Cooling plate, server housing and cooling system

Abstract

The present disclosure provides a cooling plate, a server housing, and a cooling system. The cooling plate includes an inlet port, a substrate, a plurality of heat dissipation structures, and a plurality of fluid channels. Among them, the inlet port is used to receive a two-phase fluid; the substrate is attached to a server electronic device; the plurality of heat dissipation structures are arranged on the substrate and spaced apart on the substrate so as to expand a heat exchange area from the substrate; the plurality of fluid channels are arranged on the substrate, wherein each of the plurality of fluid channels is located between a pair of adjacent heat dissipation structures. Each fluid channel includes a channel inlet, a channel outlet, and at least one intermediate outlet. Among them, the channel inlet receives at least a part of the two-phase fluid from the inlet port, the channel outlet allows the received part of the two-phase fluid to flow through and leave the corresponding fluid channel, and at least one intermediate outlet is arranged between the channel inlet and the channel outlet to allow at least a part of the received two-phase fluid to be discharged in the form of vapor or liquid.

Description

Technical Field

[0001] The present disclosure generally relates to server and data center cooling. More specifically, the present disclosure relates to a cooling plate, a server housing, and a cooling system. Background Art

[0002] For a data center including a number of active electronic racks, its thermal management is crucial for ensuring the proper performance of servers and / or other IT devices operating in the racks (such as performing IT services). However, without proper thermal management, the thermal environment (such as temperature) within the rack can exceed the thermal operation threshold, resulting in adverse consequences (such as server failures, etc.). One method of managing the thermal environment is to use cooling air to cool IT devices. The cooling air is recycled through a cooling unit. The heat generated by the IT devices is captured by the cooling air and extracted by the cooling unit.

[0003] In recent years, data centers have been deploying high power density electronic racks, in which a large number of high density chips are packaged together to provide higher computing power. Cooling these high density racks by maintaining an appropriate thermal environment is a problem in cooling systems (such as Computer Room Air Conditioning (CRAC) units). For example, although a CRAC unit can maintain a thermal environment using more conventional (or lower density) racks, because the higher density electronic devices in high power density racks generate heat loads at a higher rate, the CRAC unit cannot effectively cool high power density racks. Or, upgrading the CRAC system to meet the cooling requirements of high density deployments requires a large cost. Another challenge in air cooling high density racks is moving a large amount of air flow sufficient to cool the racks. Since the heat dissipation capacity of a fluid is much greater than that of air, it is more economical to move a cooling fluid for cooling. Therefore, designing the cooling fluid to be closer to the IT devices, either indirectly or directly in contact with the electronic devices, is an effective means. Summary of the Invention

[0004] According to one aspect of the present disclosure, a cooling plate is provided. The cooling plate includes: an inlet port configured to receive a two-phase fluid from a cooling source; a substrate attached to a server electronic device for cooling; a plurality of heat dissipation structures arranged on and spaced apart from the substrate to extend a heat exchange area from the substrate; and a plurality of fluid channels arranged on the substrate, wherein each of the plurality of fluid channels is located between a pair of adjacent heat dissipation structures, and wherein each fluid channel includes: a channel inlet configured to receive at least a portion of the two-phase fluid from the inlet port, a channel outlet configured to allow the received portion of the two-phase fluid to flow through and out of the corresponding fluid channel, and at least one intermediate outlet arranged between the channel inlet and the channel outlet to allow at least a portion of the received two-phase fluid to be discharged in the form of vapor or liquid.

[0005] According to another aspect of the present disclosure, a server housing is provided. The server housing includes: at least one supply line; at least one fluid supply device connector coupled to the at least one supply line; a server chassis that houses server electronic devices, wherein the server chassis is at least partially immersed in a two-phase immersion fluid; and at least one cooling plate housed within the server chassis, wherein the cooling plate includes: an inlet port configured to receive a two-phase fluid from the fluid supply device connector; a substrate attached to the server electronic device for cooling; a plurality of heat dissipation structures arranged on and spaced apart from the substrate to extend a heat exchange area from the substrate; and a plurality of fluid channels arranged on the substrate, wherein each of the plurality of fluid channels is located between a pair of adjacent heat dissipation structures, and wherein each fluid channel includes: a channel inlet configured to receive at least a portion of the two-phase fluid from the inlet port; a channel outlet configured to allow the received portion of the two-phase fluid to flow through and out of the corresponding fluid channel; and at least one intermediate outlet arranged between the channel inlet and the channel outlet to allow at least a portion of the received two-phase fluid to be discharged in the form of vapor or liquid.

[0006] According to another aspect of the present disclosure, a cooling system is provided. The cooling system includes: a soaking housing; a distribution manifold coupled to the soaking housing, wherein the distribution manifold includes: at least one fluid outlet and a pump, wherein the pump distributes a two-phase fluid that can be accommodated in the soaking housing to the at least one fluid outlet; and a server housing that can be accommodated in the soaking housing, wherein the server housing includes: at least one supply line; at least one fluid supply device connector coupled between the at least one fluid outlet of the distribution manifold and the at least one supply line; a server chassis that houses server electronics, wherein the server chassis is at least partially immersed in a two-phase soaking fluid; and at least one cooling plate that can be attached to the server electronics, wherein the cooling plate includes: an inlet port configured to receive the two-phase fluid from the fluid supply device connector; a substrate attached to the server electronics for cooling; a plurality of heat dissipation structures arranged on and spaced apart from the substrate to expand a heat exchange area from the substrate; and a plurality of fluid channels arranged on the substrate, wherein each of the plurality of fluid channels is located between a pair of adjacent heat dissipation structures, and wherein each fluid channel includes: a channel inlet configured to receive at least a portion of the two-phase fluid from the inlet port; a channel outlet configured to allow the received portion of the two-phase fluid to flow through and exit the corresponding fluid channel; and at least one intermediate outlet arranged between the channel inlet and the channel outlet to allow at least a portion of the received two-phase fluid to be discharged in the form of vapor or liquid.

[0007] This summary outlines some features and advantages of embodiments of the present disclosure; however, the present disclosure also presents other features, advantages, and embodiments, or other features, advantages, and embodiments will be apparent to those skilled in the art based on the drawings, description, and claims of the present disclosure. Therefore, it should be understood that the scope of the present disclosure should not be limited by the specific embodiments disclosed in the summary. Brief Description of the Drawings

[0008] Embodiments of the present disclosure are illustrated by way of example and not limitation in the accompanying drawings, in which like reference numerals indicate similar elements, and in which:

[0009] Figure 1 A block diagram of a two-phase immersion cooling system according to an embodiment is shown;

[0010] Figure 2A - 2BA block diagram showing a top view of a cooling plate according to some embodiments;

[0011] Figure 3A A block diagram showing a side view of a cooling plate according to an embodiment;

[0012] Figure 3B A block diagram showing a cross - section of a fluid channel according to an embodiment;

[0013] Figure 4 A block diagram showing a perspective view of a cooling plate according to an embodiment;

[0014] Figure 5 A block diagram showing a perspective view of a server housing according to an embodiment;

[0015] Figure 6 A block diagram showing the system operation of a two - phase immersion cooling system according to an embodiment; and

[0016] Figure 7 A block diagram showing the system control of a two - phase immersion cooling system according to an embodiment. Detailed Description

[0017] Various embodiments and aspects of the present disclosure will be described with reference to the details discussed below and illustrated by the accompanying drawings. The following description and drawings are illustrative of the present disclosure and should not be construed as limiting the present disclosure. Many specific details are described to provide a thorough understanding of the various embodiments of the present disclosure. However, in some instances, well - known or conventional details are not described in order to provide a concise discussion of the embodiments of the present disclosure.

[0018] References to "an embodiment" or "one embodiment" in the specification mean that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present disclosure. The phrases "in an embodiment" appearing in different places in the specification do not necessarily refer to the same embodiment.

[0019] Immersion cooling involves immersing an electronic device at least partially in a non - conductive dielectric solution and is a viable solution for high - density electronic devices. Generally, two - phase immersion cooling only considers fluid recirculation for an electronic rack and does not consider local cooling acceleration. Heterogeneous electronic components will generate predictable hotspots under two - phase immersion cooling. Therefore, local cooling acceleration is needed to handle the hotspots of different electronic hardware, chips, and configuration structures.

[0020] The solution of the two-phase immersion system only considers the fluid recirculation at the rack level and does not consider any local cooling acceleration. Embodiments of the present disclosure propose a hardware design for cooling devices used in both servers and immersion tanks. For example, the present disclosure provides a two-phase immersion system that utilizes Local Fluid Acceleration to better manage and recirculate the two-phase immersion cooling fluid. The current hardware design can be used for heterogeneous servers with different chip configurations to coexist in a single tank.

[0021] According to a first aspect, a cooling plate includes an inlet port, a substrate, a plurality of heat dissipation structures, and a plurality of fluid channels. The inlet port is configured to receive a two-phase fluid; the substrate is attached to a server electronic device for cooling; the plurality of heat dissipation structures are arranged on and spaced apart from the substrate to extend a heat exchange area from the substrate; the plurality of fluid channels are arranged on the substrate, and each of the plurality of fluid channels is located between a pair of adjacent heat dissipation structures. Each fluid channel includes a channel inlet, a channel outlet, and at least one intermediate outlet. The channel inlet receives at least a portion of the two-phase fluid from the inlet port; the channel outlet allows the received portion of the two-phase fluid to flow through and exit the corresponding fluid channel; the at least one intermediate outlet is arranged between the channel inlet and the channel outlet to allow at least a portion of the received two-phase fluid to be discharged in the form of vapor or liquid. The two-phase fluid refers to a liquid coolant that cools the electronic device by undergoing a phase change from a liquid phase to a vapor phase when the electronic device is in thermal contact with the liquid coolant during the cooling process.

[0022] In one embodiment, the heat dissipation structure is in thermal contact with the fluid channel. In one embodiment, the cooling plate further includes an inlet channel coupled between the inlet port and the channel inlet of each fluid channel to distribute the two-phase fluid to the fluid channels. In one embodiment, the height of each heat dissipation structure is greater than the height of the corresponding fluid channel. In one embodiment, the shape factors of the respective fluid channels are different. In one embodiment, the intermediate outlet of the corresponding fluid channel is in a serpentine shape or a rectangular shape.

[0023] In one embodiment, each fluid channel includes at least one outlet that is close to the tip portion of the corresponding heat dissipation structure. In one embodiment, the intermediate outlet is arranged on the surface of the corresponding fluid channel that is away from the substrate. In one embodiment, the channel inlet is arranged at a first end of the corresponding fluid channel, and the channel outlet is arranged at a second end of the corresponding fluid channel. In one embodiment, when the cooling plate is immersed in the two-phase immersion fluid in an immersion tank environment, the vapor-phase or mixed-phase two-phase fluid will leave the fluid channel to mix with the two-phase immersion fluid.

[0024] According to a second aspect, a server housing includes at least one supply line, at least one fluid supply device connector, a server chassis, and at least one cooling plate. At least one fluid supply device connector is coupled to at least one supply line; the server chassis houses server electronic devices, and the server chassis is at least partially immersed in a two-phase immersion fluid; and at least one cooling plate is housed within the server chassis. The cooling plate includes an inlet port, a substrate, a plurality of heat dissipation structures, and a plurality of fluid channels. The inlet port receives a two-phase fluid from the fluid supply device connector; the substrate is attached to the server electronic devices for cooling; the plurality of heat dissipation structures are arranged on and spaced apart on the substrate to expand a heat exchange area from the substrate; the plurality of fluid channels are arranged on the substrate, and each of the plurality of fluid channels is located between a pair of adjacent heat dissipation structures. Each fluid channel includes a channel inlet, a channel outlet, and at least one intermediate outlet. The channel inlet receives at least a portion of the two-phase fluid from the inlet port; the channel outlet allows the received portion of the two-phase fluid to flow through and exit the corresponding fluid channel; and at least one intermediate outlet is arranged between the channel inlet and the channel outlet to allow at least a portion of the received two-phase fluid to be discharged in the form of vapor or liquid.

[0025] According to a third aspect, a cooling system includes an immersion housing and a distribution manifold coupled to the immersion housing. The distribution manifold includes at least one fluid outlet and a pump that distributes a two-phase fluid that can be accommodated in the immersion housing to the at least one fluid outlet. The cooling system further includes a server housing that can be accommodated in the immersion housing. The server housing includes at least one supply line, at least one fluid supply device connector, a server chassis, and at least one cooling plate. At least one fluid supply device connector is coupled between the at least one fluid outlet of the distribution manifold and the at least one supply line; the server chassis houses server electronic devices, and the server chassis is at least partially immersed in a two-phase immersion fluid; and at least one cooling plate is housed in the server chassis.

[0026] The cold plate includes an inlet port, a substrate, a plurality of heat dissipation structures, and a plurality of fluid channels. Among them, the inlet port receives a two-phase fluid from a fluid supply device connector; the substrate is attached to the server electronic device for cooling; the plurality of heat dissipation structures are arranged on the substrate and spaced apart on the substrate to expand the heat exchange area from the substrate, and the plurality of fluid channels are arranged on the substrate. Among them, each fluid channel in the plurality of fluid channels is located between a pair of adjacent heat dissipation structures. Each fluid channel includes a channel inlet, a channel outlet, and at least one intermediate outlet. Among them, the channel inlet receives at least a part of the two-phase fluid from the inlet port, the channel outlet allows the received part of the two-phase fluid to flow through and leave the corresponding fluid channel, and at least one intermediate outlet is arranged between the channel inlet and the channel outlet to allow at least a part of the received two-phase fluid to be discharged in the form of steam or liquid. The fluid outlet on the distribution manifold can be a quick-disconnect device, which is designed to engage with the fluid supply device connector of the server.

[0027] In one embodiment, the cooling system includes a temperature sensor, and among them, the pump can be controlled by the temperature sensor to manage the flow of the two-phase fluid flowing into the fluid channel. In another embodiment, the temperature sensor can be a part of the server electronic device.

[0028] Figure 1 A block diagram of a two-phase immersion cooling system 100 according to an embodiment is shown. The cooling system 100 may include a server housing 104, and the server housing 104 may include an electronic server (or server 102) immersed in a two-phase immersion coolant fluid 103, and the two-phase immersion coolant fluid 103 is accommodated in an immersion housing 101 for immersion cooling.

[0029] Server 102 can be configured to provide IT services. Specifically, server 102 can include a host server (referred to as a host node) and / or at least one computing server (also referred to as a computing node, such as a CPU server and a GPU server). The host server (having at least one CPU) typically interacts with a client (not shown) via a network (such as the Internet) to receive requests for specific services, such as storage services (e.g., cloud-based storage services such as backup and / or recovery), executing an application to perform certain operations (e.g., image processing, deep data learning algorithms, or modeling as part of a software as a service or SaaS platform). In response to the request, the host server distributes tasks to at least one performance computing node or computing server (having at least one GPU) managed by the host server. In one embodiment, server 102 can perform any type of computing task and / or can be any type of computer device (e.g., a server, a storage device, etc.). In one embodiment, server 102 can be an edge computing device. Thus, when server 102 provides IT services, the heat generated by each server 102 is transferred to the two-phase immersion fluid 103.

[0030] In one embodiment, the cooling system 100 includes a pump 107 and a loop line 109, and the pump 107 and the loop line 109 are encapsulated within an immersion housing 101. In one embodiment, the pump 107 is part of a distribution manifold 111 and the pump 107 is immersed in the two-phase immersion fluid 103. In another embodiment, the pump 107 is located above or partially above the two-phase immersion fluid 103, and the loop line 109 extends into the two-phase immersion fluid 103.

[0031] In one embodiment, the system 100 includes a distribution manifold 111. The distribution manifold 111 can be connected to the pump 107, and the distribution manifold 111 can be located above the two-phase fluid 103. The distribution manifold 111 can include a fluid outlet 113 to distribute the fluid to a supply line 115, and the supply line 115 supplies the fluid to respective cooling modules 105A - B.

[0032] Each server 102 can include server electronics that can be attached to at least one cooling plate 105A - B to be cooled more rapidly. When the cooling plates 105A - B are deployed, two-phase fluid is supplied from the distribution manifold 111 through the fluid outlet 113 and the supply line 115 to the cooling plates 105A - B.

[0033] In one embodiment, system 100 includes a condensation unit (condenser) 117 located at the upper portion of the immersion housing 101 for condensing the vapor-phase two-phase coolant back to the liquid phase. The cooling plates 105A-B can be coupled to a distribution manifold to supply the two-phase fluid to the cooling plates 105A-B for extracting heat from server electronics attachable to the cooling plates 105A-B. The liquid-phase two-phase fluid can be discharged from the cooling plates 105A-B and mixed with the two-phase immersion fluid 103. The vapor-phase two-phase fluid can be discharged from the cooling plates 105A-B, rise to the upper portion of the immersion housing 101. Then, the vapor can enter the condensation unit 117, thereby condensing the vapor back to the liquid phase. The liquid-phase two-phase fluid directly drips back into the immersion housing 101 under the action of gravity and is mixed with the two-phase immersion fluid 103 in the immersion housing 101.

[0034] Figure 2A A block diagram showing a top view of a cooling plate 105A according to one embodiment is presented. The cooling plate 105A may include an inlet port 201 and an inlet channel 203 coupled to the inlet port 201. The inlet port 201 may be used to receive the supplied liquid-phase two-phase coolant fluid. The supplied two-phase coolant fluid can enter the inlet channel 203. The inlet channel 203 can fan out the two-phase coolant fluid to distribute the two-phase coolant fluid to a channel inlet 209 corresponding to each of at least one fluid channel 205A-C of the cooling plate 105A. At least one fluid channel 205A-C may be arranged on a substrate 211 of the cooling plate 105A. In one embodiment, the fluid channels 205A-C may be made of a porous mesh material that surrounds and shapes the channels. In one embodiment, the fluid channels 205A-C are channels with open spaces at the top and bottom.

[0035] The channel inlet 209 corresponding to the fluid channels 205A-C may be fixed to the inlet channel 203 to receive the two-phase fluid from the inlet channel 203. The channel inlet 209 is the inlet point for the two-phase fluid of the fluid channels 205A-C.

[0036] In one embodiment, the cold plate 105A includes a substrate 211 and at least one heat dissipation structure 207 for extending the heat exchange area from the substrate 211. The heat dissipation structure 207 may be disposed on and spaced apart from the substrate 211 of the cold plate 105A. The heat dissipation structure 207 and / or the substrate 211 may include copper, aluminum, and any other thermally conductive material or a combination thereof. In one embodiment, the heat dissipation structure 207 may be in thermal contact with adjacent fluid channels 205A-C. The fluid channels 205A-C are designed to guide a two-phase fluid through a length of the fluid channel, where the two-phase fluid may be discharged at at least one intermediate outlet along the fluid channel or at an outlet located at an opposite end of the fluid channel. Since the fluid channels 205A-C are in thermal contact with the substrate 211 and / or the heat dissipation structure 207, the two-phase fluid can extract heat from the substrate 211 or the heat dissipation structure 207, where the substrate 211 may be attached to the server electronic device to accelerate the cooling of the server electronic device. In one embodiment, the fluid channels 205A-C are inserted under and fixed by the bridge 217. The cold plate 105A may further include an outlet port 213 at the end of the fluid channels 205A-C, where the two-phase fluid can be discharged from the cold plate 105A. The two-phase fluid discharged from the cold plate 105A in the liquid phase can be mixed with the two-phase immersion fluid in the immersion housing 101, while the two-phase fluid present in the cold plate 105A in the vapor phase can rise to the upper part of the immersion housing. The vapor can be condensed by the condensation unit 117, and the condensed fluid can directly fall into the immersion housing 101. Therefore, the cold plate 105A having the heat dissipation structure 207 and the fluid channels 205A-C can accelerate the cooling of the server electronic device of the server 202.

[0037] Figure 2B A block diagram showing a top view of a cold plate 105B according to an embodiment is shown. The cold plate 105B may include a heat dissipation structure 207 and fluid channels 205D-E. In one embodiment, as Figure 2B shown, some portions of the heat dissipation structure 207 may include edges 215 or bridges 217 in a serpentine or toothed or any other shape to fix the fluid channels 205D-E. As Figure 3A shown, the edges 215 or bridges 217 may be disposed between the heat dissipation structures 207. The edges 215 / bridges 217 may be located at approximately half of the height of the heat dissipation structure 207. As Figure 3A shown, the fluid channels 205 may be located between two adjacent heat dissipation structures 207 and below the edges 215 and bridges 217. Returning to reference Figure 2A -B, the channels 205A-E may include intermediate outlets 219 for discharging the two-phase fluid from the cold plate 105.

[0038] In one embodiment, as described above, the heat dissipation structure 207 and the substrate 211 can be fabricated as a single component. Since the teeth 215 or the bridges 217 are located at approximately half of the height of the heat dissipation structure 207, the fluid channel 205 can be inserted into the space between the heat dissipation structure 207, the substrate 211, and the teeth 215 / bridges 217. That is, the fluid channel 205 can be located below the teeth 215 / bridges 217, and the teeth 215 / bridges 217 can provide structural support for the fluid channel 205 and fix the fluid channel 205.

[0039] Figure 3A A block diagram showing a side view of a cooling plate 105 according to an embodiment. As Figure 3A shown, in one embodiment, the height of the heat dissipation structure 207 of the cooling plate 105 is greater than the height of the fluid channel 205. In one embodiment, the fluid channel 205 is fixed by the bridges 217 or the serpentine / toothed edges 215. In one embodiment, the heat dissipation structure 207 and / or the bridges 217 or the teeth 215 can be assembled or directly fabricated on the substrate 211. The substrate 211 can be used as Figure 1 a part of the server 102 in, and is directly attached to the high-performance server electronic device 301. As described above, the end of the fluid channel 205 opposite to the substrate 211 can be provided with an outlet for the two-phase coolant fluid. Therefore, the vapor-phase or mixed-phase fluid can be discharged from the fluid channel 205 for mixing in the immersion tank environment.

[0040] The heat flow (or thermal cooling) of the cooling plate 105 can be represented by #1 to #4. #1 can represent the overall heat flow from the server electronic device 301 to the cooling plate 105, #2 represents the active heat extraction via the two-phase fluid at the fluid channel 205, #3 represents the heat conduction of the heat dissipation structure 207, and #4 represents the heat extraction from the heat dissipation structure 207 to the two-phase immersion fluid in the surrounding immersion environment.

[0041] Figure 3B A block diagram 300 showing a cross-section of a fluid channel 205 according to an embodiment. The block diagram 300 can represent the view at Figure 2B the cross-section x. As Figure 3B shown, the fluid channel 205 provides a channel for the two-phase fluid to flow from the channel inlet 209 to the channel outlet 213. The two-phase fluid can be discharged at the channel outlet 213 in the form of a liquid phase or a mixed phase, or at any intermediate channel outlet 219. In this embodiment, the fluid channel 205 is formed by the substrate 211 and the outer surfaces of the adjacent radiators 207. The intermediate outlet 219 is located at the top of the fluid channel 205, and the intermediate outlet 219 is formed by the 215 / 217 between two adjacent radiators 207.

[0042] Figure 4 A block diagram showing a perspective view of a cold plate 105 according to an embodiment. Figure 5 A block diagram showing a perspective view of a server housing according to an embodiment. The inlet channel 203 may include an opening or an intermediate outlet to engage with the channel inlet 209.

[0043] As Figure 4 and Figure 5 shown, the cold plate 105 may include an inlet port 201, an inlet channel 203, a fluid channel 205, and a heat dissipation structure 207. The fluid channel 205 may include an outlet port 213. In addition, the fluid channel 205 may include an inlet 209 that engages with the inlet channel 203. Additional intermediate outlets 219 for discharging the two-phase fluid from the cold plate 105 may be provided anywhere along the fluid channel.

[0044] As Figure 5 shown, the server housing 104 may be used to house the cold plate 105 and the server electronics 301. The server housing 104 may include a housing inlet port 501 and an integrated loop 503 to direct the fluid flow from the inlet port 501 to the port 201 of the cold plate 105. The inlet port 501 may be connected to a distribution manifold 111 (as Figure 1 shown). In one embodiment, the cold plate 105 may be equipped with an expandable inlet port 201 (which may be directly connected to the distribution manifold 111). In one embodiment, the server housing 104 may include a chassis main frame that includes openings / perforations 505 for fluid recirculation. During operation, the server housing 104, the server electronics 301, and / or the server 102 may be fully immersed or partially immersed in a two-phase fluid in a soaking environment.

[0045] Figure 6 A block diagram showing the system operation of a two-phase immersion cooling system 100 according to an embodiment. Referring to Figure 6 , during the operating state, the system operation of the cooling system 100 may be described by #1 to #6. As Figure 6As shown, #1 may represent that the two-phase immersion fluid 103 (which is in the liquid phase in the immersion housing 101) is pumped to the distribution manifold 111. #2 may represent that the two-phase fluid is supplied to the cooling plates 105A-B via the supply manifold 111 and via line 115. #3 may represent that the two-phase fluid is discharged from the cooling plates 105A-B in the liquid phase. #4 may represent that the two-phase fluid is discharged from the cooling plates 105A-B in the vapor phase, wherein one or both of the heat dissipation structure and / or the fluid channels cause the two-phase fluid to evaporate. #5 may represent the overall evaporation path of the two-phase coolant in the vapor phase. Here, the vapor rises above the two-phase immersion fluid 103 in the liquid phase. #6 may represent that the vapor is condensed back into the two-phase fluid 103 in the liquid phase by the condensation unit 117, wherein the two-phase fluid is mixed with the two-phase immersion fluid 103.

[0046] Figure 7 FIG. shows a block diagram of the system control of a two-phase immersion cooling system 100 according to an embodiment. As Figure 7 shown, in one embodiment, the immersion cooling system 100 includes a pump 705 and a line 707 to supply an external cooling fluid (air, antifreeze, water, etc.) to the condensation unit 117. The system control of pumps 107 and 705 is designed as follows.

[0047] In one embodiment, the immersion cooling system 100 includes at least one temperature sensor 701 that can be used to manage the flow rate of the fluid through pump 107. For example, a highest sensor reading and / or an average reading of sensor 701 above a threshold may trigger an increase in the flow rate of pump 107. The temperature sensor 701 may obtain a temperature reading of a server electronic device (high-density chip) as part of the server electronic device, or may be implemented near the cooling plate 105, or as part of the cooling plate 105. For example, the temperature sensor 701 may be embedded at the heat dissipation structure, at the fluid channel, or on the substrate of the cooling plate 105.

[0048] In one embodiment, the immersion system 100 includes a power sensor 703 for sensing the power used by the immersion housing 101. For example, a reading of sensor 703 above a threshold may trigger an increase in the flow rate of pump 705, thereby increasing the external cooling capacity transferred from the external loop 707 to the condensation unit 117. Thus, the cooling plates and the immersion cooling system can maintain a two-phase immersion environment and also utilize the two-phase fluid for local cooling acceleration.

[0049] In the foregoing specification, embodiments of the present disclosure have been described with reference to specific exemplary embodiments of the present disclosure. Clearly, various modifications can be made thereto without departing from the broader spirit and scope of the present disclosure as set forth in the following claims. Accordingly, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense.

Claims

1. A cooling plate, comprising: An inlet port configured to receive a two-phase fluid from a cooling source; A substrate attached to a server electronic device for cooling; A plurality of heat dissipation structures arranged on and spaced apart from each other on the substrate to expand a heat exchange area from the substrate; And A plurality of fluid channels arranged on the substrate, wherein each of the plurality of fluid channels is located between a pair of adjacent heat dissipation structures, and each of the fluid channels includes: A channel inlet configured to receive at least a portion of the two-phase fluid from the inlet port; A channel outlet configured to allow the received portion of the two-phase fluid to flow through and exit the corresponding fluid channel, and At least one intermediate outlet arranged between the channel inlet and the channel outlet to allow at least a portion of the received two-phase fluid to be discharged in the form of vapor or liquid.

2. The cooling plate according to claim 1, wherein, The plurality of heat dissipation structures are in thermal contact with the plurality of fluid channels.

3. The cooling plate according to claim 1, further comprising an inlet channel coupled between the inlet port and the channel inlet of each fluid channel to distribute the two-phase fluid to the fluid channels.

4. The cooling plate according to claim 1, wherein, The height of each of the plurality of heat dissipation structures is greater than the height of the corresponding fluid channel.

5. The cooling plate according to claim 1, wherein, The intermediate outlet of the fluid channel is in a serpentine shape or a rectangular shape.

6. The cooling plate according to claim 1, wherein, Each of the plurality of fluid channels includes at least one outlet near an end portion of the corresponding heat dissipation structure.

7. The cooling plate according to claim 1, wherein, The intermediate outlet is arranged on a surface of the fluid channel away from the substrate.

8. The cooling plate according to claim 1, wherein, The channel inlet is arranged at a first end of the fluid channel, and the channel outlet is arranged at a second end of the fluid channel.

9. The cooling plate according to claim 1, wherein, When the cooling plate is immersed in a two-phase immersion fluid in an immersion tank environment, the two-phase fluid in the vapor phase or the mixed phase will leave the fluid channel to mix with the two-phase immersion fluid.

10. A server housing, comprising: At least one supply line; At least one fluid supply device connector coupled to the at least one supply line; A server chassis that houses a server electronic device, wherein the server chassis is at least partially immersed in a two-phase immersion fluid; and At least one cooling plate housed within the server chassis, wherein the cooling plate includes: An inlet port configured to receive a two-phase fluid from the fluid supply device connector; A substrate attached to the server electronic device for cooling; A plurality of heat dissipation structures arranged on and spaced apart from each other on the substrate to expand a heat exchange area from the substrate; and A plurality of fluid channels arranged on the substrate, wherein each of the plurality of fluid channels is located between a pair of adjacent heat dissipation structures, and each of the fluid channels includes: A channel inlet configured to receive at least a portion of the two-phase fluid from the inlet port; A channel outlet configured to allow the received portion of the two-phase fluid to flow through and exit the corresponding fluid channel; and At least one intermediate outlet, the at least one intermediate outlet being arranged between the channel inlet and the channel outlet to allow at least a portion of the received two-phase fluid to be discharged in vapor form or liquid form.

11. The server housing according to claim 10, wherein, The plurality of heat dissipation structures are in thermal contact with the plurality of fluid channels.

12. The server housing according to claim 10 further includes an inlet passage that is coupled between the inlet port and the passage inlet of each fluid passage to distribute the two-phase fluid to the fluid passages.

13. The server housing according to claim 10, wherein The height of each of the plurality of heat dissipation structures is greater than the height of the corresponding fluid channel.

14. The server housing according to claim 10, wherein The intermediate outlet of the fluid channel is in a serpentine shape or a rectangular shape.

15. The server housing according to claim 10, wherein Each of the plurality of fluid channels includes at least one outlet, the at least one outlet being close to the end portion of the corresponding heat dissipation structure.

16. The server housing according to claim 10, wherein The intermediate outlet is arranged on the surface of the fluid channel away from the substrate.

17. The server housing according to claim 10, wherein The channel inlet is arranged at the first end of the fluid channel, and the channel outlet is arranged at the second end of the fluid channel.

18. The server housing according to claim 10, wherein When the cooling plate is immersed in the two-phase immersion fluid in the immersion tank environment, the two-phase fluid in vapor phase or mixed phase will leave the fluid channel to mix with the two-phase immersion fluid.

19. A cooling system, comprising: Immersion housing; Distribution manifold, the distribution manifold being coupled to the immersion housing, wherein the distribution manifold includes: at least one fluid outlet and a pump, wherein the pump distributes the two-phase fluid that can be accommodated in the immersion housing to the at least one fluid outlet; and Server housing, the server housing being accommodable in the immersion housing, wherein the server housing includes: At least one supply line; At least one fluid supply device connector, the at least one fluid supply device connector being coupled between the at least one fluid outlet of the distribution manifold and the at least one supply line; Server chassis, the server chassis housing server electronics, wherein the server chassis is at least partially immersed in the two-phase immersion fluid; and At least one cooling plate, the at least one cooling plate being attachable to the server electronics, wherein the cooling plate includes: Inlet port, the inlet port being configured to receive the two-phase fluid from the fluid supply device connector; Substrate, the substrate being attached to the server electronics for cooling; A plurality of heat dissipation structures, the plurality of heat dissipation structures being arranged on and spaced apart on the substrate so as to expand the heat exchange area from the substrate; and A plurality of fluid channels, the plurality of fluid channels being arranged on the substrate, wherein each of the plurality of fluid channels is located between a pair of adjacent heat dissipation structures, and wherein each fluid channel includes: Channel inlet, the channel inlet being configured to receive at least a portion of the two-phase fluid from the inlet port; Channel outlet, the channel outlet being configured to allow the received portion of the two-phase fluid to flow through and leave the corresponding fluid channel; and At least one intermediate outlet, the at least one intermediate outlet being arranged between the channel inlet and the channel outlet to allow at least a portion of the received two-phase fluid to be discharged in vapor form or liquid form.

20. The cooling system according to claim 19 further includes: Temperature sensor, wherein the pump can be controlled by the temperature sensor to manage the flow of the two-phase fluid to the plurality of fluid channels.

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