Micro oled display packaging structure and preparation method thereof

Abstract

The application belongs to the technical field of Micro OLED display packaging structure, and also relates to a preparation method of the Micro OLED display packaging structure. A CMOS driving circuit is arranged on a silicon wafer substrate to form a CMOS substrate, a plurality of groups of anodes are arranged on the CMOS substrate, a pixel definition layer is arranged between adjacent anodes, an OLED layer encapsulates the definition layer and the anodes on the CMOS substrate, a TFE layer is located outside the OLED layer, micropores are arranged on the surface of the TFE layer, the depth of the micropores is 400-500 nm, a high-viscosity material layer is arranged in the micropores, and the viscosity of the high-viscosity material layer is 2.8-3.2. The Micro OLED display packaging structure and the preparation method thereof improve the adhesion between the TFE and the OC without affecting the light emission of the OLED, reduce product failure caused by the separation of the TFE and the OC, and improve the product competitiveness.

Description

Technical Field

[0001] This invention belongs to the field of Micro OLED display technology, and more specifically, relates to a Micro OLED display packaging structure. This invention also relates to a method for preparing a Micro OLED display packaging structure. Background Technology

[0002] In the manufacturing of color screens for micro OLED displays, the color filter process involves multiple coating, exposure, and development steps. For protection by the thin-film encapsulation (TFE), a coating is commonly applied to the surface of the TFE. However, when such a display structure is placed in harsh environments (high temperature and high humidity), the color filter (OC) is prone to separation from the TFE, causing color spots and affecting the product's performance and lifespan. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a method for preparing a MicroOLED display packaging structure that is simple in steps, improves the adhesion between TFE and OC (OC refers to overcoat; curing film protective layer) without affecting the light output of OLED, and reduces product failure caused by the separation of TFE and OC, thereby enhancing product competitiveness.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows:

[0005] This invention relates to a method for fabricating a Micro OLED display encapsulation structure. The fabrication steps of the Micro OLED display encapsulation structure fabrication method are as follows:

[0006] S1. Fabricate a CMOS driving circuit on a silicon wafer substrate to form a CMOS substrate;

[0007] S2. Fabricate the anode on a CMOS substrate;

[0008] S3. Fabricate the pixel definition layer (PDL) on the anode using a photolithography process;

[0009] S4. An OLED layer is prepared outside the definition layer (PDL) by a vapor deposition process. The OLED layer includes a hole injection / transport layer, an organic light-emitting layer, an electron injection / transport layer, and a cathode.

[0010] S5. Fabricate a TFE layer (encapsulation layer) on the OLED layer;

[0011] S6. Multiple micropores are etched into the TFE layer (encapsulation layer), with a depth of 400-500nm;

[0012] S7. A high-viscosity material layer is formed within the micropores of the TFE layer (encapsulation layer), and the viscosity of the high-viscosity material layer 7 is between 2.8 and 3.2.

[0013] S8. Complete the subsequent photolithography and module manufacturing processes: first OC layer, CF layer (CF refers to color filter), second OC layer, and cover plate (CG) 11.

[0014] When preparing the TFE layer (encapsulation layer), the methods for preparing the TFE layer include, but are not limited to, ALD, PECVD, IJP, etc.

[0015] The film material of TFE layer 5 is one or a combination of several of Al2O3, TiO2, ATO, SiN, SiON, SiO, acrylic-based materials, and epoxy resin-based organic materials.

[0016] When etching micropores in a TFE layer, methods include, but are not limited to, laser etching and dry etching.

[0017] When setting a high-viscosity material layer within the micropores of a TFE layer, the methods for setting the high-viscosity material layer include, but are not limited to, spin coating and inkjet printing.

[0018] When completing the subsequent photolithography and module manufacturing processes, the first OC layer, CF layer, second OC layer, and cover plate (CG) are prepared and pasted in sequence, and then the Micro OLED display packaging structure is cut.

[0019] The present invention also relates to a Micro OLED display packaging structure that is simple in structure, improves the adhesion between TFE and OC without affecting the light output of OLED, and reduces product failure caused by the separation of TFE and OC, thereby enhancing product competitiveness.

[0020] The aforementioned Micro OLED display packaging structure has a CMOS driving circuit disposed on a silicon wafer substrate to form a CMOS substrate. Multiple Anodes 2 are disposed on the CMOS substrate. Pixel definition layers (PDLs) are disposed between adjacent Anodes. The OLED layer encapsulates the PDL and Anodes on the CMOS substrate. A TFE layer (encapsulation layer) is located outside the OLED layer. Micropores with a depth of 400-500 nm are disposed on the surface of the TFE layer. A high-viscosity material layer with a viscosity between 2.8 and 3.2 is disposed inside the micropores.

[0021] The surface of the TFE layer (encapsulation layer) is sequentially provided with a first OC layer, a CF layer, a second OC layer, and a cover plate layer (CG).

[0022] The TFE layer (encapsulation layer) includes multiple sets of micropores arranged in parallel, extending from near the upper part of the TFE layer (encapsulation layer) to near the lower part of the TFE layer (encapsulation layer), and each set of micropores includes multiple micropores arranged at intervals.

[0023] Multiple micropores in each micropore group extend from the left side near the TFE layer (encapsulation layer) to the right side near the TFE layer (encapsulation layer).

[0024] The working principle and beneficial effects of the technical solution adopted in this invention are as follows:

[0025] The present invention discloses a Micro OLED display packaging structure and its fabrication method. In the fabricated Micro OLED display packaging structure, a CMOS driving circuit is disposed on a silicon wafer substrate to form a CMOS substrate. Multiple anodes are disposed on the CMOS substrate. A pixel definition layer (PDL) is disposed between adjacent anodes. An OLED layer encapsulates the PDL and anodes on the CMOS substrate. A TFE layer (encapsulation layer) is located outside the OLED layer. Micropores with a depth of 400-500 nm are formed on the surface of the TFE layer. A high-viscosity material layer with a viscosity between 2.8 and 3.2 is disposed within the micropores. Thus, by designing the Micro OLED display packaging structure, micropores are etched into the encapsulation layer (TFE), and a high-viscosity material layer is formed at the micropores, effectively improving the adhesion between the TFE and the first OC (Optical Core), reducing product failure caused by TFE and OC separation, and improving product quality. Attached Figure Description

[0026] The following is a brief explanation of the contents depicted in the accompanying drawings and the markings therein:

[0027] Figure 1a This is a top view of the TFE layer in the Micro OLED display packaging structure described in this invention.

[0028] Figure 1b This is a partially enlarged schematic diagram of the TFE layer in the Micro OLED display packaging structure described in this invention.

[0029] Figure 1c This is a schematic diagram of the cross-section of the TFE layer in the Micro OLED display packaging structure described in this invention.

[0030] Figure 2This is a schematic diagram of the anode fabrication process of the Micro OLED display packaging structure described in this invention;

[0031] Figure 3 This is a schematic diagram of the fabrication process of the PDL layer in the Micro OLED display packaging structure described in this invention.

[0032] Figure 4 This is a schematic diagram of the OLED layer fabrication process of the Micro OLED display encapsulation structure described in this invention.

[0033] Figure 5 This is a schematic diagram of the fabrication process of the TFE layer in the Micro OLED display encapsulation structure described in this invention.

[0034] Figure 6 This is a schematic diagram of the Micro OLED display packaging structure described in this invention when micropores are etched in the TFE layer;

[0035] Figure 7 This is a schematic diagram of the fabrication process of the high-viscosity material layer in the Micro OLED display encapsulation structure described in this invention.

[0036] Figure 8 This is a schematic diagram of the Micro OLED display packaging structure described in this invention;

[0037] The labels in the attached diagram are as follows: 1. CMOS substrate; 2. Anode; 3. Definition layer (PDL); 4. OLED layer; 5. TFE layer (encapsulation layer); 6. Micropore; 7. High viscosity material layer; 8. First OC layer; 9. CF layer; 10. Second OC layer; 11. Cover plate. Detailed Implementation

[0038] The following description, with reference to the accompanying drawings, provides a more detailed explanation of the specific embodiments of the present invention, including the shape and structure of each component, the relative positions and connections between the parts, the functions and working principles of each part:

[0039] As attached Figure 1a - Appendix Figure 8 As shown, this invention discloses a method for fabricating a Micro OLED display packaging structure. The fabrication steps of the Micro OLED display packaging structure fabrication method are as follows: S1. Fabricating a CMOS driving circuit on a silicon wafer substrate to form a CMOS substrate 1 (Figure 1); S2. Fabricating an Anode 2 on the CMOS substrate. Figure 2 S3. Pixel definition layer (PDL) 3 is fabricated on Anode 2 using a photolithography process. Figure 3S4. An OLED layer 4 is fabricated outside the definition layer (PDL) 3 by a vapor deposition process. The OLED layer 4 includes a hole injection / transport layer, an organic light-emitting layer, an electron injection / transport layer, and a cathode. Figure 4 S5. Fabricate a TFE layer (encapsulation layer) 5 on the OLED layer 4; S6. Etch multiple micropores 6 in the TFE layer (encapsulation layer) 5, with a depth of 400-500 nm; S7. Form a high-viscosity material layer 7 within the micropores 6 of the TFE layer (encapsulation layer) 5, with a viscosity between 2.8 and 3.2; S8. Complete the subsequent photoluminescence and module fabrication processes: first OC layer 8, CF layer 9, second OC layer 10, and cover plate (CG) 11. The above steps propose an improved technical solution to address the shortcomings of existing technologies. In the Micro OLED display packaging structure prepared by the above method, a CMOS driving circuit is disposed on a silicon wafer substrate to form a CMOS substrate 1. Multiple anodes 2 are disposed on the CMOS substrate 1. A pixel definition layer (PDL) 3 is disposed between adjacent anodes 2. The OLED layer 4 encapsulates the definition layer (PDL) 3 and the anodes 2 on the CMOS substrate 1. A TFE layer (encapsulation layer) 5 is located outside the OLED layer 4. Micropores 6 are disposed on the surface of the TFE layer 5, with a depth of 400-500 nm. A high-viscosity material layer 7 is disposed inside the micropores 6, with a viscosity between 2.8 and 3.2. In this way, by setting the Micro OLED display packaging structure, micropores are etched in the encapsulation layer (TFE), and a high-viscosity material layer is formed at the micropores, thereby effectively improving the adhesion between the TFE and the first OC, reducing product failure problems caused by the separation of TFE and OC, and improving product quality.

[0040] When preparing the TFE layer (encapsulation layer) 5, the methods for preparing the TFE layer include, but are not limited to, ALD, PECVD, and IJP. ALD refers to Atomic layer deposition. PECVD refers to Plasma Enhanced Chemical Vapor Deposition. IJP refers to Inkjet Printing.

[0041] The film material of TFE layer 5 is one or a combination of several of the following: Al2O3, TiO2, ATO, SiN, SiON, SiO, acrylic-based materials, and epoxy resin-based organic materials. Figure 5 The above-mentioned substances are all existing technologies.

[0042] When etching micropores 6 in the TFE layer 5, the methods include, but are not limited to, laser etching and dry etching. When placing a high-viscosity material layer 7 within the micropores 6 of the TFE layer 5, the methods for placing the high-viscosity material layer 7 include, but are not limited to, spin coating and inkjet printing. After completing the subsequent photolithography and module fabrication processes, the first OC layer 8, CF layer 9, second OC layer 10, and cover plate (CG) 11 are prepared and bonded, and then the Micro OLED display packaging structure is cut.

[0043] In the structure and method of this invention, CMOS stands for Complementary Metal Oxide Semiconductor. OLED stands for Organic Light-Emitting Diode.

[0044] The present invention also relates to a Micro OLED display packaging structure that is simple in structure, improves the adhesion between TFE and OC without affecting the light output of OLED, and reduces product failure caused by the separation of TFE and OC, thereby enhancing product competitiveness.

[0045] The Micro OLED display packaging structure comprises a CMOS driving circuit mounted on a silicon substrate to form a CMOS substrate 1. Multiple anodes 2 are mounted on the CMOS substrate 1. Pixel definition layers (PDLs) 3 are positioned between adjacent anodes 2. An OLED layer 4 encapsulates the PDL 3 and anodes 2 onto the CMOS substrate 1. A TFE layer (encapsulation layer) 5 is located outside the OLED layer 4. Micropores 6 with a depth of 400-500 nm are formed on the surface of the TFE layer 5. A high-viscosity material layer 7 with a viscosity between 2.8 and 3.2 nm is placed within the micropores 6. The viscosity unit is Pascal-second (Pa·s). The Micro OLED display packaging structure and its fabrication method of this invention, without affecting OLED light emission (i.e., while maintaining existing advantages), improves the adhesion between the TFE and the OC, reduces product failures caused by TFE-OC separation, and enhances product competitiveness.

[0046] The TFE layer (encapsulation layer) surface is sequentially provided with a first OC layer, a CF layer, a second OC layer, and a cover plate layer (CG). The TFE layer (encapsulation layer) 5 includes multiple sets of microvias arranged in parallel, extending from near the upper part of the TFE layer (encapsulation layer) 5 to near the lower part. Each microvia set includes multiple micropores 6 arranged at intervals. The multiple micropores 6 in each microvia set extend from near the left side of the TFE layer (encapsulation layer) 5 to near the right side of the TFE layer (encapsulation layer) 5.

[0047] The present invention discloses a Micro OLED display packaging structure and its fabrication method. In the fabricated Micro OLED display packaging structure, a CMOS driving circuit is disposed on a silicon wafer substrate to form a CMOS substrate. Multiple anodes are disposed on the CMOS substrate. A pixel definition layer (PDL) is disposed between adjacent anodes. An OLED layer encapsulates the PDL and anodes on the CMOS substrate. A TFE layer (encapsulation layer) is located outside the OLED layer. Micropores with a depth of 400-500 nm are formed on the surface of the TFE layer. A high-viscosity material layer with a viscosity between 2.8 and 3.2 is disposed within the micropores. Thus, by designing the Micro OLED display packaging structure, micropores are etched into the encapsulation layer (TFE), and a high-viscosity material layer is formed at the micropores, effectively improving the adhesion between the TFE and the first OC (Optical Core), reducing product failure caused by TFE and OC separation, and improving product quality.

[0048] The present invention has been described above by way of example with reference to the accompanying drawings. Obviously, the specific implementation of the present invention is not limited to the above-described manner. Any improvements made by adopting the inventive concept and technical solution of the present invention, or the direct application of the inventive concept and technical solution of the present invention to other occasions without modification, are all within the protection scope of the present invention.

Claims

1. A method for fabricating a Micro OLED display encapsulation structure, characterized in that: The fabrication steps of the aforementioned Micro OLED display encapsulation structure fabrication method are as follows: S1. A CMOS driving circuit is fabricated on a silicon wafer substrate to form a CMOS substrate (1). S2. Fabricate Anode (2) on CMOS substrate; S3. Pixel PDL (3) is fabricated on Anode (2) using a photolithography process. S4. An OLED layer (4) is prepared outside the defined layer (3) by a vapor deposition process. The OLED layer (4) includes a hole injection / transport layer, an organic light-emitting layer, an electron injection / transport layer, and a cathode. S5. Prepare a TFE layer (5) on the OLED layer (4); S6. A plurality of micropores (6) are etched on the TFE layer (5); the TFE layer (5) includes a plurality of micropore groups, which are arranged in parallel and extend from near the upper part of the TFE layer (5) to near the lower part of the TFE layer (5). Each micropore group includes a plurality of micropores (6) arranged in a gap; the plurality of micropores (6) in each micropore group extend from near the left side of the TFE layer (5) to near the right side of the TFE layer (5); S7. Inject a high-viscosity material layer (7) into the micropores (6) of the TFE layer (5); S8. Complete the subsequent photolithography and module manufacturing processes: first OC layer (8), CF layer (9), second OC layer (10), and cover plate (11).

2. The method for fabricating the Micro OLED display packaging structure according to claim 1, characterized in that: When multiple micropores (6) are etched in the TFE layer (5), the depth of the TFE layer (5) is 400-500 nm; when a high viscosity material layer (7) is injected into the micropores (6) of the TFE layer (5), the viscosity of the high viscosity material layer (7) is between 2.8 and 3.

2.

3. The method for fabricating the Micro OLED display packaging structure according to claim 1 or 2, characterized in that: The film layer of the TFE layer (5) is one or a combination of several of the following: Al2O3, TiO2, ATO, SiN, SiON, SiO, acrylic organics, and epoxy resin organics.

4. The method for fabricating the Micro OLED display packaging structure according to claim 1 or 2, characterized in that: When preparing the TFE layer (5), the preparation method of the TFE layer (5) includes, but is not limited to, ALD, PECVD, and IJP; when etching microholes (6) in the TFE layer (5), the method includes, but is not limited to, laser etching and dry etching.

5. The method for fabricating the Micro OLED display packaging structure according to claim 1 or 2, characterized in that: When a high-viscosity material layer (7) is set in the micropores (6) of the TFE layer (5), the method of setting the high-viscosity material layer (7) includes, but is not limited to, spin coating and inkjet printing.

6. The method for fabricating the Micro OLED display packaging structure according to claim 1 or 2, characterized in that: When completing the subsequent photoluminescence and module manufacturing process, the first OC layer (8), CF layer (9), second OC layer (10), and cover plate (11) are prepared and pasted in sequence, and then the Micro OLED display packaging structure is cut.

7. A Micro OLED display packaging structure, characterized in that: A CMOS driving circuit is set on a silicon wafer substrate to form a CMOS substrate (1). Multiple Anodes (2) are set on the CMOS substrate (1). A pixel definition layer (3) is set between adjacent Anodes (2). An OLED layer (4) encapsulates the definition layer (3) and Anodes (2) on the CMOS substrate (1). A TFE layer (5) is located outside the OLED layer (4). Micropores (6) are set on the surface of the TFE layer (5). A high-viscosity material layer (7) is set inside the micropores (6).

8. The Micro OLED display packaging structure according to claim 7, characterized in that: The depth of the micropores (6) on the surface of the TFE layer (5) is 400-500 nm; the viscosity of the high-viscosity material layer (7) inside the micropores (6) is between 2.8 and 3.

2.

9. The Micro OLED display packaging structure according to claim 7, characterized in that: The surface of the TFE layer (5) is sequentially provided with a first OC layer (8), a CF layer (9), a second OC layer (10), and a cover plate layer (11).

10. The Micro OLED display packaging structure according to claim 7 or 8, characterized in that: The TFE layer (5) includes multiple sets of micropores arranged in parallel. The multiple sets of micropores extend from near the upper part of the TFE layer (5) to near the lower part of the TFE layer (5). Each set of micropores includes multiple micropores (6) arranged at intervals. The multiple micropores (6) of each set of micropores extend from near the left side of the TFE layer (5) to near the right side of the TFE layer (5).

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