Antenna radio frequency filter assembly

Abstract

The present invention relates to an antenna RF filter assembly, and more particularly, the present invention comprises a main board on which a plurality of electric components are mounted; a plurality of RF filters provided on one surface of the main board; and a filter support member disposed between the main board and the plurality of RF filters, formed of a metal material, and spaced apart from the plurality of RF filters in the direction of the one surface of the main board, thereby providing the advantages of preventing cracks in the solder paste due to the difference in the thermal expansion coefficients of the main board and the RF filters, and achieving a more precise arrangement of the RF filters, and improving the reliability of the product.

Description

Technical Field

[0001] This invention relates to a radio frequency filter assembly for antennas, and more specifically, to a radio frequency filter assembly for antennas that minimizes the solder joint area and prevents electrical short circuits. Background Technology

[0002] To meet the increasing demand for wireless data communication following the commercialization of 4G (fourth generation) communication systems, research and development of improved 5G (fifth generation) or pre-5G communication systems are underway. For this reason, 5G or pre-5G communication systems are referred to as Beyond 4G Network communication systems or Post-LTE systems, representing the future of Long Term Evolution (LTE).

[0003] To achieve high data transmission rates, 5G communication systems consider using ultra-high frequency (mmWave) bands for communication. To reduce path loss and increase propagation distance of radio waves in the mmWave band, technologies such as beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antenna, analog beamforming, and large-scale antennas are studied in 5G communication systems.

[0004] In particular, array antenna technology involves the integration of multiple filters and antenna components—one of the antenna elements—on the front of a single-board motherboard. Furthermore, achieving resistance matching between multiple receive and transmit channels requires high physical precision. Recently, in the 5G communication system market, there has been a growing demand for ceramic waveguide filters (CWB filters) among various array antennas, facilitating both frequency filtering design and manufacturing. This necessitates a mass production technology to meet the demand for CWB filters.

[0005] Figure 1 A simplified cross-sectional view illustrating an example of the configuration of a filter mounted on a motherboard in a prior art antenna radio frequency filter assembly.

[0006] like Figure 1As shown, the prior art antenna RF filter assembly 1 achieves bonding by using a fixing plate 5 as a medium on one side of a main board 10 formed of a specified material in the form of a single plate. The fixing plate 5 is made of FR4 material and serves to maintain a specified distance from one side of the main board 10 to prevent short circuits in electrical signals during direct contact bonding between the main board 10 and the RF filter 20.

[0007] After applying solder paste 30 to one side of the mounting plate 5 to a specified thickness, multiple RF filters 20 made of ceramic material are used for precision component arrangement. Then, the solder paste 30 is melted by applying specified heat. All multiple RF filters 20 are installed in this way (i.e., SMT method). During the installation of RF filters 20, in order to prevent short circuit defects under the components, the solder paste 30 is usually applied to a very thick thickness.

[0008] However, the solder paste 30 disposed between the mounting plate 5 and the RF filter 20 may crack at specified locations due to the difference in the coefficients of thermal expansion between the FR4 material mounting plate 5 and the ceramic material RF filter (for example, the coefficient of thermal expansion of the mounting plate 5 is 17ppm / ℃, and the coefficient of thermal expansion of the ceramic material RF filter is 8.2ppm / ℃). This is caused by the system heating inside the antenna housing body (not shown) of the prior art antenna RF filter assembly 1, which may become a major cause of antenna malfunction.

[0009] That is, if a crack is generated between the fixing plate 5 and the RF filter 20, the RF filter 20 will be physically separated and physically detached, and the silver plating layer metallized around the RF filter 20 will be detached, which will lead to a deterioration in the performance of the antenna.

[0010] Furthermore, the formation of such cracks can also affect the performance of the input and output ports (not shown) of the RF filter 20. On the other hand, signal leakage at the part that serves as the grounding terminal (GND) can cause performance degradation between the RF filters 20 at the isolation level. Summary of the Invention

[0011] Technical issues

[0012] The present invention is intended to solve the technical problems described above. One object of the present invention is to provide an antenna RF filter assembly that minimizes the soldering area between the motherboard and multiple RF filters and reduces the amount of soldering required.

[0013] Furthermore, another object of the present invention is to provide an antenna radio frequency filter assembly that can prevent electrical short circuits in advance by separating multiple radio frequency filters from one side of the motherboard by a predetermined distance.

[0014] Furthermore, another object of the present invention is to provide an antenna RF filter assembly that ensures reliability by achieving uniform and precise device arrangement of multiple RF filters on one side of a motherboard.

[0015] The purpose of this invention is not limited to the purposes mentioned above. Other purposes not mentioned can be clearly understood by those skilled in the art through the following description.

[0016] Technical solution

[0017] An antenna radio frequency filter assembly according to an embodiment of the present invention includes: a plurality of radio frequency filters disposed on one side of a main board on which a plurality of electrical components are mounted; and a filter support member disposed between the main board and the plurality of radio frequency filters, formed of a metal material, and separating the plurality of radio frequency filters from one side of the main board.

[0018] The filter support component may include a filter body support portion, except for a portion thereof, which is formed in a manner corresponding to the shape of the end of each of the plurality of radio frequency filters that is closer to the motherboard side.

[0019] Furthermore, the aforementioned filter support component may also include a filter port support portion, which is disposed inside the aforementioned filter body support portion and is separated from the aforementioned filter body support portion, and is respectively separated from the motherboard from the input and output port portions supporting the power supply signals for the aforementioned plurality of radio frequency filters.

[0020] Furthermore, in the aforementioned filter body support portion, the aforementioned filter port support portion may be disposed inside the aforementioned filter body support portion corresponding to the portion that has been removed.

[0021] Furthermore, the filter body support and the filter port support can be separated from the plurality of radio frequency filters at the same height.

[0022] Furthermore, the aforementioned filter body support portion may include a side cut groove portion and a side cut groove portion formed from one side edge end and the other side edge end to the portion where the aforementioned filter port support portion is disposed.

[0023] Moreover, the filter body support portion may include: a support plate portion attached to one side of the main board in a surface contact manner; edge support ends respectively bent toward the plurality of radio frequency filters at the edge end portions of the support plate portion; and at least one inner support end formed by bending a part of the support plate portion corresponding to the inner side of the edge support ends, and respectively supporting the opposing surfaces of the plurality of radio frequency filters.

[0024] Moreover, the outer shape formed by the support plate portion may be the same as the shape obtained by removing the one cutout groove portion and the other cutout groove portion from the outer shape of the opposing surface of the radio frequency filter.

[0025] Moreover, the edge support ends may be formed in a shape where recesses and protrusions are repeatedly formed along the edge end portions.

[0026] Moreover, the at least one inner support end may be formed by cutting a part of the support plate portion into a "匚" shape, and the at least one inner support end may include: a first bending portion bent from a portion connected to the support plate portion toward the direction where the plurality of radio frequency filters are provided; and a second bending portion bent in a manner parallel to the opposing surfaces of the plurality of radio frequency filters from the end of the first bending portion.

[0027] Moreover, the plurality of radio frequency filters may be formed of ceramic waveguide filters, the filter port support portion may be provided at positions corresponding to the input port holes and the output port holes, the input port holes are connected to the input ports of the ceramic waveguide filters, and the output port holes are connected to the output ports of the ceramic waveguide filters.

[0028] Moreover, the plurality of radio frequency filters may be formed of ceramic waveguide filters, and may be welded and joined at the contact positions of the filter body support portion and the filter port support portion.

[0029] Moreover, the filter support member is formed of a metal material different from the materials of the plurality of radio frequency filters and the main board, and may include one of steel, stainless steel (SUS), and pure copper (Cu) materials.

[0030] Effects of the Invention

[0031] According to an embodiment of the radio frequency filter assembly for an antenna of the present invention, the following various effects can be achieved.

[0032] First, the present invention can achieve the following effect, that is, by minimizing the welding area and the welding amount between the main board and the plurality of radio frequency filters, the thickness of the solder paste is thinned, so that the cracks of the solder paste caused by system heating can be minimized.

[0033] Furthermore, the present invention can achieve the following effect: it can alleviate the stress generated between the RF filter and the motherboard due to the expansion of the filter support component made of metal material during thermal expansion.

[0034] Moreover, the present invention can achieve the following effect: by separating multiple radio frequency filters from one side of the motherboard by a specified distance, electrical short circuits can be prevented in advance, thereby ensuring a stable signal flow.

[0035] Furthermore, the present invention can achieve the following effect: by arranging multiple radio frequency filters uniformly and precisely on one side of the motherboard, the reliability of the product can be improved. Attached Figure Description

[0036] Figure 1 A simplified cross-sectional view illustrating an example of the configuration of a filter mounted on a motherboard in a prior art antenna radio frequency filter assembly.

[0037] Figure 2a as well as Figure 2b These are top and bottom perspective views of an antenna radio frequency filter assembly according to an embodiment of the present invention.

[0038] Figure 3 This is an exploded perspective view of an antenna radio frequency filter assembly according to an embodiment of the present invention.

[0039] Figure 4 To show Figure 3 A 3D view of the filter in the structure shown.

[0040] Figure 5 To show Figure 3 A perspective view of the filter support component in the structure shown.

[0041] Figure 6 For along Figure 2a A cross-sectional view of the AA line cut in the image.

[0042] Explanation of reference numerals in the attached figures

[0043] 100: Antenna RF filter assembly; 110: Motherboard

[0044] 120: Radio Frequency Filter (Ceramic Waveguide Filter) 121: Filter Body

[0045] 122: Resonator column; 123: Modulation cover

[0046] 124: Engraving 125: Filter Cover

[0047] 140: Filter support component; 142: Filter body support component

[0048] 143: Filter port support section; 144: Edge support end

[0049] 144a: concave portion 144b: convex portion

[0050] 145: Inner support end; 145a: First curved portion

[0051] 145b: Second curved section; 146a: One-sided cut groove section

[0052] 146b: Cut groove on the other side; 147: Straight slit section

[0053] 148: Circular slit Detailed Implementation

[0054] Hereinafter, an embodiment of the antenna radio frequency filter assembly of the present invention will be described in detail with reference to the accompanying drawings.

[0055] In assigning reference numerals to structural elements in the various figures, the same reference numerals are assigned to the same structural elements as much as possible, even if they appear in different figures. Furthermore, in describing embodiments of the present invention, if it is determined that a detailed description of a related well-known structure or function may hinder the understanding of the embodiments of the present invention, its detailed description is omitted.

[0056] In describing the structural elements of the embodiments of the present invention, terms such as "first," "second," "A," "B," "(a)," and "(b)" may be used. These terms are only used to distinguish a structural element from other structural elements, and the nature, sequence, or order of the corresponding structural elements is not limited by their terminology. Furthermore, unless otherwise defined, the meanings of all terms used in the specification, including technical or scientific terms, are the same as those commonly understood by one of ordinary skill in the art to which this invention pertains. Multiple terms whose commonly used meanings are the same as those defined in dictionaries should be interpreted as having the same meaning as the related art in the context, and should not be interpreted in an idealized or overly formalized sense unless explicitly defined in this application.

[0057] Figure 2a as well as Figure 2b These are top and bottom perspective views of an antenna radio frequency filter assembly according to an embodiment of the present invention. Figure 3 This is an exploded perspective view of an antenna radio frequency filter assembly according to an embodiment of the present invention. Figure 4 To show Figure 3 A 3D view of the filter in the structure shown.

[0058] like Figures 2a to 4As shown, an antenna radio frequency filter assembly 100 according to an embodiment of the present invention includes a main board 110, a plurality of radio frequency filters 120 and a filter support component 140.

[0059] The main board 110 is a single-board printed circuit board (PCB). Multiple RF filters 120 or a portion of multiple electrical components synchronized with them can be mounted on one side, and multiple electrical components consisting of multiple power supply related components can be mounted on the other side to calibrate and control the power supply to the multiple RF filters 120.

[0060] In one embodiment of the invention, for ease of explanation, the other side of the motherboard 110, which is composed of a single-board printed circuit board, is shown ( Figure 2a The diagram above shows a single RF filter 120 disposed on a single filter support member 140, but this does not preclude the following configuration, in which the filter support member 140 is formed in an inherent shape based on the configuration positions of all or part of the plurality of RF filters 120 and is stacked in multiple positions relative to the entire other side of the motherboard 110.

[0061] The radio frequency filter 120 can be composed of a ceramic waveguide filter, and multiple filter support components 140 can be installed and arranged at specified intervals on one side of the motherboard 110 as a medium.

[0062] like Figure 3 and Figure 4 As shown, the radio frequency filter 120 employing a ceramic waveguide filter includes a filter body 121 formed of ceramic material and at least four resonant blocks disposed on the filter body 121. Each resonant block is provided with a corresponding resonator post 122, and each resonator post 122 filters the frequency signal through adjacent coupling with adjacent resonator posts 122 or by skipping at least one cross-coupling.

[0063] The resonant blocks 11, 12, 13, 14, 15, and 16 formed on the filter body 121 do not need to be completely physically separated. It is sufficient that they can be distinguished by changing the signal transmission path width through the partition set on the filter body 121.

[0064] For example, such as Figure 4As shown, six resonator pillars 122a, 122b, 122c, 122d, 122e, and 122f are provided in the filter body 121. If an electrical signal is input through the input port hole 129a (described later), the signal is applied through the first resonator pillar 122a closest to the input port hole 129a, and then filtered sequentially through the second resonator pillar 122b, the third resonator pillar 122c, the fourth resonator pillar 122d, the fifth resonator pillar 122e, and the sixth resonator pillar 122f. Finally, the signal is output through the output port hole 129b.

[0065] Specifically, the first resonant block 11 and the second resonant block 12 are divided by setting a first partition 127a between the first resonator column 122a and the second resonator column 122b; the second resonant block 12 and the third resonant block 13 are divided by setting a second partition 127b between the second resonator column 122b and the third resonator column 122c; the third resonant block 13 and the fourth resonant block 14 are divided by setting a portion of the third partition 127c between the third resonator column 122c and the fourth resonator column 122d; the fourth resonant block 14 and the fifth resonant block 15 are divided by setting a fourth partition 127d between the fourth resonator column 122d and the fifth resonator column 122e; and the fifth resonant block 15 and the sixth resonant block 16 are divided by setting the remaining portion of the third partition 127c between the fifth resonator column 122e and the sixth resonator column 122f. In particular, the third partition 127c serves to physically divide the three resonant blocks (the first resonant block 11, the third resonant block 13, and the sixth resonant block 16) simultaneously by being positioned between the first resonator column 122a, the third resonator column 122c, and the sixth resonator column 122f.

[0066] The first partition 127a, the second partition 127b, the third partition 127c, and the fourth partition 127d described above can all be formed to a predetermined size that runs through the filter body 121 in the vertical direction.

[0067] The filter body 121 is coated with a metal film, which, except for the input port hole 129a or the output port hole 129b described later, can block the flow of electrical signals both internally and externally.

[0068] As described above, in order to perform filtering based on the adjacent coupling or cross coupling of electrical signals flowing through input ports or output ports (not shown), at least four resonant blocks are preferably provided on the filter body 121. In one embodiment of the present invention, six resonant blocks 11, 12, 13, 14, 15, and 16 are provided as an example for explanation.

[0069] That is, in the antenna radio frequency filter assembly 100 of one embodiment of the present invention, the ceramic waveguide filter has six resonant blocks 11, 12, 13, 14, 15, and 16 disposed in a filter body 121. The resonator pillars 122a, 122b, 122c, 122d, 122e, and 122f of each resonant block 11, 12, 13, 14, 15, and 16 can be disposed in a form filled and fixed with a dielectric material having a specified capacitance. Air is also a type of dielectric material. When air is used as the dielectric material constituting the resonator pillars 122a, 122b, 122c, 122d, 122e, and 122f, no separate filling and fixing steps are required. The six resonator pillars 122a, 122b, 122c, 122d, 122e, and 122f can be formed in a hollow form by removing a portion of the dielectric material from the filter body 121.

[0070] Among them, such as Figure 4 As shown, a portion of the inner surfaces of the resonator pillars 122a, 122b, 122c, 122d, 122e, and 122f, and a portion of one side of the filter body 121 corresponding to the upper edge portions of the resonator pillars 122a, 122b, 122c, 122d, 122e, and 122f, can be coated with conductive material to form a coating portion 126a, 126b, 126c, 126d, 126e, and 126f. A portion of the coating portion 126a, 126b, 126c, 126d, 126e, and 126f may further include a coating extension end 126f-1 extending closer to the corresponding resonator pillar 126d, so as to easily achieve cross-coupling between portions of the resonator pillars 122a, 122b, 122c, 122d, 122e, and 122f.

[0071] In one embodiment of the present invention, on one side of the filter body 121, a coating extension end 126f-1 can be formed extending from the coating portion 126f formed on the sixth resonator post 122f toward the coating portion 126d of the fourth resonator post 122d in a close manner, so as to form a cross-coupling between the fourth resonator post 122d and the sixth resonator post 122f that skips a fifth resonator post 122e, and cross-coupling can be easily achieved.

[0072] Moreover, referencing Figure 4An arc-shaped portion 128, without any coating layer, can be provided around each of the coated portions 126a, 126b, 126c, 126d, 126e, and 126f. The arc-shaped portion 128 can perform a grounding function to insulate the portion coated on the outer surface of the filter body 121 from the coated portions 126a, 126b, 126c, 126d, 126e, and 126f of the resonator pillars 122a, 122b, 122c, 122d, 122e, and 122f.

[0073] On the other hand, although not shown, an input port hole 129a and an output port hole 129b can be formed on the other side of the ceramic waveguide filter. The input port hole 129a is used to connect to the input port (not shown) of one of the six resonator pillars 122 for an input electrical signal, and the output port hole 129b is used to connect to the output port (not shown) of one of the six resonator pillars 122 for an output electrical signal. The input port hole 129a and the output port hole 129b can be provided with an input port and an output port, respectively, that connect to the main board 110 side using the filter port support portion 143 in the structure of the filter support member 140 (described later) as a medium.

[0074] Moreover, such as Figure 3 As shown, the ceramic waveguide filter may further include: a modulation cover 123 disposed on one side of the opening of each resonator post 122, configured to perform frequency modulation by means of a etch or modulation screw; and a filter cover 125, which is combined to cover one side of the filter body 121 including the modulation cover 123.

[0075] When the frequency modulation method is etched, the etched plate 124 can be integrally formed on the modulation cover 123. The etched plate 124 is spaced apart and positioned corresponding to the resonator post 122. The spacing between the resonator post 122 and the bottom surface can be finely adjusted by etching with an etching tool (not shown), thereby performing frequency modulation.

[0076] On the other hand, such as Figures 2a to 3 As shown, the filter support component 140, disposed between the motherboard 110 and the plurality of RF filters 120, serves to separate the plurality of RF filters 120 on one side of the motherboard 110. Furthermore, the filter support component 140 is fixed to one side of the motherboard 110 using various bonding methods other than soldering, and is bonded to the plurality of RF filters 120 via soldering, thereby acting as a medium for the bonding between the motherboard 110 and the RF filters 120.

[0077] This filter support component 140 can be made entirely of a metal material different from the materials of the plurality of RF filters 120 and the motherboard 110, including steel, stainless steel (SUS), and pure copper (Cu). Because the filter support component 140 is made of a metal material, it has the advantage of minimizing the difference in the coefficients of thermal expansion between the solder pastes that act as a dielectric between the filter bodies 121.

[0078] Figure 5 To show Figure 3 A perspective view of the filter support component in the structure shown. Figure 6 For along Figure 2a A cross-sectional view of the AA line cut in the image.

[0079] Reference Figure 3 as well as Figure 5 The filter support member 140 may include: a filter body support portion 142, except for a portion thereof, formed in a manner corresponding to the shape of the end of each of the plurality of RF filters 120 near the motherboard 110; and a filter port support portion 143, disposed inside the filter body support portion 142, spaced apart from the filter body support portion 142, and spaced apart from the motherboard 110 from the input / output port portions supporting power supply signals for the plurality of RF filters 120. The filter port support portions 143 can be formed in pairs corresponding to the input port aperture 129a and output port aperture 129b formed on the RF filters 120, respectively.

[0080] The filter body support portion 142 and the aforementioned filter port support portion 143 are spaced apart from each other at the same height by multiple radio frequency filters 120. This will be explained in more detail later.

[0081] like Figure 3 as well as Figure 5 As shown, in order to achieve the separation of a pair of filter port support portions 143, the filter body support portion 142 can be formed by cutting from one side edge end and the other side edge end to the part where the filter port support portion 143 is disposed.

[0082] More in detail, such as Figure 3 as well as Figure 5 As shown, when the ceramic waveguide filter is generally formed as a cuboid along its length, the filter body support 142 can be formed into a plate shape corresponding to one or the other side of the ceramic waveguide filter.

[0083] Among them, such as Figure 3As shown, a pair of filter port support portions 143 are disposed inside the filter body support portion 142 without mutual interference in a manner that is not electrically connected to the filter body support portion 142. The filter body support portion 142 may include: a side cut-out groove portion 146a, which is cut from one side edge end as one end in the length direction to the portion where a filter port support portion 143 is disposed; and a other side cut-out groove portion 146b, which is cut from the other side edge end as the other end in the length direction to the portion where another filter port support portion 143 is disposed.

[0084] The cut-out groove 146a on one side and the cut-out groove 146b on the other side can each form a straight slit 147 of the same width up to the part where a pair of filter port support parts 143 are provided. The part where the pair of filter port support parts 143 are located can form a circular slit 148 with a diameter greater than the width of the end of the straight slit 147.

[0085] Although not shown, the straight slit portion 147 is a signal line pattern printed on the motherboard 110 side, which can perform the function of shielding external noise from the electrical signals flowing through the input port and the output port respectively.

[0086] The circular slit 148 can stabilize the flow of electrical signals connected to the ceramic waveguide filter side through the input port and output port, respectively.

[0087] On the other hand, such as Figure 3 as well as Figure 5 As shown, the filter body support portion 142 may include: a support plate portion 142a, which is attached to one side of the main board 110 in a surface contact manner; an edge support end 144, which is bent toward a plurality of radio frequency filters 120 (i.e., ceramic waveguide filters) at the edge end of the support plate portion 142a; and at least one inner support end 145, which is formed by bending a portion of the support plate portion 142a corresponding to the inner side of the edge support end 144, and supports the respective opposing surfaces of the ceramic waveguide filters.

[0088] As described above, the shape of the support plate portion 142a is approximately the same as the shape of the opposite surface of the ceramic waveguide filter, except that the shapes of the cut-out portion 146a on one side and the cut-out portion 146b on the other side are removed.

[0089] Furthermore, the edge support end 144 is formed along the outer edge end of the support plate portion 142a, and can be bent vertically toward the ceramic waveguide filter at the outer edge end of the support plate portion 142a.

[0090] The edge support end 144 is formed in a concavo-convex shape in which concave portions 144a and convex portions 144b are repeatedly formed along the outer edge end of the support plate portion 142a. This is not only to minimize the welding joint area of the opposing surfaces of the ceramic waveguide filter through the cut portion of the concave portion 144a of the edge support end 144, but also to stably support and separate the opposing surfaces of the ceramic waveguide filter through the protruding portion of the convex portion 144b of the edge support end 144.

[0091] On the other hand, at least one inner support end 145 is formed by cutting a part of the support plate portion 142a into a "C" shape. The at least one inner support end 145 may include: a first bending portion 145a, which is bent from a portion connected to the support plate portion 142a toward the direction where a plurality of radio frequency filters 120 (i.e., ceramic waveguide filters) are provided; and a second bending portion 145b, which is bent from the end of the first bending portion 145a in a manner parallel to the opposing surfaces of the plurality of radio frequency filters 120 (i.e., ceramic waveguide filters).

[0092] The first bending portion 145a can function to separate the ceramic waveguide filter from one surface of the support plate portion 142a (or one surface of the main board 110) by a predetermined distance, and the second bending portion 145b can function to support the opposing surfaces of the ceramic waveguide filter separated by the first bending portion 145a.

[0093] As described above, the edge support end 144 of the filter body support portion 142 can be used to uniformly support the edge portions of the opposing surfaces of the ceramic waveguide filter, and the inner support end 145 of the filter body support portion 142 can be used to uniformly support the interior of the opposing surfaces of the ceramic waveguide filter that is not supported by the edge support end 144 at multiple positions.

[0094] On the other hand, similar to the edge support end 144 of the filter body support portion 142, the filter port support portion 143 can be formed in a shape in which concave portions 144a and convex portions 144b are repeatedly formed.

[0095] Among them, preferably, the ends of the edge support end 144 and the inner support end 145 of the filter body support portion 142 and the end of the filter port support portion 143 are formed to have the same height from one surface of the main board 110 (or one surface of the support plate). This is to make the height of the ceramic waveguide filter supported and separated by the filter body support portion 142 and the filter port support portion 143 uniform.

[0096] Solder paste (not shown) of a specified thickness can be applied to the ends of the filter body support portion 142 and the filter port support portion 143, and welding can be achieved at the contact position where it contacts the opposing surfaces of the ceramic waveguide filter.

[0097] That is, the solder paste is an element that combines the filter support component 140 and the ceramic waveguide filter by welding them together. It is not applied to all areas of the filter body support portion 142 and the filter port support portion 143, but can be applied only to the edge support end 144 and the end of the inner support end 145 of the filter body support portion 142 and the end of the filter port support portion 143 in the manner described above.

[0098] This has the advantage that the soldering area can be minimized compared to applying solder paste to all areas of the filter support component 140. Furthermore, the thickness of the solder paste can be reduced by minimizing the amount of solder applied. As described above, by minimizing the soldering area and reducing the thickness of the solder paste, the following advantages are achieved: even with a large difference in the coefficients of thermal expansion between the filter support component 140 and the ceramic waveguide filter, the likelihood and amount of solder paste cracking are significantly reduced.

[0099] More specifically, the solder paste is formed in the form of the support plate portion 142a of the filter body support portion 142 in the structure of the filter support member 140, and can be applied in spots at the end of the edge support end 144 in the structure of the filter body support portion 142, or applied only to one side of the end of the inner support end 145 (i.e., the second curved portion 145b) in the structure of the filter body support portion 142. Furthermore, solder paste can be applied in spots at the end of the filter port support portion 143 in the structure of the filter support member 140.

[0100] As described above, compared with the existing soldering area of ​​the RF filter 120 formed on one side of the motherboard 110, the soldering area for applying solder paste can be minimized. This can prevent problems caused by solder paste cracking in advance. The effect is that the stress generated by thermal expansion between the RF filter 120 and the motherboard 110 due to the expansion of the filter support member 140 formed of metal material during thermal expansion can be alleviated.

[0101] The antenna radio frequency filter assembly of the present invention has been described in detail above with reference to the accompanying drawings. However, the embodiments of the present invention are not limited to the one described above, and various modifications and equivalent implementations can be made by those skilled in the art. Furthermore, the true scope of protection of the present invention should be defined according to the claims.

[0102] Industrial availability

[0103] The present invention provides an antenna radio frequency filter assembly that reduces the amount of soldering between the motherboard and multiple radio frequency filters, prevents short circuits by separating multiple radio frequency filters from one side of the motherboard by a specified distance, and improves product reliability by achieving uniform and precise device arrangement of multiple radio frequency filters on one side of the motherboard.

Claims

1. An RF filter assembly for an antenna, characterized by, Comprising: A plurality of radio frequency filters disposed on one side of a main board; the radio frequency filters perform filtering through adjacent coupling or cross-coupling of electrical signals flowing through an input port or an output port; And A filter support member disposed between the main board and the plurality of radio frequency filters, formed of a metal material, and separating the plurality of radio frequency filters from one side of the main board; Wherein, the filter support member includes: A filter body support portion formed to correspond to the shape of the end portion of each of the plurality of radio frequency filters close to the main board side in the outer shape thereof, except for a part thereof; and A filter port support portion disposed inside the filter body support portion and separated from the filter body support portion, and separately separating and supporting the input / output port portions of the power supply signals for the plurality of radio frequency filters with respect to the main board; Moreover, wherein the filter body support portion and the filter port support portion separately separate the plurality of radio frequency filters at the same height.

2. The RF filter assembly for antennas according to claim 1, characterized in that, In the filter body support portion, the filter port support portion is disposed inside the filter body support portion corresponding to the removed part.

3. The RF filter assembly for antennas according to claim 1, characterized in that, The filter body support portion includes a first cut groove portion and a second cut groove portion cut from one side edge end portion and the other side edge end portion to the portion where the filter port support portion is disposed.

4. The RF filter assembly for antennas according to claim 3, characterized in that, The filter body support portion includes: A support plate portion attached to one side of the main board in a surface contact manner; Edge support ends bent toward the plurality of radio frequency filters at the edge end portions of the support plate portion; and At least one inner support end formed by bending a part of the support plate portion corresponding to the inner side of the edge support ends, and separately supporting the opposing surfaces of the plurality of radio frequency filters.

5. The RF filter assembly for antennas according to claim 4, characterized in that, The outer shape formed by the support plate portion is the same as the shape obtained by removing the first cut groove portion and the second cut groove portion from the outer shape of the opposing surface of the radio frequency filter.

6. The RF filter assembly for antennas according to claim 4, characterized in that, The edge support ends are formed in a shape in which recesses and protrusions are repeatedly formed along the edge end portions.

7. The radio frequency filter assembly for an antenna according to claim 4, wherein The at least one inner support end is formed by cutting a part of the support plate portion into a "C" shape, The at least one inner support end includes: A first bending portion bent from a portion connected to the support plate portion toward the direction where the plurality of radio frequency filters are disposed; and A second bending portion bent in a direction parallel to the opposing surfaces of the plurality of radio frequency filters from the end portion of the first bending portion.

8. The radio frequency filter assembly for an antenna according to claim 1, wherein The plurality of radio frequency filters are constituted by ceramic waveguide filters, The filter port support portion is disposed at a position corresponding to an input port hole and an output port hole, the input port hole is connected to an input port of the ceramic waveguide filter, and the output port hole is connected to an output port of the ceramic waveguide filter.

9. The radio frequency filter assembly for an antenna according to claim 1, wherein The plurality of radio frequency filters are composed of ceramic waveguide filters, The filter body support portion and the filter port support portion are welded together at a contact position.

10. The RF filter assembly for antennas according to claim 1, characterized in that, The filter support member is composed of a metal material different from the material of the plurality of radio frequency filters and the material of the main board, and includes one of steel and pure copper.

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