A thermoelectric separation substrate with a stepped welding surface and a manufacturing method thereof

Abstract

The present invention discloses a thermoelectric separation substrate with a stepped welding surface and a manufacturing method thereof, which includes an aluminum plate and non-flowing glue PP; a solder mask area and a non-solder mask copper foil browned area are arranged on the surface of the aluminum plate; the non-flowing glue PP is installed and fixed at the upper end of the non-solder mask copper foil browned area; a copper foil is installed on the surface of the non-glue-remaining PP; in the present invention, a solder mask area and a non-solder mask copper foil browned area are arranged on the surface of the aluminum plate; the non-flowing glue PP is installed and fixed at the upper end of the non-solder mask copper foil browned area; a copper foil is installed on the surface of the non-glue-remaining PP, so that they form an integral body, and two welding surfaces are integrated on one substrate, which is convenient for customers to assemble and improves reliability at the same time, and flexibly solves the data and precision of the height difference between the two welding surfaces of customers; by arranging a first solder mask oil outside the hollow groove arranged on the surface of the aluminum plate and a second solder mask oil on the surface of the copper foil; it ensures the solder mask uniformity of the two solder surfaces, and there will be no situation where the lower interface does not get oil or the ink accumulates, which affects the component assembly.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB manufacturing, and particularly relates to a thermoelectric separation substrate with a stepped welding surface and a manufacturing method thereof. Background Art

[0002] Currently, most of the welding of PCBs is on a single plane. However, for some power devices, the functional welding pins and the grounding and heat dissipation welding pins are not on the same plane, and the height difference may be between 0.20 - 0.4 mm. Obviously, it is very difficult to achieve such a thickness difference by selective electroplating, and even if such a thickness difference is achieved, it is very difficult to perform uniform solder mask production on the two welding surfaces. In the prior art, production is carried out using two different board thicknesses respectively. For example, aluminum substrates with two board thicknesses of 1.0 and 1.2 mm are separately manufactured and then a carrier is used for reflow soldering, but this is relatively difficult to assemble. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a thermoelectric separation substrate with a stepped welding surface and a manufacturing method thereof. By installing non - flowing glue PP on the upper end of the aluminum plate to form an integral body, the two welding surfaces are integrated on one substrate, which is convenient for customers to assemble and improves reliability, and flexibly solves the data and accuracy of the height difference between the two welding surfaces for customers.

[0004] The thermoelectric separation substrate with a stepped welding surface of the present invention is realized through the following technical solutions: It includes an aluminum plate and non - flowing glue PP; a solder mask area and a non - solder - mask copper foil browning area are arranged on the surface of the aluminum plate; the non - flowing glue PP is installed and fixed on the upper end of the non - solder - mask copper foil browning area; a copper foil is installed on the surface of the non - glue - leaving PP.

[0005] As a preferred technical solution, an insulating protective film is arranged on the surface of the aluminum plate, and a copper - clad laminate is installed inside the aluminum plate;

[0006] One or more hollow grooves for connecting the copper - clad laminate are arranged on the surface of the aluminum plate; a first solder mask oil is arranged outside the hollow grooves.

[0007] As a preferred technical solution, a second solder mask oil is arranged on the surface of the copper foil; a milling edge is arranged on the surface of the non - glue - leaving PP.

[0008] The manufacturing method of the thermoelectric separation substrate with a stepped welding surface of the present invention is realized through the following technical solutions: It includes the following steps:

[0009] S1. Cut the aluminum plate - drill reference holes - wet film coating - pre - baking - exposure - development - etching - stripping - solder mask printing - pre - baking - alignment - exposure - development - post - baking;

[0010] S2. Design the total thickness of the non - glue - leaving PP and the copper foil;

[0011] S3. Perform brownification treatment on the aluminum plate completed in S1, and perform dust adhesion cleaning on the aluminum plate completed in S2;

[0012] S4. Rivet the aluminum plates together; stack and press a copper foil on the upper end of the non-flowing glue PP;

[0013] S5. Perform outer layer wet film coating - pre-baking - exposure - development - etching - stripping - solder mask printing - pre-baking - alignment - exposure - development - post-baking - lettering - surface treatment - forming - testing - appearance inspection on the riveted body completed in S4.

[0014] The beneficial effects of the present invention are:

[0015] 1. By providing a solder mask area and a non-solder mask copper foil brownification area on the surface of the aluminum plate; the non-flowing glue PP is installed and fixed on the upper end of the non-solder mask copper foil brownification area; a copper foil is installed on the surface of the non-retaining glue PP, making them form an integral body, and the two welding surfaces are integrated on one substrate, which is convenient for customers to assemble and improves reliability at the same time, and flexibly solves the data and accuracy of the height difference between the two welding surfaces of the customers;

[0016] 2. By providing a first solder mask oil outside the hollow groove provided on the surface of the aluminum plate and a second solder mask oil on the surface of the copper foil; ensuring the uniform solder mask of the two solder surfaces, and there will be no situation where the lower interface does not get oil or the ink accumulates, affecting the component assembly. Brief Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0018] Figure 1 Schematic diagram of the thermoelectric separation substrate with a stepped welding surface of the present invention Figure 1 ;

[0019] Figure 2 Schematic diagram of the thermoelectric separation substrate with a stepped welding surface of the present invention Figure 2 ;

[0020] Figure 3 Schematic diagram of the thermoelectric separation substrate with a stepped welding surface of the present invention Figure 3 ;

[0021] Figure 4 Schematic diagram of the post-baking operation area of the present invention. Detailed Embodiments

[0022] All features disclosed in this specification, or steps in all methods or processes disclosed, except for mutually exclusive features and / or steps, can be combined in any way.

[0023] Any feature disclosed in this specification (including any additional claims, abstract, and drawings), unless specifically stated, can be replaced by other equivalent or similar-purpose alternative features. That is, unless specifically stated, each feature is only an example of a series of equivalent or similar features.

[0024] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by terms such as "one end", "the other end", "outer side", "upper", "inner side", "horizontal", "coaxial", "central", "end portion", "length", "outer end", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0025] In addition, in the description of the present invention, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0026] Spatial relative position terms used in the present invention, such as "upper", "above", "lower", "below", etc., are for the purpose of facilitating description to describe the relationship of one unit or feature relative to another unit or feature as shown in the drawings. The spatial relative position terms can be intended to include different orientations of the device during use or operation other than the orientation shown in the figures. For example, if the device in the figure is flipped, the unit described as being "below" or "beneath" other units or features will be located "above" other units or features. Therefore, the exemplary term "below" can encompass both the upper and lower orientations. The device can be oriented in other ways (rotated 90 degrees or other orientations), and the spatially related descriptive terms used herein can be interpreted accordingly.

[0027] In the present invention, unless otherwise clearly specified and defined, terms such as "arranged", "socketed", "connected", "penetrated", "plugged in", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and can be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] Such as Figure 1 - Figure 3As shown in the figure, a thermoelectric separation substrate with a stepped welding surface according to the present invention includes an aluminum plate 1 and a non-flowing glue PP2; a solder mask area 3 and a non-solder mask copper foil browning area 4 are provided on the surface of the aluminum plate 2; the non-flowing glue PP2 is installed and fixed at the upper end of the non-solder mask copper foil browning area 4; a copper foil 5 is installed on the surface of the non-flowing glue PP2.

[0029] In this embodiment, an insulating protection film 6 is provided on the surface of the aluminum plate 1, and a copper clad laminate 8 is installed inside the aluminum plate 1; more than one hollow groove 7 for connecting the copper clad laminate 8 is provided on the surface of the aluminum plate 1; a first solder mask oil 9 is provided outside the hollow groove 7.

[0030] In this embodiment, a second solder mask oil 10 is provided on the surface of the copper foil 5; a chamfering 11 is provided on the surface of the non-flowing glue PP2.

[0031] As Figure 1 - Figure 3 As shown in the figure, a manufacturing method of a thermoelectric separation substrate with a stepped welding surface according to the present invention includes the following steps:

[0032] S1. Cut the aluminum plate 1 - drill reference holes - wet film coating - pre-baking - exposure - development - etching - stripping - solder mask printing - pre-baking - alignment - exposure - development - post-baking (no solder mask at the lamination position);

[0033] S2. According to the total thickness of the non-flowing glue PP2 and the copper foil 5 designed by the customer, (stepped position);

[0034] S3. Perform browning treatment on the aluminum plate 1 completed in S1, and perform dust sticking cleaning on the aluminum plate 1 completed in S2;

[0035] S4. Rivet the aluminum plate 1 with the aluminum plate 1; place the non-flowing glue PP2 on the solder mask surface, stack the copper foil 5 on the upper end of the non-flowing glue PP2 (the copper foil is not chamfered and opened), and perform lamination on it;

[0036] S5. Perform outer layer wet film coating - pre-baking - exposure - development - etching - stripping - solder mask printing - pre-baking - alignment - exposure - development - post-baking on the riveted body completed in S4 (as Figure 4 shown in the figure, make light blocking points on the film at the position where the concave part is soldered for the first time, and all the ink is developed off) － Characters - surface treatment - shaping - testing - appearance inspection.

[0037] In this embodiment, the aluminum plate is actually an aluminum-based copper clad laminate, which is composed of an aluminum base, an insulating layer (film), and a copper foil; the non-flowing glue PP2 is placed on the solder mask surface, and the non-flowing glue PP is arranged on the copper foil layer of the aluminum plate (the upper part of the copper foil layer is coated with solder mask).

[0038] In this embodiment, the hollow groove 7 is an area where the copper foil is etched away. It mainly prevents the copper pads of the surface components from being connected to the copper foil of the aluminum plate during solder printing. The copper foil around its four sides is also removed to mainly prevent copper burrs during profiling and possible leakage. The copper-clad laminate 8 is the copper foil area after etching the copper-clad layer of the aluminum substrate.

[0039] The beneficial effects of the present invention are as follows:

[0040] 1. The height difference between the two welding surfaces can be accurately controlled. The calculation method is the required height difference of the customer minus the thickness of the surface copper foil, which is the thickness of the medium. Select 1 - 2 appropriate non-adhesive PP2s (different models correspond to different thicknesses).

[0041] 2. The surface laminated copper foil is not opened, and the non-adhesive PP2 routing positions are not protected by ink. When etching the outer layer, an appropriate etching rate / speed can be selected, which can just etch the required etched parts of the outer layer clean, and at the same time ensure that the copper pads on the aluminum substrate that have been exposed by solder mask will not be over-etched.

[0042] 3. For double solder mask, the solder mask film for the non-adhesive PP2 position without routing in the second solder mask is used as a light-blocking point to ensure that the second solder mask at this place is removed, ensuring that the ink on the two interfaces is uniform, without ink not being applied or ink accumulation, and will not affect assembly welding.

[0043] As described above, the above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any change or substitution that can be thought of without creative work should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.

Claims

1. A thermoelectric separation substrate with a stepped welding surface, comprising an aluminum plate (1) and non-gelatinous PP (2); characterized in that: The surface of the aluminum plate (1) is provided with a solder mask area (3) and a non-solder mask copper foil brownification area (4); the non-flowing glue PP (2) is installed and fixed at the upper end of the non-solder mask copper foil brownification area (4); the surface of the non-flowing glue PP (2) is provided with a copper foil (5). The aluminum plate is an aluminum-based copper clad laminate, which is composed of an aluminum base, an insulating layer and a copper foil. Among them, the surface of the aluminum plate (1) is provided with an insulating protective film (6), and a copper clad laminate (7) is installed inside the aluminum plate (1). The copper clad laminate is the copper foil area after etching the copper clad layer of the aluminum substrate. One or more hollow grooves (8) for connecting the copper clad laminate (7) are provided on the surface of the aluminum plate (1); a first solder mask oil (9) is provided outside the hollow groove (8). A second solder mask oil (10) is provided on the surface of the copper foil (5); a milling edge (11) is provided on the surface of the non-flowing glue PP (2), and the ink protection is not performed at the milled position of the non-flowing glue PP (2).

2. A manufacturing method of a thermoelectric separation substrate having a stepped welding surface according to claim 1, characterized in that: It includes the following steps: S1. Cut the aluminum plate (1) - drill the reference holes - wet film coating - pre-baking - exposure - development - etching - stripping - solder mask printing - pre-baking - alignment - exposure - development - post-baking. S2. Design the total thickness of the non-flowing glue PP (2) and the copper foil (5). S3. Perform brownification treatment on the aluminum plate (1) completed in S1, and perform dust sticking cleaning after completing S2. S4. Rivet the aluminum plate (1) completed in S3 with the non-flowing glue PP (2) and the copper foil (5); the non-flowing glue PP (2) is arranged on the side of the copper foil layer of the aluminum plate, and the copper foil (5) is stacked on the upper end of the non-flowing glue PP (2) and pressed. S5. Perform outer layer wet film coating - pre-baking - exposure - development - etching - stripping - solder mask printing - pre-baking - alignment - exposure - development - post-baking - lettering - surface treatment - forming - testing - appearance inspection on the riveted body completed in S4.

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