Via inspection method, device, tool, electronic equipment and readable storage medium

Abstract

This invention provides a via inspection method, apparatus, tool, electronic device, and readable storage medium. The via inspection method includes: acquiring the design file corresponding to the printed circuit board (PCB); determining the correspondence between the via diameter value range and the via diameter tolerance, as well as the via design parameters, based on the design file; creating a via tolerance database based on the correspondence between the via diameter value range and the via diameter tolerance; creating a database of areas to be inspected corresponding to a target inspection area based on the via design parameters; determining inspection rule values ​​corresponding to the target inspection area based on the target inspection area; and determining the via inspection result based on the via tolerance database and / or the database of areas to be inspected, and the inspection rule values. This improves the inspection efficiency and accuracy of the via inspection process, avoids signal distortion and short-circuit burn-out problems caused by incorrect via usage, and thus improves the design quality of printed circuit board products.

Description

Technical Field

[0001] This invention relates to the field of computer technology, and more particularly to a via inspection method, apparatus, tool, electronic device, and readable storage medium. Background Technology

[0002] Printed Circuit Boards (PCBs) are a crucial component of servers, and the number of components and trace density on them continue to increase with the improvement of server performance. In double-sided and multi-layer PCBs, vias are inevitably needed at the intersections of the traces that need to be connected between layers to connect the printed conductors. When drilling PCBs, due to limitations in manufacturing processes, the tolerances of the vias produced on the PCB are easily too large. With excessively large via tolerances, short circuits and board burn-out quality problems can easily occur in the power supply area. At the same time, when the wall of a via is far from the walls of other vias, in high-density areas (BGA, Ball Grid Array), the lack of a reference return path for the signal can easily lead to sudden changes in signal impedance, causing signal distortion quality problems.

[0003] Due to the aforementioned quality issues, printed circuit boards typically use vias with different parameters in different application scenarios. Currently, vias are mainly inspected manually based on different usage scenarios to prevent short circuits and signal distortion.

[0004] However, as the density of components and traces on printed circuit boards continues to increase, the number of vias on printed circuit boards also continues to grow. Manual visual inspection is not only inefficient but also prone to missed or false detections, making it impossible to guarantee inspection efficiency and accuracy. Summary of the Invention

[0005] This invention provides a via inspection method, apparatus, tool, electronic device, and readable storage medium to solve the problems of low efficiency and low accuracy in via inspection in related technologies.

[0006] To address the aforementioned technical problems, embodiments of the present invention provide a via inspection method, comprising:

[0007] Obtain the design file corresponding to the printed circuit board, and determine the correspondence between the aperture value range and aperture tolerance of the via in the printed circuit board and the via design parameters based on the design file;

[0008] Based on the correspondence between the aperture value range and the aperture tolerance, a through-hole tolerance database is created;

[0009] Based on the via design parameters, create a database of areas to be inspected corresponding to the target inspection area;

[0010] Based on the target inspection area, determine the inspection rule value corresponding to the target inspection area;

[0011] The via inspection result is determined based on the via tolerance database and / or the area to be inspected database, as well as the inspection rule value.

[0012] Optionally, the step of creating a bore tolerance database based on the correspondence between the bore diameter value range and the bore diameter tolerance includes:

[0013] Based on the aperture tolerance, determine the positive aperture tolerance of the aperture tolerance;

[0014] Based on the correspondence between the aperture value range and the aperture tolerance, when the positive aperture tolerance is the same, the aperture value range corresponding to the positive aperture tolerance is determined;

[0015] The aperture value ranges are merged;

[0016] A through-hole tolerance database is created based on the correspondence between the merged aperture value range and the positive aperture tolerance.

[0017] Optionally, creating a database of areas to be inspected corresponding to the target inspection area based on the via design parameters includes:

[0018] Based on the via design parameters, target via design parameters corresponding to the target inspection area are extracted from the via design parameters; the target via design parameters include some or all of the parameters in the via design parameters.

[0019] Based on the target via design parameters, create a database of areas to be inspected corresponding to the target inspection area.

[0020] Optionally, the target inspection area includes a power supply area and a high-density area;

[0021] The step of extracting the target via design parameters corresponding to the target inspection area from the via design parameters includes:

[0022] When the target inspection area is a power area, the first coordinates, drilling radius and first isolation zone radius of the first via corresponding to the power area are extracted from the via design parameters according to the via design parameters and determined as the first target via design parameters.

[0023] When the target inspection area is a high-density area, according to the via design parameters, the second coordinates, copper ring radius and second isolation area radius of the second via corresponding to the high-density area are extracted from the via design parameters and used as the second target via design parameters.

[0024] The step of creating a database of areas to be inspected corresponding to the target inspection area based on the target via design parameters includes:

[0025] Based on the design parameters of the first target via, a first inspection area database corresponding to the power supply area is created;

[0026] Based on the design parameters of the second target via, a second database of areas to be inspected corresponding to the high-density area is created.

[0027] Optionally, the target inspection area includes a power area and a high-density area; the inspection area database includes a first inspection area database and a second inspection area database; the inspection rule values ​​include the power area inspection rule values ​​corresponding to the power area and the high-density area inspection rule values ​​corresponding to the high-density area.

[0028] The step of determining the via inspection result based on the via tolerance database and / or the area to be inspected database, and the inspection rule value, includes:

[0029] When the target inspection area is a power supply area, the via inspection result is determined based on the via tolerance database, the first inspection area database, and the power supply area inspection rule value.

[0030] If the target inspection area is a high-density area, the via inspection result is determined based on the second inspection area database and the high-density area inspection rule value.

[0031] Optionally, determining the via inspection result based on the via tolerance database, the first inspection area database, and the power area inspection rule value includes:

[0032] When the target inspection area is the power supply area, the hole diameter value range corresponding to the hole radius is queried in the through hole tolerance database according to the hole radius in the first inspection area database.

[0033] Based on the aperture value range, determine the aperture tolerance corresponding to the aperture value range;

[0034] Based on the hole diameter tolerance and the drilling radius, determine the sum of the hole diameter tolerance and the drilling radius;

[0035] Based on the radius of the first isolation zone of the first via in the first inspection area database and the summation value, determine the first difference between the radius of the first isolation zone and the summation value;

[0036] If the first difference is greater than or equal to the power area inspection rule value, the via inspection result is determined to be an inspection pass;

[0037] If the first difference is less than the power area inspection rule value, the via inspection result is determined to be an inspection failure.

[0038] Optionally, determining the via inspection result based on the second inspection area database and the high-density area inspection rule value includes:

[0039] When the target inspection area is the high-density area, a second difference between the second isolation area radius and the copper ring radius is determined based on the second isolation area radius and the copper ring radius in the second inspection area database;

[0040] If the second difference is less than or equal to the high-density area inspection rule value, the via inspection result is determined to be an inspection pass;

[0041] If the second difference is greater than the high-density area inspection rule value, the via inspection result is determined to be an inspection failure.

[0042] Optionally, after determining the via inspection result based on the via tolerance database and / or the area to be inspected database, and the inspection rule value, the method further includes:

[0043] If the via inspection result is "fail", obtain the coordinates corresponding to the via from the database of the area to be inspected;

[0044] The coordinates are output so that the user can modify the design parameters of the via corresponding to the coordinates.

[0045] To address the aforementioned technical problems, embodiments of the present invention also provide a through-hole inspection device, comprising:

[0046] The design file acquisition module is used to acquire the design file corresponding to the printed circuit board, and determine the correspondence between the aperture value range and aperture tolerance of the via in the printed circuit board and the via design parameters based on the design file.

[0047] The through-hole tolerance database creation module is used to create a through-hole tolerance database based on the correspondence between the hole diameter value range and the hole diameter tolerance.

[0048] The inspection area database creation module is used to create an inspection area database corresponding to the target inspection area based on the via design parameters.

[0049] The inspection rule value determination module is used to determine the inspection rule value corresponding to the target inspection area based on the target inspection area;

[0050] The inspection result determination module is used to determine the through hole inspection result based on the through hole tolerance database and / or the inspection area database, as well as the inspection rule value.

[0051] To address the aforementioned technical problems, this invention also provides a via inspection tool, which includes a functional interface comprising a via tolerance database creation component, a region to be inspected database creation component, an inspection rule value determination component, and a via inspection component.

[0052] The via tolerance database creation component is used to create a via tolerance database based on the correspondence between the via diameter value range and the via diameter tolerance; the correspondence between the via diameter value range and the via diameter tolerance is the correspondence between the via diameter value range and the via diameter tolerance in the printed circuit board determined according to the design documents of the printed circuit board.

[0053] The inspection area database creation component is used to create an inspection area database corresponding to the target inspection area based on the via design parameters; the via design parameters are the via design parameters in the printed circuit board determined according to the printed circuit board design file;

[0054] The inspection rule value determination component is used to determine the inspection rule value corresponding to the target inspection area based on the target inspection area.

[0055] The via inspection component is used to determine the via inspection result based on the via tolerance database created by the via tolerance database creation component and / or the inspection area database created by the inspection area database creation component, and the inspection rule value determined by the inspection rule value determination component.

[0056] Optionally, the functional interface may also include a result viewing component;

[0057] The result viewing component is used to display the via inspection results determined by the via inspection component.

[0058] To address the aforementioned technical problems, embodiments of the present invention also provide an electronic device, the electronic device including a memory and a processor, the memory being used to store a computer program, and the processor being used to execute the computer program to implement the via inspection method as described in any of the preceding claims.

[0059] To address the aforementioned technical problems, embodiments of the present invention also provide a readable storage medium storing a computer program, which, when executed by a processor, implements the via inspection method as described in any of the preceding embodiments.

[0060] In this embodiment of the invention, by acquiring the design file corresponding to the printed circuit board (PCB), and based on the design file, determining the correspondence between the via diameter range and the via diameter tolerance, as well as the via design parameters, a via tolerance database is created. Based on the correspondence between the via diameter range and the via diameter tolerance, a database of areas to be inspected corresponding to the target inspection area is created. Based on the target inspection area, inspection rule values ​​corresponding to the target inspection area are determined. Finally, the via inspection result is determined based on the via tolerance database and / or the database of areas to be inspected, and the inspection rule values. Determining the via inspection result based on the database of areas to be inspected corresponding to the target inspection area, the via tolerance database, and the inspection rule values ​​enables the correctness check of via usage in different target inspection areas within the PCB. This improves the inspection efficiency and accuracy of the via inspection process, avoids signal distortion and short-circuit burn-out problems caused by incorrect via usage, and thus improves the design quality of the PCB product. Attached Figure Description

[0061] Figure 1 This is a flowchart of the steps of a via inspection method provided in an embodiment of the present invention;

[0062] Figure 2 This is a schematic diagram of a via structure provided in an embodiment of the present invention;

[0063] Figure 3 This is a schematic diagram of another via structure provided in an embodiment of the present invention;

[0064] Figure 4 This is a schematic diagram of target inspection area division provided by an embodiment of the present invention;

[0065] Figure 5 This is a flowchart of another via inspection method provided in an embodiment of the present invention;

[0066] Figure 6 This is a schematic diagram of the functional interface of a through-hole inspection tool provided in an embodiment of the present invention;

[0067] Figure 7 This is a schematic diagram of the functional interface of another through-hole inspection tool provided in an embodiment of the present invention;

[0068] Figure 8 This is a logic block diagram of a via inspection device provided in an embodiment of the present invention;

[0069] Figure 9 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present invention.

[0070] Figure label:

[0071] 210 - Drilling; 220 - Copper Ring; 230 - Isolation Zone; 300 - Printed Circuit Board; 400 - Printed Circuit Board; 410 - High-Density Area; 420 - Power Supply Area; 600 - Functional Interface; 610 - Via Tolerance Database Creation Component; 620 - Area to be Inspected Database Creation Component; 630 - Inspection Rule Value Determination Component; 640 - Via Inspection Component; 650 - Result Viewing Component. Detailed Implementation

[0072] Exemplary embodiments of the invention will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0073] In an embodiment of the present invention, Figure 1 A flowchart illustrating the steps of a via inspection method provided by an embodiment of the present invention is shown, as follows: Figure 1 As shown, the method may include:

[0074] Step S110: Obtain the design file corresponding to the printed circuit board, and determine the correspondence between the aperture value range and aperture tolerance of the via in the printed circuit board and the via design parameters based on the design file.

[0075] The printed circuit board (PCB) can be a designed PCB awaiting via inspection. The PCB includes several vias. In double-sided and multi-layer PCBs, a via is a common hole (via) provided at the intersection of the conductors that need to be connected between layers, to connect the printed wires between different layers. In this embodiment, the vias in the PCB include, but are not limited to, plating through holes (PHTs). A plating through hole refers to a thin layer of copper being chemically plated onto the inner wall of the hole between the top and bottom layers of the PCB, thus connecting the top and bottom layers. Hereinafter referred to as a via.

[0076] Reference Figure 2 , Figure 2This diagram illustrates a via structure according to an embodiment of the present invention. The via includes a drill 210, a copper pad 220, and an antipad 230. The drill 210 is the portion of the via that requires drilling, and its diameter is the via's aperture value. The copper pad 220 is a ring of high-temperature resistant copper plating disposed on the wall of the drill 210. The copper pad 220 has network properties, and these properties are identical to the network properties of the signals passing through the via. The antipad 230 defines the distance between the via wall and other copper foils, preventing signal interference and short circuits.

[0077] Reference Figure 3 , Figure 3 A schematic diagram of another via structure provided by an embodiment of the present invention is shown. In this via, the diameter of the drill hole 210 is 2x, the diameter of the copper ring 220 is 2y, and the diameter of the isolation zone 230 is 2z. It should be noted that the relationship between x, y, and z is: x < y < z, where x, y, and z are all values ​​greater than 0.

[0078] Specifically, when a designed printed circuit board (PCB) is sent to a factory for drilling and fabrication, the actual manufacturing capabilities of the factory may limit the tolerance of the via diameter in the produced PCB. If the isolation zone diameter of the via is set too small during design, it will result in different network signals being too close together. If such vias are placed in high-current functional areas, such as power supply areas, the high-temperature metal ion migration in the power supply area will be significant during long-term operation of the PCB, easily leading to short circuits and board burn-out, and other quality and safety accidents. Furthermore, if the isolation zone diameter of the via is designed to be relatively large, it will result in greater clearance of the signal copper traces on the negative layer of the PCB. If such vias are used in high-density areas, it can easily lead to a lack of a reference return path for the signal, resulting in sudden changes in signal impedance and causing quality problems such as signal integrity issues.

[0079] In this embodiment of the invention, different printed circuit boards (PCBs) correspond to different design files. These design files include the PCB manufacturer's drilling tolerance specifications and the corresponding design parameters for that PCB during the PCB design process. The drilling tolerance specifications include the correspondence between the via diameter range and the diameter tolerance in the PCB. For example, when the diameter range is 8.0 mil - 12.0 mil (length unit: mil), the diameter tolerance is +3.0 mil / -3.0 mil; when the diameter range is 24.0 mil - 32.0 mil, the diameter tolerance is +4.0 mil / -0.0 mil. The corresponding design parameters for the PCB include the via design parameters for the vias set in the PCB. Specifically, the via design parameters may include the coordinates of the via, the drilling radius of the via, the copper ring radius of the via, the isolation zone radius of the via, and the target inspection area corresponding to the via, etc.

[0080] Specifically, the design file corresponding to the printed circuit board to be inspected can be obtained first. Then, the correspondence between the aperture value range and aperture tolerance of the via and the via design parameters can be extracted from the design file. The extracted aperture value range and aperture tolerance correspondence and via design parameters can be determined as the correspondence between the aperture value range and aperture tolerance of the via and the via design parameters in the printed circuit board.

[0081] Step S120: Create a through-hole tolerance database based on the correspondence between the aperture value range and the aperture tolerance.

[0082] It should be noted that there is a one-to-one correspondence between the aperture value range and the aperture tolerance. For example, a specific aperture value can be used to determine the aperture value range in which it falls. Then, based on the one-to-one correspondence between the aperture value range and the aperture tolerance, the aperture tolerance corresponding to that aperture value can be finally determined. The aperture tolerance can include positive and negative aperture tolerances, and the aperture tolerance range formed by the positive and negative aperture tolerances is the aperture tolerance itself.

[0083] In this embodiment, the via tolerance database includes the via diameter value and the corresponding via diameter tolerance. Specifically, when different via diameter values ​​correspond to the same via diameter tolerance, several different via diameter values ​​with the same via diameter tolerance can be merged to obtain different via diameter value ranges corresponding to different via diameter tolerances.

[0084] It should be noted that the aperture value range corresponding to the aperture tolerance in the through-hole tolerance database can be the same aperture value range as the aperture value range in the correspondence between aperture value range and aperture tolerance determined based on the design document in step S110, or it can be the aperture value range after merging the aperture value range in the correspondence between aperture value range and aperture tolerance determined based on the design document in step S110 according to the aperture tolerance. Of course, according to actual inspection needs, the aperture tolerance in the correspondence between aperture value range and aperture tolerance determined based on the design document can be filtered, and then the corresponding aperture value range can be merged or split based on the filtered aperture tolerance to obtain the through-hole tolerance database for use in step S150. This embodiment of the invention does not specifically limit this.

[0085] Step S130: Based on the via design parameters, create a database of areas to be inspected corresponding to the target inspection area.

[0086] Among them, via design parameters are parameters related to the via design in the printed circuit board. Specifically, via parameters may include the coordinates of the via, the drill radius, the copper ring radius, the isolation zone radius, and the target inspection area corresponding to the via.

[0087] The target inspection area is the area on the printed circuit board (PCB) that requires via inspection. Based on the functional areas of the PCB, the target inspection area can be divided into power supply areas and high-density areas. The power supply area can include power line routing areas, where current is high and temperature is relatively high. At higher temperatures, the increased migration of metal ions can easily lead to short circuits and board burn-out problems. The high-density area can include the area on the PCB where an array of solder balls is formed on the bottom of the package substrate as the input / output terminals of the circuit, interconnecting with the PCB. (Refer to 4.) Figure 4 This diagram illustrates a target inspection area division according to an embodiment of the present invention. Figure 4 The printed circuit board 400 includes a high-density area 410 and a power supply area 420.

[0088] The inspection area database contains data corresponding to the target inspection area, which includes a power supply area and a high-density area. Accordingly, the inspection area database includes a first inspection area database corresponding to the power supply area and a second inspection area database corresponding to the high-density area. The inspection area database includes via design parameters related to via inspection for all vias within the corresponding target inspection area.

[0089] In this embodiment of the invention, the via design parameters corresponding to the target inspection area can be extracted from the via design parameters, and these design parameters can be created into an inspection area database corresponding to the target inspection area according to a preset format for use in step S150.

[0090] Step S140: Based on the target inspection area, determine the inspection rule value corresponding to the target inspection area.

[0091] The inspection rule value is the basis for judgment during the via inspection process, and the specific value needs to be determined according to different target inspection areas and the actual use scenario of the printed circuit board to be inspected.

[0092] In this embodiment of the invention, different target inspection areas can correspond to different inspection rule values. For different usage scenarios, the inspection rule value corresponding to the same target inspection area will also be different. Specifically, when the target inspection area is a power area, if the isolation radius z is less than the drill radius x ± hole diameter tolerance w (i.e., z < x ± w), it indicates that the network of the via has already contacted the network of other vias, which will cause a short circuit. Furthermore, if the isolation radius z is greater than but close to the drill radius x ± hole diameter tolerance w, the power area of ​​the printed circuit board has a large current and high temperature during operation, resulting in a faster migration speed of metal ions in the power area. During long-term operation, short circuits are also very likely to occur. Therefore, for vias located in the power area, the isolation radius z needs to be a certain range larger than the drill radius x ± hole diameter tolerance w to ensure the quality and safety of the power area of ​​the printed circuit board during operation. Thus, the range by which the isolation radius z is larger than the drill radius x ± hole diameter tolerance w can be defined as the inspection rule value u corresponding to the power area.

[0093] Similarly, in high-density inspection areas, when the difference between the isolation radius z and the copper ring radius y is large—meaning there is no copper directly below the via—signals passing through the via may lack a reference return path, leading to cross-split transmission, sudden changes in signal impedance, and signal integrity issues. For example, if a signal passing through the via travels on the third layer of a printed circuit board, and a continuous copper layer is required on the fourth layer directly below the signal, but the fourth layer near the via on the third layer is a small void without copper, the signal passing through the third-layer via will lack a reference return path, resulting in signal integrity problems. Therefore, for vias in high-density areas, the difference between the isolation radius z and the copper ring radius y needs to be within a certain range. This range can be defined as the inspection rule value n corresponding to high-density areas.

[0094] In addition, the inspection rule values ​​will vary depending on the application scenario. For civilian products, the inspection rule value corresponding to the power area can be 10 mil, and the inspection rule value corresponding to the high-density area can be 4 mil. However, the inspection rule value requirements for the power area of ​​commercial or military printed circuit board products will be higher, and the inspection rule value corresponding to the high-density area of ​​commercial or military printed circuit board products will reach 3 mil.

[0095] Step S150: Determine the via inspection result based on the via tolerance database and / or the area to be inspected database, as well as the inspection rule value.

[0096] In this embodiment of the invention, the via inspection result is determined based on the via tolerance database and the area to be inspected database created in steps S120-S130, and the inspection rule value determined in step S140. For each via in the printed circuit board to be inspected, the via inspection result corresponding to that via can be obtained by executing steps S110 to S150.

[0097] Specifically, before determining the via inspection result based on the via tolerance database and / or the inspection area database and the inspection rule value, the inspection calculation logic for the via can be determined based on the target inspection area where the current via is located. Based on the inspection calculation logic corresponding to the via, the operation of determining the via inspection result based on the via tolerance database and / or the inspection area database and the inspection rule value is then executed.

[0098] Specifically, when the target inspection area is the power supply area, the inspection calculation logic corresponding to the power supply area is that the difference between the isolation zone radius and the borehole radius x ± hole diameter tolerance w is greater than or equal to the inspection rule value u corresponding to the power supply area. When the target inspection area is a high-density area, the inspection calculation logic corresponding to the high-density area is that the difference between the isolation zone radius z and the copper ring radius y is less than or equal to the inspection rule value n corresponding to the high-density area. .

[0099] It should be noted that when the target inspection area is the power supply area, the via inspection result needs to be determined based on the via tolerance database, the area to be inspected database, and the inspection rule values; when the target inspection area is the high-density area, the via inspection result needs to be determined based on the area to be inspected database and the inspection rule values.

[0100] Furthermore, in this embodiment of the invention, when the drilling tolerance manufacturing specifications corresponding to the printed circuit board manufacturer are determined, it is only necessary to create the via tolerance database once during the initial execution of step S120. Each time a via inspection is performed, it is only necessary to create a database of the area to be inspected corresponding to the target inspection area according to different printed circuit boards and determine the inspection rule value. This not only ensures the accuracy of the via inspection results but also further improves the efficiency of the via inspection.

[0101] Reference Figure 5 , Figure 5 This is a flowchart of another via inspection method provided in an embodiment of the present invention, as shown below. Figure 5 As shown, the method may include:

[0102] Step S201: Obtain the design file corresponding to the printed circuit board, and determine the correspondence between the aperture value range and aperture tolerance of the via in the printed circuit board and the via design parameters based on the design file.

[0103] This step can be referred to in the detailed description of step 110, and will not be repeated here.

[0104] Step S202: Determine the positive tolerance of the aperture based on the aperture tolerance.

[0105] Specifically, the aperture tolerance corresponding to the aperture value range can include positive aperture tolerance and negative aperture tolerance.

[0106] In this embodiment of the invention, the aperture tolerance refers to the tolerance caused by the factory's process capabilities during the actual manufacturing of the printed circuit board. In other words, ideally, when the factory manufactures vias with the exact same via design parameters as those in the design documents, short circuits are generally not a problem in the power supply area. However, in reality, due to manufacturing deviations after processing, these deviations are a key factor leading to short circuits in the power supply area.

[0107] It should be noted that in the via design parameters of the design file, the difference between the isolation zone radius and the drill radius x ± hole diameter tolerance w must be greater than or equal to the inspection rule value u corresponding to the power supply area, that is... This is true. Therefore, a negative via diameter tolerance indicates that the actual drill radius of the manufactured via is smaller than the designed drill radius in the via design parameters. Short circuits will not occur if the via design parameters are met. Similarly, short circuits will not occur if the drill radius is smaller than the designed drill radius. Only when the via tolerance is positive will the drill radius of the manufactured via be larger than the designed drill radius. With a larger drill radius, the difference between the isolation zone radius and the actual drill radius decreases, and the distance between the drill hole wall and the signals from other networks decreases, making short circuits more likely to occur over time.

[0108] Therefore, the positive tolerance of the aperture tolerance can be determined based on the aperture tolerance, and steps S203 to S205 can be performed based on the positive tolerance of the aperture.

[0109] Step S203: Based on the correspondence between the aperture value range and the aperture tolerance, and assuming the aperture positive tolerance is the same, determine the aperture value range corresponding to the aperture positive tolerance.

[0110] In this embodiment of the invention, after determining the positive tolerance of the aperture tolerance in step S202, it is possible to determine whether the positive tolerance of the aperture corresponding to each different aperture value range is the same based on the correspondence between the aperture value range and the aperture tolerance. If the positive tolerance of the aperture is the same, the aperture value range corresponding to the aperture tolerance with the same positive tolerance is determined.

[0111] It should be noted that if it is confirmed that the positive tolerance of the aperture corresponding to each different aperture value range is different, then there is no need to perform the operations corresponding to steps 203 to S205, and you can directly perform step S206.

[0112] Step S204: Merge the aperture value ranges.

[0113] Specifically, when the positive tolerance of the aperture is the same, after determining the aperture value range corresponding to the positive tolerance of the aperture, the aperture value ranges with the same positive tolerance can be merged to obtain a new aperture value range corresponding to the positive tolerance of the aperture.

[0114] In this embodiment of the invention, after merging aperture value intervals with the same positive aperture tolerance, there is a one-to-one correspondence between the aperture value intervals and the positive aperture tolerances. Based on a given aperture value interval, a corresponding positive aperture tolerance can be determined. For example, based on a given aperture value, an aperture value interval corresponding to that aperture value can be determined, and then based on the correspondence between the aperture value interval and the positive aperture tolerance, the corresponding positive tolerance can be determined.

[0115] Step S205: Create a through-hole tolerance database based on the correspondence between the merged aperture value range and the aperture positive tolerance.

[0116] In this embodiment of the invention, based on the correspondence between the merged aperture value range and the positive aperture tolerance, a through-hole tolerance database can be created according to a preset format for use in step S208.

[0117] For example, the correspondence between the via diameter range and the via diameter tolerance in the design file corresponding to the printed circuit board is shown in Table 1.

[0118]

[0119] Table 1

[0120] Based on Table 1, the positive aperture tolerances are determined to be +2.0 mil, +2.0 mil, +3.0 mil, +3.0 mil, and +4.0 mil. According to the correspondence between aperture value ranges and aperture tolerances, when the positive aperture tolerance is the same, the corresponding aperture value ranges are determined. Specifically, when the positive aperture tolerance is +2.0 mil, the corresponding aperture value ranges are Φ≤6.0 mil and 6.0 mil<Φ≤8.0 mil; when the positive aperture tolerance is +3.0 mil, the corresponding aperture value ranges are 8.0 mil<Φ≤12.0 mil and 12.0 mil<Φ≤24.0 mil. For the case of a positive aperture tolerance of +2.0 mil, the aperture value ranges are merged to obtain a new aperture value range of Φ≤8.0 mil. For the case of a positive aperture tolerance of +3.0 mil… In the case of mil, after merging the aperture value ranges, a new aperture value range is obtained: 8.0mil < Φ ≤ 24.0mil. Therefore, based on the correspondence between the merged aperture value ranges and the positive aperture tolerance, a through-hole tolerance database is created as shown in Table 2.

[0121]

[0122] Table 2

[0123] Regarding Table 2, after merging the aperture value ranges with the same positive aperture tolerance, there is a one-to-one correspondence between the aperture value range and the positive aperture tolerance. Based on a specific aperture value range, a corresponding positive aperture tolerance can be determined. For example, based on a specific aperture value of 3 mil, the aperture value range corresponding to this aperture value can be determined as Φ≤8.0 mil. Furthermore, based on the correspondence between aperture value ranges and positive aperture tolerances, the positive tolerance corresponding to this aperture value can be determined to be 2 mil.

[0124] It should be noted that for different printed circuit board manufacturers, the correspondence between the via diameter range and the via diameter tolerance in the drilling tolerance manufacturing specifications may differ. When creating the via tolerance database based on the merged via diameter range and the corresponding positive tolerance, the via tolerance database can be created according to the specific data in the drilling tolerance manufacturing specifications.

[0125] Step S206: Based on the via design parameters, extract the target via design parameters corresponding to the target inspection area from the via design parameters.

[0126] The target via design parameters include some or all of the via design parameters.

[0127] In this embodiment of the invention, target via design parameters corresponding to the target inspection area can be extracted from the via design parameters based on the target inspection area. Specifically, the target via design parameters are the portion of the design parameters extracted from the via design parameters based on the target inspection area. These target design parameters are used to create a database of areas to be inspected corresponding to the target inspection area.

[0128] Specifically, the target via design parameters corresponding to the target inspection area can be extracted from the via design parameters using the V lookup command in Excel; or the target via design parameters corresponding to the target inspection area can be extracted using pointer commands in C language; or other more advanced languages ​​or algorithms can be used to extract the target via design parameters corresponding to the target inspection area. This embodiment of the invention does not specifically limit the specific methods used.

[0129] Step S207: Based on the target via design parameters, create a database of areas to be inspected corresponding to the target inspection area.

[0130] Specifically, based on the target via design parameters, a database of areas to be inspected corresponding to the target inspection area can be created according to a preset format. It should be noted that the database of areas to be inspected corresponding to the target inspection area includes the target via design parameters.

[0131] Optionally, the target inspection area may include a power supply area and a high-density area.

[0132] Step S206 may include sub-steps S2061 and S2062:

[0133] Sub-step S2061: If the target inspection area is a power area, extract the first coordinate, drilling radius and first isolation zone radius of the first via corresponding to the power area from the via design parameters, and determine them as the first target via design parameters.

[0134] It should be noted that the design parameters of the target via corresponding to the power supply area may include the first coordinates, drilling radius, and first isolation zone radius of the first via located in the power supply area.

[0135] The first via can be any via located within the power supply area.

[0136] In this embodiment of the invention, when the target inspection area is determined to be a power area, the first coordinates, drilling radius and first isolation zone radius of the first via corresponding to the power area can be extracted from the via design parameters according to the via design parameters. Then, the extracted first coordinates, drilling radius and first isolation zone radius of the first via are used as the first target via design parameters corresponding to the power area.

[0137] Sub-step S2062: If the target inspection area is a high-density area, extract the second coordinates, copper ring radius, and second isolation zone radius of the second via corresponding to the high-density area from the via design parameters, and use them as the second target via design parameters.

[0138] It should be noted that the design parameters of the target via corresponding to the high-density area may include the second coordinates of the second via located in the high-density area, the radius of the copper ring, and the radius of the second isolation zone.

[0139] The second via can be any via located within the high-density region.

[0140] In this embodiment of the invention, when the target inspection area is determined to be a high-density area, the second coordinates, copper ring radius, and second isolation zone radius of the second via corresponding to the high-density area can be extracted from the via design parameters according to the via design parameters. Then, the extracted second coordinates, copper ring radius, and second isolation zone radius of the second via are used as the second target via design parameters corresponding to the high-density area.

[0141] Optionally, step S207 may include sub-steps S2071 and S2072:

[0142] Sub-step S2071: Based on the design parameters of the first target via, create a first inspection area database corresponding to the power supply area.

[0143] Specifically, based on the design parameters of the first target via corresponding to the power supply area, the design parameters of the first target via can be used to create a database of the first inspection area corresponding to the power supply area in a preset format.

[0144] For example, for several first vias in the power supply area, the first coordinates, drilling radius and first isolation zone radius of the first via corresponding to the power supply area are extracted from the via design parameters and determined as the first target via design parameters. Based on the first target via design parameters, a first inspection area database corresponding to the power supply area is created. The first inspection area database can be as shown in Table 3.

[0145]

[0146] Table 3

[0147] It should be noted that the embodiments of the present invention do not specifically limit the preset format of the first inspection area database, as long as the first inspection data includes the design parameters of the first target via.

[0148] Sub-step S2072: Based on the design parameters of the second target via, create a second inspection area database corresponding to the high-density area.

[0149] Specifically, based on the design parameters of the second target via corresponding to the high-density area, the design parameters of the second target via can be used to create a database of the second inspection area corresponding to the high-density area in a preset format.

[0150] For example, for several second vias in a high-density area, the second coordinates, copper ring radius, and second isolation zone radius of the second vias corresponding to the high-density area are extracted from the via design parameters and determined as the second target via design parameters. Based on the second target via design parameters, a second inspection area database corresponding to the high-density area is created. The second inspection area database can be as shown in Table 4.

[0151]

[0152] Table 4

[0153] It should be noted that the embodiments of the present invention do not specifically limit the preset format of the second inspection area database, as long as the second inspection data includes the design parameters of the second target via.

[0154] In this embodiment of the invention, after step S207, if the target inspection area is a power supply area, then step S208 is executed; if the target inspection area is a high-density area, then step S209 is executed.

[0155] Step S208: If the target inspection area is a power supply area, determine the via inspection result based on the via tolerance database, the first inspection area database, and the power supply area inspection rule value.

[0156] The target inspection area includes the power area and the high-density area; the inspection area database includes the first inspection area database and the second inspection area database; the inspection rule values ​​include the power area inspection rule values ​​corresponding to the power area and the high-density area inspection rule values ​​corresponding to the high-density area.

[0157] Specifically, when the target inspection area is the power supply area, the inspection calculation logic of the first via corresponding to the power supply area can be determined first. Then, based on the inspection calculation logic of the first via, the inspection result of the first via can be determined according to the via tolerance database, the first inspection area database, and the power supply area inspection rule value.

[0158] It should be noted that the calculation logic for the first via corresponding to the power supply area can be that the difference between the radius of the first isolation zone and the drill radius x ± the first hole diameter tolerance w is greater than or equal to the inspection rule value u corresponding to the power supply area. .

[0159] Optionally, step S208 may include sub-steps S2081 to S2086:

[0160] Sub-step S2081: If the target inspection area is the power supply area, query the hole diameter value range corresponding to the hole radius in the through hole tolerance database according to the hole radius in the first inspection area database.

[0161] Specifically, when the target inspection area is the power supply area, the borehole diameter range corresponding to the borehole radius can be queried in the through-hole tolerance database based on the borehole radius in the first inspection area database.

[0162] Sub-step S2082: Determine the aperture tolerance corresponding to the aperture value range based on the aperture value range.

[0163] Specifically, in step S2081, after querying the hole diameter value range corresponding to the hole radius in the through hole tolerance database based on the hole radius in the first inspection area database, the hole diameter tolerance corresponding to the hole radius is determined based on the hole diameter value range corresponding to the hole radius found in the through hole tolerance database and the correspondence between the hole diameter value range and the hole diameter tolerance.

[0164] In cases where the through-hole tolerance database includes the correspondence between hole diameter value ranges and positive hole diameter tolerances, the positive hole diameter tolerance corresponding to the hole diameter value range can also be determined based on the hole diameter value range.

[0165] Sub-step S2083: Determine the sum of the hole diameter tolerance and the hole radius based on the hole diameter tolerance and the hole radius.

[0166] Specifically, the hole diameter tolerance determined in step S2082 and the drilling radius of the first hole diameter in the first database to be inspected are summed to obtain the sum value.

[0167] In this embodiment of the invention, the positive tolerance of the hole diameter determined in step S2082 and the drilling radius of the first hole diameter in the first database to be inspected can be summed to obtain a sum value.

[0168] Sub-step S2084: Based on the first isolation zone radius of the first via in the first inspection area database and the summation value, determine the first difference between the first isolation zone radius and the summation value.

[0169] Specifically, after obtaining the summation value in step S2083, the first isolation zone radius of the first via can be subtracted from the summation value obtained in step S2083 to determine the first difference between the first isolation zone radius and the summation value.

[0170] Sub-step S2085: If the first difference is greater than or equal to the power area inspection rule value, determine that the via inspection result is passed.

[0171] Specifically, if the first difference is greater than or equal to the power supply area inspection rule value, the via inspection result is determined to be passed. That is, the difference between the radius of the first isolation zone and the drill radius x ± the first hole diameter tolerance w is greater than or equal to the inspection rule value u corresponding to the power supply area. If the condition is met, the via inspection result of the first via in the power supply area is determined to be a pass inspection.

[0172] It should be noted that if the first via inspection result is "passed," it indicates that the design of the first via in the power supply area is reasonable. Even with via tolerances during manufacturing, short circuits and board burn-out issues will not occur. In this case, the via design parameters of the first via do not need to be adjusted. If the first via inspection result is "passed," you can directly proceed to inspect the next first via in the power supply area or the second via in the high-density area.

[0173] Sub-step S2086: If the first difference is less than the power area inspection rule value, determine that the via inspection result is an inspection failure.

[0174] Specifically, if the first difference is less than the power supply area inspection rule value, the via inspection result is determined to be an inspection failure. That is, the difference between the radius of the first isolation zone and the drill radius x ± the first hole diameter tolerance w is greater than or equal to the inspection rule value u corresponding to the power supply area. If this condition is not met, the via inspection result for the first via in the power supply area is determined to be "inspection failed".

[0175] It should be noted that if the first via inspection fails, it indicates that the design of the first via in the power supply area is unreasonable. If via tolerances exist during manufacturing, a short circuit and board burn-out may occur. In this case, the via design parameters of the first via need to be adjusted by notifying the user or relevant technical personnel. Therefore, if the first via inspection fails, steps S210 and S211 need to be executed.

[0176] Step S209: If the target inspection area is a high-density area, determine the via inspection result based on the second inspection area database and the high-density area inspection rule value.

[0177] The target inspection area includes the power area and the high-density area; the inspection area database includes the first inspection area database and the second inspection area database; the inspection rule values ​​include the power area inspection rule values ​​corresponding to the power area and the high-density area inspection rule values ​​corresponding to the high-density area.

[0178] Specifically, when the target inspection area is a high-density area, the inspection calculation logic of the second via corresponding to the high-density area can be determined first. Then, based on the inspection calculation logic of the second via, the inspection result of the second via can be determined according to the second inspection area database and the inspection rule value of the high-density area.

[0179] It should be noted that the calculation logic for the second via corresponding to the high-density area can be that the difference between the radius z of the second isolation zone and the radius y of the copper ring is less than or equal to the inspection rule value n corresponding to the high-density area. .

[0180] Optionally, step S209 may include sub-steps S2091 to S2093:

[0181] Sub-step S2091: If the target inspection area is the high-density area, determine the second difference between the second isolation area radius and the copper ring radius based on the second isolation area radius and the copper ring radius in the second inspection area database.

[0182] Specifically, when the target inspection area is a high-density area, the second difference between the second isolation zone radius and the copper ring radius can be calculated based on the second isolation zone radius and the copper ring radius corresponding to the second via in the second inspection area database.

[0183] Sub-step S2092: If the second difference is less than or equal to the high-density area inspection rule value, determine that the via inspection result is passed.

[0184] Specifically, if the second difference is less than or equal to the inspection rule value for the high-density area, the via inspection result is determined to be passed. That is, the difference between the radius z of the second isolation zone and the radius y of the copper ring is less than or equal to the inspection rule value n corresponding to the high-density area. If the condition is met, the via inspection result of the second via in the high-density area is determined to be a pass inspection.

[0185] It should be noted that if the second via inspection passes, it indicates that the design of the second via in the high-density area is reasonable. During actual operation of the printed circuit board, there will be no signal distortion due to the lack of a reference return path for signals passing through the second via. In this case, the via design parameters of the second via do not need to be adjusted. If the second via inspection passes, you can directly inspect the next second via in the high-density area or the first via in the power supply area sequentially.

[0186] Sub-step S2093: If the second difference is greater than the high-density area inspection rule value, determine that the via inspection result is an inspection failure.

[0187] Specifically, if the second difference is greater than the inspection rule value for the high-density area, the via inspection result is determined to be a failure. That is, the difference between the radius z of the second isolation zone and the radius y of the copper ring is less than or equal to the inspection rule value n corresponding to the high-density area. If this is not the case, the inspection result of the second via in the high-density area is determined to be a failure.

[0188] It should be noted that if the second via fails the inspection, it indicates that the design of the second via in the high-density area is unreasonable. During the actual operation of the printed circuit board, signal distortion may occur because the signal passing through the second via lacks a reference return path. In this case, the via design parameters of the second via need to be adjusted by notifying the user or relevant technical personnel. Therefore, if the second via fails the inspection, steps S210 and S211 need to be executed.

[0189] Step S210: If the via inspection result is "failed", obtain the coordinates corresponding to the via in the database of the area to be inspected.

[0190] Specifically, when the target inspection area is a power area and the via inspection result of the first via in the power area is "not inspected", the coordinates of the first via corresponding to the first via in the first inspection area database can be obtained; when the target inspection area is a high-density area and the via inspection result of the second via in the high-density area is "not inspected", the coordinates of the second via corresponding to the second via in the second inspection area database can be obtained.

[0191] The via coordinates are used to locate vias in the printed circuit board, so that users or relevant technicians can determine the specific location of vias that failed the inspection based on the coordinates of the vias, and facilitate the modification of the via design parameters corresponding to the vias.

[0192] Step S211: Output the coordinates so that the user can modify the design parameters of the via corresponding to the coordinates.

[0193] Specifically, after determining the coordinates of the via that failed the inspection in step S210, the coordinates of the via can be output to the user or relevant technical personnel in the form of alarm information or other prompt information, so that the user or relevant technical personnel can modify the design parameters of the via corresponding to the coordinates.

[0194] In this embodiment of the invention, by acquiring the design file corresponding to the printed circuit board (PCB), and based on the design file, determining the correspondence between the via diameter range and the via diameter tolerance, as well as the via design parameters, a via tolerance database is created. Based on the correspondence between the via diameter range and the via diameter tolerance, a database of areas to be inspected corresponding to the target inspection area is created. Based on the target inspection area, inspection rule values ​​corresponding to the target inspection area are determined. Finally, the via inspection result is determined based on the via tolerance database and / or the database of areas to be inspected, and the inspection rule values. Determining the via inspection result based on the database of areas to be inspected corresponding to the target inspection area, the via tolerance database, and the inspection rule values ​​enables the correctness check of via usage in different target inspection areas within the PCB. This improves the inspection efficiency and accuracy of the via inspection process, avoids signal distortion and short-circuit burn-out problems caused by incorrect via usage, and thus improves the design quality of the PCB product.

[0195] This invention provides a via inspection tool, such as... Figure 6 As shown, Figure 6This diagram illustrates the functional interface of a through-hole inspection tool provided in an embodiment of the present invention. The through-hole inspection tool includes a functional interface 600, which includes a through-hole tolerance database creation component 610, a region-to-be-inspected database creation component 620, an inspection rule value determination component 630, and a through-hole inspection component 640.

[0196] The through-hole tolerance database creation component 610 is used to create a through-hole tolerance database based on the correspondence between the hole diameter value range and the hole diameter tolerance.

[0197] In this embodiment of the invention, the correspondence between the aperture value range and the aperture tolerance is the correspondence between the aperture value range and the aperture tolerance of the via in the printed circuit board determined according to the design documents of the printed circuit board.

[0198] The inspection area database creation component 620 is used to create an inspection area database corresponding to the target inspection area based on the via design parameters.

[0199] In this embodiment of the invention, the via design parameters are the via design parameters in the printed circuit board determined according to the printed circuit board design documents.

[0200] The inspection rule value determination component 630 is used to determine the inspection rule value corresponding to the target inspection area based on the target inspection area.

[0201] In this embodiment of the invention, the inspection rule value determination component 630 can input the inspection rule value corresponding to the target inspection area to the via inspection tool.

[0202] The via inspection component 640 is used to determine the via inspection result based on the via tolerance database created by the via tolerance database creation component and / or the area to be inspected database created by the area to be inspected database creation component, and the inspection rule value determined by the inspection rule value determination component.

[0203] Optionally, such as Figure 7 The above, Figure 7 A schematic diagram of the functional interface of another via inspection tool provided in an embodiment of the present invention is shown. The functional interface 600 may also include a result viewing component 650.

[0204] The result viewing component 650 is used to display the via inspection results determined by the via inspection component.

[0205] Specifically, after the via inspection component 640 determines the via inspection result, the result viewing component 650 can automatically display the via inspection result determined by the via inspection component 640 in the function interface 600; of course, the result viewing component 650 can also first obtain the via inspection result from the via inspection component 640 after the via inspection component 640 determines the via inspection result, and then display the via inspection result determined by the via inspection component 640 when the user clicks on the result viewing component 650 in the function interface 600. This embodiment of the invention does not impose specific limitations on this aspect.

[0206] Figure 8 A logic block diagram of a via inspection device provided in an embodiment of the present invention is shown, such as... Figure 8 As shown, the via inspection device 800 may include:

[0207] Design file acquisition module 810 is used to acquire the design file corresponding to the printed circuit board, and determine the correspondence between the aperture value range and aperture tolerance of the via in the printed circuit board and the via design parameters based on the design file.

[0208] The through-hole tolerance database creation module 820 is used to create a through-hole tolerance database based on the correspondence between the hole diameter value range and the hole diameter tolerance.

[0209] The inspection area database creation module 830 is used to create an inspection area database corresponding to the target inspection area based on the via design parameters.

[0210] The inspection rule value determination module 840 is used to determine the inspection rule value corresponding to the target inspection area based on the target inspection area;

[0211] The inspection result determination module 850 is used to determine the via inspection result based on the via tolerance database and / or the area to be inspected database, as well as the inspection rule value.

[0212] Optionally, the through-hole tolerance database creation module 820 may include:

[0213] A positive tolerance determination submodule is used to determine the positive tolerance of the aperture tolerance based on the aperture tolerance.

[0214] The aperture value range determination submodule is used to determine the aperture value range corresponding to the positive aperture tolerance based on the correspondence between the aperture value range and the aperture tolerance, when the positive aperture tolerance is the same.

[0215] A aperture value range merging submodule, used to merge the aperture value ranges;

[0216] The through-hole tolerance database creation submodule is used to create a through-hole tolerance database based on the correspondence between the merged hole diameter value range and the positive hole diameter tolerance.

[0217] Optionally, the database creation module 830 for the area to be inspected may include:

[0218] The target via design parameter extraction submodule is used to extract the target via design parameters corresponding to the target inspection area from the via design parameters, based on the via design parameters; the target via design parameters include some or all of the parameters in the via design parameters;

[0219] The inspection area database creation submodule is used to create an inspection area database corresponding to the target inspection area based on the target via design parameters.

[0220] Optionally, the target inspection area includes a power supply area and a high-density area; the target via design parameter extraction submodule may include:

[0221] The first target via design parameter determination unit is used to extract the first coordinate, drilling radius and first isolation zone radius of the first via corresponding to the power area from the via design parameters when the target inspection area is a power area, and determine them as the first target via design parameters.

[0222] The second target via design parameter determination unit is used to extract the second coordinates, copper ring radius and second isolation zone radius of the second via corresponding to the high-density area from the via design parameters when the target inspection area is a high-density area, and determine them as the second target via design parameters.

[0223] Optionally, the submodule for creating the database of the area to be inspected may include:

[0224] The first inspection area database creation unit is used to create a first inspection area database corresponding to the power supply area based on the first target via design parameters.

[0225] The second inspection area database creation unit is used to create a second inspection area database corresponding to the high-density area based on the second target via design parameters.

[0226] Optionally, the target inspection area includes a power area and a high-density area; the inspection area database includes a first inspection area database and a second inspection area database; the inspection rule values ​​include the power area inspection rule values ​​corresponding to the power area and the high-density area inspection rule values ​​corresponding to the high-density area; the inspection result determination module 850 may include:

[0227] The first inspection result determination submodule is used to determine the via inspection result based on the via tolerance database, the first inspection area database, and the power area inspection rule value when the target inspection area is a power area.

[0228] The second inspection result determination submodule is used to determine the via inspection result based on the second inspection area database and the high-density area inspection rule value when the target inspection area is a high-density area.

[0229] Optionally, the first inspection result determination submodule may include:

[0230] The aperture value range query unit is used to query the aperture value range corresponding to the drilling radius in the through hole tolerance database when the target inspection area is the power supply area.

[0231] A aperture tolerance determination unit is used to determine the aperture tolerance corresponding to the aperture value range based on the aperture value range;

[0232] The summation value determination unit is used to determine the summation value of the hole diameter tolerance and the hole radius based on the hole diameter tolerance and the hole radius;

[0233] The first difference determination unit is used to determine the first difference between the first isolation zone radius and the summation value based on the first isolation zone radius of the first via in the first inspection area database and the summation value.

[0234] The first inspection result determination unit is used to determine the via inspection result as passed when the first difference is greater than or equal to the power area inspection rule value.

[0235] The first inspection result determination unit is further configured to determine the via inspection result as inspection failure if the first difference is less than the power area inspection rule value.

[0236] Optionally, the second inspection result determination submodule may include:

[0237] The second difference determination unit is used to determine a second difference between the radius of the second isolation zone and the radius of the copper ring based on the radius of the second isolation zone and the radius of the copper ring in the second inspection area database when the target inspection area is the high-density area.

[0238] The second inspection result determination unit is used to determine the via inspection result as passed when the second difference is less than or equal to the high-density area inspection rule value.

[0239] The second inspection result determination unit is further configured to determine the via inspection result as an inspection failure if the second difference is greater than the high-density area inspection rule value.

[0240] Optionally, the via inspection device 800 may further include:

[0241] The coordinate acquisition module is used to acquire the coordinates corresponding to the via in the database of the area to be inspected when the via inspection result is that the inspection fails.

[0242] The coordinate output module is used to output the coordinates so that the user can modify the design parameters of the via corresponding to the coordinates.

[0243] In this embodiment of the invention, by acquiring the design file corresponding to the printed circuit board (PCB), and based on the design file, determining the correspondence between the via diameter range and the via diameter tolerance, as well as the via design parameters, a via tolerance database is created. Based on the correspondence between the via diameter range and the via diameter tolerance, a database of areas to be inspected corresponding to the target inspection area is created. Based on the target inspection area, inspection rule values ​​corresponding to the target inspection area are determined. Finally, the via inspection result is determined based on the via tolerance database and / or the database of areas to be inspected, and the inspection rule values. Determining the via inspection result based on the database of areas to be inspected corresponding to the target inspection area, the via tolerance database, and the inspection rule values ​​enables the correctness check of via usage in different target inspection areas within the PCB. This improves the inspection efficiency and accuracy of the via inspection process, avoids signal distortion and short-circuit burn-out problems caused by incorrect via usage, and thus improves the design quality of the PCB product.

[0244] This invention also provides an electronic device, including a memory and a processor, wherein the memory is used to store a computer program, and the processor is used to execute the computer program to implement the via inspection method as described above.

[0245] like Figure 9 As shown, Figure 9 A schematic diagram of an electronic device 900 according to an embodiment of the present invention is shown. The electronic device 900 includes a processing component 910, which further includes one or more processors, and memory resources represented by a memory 950 for storing instructions executable by the processing component 910, such as application programs. The application programs stored in the memory 950 may include one or more modules, each corresponding to a set of instructions. Furthermore, the processing component 910 is configured to execute instructions to perform an external device processing method provided in an embodiment of this application.

[0246] Electronic device 900 may also include a power supply component 920 configured to perform power management of electronic device 900, a wired or wireless network interface 930 configured to connect electronic device 900 to a network, and an input / output (I / O) interface 940. Electronic device 900 can operate on an operating system stored in memory 950, such as Windows Server™, Mac OS X™, Unix™, Linux™, FreeBSD™, or similar.

[0247] This application embodiment also provides a readable storage medium storing a computer program, which, when executed by a processor, implements the via inspection method described above.

[0248] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the application disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0249] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A method for inspecting vias, characterized in that, include: Obtain the design file corresponding to the printed circuit board, and determine the correspondence between the aperture value range and aperture tolerance of the via in the printed circuit board and the via design parameters based on the design file; The printed circuit board is a designed printed circuit board that is ready for through-hole inspection; The via design parameters include at least the via coordinates, the via drilling radius, the via copper ring radius, the via isolation zone radius, and the target inspection area corresponding to the via. Based on the correspondence between the aperture value range and the aperture tolerance, a through-hole tolerance database is created; Based on the via design parameters, a database of areas to be inspected corresponding to the target inspection area is created; the target inspection area includes power supply areas and high-density areas. Based on the target inspection area, determine the inspection rule value corresponding to the target inspection area; when the target inspection area is a power area, the range in which the radius of the isolation zone should be greater than the sum of the borehole radius and the hole diameter tolerance is taken as the inspection rule value corresponding to the power area; when the target inspection area is a high-density area, the range in which the difference between the radius of the isolation zone and the radius of the copper ring should be less than is taken as the inspection rule value corresponding to the high-density area. According to the inspection calculation logic corresponding to the via, the via inspection result is determined based on the via tolerance database and / or the inspection area database, as well as the inspection rule value. Specifically, when the target inspection area is a power area, the inspection calculation logic is that the sum of the isolation zone radius, the drill hole radius, and the hole diameter tolerance is greater than or equal to the inspection rule value corresponding to the power area. When the target inspection area is a high-density area, the inspection calculation logic is that the difference between the isolation zone radius and the copper ring radius is less than or equal to the inspection rule value corresponding to the high-density area. The step of creating a database of areas to be inspected corresponding to the target inspection area based on the via design parameters includes: Based on the via design parameters, target via design parameters corresponding to the target inspection area are extracted from the via design parameters; the target via design parameters include some or all of the parameters in the via design parameters. Based on the target via design parameters, create a database of areas to be inspected corresponding to the target inspection area.

2. The method according to claim 1, characterized in that, The step of creating a through-hole tolerance database based on the correspondence between the aperture value range and the aperture tolerance includes: Based on the stated aperture tolerance, determine the positive aperture tolerance of the stated aperture tolerance; Based on the correspondence between the aperture value range and the aperture tolerance, when the positive aperture tolerance is the same, the aperture value range corresponding to the positive aperture tolerance is determined. The aperture value ranges are merged; A through-hole tolerance database is created based on the correspondence between the merged aperture value range and the positive aperture tolerance.

3. The method according to claim 1, characterized in that, The target inspection area includes a power supply area and a high-density area; The step of extracting the target via design parameters corresponding to the target inspection area from the via design parameters includes: When the target inspection area is a power area, the first coordinates, drilling radius and first isolation zone radius of the first via corresponding to the power area are extracted from the via design parameters according to the via design parameters and determined as the first target via design parameters. When the target inspection area is a high-density area, according to the via design parameters, the second coordinates, copper ring radius and second isolation zone radius of the second via corresponding to the high-density area are extracted from the via design parameters and determined as the second target via design parameters; The step of creating a database of areas to be inspected corresponding to the target inspection area based on the target via design parameters includes: Based on the design parameters of the first target via, a first inspection area database corresponding to the power supply area is created; Based on the design parameters of the second target via, a second database of areas to be inspected corresponding to the high-density area is created.

4. The method according to claim 1, characterized in that, The database of areas to be inspected includes a first database of areas to be inspected and a second database of areas to be inspected; the inspection rule values ​​include the power area inspection rule values ​​corresponding to the power area and the high-density area inspection rule values ​​corresponding to the high-density area. The step of determining the via inspection result based on the via tolerance database and / or the area to be inspected database, and the inspection rule value, includes: When the target inspection area is a power supply area, the via inspection result is determined based on the via tolerance database, the first inspection area database, and the power supply area inspection rule value. If the target inspection area is a high-density area, the via inspection result is determined based on the second inspection area database and the high-density area inspection rule value.

5. The method according to claim 4, characterized in that, The step of determining the via inspection result based on the via tolerance database, the first inspection area database, and the power area inspection rule value includes: When the target inspection area is the power supply area, the hole diameter value range corresponding to the hole radius is queried in the through hole tolerance database according to the hole radius in the first inspection area database. Based on the aperture value range, determine the aperture tolerance corresponding to the aperture value range; Based on the hole diameter tolerance and the drilling radius, determine the sum of the hole diameter tolerance and the drilling radius; Based on the radius of the first isolation zone of the first via in the first inspection area database and the summation value, determine the first difference between the radius of the first isolation zone and the summation value; If the first difference is greater than or equal to the power area inspection rule value, the via inspection result is determined to be an inspection pass; If the first difference is less than the power area inspection rule value, the via inspection result is determined to be an inspection failure.

6. The method according to claim 4, characterized in that, The step of determining the via inspection result based on the second inspection area database and the high-density area inspection rule value includes: When the target inspection area is the high-density area, a second difference between the second isolation area radius and the copper ring radius is determined based on the second isolation area radius and the copper ring radius in the second inspection area database; If the second difference is less than or equal to the high-density area inspection rule value, the via inspection result is determined to be an inspection pass; If the second difference is greater than the high-density area inspection rule value, the via inspection result is determined to be an inspection failure.

7. The method according to claim 1, characterized in that, After determining the via inspection result based on the via tolerance database and / or the area to be inspected database, and the inspection rule value, the method further includes: If the via inspection result is "fail", obtain the coordinates corresponding to the via from the database of the area to be inspected; The coordinates are output so that the user can modify the design parameters of the via corresponding to the coordinates.

8. A through-hole inspection device, characterized in that, include: The design file acquisition module is used to acquire the design file corresponding to the printed circuit board, and determine the correspondence between the aperture value range and aperture tolerance of the via in the printed circuit board and the via design parameters based on the design file. The printed circuit board is a designed printed circuit board that is ready for through-hole inspection; The via design parameters include at least the via coordinates, the via drilling radius, the via copper ring radius, the via isolation zone radius, and the target inspection area corresponding to the via. The through-hole tolerance database creation module is used to create a through-hole tolerance database based on the correspondence between the hole diameter value range and the hole diameter tolerance. The inspection area database creation module is used to create an inspection area database corresponding to the target inspection area based on the via design parameters; the target inspection area includes a power area and a high-density area; The inspection rule value determination module is used to determine the inspection rule value corresponding to the target inspection area based on the target inspection area; when the target inspection area is a power area, the range in which the radius of the isolation zone should be greater than the sum of the borehole radius and the borehole diameter tolerance is used as the inspection rule value corresponding to the power area; when the target inspection area is a high-density area, the range in which the difference between the radius of the isolation zone and the radius of the copper ring should be less than is used as the inspection rule value corresponding to the high-density area. The inspection result determination module is used to determine the via inspection result based on the via tolerance database and / or the inspection area database, and the inspection rule value, according to the inspection calculation logic corresponding to the via. Specifically, when the target inspection area is a power area, the inspection calculation logic is that the sum of the isolation zone radius, the drill hole radius, and the hole diameter tolerance is greater than or equal to the inspection rule value corresponding to the power area; when the target inspection area is a high-density area, the inspection calculation logic is that the difference between the isolation zone radius and the copper ring radius is less than or equal to the inspection rule value corresponding to the high-density area. The database creation module for the area to be inspected includes: The target via design parameter extraction submodule is used to extract the target via design parameters corresponding to the target inspection area from the via design parameters, based on the via design parameters; the target via design parameters include some or all of the parameters in the via design parameters; The inspection area database creation submodule is used to create an inspection area database corresponding to the target inspection area based on the target via design parameters.

9. A through-hole inspection tool, characterized in that, The via inspection tool includes a functional interface, which includes a via tolerance database creation component, a region to be inspected database creation component, an inspection rule value determination component, and a via inspection component. The via tolerance database creation component is used to create a via tolerance database based on the correspondence between the via diameter value range and the via diameter tolerance; the correspondence between the via diameter value range and the via diameter tolerance is the correspondence between the via diameter value range and the via diameter tolerance in the printed circuit board determined according to the design documents of the printed circuit board; the printed circuit board is a printed circuit board that has been designed and is to be inspected for vias. The inspection area database creation component is used to create an inspection area database corresponding to the target inspection area based on the via design parameters; the via design parameters are the via design parameters in the printed circuit board determined according to the printed circuit board design file; the via design parameters include at least the coordinates of the via, the drilling radius of the via, the copper ring radius of the via, the isolation zone radius of the via, and the target inspection area corresponding to the via; The step of creating an inspection area database corresponding to the target inspection area based on the via design parameters includes: extracting target via design parameters corresponding to the target inspection area from the via design parameters; the target via design parameters include some or all of the parameters in the via design parameters; creating an inspection area database corresponding to the target inspection area based on the target via design parameters; the target inspection area includes a power area and a high-density area; The inspection rule value determination component is used to determine, based on the target inspection area, an inspection rule value corresponding to the target inspection area; when the target inspection area is a power area, the range in which the radius of the isolation zone should be greater than the sum of the borehole radius and the borehole diameter tolerance is used as the inspection rule value corresponding to the power area; when the target inspection area is a high-density area, the range in which the difference between the radius of the isolation zone and the radius of the copper ring should be less than is used as the inspection rule value corresponding to the high-density area. The via inspection component is used to determine the via inspection result by executing the via tolerance database created by the via tolerance database creation component and / or the inspection area database created by the inspection area database creation component, and the inspection rule value determined by the inspection rule value determination component, according to the inspection calculation logic corresponding to the via. Specifically, when the target inspection area is a power area, the inspection calculation logic is that the sum of the isolation zone radius, the drill radius, and the hole diameter tolerance is greater than or equal to the inspection rule value corresponding to the power area; when the target inspection area is a high-density area, the inspection calculation logic is that the difference between the isolation zone radius and the copper ring radius is less than or equal to the inspection rule value corresponding to the high-density area.

10. The through-hole inspection tool according to claim 9, characterized in that, The functional interface also includes a results viewing component; The result viewing component is used to display the via inspection results determined by the via inspection component.

11. An electronic device, characterized in that, It includes a memory and a processor, the memory being used to store a computer program, and the processor being used to execute the computer program to implement the via inspection method as described in any one of claims 1-7.

12. A readable storage medium, characterized in that, The readable storage medium stores a computer program that, when executed by a processor, implements the via inspection method as described in any one of claims 1-7.

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