Electronic device

Abstract

An electronic device includes a panel having an operation area and an extended circuit area. The panel includes a first substrate and a first polarizing element. The first polarizing element is disposed on the first substrate. The first substrate extends from the operation area to the extended circuit area, and the first polarizing element extends from the operation area to the extended circuit area.

Description

Technical Field

[0001] This invention relates to an electronic device, and more particularly to an electronic device having an extended circuit area. Background Technology

[0002] With the development of technology, electronic devices are widely used in all aspects of life. How to improve the quality of electronic devices, reduce manufacturing costs, or simplify the manufacturing process has become an important issue. Summary of the Invention

[0003] An electronic device according to the present invention includes a panel having an operation area and an extended circuit area. The panel includes a first substrate and a first polarizing element. The first polarizing element is disposed on the first substrate. The first substrate extends from the operation area to the extended circuit area, and the first polarizing element extends from the operation area to the extended circuit area. Attached Figure Description

[0004] Figures 1 to 4 This is a top view schematic diagram illustrating different processes in a method of manufacturing an electronic device according to the present invention. Figure 1 The diagram below shows along Figure 1 A schematic diagram of the cross-sectional structure along section line A-A' in the diagram; Figure 2 The diagram below shows along Figure 2 A schematic diagram of the cross-sectional structure along section line B-B' in the diagram; Figure 3 The diagram below shows along Figure 3 A schematic diagram of the cross-sectional structure along section line C-C' in the diagram; Figure 4 The diagram below shows along Figure 4 A schematic diagram of the cross-sectional structure of section line D-D' in the figure.

[0005] Figure 5 A top view schematic diagram of an electronic device according to some embodiments of the present invention is shown.

[0006] Figure 6 Based on the drawing Figure 5 A schematic diagram of the cross-sectional structure of the tangent E-E' in the figure.

[0007] Figure 7 Based on the drawing Figure 5 A schematic diagram of the cross-sectional structure of the tangent line G-G'.

[0008] Figure 8 Based on the drawing Figure 5 A schematic diagram of the cross-sectional structure of the tangent F-F' in the figure.

[0009] Figure 9 Based on the drawing Figure 5 A schematic diagram of the cross-sectional structure of the tangent H-H' in the figure.

[0010] Figure 10The illustration is a side view schematic diagram of an electronic device according to an embodiment of the present invention.

[0011] Figure 11 The illustration depicts a line according to an embodiment of the present invention. Figure 5 A schematic diagram of the cross-sectional structure of an electronic device in a modified embodiment of the tangent E-E'.

[0012] Explanation of reference numerals in the attached drawings: 100 - Initial panel; 101 - Panel; 101A - Electronic device; 102 - Electronic device; 102A - Privacy control panel; 102B - Display panel; 103 - Electronic device; 103A - Panel; 111 - First substrate; 112 - First conductive layer; 112A - First conductive pattern; 112B - First conductive pattern; 112C - First conductive pattern; CSL1 - First conductive line structure; 113A - First trace; 113B - First trace; 113C - First trace; 114A - Second conductive pattern; 114B - Second conductive pattern; 114C - Second conductive pattern; 115 - First polarizing element; 116 - First polarizing element 121-Second substrate; 122-Second conductive layer; 122A-Fourth conductive pattern; CSL2-Second conductive line structure; 123A-Second trace; 124-Second alignment film; 124A-Third conductive pattern; 125-Second polarizing element; 126-Sacrificial layer; 127-Carrier plate; 128-Thin film transistor layer; 129-Light emitting element; 130-Sealing material; 131-Dielectric material; 141-Extended circuit area; 143-Conductive element; 144-Adhesive material; 145-End region; 150-External lead bonding area; 151-Electronic component; AA-Operating area; NAA-Non-Operating area; CSL3-Conductive line structure; Z-Normal direction. Detailed Implementation

[0013] The present invention can be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that, for ease of understanding and for the sake of brevity, many of the accompanying drawings depict only a portion of the electronic device, and specific elements in the drawings are not drawn to scale. Furthermore, the number and size of the elements in the drawings are for illustrative purposes only and are not intended to limit the scope of the present invention.

[0014] Throughout this specification and claims, certain terms are used to refer to specific elements. Those skilled in the art will understand that electronic device manufacturers may use different names to refer to the same elements. This document is not intended to distinguish between elements that function identically but have different names.

[0015] In the following description and claims, the words "containing" and "including" are open-ended terms, and therefore should be interpreted as "containing but not limited to...".

[0016] It should be understood that when an element or membrane is referred to as being "set on" or "connected to" another element or membrane, it can be directly on or directly connected to that other element or membrane, or there may be an inserted element or membrane between them (indirect cases). Conversely, when an element is referred to as being "directly on" or "directly connected to" another element or membrane, there may be no inserted element or membrane between them. When an element or membrane is referred to as being "electrically connected" to another element or membrane, it can be interpreted as either a direct electrical connection or an indirect electrical connection.

[0017] The terms “approximately,” “equal to,” “same as,” “substantially,” or “roughly” are generally interpreted as being within plus or minus 20% of the given value, or within plus or minus 10%, plus or minus 5%, plus or minus 3%, plus or minus 2%, plus or minus 1%, or plus or minus 0.5% of the given value.

[0018] Although the terms "first," "second," "third," etc., can be used to describe multiple components, the components are not limited to these terms. These terms are used only to distinguish a single component from other components in the specification. The same terms may not be used in the claims, but rather replaced by "first," "second," "third," etc., according to the order of the elements declared in the claims. Therefore, in the following description, a first component may be a second component in the claims.

[0019] The electrical connection or coupling described in this invention can refer to a direct connection or an indirect connection. In the case of a direct connection, the endpoints of two circuit elements are directly connected or connected to each other by a conductor segment. In the case of an indirect connection, the endpoints of two circuit elements are connected by a switch, diode, capacitor, inductor, resistor, other suitable element or combination of the above elements, but are not limited thereto.

[0020] In this invention, the thickness, length, and width can be measured using an optical microscope, while the thickness or width can be measured from a cross-sectional image in an electron microscope, but these are not limitations. Furthermore, any two values ​​or directions used for comparison may have a certain degree of error. Additionally, the terms "equal to," "equivalent to," "identical," "substantially," or "approximately" used in this invention generally mean falling within 10% of a given value or range. Moreover, the terms "given range is from a first value to a second value" and "given range falls within the range of the first value to the second value" indicate that the given range includes the first value, the second value, and other values ​​in between. If the first direction is perpendicular to the second direction, the angle between the first and second directions can be between 80 and 100 degrees; if the first direction is parallel to the second direction, the angle between the first and second directions can be between 0 and 10 degrees.

[0021] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It is understood that these terms, for example, as defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant art and this invention, and should not be interpreted in an idealized or overly formal manner, unless specifically defined in the embodiments of this invention.

[0022] In this invention, the electronic device may include a display device, a backlight device, an antenna device, a sensing device, or a splicing device, but is not limited thereto. The electronic device may be a bendable or flexible electronic device. The display device may be a non-self-emissive display device or a self-emissive display device. The antenna device may be a liquid crystal type antenna device or a non-liquid crystal type antenna device. The sensing device may be a sensing device that senses capacitance, light, heat, or ultrasound, but is not limited thereto. In this invention, electronic components may include passive and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. Diodes may include light-emitting diodes or photodiodes. Light-emitting diodes may include, for example, organic light-emitting diodes (OLEDs), mini LEDs, micro LEDs, or quantum dot LEDs, but are not limited thereto. The splicing device may be, for example, a display splicing device or an antenna splicing device, but is not limited thereto. It should be noted that the electronic device may be any arrangement and combination of the foregoing, but is not limited thereto. The present invention will be described below using display devices as electronic devices or splicing devices, but the present invention is not limited thereto.

[0023] It should be noted that the technical solutions provided in the different embodiments below can be substituted for, combined or mixed with each other to constitute another embodiment without violating the spirit of the present invention.

[0024] Figures 1 to 4 This is a top view schematic diagram of a different process of manufacturing an electronic device according to the present invention. Figure 1 The diagram below shows along Figure 1 A schematic diagram of the cross-sectional structure along section line A-A' in the diagram; Figure 2 The diagram below shows along Figure 2 A schematic diagram of the cross-sectional structure along section line B-B' in the diagram; Figure 3 The diagram below shows along Figure 3 A schematic diagram of the cross-sectional structure along section line C-C' in the diagram; Figure 4 The diagram below shows along Figure 4 A schematic diagram of the cross-sectional structure of section line D-D' in the figure.

[0025] First, please refer to Figure 1 According to the method of manufacturing an electronic device according to the present invention, an initial panel 100 may be provided first. The initial panel 100 may be, for example, an uncut and assembled panel, but is not limited thereto. In detail, the initial panel 100 may include a first substrate 111, a second substrate 121, and a sealing material 130, wherein the second substrate 121 is disposed relative to the first substrate 111, but is not limited thereto. A color filter layer (not shown) may be disposed on the first substrate 111, and a thin-film transistor (not shown) may be disposed on the second substrate 121, and vice versa, but is not limited thereto. The first substrate 111 and the second substrate 121 may be assembled to form the initial panel 100, but is not limited thereto.

[0026] In some embodiments, a first conductive line structure CSL1 may be disposed on a surface of the first substrate 111 adjacent to the second substrate 121. In some embodiments, a second conductive line structure CSL2 may be disposed on a surface of the second substrate 112 adjacent to the first substrate 111.

[0027] In some embodiments, a carrier plate 127 may be disposed on a surface of the second substrate 121 remote from the first substrate 111. The carrier plate 127 may include a rigid carrier plate, such as glass or ceramic, for temporarily supporting the second substrate 121. In some embodiments, a sacrificial layer 126 may be disposed between the carrier plate 127 and the second substrate 121, but is not limited thereto. The sacrificial layer 126 may be selectively removed in subsequent processes to separate the carrier plate 127 from the second substrate 121. The first substrate 111 and / or the second substrate 121 may include a flexible substrate material, such as polyimide (PI) or other suitable materials, but are not limited thereto.

[0028] Figure 1Examples of embodiments in which the size of the second substrate 121 may differ from the size (e.g., area) of the first substrate 111, for example, the size of the second substrate 121 may be larger than the size (e.g., area) of the first substrate 111, but are not limited thereto. In some embodiments, the shape or size (e.g., area) of the second substrate 121 may be the same as or different from the shape or size (e.g., area) of the first substrate 111.

[0029] In some embodiments, the initial panel 100 may include a dielectric material 131 disposed between a first substrate 111 and a second substrate 121. The dielectric material 131 may be, for example, a photomodulation material, such as liquid crystal material or other suitable material. In some embodiments, a sealing material 130 may be disposed between the first substrate 111 and the second substrate 121 and surround the periphery of the dielectric material 131. In some embodiments, the sealing material 130 may include an adhesive, a fiber material, other suitable materials, or a combination thereof. In some embodiments, when the initial panel 100 includes the sealing material 130, the operating area AA (or active area) and the non-operating area NAA may be defined generally based on the sealing material 130, but are not limited thereto. The operating area AA may be defined as the area surrounded by the sealing material 130. In other embodiments (not shown), when the initial panel 100 does not include the sealing material 130, the operating area AA may be defined according to the application type of the panel (e.g., display, detection, light emission, or other applications). For example, when the panel is a display panel, the operation area AA can be roughly defined as the area where the image can be displayed, and so on. In addition, the area in the initial panel 100 excluding the operation area AA can be regarded as the non-operation area NAA.

[0030] Please refer to Figure 2 A first polarizing element 115 is disposed on a first substrate 111, for example, on a surface of the first substrate 111 remote from the second substrate 121. In some embodiments, the shape or size (e.g., area) of the first polarizing element 115 may be substantially the same as the shape or size (e.g., area) of the first substrate 111, but is not limited thereto. In some embodiments, the first substrate 111 and / or the first polarizing element 115 may extend from the operating region AA to the non-operating region NAA (including the extended circuit region formed subsequently after cutting).

[0031] Then, please refer to Figure 3In some embodiments, the sacrificial layer 126 and the carrier plate 127 may be removed before the second polarizing element 125 is disposed on the second substrate 121. Then, the second polarizing element 125 is disposed on a surface of the second substrate 121 remote from the first substrate 111. In some embodiments, the shape or size (e.g., area) of the second polarizing element 125 may be substantially the same as, but not limited to, the shape or size (e.g., area) of the second substrate 121. In some embodiments, the second substrate 121 and / or the second polarizing element 125 extend from the operating region AA to the non-operating region NAA (including the extended circuit area subsequently formed after trimming).

[0032] Then, please refer to Figure 4 The initial panel 100 is cut to obtain the panel 101 of the electronic device. The cutting process may include cutting off a portion of the non-operating area NAA (such as...) of the initial panel 100. Figure 4 The dashed line indicates the portion of the non-operating area (NAA) that has been cut off, while a portion of the non-operating area NAA and the complete operating area AA are retained. In other words, the panel 101 obtained after cutting may include at least the first substrate 111, the second substrate 121, the first polarizing element 115, and / or the second polarizing element 125 located in the operating area AA, but is not limited thereto. The panel 101 obtained after cutting may also include a portion of the first substrate 111, the second substrate 121, the first polarizing element 115, and / or the second polarizing element 125 located in the non-operating area NAA, and / or sealing material 130. In some embodiments, the retained non-operating area NAA may include at least one extended circuit area 141. Figure 4An embodiment of panel 101 including a single extended circuit region 141 is illustrated, but not limited thereto. In some embodiments, the extended circuit region 141 may be connected, for example, to at least one side of the operating region AA, and there may be selectively other non-operating region AA portions between the operating region AA and the extended circuit region 141. In some embodiments, the outline of the extended circuit region 141 may be, for example, L-shaped or other suitable shape (e.g., rectangular), but is not limited thereto. In other words, the panel 101 obtained after cutting may have an operating region AA and an extended circuit region 141, and the panel 101 includes a first substrate 111 and a first polarizing element 115 disposed on the first substrate 111. In some embodiments, the first substrate 111 may extend from the operating region AA to the extended circuit region 141, and the first polarizing element 115 may extend from the operating region AA to the extended circuit region 141. In some embodiments, the panel 101 includes a second substrate 121 and a second polarizing element 125, the second substrate 121 being disposed relative to the first substrate 111 and extending from the operating region AA to the extended circuit region 141. The second polarizing element 125 may be disposed on a surface of the second substrate 121 away from the first substrate 111, and the second polarizing element 125 extends from the operating area AA to the extended circuit area 141. The panel 101 may be a privacy control panel or a display panel, but is not limited thereto.

[0033] Please refer to Figure 5 This diagram illustrates a top view of an electronic device 101A according to some embodiments of the present invention. The electronic device 101A includes a panel 101 having an operating area AA and one or more extended circuit areas 141. As described above, when the panel 101 includes a sealing material 130, the operating area 140 can be generally defined as the area surrounded by the sealing material 130, but is not limited thereto. In some embodiments, a plurality of sub-pixels or thin-film transistors (not shown) may be located in the operating area AA. In some embodiments, a non-operating area NAA retained after the panel 101 is cut may be located on at least one side of the operating area AA, but is not limited thereto. In some embodiments, some circuitry may be selectively located in the aforementioned retained non-operating area NAA, but is not limited thereto.

[0034] Figure 6 The illustrated electronic device 101A is according to an embodiment of the present invention, along... Figure 5 A schematic diagram of the cross-sectional structure of the tangent E-E' in the figure. Please refer to... Figure 5 and Figure 6Panel 101 may include a first substrate 111, a second substrate 121, a sealing material 130, a dielectric material 131, a first polarizing element 115, and a second polarizing element 125. The detailed arrangement of these components can be found above. In some embodiments, a first conductive line structure CSL1 may be disposed on a surface of the first substrate 111 away from the first polarizing element 115. In some embodiments, a second conductive line structure CSL2 may be disposed on a surface of the second substrate 121 away from the second polarizing element 125. In some embodiments, panel 101 may include a first alignment film 116 and / or a second alignment film 124. In some embodiments, the first alignment film 116 may be disposed on a surface of the first conductive line structure CSL1 adjacent to the dielectric material 131. In some embodiments, the second alignment film 124 may be disposed on a surface of the second conductive line structure CSL2 adjacent to the dielectric material 131. In other words, the dielectric material 131 may be disposed between the first alignment film 116 and the second alignment film 124. In some embodiments, the first conductive line structure CSL1 may include a first conductive layer 112, which may serve as a first electrode. In some embodiments, the second conductive line structure CSL2 may include a second conductive layer 122, which may serve as a second electrode. In some embodiments, the first conductive layer 112 and / or the second conductive layer 122 may be located, for example, at least within the operating region AA. In some embodiments, the first conductive layer 112 and / or the second conductive layer 122 may be, for example, a full-surface electrode, but are not limited thereto. In some embodiments, the first conductive layer 112 and the second conductive layer 122 may substantially overlap in the normal direction Z of the first substrate 111, but are not limited thereto. In some embodiments (not shown), the first conductive layer 112 and / or the second conductive layer 122 may be, for example, a patterned electrode. In some embodiments, the first conductive layer 112 and / or the second conductive layer 122 may include a transparent conductive material or a non-transparent conductive material, but are not limited thereto. Transparent conductive materials include, for example, metal oxides, silver nanowires or conductive nanomaterials, other suitable materials, or combinations thereof, but are not limited thereto. In some embodiments, the material of the second conductive layer 122 may be similar to that of the first conductive layer 112, but is not limited thereto. In some embodiments, the first conductive layer 112 and the second conductive layer 122 may be single-layer or composite layer materials. In some embodiments, one of the first conductive line structure CSL1 or the second conductive line structure CSL2 may optionally include a thin-film transistor.

[0035] Figure 7 The illustrated electronic device 101A is according to an embodiment of the present invention, along... Figure 5 A schematic diagram of the cross-sectional structure of the tangent G-G' in the figure. Please refer to... Figure 5 and Figure 7The first conductive line structure CSL1 may have one or more first traces (e.g., 113A / 113C) located in the extension circuit region 141, but is not limited thereto. In some embodiments, the second conductive line structure 123 may have one or more second traces 123A located in the extension circuit region 141. In some embodiments, the number of first traces may be the same as or different from the number of second traces. Figure 7 An embodiment of a single second trace 123A is illustrated, but not limited thereto. In some embodiments, the first trace (e.g., 113A / 113C) and / or the second trace 123A may, for example, comprise a metallic material, a transparent conductive material, or a combination thereof. In some embodiments, the first trace (e.g., 113A / 113C) may be a single-layer or multi-layer structure. In some embodiments, the second trace 123A may be a single-layer or multi-layer structure. For example, the first trace (e.g., 113A / 113C) may be composed, for example, of a first conductive pattern (112A / 112C) and / or a second conductive pattern (114A / 114C), respectively. For example, the second trace 123A may be composed, for example, of a third conductive pattern 124A and / or a fourth conductive pattern 122A, but is not limited thereto. In some embodiments, the first trace (e.g., 113A / 113C) and the second trace 123A may not overlap, for example, in the normal direction Z of the first substrate 111, but are not limited thereto. In some embodiments (not shown), the first trace (e.g., 113A / 113C) may, for example, be connected to the first conductive layer 112 (e.g., ...). Figure 6 Electrical connection (as shown). In some embodiments (not shown), the first conductive pattern (112A / 112C) or the second conductive pattern (114A / 114C) in the first trace (e.g., 113A / 113C) may, for example, be connected to the first conductive layer 112 (e.g., as shown). Figure 6 The first conductive layer 112 may be on the same layer as the first conductive layer 112 and connected, but is not limited thereto. For example, the second conductive pattern (114A / 114C) in the first trace (e.g., 113A / 113C) may be on the same layer as the first conductive layer 112 and connected, so that the first trace (e.g., 113A / 113C) is electrically connected to the first conductive layer 112, but is not limited thereto.

[0036] In some embodiments (not shown), the second trace (e.g., 123A) may, for example, be connected to the second conductive layer 122 (e.g., ...). Figure 6 Electrical connection (as shown). In some embodiments (not shown), the third conductive pattern 124A or the fourth conductive pattern 122A in the second trace (e.g., 123A) may, for example, be connected to the second conductive layer 122 (e.g., as shown). Figure 6 As shown, but not limited to this. For example, the fourth conductive pattern 122A in the second trace (e.g., 123A) may, for example, be connected to the second conductive layer 122 (e.g., as shown). Figure 6The second trace (e.g., 123A) is on the same layer and connected to the second conductive layer 122, so that the second trace can be electrically connected to the second conductive layer 122, for example.

[0037] Please also refer to Figures 5 to 7 In some embodiments, the first substrate 111 may extend from the operating area AA to the extended circuit area 141. In some embodiments, the first polarizing element 115 may extend from the operating area AA to the extended circuit area 141. In some embodiments, the second substrate 121 may extend from the operating area AA to the extended circuit area 141. In some embodiments, the second polarizing element 125 may extend from the operating area AA to the extended circuit area 141. In some embodiments, the first conductive line structure CSL1 may extend from the operating area AA to the extended circuit area 141. In some embodiments, the second conductive line structure CSL2 may extend from the operating area AA to the extended circuit area 141. In some embodiments, the panel 101 may include an adhesive 144, which may be disposed, for example, between the first substrate 111 and the second substrate 121 and located in the extended circuit area 141, but is not limited thereto. In some embodiments, the adhesive 144 may be selectively located between a first trace (e.g., 113A / 113C) and a second trace (e.g., 123A). The adhesive 144 can be used to support the distance between the first substrate 111 and the second substrate 121 located in the extended circuit area 141, reducing the chance of a short circuit due to contact between the first trace (e.g., 113A / 113C) and the second trace (e.g., 123A), but is not limited thereto. In some embodiments, the adhesive 144 can reduce the impact of ambient moisture or oxygen on the first trace (e.g., 113A / 113C) and the second trace (e.g., 123A), but is not limited thereto. In some embodiments, the adhesive 144 and the sealing material 130 can be the same or different materials. In some embodiments, the adhesive 144 and the sealing material 130 can be connected to each other or separated.

[0038] Figure 8 The illustrated electronic device 101A is according to an embodiment of the present invention, along... Figure 5 A schematic diagram of the cross-sectional structure of the tangent F-F' of the extended circuit region 141. In some embodiments, located in Figure 8The first conductive line structure CSL1 in the extended circuit region 141 may further include a first trace 113B, but is not limited thereto. In some embodiments, the first trace 113B may include, for example, a metallic material, a transparent conductive material, or a combination thereof. In some embodiments, the first trace 113B may be, for example, a single-layer or multi-layer structure. The material of the first trace 113B may be similar to that of the first traces 113A or 113C. Specifically, the first trace 113B may be, for example, composed of a first conductive pattern 112B and / or a second conductive pattern 114B. It should be noted that the first trace 113B is not electrically connected to the first conductive layer 112, for example. In some embodiments, the first trace 113B may overlap with the second trace 123A in the normal direction Z of the first substrate 111, for example. In some embodiments, the first trace 113B may be electrically connected to the second conductive line structure 123 (e.g., the second trace 123A), for example. For example, the first trace 113B may be electrically connected to the second conductive line structure 123 (e.g., the second trace 123A) via one or more conductive elements 143. In some embodiments, the conductive element 143 may include gold (Au) paste, silver paste, or other suitable conductive materials, but is not limited thereto. In some embodiments, the panel 101 may include an adhesive 144, which may, for example, cover at least one conductive element 143 to reduce the influence of ambient moisture or oxygen on the conductive element 143, but is not limited thereto. Please also refer to Figures 5 to 8 In some embodiments, the first trace (e.g., 113A and 113C) may be used, for example, to transmit a first signal to the first conductive layer 112, and the first trace 113B and the second conductive line structure 123 (e.g., the second trace 123A) may be used, for example, to transmit a second signal to the second conductive layer 114, wherein the first signal and the second signal are different.

[0039] It should be noted that, in Figure 7 or Figure 8 The adhesive 144 can also be coated over the entire surface between the first substrate 111 and the second substrate 121, for example, and is not limited to... Figure 7 or Figure 8 The spherical embodiment is illustrated in the figure.

[0040] Figure 9 The illustrated electronic device 101A is according to an embodiment of the present invention, along... Figure 5 A schematic diagram of the cross-sectional structure of the tangent H-H' in the figure. Figure 9The illustration shows a cross-sectional view of the terminal portion of an extension circuit region 141 of an electronic device 101A according to an embodiment of the present invention. In some embodiments, a first conductive line structure CSL1 extends from an operating region AA to the extension circuit region 144, and a portion of the first conductive line structure CSL1 located in the terminal portion 145 of the extension circuit region 144 may be exposed by a second substrate 120 and / or a second polarizing element 125. In some embodiments, an electronic component 151 may be electrically connected to the portion of the first conductive line structure CSL1 exposed by the second substrate 121 and / or the second polarizing element 125. In some embodiments, a portion of the second substrate 121 and / or a portion of the second polarizing element 125 located in the terminal portion 145 of the extension circuit region 144 may be removed to expose a portion of the first conductive line structure CSL1. In some embodiments, the removal of a portion of the second substrate 121 and / or a portion of the second polarizing element 125 may include laser cutting, rotary cutting, or other suitable removal methods. In some embodiments, the area exposed by the second substrate 121 and / or the second polarizing element 125 may define an outer lead bonding (OLB) region 150. Therefore, the first traces 113A, 113B, and 113C in the first conductive line structure CSL1 located in the OLB region 150 may serve as terminals for receiving signals provided by the electronic component 151, but are not limited thereto. In some embodiments, the electronic component 151 may include one of a connector, a flexible printed circuit board (FPC), a chip-on-film package (COF), or an integrated circuit (IC), but is not limited thereto.

[0041] Figure 10 The illustration shows a side view of an electronic device 102 according to an embodiment of the present invention. In one embodiment, the electronic device 102 may include a privacy control panel 102A and / or a display panel 102B (or other panels). In some embodiments, the display panel 102B may include a self-emissive panel or a non-self-emissive panel. If the display panel 102B is a non-self-emissive panel, a backlight module (not shown) may be provided underneath. The aforementioned privacy control panel 102A and / or display panel 102B (or other panels) may be designed as the panel with extended circuit area 141 in this invention, as required.

[0042] Figure 11 The illustration depicts a line according to an embodiment of the present invention. Figure 5A cross-sectional structural schematic diagram of the electronic device 103 in a modified embodiment of the tangent E-E' is shown. If the electronic device 103 is applied to a self-emissive panel, the panel 103A may include a carrier plate 127, a conductive line structure CSL3 (which may include a thin-film transistor layer), and a plurality of light-emitting elements 129, but is not limited thereto. The light-emitting elements 129 may include, for example, light-emitting diodes, quantum dots, fluorescent materials, phosphorescent materials, other suitable display media, or combinations of the above materials, but are not limited thereto. Light-emitting diodes may include, for example, organic light-emitting diodes, sub-millimeter light-emitting diodes (mini LEDs), micro LEDs, or quantum dot light-emitting diodes (QLEDs, QDLEDs), other suitable materials, or combinations of the above, but are not limited thereto. In some embodiments, the panel 103A includes an operating area AA and an extended circuit area 141, the extended circuit area 141 may include an external lead bonding area 150 as described above. In some embodiments, a first substrate 111 extends from the operating area AA to the extended circuit area 141. In some embodiments, a first polarizing element 115 extends from the operating area AA to the extended circuit area 141. In some embodiments, a first conductive line structure CSL1 may be disposed on a surface of the first substrate 111 away from the first polarizing element 115. The first conductive line structure CSL1 extends from the operating region AA to the extended circuit region 141, and a portion of the first conductive line structure CSL1 is exposed by the second substrate 121 and the carrier plate 127. In some embodiments, electronic components (not shown) Figure 11 For reference Figure 9 The first conductive line structure CSL1 can be electrically connected to the portion exposed by the second substrate 121 and the carrier plate 127. In some embodiments (not shown), the conductive line structure CSL3 can be electrically connected to the first conductive line structure CSL1 through some conductive connectors (not shown, such as copper pillars or silver paste), and the first conductive line structure CSL1 transmits signals provided by electronic components to operate the light-emitting element 129, but is not limited thereto. In some embodiments (not shown), the first conductive line structure CSL1 may also optionally include a thin-film transistor layer, in which case the light-emitting element 129 may be electrically connected or bonded to the first conductive line structure CSL1, for example, in which case the conductive line structure CSL3 may be optionally omitted.

[0043] The electronic device according to various embodiments of the present invention may include a panel. The panel may include at least one substrate and at least one polarizing element. The panel may include an operating area and a non-operating area. The at least one substrate and at least one polarizing element may extend from the operating area to an extended circuit area. Furthermore, by extending a first conductive line structure from the operating area to the extended circuit area and exposing a portion of the first conductive line structure as a terminal portion for receiving signals provided by electronic components, the existing flexible printed circuit board is replaced. The design of this invention simplifies the manufacturing process and method of electronic devices or reduces manufacturing costs.

[0044] The above description is merely an embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An electronic device, characterized by comprising: The panel comprises: a first substrate; a second substrate disposed opposite to the first substrate and extending from the operation area to the extended circuit area; a sealing material disposed between the first substrate and the second substrate; a first polarizing element disposed on the first substrate; a second polarizing element disposed on a surface of the second substrate away from the first substrate, and the second polarizing element extends from the operation area to the extended circuit area; a first conductive circuit structure disposed on a surface of the first substrate away from the first polarizing element, the first conductive circuit structure extends from the operation area to the extended circuit area, a portion of the first conductive circuit structure is exposed by the second substrate and the second polarizing element, and another portion of the first conductive circuit structure is disposed between the first substrate and the sealing material; and a second conductive circuit structure disposed on a surface of the second substrate away from the second polarizing element, the second conductive circuit structure extends from the operation area to the extended circuit area, and a portion of the second conductive circuit structure is disposed between the second substrate and the sealing material; wherein the first substrate extends from the operation area to the extended circuit area, and the first polarizing element extends from the operation area to the extended circuit area. Further comprising: 2.The electronic device of claim 1, wherein, an electronic element electrically connected to the portion of the first conductive circuit structure exposed by the second substrate and the second polarizing element. The first conductive circuit structure has a first trace, the second conductive circuit structure has a second trace, and the first trace and the second trace are electrically connected to each other via a conductive element. 3.The electronic device of claim 1, wherein, The panel further comprises an adhesive material, and the adhesive material covers the conductive element. 4.The electronic device of claim 3, wherein, The first trace and the second trace overlap in the normal direction of the first substrate. 5.The electronic device of claim 3, wherein, The panel is a privacy control panel. 6.The electronic device of claim 1, wherein, The panel is a display panel. 7.The electronic device of claim 1, wherein, ​

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