Method, device and computer program for producing a line of weakness on the surface of a component

Abstract

The solution proposed by the present invention relates to a method for generating a weakened line on a component surface. The method comprises a guiding step and a skipping step. In the guiding step, a removal device (310) for removing surface material is guided through a plurality of sections (M1, M2, M3) of a predetermined linear profile (100) by using an activated laser beam (407) so as to generate a target wall thickness for at least one of the sections (M1, M2, M3) to generate a weakened line. In the skipping step, when a section (M1, M2, M3) has the target wall thickness, the section (M1, M2, M3) is skipped.

Description

Technical Field

[0001] The invention relates to a method and a device for producing a weakening line on a component surface and a corresponding computer program product. Background Art

[0002] DE 10 2013 104 138 B3 describes a method for introducing a weakening line by material removal in a fiber coating material. Summary of the invention

[0003] Against this background, the present invention proposes a method for producing a weakening line on a component surface and a device for producing a weakening line on a component surface. Advantageous embodiments emerge from the following description.

[0004] The advantage that can be achieved with the proposed solution is that a weakening line can be produced particularly quickly on the component surface.

[0005] The method for producing a weakened line on a component surface has a guiding step and a skipping step. In the guiding step, a removal device for removing surface material is guided through a plurality of sections of a predetermined linear profile by using an activated laser beam so as to produce a target wall thickness for at least one of the sections to produce a weakened line. In the skipping step, when a section has the target wall thickness, the section is skipped.

[0006] The component may be a cover element for an airbag for a vehicle, which can be provided with a predetermined breaking point in the region of the airbag flap using the method proposed here. The surface may have one or more plastics, such as polypropylene (PP), thermoplastic polyolefin (TPO), polyurethane (PU) and / or polyvinyl chloride. The surface is configured to be arranged on the side of the component facing away from the vehicle occupant when the component is installed in the vehicle, i.e. it is not visible to the vehicle occupant. The removal device may be a laser, which removes the material by heating the material with the aid of a laser beam. To perform the movement, the removal device may also have a scanner (e.g. a galvanometer scanner). A plurality of sections of the predetermined linear contour may be shaped differently or identically in any manner, for example at least one section may be shaped as a straight line or a curve. The sections may be arranged at least partially to directly transition into each other in order to produce a continuous weakening line; or the sections may be arranged at least partially to be separated from each other in order to produce a weakening line that is interrupted / perforated at any distance between the sections. Here, these distances may be the same or different from each other. Each of these sections can have a target wall thickness, which can be identical or different from one another. The method proposed here makes it possible to skip a complete section that has already reached its desired target wall thickness in order to shorten the process for producing the weakening line. In the skipping step, the section can be skipped, that is, the removal device is not guided over the section. In the skipping step, the removal device can be guided to skip the section to a subsequent section after the section. In the skipping step, the contour is actively changed accordingly, in particular shortened.

[0007] During the skipping step, the output of the laser beam may be disabled, thereby ensuring that no material is removed during the skipping step for bridging the distance to the subsequent section.

[0008] It is also advantageous that the method further comprises a generating step, wherein a preceding route is generated for a subsequent section of the profile after the section, wherein the removal device jumps to the preceding route in the skipping step to move on the preceding route; and / or wherein a tracking route is generated for a preceding section of the profile arranged before the section, wherein the removal device moves on the tracking route before the skipping step. The preceding route can be generated as a route between the section and the subsequent section. The removal device can jump to the beginning of the preceding route towards the section in the skipping step so as to subsequently move on the preceding route to the end of the preceding route towards the subsequent section. Correspondingly, a tracking route can be generated between the preceding section and the section in the generating step, and / or wherein before the skipping step, the removal device is moved from the beginning of the tracking route towards the preceding section to the end of the tracking route towards the section. When the removal device moves on the preceding route and / or the tracking route, the output of the laser beam can be prohibited. Such a preceding route and / or tracking route can be generated for all sections of the profile. When two sections are directly connected to each other, the removal device can jump after the beginning of the preceding section of the subsequent section after the section at the end of the tracking route of the preceding section. Not only when skipping, but also when jumping between two sections of the profile that are arranged one after another and separated from each other, the removal device can correspondingly jump to the preceding route of the subsequent section first and / or jump after moving through the tracking route of the section arranged before the subsequent section. For example, it is always possible to jump / jump only between the end of the preceding route and / or the beginning of the tracking route. Such a preceding route and / or tracking route can be realized that no matter when the removal device jumps or jumps after the section is completed, it is always guided to these sections from the same direction. When moving on the preceding route and / or tracking route, it is also time for synchronization between the scanner and the laser.

[0009] In the generating step, a preceding route directly connected to the subsequent segment and / or a tracking route directly connected to the preceding segment may be generated. For example, a preceding route directly connected to the subsequent segment as an extension thereof may be generated in the generating step, and / or a tracking route directly connected to the preceding segment as an extension thereof may be generated. Therefore, the orientation of the preceding route and / or the tracking route may correspond to the orientation of the relevant segment. When a segment is, for example, shaped as a straight extension, its preceding route and / or the tracking route may therefore also be shaped as a straight line. In the case where a segment is curved, its preceding route and / or the tracking route may also be curved and shaped accordingly.

[0010] According to an embodiment, in the generating step, a preceding route whose preceding length is shorter than the length of the subsequent segment may be generated, and / or a tracking route whose tracking length is shorter than the length of the preceding segment may be generated. Both the preceding route and / or the tracking route may be very short, since they are only used for orientation of the removal device. Thus, unnecessary long paths may be avoided.

[0011] In the skipping step, the removal device can be moved in a direct path from a preceding section of the contour arranged before the section to a subsequent section of the contour after the section. Therefore, the removal device can be moved in the skipping step from the preceding section to the subsequent section in the shortest path, for example in a straight line and avoiding unnecessary detours. Here, in the skipping step, the removal device can still be moved from the end of the tracking route of the preceding section to the beginning of the preceding route of the subsequent section. When skipping, the path with the smallest spacing between the preceding section and the section and / or the path with the smallest spacing between the section and the subsequent section can always be advantageously selected.

[0012] It is also advantageous that the removal device moves at a higher speed in the skipping step than in the guiding step. Thus, the removal device can be moved at maximum speed in the skipping step. The removal device can also be moved at maximum speed when jumping between successive, separate, unconnected sections. Since no material handling is provided during the skipping and jumping, particularly fast movement speeds can be achieved here in order to save time. In the guiding step of removing the surface, however, a slower movement speed suitable for processing can be achieved for the removal device.

[0013] The method may have a further skipping step, wherein when a further section of the contour has a target wall thickness or a further target wall thickness, the further section is skipped. This serves to further save time. Accordingly, all sections having their respective target wall thicknesses may be skipped.

[0014] According to an embodiment, the method steps can be repeated until all sections of the contour have a determined target wall thickness. Thus, a complete weakening line can be produced in a short time. In this case, the removal device can be repeatedly guided over these sections to achieve a target wall thickness for the individual sections, wherein the guidance can be repeated over the same section at the earliest after a defined period of time after the treatment has taken place. Such a time delay between the scanning cycle / treatment cycle allows cooling of the surface to prevent overheating of the surface.

[0015] The present invention designs a device to execute or implement the steps of the variant of the method proposed here in a corresponding device. The basic purpose of the present solution can also be achieved quickly and efficiently through this implementation variant of the present solution in the form of a device.

[0016] The device can be an electrical device that processes sensor signals and outputs control signals and / or data signals depending on the sensor signals. The device can have an interface that can be designed in hardware and / or software. In the case of hardware design, these interfaces can be, for example, part of a so-called system ASIC that contains various functions of the device. However, it is also possible that these interfaces are self-owned integrated circuits or at least partially consist of discrete construction elements. In the case of software design, these interfaces can be, for example, software modules that exist on a microcontroller together with other software modules.

[0017] Also advantageous is a computer program product with a program code, which can be stored on a machine-readable carrier (such as a semiconductor memory, hard disk storage or optical storage) and is used to perform the method according to one of the above embodiments when the program product is executed on a computer or device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The scheme is described in detail below with the aid of the accompanying drawings. In the accompanying drawings:

[0019] Figure 1 a schematic diagram showing a profile for a line of weakness;

[0020] Figure 2 shows the relative position of a schematically illustrated profile 100 for treatment with a device for producing a weakening line on a component surface according to an embodiment;

[0021] Figure 3 A schematic diagram showing an apparatus for producing a weakening line on a component surface according to an embodiment;

[0022] Figure 4 A schematic diagram showing an apparatus for producing a weakening line on a surface of a component according to an embodiment; and

[0023] Figure 5 A flow chart of a method for producing a weakening line on a component surface according to an embodiment is shown. DETAILED DESCRIPTION

[0024] In the following description of advantageous exemplary embodiments of the approach, identical or similar reference numerals are used for elements which are illustrated in the various figures and act similarly, wherein a repeated description of these elements is omitted.

[0025] Figure 1 A schematic diagram of a profile 100 for a line of weakness is shown.

[0026] exist Figure 1A common process for producing a weakening line along a profile 100 using a laser beam is described in . The profile 100 is here exemplarily divided into three segments ID0, ID1, ID2. The controlled movement of the laser beam is usually carried out by means of a galvanometer scanner. The segments ID0, ID1, ID2 showing the weakening line to be produced are shown in FIG. Figure 1 The dashed outline / line J shows the corresponding jump of the laser beam to the next removal point. During the jump J, the laser beam is switched off as an example.

[0027] In the example shown here, processing is started at point S of segment ID0 by means of a laser beam and is guided to point T of segment ID0 via point U. At point T, a jump J is made to point U. The laser beam is then guided to point V via segment ID1. At point V, a jump J is made to point W of segment ID2. The laser beam is then guided from point W via point V to point X of segment ID2. At point X, a jump J is made to point S of segment ID0. The above process is repeated at point S until all segments ID0, ID1, ID2 each have a target wall thickness set for them.

[0028] In the example described here, segment ID0 reaches its target wall thickness after 11 processing cycles, segment ID1 reaches its target wall thickness after 16 cycles, and segment ID2 reaches its target wall thickness after 14 cycles. In the example described here, the maximum number of cycles is 16. This means that the laser beam will traverse the entire profile 100 16 times, regardless of whether segments ID0, ID1, ID2 have been evaluated as "Ok" (i.e., have the desired target wall thickness) according to the settings. According to the current status, the laser can only be turned off at each removal point if a previously defined value of the remaining wall thickness has been reached at this point.

[0029] The jump J between ID0 and ID1 or between ID1 and ID2 usually extends in a straight line along the processing line. Figure 1 Only the curve is shown.

[0030] In the example described here, the long cycle time is caused by the constant repetition of the scanning motion and the frequent switching of the laser on and off.

[0031] Figure 2 The relative positions of a schematically illustrated profile 100 for treatment with a device for producing a weakening line on a component surface according to an embodiment are shown. Figure 3 and Figure 4 Shown in.

[0032] According to an exemplary embodiment, at least one of the contours 100 can be used to produce a weakening line on the surface of a cover element of an airbag cover of a vehicle airbag, for example to mark it there. According to this exemplary embodiment, the contour 100 has only seven segments M following one another in the image segment a). 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 , with the same or arbitrarily different target wall thicknesses set for these sections.

[0033] The device for producing a weakened line on a surface is designed to guide a removal device for removing surface material through a plurality of sections M of a predetermined linear profile 100 by using an activated laser beam. 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 , so that for segment M 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 At least one section in the invention produces a target wall thickness to produce a weakened line. The device is also designed to: when the section M 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 When the target wall thickness is reached, segment M is skipped 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 .

[0034] According to this embodiment, these segments M 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 The second section M may be shaped differently in any manner, for example 2 Shaped as a straight and / or fourth section M 4 The V-shaped and / or sixth section M6 According to an embodiment, these segments M 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 The sections are at least partially arranged to transition directly into each other to produce a continuous weakening line; or the sections are at least partially arranged to be separated from each other to produce a continuous weakening line in section M. 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 The weakened lines are interrupted / perforated at arbitrary intervals in the section. Here, these intervals are the same or different from each other. According to this embodiment, the sections M 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 Each segment in has a target wall thickness, and these target wall thicknesses are the same or different from each other. According to this embodiment, these segments M 1 、M 3 、M 5 、M 7 The desired target wall thickness is reached, so the machine skips section M. 1 、M 3 、M 5 、M 7 , in order to shorten the process for producing the weakening line. When skipping, the segment M is skipped respectively. 1 、M 3 、M 5 、M 7 , that is, the removal device is not guided through section M 1 、M 3 、M 5 、M 7 When skipping, the skipped segment M is skipped accordingly. 1 、M 3 、M 5 、M 7 To guide the removal device to the skipped section M 1 、M 3 、M 5 、M 7 The subsequent segment after that. Here, the contour 100 is actively changed (shortened). The skipped segment M 1 、M 3 、M5 、M 7 exist Figure 2 Not shown in the figure, the dashed arrows indicate that these segments are skipped. 1 、M 3 、M 5 、M 7 Jump J.

[0035] According to this embodiment, the device is also designed to disable the output of the laser beam during the skip.

[0036] According to this embodiment, the device is designed to allow the removal device to take a direct path from the portion arranged in section M during the jump. 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 The previous segment M of the previous profile 100 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 Move to segment M 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 The subsequent segment M of the contour 100 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 According to this embodiment, the device is also designed to guide the removal device through the section M relative to the treatment. 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 According to this embodiment, the device is designed so that once all segments M of the profile 100 are 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7Each has its target wall thickness, these segments are skipped.

[0037] According to this embodiment, the apparatus is designed to repeatedly guide the removal device for removing surface material through a plurality of sections M of the profile 100 by using the activated laser beam. 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 , and repeatedly skip the segment M that has reached the target wall thickness 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 , up to all segments M of the contour 100 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 According to an embodiment, the device can achieve the following: at the earliest in the same section M after a defined period of time after treatment. 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 Repeated guidance on .

[0038] In image section b), the generation of the look-ahead path VLS and / or the follow-up path NLS is depicted. After the laser beam is switched off, it jumps J to the next processing section M. 2 、M 4 、M 6 When the mechanical movement is synchronized with the time point of "turning on the laser", it is necessary to synchronize the mechanical movement with the time point of "turning on the laser". During each repetition of the scanning movement, the laser beam should hit each removal point at the same position with the same focus. Only in this way can it be guaranteed that the material in each hole is continuously removed up to the limit value. Skipping completed sections requires flexible synchronization between the laser operation and the beam position. Time can be created for synchronization by means of a look-ahead route VLS and / or a follow-up route NLS. According to an embodiment, the device has a generating device for this purpose, which is designed to generate a time for the section M. 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7The subsequent segment M of the contour 100 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 The preceding route VLS of the section M, wherein the device is designed to move the removal device to the preceding route VLS when skipping, so that the removal device moves on the preceding route VLS; and / or wherein the generating device is designed to generate a preceding route VLS for arrangement in the section M 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 The previous segment M of the previous profile 100 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 A tracking route NLS, wherein the device is designed to move the removal device on the tracking route NLS before jumping over.

[0039] According to this embodiment, the preceding routes VLS are each generated as sections M. 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 and its subsequent segment M 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 According to this embodiment, the device is designed to move the removal device to the skipped section M of the preceding route VLS when skipping. 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 to the beginning of the preceding route VLS, so as to subsequently move through the preceding route VLS to the following section M of the preceding route VLS. 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M7 Correspondingly, the generating device according to this embodiment is designed to be used in the previous segment M 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 The skipped segment M 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 According to this embodiment, the device is designed to make the removal device pass through the tracking route NLS before skipping the previous section M. 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 The start point moves to the direction section M of the tracking route NLS 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 According to this embodiment, when the removal device moves on the preceding route VLS and / or the following route NLS, the device prohibits the output of the laser beam. According to this embodiment, the generating device is designed to generate a laser beam directly connected to the subsequent segment M. 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 The preceding route VLS connected to the preceding segment M 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 According to an embodiment, the generating device generates, for example, a subsequent segment M directly as a tracking route NLS. 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7The preceding route VLS connected to it and / or generated directly as the preceding segment M 1 、M 2 、M 3 、M 4 、M 5 、M 6 、M 7 Therefore, according to the embodiment, the section for the straight extension (here, the section M) is connected to the tracking route NLS. 1 , M4 ) is also generated as a straight line. Correspondingly, according to an embodiment, the curved section (here, section M) is used for 6 )'s preceding route VLS and / or following route NLS are also generated to be correspondingly curved.

[0040] According to an embodiment, the generating means is further designed to generate a preceding route VLS whose preceding length is shorter than the succeeding segment length and / or to generate a following route NLS whose following length is shorter than the preceding segment length.

[0041] Although image segment c) visually corresponds to image segment a), image segment c) has an eighth segment M according to this exemplary embodiment. 8 In the image segment a), the V-shaped segment M 4 The image segment c) is divided into two segments M that are connected to each other and are each straight lines. 4 、M 8 , these two sections together form a V shape. According to this embodiment, the eighth section M 8 Arranged in the fourth section M 4 With the fifth segment M 5 between.

[0042] Corresponding to the description in image section b), in image section d) a fourth section M for the now straight line is presented. 4 The tracking route NLS and the M 8 According to this embodiment, in the two sections M 4 、M 8 When the removal device is directly connected to each other, it moves through the front section M 4 After the end of the tracking route NLS, jump to segment M 4 The subsequent segment M 8 The starting point of the preceding route VLS.

[0043] In the image segments b) and d), the segments M to be processed are generated. 2 、M 4 、M6 、M 8 The look-ahead path VLS and follow-up path NLS are used to accelerate or decelerate the movement of the laser beam. These look-ahead paths VLS or follow-up paths NLS provide the time for synchronizing the laser operation and the beam position when the laser is switched off. This ensures that the laser hits the first removal point at exactly the same position, regardless of the direction in which the beam "jumps".

[0044] Furthermore, according to an embodiment, the time period / time window of the look-ahead route VLS is used to pre-evaluate the process already in the microcontroller and decide whether the subsequent segment should be skipped directly. To this end, according to an embodiment, the results of the previous scanning movement are retrieved, processed, and the further movement process is controlled.

[0045] At the end of the process, there are M segments left to be processed. 2 、M 4 、M 6 、M 8 The number of scanning movements is smaller and the time between repeated scanning movements will also be shorter. This may lead to an increase in undesirable thermal effects on the material. In order to avoid this, according to an embodiment, a time delay is performed for the next scanning movement.

[0046] The device proposed here can advantageously implement a method for introducing a weakening line in a cover element by material removal with the aid of a laser. For safe deployment of an airbag, it is important that the cover element is provided with a rated breaking point in the area of ​​the airbag cover that is achieved by introducing a weakening line. For reasons of visibility, the introduction is usually carried out from the non-visible rear side of the cover element. In addition to a precisely adjustable residual tear strength of the weakening line, the highest quality requirements for the surface are only met if the weakening line is not perceptible visually or haptically on the viewing side of the cover element facing the occupant.

[0047] Here, cover elements are understood in the broadest sense to be interior elements of a vehicle, in particular the instrument panel. According to various embodiments, these cover elements are designed as single-layer or multi-layer. According to an embodiment, the cover element has a plastic such as polypropylene (PP), thermoplastic polyolefin (TPO), polyurethane (PU) and / or polyvinyl chloride as material. According to an embodiment, a high-quality decorative layer (for example made of textile material or leather) is processed for the side of the cover element facing the passenger's sight line.

[0048] Figure 3 A schematic diagram of a device 300 for producing a weakening line on a component surface according to an embodiment is shown. The device may be Figure 2 The device 300 is described.

[0049] According to this embodiment, the apparatus 300 is implemented in the controller 305 of the removal device 310. According to this embodiment, the controller 305 further includes a laser controller 315 and a scanner controller 320, wherein according to this embodiment, the apparatus 300 is connected to the scanner controller 320 and the laser controller 315 in a signal-transmitting manner.

[0050] According to this embodiment, a profile 100, which can also be referred to as a "graphic", is designed on a PC 325 and received by a controller 305. A workpiece 330, here in the form of a cover element surface, is processed according to a laser controller 315 and a scanner controller 320. A sensor 335 senses values ​​such as the wall thickness of the cover element at individual sections of the profile 100. The laser controller 315 is regulated according to a sensor value 340 of the sensor 335. Due to the device 300 proposed here, the scanner controller 320 is also regulated according to the sensor value 340 of the sensor 335.

[0051] In the application example, a pulsed laser beam is directed to the back side of the cover element and guided in a linear manner when using the removal device 310. The parameters of the laser pulse are selected so that the laser pulse achieves an energy input that achieves heating of the material to a temperature above the ablation threshold at the corresponding impact position, but the temperature of the area of ​​the material adjacent to the corresponding impact position remains below the limit temperature. The scanning movement is repeated several times along the weakening line to be produced until a defined residual wall thickness is achieved on the line of sight side. The achieved residual wall thickness is monitored by a sensor 335, which has a local resolution corresponding to the size of the impact position. When a defined residual wall thickness / target wall thickness is achieved at each impact position, the device 300 is used to skip this section when the laser beam is switched off. The scanning movement is repeated (N cycles) until all impact points reach a defined residual wall thickness. According to this embodiment, the weakening line is composed of a continuous groove or a series of grooves or holes (for example in the form of blind holes or microholes) or a combination thereof. According to the embodiment, the removal depth is constant or varies according to a specific mechanism over the length of the weakening line.

[0052] According to this embodiment, the processing cycle 345 of the profile 100 is repeated five times to produce the weakened line. In the first three processing cycles 345, the laser control / scanner control is carried out in a manner that is completely adapted to the profile 100. In the fourth and fifth processing cycles 345, the laser control / scanner control is adapted to the profile 100 to an increasingly low degree, so that the profile 100 needs to be actively changed 350 accordingly in the fourth and fifth processing cycles 345, because according to the embodiment, already completed sections are skipped.

[0053] In the solution proposed here, the pattern / contour 100 consists of individual sub-patterns in the form of segments which are skipped by the laser beam after weakening. Each segment is characterized by a defined residual wall thickness which is achieved by a specific weakening mechanism. The weakening mechanism is defined and calibrated according to an embodiment by parameters. According to an embodiment, such parameters may be:

[0054] -Laser beam type

[0055] -Laser power

[0056] - Pulse width

[0057] -Focus

[0058] - Geometry of the weakening line

[0059] - Size and spacing of grooves and holes

[0060] - Number of cycles of scanning motion

[0061] -Speed ​​of scanning movement

[0062] Thanks to the device 300, individual sections of the pattern are skipped after they have been completed, that is, when all scanned points / holes have reached a defined remaining wall thickness and have been evaluated as "OK". According to an embodiment, in the subsequent repeated scanning movement, the switched-off laser beam skips these sections at maximum speed. This reduces the cycle time for producing the entire weakening line.

[0063] Figure 4 A schematic diagram of a device 300 for producing a weakening line on a component surface according to an embodiment is shown. The device may be Figure 2 or Figure 3 The device 300 described in Figure 3 As described, the device 300 is implemented in the controller 305 (here in the form of a technology processor) according to this embodiment. The laser controller 315 and the scanner controller 320 may also be referred to as a "communication processor" which is designed to communicate with the device 300, the laser 400 for generating the laser beam 407, the scanner 405 and the user interface / operating software 410. According to this embodiment, the user interface / operating software 410 includes a recipe / instruction 415 with target wall thicknesses, which are in the form of a laser controller 315 for each segment M of the profile 100. 1 、M 2 、M 3 The desired weakening rating 420 is in the form of a profile which, according to this embodiment, comprises a segment M 1 、M 2 、M 3 According to this embodiment, for the first section M 1The required weakening rating 420 is 95% for the second section M 2 The required weakening rating 420 is 90%, and for the third section M 3 The required weakening rating 420 is 98%. In addition, according to this embodiment, the scheme / instruction 415 includes additional instructions 425, such as for these sections M 1 、M 2 、M 3 According to this embodiment, the user interface / operating software 410 also includes an evaluation device / control device 430, which is designed to compare the rated value 420 with the actual value and / or evaluate all other evaluation parameters. 1 、M 2 、M 3 Due to the successful satisfaction of the indication 415, it is skipped at a skip rate that is greater than the segment M that has not been completed at the time of processing. 1 、M 2 、M 3 According to this embodiment, segment M 1 、M 2 Satisfies its indication 415, and the third segment M 3 Therefore, according to this embodiment, the completed segment M is skipped. 1 、M 2 And process the third segment M 3 .

[0064] According to this embodiment, the device 300 has a cycle activation device 435, a calculation device 440, a verification device 445 and / or a transmission device 450. According to an embodiment, the cycle activation device 435 activates the removal device 310 for a cycle n along the contour 100. The calculation device 440 calculates the contour generation / graphic generation of the contour 100 for the current cycle. According to this embodiment, the verification device 445 verifies the indication 415 using the actual value determined by the sensor evaluation electronics 455 of the sensor 335. The sensor electronics 455 provides sensing sensors from the sensor field 460 for this purpose. In not all segments M 1 、M 2 、M 3 When the indications are met (i.e., the target wall thickness is not reached yet), the verification device 445 outputs an activation signal 465 to the cycle activation device 435 to activate a further cycle, wherein the completed segment M 1 、M 2 is skipped in further cycles. 1 、M 2 、M 3When its indication is met (ie, it has its target wall thickness), the verification device 445 outputs a transmission signal 470 to the transmission device 450 to transmit the result to the user interface / operation software 410 .

[0065] According to an embodiment, user interface / operating software 410 is part of device 300 .

[0066] Figure 5 A flow chart of a method 500 for producing a weakening line on a component surface according to an embodiment is shown. Here, the method 500 may be involved, which may be performed by Figures 2 to 3 One of the devices described herein can be operated and / or performed.

[0067] The method 500 has a guiding step 505 and a skipping step 510. In the guiding step 505, a plurality of sections of a predetermined linear profile are skipped to guide a removal device for removing surface material using an activated laser beam so as to produce a target wall thickness for at least one of the sections to produce a weakened line. In the skipping step 510, when a section has the target wall thickness, the section is skipped.

[0068] Optionally, according to this embodiment, method 500 also includes a generating step 515, wherein a preceding route is generated for a subsequent segment of the contour after the segment, wherein the removal device jumps to the preceding route in skipping step 510 to move on the preceding route; and / or wherein a tracking route is generated for a preceding segment of the contour arranged before the segment, wherein the removal device is caused to move on the tracking route before skipping step 510.

[0069] The embodiments described and shown in the drawings are selected only as examples. Different embodiments can be combined with each other completely or in terms of individual features. An embodiment can also be supplemented by features of other embodiments.

[0070] Furthermore, method steps of the aspects may be repeated and performed in an order different from that described.

[0071] If an embodiment includes the conjunction “and / or” between a first feature and a second feature, this should be understood that the embodiment according to one embodiment has the first and second features and the embodiment according to another embodiment includes only the first feature or only the second feature.

Claims

1. A method (500) for producing a weakened line on a surface of a component, wherein the method (500) comprises the following steps: The weakening line is produced by guiding (505) a removal device (310) for removing surface material through a plurality of sections (M1, M2, M3, M4, M5, M6, M7, M8) of a predetermined linear profile (100) using an activated laser beam (407) so as to produce a target wall thickness for at least one of the sections (M1, M2, M3, M4, M5, M6, M7, M8); as well as When the segment (M1, M2, M3, M4, M5, M6, M7, M8) has the target wall thickness, the segment (M1, M2, M3, M4, M5, M6, M7, M8) is skipped (510), characterized in that a generation step (515) is performed in which a look-ahead path (VLS) is generated for a subsequent segment (M1, M2, M3, M4, M5, M6, M7, M8) of the profile (100) after the segment (M1, M2, M3, M4, M5, M6, M7, M8), wherein the removal device (310) jumps to the look-ahead path (VLS) in the skipping step (510) to be moved on the look-ahead path (VLS); and / or wherein A tracking path (NLS) is generated for a preceding segment (M1, M2, M3, M4, M5, M6, M7, M8) of the profile (100) which is arranged before the segment (M1, M2, M3, M4, M5, M6, M7, M8), wherein the removal device (310) is moved on the tracking path (NLS) before the skipping step (510); the removal device (310) is moved on the preceding path (VLS) and / or on the tracking path (NLS) to create time for synchronization between activation of the laser beam and beam position of the laser beam when skipping (510) the segment (M1, M2, M3, M4, M5, M6, M7, M8).

2. The method (500) according to claim 1, wherein in the skipping step (510), output of the laser beam (407) is disabled.

3. The method (500) according to claim 1 or 2, wherein in the generating step (515), the preceding route (VLS) directly connected to the subsequent segment (M1, M2, M3, M4, M5, M6, M7, M8) is generated, and / or the following route (NLS) directly connected to the preceding segment (M1, M2, M3, M4, M5, M6, M7, M8) is generated.

4. The method (500) according to claim 1, wherein in the generating step (515), the preceding route (VLS) is generated whose preceding length is shorter than the length of the subsequent segment (M1, M2, M3, M4, M5, M6, M7, M8), and / or the tracking route (NLS) is generated whose tracking length is shorter than the length of the preceding segment (M1, M2, M3, M4, M5, M6, M7, M8).

5. The method (500) according to claim 1, wherein in the skipping step (510), the removal device (310) is moved in a direct path from a preceding segment (M1, M2, M3, M4, M5, M6, M7, M8) of the profile (100) that is arranged before the segment (M1, M2, M3, M4, M5, M6, M7, M8) to a subsequent segment (M1, M2, M3, M4, M5, M6, M7, M8) of the profile (100) that is arranged after the segment (M1, M2, M3, M4, M5, M6, M7, M8).

6. The method (500) according to claim 1, wherein in the skipping step (510), the movement speed of the removal device (310) is higher than its movement speed in the guiding step (505).

7. The method (500) according to claim 1, characterized in that The method comprises a continuing skipping step (510), wherein when a further section (M1, M2, M3, M4, M5, M6, M7, M8) of the contour (100) has the target wall thickness or a further target wall thickness, the further section (M1, M2, M3, M4, M5, M6, M7, M8) is skipped.

8. The method (500) according to claim 1, wherein the steps (505, 510, 515) of the method (500) are repeated until all sections (M1, M2, M3, M4, M5, M6, M7, M8) of the contour (100) each have a determined target wall thickness.

9. A device (300) for producing a weakening line on a component surface, characterized in that The device comprises a user interface (410), an evaluation device (430), a cyclic activation device (435), a calculation device (440), a verification device (445) and / or a transmission device (450), and is configured to carry out and / or control the steps (505, 510, 515) of the method (500) according to one of the preceding claims.

10. A computer program, characterized in that The computer program is configured to implement the method (500) according to one of claims 1 to 8.

11. A machine-readable storage medium, characterized in that The computer program according to claim 10 is stored on the storage medium.

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