Electrochromic device, rearview mirror and method for manufacturing electrochromic device

Abstract

The application belongs to the technical field of electrochromic technology, and provides an electrochromic device, a rearview mirror and a preparation method of the electrochromic device. The preparation method of the electrochromic device comprises the following steps: providing a first conductive substrate layer and a second conductive substrate layer; arranging an electrochromic diaphragm between the first conductive substrate layer and the second conductive substrate layer; arranging a first adhesive layer on the first conductive substrate layer and a second adhesive layer on the second conductive substrate layer; arranging a first groove on the first adhesive layer and a first rigid support structure in the first groove, and / or arranging a second groove on the second adhesive layer; arranging a second rigid support structure in the second groove; and binding a first lead-out electrode to a first binding part and binding a second lead-out electrode to a second binding part. The preparation method of the electrochromic device provided by the application can reduce the risk of disconnection of the electrochromic device.

Description

Technical Field

[0001] This application relates to the field of electrochromic technology, specifically to an electrochromic device, a rearview mirror, and a method for preparing the electrochromic device. Background Technology

[0002] Please see Figure 1 An electrochromic device 100 typically includes an electrochromic film 110 and two conductive substrate layers 120. The electrochromic film 110 is disposed between the two conductive substrate layers 120. After the two conductive substrate layers 120 are respectively connected to the positive and negative terminals of a power supply, a potential difference can be formed on both sides of the electrochromic film 110, causing the light transmittance of the electrochromic film 110 to change.

[0003] Based on the relevant technology known to the inventor, adhesive layers such as optically clear adhesive (OCA) 130 are typically used to bond the two conductive substrate layers 120 to other structures, for example, please refer to [link to relevant documentation]. Figure 1 Two conductive substrate layers 120 are bonded to a cover plate 140 and a back plate 150 respectively via an adhesive layer 130. In existing technologies, the adhesive layer 130 is typically applied to the conductive substrate layer 120 first, followed by bonding the lead electrode 160 to the bonding portion 121 of the conductive substrate layer 120 (e.g., in a flexible printed circuit board, FPC). Finally, the two conductive substrate layers 120 are bonded to other structures via the adhesive layer 130. However, in these technologies, the electrical connection between the lead electrode 160 and the bonding portion 121 of the conductive substrate layer 120 is unstable, leading to a significant risk of open circuits in the electrochromic device. Summary of the Invention

[0004] The purpose of this application is to provide an electrochromic device, a rearview mirror, and a method for fabricating an electrochromic device, in order to solve the technical problem in the prior art where the electrical connection between the lead-out electrode and the bonding portion of the conductive substrate is unstable, leading to a high risk of open circuit in the electrochromic device.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0006] In a first aspect, a method for preparing an electrochromic device is provided, the method comprising:

[0007] A first conductive substrate layer and a second conductive substrate layer are provided. The first conductive substrate layer includes a first main body portion and a first bonding portion connected to each other. The second conductive substrate layer includes a second main body portion and a second bonding portion connected to each other.

[0008] An electrochromic film is formed between the first main body portion and the second main body portion, such that both the first binding portion and the second binding portion protrude from the outer peripheral surface of the electrochromic film.

[0009] A first adhesive layer is disposed on the surface of the first conductive substrate layer away from the electrochromic film, and a second adhesive layer is disposed on the surface of the second conductive substrate layer away from the electrochromic film; a first groove is disposed on the first adhesive layer, the orthographic projection of the first groove on the first conductive substrate layer at least covers a portion of the first bonding portion, and a first rigid support structure is disposed in the first groove; and / or, a second groove is disposed on the second adhesive layer, the orthographic projection of the second groove on the second conductive substrate layer at least covers a portion of the second bonding portion, and a second rigid support structure is disposed in the second groove;

[0010] A first lead electrode is attached to the first binding part, and a second lead electrode is attached to the second binding part.

[0011] In one embodiment, a first conductive substrate layer and a second conductive substrate layer are provided. The first conductive substrate layer includes a first body portion and a first bonding portion connected together, and the second conductive substrate layer includes a second body portion and a second bonding portion connected together.

[0012] A first substrate layer is provided, and a first conductive thin film layer is disposed on the first substrate layer; the first conductive thin film layer includes a first body region and a first bonding region that are electrically connected, the first body region and the first substrate layer for carrying the first body region form a first body portion, and the first bonding region and the first substrate layer for carrying the first bonding region form a first bonding portion;

[0013] A second substrate layer is provided, and a second conductive thin film layer is disposed on the second substrate layer; the second conductive thin film layer includes a second body region and a second bonding region that are electrically connected, the second body region and the second substrate layer for carrying the second body region form a second body portion, and the second bonding region and the second substrate layer for carrying the second bonding region form a second bonding portion.

[0014] In one embodiment, a first conductive substrate layer and a second conductive substrate layer are provided. The first conductive substrate layer includes a first body portion and a first bonding portion connected together, and the second conductive substrate layer includes a second body portion and a second bonding portion connected together.

[0015] A first substrate layer is provided, and a first conductive thin film layer is disposed on the first substrate layer. The first conductive thin film layer includes a first body region and a first bonding region that are electrically connected. A first bus lead is disposed on the first body region and the first bonding region. A first insulating layer is coated on the surface of the first bus lead disposed on the first body region. The first body region, the first substrate layer for carrying the first body region, the first bus lead disposed on the first body region, and the first insulating layer form a first body portion. The first bonding region, the first substrate layer for carrying the first bonding region, and the first bus lead disposed on the first bonding region form a first bonding portion.

[0016] A second substrate layer is provided, and a second conductive thin film layer is disposed on the second substrate layer. The second conductive thin film layer includes a second body region and a second bonding region that are electrically connected. A second bus lead is disposed on the second body region and the second bonding region. A second insulating layer is coated on the surface of the second bus lead disposed on the second body region. The second body region, the second substrate layer for carrying the second body region, the second bus lead disposed on the second body region, and the second insulating layer form a second body portion. The second bonding region, the second substrate layer for carrying the second bonding region, and the second bus lead disposed on the second bonding region form a second bonding portion.

[0017] In one embodiment, forming an electrochromic film between the first main body portion and the second main body portion, such that both the first bonding portion and the second bonding portion protrude from the outer peripheral surface of the electrochromic film, includes:

[0018] An electrochromic layer is coated on the conductive side of the first conductive substrate layer, and an ion storage layer is coated on the conductive side of the second conductive substrate layer; or, an ion storage layer is coated on the conductive side of the first conductive substrate layer, and an electrochromic layer is coated on the conductive side of the second conductive substrate layer.

[0019] The electrochromic layer and the ion storage layer are arranged opposite each other with a predetermined gap. An electrolyte is dropped into the predetermined gap and the electrolyte is solidified into an electrolyte layer. The electrolyte layer, the ion storage layer, and the electrochromic layer form the electrochromic film.

[0020] The electrochromic film and the second conductive substrate layer corresponding to the position of the first bonding portion are removed by partial cutting, so that the first bonding portion protrudes from the outer peripheral surface of the electrochromic film and the outer peripheral surface of the second conductive substrate layer.

[0021] The electrochromic film and the first conductive substrate layer corresponding to the position of the second bonding portion are removed by partial cutting, so that the second bonding portion protrudes from the outer peripheral surface of the electrochromic film and the outer peripheral surface of the first conductive substrate layer.

[0022] In one embodiment, the first adhesive layer is disposed on the surface of the first conductive substrate layer away from the electrochromic film, and a second adhesive layer is disposed on the surface of the second conductive substrate layer away from the electrochromic film; a first groove is disposed on the first adhesive layer, the orthographic projection of the first groove on the first conductive substrate layer at least covers a portion of the first bonding portion, and a first rigid support structure is disposed within the first groove; and / or, a second groove is disposed on the second adhesive layer, the orthographic projection of the second groove on the second conductive substrate layer at least covers a portion of the second bonding portion, and a second rigid support structure is disposed within the second groove, comprising:

[0023] Provide a first adhesive layer and a second adhesive layer;

[0024] The first adhesive layer is bonded to the side of the first conductive substrate away from the electrochromic film, and the second adhesive layer is bonded to the side of the second conductive substrate away from the electrochromic film.

[0025] A first groove is provided on the first adhesive layer, the orthographic projection of the first groove on the first conductive substrate layer at least covers a portion of the first bonding portion, and the first groove at least penetrates the outer peripheral surface of the first adhesive layer or the surface of the first adhesive layer away from the electrochromic film, and a first rigid support structure is provided in the first groove; and / or, a second groove is provided on the second adhesive layer, the orthographic projection of the second groove on the second conductive substrate layer at least covers a portion of the second bonding portion, and the second groove at least penetrates the outer peripheral surface of the second adhesive layer or the surface of the second adhesive layer away from the electrochromic film, and a second rigid support structure is provided in the second groove.

[0026] In one embodiment, the first adhesive layer is disposed on the surface of the first conductive substrate layer away from the electrochromic film, and a second adhesive layer is disposed on the surface of the second conductive substrate layer away from the electrochromic film; a first groove is disposed on the first adhesive layer, the orthographic projection of the first groove on the first conductive substrate layer at least covers a portion of the first bonding portion, and a first rigid support structure is disposed within the first groove; and / or, a second groove is disposed on the second adhesive layer, the orthographic projection of the second groove on the second conductive substrate layer at least covers a portion of the second bonding portion, and a second rigid support structure is disposed within the second groove, comprising:

[0027] Provide a first adhesive layer and a second adhesive layer;

[0028] A first groove is formed on the first adhesive layer, the first groove penetrating at least through the outer peripheral surface or one side surface of the first adhesive layer, and the first adhesive layer is bonded to the side of the first conductive substrate away from the electrochromic film, keeping the first groove open, and ensuring that the orthographic projection of the first groove on the first conductive substrate at least covers a portion of the first bonding portion, and a first rigid support structure is formed within the first groove; and / or, a second groove is formed on the second adhesive layer, the second groove penetrating at least through the outer peripheral surface or one side surface of the second adhesive layer, and the second adhesive layer is bonded to the side of the second conductive substrate away from the electrochromic film, keeping the first groove open, and ensuring that the orthographic projection of the second groove on the second conductive substrate at least covers a portion of the second bonding portion, and a second rigid support structure is formed within the second groove.

[0029] In one embodiment, the first adhesive layer is disposed on the surface of the first conductive substrate layer away from the electrochromic film, and a second adhesive layer is disposed on the surface of the second conductive substrate layer away from the electrochromic film; a first groove is disposed on the first adhesive layer, the orthographic projection of the first groove on the first conductive substrate layer at least covers a portion of the first bonding portion, and a first rigid support structure is disposed within the first groove; and / or, a second groove is disposed on the second adhesive layer, the orthographic projection of the second groove on the second conductive substrate layer at least covers a portion of the second bonding portion, and a second rigid support structure is disposed within the second groove, comprising:

[0030] Provide a first adhesive layer and a second adhesive layer;

[0031] A first groove is provided on the first adhesive layer, and a first rigid support structure is provided in the first groove. The first adhesive layer is bonded to the side of the first conductive substrate away from the electrochromic film, and the orthogonal projection of the first groove on the first conductive substrate covers at least a portion of the first bonding portion; and / or, a second groove is provided on the second adhesive layer, and a second rigid support structure is provided in the second groove. The second adhesive layer is bonded to the side of the second conductive substrate away from the electrochromic film, and the orthogonal projection of the second groove on the second conductive substrate covers at least a portion of the second bonding portion.

[0032] In one embodiment, the method for fabricating the electrochromic device further includes:

[0033] Prepare a cover plate and a back plate. Place the cover plate on the surface of the first adhesive layer away from the first conductive substrate layer, and place the back plate on the surface of the second adhesive layer away from the second conductive substrate layer. Place a sealant layer between the cover plate and the back plate, so that the sealant layer, the cover plate, and the back plate together form a sealed cavity that can accommodate the first adhesive layer, the first conductive substrate layer, the electrochromic film, the second conductive substrate layer, and the second adhesive layer. Then, cure the sealant layer.

[0034] In one embodiment, before the cover plate is disposed on the surface of the first adhesive layer away from the first conductive substrate layer, a shielding layer is further disposed on the side of the cover plate for connection with the first adhesive layer. The shielding layer is capable of shielding the first groove and / or the second groove when the cover plate and the shielding layer are disposed together on the side of the first adhesive layer away from the first conductive substrate layer.

[0035] In one embodiment, the provision of a cover plate and a back plate involves disposing the cover plate on the surface of the first adhesive layer away from the first conductive substrate layer, and disposing the back plate on the surface of the second adhesive layer away from the second conductive substrate layer. A sealant layer is disposed between the cover plate and the back plate, such that the sealant layer, the cover plate, and the back plate together form a sealed cavity capable of accommodating the first adhesive layer, the first conductive substrate layer, the electrochromic film, the second conductive substrate layer, and the second adhesive layer. Curing the sealant layer includes:

[0036] A cover plate and a back plate are provided, wherein the orthographic projection of the cover plate onto the back plate covers and extends beyond the back plate;

[0037] The cover plate is disposed on the surface of the first adhesive layer away from the first conductive substrate layer, and the back plate is disposed on the surface of the second adhesive layer away from the second conductive substrate layer;

[0038] A sealant layer is provided between the cover plate and the back plate, such that one side of the sealant layer is bonded to the surface of the cover plate facing the back plate, and the other side of the sealant layer is bonded to the surface of the back plate facing the cover plate and / or the outer peripheral surface of the back plate, so that the cover plate, the back plate and the sealant layer together form a sealed cavity, and the sealant layer is cured.

[0039] In one embodiment, the provision of a cover plate and a back plate involves disposing the cover plate on the surface of the first adhesive layer away from the first conductive substrate layer, and disposing the back plate on the surface of the second adhesive layer away from the second conductive substrate layer. A sealant layer is disposed between the cover plate and the back plate, such that the sealant layer, the cover plate, and the back plate together form a sealed cavity capable of accommodating the first adhesive layer, the first conductive substrate layer, the electrochromic film, the second conductive substrate layer, and the second adhesive layer. Curing the sealant layer includes:

[0040] A cover plate and a back plate are provided, wherein the shape and size of the outer contour of the cover plate are the same as the shape and size of the outer contour of the back plate;

[0041] The cover plate is disposed on the surface of the first adhesive layer away from the first conductive substrate layer, and a sealant layer is disposed on the surface of the cover plate facing the first adhesive layer. The back plate is disposed on the surface of the second adhesive layer away from the second conductive substrate layer and bonded to the sealant layer, so that the cover plate, the back plate, and the sealant layer together form a sealed cavity; or; the back plate is disposed on the surface of the second adhesive layer away from the second conductive substrate layer, and a sealant layer is disposed on the surface of the back plate facing the second adhesive layer. The cover plate is disposed on the surface of the first adhesive layer away from the first conductive substrate layer. The first conductive substrate layer is bonded to the surface of the first adhesive layer and to the sealant layer, so that the cover plate, the back plate, and the sealant layer together form a sealed cavity; or, the cover plate is disposed on the surface of the first adhesive layer away from the first conductive substrate layer, the back plate is disposed on the surface of the second adhesive layer away from the second conductive substrate layer, and a sealant layer is disposed between the cover plate and the back plate, so that the sealant layer connects the surface of the cover plate facing the back plate and the surface of the back plate facing the cover plate, so that the cover plate, the back plate, and the sealant layer together form a sealed cavity;

[0042] The sealant layer is cured.

[0043] In one embodiment, the first rigid support structure is made of one or more of glass, ceramic, metal, and wood.

[0044] In one embodiment, the second rigid support structure is made of one or more of glass, ceramic, metal, and wood.

[0045] In one embodiment, the first rigid support structure includes at least one of a quartz glass strip, a quartz glass plate, a quartz glass sphere, and a quartz glass tube.

[0046] In one embodiment, the second rigid support structure includes at least one of a quartz glass strip, a quartz glass plate, a quartz glass sphere, and a quartz glass tube.

[0047] Secondly, this application also provides an electrochromic device, the electrochromic device comprising a first adhesive layer, a first conductive substrate layer, an electrochromic film, a second conductive substrate layer, and a second adhesive layer stacked sequentially; the first conductive substrate layer comprises a first main body portion and a first bonding portion connected together, the first main body portion being connected between the first adhesive layer and the electrochromic film, the first bonding portion protruding from the outer peripheral surface of the electrochromic film and used for electrical connection with a first lead electrode; the second conductive substrate layer comprises a second main body portion and a second bonding portion connected together, the second main body portion being connected between the second adhesive layer and the electrochromic film, the second bonding portion protruding from the outer peripheral surface of the electrochromic film and used for electrical connection with a second lead electrode; wherein, the first adhesive layer has a first groove in the region corresponding to the position of the first bonding portion; and / or, the second adhesive layer has a second groove in the region corresponding to the position of the second bonding portion.

[0048] In one embodiment, the first groove extends through the first transparent adhesive along the thickness direction of the first adhesive layer.

[0049] In one embodiment, the second groove extends through the second adhesive layer along the thickness direction of the second adhesive layer.

[0050] In one embodiment, the first groove is closed at one end and open at the other end in the thickness direction of the first adhesive layer, and the thickness of the first adhesive layer at the closed end of the first groove is less than 100 μm.

[0051] In one embodiment, the second groove is closed at one end and open at the other end in the thickness direction of the second adhesive layer, and the thickness of the second adhesive layer at the closed end of the second groove is less than 100 μm.

[0052] In one embodiment, the first groove is closed at both ends in the thickness direction of the first adhesive layer, the first groove penetrates the outer peripheral surface of the first adhesive layer, and the total thickness of the first adhesive layer at the two closed ends of the first groove is less than 100 μm.

[0053] In one embodiment, the second groove is closed at both ends in the thickness direction of the second adhesive layer, the second groove penetrates the outer peripheral surface of the second adhesive layer, and the total thickness of the second adhesive layer at the two closed ends of the second groove is less than 100 μm.

[0054] In one embodiment, the first conductive substrate layer includes a first substrate layer and a first conductive thin film layer sequentially stacked along a direction from away from the electrochromic film to close to the electrochromic film. A portion of the first substrate layer and a portion of the first conductive thin film layer are located between the electrochromic film and the first adhesive layer and form the first main body portion. Another portion of the first substrate layer and another portion of the first conductive thin film layer protrude from the outer peripheral surface of the electrochromic film and form the first bonding portion. At least a portion of the first conductive thin film layer protruding from the outer peripheral surface of the electrochromic film is used to bond the first lead electrode. The orthographic projection of the first groove on the first substrate layer covers the orthographic projection of the first conductive thin film layer used to bond the first lead electrode on the first substrate layer.

[0055] In one embodiment, the second conductive substrate layer includes a second substrate layer and a second conductive thin film layer sequentially stacked along a direction from away from the electrochromic film to close to the electrochromic film. A portion of the second substrate layer and a portion of the second conductive thin film layer are located between the electrochromic film and the second adhesive layer and form the second main body portion. Another portion of the second substrate layer and another portion of the second conductive thin film layer protrude from the outer peripheral surface of the electrochromic film and form the second bonding portion. At least a portion of the second conductive thin film layer protruding from the outer peripheral surface of the electrochromic film is used to bond the second lead electrode. The orthographic projection of the second groove on the second substrate layer covers the orthographic projection of the second conductive thin film layer used to bond the second lead electrode on the second substrate layer.

[0056] In one embodiment, the first conductive substrate layer includes a first substrate layer, a first conductive thin film layer, a first bus lead, and a first insulating layer. The first substrate layer and the first conductive thin film layer are stacked sequentially from away from the electrochromic film to near the electrochromic film. The first bus lead is disposed on the side of the first conductive thin film layer away from the first substrate layer. The first insulating layer covers a portion of the surface of the first bus lead. A portion of the first substrate layer, a portion of the first conductive thin film layer, a portion of the first bus lead, and the first insulating layer are located between the first adhesive layer and the electrochromic film and form the first main body portion. Another portion of the first substrate layer, another portion of the first conductive thin film layer, and another portion of the first bus lead protrude from the outer peripheral surface of the electrochromic film and form the first bonding portion. At least a portion of the first bus lead protruding from the outer peripheral surface of the electrochromic film is used to bond the first lead electrode. The orthographic projection of the first groove on the first substrate layer covers the orthographic projection of the first bus lead used to bond the first lead electrode on the first substrate layer.

[0057] In one embodiment, the second conductive substrate layer includes a second substrate layer, a second conductive thin film layer, a second bus lead, and a second insulating layer. The second substrate layer and the second conductive thin film layer are stacked sequentially from the direction away from the electrochromic film to the direction near the electrochromic film. The second bus lead is disposed on the side of the second conductive thin film layer away from the second substrate layer, and the second insulating layer covers a portion of the surface of the second bus lead. A portion of the second substrate layer, a portion of the second conductive thin film layer, a portion of the second bus lead, and the second insulating layer are located between the second adhesive layer and the electrochromic film and form the second main body portion. Another portion of the second substrate layer, another portion of the second conductive thin film layer, and another portion of the second bus lead protrude from the outer peripheral surface of the electrochromic film and form the second bonding portion. At least a portion of the second bus lead protruding from the outer peripheral surface of the electrochromic film is used to bond the second lead electrode. The orthographic projection of the second groove on the second substrate layer covers the orthographic projection of the second bus lead used to bond the second lead electrode on the second substrate layer.

[0058] In one embodiment, the electrochromic film includes a liquid crystal layer.

[0059] In one embodiment, the electrochromic film includes an ion storage layer, an electrolyte layer, and an electrochromic layer stacked sequentially.

[0060] In one embodiment, the electrochromic device further includes a cover plate and a back plate, the cover plate being disposed on the side of the first adhesive layer away from the first conductive substrate layer, and the back plate being disposed on the side of the second adhesive layer away from the second conductive substrate layer.

[0061] In one embodiment, the electrochromic device further includes a shielding layer disposed on the side of the cover plate near the back plate, wherein the orthographic projection of the shielding layer on the cover plate covers the orthographic projection of the first groove on the cover plate and / or the orthographic projection of the second groove on the cover plate.

[0062] In one embodiment, the electrochromic device further includes a sealant layer, the sealant layer, the cover plate, and the back plate together forming a sealed cavity, the sealed cavity being used to accommodate the first adhesive layer, the first conductive substrate layer, the electrochromic film, the second conductive substrate layer, and the first adhesive layer.

[0063] In one embodiment, the orthographic projection of the cover plate onto the back plate coincides with the back plate, and the sealant layer is bonded between the surface of the cover plate facing the back plate and the surface of the back plate facing the cover plate.

[0064] In one embodiment, the cover plate's orthographic projection onto the back plate covers and extends beyond the back plate, one end of the sealant layer is connected to the surface of the cover plate facing the back plate, and the other end of the sealant layer is connected to the surface of the back plate facing the cover plate and / or the outer peripheral surface of the back plate.

[0065] In one embodiment, the middle portion of the cover plate protrudes away from the back plate, the middle portion of the back plate protrudes towards the cover plate, the curvature of the cover plate is greater than the curvature of the back plate, and the thickness of the first adhesive layer is greater than the thickness of the second adhesive layer.

[0066] Thirdly, this application also provides a rearview mirror, the rearview mirror including a reflective coating and the aforementioned electrochromic device, wherein the reflective coating is disposed on the side of the back plate near the second adhesive layer or on the side of the back plate away from the second adhesive layer.

[0067] The beneficial effects of the electrochromic device, rearview mirror, and preparation method of the electrochromic device provided in this application are as follows: Compared with the prior art, the preparation method of the electrochromic device provided in this application, by providing a first groove in the region corresponding to the first adhesive layer and the first binding part, and providing a first rigid support structure in the first groove, ensures that when the first lead electrode is bound to the first binding part using a pressing structure such as a pressure head, at least a portion of the first adhesive layer below the pressing structure is replaced by the first rigid support structure. This reduces the buffering effect of the flexible first adhesive layer on the binding operation, and strengthens the connection between the first lead electrode and the first binding part. The electrical connection is more stable and the bonding force is better, thereby reducing the risk of open circuit in the electrochromic device; and / or, by providing a second groove in the area corresponding to the second adhesive layer and the second bonding part, and providing a second rigid support structure in the second groove, when the second lead electrode is bonded to the second bonding part, at least a portion of the second adhesive layer below the pressing structure such as the pressure head is replaced by the second rigid support structure, which can reduce the buffering effect of the flexible second adhesive layer on the bonding operation, making the electrical connection between the second lead electrode and the second bonding part more stable and the bonding force better, thereby reducing the risk of open circuit in the electrochromic device. Attached Figure Description

[0068] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0069] Figure 1 This is a schematic diagram of the structure of a conventional electrochromic device provided in the embodiments of this application;

[0070] Figure 2 A flowchart illustrating the fabrication method of the electrochromic device provided in this application embodiment;

[0071] Figure 3 This is a top view of the electrochromic device provided in an embodiment of this application, with the first busbar in the figure in perspective.

[0072] Figure 4 This is a bottom view of the electrochromic device provided in an embodiment of this application, with the second busbar in perspective.

[0073] Figure 5 for Figure 3 A sectional view of the electrochromic device shown along line AA;

[0074] Figure 6 for Figure 3The BB-direction cross-sectional view of the electrochromic device shown;

[0075] Figure 7 This is a schematic diagram of the structure of another electrochromic device provided in an embodiment of this application;

[0076] Figure 8 A schematic diagram of the structure of yet another electrochromic device provided in an embodiment of this application;

[0077] Figure 9 for Figure 8 An enlarged view of section C in the schematic diagram of the electrochromic device shown;

[0078] Figure 10 for Figure 8 An enlarged view of point D in the schematic diagram of the electrochromic device shown;

[0079] Figure 11 A schematic diagram of the structure of yet another electrochromic device provided in an embodiment of this application;

[0080] Figure 12 A schematic diagram of the structure of another electrochromic device provided in the embodiments of this application;

[0081] Figure 13 for Figure 12 An enlarged view of point E in the schematic diagram of the electrochromic device shown;

[0082] Figure 14 for Figure 12 An enlarged view of point F in the schematic diagram of the electrochromic device shown;

[0083] Figure 15 A schematic diagram of the structure of yet another electrochromic device provided in an embodiment of this application;

[0084] Figure 16 A schematic diagram of the structure of another electrochromic device provided in an embodiment of this application shows a sealant layer and a cover plate and a back plate of equal size;

[0085] Figure 17 This is a schematic diagram of the structure of another electrochromic device provided in an embodiment of this application, showing a sealant layer, a cover plate, and a back plate with dimensions smaller than the cover plate.

[0086] The following are the labeling elements in the figure:

[0087] 100 - Existing electrochromic device; 110 - Electrochromic film; 120 - Conductive substrate; 121 - Bonding part; 130 - Adhesive layer; 140 - Cover plate; 150 - Back plate; 160 - Lead-out electrode;

[0088] 200 - Electrochromic device; 211 - First conductive substrate layer; 2111 - First main body portion; 2112 - First bonding portion; 2113 - First substrate layer; 2114 - First conductive thin film layer; 21141 - First main body region; 21142 - First bonding region; 2115 - First bus lead; 2116 - First insulating layer; 212 - Second conductive substrate layer; 2121 - Second main body portion; 2122 - Second bonding portion; 2123 - Second substrate layer; 2124 - Second conductive thin film layer; 21241 - First... 21242 - Second bonding area; 2125 - Second busbar; 2126 - Second insulating layer; 220 - Electrochromic film; 221 - Electrochromic layer; 222 - Ion storage layer; 223 - Electrolyte layer; 231 - First adhesive layer; 2311 - First groove; 232 - Second adhesive layer; 2321 - Second groove; 241 - First lead electrode; 242 - Second lead electrode; 250 - Cover plate; 260 - Back plate; 270 - Reflective coating; 280 - Sealant layer; 290 - Shielding layer. Detailed Implementation

[0089] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0090] In the description of this application, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0091] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0092] Throughout this specification, references to "an embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of this application. Therefore, the phrases "in one embodiment" or "in some embodiments" appear in various places throughout the specification, and not all refer to the same embodiment. Furthermore, in one or more embodiments, particular features, structures, or characteristics may be combined in any suitable manner.

[0093] Please see Figures 2 to 6 The preparation method of the electrochromic device 200 provided in the embodiments of this application will now be described. The preparation method of the electrochromic device 200 includes the following steps:

[0094] S1: A first conductive substrate layer 211 and a second conductive substrate layer 212 are provided. The first conductive substrate layer 211 includes a first main body portion 2111 and a first bonding portion 2112 connected to each other. The second conductive substrate layer 212 includes a second main body portion 2121 and a second bonding portion 2122 connected to each other.

[0095] S2: An electrochromic film 220 is formed between the first main body portion 2111 and the second main body portion 2121, such that the first binding portion 2112 protrudes from the outer peripheral surface of the electrochromic film 220, and the second binding portion 2122 protrudes from the outer peripheral surface of the electrochromic film 220.

[0096] S3: A first adhesive layer 231 is provided on the surface of the first conductive substrate layer 211 away from the electrochromic film 220, and a second adhesive layer 232 is provided on the surface of the second conductive substrate layer 212 away from the electrochromic film 220; a first groove 2311 is provided on the first adhesive layer 231, the orthographic projection of the first groove 2311 on the first conductive substrate layer 211 at least covers a portion of the first bonding portion 2112, and a first rigid support structure (not shown in the figure) is provided in the first groove 2311; and / or, a second groove 2321 is provided on the second adhesive layer 232, the orthographic projection of the second groove 2321 on the second conductive substrate layer 212 at least covers a portion of the second bonding portion 2122, and a second rigid support structure (not shown in the figure) is provided in the second groove 2321.

[0097] S4: Bind the first lead electrode 241 to the first binding part 2112 and bind the second lead electrode 242 to the second binding part 2122.

[0098] It should be noted that the preparation method of the electrochromic device provided in this embodiment is not necessarily performed in the order of steps S1-S4. It can be adapted according to the actual preparation process. Those skilled in the art can also add other steps. These obvious modifications or equivalent substitutions should also be included within the protection scope of this invention, and will not be elaborated here.

[0099] In this embodiment, the orthographic projection of the first groove 2311 on the first conductive substrate 211 covers at least a portion of the first bonding portion 2112, including the following situations: the orthographic projection of the first groove 2311 on the first conductive substrate 211 is completely located within the first bonding portion 2112 and only covers a portion of the first bonding portion 2112; the orthographic projection of the first groove 2311 on the first conductive substrate 211 just covers the first bonding portion 2112; a portion of the orthographic projection of the first groove 2311 on the first conductive substrate 211 covers a portion of the first bonding portion 2112, and another portion is located outside the first bonding portion 2112; and a portion of the orthographic projection of the first groove 2311 on the first conductive substrate 211 just covers the first bonding portion 2112, and another portion is located outside the first bonding portion 2112.

[0100] In this embodiment, the orthographic projection of the second groove 2321 on the second conductive substrate 212 at least covers a portion of the second bonding portion 2122, including the following situations: the orthographic projection of the second groove 2321 on the second conductive substrate 212 is completely located within the second bonding portion 2122 and only covers a portion of the second bonding portion 2122; the orthographic projection of the second groove 2321 on the second conductive substrate 212 just covers the second bonding portion 2122; a portion of the orthographic projection of the second groove 2321 on the second conductive substrate 212 covers a portion of the second bonding portion 2122, and another portion is located outside the second bonding portion 2122; and a portion of the orthographic projection of the second groove 2321 on the second conductive substrate 212 just covers the second bonding portion 2122, and another portion is located outside the second bonding portion 2122.

[0101] In this embodiment, the first rigid support structure can be made of one or more of glass, ceramic, metal, and wood. The first rigid support structure can be configured as strip, sphere, ellipsoid, plate, block, etc. The shape of the first rigid support structure can be the same as or different from the shape of the first groove 2311.

[0102] The first rigid support structure can be configured to be completely housed within the first groove 2311. In this case, the first rigid support structure can support at least a portion of the first binding portion 2112. Alternatively, the first rigid support structure can be configured to have a portion housed within the first groove 2311, with another portion located outside the first groove 2311. In this case, in addition to supporting at least a portion of the first binding portion 2112, the first rigid support structure can also support the first main body portion 2111 adjacent to the first binding portion 2112, allowing the first lead electrode 241 to be more stably bound to the first binding portion 2112, thus improving the effectiveness of the binding operation.

[0103] In this embodiment, the second rigid support structure can be made of one or more of glass, ceramic, metal, and wood. The second rigid support structure can be set in the shape of strip, sphere, ellipsoid, plate, block, etc. The shape of the second rigid support structure can be the same as or different from the shape of the second groove 2321.

[0104] The second rigid support structure can be configured to be completely housed within the second groove 2321. In this case, the second rigid support structure can support at least a portion of the second binding portion 2122. Alternatively, the second rigid support structure can be configured to have a portion housed within the second groove 2321, with another portion located outside the second groove 2321. In this case, in addition to supporting at least a portion of the second binding portion 2122, the second rigid support structure can also support the second main body portion 2121 adjacent to the second binding portion 2122, allowing the second lead electrode 242 to be more stably bound to the second binding portion 2122, thus improving the effectiveness of the binding operation.

[0105] In this embodiment, binding the first lead electrode 241 to the first binding part 2112 can be understood as bonding the first lead electrode 241 to the first binding part 2112 under normal temperature and pressure, or under other special temperature and pressure conditions. For example, the first lead electrode 241 can be bonded to the first binding part 2112 under specific temperature and pressure conditions using anisotropic conductive film (ACF). Of course, other methods can also be selected as needed.

[0106] In this embodiment, binding the second lead electrode 242 to the second bonding part 2122 can be understood as bonding the second lead electrode 242 to the second bonding part 2122 under normal temperature and pressure, or under other special temperature and pressure conditions. For example, the second lead electrode 242 can be bonded to the second bonding part 2122 under specific temperature and pressure conditions using anisotropic conductive film (ACF). Of course, other methods can also be selected as needed.

[0107] Specifically, as a specific implementation of binding the first lead electrode 241 to the first binding part 2112, the stacked structure formed by the first adhesive layer 231, the first conductive substrate layer 211, the electrochromic film 220, the second conductive substrate layer 212, and the second adhesive layer 232 can be placed on the external support surface as a whole. The stacked structure is made to directly contact the external support surface through the release film on the side of the first adhesive layer 231 away from the first conductive substrate layer 211, so as to avoid the first adhesive layer 231 from bonding with the external support surface. Then, the first lead electrode 241 is pressed into the side of the first binding part 2112 away from the first adhesive layer 231 by a pressing structure such as a pressure head. After the binding operation is completed, when the first adhesive layer 231 needs to be bonded to other structures, the release film on the first adhesive layer 231 can be removed first, and then the first adhesive layer 231 can be bonded to other structures (such as the cover plate 250 described below).

[0108] Similarly, as a specific implementation of binding the second lead electrode 242 to the second binding part 2122, the stacked structure formed by the first adhesive layer 231, the first conductive substrate layer 211, the electrochromic film 220, the second conductive substrate layer 212, and the second adhesive layer 232 can be placed on the external support surface as a whole. The stacked structure is made to directly contact the external support surface through the release film on the side of the second adhesive layer 232 away from the second conductive substrate layer 212, so as to avoid the second adhesive layer 232 from bonding with the external support surface. Then, the second lead electrode 242 is pressed into the side of the second binding part 2122 away from the second adhesive layer 232 by a pressing structure such as a pressure head. After the binding operation is completed, when the second adhesive layer 232 needs to be bonded to other structures, the release film on the second adhesive layer 232 can be removed first, and then the second adhesive layer 232 can be bonded to other structures (such as the back plate 260 described below).

[0109] Preferably, the first adhesive layer 231, the first conductive substrate layer 211, the second conductive substrate layer 212, and the second adhesive layer 232 can all be configured as light-transmitting structures.

[0110] Preferably, both the first lead-out electrode 241 and the second lead-out electrode 242 are flexible printed circuit boards (FPCs).

[0111] The method for fabricating the electrochromic device 200 provided in this application, compared with the prior art, involves providing a first groove 2311 in the region corresponding to the first adhesive layer 231 and the first binding portion 2112, and providing a first rigid support structure within the first groove 2311. This allows at least a portion of the first adhesive layer 231 below the pressure head or similar pressure structure to be replaced by the first rigid support structure when the first lead electrode 241 is bound to the first binding portion 2112 using a pressure head or similar clamping structure. This reduces the buffering effect of the flexible first adhesive layer 231 on the binding operation, making the electrical connection between the first lead electrode 241 and the first binding portion 2112 more stable and the bonding force better, thereby reducing... The risk of open circuit in the electrochromic device 200; and / or, by providing a second groove 2321 on the second adhesive layer 232 in the area corresponding to the second binding portion 2122, and providing a second rigid support structure in the second groove 2321, when the second lead electrode 242 is bound to the second binding portion 2122, at least a portion of the second adhesive layer 232 below the pressing structure such as the pressure head is replaced by the second rigid support structure, which can reduce the buffering effect of the flexible second adhesive layer 232 on the binding operation, make the electrical connection between the second lead electrode 242 and the second binding portion 2122 more stable and the bonding force better, thereby reducing the risk of open circuit in the electrochromic device 200.

[0112] Furthermore, the first rigid support structure provides rigid support, ensuring that the first lead electrode 241 and the first binding part 2112 are stably positioned when bound together, preventing positional displacement. Similarly, the second rigid support structure ensures that the second lead electrode 242 and the second binding part 2122 are securely bound together and stably positioned.

[0113] In another embodiment of this application, the first rigid support structure includes at least one of a quartz glass strip, a quartz glass ball, a quartz glass plate, and a quartz glass tube. This design offers several advantages. First, because quartz glass can withstand high pressure and high temperature, the bonding of the first lead electrode 241 can be performed under these conditions. Second, the good light transmittance of quartz glass allows for better alignment between the first rigid support structure and the first groove 2311 during installation. Furthermore, since both the first adhesive layer 231 and the first conductive substrate layer 211 are made of transparent material, the bonding operation can be monitored from the side where the first rigid support structure is located. For example, a camera can be placed below the first rigid support structure. This allows the camera to clearly capture the alignment of the first lead electrode 241 with the first bonding part 2112 through the first rigid support structure, the first adhesive layer 231, and the first conductive substrate layer 211. This improves the accuracy of the alignment and the stability of the connection, as well as the efficiency and convenience of the bonding operation.

[0114] In another embodiment of this application, the second rigid support structure includes at least one of a glass strip, a glass ball, a glass plate, and a glass tube. This design offers several advantages. First, because quartz glass can withstand high pressure and temperature, the bonding of the second lead electrode 242 can be performed under these conditions. Second, the good light transmittance of quartz glass allows for better alignment of the second rigid support structure and the second groove 2321 during installation. Furthermore, since both the second adhesive layer 232 and the second conductive substrate layer 212 are made of transparent material, the bonding process can be monitored from the side where the second rigid support structure is located. For example, a camera can be placed below the second rigid support structure. This allows the camera to clearly capture the alignment of the second lead electrode 242 with the second bonding part 2122 through the second rigid support structure, the second adhesive layer 232, and the second conductive substrate layer 212. This improves the accuracy of the alignment and the stability of the connection between the second lead electrode 242 and the second bonding part 2122, as well as the efficiency and convenience of the bonding operation.

[0115] In another embodiment of this application, as a specific implementation of step S1, step S1 may include:

[0116] A first substrate layer 2113 is provided, and a first conductive thin film layer 2114 is disposed on the first substrate layer 2113. The first conductive thin film layer 2114 includes a first main body region 21141 and a first bonding region 21142 that are electrically connected. The first main body region 21141 and the first substrate layer 2113 supporting the first main body region 21141 form a first main body portion 2111, and the first bonding region 21142 and the first substrate layer 2113 supporting the first bonding region 21142 form a first bonding portion 2112.

[0117] A second substrate layer 2123 is provided, and a second conductive thin film layer 2124 is disposed on the second substrate layer 2123. The second conductive thin film layer 2124 includes a second body region 21241 and a second bonding region 21242 that are electrically connected. The second body region 21241 and the second conductive thin film layer 2124 supporting the second body region 21241 form a second body portion 2121, and the second bonding region 21242 and the second conductive thin film layer 2124 supporting the second bonding region 21242 form a second bonding portion 2122.

[0118] It should be noted that the first conductive substrate layer 211 in this embodiment can be understood as... Figures 5 to 17 The structure remaining after removing the first bus lead 2115 and the first insulating layer 2116 from the first conductive substrate layer 211 is the first substrate layer 2113 and the first conductive thin film layer 2114. In this embodiment, the first substrate layer 2113 can be understood as... Figures 5 to 17 The first substrate layer 2113 in the first embodiment and the first conductive thin film layer 2114 in the first embodiment can be understood as... Figures 5 to 17 The first conductive thin film layer 2114 in this embodiment is not provided with the first bus lead 2115 and the first insulating layer 2116. The first conductive thin film layer 2114 in this embodiment is directly bonded to the first lead electrode 241 through its first bonding area 21142.

[0119] Similarly, the second conductive substrate layer 212 in this embodiment can be understood as... Figures 5 to 17 The structure remaining after removing the second bus lead 2125 and the second insulating layer 2126 from the second conductive substrate layer 212 shown is the second substrate layer 2123 and the second conductive thin film layer 2124. In other words, the second substrate layer 2123 in this embodiment can be understood as... Figures 5 to 17 The second substrate layer 2123 in this embodiment and the second conductive thin film layer 2124 can be understood as... Figures 5 to 17The second conductive thin film layer 2124 in this embodiment is not provided with a second bus lead 2125 and a second insulating layer 2126. In this embodiment, the second conductive thin film layer 2124 is directly bonded to the second lead electrode 242 through its second bonding area 21242.

[0120] Both the first substrate layer 2113 and the second substrate layer 2123 can be polyethylene glycol terephthalate (PET) films, and both the first conductive thin film layer 2114 and the second conductive thin film layer 2124 can be indium tin oxide (ITO) conductive layers.

[0121] By using the fabrication method of the electrochromic device 200 provided in this embodiment, a first conductive substrate layer 211 and a second conductive substrate layer 212 can be fabricated. A first lead electrode 241 is bonded in the first bonding region 21142, and a second lead electrode 242 is bonded in the second bonding region 21242. After the first lead electrode 241 and the second lead electrode 242 are electrically connected to the positive and negative terminals of the power supply, respectively, the first conductive substrate layer 211 and the second conductive substrate layer 212 can be used to form a potential difference on both sides of the electrochromic film 220, thereby changing the light transmittance of the electrochromic film 220.

[0122] In another embodiment of this application, please refer to Figure 6 and Figure 7 As another specific implementation of step S1, step S1 may include:

[0123] A first substrate layer 2113 is provided, and a first conductive thin film layer 2114 is disposed on the first substrate layer 2113. The first conductive thin film layer 2114 includes a first main body region 21141 and a first bonding region 21142 that are electrically connected. A first bus lead 2115 is disposed on the first main body region 21141 and the first bonding region 21142. A first insulating layer 2116 is coated on the surface of the first bus lead 2115 disposed on the first main body region 21141. The first main body region 21141, the first substrate layer 2113 for supporting the first main body region 21141, the first bus lead 2115 disposed on the first main body region 21141, and the first insulating layer 2116 form a first main body portion 2111; the first bonding region 21142, the first substrate layer 2113 for supporting the first bonding region 21142, and the first bus lead 2115 disposed on the first bonding region 21142 form a first bonding portion 2112.

[0124] A second substrate layer 2123 is provided, and a second conductive thin film layer 2124 is disposed on the second substrate layer 2123. The second conductive thin film layer 2124 includes a second main body region 21241 and a second bonding region 21242 that are electrically connected. A second bus lead 2125 is disposed on the second main body region 21241 and the second bonding region 21242. A second insulating layer 2126 is coated on the surface of the second bus lead 2125 disposed on the second main body region 21241. The second main body region 21241, the second substrate layer 2123 for supporting the second main body region 21241, the second bus lead 2125 disposed on the second main body region 21241, and the second insulating layer 2126 form a second main body portion 2121. The second bonding region 21242, the second substrate layer 2123 for supporting the second bonding region 21242, and the second bus lead 2125 disposed on the second bonding region 21242 form a second bonding portion 2122.

[0125] Specifically, in this embodiment, both the first substrate layer 2113 and the second substrate layer 2123 can be polyethylene glycol terephthalate (PET) films. Both the first conductive thin film layer 2114 and the second conductive thin film layer 2124 can be indium tin oxide (ITO) conductive thin film layers. Both the first bus lead 2115 and the second bus lead 2125 can be silver wires, copper wires, or other conductive wires. The materials of the first insulating layer 2116 and the second insulating layer 2126 can be insulating varnish, insulating resin adhesive, etc. On the one hand, the first insulating layer 2116 and the second insulating layer 2126 can protect the covered first bus lead 2115 and second bus lead 2125 from oxidation. On the other hand, since the electrochromic film 220 between the first conductive substrate layer 211 and the second conductive substrate layer 212 is relatively thin, the first insulating layer 2116 and the second insulating layer 2126 can also minimize the discharge phenomenon between the first bus lead 2115 and the second bus lead 2125 when they are placed opposite each other.

[0126] By using the fabrication method of the electrochromic device 200 provided in this embodiment, a first conductive substrate layer 211 and a second conductive substrate layer 212 can be fabricated. A first lead-out electrode 241 is bound to a first bus lead 2115, and a second lead-out electrode 242 is bound to a second bus lead 2125. After the first lead-out electrode 241 and the second lead-out electrode 242 are electrically connected to the positive and negative terminals of the power supply, respectively, the first conductive substrate layer 211 and the second conductive substrate layer 212 can be used to create a potential difference on both sides of the electrochromic film 220, thereby changing the light transmittance of the electrochromic film 220.

[0127] Furthermore, the fabrication method of the electrochromic device 200 provided in this embodiment electrically connects the first conductive thin film layer 2114 to the first lead-out electrode 241 through the first bus lead 2115, which can reduce the sheet resistance value of the first conductive thin film layer 2114. Electrically connecting the second conductive thin film layer 2124 to the second lead-out electrode 242 through the second bus lead 2125 can reduce the sheet resistance value of the second conductive thin film layer 2124, which is beneficial to improving the efficiency of the electrochromic device 200.

[0128] In another embodiment of this application, please refer to Figure 6 and Figure 7 As a specific implementation of step S2, step S2 includes:

[0129] First, an electrochromic layer 221 is coated on the conductive side of the first conductive substrate layer 211, and an ion storage layer 222 is coated on the conductive side of the second conductive substrate layer 212; or, an ion storage layer 222 is coated on the conductive side of the first conductive substrate layer 211, and an electrochromic layer 221 is coated on the conductive side of the second conductive substrate layer 212.

[0130] Specifically, in the case where the first conductive substrate layer 211 includes a first substrate layer 2113 and a first conductive thin film layer 2114, and the second conductive substrate layer 212 includes a second substrate layer 2123 and a second conductive thin film layer 2124 (not shown in the figure), the above-mentioned steps of coating the ion storage layer 222 and the electrochromic layer 221 specifically include: coating the electrochromic layer 221 on one of the surfaces of the first conductive thin film layer 2114 away from the first substrate layer 2113 and the second conductive thin film layer 2124 away from the second substrate layer 2123, and coating the other of the surfaces of the first conductive thin film layer 2114 away from the first substrate layer 2113 and the second conductive thin film layer 2124 away from the second substrate layer 2123.

[0131] Specifically, please refer to Figure 5 and Figure 6 When the first conductive substrate 211 includes a first substrate 2113, a first conductive thin film layer 2114, and a first busbar 2115, and the second conductive substrate 212 includes a second substrate 2123, a second conductive thin film layer 2124, and a second busbar 2125, the above-mentioned steps of coating the ion storage layer 222 and the electrochromic layer 221 specifically include: coating one of the surfaces of the first conductive substrate 211 where the first busbar 2115 is provided and the second conductive substrate 212 where the second busbar 2125 is provided, and coating the other of the surfaces of the first conductive substrate 211 where the first busbar 2115 is provided and the second conductive substrate 212 where the second busbar 2125 is provided, with the ion storage layer 222.

[0132] Next, the electrochromic layer 221 and the ion storage layer 222 are positioned opposite each other with a predetermined gap. An electrolyte is then dropped into the predetermined gap, causing the electrolyte to solidify into an electrolyte layer 223. The electrolyte layer 223, the ion storage layer 222, and the electrochromic layer 221 together form an electrochromic film 220.

[0133] Next, the electrochromic film 220 and the second conductive substrate layer 212 corresponding to the position of the first bonding portion 2112 are removed by partial cutting, so that the first bonding portion 2112 protrudes from the outer peripheral surface of the electrochromic film 220 and the outer peripheral surface of the second conductive substrate layer 212. The electrochromic film 220 and the first conductive substrate layer 211 corresponding to the position of the second bonding portion 2122 are removed by partial cutting, so that the second bonding portion 2122 protrudes from the outer peripheral surface of the electrochromic film 220 and the outer peripheral surface of the first conductive substrate layer 211.

[0134] It should be noted that, in this embodiment, the area on the electrochromic film 220 corresponding to the position of the first bonding portion 2112 can be understood as the area on the electrochromic film 220 covered by the orthographic projection of the first bonding portion 2112 onto the electrochromic film 220. Similarly, the area on the second conductive substrate layer 212 corresponding to the position of the first bonding portion 2112 can be understood as the area on the second conductive substrate layer 212 covered by the orthographic projection of the first bonding portion 2112 onto the second conductive substrate layer 212.

[0135] The area on the electrochromic film 220 corresponding to the position of the second bonding portion 2122 can be understood as the area on the electrochromic film 220 covered by the orthographic projection of the second bonding portion 2122 onto the electrochromic film 220. Similarly, the area on the first conductive substrate layer 211 corresponding to the position of the second bonding portion 2122 can be understood as the area on the first conductive substrate layer 211 covered by the orthographic projection of the second bonding portion 2122 onto the first conductive substrate layer 211.

[0136] After the above steps are completed, or after an electrolyte is formed between the electrochromic layer 221 and the ion storage layer 222, the first conductive substrate layer 211, the second conductive substrate layer 212, and the electrochromic film 220 can be cut as a whole to form a predetermined outer contour. Thus, in step S3, the outer contour of the first adhesive layer 231 needs to be cut into a shape that matches the outer contour of the first conductive substrate layer 211, and the outer contour of the second adhesive layer 232 needs to be cut into a shape that matches the outer contour of the second conductive substrate layer 212. Of course, the operation of cutting the first conductive substrate layer 211, the second conductive substrate layer 212, and the electrochromic film 220 as a whole to form a predetermined outer contour can also be performed after step S3, so that the outer contours of the first adhesive layer 231, the second adhesive layer 232, the first conductive substrate layer 211, and the second conductive substrate layer 212 can be cut simultaneously.

[0137] The fabrication method of the electrochromic device 200 provided in this embodiment can be used to prepare a stacked structure in which a first conductive substrate layer 211, an electrochromic film 220, and a second conductive substrate layer 212 are stacked in sequence. In this stacked structure, the first binding part 2112 extends to the outer peripheral surface of the electrochromic film 220, and the second binding part 2122 extends to the outer peripheral surface of the electrochromic film 220, which can reserve operating space for binding the first lead electrode 241 on the first binding part 2112 and binding the second lead electrode 242 on the second binding part 2122.

[0138] In another embodiment of this application, please refer to Figure 6 and Figure 7 As another specific implementation of step S2, step S2 includes:

[0139] An electrochromic layer 221 is coated on the surface of the first main body region 21141 of the first main body portion 2111, and an ion storage layer 222 is coated on the surface of the second main body region 21241 of the second main body portion 2121; or, an ion storage layer 222 is coated on the surface of the first main body region 21141 of the first main body portion 2111, and an electrochromic layer 221 is coated on the surface of the second main body region 21241 of the second main body portion 2121.

[0140] The electrochromic layer 221 and the ion storage layer 222 are arranged opposite each other with a predetermined gap. An electrolyte is dropped into the predetermined gap and the electrolyte is solidified into an electrolyte layer 223. The electrolyte layer 223, the ion storage layer 222 and the electrochromic layer 221 form an electrochromic film 220.

[0141] The fabrication method of the electrochromic device 200 provided in this embodiment can, on the one hand, also fabricate a stacked structure in which a first conductive substrate layer 211, an electrochromic film 220, and a second conductive substrate layer 212 are sequentially stacked. In this stacked structure, the first bonding portion 2112 extends to the outer peripheral surface of the electrochromic film 220, and the second bonding portion 2122 extends to the outer peripheral surface of the electrochromic film 220, thus reserving operating space for bonding the first lead electrode 241 to the first bonding portion 2112 and the second lead electrode 242 to the second bonding portion 2122. On the other hand, since the electrochromic film 220 is only disposed between the first main body portion 2111 and the second main body portion 2121, the fabrication method of the electrochromic device 200 provided in this embodiment eliminates the need to remove a portion of the electrochromic film 220 to expose the first bonding portion 2112 and the second bonding portion 2122.

[0142] In another embodiment of this application, please refer to Figures 6 to 14 As a specific implementation of step S3, step S3 includes:

[0143] A first adhesive layer 231 and a second adhesive layer 232 are provided.

[0144] The first adhesive layer 231 is bonded to the side of the first conductive substrate 211 away from the electrochromic film 220, and the second adhesive layer 232 is bonded to the side of the second conductive substrate 212 away from the electrochromic film 220.

[0145] Please see Figure 6 , Figure 7 , Figure 9 , Figure 11 , Figure 12 and Figure 13 A first groove 2311 is provided in the first adhesive layer 231. The orthographic projection of the first groove 2311 on the first conductive substrate layer 211 at least covers a portion of the first bonding portion 2112, and the first groove 2311 at least penetrates the outer peripheral surface of the first adhesive layer 231 or the surface of the first adhesive layer 231 away from the electrochromic film 220. A first rigid support structure is provided within the first groove 2311; and / or, please refer to Figure 6 , Figure 7 , Figure 10 , Figure 11 , Figure 12 and Figure 14 A second groove 2321 is provided on the second adhesive layer 232. The orthographic projection of the second groove 2321 on the second conductive substrate layer 212 at least covers a portion of the second bonding portion 2122. The second groove 2321 at least penetrates the outer peripheral surface of the second adhesive layer 232 or the surface of the second adhesive layer 232 away from the electrochromic film 220. A second rigid support structure is provided in the second groove 2321.

[0146] In this embodiment, the first groove 2311 is configured to penetrate at least through the outer peripheral surface of the first adhesive layer 231 or the surface of the first adhesive layer 231 away from the first conductive substrate layer 211. With this configuration, when the first adhesive layer 231 is bonded to the first conductive substrate layer 211, the first groove 2311 is in an open state. The first rigid support structure can be placed in the first groove 2311 through the opening of the first groove 2311, and then the first lead electrode 241 is bound to the first binding part 2112. After the first lead electrode 241 is bound to the first binding part 2112, the first rigid support structure can also be removed from the first groove 2311 through the opening of the first groove 2311.

[0147] Similarly, the second groove 2321 is configured to penetrate at least through the outer peripheral surface of the second adhesive layer 232 or the surface of the second adhesive layer 232 away from the electrochromic film 220. With this configuration, when the second adhesive layer 232 is bonded to the first conductive substrate layer 211, the second groove 2321 is in an open state. The second rigid support structure can be placed in the second groove 2321 through the opening of the second groove 2321, and then the second lead electrode 242 is bound to the second binding part 2122. After the second lead electrode 242 is bound to the second binding part 2122, the second rigid support structure can also be removed from the second groove 2321 through the opening of the second groove 2321.

[0148] The method for preparing the electrochromic device 200 provided in this embodiment involves first bonding a first adhesive layer 231 to a first conductive substrate 211 and bonding a second adhesive layer 232 to a second conductive substrate 212. Then, a first groove 2311 is provided on the first adhesive layer 231 and / or a second groove 2321 is provided on the second adhesive layer 232. This eliminates the need to align the first groove 2311 with the first bonding portion 2112 when bonding the first adhesive layer 231 to the first conductive substrate 211, and eliminates the need to align the second groove 2321 with the second bonding portion 2122 when bonding the second adhesive layer 232 to the second conductive substrate 212. The alignment and bonding of the first adhesive layer 231 and the first conductive substrate 211, as well as the alignment and bonding of the second adhesive layer 232 and the second conductive substrate 212, are relatively convenient and can improve production efficiency.

[0149] In another embodiment of this application, please refer to Figures 6 to 14 As another specific implementation of step S3, step S3 includes:

[0150] A first adhesive layer 231 and a second adhesive layer 232 are provided.

[0151] Please see Figure 6 , Figure 7 , Figure 9 , Figure 11 , Figure 12 and Figure 13 A first groove 2311 is provided on the first adhesive layer 231. The first groove 2311 penetrates at least through the outer peripheral surface or one side of the first adhesive layer 231, bonding the first adhesive layer 231 to the side of the first conductive substrate layer 211 away from the electrochromic film 220. The orthogonal projection of the first groove 2311 onto the first conductive substrate layer 211 at least covers a portion of the first bonding portion 2112, and the first groove 2311 remains open. A first rigid support structure is provided within the first groove 2311; and / or, please refer to Figure 6 , Figure 7 , Figure 10 , Figure 11 , Figure 12 and Figure 14 A second groove 2321 is provided on the second adhesive layer 232. The second groove 2321 penetrates at least through the outer peripheral surface or one side of the second adhesive layer 232, and the second adhesive layer 232 is bonded to the side of the second conductive substrate layer 212 away from the electrochromic film 220. The orthogonal projection of the second groove 2321 on the second conductive substrate layer 212 at least covers a part of the second bonding portion 2122, and the first groove 2311 is kept open. A second rigid support structure is provided in the second groove 2321.

[0152] In this embodiment, after the first adhesive layer 231 is bonded to the first conductive substrate layer 211, the first groove 2311 is in an open state, which also facilitates the first rigid support structure to be inserted into or removed from the first groove 2311 through the opening of the first groove 2311. After the second adhesive layer 232 is bonded to the second conductive substrate layer 212, the second groove 2321 is in an open state, which also facilitates the second rigid support structure to be inserted into or removed from the second groove 2321 through the opening of the second groove 2321.

[0153] The method for fabricating the electrochromic device 200 provided in this embodiment involves first forming a first groove 2311 on a first adhesive layer 231 and / or forming a second groove 2321 on a second adhesive layer 232. Then, the first adhesive layer 231 is bonded to a first conductive substrate layer 211, and the second adhesive layer 232 is bonded to a second conductive substrate layer 212. This arrangement allows for flexibility in grooving methods, such as laser ablation or die cutting, by pre-forming the first groove 2311 and / or the second groove 2321 without damaging the first conductive substrate layer 211 and / or the second conductive substrate layer 212. The conductive substrate layer 212 ensures a high yield rate. Furthermore, since the first adhesive layer 231 removed from the first groove 2311 is not bonded to the first conductive substrate layer 211, there is no need to peel off this portion of the first adhesive layer 231 from the first conductive substrate layer 211, simplifying the manufacturing process and improving the ease of setting the first groove 2311. Similarly, since the second adhesive layer 232 removed from the second groove 2321 is not bonded to the second conductive substrate layer 212, there is no need to peel off this portion of the second adhesive layer 232 from the second conductive substrate layer 212, simplifying the manufacturing process and improving the ease of setting the second groove 2321.

[0154] In another embodiment of this application, please refer to Figures 6 to 15 As another specific implementation of step S3, step S3 includes:

[0155] A first adhesive layer 231 and a second adhesive layer 232 are provided.

[0156] A first groove 2311 is provided on the first adhesive layer 231, and a first rigid support structure is provided in the first groove 2311. The first adhesive layer 231 is bonded to the side of the first conductive substrate layer 211 away from the electrochromic film 220, and the orthogonal projection of the first groove 2311 on the first conductive substrate layer 211 at least covers a portion of the first bonding portion 2112; and / or, a second groove 2321 is provided on the second adhesive layer 232, and a second rigid support structure is provided in the second groove 2321. The second adhesive layer 232 is bonded to the side of the second conductive substrate layer 212 away from the electrochromic film 220, and the orthogonal projection of the second groove 2321 on the second conductive substrate layer 212 at least covers a portion of the second bonding portion 2122.

[0157] Specifically, in this embodiment, please refer to Figure 6 , Figure 7 , Figure 9 , Figure 11 , Figure 12 and Figure 13The first groove 2311 can be configured to penetrate at least through the outer peripheral surface of the first adhesive layer 231 or the side of the first adhesive layer 231 away from the first conductive substrate layer 211. Thus, as described above, after the first adhesive layer 231 is bonded to the first conductive substrate layer 211, the first groove 2311 is in an open state. (See also...) Figure 15 The first groove 2311 can also be configured as a blind hole located on the side of the first adhesive layer 231 used for bonding with the first conductive substrate layer 211. After the first adhesive layer 231 is bonded to the first conductive substrate layer 211, the first groove 2311 is in a closed state. Therefore, before the first adhesive layer 231 is bonded to the first conductive substrate layer 211, the first rigid support structure needs to be set in the first groove 2311, and then the first lead electrode 241 is bound to the first binding part 2112. After the first lead electrode 241 is bound to the first binding part 2112, the first rigid support structure will remain in the first groove 2311. The fabrication method of the electrochromic device 200 provided in this embodiment allows for more flexible and diverse implementation methods for the first groove 2311. Please refer to... Figures 6 to 15 The second groove 2321 is set in a similar way to the first groove 2311, and the implementation methods are also quite flexible and diverse, so they will not be described in detail here.

[0158] The method for fabricating the electrochromic device 200 provided in this embodiment also involves first forming a first groove 2311 on the first adhesive layer 231 and / or forming a second groove 2321 on the second adhesive layer 232. Then, the first adhesive layer 231 is bonded to the first conductive substrate layer 211, and the second adhesive layer 232 is bonded to the second conductive substrate layer 212. This arrangement allows for flexibility in grooving methods, such as laser ablation or die cutting, by pre-forming the first groove 2311 and / or the second groove 2321. Furthermore, pre-forming the first groove 2311 and / or the second groove 2321 avoids damage to the first conductive substrate layer 211 and / or the second conductive substrate layer 212. The bottom layer 212 ensures a high yield rate. On the other hand, since the first adhesive layer 231 removed from the first groove 2311 does not bond with the first conductive substrate layer 211, there is no need to peel off the removed portion of the first adhesive layer 231 from the first conductive substrate layer 211, simplifying the manufacturing process and improving the ease of setting the first groove 2311. Similarly, since the second adhesive layer 232 removed from the second groove 2321 does not bond with the second conductive substrate layer 212, there is no need to peel off the removed portion of the second adhesive layer 232 from the second conductive substrate layer 212, simplifying the manufacturing process and improving the ease of setting the second groove 2321.

[0159] In another embodiment of this application, please refer to Figure 16 and Figure 17The method for preparing the electrochromic device 200 also includes the following steps:

[0160] S5: Prepare a cover plate 250 and a back plate 260. Place the cover plate 250 on the surface of the first adhesive layer 231 away from the first conductive substrate layer 211, and place the back plate 260 on the surface of the second adhesive layer 232 away from the second conductive substrate layer 212. Place a sealant layer 280 between the cover plate 250 and the back plate 260, so that the sealant layer 280, the cover plate 250 and the back plate 260 form a sealed cavity. The sealed cavity can accommodate the first adhesive layer 231, the first conductive substrate layer 211, the electrochromic film 220, the second conductive substrate layer 212 and the second adhesive layer 232. Cure the sealant layer 280.

[0161] The method for preparing the electrochromic device 200 provided in this embodiment involves providing a cover plate 250 on the first adhesive layer 231, providing a back plate 260 on the second adhesive layer 232, and providing a sealant layer 280. This sealant layer 280, cover plate 250, and back plate 260 together seal the first adhesive layer 231, the first conductive substrate layer 211, the electrochromic film 220, the second conductive substrate layer 212, and the second adhesive layer 232, thereby effectively preventing water, oxygen, and other substances from seeping into the periphery of the electrochromic device 200 and extending the service life of the electrochromic device 200.

[0162] In another embodiment of this application, please refer to Figure 16 As another specific implementation of step S5, step S5 includes:

[0163] First, a cover plate 250 and a back plate 260 are provided. When the cover plate 250 and the back plate 260 are stacked, the orthographic projection of the cover plate 250 on the back plate 260 coincides with the back plate 260. In other words, the shape and size of the outer contour of the cover plate 250 are the same as the shape and size of the outer contour of the back plate 260.

[0164] Next, the cover plate 250 can be disposed on the surface of the first adhesive layer 231 away from the first conductive substrate layer 211, and a sealing layer 280 can be disposed on the surface of the cover plate 250 facing the first adhesive layer 231. The back plate 260 can be disposed on the surface of the second adhesive layer 232 away from the second conductive substrate layer 212 and bonded to the sealing layer 280, so that the cover plate 250, the back plate 260 and the sealing layer 280 together form a sealed cavity.

[0165] Alternatively, a back plate 260 can be disposed on the surface of the second adhesive layer 232 away from the second conductive substrate layer 212, and a sealing layer 280 can be disposed on the surface of the back plate 260 facing the second adhesive layer 232. A cover plate 250 can be disposed on the surface of the first adhesive layer 231 away from the first conductive substrate layer 211 and bonded to the sealing layer 280, so that the cover plate 250, the back plate 260 and the sealing layer 280 together form a sealed cavity.

[0166] Alternatively, a cover plate 250 can be disposed on the surface of the first adhesive layer 231 away from the first conductive substrate layer 211, and a back plate 260 can be disposed on the surface of the second adhesive layer 232 away from the second conductive substrate layer 212. A sealant layer 280 can be disposed between the cover plate 250 and the back plate 260, so that the sealant layer 280 connects the surface of the cover plate 250 facing the back plate 260 and the surface of the back plate 260 facing the cover plate 250. The sealant layer 280 can be cured so that the cover plate 250, the back plate 260 and the sealant layer 280 together form a sealed cavity.

[0167] Finally, cure the sealant layer 280.

[0168] The method for preparing the electrochromic device 200 provided in this embodiment uses a cover plate 250 and a back plate 260 with the same outer contour shape and size. The assembly order of the cover plate 250 and the back plate 260 can be changed. Alternatively, one or both of the cover plate 250 and the back plate 260 can be assembled before applying sealant, making the operation more flexible.

[0169] In another embodiment of this application, please refer to Figure 17 As a specific implementation of step S5, step S5 includes:

[0170] A cover plate 250 and a back plate 260 are provided. When the cover plate 250 and the back plate 260 are stacked, the orthogonal projection of the cover plate 250 on the back plate 260 covers and extends beyond the back plate 260.

[0171] The cover plate 250 is disposed on the surface of the first adhesive layer 231 away from the first conductive substrate layer 211, and the back plate 260 is disposed on the surface of the second adhesive layer 232 away from the second conductive substrate layer 212.

[0172] A sealing layer 280 is provided between the cover plate 250 and the back plate 260, such that one side of the sealing layer 280 is bonded to the surface of the cover plate 250 facing the back plate 260, and the other side of the sealing layer 280 is bonded to the surface of the back plate 260 facing the cover plate 250 and / or the outer peripheral surface of the back plate 260, so that the cover plate 250, the back plate 260 and the sealing layer 280 together form a sealed cavity, and finally the sealing layer 280 is cured.

[0173] The method for preparing the electrochromic device 200 provided in this embodiment uses a back plate 260 with a size smaller than that of the cover plate 250. This allows the sealant layer 280 to bond not only to the surface of the back plate 260 facing the cover plate 250, but also to the outer peripheral surface of the back plate 260. When the sealant layer 280 uses a light-curing adhesive, the light-receiving area of ​​the sealant layer 280 during the sealing process can be increased, the curing time required can be reduced, and the comprehensiveness and effectiveness of its curing can be improved, thereby improving the sealing performance of the electrochromic device 200.

[0174] In another embodiment of this application, please refer to Figures 6 to 9 , Figures 11 to 13 as well as Figures 15 to 17 Before the cover plate 250 is disposed on the surface of the first adhesive layer 231 away from the first conductive substrate layer 211, a shielding layer 290 is disposed on the side of the cover plate 250 for connection with the first adhesive layer 231. When the cover plate 250 and the shielding layer 290 are disposed together on the side of the first adhesive layer 231 away from the first conductive substrate layer 211, the shielding layer 290 can shield the first groove 2311 and / or the second groove 2321.

[0175] It should be noted that when the first adhesive layer 231 has a first groove 2311 and the second adhesive layer 232 does not have a second groove 2321, the shielding layer 290 is used to shield the first groove 2311; when the second adhesive layer 232 has a second groove 2321 and the first adhesive layer 231 does not have a first groove 2311, the shielding layer 290 is used to shield the second groove 2321; when the first adhesive layer 231 has a first groove 2311 and the second adhesive layer 232 has a second groove 2321, the shielding layer 290 is used to shield both the first groove 2311 and the second groove 2321. The shielding layer 290 and the reflective coating layer 270 can be made of the same material.

[0176] The method for preparing the electrochromic device 200 provided in this embodiment involves providing a shielding layer 290 on the side of the cover plate 250 that is connected to the first adhesive layer 231. This shields the first groove 2311 and / or the second groove 2321, so that when the user looks at the electrochromic device 200 from one side of the cover plate 250, the first groove 2311 and / or the second groove 2321 cannot be observed, thus ensuring that the appearance of the electrochromic device 200 meets the quality requirements.

[0177] Please see Figures 3 to 6This application also provides an electrochromic device 200, which includes a first adhesive layer 231, a first conductive substrate layer 211, an electrochromic film 220, a second conductive substrate layer 212, and a second adhesive layer 232 stacked sequentially. The first conductive substrate layer 211 includes a first main body portion 2111 and a first bonding portion 2112 connected to each other. The first main body portion 2111 is connected between the first adhesive layer 231 and the electrochromic film 220. The first bonding portion 2112 protrudes from the outer peripheral surface of the electrochromic film 220 and is used to connect with the first lead electrode 241. The second conductive substrate layer 212 includes a second main body portion 2121 and a second bonding portion 2122 connected to each other. The second main body portion 2121 is connected between the second adhesive layer 232 and the electrochromic film 220. The second bonding portion 2122 protrudes from the outer peripheral surface of the electrochromic film 220 and is used for electrical connection with the second lead electrode 242. The first adhesive layer 231 has a first groove 2311 in the area corresponding to the position of the first bonding portion 2112. And / or, the second adhesive layer 232 has a second groove 2321 in the area corresponding to the position of the second bonding portion 2122.

[0178] Specifically, the electrochromic module can be implemented in several ways. In one implementation, the electrochromic film 220 includes a liquid crystal layer, which mainly changes the light intensity by causing the liquid crystal molecules to twist under the applied voltage. In another implementation, the electrochromic film 220 includes an ion storage layer 222, an electrolyte layer 223, and an electrochromic layer 221 stacked sequentially. With this configuration, the electrochromic film 220 changes the light intensity by changing its color under the applied voltage.

[0179] Specifically, the first groove 2311 can have various forms, for example, please refer to Figure 6 The first groove 2311 penetrates the outer peripheral surface of the first adhesive layer 231, and the first groove 2311 is open at both ends in the thickness direction of the first adhesive layer 231; for example, please refer to Figure 7 The first groove 2311 is a through hole disposed on the surface of the first adhesive layer 231 away from the first conductive substrate layer 211; for example, Figure 8 , Figure 9 and Figure 11 The first groove 2311 penetrates the outer peripheral surface of the first adhesive layer 231. The first groove 2311 is closed at one end and open at the other end in the thickness direction of the first adhesive layer 231; for example, please refer to... Figure 12 and Figure 13 The first groove 2311 penetrates the outer peripheral surface of the first adhesive layer 231, and the first groove 2311 is closed at both ends in the thickness direction of the first adhesive layer 231; for example, please refer to Figure 15The first groove 2311 is a blind hole provided on the surface of the first adhesive layer 231 near the first conductive substrate layer 211. Of course, the first groove 2311 can also be implemented in other ways, as long as the thickness of the first adhesive layer 231 on the side of the first bonding portion 2112 away from the electrochromic film 220 is zero or less than the thickness of the first adhesive layer 231 on the side of the first main body portion 2111 away from the electrochromic film 220 after the first groove 2311 is provided.

[0180] Similarly, the second groove 2321 can have various forms.

[0181] For example, please refer to Figure 6 The second groove 2321 penetrates the outer peripheral surface of the second adhesive layer 232, and the second groove 2321 is open at both ends in the thickness direction of the second adhesive layer 232; for example, please refer to Figure 7 The second groove 2321 is a through hole disposed on the surface of the second adhesive layer 232 away from the second conductive substrate layer 212; for example, please refer to Figure 8 , Figure 10 and Figure 11 The second groove 2321 penetrates the outer peripheral surface of the second adhesive layer 232, and the second groove 2321 is closed at one end and open at the other end in the thickness direction of the second adhesive layer 232; for example, please refer to Figure 12 and Figure 14 The second groove 2321 penetrates the outer peripheral surface of the second adhesive layer 232, and both ends of the second groove 2321 are closed in the thickness direction of the second adhesive layer 232; for example, please refer to Figure 15 The second groove 2321 is a blind hole provided on the surface of the second adhesive layer 232 near the second conductive substrate layer 212. Of course, the second groove 2321 can also be implemented in other ways, as long as the thickness of the second adhesive layer 232 on the side of the second bonding portion 2122 away from the electrochromic film 220 is zero or less than the thickness of the second adhesive layer 232 on the side of the second main body portion 2121 away from the electrochromic film 220 after the second groove 2321 is provided.

[0182] In this embodiment, when the first adhesive layer 231 has a first groove 2311, and the first lead electrode 241 (FPC) needs to be bound to the first binding part 2112, a first rigid support structure can be provided in the first groove 2311. This allows at least a portion of the first adhesive layer 231 below the pressing structure such as the pressure head to be replaced by the first rigid support structure. This reduces the buffering effect of the flexible first adhesive layer 231 on the binding operation, making the electrical connection between the first lead electrode 241 and the first binding part 2112 more stable and the bonding force better, thereby reducing the risk of open circuit in the electrochromic device 200. When a second groove 2321 is provided in the area corresponding to the second adhesive layer 232 and the second binding part 2122, when it is necessary to bind the second lead electrode 242 (FPC) to the second binding part 2122, a second rigid support structure can be provided in the second groove 2321. This allows at least a portion of the second adhesive layer 232 below the pressing structure such as the pressure head to be replaced by the second rigid support structure. This reduces the buffering effect of the flexible second adhesive layer 232 on the binding operation, making the electrical connection between the second lead electrode 242 and the second binding part 2122 more stable and the bonding force better, thereby reducing the risk of open circuit in the electrochromic device 200.

[0183] In another embodiment of this application, please refer to Figure 6 and Figure 7 As a specific implementation of the first groove 2311, the first groove 2311 penetrates through the first adhesive layer 231 along its thickness direction. With this configuration, when a clamping structure such as a pressure head is required to bind the first lead electrode 241 (FPC) to the first binding part 2112, a first rigid support structure with a height equal to the thickness of the first adhesive layer 231 can be provided within the first groove 2311. In this way, only the first binding part 2112 and the first rigid support structure exist below the pressure head or other clamping structure, completely avoiding the buffering effect of the first adhesive layer 231 from affecting the binding operation of the first lead electrode 241. This makes the electrical connection between the first lead electrode 241 and the first binding part 2112 more stable, thereby significantly reducing the risk of open circuit in the electrochromic device 200.

[0184] In another embodiment of this application, please refer to Figure 8 , Figure 9 and Figure 11 As another implementation of the first groove 2311, the first groove 2311 is closed at one end and open at the other end in the thickness direction of the first adhesive layer 231. The thickness H1 of the first adhesive layer 231 located at the closed end of the first groove 231 (see [reference]). Figure 9 (less than 100um)

[0185] In this embodiment, when the electrochromic device 200 needs to bind the first lead electrode 241 (FPC) to the first binding part 2112, a first rigid support structure can be provided in the first groove 2311. In this way, only the first rigid support structure and the first adhesive layer 231 with a thickness of less than 100 μm exist below the pressing structure such as the pressure head. This can better avoid the buffering effect of the first adhesive layer 231 on the binding operation, making the electrical connection between the first lead electrode 241 and the first binding part 2112 more stable, thereby reducing the risk of open circuit in the electrochromic device 200.

[0186] In another embodiment of this application, please refer to Figure 12 and Figure 13 As another implementation of the first groove 2311, the first groove 2311 is closed at both ends in the thickness direction of the first adhesive layer 231. The first groove 2311 penetrates the outer peripheral surface of the first adhesive layer 231, and the total thickness at the two closed ends of the first groove 2311 is less than 100 μm. In other words, please refer to... Figure 13 The sum of the thickness H2 of the first adhesive layer 231 located at one closed end of the first groove 2311 and the thickness H3 of the first adhesive layer 231 located at the other closed end of the first groove 2311 is less than 100um.

[0187] In this embodiment, when the electrochromic device 200 needs to bind the first lead electrode 241 (FPC) to the first binding part 2112, a first rigid support structure can be provided in the first groove 2311. In this way, only the first rigid support structure and the first adhesive layer 231 with a total thickness of less than 100 μm exist below the pressing structure such as the pressure head. This can better avoid the buffering effect of the first adhesive layer 231 on the binding operation, making the electrical connection between the first lead electrode 241 and the first binding part 2112 more stable, thereby reducing the risk of open circuit in the electrochromic device 200.

[0188] In another embodiment of this application, please refer to Figure 6 and Figure 7As a specific implementation of the second groove 2321, the second groove 2321 penetrates through the second adhesive layer 232 along the thickness direction of the second adhesive layer 232. With this configuration, when a clamping structure such as a pressure head is required to bind the second lead electrode 242 (FPC) to the second binding part 2122, a second rigid support structure with a height equal to the thickness of the second adhesive layer 232 can be provided in the second groove 2321. In this way, only the second binding part 2122 and the second rigid support structure exist below the clamping structure such as the pressure head, which can completely avoid the buffering effect of the second adhesive layer 232 from affecting the binding operation of the second lead electrode 242, making the electrical connection between the second lead electrode 242 and the second binding part 2122 more stable, thereby greatly reducing the risk of open circuit in the electrochromic device 200.

[0189] In another embodiment of this application, please refer to Figure 8 , Figure 10 and Figure 11 As another specific implementation of the second groove 2321, the second groove 2321 is closed at one end and open at the other end in the thickness direction of the second adhesive layer 232. The thickness H4 of the second adhesive layer 232 located at the closed end of the second groove 2321 (see [reference]). Figure 10 (less than 100um)

[0190] In this embodiment, when the second lead electrode 242 (FPC) needs to be bonded to the second bonding part 2122, a second rigid support structure can be provided in the second groove 2321. In this way, only the second rigid support structure and the second adhesive layer 232 with a thickness of less than 100 μm exist below the pressing structure such as the pressure head. This can better avoid the buffering effect of the second adhesive layer 232 on the bonding operation, making the electrical connection between the second lead electrode 242 and the second bonding part 2122 more stable, thereby reducing the risk of open circuit in the electrochromic device 200.

[0191] In another embodiment of this application, please refer to Figure 12 and Figure 14 As another specific implementation of the second groove 2321, the second groove 2321 is closed at both ends in the thickness direction of the second adhesive layer 232. The second groove 2321 penetrates the outer peripheral surface of the second adhesive layer 232, and the total thickness of the second adhesive layer 232 located at the two closed ends of the second groove 2321 is less than 100 μm. In other words, please refer to... Figure 14 The sum of the thickness H5 of the second adhesive layer 232 located at one closed end of the second groove 2321 and the thickness H6 of the second adhesive layer 232 located at the other closed end of the second groove 2321 is less than 100um.

[0192] In this embodiment, when the electrochromic device 200 needs to bind the second lead electrode 242 (FPC) to the second binding part 2122, a second rigid support structure can be provided in the second groove 2321. In this way, only the second rigid support structure and the second adhesive layer 232 with a total thickness of less than 100 μm exist below the pressing structure such as the pressure head. This can better avoid the buffering effect of the second adhesive layer 232 on the binding operation, making the electrical connection between the second lead electrode 242 and the second binding part 2122 more stable, thereby reducing the risk of open circuit in the electrochromic device 200.

[0193] In another embodiment of this application, as a specific implementation of the first conductive substrate layer 211, the first conductive substrate layer 211 includes a first substrate layer 2113 and a first conductive thin film layer 2114 sequentially stacked along a direction from away from the electrochromic film 220 to close to the electrochromic film 220 (this case is not shown in the figure). A portion of the first substrate layer 2113 and a portion of the first conductive thin film layer 2114 are located between the electrochromic film 220 and the first adhesive layer 231, forming a first main body portion 2111. Other portions of the first substrate layer 2113 and the first conductive thin film layer 2114 protrude beyond the outer peripheral surface of the electrochromic film 220, forming a first bonding portion 2112. At least a portion of the first conductive thin film layer 2114 protruding beyond the outer peripheral surface of the electrochromic film 220 is used to bond the first lead electrode 241. The orthographic projection of the first groove 2311 on the first substrate layer 2113 covers the orthographic projection of the first conductive thin film layer 2114 for bonding the first lead electrode 241 on the first substrate layer 2113.

[0194] Specifically, the first substrate layer 2113 can be a polyethylene glycol terephthalate (PET) film, and the first conductive thin film layer 2114 can be an indium tin oxide (ITO) conductive thin film.

[0195] In the electrochromic device 200 provided in this embodiment, since the orthographic projection of the first groove 2311 on the first substrate layer 2113 covers the orthographic projection of the first conductive thin film layer 2114 used for binding the first lead electrode 241 on the first substrate layer 2113, after the first rigid support structure is set in the first groove 2311 and the first lead electrode 241 is bound to the first conductive thin film layer 2114 using a pressing structure such as a pressure head, the area directly below the area on the first conductive thin film layer 2114 used for binding with the first lead electrode 241 can be supported by the first rigid support structure. In other words, the buffering effect of the first adhesive layer 231 can be avoided as much as possible from affecting the stability of binding the first lead electrode 241 on the first conductive thin film layer 2114.

[0196] In another embodiment of this application, please refer to Figure 6 and Figure 7 In another specific implementation of the first conductive substrate layer 211, the first conductive substrate layer 2111 includes a first substrate layer 2113, a first conductive thin film layer 2114, a first bus lead 2115, and a first insulating layer 2116. The first substrate layer 2113 and the first conductive thin film layer 2114 are stacked sequentially in a direction from away from the electrochromic film 220 to close to the electrochromic film 220. The first bus lead 2115 is disposed on the side of the first conductive thin film layer 2114 away from the first substrate layer 2113, and the first insulating layer 2116 covers a portion of the surface of the first bus lead 2115. A portion of the first substrate layer 2113, a portion of the first conductive thin film layer 2114, a portion of the first bus lead 2115, and the first insulating layer 2116 are all located between the first adhesive layer 231 and the electrochromic film 220, forming the first main body 2111. Other regions of the first substrate layer 2113, other regions of the first conductive thin film layer 2114, and other regions of the first busbar 2115 all protrude from the outer peripheral surface of the electrochromic film 220 and form a first bonding portion 2112. At least a portion of the first busbar 2115 protruding from the outer peripheral surface of the electrochromic film 220 is used to bond the first lead electrode 241. The orthographic projection of the first groove 2311 on the first substrate layer 2113 covers the orthographic projection of the first busbar 2115 used to bond the first lead electrode 241 on the first substrate layer 2113.

[0197] Specifically, the first substrate layer 2113 can be a polyethylene glycol terephthalate (PET) film, the first conductive film layer 2114 can be an indium tin oxide (ITO) conductive film, and the first bus lead 2115 can be a silver wire, copper wire, or other wire.

[0198] The electrochromic device 200 provided in this embodiment has several advantages. First, since the orthographic projection of the first groove 2311 on the first substrate layer 2113 covers the orthographic projection of the first busbar 2115 used for binding the first lead electrode 241 on the first substrate layer 2113, after the first rigid support structure is provided in the first groove 2311 and the first lead electrode 241 is bound to the first busbar 2115 using a pressing structure such as a pressure head, the area directly below the area on the first busbar 2115 used for binding with the first lead electrode 241 can be supported by the first rigid support structure. This means that the buffering effect of the first adhesive layer 231 can be minimized from affecting the stability of binding the first lead electrode 241 to the first busbar 2115. Second, by electrically connecting the first conductive thin film layer 2114 to the first lead electrode 241 through the first busbar 2115, the surface resistance of the first conductive thin film layer 2114 can be reduced, which is beneficial to improving the efficiency of the electrochromic device 200.

[0199] Preferably, please refer to Figure 9 The width W2 of the first busbar 2115 is about 1mm. The contact area between the pressure head and the first binding part 2112 is slightly larger than the width of the first busbar 2115, and can be set to 1mm-2mm. The dimension W1 of the first groove 2311 in the direction from the edge of the first adhesive layer 231 to the center can be set to 2mm-3mm.

[0200] In another embodiment of this application, as a specific implementation of the second conductive substrate layer 212, the second conductive substrate layer 212 includes a second substrate layer 2123 and a second conductive thin film layer 2124 sequentially stacked along a direction from away from the electrochromic film 220 to close to the electrochromic film 220. This case is not shown in the figures. In this case, a portion of the second substrate layer 2123 and a portion of the second conductive thin film layer 2124 are located between the electrochromic film 220 and the second adhesive layer 232, forming a second main body portion 2121; another portion of the second substrate layer 2123 and another portion of the second conductive thin film layer 2124 protrude from the outer peripheral surface of the electrochromic film 220, forming a second bonding portion 2122; at least a portion of the second conductive thin film layer 2124 protruding from the outer peripheral surface of the electrochromic film 220 is used to bond the second lead electrode 242. The projection of the second groove 2321 on the second base layer 2123 covers the projection of the second conductive thin film layer 2124 for bonding the second lead electrode 242 on the second base layer 2123.

[0201] Specifically, the second substrate layer 2123 can be a polyethylene glycol terephthalate (PET) film, and the second conductive film layer 2124 can be an indium tin oxide (ITO) conductive film.

[0202] In the electrochromic device 200 provided in this embodiment, since the projection of the second groove 2321 on the second base layer 2123 covers the projection of the second conductive thin film layer 2124 used for binding the second lead electrode 242 on the second base layer 2123, after the second rigid support structure is set in the second groove 2321 and the second lead electrode 242 is bound to the second conductive thin film layer 2124 using a pressing structure such as a pressure head, the area directly below the area on the second conductive thin film layer 2124 used for binding with the second lead electrode 242 can be supported by the second rigid support structure. In other words, the buffering effect of the second adhesive layer 232 can be avoided as much as possible from affecting the stability of binding the second lead electrode 242 on the second conductive thin film layer 2124.

[0203] In another embodiment of this application, please refer to Figure 6 and Figure 7 As another specific implementation of the second conductive substrate layer 212, the second conductive substrate layer 212 includes a second substrate layer 2123, a second conductive thin film layer 2124, a second bus lead 2125, and a second insulating layer 2126. The second substrate layer 2123 and the second conductive thin film layer 2124 are stacked sequentially in a direction from away from the electrochromic film 220 to close to the electrochromic film 220. The second bus lead 2125 is disposed on the side of the second conductive thin film layer 2124 away from the second substrate layer 2123. The second insulating layer 2126 covers part of the surface of the second bus lead 2125. A portion of the second base layer 2123, a portion of the second conductive thin film layer 2124, a portion of the second busbar 2125, and the second insulating layer 2126 are located between the second adhesive layer 232 and the electrochromic film 220, forming the second main body 2121. Other portions of the second base layer 2123, the second conductive thin film layer 2124, and the second busbar 2125 protrude from the outer peripheral surface of the electrochromic film 220, forming the second bonding portion 2122. At least a portion of the second busbar 2125 protruding from the outer peripheral surface of the electrochromic film 220 is used to bond the second lead electrode 242. The orthographic projection of the second groove 2321 on the second base layer 2123 covers the orthographic projection of the second busbar 2125 used to bond the second lead electrode 242 on the second base layer 2123.

[0204] Specifically, the second substrate layer 2123 can be a polyethylene glycol terephthalate (PET) film, and the second conductive film layer 2124 can be an indium tin oxide (ITO) conductive film. The second bus leads 2125 can all be silver wires, copper wires, or other conductive wires.

[0205] The electrochromic device 200 provided in this embodiment has the following advantages: Firstly, since the orthographic projection of the second groove 2321 on the second base layer 2123 covers the orthographic projection of the second busbar 2125 used for binding the second lead electrode 242 on the second base layer 2123, after the second rigid support structure is provided in the second groove 2321, and the second lead electrode 242 is bound to the second busbar 2125 using a pressing structure such as a pressure head, the area directly below the region on the second busbar 2125 used for binding with the second lead electrode 242 can be supported by the second rigid support structure. This means that the buffering effect of the second adhesive layer 232 can be minimized from affecting the second lead electrode 242. On the one hand, the stability of the second lead electrode 242 is improved by binding the second bus lead 2125 to the second lead electrode 242. On the other hand, the electrical connection between the second conductive thin film layer 2124 and the second lead electrode 242 through the second bus lead 2125 can reduce the surface resistance of the second conductive thin film layer 2124, which is beneficial to reduce the power loss of the electrochromic device 200. Furthermore, since the electrochromic film 220 between the first conductive substrate layer 211 and the second conductive substrate layer 212 is relatively thin, the provision of the first insulating layer 2116 and the second insulating layer 2126 can also minimize the discharge phenomenon between the first bus lead 2115 and the second bus lead 2125 when they are arranged opposite each other.

[0206] Preferably, please refer to Figure 10 The width W4 of the second busbar 2125 is about 1mm. The contact area between the pressure head and the second binding part 2122 is slightly larger than the width of the second busbar 2125, and can be set to 1mm-2mm. The dimension W3 of the second groove 2321 in the direction from the edge of the second adhesive layer 232 to the center can be set to 2mm-3mm.

[0207] In another embodiment of this application, please refer to Figures 6 to 8 , Figure 11 , Figure 12 as well as Figures 15 to 17The electrochromic device 200 also includes a cover plate 250 and a back plate 260. The cover plate 250 is disposed on the side of the first adhesive layer 231 away from the first conductive substrate layer 211, and the back plate 260 is disposed on the side of the second adhesive layer 232 away from the second conductive substrate layer 212. The cover plate 250 and the back plate 260 can respectively support the two sides of the electrochromic film 220, so that the electrochromic film 220 is more convenient to use and less prone to damage.

[0208] Specifically, both the cover plate 250 and the back plate 260 can be configured as light-transmitting structures.

[0209] In another embodiment of this application, please refer to Figures 6 to 8 , Figure 11 , Figure 12 as well as Figures 15 to 17 The electrochromic device 200 also includes a shielding layer 290, which is disposed on the side of the cover plate 250 near the back plate 260. The orthographic projection of the shielding layer 290 on the cover plate 250 covers the orthographic projection of the first groove 2311 on the cover plate 250 and / or the orthographic projection of the second groove 2321 on the cover plate 250.

[0210] The electrochromic device 200 provided in this embodiment can block the first groove 2311 and / or the second groove 2321 by providing a shielding layer 290 on the side of the cover plate 250 that is connected to the first adhesive layer 231. When the user looks at the electrochromic device 200 from one side of the cover plate 250, the first groove 2311 and / or the second groove 2321 cannot be observed, thus ensuring that the appearance of the electrochromic device 200 meets the quality requirements.

[0211] In another embodiment of this application, please refer to Figure 16 and Figure 17 The electrochromic device 200 also includes a sealant layer 280, which, together with the cover plate 250 and the back plate 260, forms a sealed cavity. The sealed cavity is used to accommodate the first adhesive layer 231, the first conductive substrate layer 211, the electrochromic film 220, the second conductive substrate layer 212, and the second adhesive layer 232.

[0212] Specifically, please refer to Figure 16 The shape of the outer contour of the cover plate 250 can be set to be the same as the shape of the outer contour of the back plate 260, and the size of the outer contour of the cover plate 250 can be set to be the same as the size of the outer contour of the back plate 260. Correspondingly, the sealant layer 280 is connected between the surface of the cover plate 250 facing the back plate 260 and the surface of the back plate 260 facing the cover plate 250.

[0213] The electrochromic device 200 provided in this embodiment, by providing a sealing layer 280, can seal the first adhesive layer 231, the first conductive substrate layer 211, the electrochromic film 220, the second conductive substrate layer 212, and the second adhesive layer 232 together with the cover plate 250 and the back plate 260, thereby effectively preventing water, oxygen, etc. from seeping into the periphery of the electrochromic device 200, and thus extending the service life of the electrochromic device 200.

[0214] In another embodiment of this application, please refer to Figure 17 The orthographic projection of the cover plate 250 onto the back plate 260 covers and extends beyond the back plate 260. One end of the sealant layer 280 is connected to the surface of the cover plate 250 facing the back plate 260, and the other end of the sealant layer 280 is connected to the surface of the back plate 260 facing the cover plate 250 and / or the outer peripheral surface of the back plate 260.

[0215] The electrochromic device 200 provided in this embodiment has a back plate 260 that is smaller than the cover plate 250. The sealant layer 280 can not only bond to the surface of the back plate 260 facing the cover plate 250, but also to the outer peripheral surface of the back plate 260. When the sealant layer 280 is a light-curing adhesive, the light-receiving area of ​​the sealant layer 280 during the sealing process can be increased, the curing time required can be reduced, and the fullness and effectiveness of its curing can be improved, thereby improving the sealing performance of the electrochromic device 200.

[0216] In another embodiment of this application, the middle portion of the cover plate 250 protrudes away from the back plate 260, and the middle portion of the back plate 260 protrudes towards the cover plate 250. The curvature of the cover plate 250 is greater than the curvature of the back plate 260, and the thickness of the first adhesive layer 231 is greater than the thickness of the second adhesive layer 232. This case is not shown in the figure.

[0217] Since the first adhesive layer 231 is bonded to the concave surface of the cover plate 250 and the second adhesive layer 232 is bonded to the convex surface of the back plate 260, it is easier to bond the second adhesive layer 232 flatly to the back plate 260. Therefore, after the first adhesive layer 231, the first conductive substrate layer 211, the electrochromic film 220, the second conductive substrate layer 212, and the second adhesive layer 232 are stacked in sequence, preferably, the release film of the second adhesive layer 232 can be removed first, and then the second adhesive layer 232 can be bonded to the convex surface of the back plate 260. Then, the release film of the first adhesive layer 231 can be removed, and then the first adhesive layer 231 can be bonded to the concave surface of the cover plate 250.

[0218] In addition, since the first adhesive layer 231, the first conductive substrate layer 211, the electrochromic film 220, the second conductive substrate layer 212, and the second adhesive layer 232 are generally flexible and can conform to the shape of the back plate 260 through deformation, the thickness of the second adhesive layer 232 does not need to be very thick. However, after the second adhesive layer 232 is bonded to the back plate 260, since the back plate 260 usually cannot deform, when the first adhesive layer 231 is bonded to the cover plate 250, the first adhesive layer 231 can no longer deform significantly due to the restriction of the back plate 260. At this time, the bonding between it and the cover plate 250 is more difficult. Therefore, in order to improve the bonding effect and prevent the generation of bubbles, the thickness of the first adhesive layer 231 used here is relatively thick, which is beneficial to improve the bonding effect.

[0219] Preferably, when the maximum gap width between the back plate 260 and the cover plate 250 is 120µm, the thickness of the first adhesive layer 231 is 200µm-250µm, and the thickness of the second adhesive layer 232 can be set to be less than or equal to 25µm to obtain a better bonding effect.

[0220] Please see Figures 3 to 6 In another embodiment of this application, a rearview mirror is also provided, the rearview mirror including a reflective coating 270 and the electrochromic device 200 described above. The reflective coating 270 is disposed on the side of the back plate 260 near the second conductive substrate layer 212 or on the side of the back plate 260 away from the second conductive substrate layer 212.

[0221] Since the rearview mirror provided in this embodiment includes the electrochromic device 200, the first lead electrode 241 of the rearview mirror provided in this embodiment can be stably bound to the first conductive substrate layer 211, and the second lead electrode 242 can be stably bound to the second conductive substrate layer 212, so that the rearview mirror can stably play the role of preventing glare from strong light.

[0222] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A method for preparing an electrochromic device, characterized in that, The method for preparing the electrochromic device includes: A first conductive substrate layer and a second conductive substrate layer are provided. The first conductive substrate layer includes a first main body portion and a first bonding portion connected to each other. The second conductive substrate layer includes a second main body portion and a second bonding portion connected to each other. An electrochromic film is formed between the first main body portion and the second main body portion, such that both the first binding portion and the second binding portion protrude from the outer peripheral surface of the electrochromic film. A first adhesive layer is disposed on the surface of the first conductive substrate layer away from the electrochromic film, and a second adhesive layer is disposed on the surface of the second conductive substrate layer away from the electrochromic film; a first groove is disposed on the first adhesive layer, the orthographic projection of the first groove on the first conductive substrate layer at least covers a portion of the first bonding portion, and a first rigid support structure is disposed in the first groove; and / or, a second groove is disposed on the second adhesive layer, the orthographic projection of the second groove on the second conductive substrate layer at least covers a portion of the second bonding portion, and a second rigid support structure is disposed in the second groove; A first lead electrode is attached to the first binding part, and a second lead electrode is attached to the second binding part.

2. The method for preparing the electrochromic device according to claim 1, characterized in that, The method of providing a first adhesive layer on the surface of the first conductive substrate layer away from the electrochromic film, and providing a second adhesive layer on the surface of the second conductive substrate layer away from the electrochromic film; providing a first groove on the first adhesive layer, wherein the orthographic projection of the first groove on the first conductive substrate layer at least covers a portion of the first bonding portion, and providing a first rigid support structure within the first groove; and / or providing a second groove on the second adhesive layer, wherein the orthographic projection of the second groove on the second conductive substrate layer at least covers a portion of the second bonding portion, and providing a second rigid support structure within the second groove includes: Provide a first adhesive layer and a second adhesive layer; The first adhesive layer is bonded to the side of the first conductive substrate away from the electrochromic film, and the second adhesive layer is bonded to the side of the second conductive substrate away from the electrochromic film. A first groove is provided on the first adhesive layer, the orthographic projection of the first groove on the first conductive substrate layer at least covers a portion of the first bonding portion, and the first groove at least penetrates the outer peripheral surface of the first adhesive layer or the surface of the first adhesive layer away from the electrochromic film, and a first rigid support structure is provided in the first groove; and / or, a second groove is provided on the second adhesive layer, the orthographic projection of the second groove on the second conductive substrate layer at least covers a portion of the second bonding portion, and the second groove at least penetrates the outer peripheral surface of the second adhesive layer or the surface of the second adhesive layer away from the electrochromic film, and a second rigid support structure is provided in the second groove.

3. The method for preparing the electrochromic device according to claim 1, characterized in that, The method includes: a first adhesive layer is disposed on the surface of the first conductive substrate layer away from the electrochromic film; a second adhesive layer is disposed on the surface of the second conductive substrate layer away from the electrochromic film; a first groove is disposed on the first adhesive layer, the orthographic projection of the first groove on the first conductive substrate layer at least covers a portion of the first bonding portion; a first rigid support structure is disposed within the first groove; and / or, a second groove is disposed on the second adhesive layer, the orthographic projection of the second groove on the second conductive substrate layer at least covers a portion of the second bonding portion; a second rigid support structure is disposed within the second groove. Provide a first adhesive layer and a second adhesive layer; A first groove is provided on the first adhesive layer, the first groove penetrating at least through the outer peripheral surface or one side surface of the first adhesive layer, the first adhesive layer is bonded to the side of the first conductive substrate away from the electrochromic film, the first groove remains open, and the orthographic projection of the first groove on the first conductive substrate at least covers a portion of the first bonding portion, a first rigid support structure is provided in the first groove; and / or, a second groove is provided on the second adhesive layer, the second groove penetrating at least through the outer peripheral surface or one side surface of the second adhesive layer, the second adhesive layer is bonded to the side of the second conductive substrate away from the electrochromic film, the second groove remains open, and the orthographic projection of the second groove on the second conductive substrate at least covers a portion of the second bonding portion, a second rigid support structure is provided in the second groove.

4. The method for preparing the electrochromic device according to claim 1, characterized in that, The method includes: a first adhesive layer is disposed on the surface of the first conductive substrate layer away from the electrochromic film; a second adhesive layer is disposed on the surface of the second conductive substrate layer away from the electrochromic film; a first groove is disposed on the first adhesive layer, the orthographic projection of the first groove on the first conductive substrate layer at least covers a portion of the first bonding portion; a first rigid support structure is disposed within the first groove; and / or, a second groove is disposed on the second adhesive layer, the orthographic projection of the second groove on the second conductive substrate layer at least covers a portion of the second bonding portion; a second rigid support structure is disposed within the second groove. Provide a first adhesive layer and a second adhesive layer; A first groove is provided on the first adhesive layer, and a first rigid support structure is provided in the first groove. The first adhesive layer is bonded to the side of the first conductive substrate away from the electrochromic film, and the orthogonal projection of the first groove on the first conductive substrate covers at least a portion of the first bonding portion; and / or, a second groove is provided on the second adhesive layer, and a second rigid support structure is provided in the second groove. The second adhesive layer is bonded to the side of the second conductive substrate away from the electrochromic film, and the orthogonal projection of the second groove on the second conductive substrate covers at least a portion of the second bonding portion.

5. The method for preparing the electrochromic device according to claim 1, characterized in that, The system provides a first conductive substrate layer and a second conductive substrate layer. The first conductive substrate layer includes a first main body portion and a first bonding portion connected to each other. The second conductive substrate layer includes a second main body portion and a second bonding portion connected to each other. A first substrate layer is provided, and a first conductive thin film layer is disposed on the first substrate layer; the first conductive thin film layer includes a first body region and a first bonding region that are electrically connected, the first body region and the first substrate layer for carrying the first body region form a first body portion, and the first bonding region and the first substrate layer for carrying the first bonding region form a first bonding portion; A second substrate layer is provided, and a second conductive thin film layer is disposed on the second substrate layer; the second conductive thin film layer includes a second body region and a second bonding region that are electrically connected, the second body region and the second substrate layer for carrying the second body region form a second body portion, and the second bonding region and the second substrate layer for carrying the second bonding region form a second bonding portion; Alternatively, the provision of a first conductive substrate layer and a second conductive substrate layer, wherein the first conductive substrate layer includes a first body portion and a first bonding portion connected to each other, and the second conductive substrate layer includes a second body portion and a second bonding portion connected to each other, comprising: A first substrate layer is provided, and a first conductive thin film layer is disposed on the first substrate layer. The first conductive thin film layer includes a first body region and a first bonding region that are electrically connected. A first bus lead is disposed on the first body region and the first bonding region. A first insulating layer is coated on the surface of the first bus lead disposed on the first body region. The first body region, the first substrate layer for carrying the first body region, the first bus lead disposed on the first body region, and the first insulating layer form a first body portion. The first bonding region, the first substrate layer for carrying the first bonding region, and the first bus lead disposed on the first bonding region form a first bonding portion. A second substrate layer is provided, and a second conductive thin film layer is disposed on the second substrate layer. The second conductive thin film layer includes a second body region and a second bonding region that are electrically connected. A second bus lead is disposed on the second body region and the second bonding region. A second insulating layer is coated on the surface of the second bus lead disposed on the second body region. The second body region, the second substrate layer for carrying the second body region, the second bus lead disposed on the second body region, and the second insulating layer form a second body portion. The second bonding region, the second substrate layer for carrying the second bonding region, and the second bus lead disposed on the second bonding region form a second bonding portion.

6. The method for preparing the electrochromic device according to claim 5, characterized in that, The step of forming an electrochromic film between the first main body portion and the second main body portion, such that both the first bonding portion and the second bonding portion protrude from the outer peripheral surface of the electrochromic film, includes: An electrochromic layer is coated on the conductive side of the first conductive substrate layer, and an ion storage layer is coated on the conductive side of the second conductive substrate layer; or, an ion storage layer is coated on the conductive side of the first conductive substrate layer, and an electrochromic layer is coated on the conductive side of the second conductive substrate layer. The electrochromic layer and the ion storage layer are arranged opposite each other with a predetermined gap. An electrolyte is dropped into the predetermined gap and the electrolyte is solidified into an electrolyte layer. The electrolyte layer, the ion storage layer, and the electrochromic layer form the electrochromic film. The electrochromic film and the second conductive substrate layer corresponding to the position of the first bonding portion are removed by partial cutting, so that the first bonding portion protrudes from the outer peripheral surface of the electrochromic film and the outer peripheral surface of the second conductive substrate layer. The electrochromic film and the first conductive substrate layer corresponding to the position of the second bonding portion are removed by partial cutting, so that the second bonding portion protrudes from the outer peripheral surface of the electrochromic film and the outer peripheral surface of the first conductive substrate layer.

7. The method for preparing the electrochromic device according to claim 1, characterized in that, The method for preparing the electrochromic device further includes: A cover plate and a back plate are provided. The cover plate is disposed on the surface of the first adhesive layer away from the first conductive substrate layer, and the back plate is disposed on the surface of the second adhesive layer away from the second conductive substrate layer. A sealant layer is disposed between the cover plate and the back plate, such that the sealant layer, the cover plate, and the back plate together form a sealed cavity capable of accommodating the first adhesive layer, the first conductive substrate layer, the electrochromic film, the second conductive substrate layer, and the second adhesive layer, and the sealant layer is cured.

8. The method for preparing the electrochromic device according to claim 7, characterized in that, Before the cover plate is disposed on the surface of the first adhesive layer away from the first conductive substrate layer, a shielding layer is disposed on the side of the cover plate for connection with the first adhesive layer. The shielding layer can shield the first groove and / or the second groove when the cover plate and the shielding layer are disposed together on the side of the first adhesive layer away from the first conductive substrate layer.

9. The method for preparing the electrochromic device according to claim 7, characterized in that, The method provides a cover plate and a back plate, wherein the cover plate is disposed on the surface of the first adhesive layer away from the first conductive substrate layer, and the back plate is disposed on the surface of the second adhesive layer away from the second conductive substrate layer. A sealant layer is disposed between the cover plate and the back plate, such that the sealant layer, the cover plate, and the back plate together form a sealed cavity capable of accommodating the first adhesive layer, the first conductive substrate layer, the electrochromic film, the second conductive substrate layer, and the second adhesive layer. The method further includes curing the sealant layer. A cover plate and a back plate are provided, wherein the orthographic projection of the cover plate onto the back plate covers and extends beyond the back plate; The cover plate is disposed on the surface of the first adhesive layer away from the first conductive substrate layer, and the back plate is disposed on the surface of the second adhesive layer away from the second conductive substrate layer; A sealant layer is provided between the cover plate and the back plate, such that one side of the sealant layer is bonded to the surface of the cover plate facing the back plate, and the other side of the sealant layer is bonded to the surface of the back plate facing the cover plate and / or the outer peripheral surface of the back plate, so that the sealant layer, the cover plate and the back plate together form a sealed cavity, and the sealant layer is cured. Alternatively, the method of providing a cover plate and a back plate involves placing the cover plate on the surface of the first adhesive layer away from the first conductive substrate layer, placing the back plate on the surface of the second adhesive layer away from the second conductive substrate layer, and providing a sealant layer between the cover plate and the back plate, such that the sealant layer, the cover plate, and the back plate together form a sealed cavity capable of accommodating the first adhesive layer, the first conductive substrate layer, the electrochromic film, the second conductive substrate layer, and the second adhesive layer, and curing the sealant layer, including: A cover plate and a back plate are provided, wherein the shape and size of the outer contour of the cover plate are the same as the shape and size of the outer contour of the back plate; The cover plate is disposed on the surface of the first adhesive layer away from the first conductive substrate layer, and a sealant layer is disposed on the surface of the cover plate facing the first adhesive layer. The back plate is disposed on the surface of the second adhesive layer away from the second conductive substrate layer and bonded to the sealant layer, so that the cover plate, the back plate, and the sealant layer together form a sealed cavity; or; the back plate is disposed on the surface of the second adhesive layer away from the second conductive substrate layer, and a sealant layer is disposed on the surface of the back plate facing the second adhesive layer. The cover plate is disposed on the surface of the first adhesive layer away from the first conductive substrate layer. The first conductive substrate layer is bonded to the surface of the first adhesive layer and to the sealant layer, so that the cover plate, the back plate, and the sealant layer together form a sealed cavity; or, the cover plate is disposed on the surface of the first adhesive layer away from the first conductive substrate layer, the back plate is disposed on the surface of the second adhesive layer away from the second conductive substrate layer, and a sealant layer is disposed between the cover plate and the back plate, so that the sealant layer connects the surface of the cover plate facing the back plate and the surface of the back plate facing the cover plate, so that the cover plate, the back plate, and the sealant layer together form a sealed cavity; The sealant layer is cured.

10. The method for preparing the electrochromic device according to claim 1, characterized in that, The first rigid support structure is made of one or more of glass, ceramic, metal, and wood; and / or the second rigid support structure is made of one or more of glass, ceramic, metal, and wood.

11. The method for preparing the electrochromic device according to claim 10, characterized in that, The first rigid support structure includes at least one of a quartz glass strip, a quartz glass plate, a quartz glass sphere, and a quartz glass tube; and / or, the second rigid support structure includes at least one of a quartz glass strip, a quartz glass plate, a quartz glass sphere, and a quartz glass tube.

12. An electrochromic device, characterized in that, The electrochromic device includes a first adhesive layer, a first conductive substrate layer, an electrochromic film, a second conductive substrate layer, and a second adhesive layer stacked sequentially. The first conductive substrate layer includes a first main body portion and a first bonding portion connected together. The first main body portion is connected between the first adhesive layer and the electrochromic film, and the first bonding portion protrudes from the outer peripheral surface of the electrochromic film and is used for electrical connection with a first lead-out electrode. The second conductive substrate layer includes a second main body portion and a second bonding portion connected together. The second main body portion is connected between the second adhesive layer and the electrochromic film, and the second bonding portion protrudes from the outer peripheral surface of the electrochromic film and is used for electrical connection with a second lead-out electrode. Wherein, the first adhesive layer is provided with a first groove, the orthographic projection of the first groove on the first conductive substrate layer at least covers a portion of the first bonding portion, and a first rigid support structure is provided in the first groove; and / or, the second adhesive layer is provided with a second groove, the orthographic projection of the second groove on the second conductive substrate layer at least covers a portion of the second bonding portion, and a second rigid support structure is provided in the second groove.

13. The electrochromic device according to claim 12, characterized in that, The first groove penetrates the first adhesive layer along the thickness direction of the first adhesive layer; and / or, the second groove penetrates the second adhesive layer along the thickness direction of the second adhesive layer.

14. The electrochromic device according to claim 12, characterized in that, The first groove is closed at one end and open at the other end in the thickness direction of the first adhesive layer, and the thickness of the first adhesive layer at the closed end of the first groove is less than 100 μm; and / or, the second groove is closed at one end and open at the other end in the thickness direction of the second adhesive layer, and the thickness of the second adhesive layer at the closed end of the second groove is less than 100 μm.

15. The electrochromic device according to claim 12, characterized in that, The first groove is closed at both ends in the thickness direction of the first adhesive layer, the first groove penetrates the outer peripheral surface of the first adhesive layer, and the total thickness of the first adhesive layer at the two closed ends of the first groove is less than 100 μm; and / or, the second groove is closed at both ends in the thickness direction of the second adhesive layer, the second groove penetrates the outer peripheral surface of the second adhesive layer, and the total thickness of the second adhesive layer at the two closed ends of the second groove is less than 100 μm.

16. The electrochromic device according to claim 12, characterized in that, The first conductive substrate layer includes a first substrate layer and a first conductive thin film layer sequentially stacked along a direction from away from the electrochromic film to close to the electrochromic film. A portion of the first substrate layer and a portion of the first conductive thin film layer are located between the electrochromic film and the first adhesive layer and form the first main body portion. Another portion of the first substrate layer and another portion of the first conductive thin film layer protrude from the outer peripheral surface of the electrochromic film and form the first bonding portion. At least a portion of the first conductive thin film layer protruding from the outer peripheral surface of the electrochromic film is used to bond the first lead electrode. The orthographic projection of the first groove on the first substrate layer covers the orthographic projection of the first conductive thin film layer used to bond the first lead electrode on the first substrate layer. And / or, the second conductive substrate layer includes a second substrate layer and a second conductive thin film layer sequentially stacked along a direction from away from the electrochromic film to close to the electrochromic film. A portion of the second substrate layer and a portion of the second conductive thin film layer are located between the electrochromic film and the second adhesive layer and form the second main body portion. Another portion of the second substrate layer and another portion of the second conductive thin film layer protrude from the outer peripheral surface of the electrochromic film and form the second bonding portion. At least a portion of the second conductive thin film layer protruding from the outer peripheral surface of the electrochromic film is used to bond the second lead electrode. The orthographic projection of the second groove on the second substrate layer covers the orthographic projection of the second conductive thin film layer used to bond the second lead electrode on the second substrate layer.

17. The electrochromic device according to claim 12, characterized in that, The first conductive substrate layer includes a first substrate layer, a first conductive thin film layer, a first bus lead, and a first insulating layer. The first substrate layer and the first conductive thin film layer are stacked sequentially from away from the electrochromic film to near the electrochromic film. The first bus lead is disposed on the side of the first conductive thin film layer away from the first substrate layer. The first insulating layer covers a portion of the surface of the first bus lead. A portion of the first substrate layer, a portion of the first conductive thin film layer, a portion of the first bus lead, and the first insulating layer are located between the first adhesive layer and the electrochromic film and form the first main body portion. Another portion of the first substrate layer, another portion of the first conductive thin film layer, and another portion of the first bus lead protrude from the outer peripheral surface of the electrochromic film and form the first bonding portion. At least a portion of the first bus lead protruding from the outer peripheral surface of the electrochromic film is used to bond the first lead electrode. The orthographic projection of the first groove on the first substrate layer covers the orthographic projection of the first bus lead used to bond the first lead electrode on the first substrate layer. And / or, the second conductive substrate layer includes a second substrate layer, a second conductive thin film layer, a second bus lead, and a second insulating layer. The second substrate layer and the second conductive thin film layer are stacked sequentially in a direction from away from the electrochromic film to close to the electrochromic film. The second bus lead is disposed on the side of the second conductive thin film layer away from the second substrate layer. The second insulating layer covers a portion of the surface of the second bus lead. A portion of the second substrate layer, a portion of the second conductive thin film layer, a portion of the second bus lead, and the second insulating layer are located between the second adhesive layer and the electrochromic film and form the second main body portion. Another portion of the second substrate layer, another portion of the second conductive thin film layer, and another portion of the second bus lead protrude from the outer peripheral surface of the electrochromic film and form the second bonding portion. At least a portion of the second bus lead protruding from the outer peripheral surface of the electrochromic film is used to bond the second lead electrode. The orthographic projection of the second groove on the second substrate layer covers the orthographic projection of the second bus lead used to bond the second lead electrode on the second substrate layer.

18. The electrochromic device according to any one of claims 12-17, characterized in that, The electrochromic device further includes a cover plate and a back plate. The cover plate is disposed on the side of the first adhesive layer away from the first conductive substrate layer, and the back plate is disposed on the side of the second adhesive layer away from the second conductive substrate layer.

19. The electrochromic device according to claim 18, characterized in that, The electrochromic device further includes a shielding layer disposed on the side of the cover plate near the back plate, wherein the orthographic projection of the shielding layer on the cover plate covers the orthographic projection of the first groove on the cover plate and / or the orthographic projection of the second groove on the cover plate.

20. The electrochromic device according to claim 18, characterized in that, The electrochromic device further includes a sealant layer, and the sealant layer, the cover plate, and the back plate together form a sealed cavity, which is used to accommodate the first adhesive layer, the first conductive substrate layer, the electrochromic film, the second conductive substrate layer, and the second adhesive layer.

21. The electrochromic device according to claim 20, characterized in that, The orthographic projection of the cover plate onto the back plate coincides with the back plate, and the sealant layer is connected between the surface of the cover plate facing the back plate and the surface of the back plate facing the cover plate; or, the orthographic projection of the cover plate onto the back plate covers and extends beyond the back plate, one end of the sealant layer is connected to the surface of the cover plate facing the back plate, and the other end of the sealant layer is connected to the surface of the back plate facing the cover plate and / or the outer peripheral surface of the back plate.

22. The electrochromic device according to claim 18, characterized in that, The middle portion of the cover plate protrudes away from the back plate, and the middle portion of the back plate protrudes towards the cover plate. The curvature of the cover plate is greater than that of the back plate, and the thickness of the first adhesive layer is greater than that of the second adhesive layer.

23. A rearview mirror, characterized in that, The rearview mirror includes a reflective coating and an electrochromic device as described in any one of claims 18-22, wherein the reflective coating is disposed on the side of the back panel near the second adhesive layer or on the side of the back panel away from the second adhesive layer.

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