Structures and structures with electronic components

Abstract

A structure (201) is provided with: a main substrate (1) having a first surface (1a) and a second surface (1b) on the opposite side from the first surface (1a); a power supply module (3) provided to the main substrate (1); a socket (4) provided to the main substrate (1); and one or more power supply wiring (8) and one or more signal wiring (9) extending in the thickness direction of the main substrate (1) and penetrating the socket (4). The one or more power supply wiring (8) each has a first end (71) on the first surface (1a) side and a second end (72) on the opposite side from the first end (71). The one or more signal wiring (8) each has a third end (73) for electrical connection with an electronic component and a fourth end (74) on the opposite side from the third end (73), the fourth end (74) being electrically connected with a conductor pattern provided to the first surface (1a).

Description

TECHNICAL FIELD

[0001] The present application relates to a structure and a structure with an electronic component. BACKGROUND

[0002] In a case where an electronic component is mounted on a substrate, how to supply power to the electronic component becomes a problem. In Japanese Patent Application Publication No. 2016-134543 (Patent Literature 1), a "semiconductor device" provided with a semiconductor module and a circuit substrate is disclosed. The semiconductor module is connected to the circuit substrate. A semiconductor element is arranged inside the semiconductor module. A power supply wiring is arranged on a surface of the circuit substrate. An external connection terminal is drawn from the semiconductor element, and the external connection terminal is connected to the power supply wiring.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT LITERATURE

[0005] Patent Literature 1: Japanese Patent Application Publication No. 2016-134543 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] In the structure of Patent Literature 1, a loss of electric energy in the power supply wiring becomes a problem. In order to suppress the loss to be small, it is considered to increase the width of the power supply wiring. However, since a part of the surface of the circuit substrate becomes a state where it cannot be used for mounting components due to the arrangement of the power supply wiring, if the width of the power supply wiring is increased, the area of the power supply wiring on the surface of the substrate becomes larger, and the area of the surface of the substrate that can be used for mounting components further decreases.

[0008] Therefore, an object of the present application is to provide a structure and a structure with an electronic component in which a loss of electric energy in a power supply wiring is suppressed and a mountable area of a substrate surface is ensured to be large.

[0009] MEANS FOR SOLVING THE PROBLEM

[0010] In order to achieve the above object, a structure of the present application is provided with: a main substrate having a first surface and a second surface on the opposite side from the first surface; a power supply module provided to the main substrate; a socket provided to the main substrate; and one or more power supply wirings and one or more signal wirings extending in a thickness direction of the main substrate and penetrating the socket. The one or more power supply wirings each have a first end on the first surface side and a second end on the opposite side from the first end. The one or more signal wirings each have a third end for electrically connecting to an electronic component and a fourth end on the opposite side from the third end. The fourth end is electrically connected to a conductor pattern provided to the first surface.

[0011] EFFECT OF THE INVENTION

[0012] According to the present application, one or more power supply wirings and one or more signal wirings are arranged to penetrate the socket in the thickness direction of the main substrate, and are appropriately connected, respectively, so that a structure body capable of suppressing the loss of electric power in the power supply wirings and ensuring a large mountable area on the surface of the substrate can be achieved. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 is a cross-sectional view of the structure body with electronic components in Embodiment 1 of the present application.

[0014] Figure 2 is a cross-sectional view of the structure body in Embodiment 1 of the present application.

[0015] Figure 3 is a plan view of the socket provided in the structure body in Embodiment 1 of the present application.

[0016] Figure 4 is a cross-sectional view of the structure body with electronic components in Embodiment 2 of the present application.

[0017] Figure 5 is a cross-sectional view of the structure body in Embodiment 2 of the present application.

[0018] Figure 6 is a cross-sectional view of the structure body with electronic components in Embodiment 3 of the present application.

[0019] Figure 7 is a side view of the power supply wiring provided in the structure body in Embodiment 3 of the present application.

[0020] Figure 8 is a view of a part of the power supply wiring provided in the structure body in Embodiment 3 of the present application, from which the internal structure can be observed.

[0021] Figure 9 is an example of the first shape of the first end of the power supply wiring.

[0022] Figure 10 is an example of the second shape of the first end of the power supply wiring.

[0023] Figure 11 is an example of the third shape of the first end of the power supply wiring.

[0024] Figure 12 is an example of the fourth shape of the first end of the power supply wiring.

[0025] Figure 13 is an example of the fifth shape of the first end of the power supply wiring.

[0026] Figure 14is an example of the sixth shape of the first end of the power supply wiring.

[0027] Figure 15 is an example of the seventh shape of the first end of the power supply wiring.

[0028] Figure 16 is an example of the eighth shape of the first end of the power supply wiring.

[0029] Figure 17 is a first side view of the front end of the wiring of the first example.

[0030] Figure 18 is a second side view of the front end of the wiring of the first example.

[0031] Figure 19 is a first side view of the front end of the wiring of the second example.

[0032] Figure 20 is a second side view of the front end of the wiring of the second example.

[0033] Figure 21 is a partial enlarged sectional view of the structure in Embodiment 4 of the present application.

[0034] Figure 22 is a partial enlarged sectional view of the structure in Embodiment 5 of the present application.

[0035] Figure 23 is a partial plan view of the structure in Embodiment 5 of the present application.

[0036] Figure 24 is a partial enlarged perspective view of the structure in Embodiment 6 of the present application.

[0037] Figure 25 is a plan view of a socket which can be used for the structure of the present application. DETAILED DESCRIPTION

[0038] The dimensional ratios shown in the drawings do not necessarily represent actual situations, and the dimensional ratios are sometimes exaggerated for the sake of convenience in explanation. In the following description, when the concepts of upper and lower are mentioned, they do not necessarily mean absolute upper and lower, but sometimes mean relative upper and lower in the illustrated posture.

[0039] (Embodiment 1)

[0040] Reference Signs List Figures 1-3 The structure in Embodiment 1 of the present application and the structure with an electronic component will be described. Figure 1A cross-sectional view of the electronic component-equipped structure 501 is shown. The electronic component-equipped structure 501 includes an electronic component 5 and a pressing tool 6. The electronic component 5 is, for example, a so-called XPU. That is, the electronic component 5 can also be, for example, a central processing unit (CPU) or a graphics processing unit (GPU). The pressing tool 6 is used to fix the electronic component 5 to the main substrate 1 in a state in which the electronic component 5 is pressed downward. The pressing tool 6 has, for example, a switching lever (not shown) that can be switched between a state in which the electronic component 5 is pressed downward and a state in which the pressing of the electronic component 5 is released by operating the switching lever.

[0041] Figure 2 A case in which the electronic component 5 and the pressing tool 6 are removed from the electronic component-equipped structure 501 is shown. Figure 2 The object shown is the structure 201. The electronic component 5 was pressed by the pressing tool 6 on the upper surface of the structure 201. The structure of the structure 201 is described below.

[0042] The structure 201 has the main substrate 1 having a first surface la and a second surface lb on the opposite side from the first surface la, the power supply module 3 provided to the main substrate 1, and the socket 4 provided to the main substrate 1. As the main substrate 1, for example, a glass composite substrate, a glass epoxy substrate, a glass polyimide substrate, or the like can be used. As the material of the socket 4, an insulating resin can be used. The structure 201 has one or more power supply wires 8 and one or more signal wires 9 that extend in the thickness direction of the main substrate 1 and pass through the socket 4. The one or more power supply wires 8 each have a first end 71 on the first surface la side and a second end 72 on the opposite side from the first end. The first end 71 is electrically connected to the electronic component 5. The second end 72 is electrically connected to the power supply module 3. The one or more signal wires 9 each have a third end 73 for electrical connection to the electronic component 5 and a fourth end 74 on the opposite side from the third end 73. The fourth end 74 is electrically connected to a conductor pattern provided to the first surface la. The fourth end 74 can be connected to the first surface la via a solder bump. In the structure 201, the length of a first power supply wire included in the one or more power supply wires 8 is different from the length of a first signal wire included in the one or more signal wires 9. In the structure 201, the power supply wire 8 is longer than the signal wire 9.

[0043] Figure 3 A case in which the upper surface of the socket 4 is shown. The plurality of power supply wires 8 are arranged in the center. The plurality of signal wires 9 are arranged around the plurality of power supply wires 8 so as to surround the plurality of power supply wires 8. The diameter of the power supply wire 8 is larger than the diameter of the signal wire 9. That is, the power supply wire 8 is thicker than the signal wire 9.

[0044] Note that a component other than that illustrated here can also be arranged on the first surface la of the main substrate 1. The same applies to the second surface lb of the main substrate 1. As the other component, for example, a memory element can also be arranged.

[0045] In the present embodiment, the electronic component 5 and the power module 3 are electrically connected using one or more power supply lines 8 and one or more signal lines 9 arranged to pass through the socket 4 in the thickness direction of the main substrate 1, and thus it is not necessary to lead the power supply line in the surface direction of the main substrate 1. Therefore, the electrical connection between the electronic component 5 and the power module 3 can be made in a very small area. As a result, it is possible to suppress a reduction in the mountable area of the substrate surface.

[0046] Since one or more power supply lines 8 and one or more signal lines 9 are arranged to pass through the socket 4 in the thickness direction of the main substrate 1, it is possible to use a columnar conductive pattern instead of a thin film-like conductive pattern. In particular, in the power supply line 8 in which a large current is required to flow, it is possible to use a large diameter conductive column as needed, and thus it is possible to reduce the resistance of the power supply line 8. Therefore, it is possible to reduce the loss of electric power in the supply of electric power to the electronic component 5.

[0047] Thus, it is possible to realize a structure in which the loss of electric power in the power supply line is suppressed and the mountable area of the substrate surface is ensured to be large.

[0048] As illustrated in the present embodiment, the electronic component-equipped structure 501 includes the structure 201 and the electronic component 5, and the first end 71 and the third end 73 are electrically connected to the electronic component 5. Since the electronic component-equipped structure 501 includes the structure 201 having the structure described in the present embodiment, it is possible to realize an electronic component-equipped structure in which the loss of electric power in the power supply line is suppressed and the mountable area of the substrate surface is ensured to be large. Here, an example in which the structure 201 is included is illustrated, but with respect to the electronic component-equipped structure, a structure having another structure described in the present specification can be included instead of the structure 201.

[0049] In the present embodiment, as a preferable example of the structure, an example in which a double-sided mounting structure is adopted is illustrated (refer to FIG. 1). Figure 2). That is, in the present embodiment, it is preferable that the power module 3 be disposed on the second face lb in the structure 201. The power module 3 is fixed to the second face lb by a screw 34. The main substrate 1 has a through-hole lc that links the first face la and the second face lb. The socket 4 is disposed on the first face la. The socket 4 has a main body portion 41 disposed along the first face la, and a protruding portion 42 that is inserted into the through-hole lc, the protruding portion 42 being a portion protruding from the main body portion 41. The one or more power wirings 8 pass through the protruding portion 42. The length of the first power wiring included in the one or more power wirings 8 is longer than the length of the first signal wiring included in the one or more signal wirings 9.

[0050] By adopting this structure, the power module 3 is disposed on the second face lb side, rather than on the first face la side on which the electronic components 5 and the pressing tool 6 are disposed, and thus, the power module 3 can be efficiently disposed on the main substrate 1 of a limited area. In particular, in the case where the size of the power module 3 is large, by disposing the power module 3 on the second face lb side, the mountable area on the first face la side can be made to have a margin, and thus, this is preferable.

[0051] As shown in the present embodiment, the one or more power wirings 8 are preferably thicker than the one or more signal wirings 9. By adopting this structure, the resistance of the power wiring 8 can be reduced. Generally, a large current is required to flow through the power wiring 8, and thus, it is appropriate to thicken the power wiring 8 in order to flow a large current. Generally, a large current is not required to flow through the signal wiring 9, and thus, the signal wiring 9 can be thin.

[0052] As shown in the present embodiment with reference to FIG. 2, Figure 3 When the socket 4 is viewed from a direction perpendicular to the first face la, it is preferable that the signal wiring 9 be disposed so as to surround the power wiring 8. The power wiring 8 extends in the thickness direction and toward the power module 3, and on the other hand, the signal wiring 9 is directed toward various wirings and components disposed on the main substrate 1. When the signal wiring 9 is disposed so as to surround the power wiring 8 like this, the signal wiring 9 is not hindered by the presence of the power wiring 8, and is easily drawn out in whichever direction toward the outside, and thus, this is preferable.

[0053] As shown in the present embodiment with reference to FIG. 2, Figure 1 and Figure 2 It is preferable that the first end 71 and the third end 73 be located in the same plane. By adopting this structure, it is easy to cause the one or more power wirings 8 and the one or more signal wirings 9 to simultaneously abut against the flat face of the electronic component 5. The terminal of the electronic component 5 is disposed on this flat face.

[0054] (Embodiment 2)

[0055] With reference to FIG. 3, Figures 4-5The configuration and the configuration with electronic parts in Embodiment 2 of the present application are described. Figure 4 A cross-sectional view of the configuration with electronic parts 502 is shown. The configuration with electronic parts 502 includes the electronic parts 5 and the pressing tool 6. The basic configuration of the electronic parts 5 and the pressing tool 6 is the same as the basic configuration described in Embodiment 1.

[0056] Figure 5 A case where the electronic parts 5 and the pressing tool 6 are removed from the configuration with electronic parts 502 is shown. Figure 5 The object shown is the configuration 202. The electronic parts 5 have been pressed by the pressing tool 6 on the upper surface of the configuration 202. The structure of the configuration 202 is described below.

[0057] The basic configuration of the configuration 202 is the same as the basic configuration described in Embodiment 1 for the configuration 201. However, the configuration 201 is a double-sided mounting configuration, and in contrast, the configuration 202 is a single-sided mounting configuration.

[0058] In the configuration 202, the socket 4 has a power module receiving portion 4e for receiving the power module 3. The power module 3 is disposed in the power module receiving portion 4e. The second end 72 is connected to the power module 3 inside the power module receiving portion 4e. In the example shown here, the power module receiving portion 4e is a recess provided on the lower surface of the socket 4. The socket 4 becomes a housing, and the power module 3 is completely housed inside the socket 4. That is, the power module 3 is disposed so as not to protrude from the lower surface of the socket 4. In the configuration 202 of the present embodiment, the signal wiring 9 is longer than the power wiring 8. The power module 3 can also be electrically connected to the first surface la of the main substrate 1.

[0059] In the present embodiment, both the electronic parts 5 and the power module 3 can be disposed on one side of the main substrate 1. The distance between the power module 3 and the electronic parts 5 can be shortened, and thus the power wiring 8 can be shortened. By shortening the power wiring 8, the loss of electric power can be further suppressed.

[0060] (Embodiment 3)

[0061] Reference Figures 6-8 The configuration and the configuration with electronic parts in Embodiment 3 of the present application are described. The basic configuration of the configuration and the configuration with electronic parts is the same as the basic configuration described so far.

[0062] Figure 6A cross-sectional view of the structure 503 with electronic components in this embodiment is shown. In the structure 503 with electronic components, at least one of the first end 71, the second end 72, the third end 73 and the fourth end 74 has an elastic structure that elastically deforms and resists the external force when pressed along the thickness direction of the main substrate 1 by an external force. Figure 7 This illustrates the case where the power supply cable 8 is removed separately for independent use. Figure 8 The diagram shows the internal structure visible within a portion of the power supply wiring 8. In the structure 503 with electronic components, the power supply wiring 8 has a spring 12 disposed inside the cylindrical member 11. The first end 71 and the second end 72 can retract due to the elastic deformation of the spring 12 when subjected to external force. On the other hand, no elastic structure is provided in the signal wiring 9.

[0063] like Figure 6 As shown, a recess corresponding to the electronic component 5 can also be provided on the upper surface of the socket 4. Figure 6 In this example, the electronic component 5 is not housed in the recess but is positioned slightly raised, but this is just one example. Part or all of the electronic component 5 may also be housed in the recess provided in the socket 4.

[0064] As in the structure 503 with electronic components in this embodiment, by having an elastic structure, the end of the wiring is pressed by the opposing member, so that the electrical connection between the socket 4 and the electronic component 5, or the electrical connection between the socket 4 and the power module 3 can be reliably made.

[0065] It should be noted that the structure 503 with electronic components is described here, while the structure in this embodiment is the one from which the electronic component 5 and the pressing tool 6 have been removed.

[0066] It should be noted that the construction of the first end 71 of the power supply wiring 8 is as follows: Figures 9-16 As shown, various constructions are considered. Figure 9 In the example shown, the front end simply becomes a flat surface. Figure 10 In the example shown, a large-diameter section is provided at the front end, making the front end a flat surface. Figure 11 In the example shown, the front end becomes pointed. In the example shown here, the front end becomes conical. Alternatively, a pyramidal shape could be used instead of a conical shape. Figure 12 In the example shown, a larger diameter portion is provided at the front end, making this front end surface a concave-convex surface. Figure 13 In the example shown, the front end is a concave portion. The shape of this concave portion could also be conical, as illustrated here. The shape of the concave portion could also be other shapes. Figure 14In the example shown, the front end becomes a semispherical surface. In Figure 15 In the example shown, a portion with a large diameter is provided at the front end, which becomes a semispherical surface. In Figure 16 In the example shown, a portion with a large diameter is provided at the front end, which becomes pointed. In the example shown here, the front end becomes conical.

[0067] It is conceivable that such a configuration change also applies to the second end 72 of the power supply wiring 8. Furthermore, such a configuration change also applies to the third end 73 of the signal wiring 9. Such a configuration change also applies to the fourth end 74 of the signal wiring 9.

[0068] It is also possible to provide the elastic configuration as described above to both the power supply wiring 8 and the signal wiring 9, but in reality, taking into account manufacturing costs, wiring diameters, and the like, it is also possible to provide the elastic configuration only to the wiring that is needed.

[0069] Here, the example in which the spring 12 is built into the inside of the cylindrical member 11 is described, but the "elastic configuration that elastically deforms when pressed in the thickness direction of the main substrate 1 by an external force and resists the external force" is not limited to using a coil spring.

[0070] For example, as a first example, it is also possible to provide the front end of the wiring with the configuration shown in Figure 17 and Figure 18 the configuration shown. Figure 17 A case in which a portion of the wiring protrudes from the surface of the socket 4 is shown. Figure 18 is a case in which the same configuration as that shown in Figure 17 is observed from a direction that differs by 90° from Figure 17 the configuration shown. The end portion of the wiring becomes a thin plate and becomes a shape that is curved to some extent. That is, the end portion of the wiring becomes a leaf spring.

[0071] In addition, as a second example, for example, it is also possible to provide the front end of the wiring with the configuration shown in Figure 19 and Figure 20 the configuration shown. Figure 19 A case in which a portion of the wiring protrudes from the surface of the socket 4 is shown. Figure 20 A case in which the same configuration as that shown in Figure 19 is observed from a direction that differs by 90° from Figure 19 the configuration shown. The end portion of the wiring becomes a configuration in which two thin plates are combined. Both of the two thin plates are leaf springs. The two thin plates are in a Y shape. In the case in which the end portion of the wiring becomes a Y shape like this, it is also possible to establish electrical connection by sandwiching the end portion that becomes the terminal of the counterpart with the Y shape.

[0072] (Embodiment 4)

[0073] Referring to Figure 21The configuration of the configuration body and the configuration body with an electronic component in Embodiment 4 of the present application will be described. The basic structure of the configuration body and the configuration body with an electronic component is the same as the basic structure described so far.

[0074] Figure 21 A case where a part of the configuration body in the present embodiment is enlarged is shown. The power supply wiring 8 and the signal wiring 9 are configured to penetrate the socket 4. The power supply wiring 8 has a portion where the diameter is increased, i.e., a protruding portion 8a, in the middle. The signal wiring 9 has a portion where the diameter is increased, i.e., a protruding portion 9a, in the middle. The socket 4 has a hollow portion so as to enclose the protruding portions 8a, 9a. By enclosing the protruding portions 8a, 9a in the hollow portion, the power supply wiring 8 and the signal wiring 9 are held so as not to fall out of the socket 4. The socket 4 having such a hollow portion can be manufactured, for example, by resin molding in two stages. That is, first, molding to half of the socket 4, at this time, the hollow portion is formed in advance as a recess, the wiring having the protruding portion is disposed in the recess, and then the remaining half of the socket 4 is molded.

[0075] The configuration body in the present embodiment is the same as the configuration described in the embodiments so far except for the other parts, and thus the description will not be repeated. In addition, the configuration body obtained by adding the electronic component 5 and the pressing tool 6 to the configuration body in the present embodiment is the configuration body with an electronic component in the present embodiment.

[0076] In the configuration body in the present embodiment, the power supply wiring 8 and the signal wiring 9 configured to penetrate the socket 4 have the protruding portions 8a, 9a in the middle, and thus the power supply wiring 8 and the signal wiring 9 are stably disposed without falling out of the socket 4.

[0077] (Embodiment 5)

[0078] Reference Figure 22 The configuration of the configuration body and the configuration body with an electronic component in Embodiment 5 of the present application will be described. The basic structure of the configuration body and the configuration body with an electronic component is the same as the basic structure described in Embodiment 4. Figure 22 A case where a part of the configuration body in the present embodiment is enlarged is shown.

[0079] In the configuration body in the present embodiment, the socket 4 has a chip component receiving portion 13 for receiving a chip component. The chip component receiving portion 13 is a recess. A capacitor 14 is disposed inside the chip component receiving portion 13 as the chip component. The chip component is electrically connected to the power supply wiring 8. Figure 23 A case where a part of the configuration body in the present embodiment is enlarged is shown. Figure 22The capacitor 14 and its vicinity in the case where the structure is viewed from directly above are shown. The capacitor 14 arranged in the chip component receiving portion 13 can be observed. A part of the extension portion 8a can also be observed inside the chip component receiving portion 13. The chip component is electrically connected to the power supply wiring 8 by being arranged so as to overlap the extension portion 8a.

[0080] The structure in the present embodiment is the same as the structure described in the embodiments so far in other parts, and thus the description will not be repeated. The structure obtained by adding the electronic component 5 and the pressing tool 6 to the structure in the present embodiment is the electronic component-equipped structure in the present embodiment.

[0081] In the present embodiment, the chip component is arranged inside the chip component receiving portion 13 provided in the socket 4, and thus the necessary chip component can be arranged. Here, the case where the chip component receiving portion 13 is a recess is described, but the chip component receiving portion 13 is not limited to a recess, and can be a cutout.

[0082] As shown in the present embodiment, the chip component arranged inside the chip component receiving portion 13 is preferably a capacitor 14. The capacitor 14 as the chip component has external electrodes at both ends. It is preferable that one external electrode of the capacitor 14 is connected to one power supply wiring 8 and the other external electrode is connected to the other power supply wiring 8. They can be connected by soldering. However, the two power supply wirings are a pair of power supply wirings that supply power to one electronic component 5. That is, one of the two is a GND wiring. By adopting this structure, the capacitor 14 functions as a bypass capacitor, and contributes to removal of noise from the power supplied to the electronic component 5.

[0083] (Embodiment 6)

[0084] Reference Figure 24 The structure and the electronic component-equipped structure in Embodiment 6 of the present application will be described. The basic structure of the structure and the electronic component-equipped structure is the same as the basic structure described in Embodiment 4. Figure 24 A case where a part of the structure in the present embodiment is enlarged is shown. In this figure, the power supply wiring 8 and the signal wiring 9 are shown assuming that the socket 4 is transparent and invisible for convenience of description. Thus, the wirings that are originally mostly hidden by the socket 4 are shown as being arranged bare. Figure 24

[0085] In the present embodiment, the one or more power supply wirings 8 include one or more GND wirings 8d that are grounded and one or more non-GND wirings 8e that are not grounded, and the one or more GND wirings 8d are arranged between the one or more non-GND wirings 8e and the one or more signal wirings 9. ​

[0086] As the structure in this embodiment, the other parts are the same as those described in the embodiments up to this point, and therefore will not be described again. In addition, the structure obtained by adding electronic component 5 and pressing tool 6 to the structure in this embodiment is the structure with electronic component in this embodiment.

[0087] In this embodiment, one or more GND wirings 8d are arranged between one or more non-GND wirings 8e and one or more signal wirings 9. Therefore, the arrangement of one or more GND wirings 8d plays a shielding role and can suppress electromagnetic waves emitted from one or more non-GND wirings 8e from being transmitted as noise to the signal wirings 9.

[0088] It should be noted that, in Figure 24 In the example shown, multiple non-GND wirings 8e are arranged in a 4×4 square at the center, and the GND wirings 8d are arranged along two parallel sides of the square formed by the arrangement of the non-GND wirings 8e. However, this is just one example. Instead of being arranged along two sides of the arrangement of the non-GND wirings 8e, the GND wirings 8d can also be arranged along one side or along three sides. The arrangement of the GND wirings 8d can also be arranged to encircle the entire perimeter of the arrangement of the non-GND wirings 8e. Figure 24 The number of wires and the shape of their arrangement shown are for illustrative purposes only and are not limited thereto.

[0089] It should be noted that in the above embodiments, the power supply wiring 8 and signal wiring 9 are shown in a cylindrical shape, but the cross-sectional shape of these wirings is not limited to a circle. For example, Figure 25 As shown, some or all of the arranged wiring can also be in shapes other than circles. Figure 25 In the top view, only a portion of the socket 4 is shown. In this example, the cross-sectional shape of the power wiring 8 is rectangular. Three power wirings 8 are arranged in the center, surrounded by a series of signal wirings 9. Such a structure is also possible.

[0090] It should be noted that multiple implementation methods described above can also be appropriately combined and used.

[0091] It should be noted that the embodiments disclosed herein are illustrative in all respects and are not restrictive. The scope of the invention is defined by the claims, including all modifications within the same meaning and scope as the claims.

[0092] Explanation of reference numerals in the attached figures

[0093] 1 main substrate, 1a first surface, 1b second surface, 1c through-hole, 3 power module, 4 socket, 4e power module receiving portion, 5 electronic component, 6 pressing tool, 7 (for power module) socket, 8 power wiring, 8a extension portion, 8d GND wiring, 8e non-GND wiring, 9 signal wiring, 9a extension portion, 11 cylindrical member, 12 spring, 13 sheet component receiving portion, 14 capacitor, 30 (of power module) substrate, 31, 32, 33 component, 34 screw, 41 main body portion, 42 protruding portion, 71 first end, 72 second end, 73 third end, 74 fourth end, 201, 202 configuration, 501, 502, 503 configuration with electronic component

Claims

1. A structure for electrically connecting to electronic components, comprising: A main substrate having a first side and a second side facing the opposite side to the first side; A power module is disposed on the main base plate; A socket is disposed on the main substrate; as well as One or more power lines and one or more signal lines extend along the thickness direction of the main substrate and penetrate the socket. The one or more power supply wires each have a first end on the first side and a second end on the opposite side of the first end. The one or more signal wirings each have a third terminal for electrical connection with electronic components and a fourth terminal opposite to the third terminal. The fourth end is electrically connected to the conductor pattern disposed on the first surface. The main substrate has a through hole connecting the first surface and the second surface. The power module is located on the second side. The socket is disposed on the first surface and has a main body portion disposed along the first surface and a protrusion portion that is inserted into the through hole, the protrusion portion being a portion protruding from the main body portion. One or more power cables pass through the protrusion. The length of the first power supply wire included in the more than one power supply wiring is longer than the length of the first signal wire included in the more than one signal wiring.

2. A structure for electrically connecting to electronic components, comprising: A main substrate having a first side and a second side facing the opposite side to the first side; A power module is disposed on the main base plate; A socket is disposed on the main substrate; as well as One or more power lines and one or more signal lines extend along the thickness direction of the main substrate and penetrate the socket. The one or more power supply wires each have a first end on the first side and a second end on the opposite side of the first end. The one or more signal wirings each have a third terminal for electrical connection with electronic components and a fourth terminal opposite to the third terminal. The fourth end is electrically connected to the conductor pattern disposed on the first surface. The socket has a power module receiving section for receiving the power module. The power module is configured in the power module receiving section. The second end is connected to the power module inside the power module receiving part.

3. The structure according to claim 1 or 2, wherein, The length of the first power supply wire included in the one or more power supply wires is different from the length of the first signal wire included in the one or more signal wires.

4. The structure according to claim 1 or 2, wherein, The power supply wiring is thicker than the signal wiring.

5. The structure according to claim 1 or 2, wherein, When the socket is viewed from a direction perpendicular to the first surface, the one or more signal wirings are configured to surround the one or more power wirings.

6. The structure according to claim 1 or 2, wherein, The socket has a plate component receiving portion for receiving a plate component, the plate component being disposed inside the plate component receiving portion, and the plate component being electrically connected to the power wiring.

7. The structure according to claim 6, wherein, The chip component is a capacitor.

8. The structure according to claim 1 or 2, wherein, At least one of the first end, the second end, the third end, and the fourth end has an elastic structure that elastically deforms and resists the external force when pressed along the thickness direction of the main substrate by an external force.

9. The structure according to claim 1 or 2, wherein, The one or more power supply lines include one or more grounded GND lines and one or more non-GND lines that are not grounded, with the one or more GND lines disposed between the one or more non-GND lines and the one or more signal lines.

10. The structure according to claim 1 or 2, wherein, The first end and the third end are located in the same plane.

11. A structure with electronic components, wherein, The structure with electronic components comprises the structure according to any one of claims 1 to 10 and the electronic components, wherein the first end and the third end are electrically connected to the electronic components.

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