Wire upsetting system

Abstract

The application discloses a wire upsetting processing system, and the wire upsetting processing die is connected to the upside of the wire upsetting processing equipment; the upper die and the lower die are coaxially arranged, the wire upsetting structure is arranged in the upper die; the lower die is arranged in a two-lobed structure; the upper die driving device and the lower die fixing device are oppositely arranged, and the wire feeding device is arranged at the end of the lower die fixing device away from the upper die driving device; the lower die fixing device is arranged in an upper and lower two-lobed structure, and the two-lobed structure of the lower die is fixedly connected in the lower die fixing device. The wire upsetting processing system has the advantages that the structure design is reasonable, the wire upsetting processing requirement of the wire with a large length-diameter ratio can be met, the horizontally arranged wire upsetting structure further meets the supporting action on the wire with a large length, and the wire is prevented from being bent and damaged.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wire upsetting system structure design, and particularly relates to a wire upsetting system. BACKGROUND

[0002] With the development of science and technology, further requirements are put forward for the processing and forming of materials.

[0003] In the medical industry, the demand for medical guide wires gradually requires a larger length-diameter ratio from no demand originally.

[0004] In the existing structure, the upsetting structure processing can only meet the processing of a length-diameter ratio less than 2.6, and only meets the upsetting requirements of a wire with a small length. However, in the prior art, in order to ensure the medical treatment effect, a larger length-diameter ratio processing and forming is required to meet the treatment purpose requirements of the medical guide wire. In particular, the nickel-titanium alloy wire is widely used in the medical industry, but a larger length-diameter ratio is required for its processing.

[0005] In the prior art, there is no special equipment to realize the upsetting processing requirement of a length-diameter ratio greater than 2.6 in the wire upsetting equipment with a large length-diameter ratio. SUMMARY

[0006] Therefore, the main purpose of the present application is to provide a wire upsetting system with reasonable structure design, which meets the wire upsetting processing procedure requirements of a larger length-diameter ratio.

[0007] To achieve the above purpose, the technical scheme of the present application is as follows:

[0008] A wire upsetting system, comprising: a wire upsetting processing equipment and a wire upsetting processing die, the wire upsetting processing die is connected to the upper side of the wire upsetting processing equipment;

[0009] In a preferred embodiment, the wire upsetting processing die comprises: an upper die and a lower die, the upper die and the lower die are coaxially arranged, and the upper die is internally provided with a wire upsetting structure;

[0010] The lower die is provided in a two-lobed structure, and the wire to be processed is clamped in the middle of the two-lobed structure, and the end to be upset of the wire to be processed extends into the wire upsetting structure in the interior of the upper die;

[0011] The wire upsetting processing equipment comprises: an upper die driving device, a lower die fixing device and a wire feeding device, the upper die driving device and the lower die fixing device are oppositely arranged, and the wire feeding device is arranged at the end of the lower die fixing device away from the upper die driving device;

[0012] The upper die is fixedly connected with the upper die driving device.

[0013] The lower die fixing device is provided with two parts, which are fixedly connected to the inside of the lower die fixing device respectively.

[0014] In a preferred embodiment, the lower die comprises an upper die part and a lower die part, both of which are semi-cylindrical structures, and a clamping hole is formed at the center of the upper die part and the lower die part, and the wire rod to be processed is clamped in the clamping hole.

[0015] In a preferred embodiment, the upper die comprises a die handle, and the wire rod upsetting structure comprises a floating die plate and a press head.

[0016] In a preferred embodiment, the press head is fixedly connected to the end of the die handle, the floating die plate is slidingly connected to the end of the die handle, a forming cavity is formed at the center of the floating die plate, the press head extends into the forming cavity, the end of the wire rod to be processed extends into the forming cavity, and the press head presses the end to be upset of the wire rod to be processed.

[0017] In a preferred embodiment, the forming cavity comprises a forming head part, a forming hole part and a guide hole part, the forming head part is formed at the end of the floating die plate away from the die handle, the guide hole part is formed at the end of the floating die plate close to the die handle, and the forming hole part is formed between the forming head part and the guide hole part.

[0018] In a preferred embodiment, the press head comprises a guide part and a pressing rod part, the guide part and the pressing rod part are integrally formed, the diameter of the guide part is the same as that of the forming hole part, the diameter of the pressing rod part is the same as that of the guide hole part, the guide part and the pressing rod part extend into the guide hole part and the forming hole part, and the pressing rod part extends into the forming head part to press the end to be upset of the wire rod to be processed.

[0019] In a preferred embodiment, the wire rod upsetting structure further comprises a ventilation hole, the ventilation hole is formed at one end of the guide hole part close to the forming hole part, and the other end of the ventilation hole extends out of the outer wall of the floating die plate.

[0020] In a preferred embodiment, the upper die further comprises a fixed plate, the fixed plate is fixedly connected to the die handle, the press head is fixedly connected to the center of the fixed plate, guide columns are fixedly connected to the edges of the fixed plate, guide holes are formed through the floating die plate, and the guide columns pass through the guide holes.

[0021] In a preferred implementation form, the wire upsetting structure further comprises: a rebound spring, the outer ring of the press head is provided with a lower ring groove, the rebound spring is fixedly connected inside the lower ring groove, and the other end of the rebound spring supports the floating die plate.

[0022] In a preferred implementation form, the floating die plate is close to one end of the fixed plate, the lower ring groove is provided with an upper ring groove in the extension direction, and the other end of the rebound spring extends into the upper ring groove.

[0023] In a preferred implementation form, further comprising: a limiting plate, the limiting plate is fixedly connected to the end of the guide column, and the limiting plate limits the stroke of the floating die plate.

[0024] In a preferred implementation form, the fixed plate is provided with a guide column hole at the edge, the guide column hole is provided with a stepped first counterbore close to one end of the die handle, the end of the guide column is a stepped column, the stepped column and the first counterbore have the same structure size, the guide column passes through the guide column hole, and the fixed plate is pressed and fixed to the stepped column through the first counterbore.

[0025] In a preferred implementation form, the fixed plate is provided with a press head hole at the center, the press head hole is provided with a stepped second counterbore close to one end of the die handle, the end of the press head away from the pressing rod is a stepped head, the stepped head and the second counterbore have the same structure size, the press head passes through the press head hole, and the fixed plate is pressed and fixed to the stepped head through the second counterbore.

[0026] In a preferred implementation form, further comprising: a wire heating device, the wire heating device is slidingly connected to one side of the junction between the upper die driving device and the lower die fixing device, so that the wire heating device is slidingly separated from the position between the upper die driving device and the lower die fixing device after heating the wire to be processed.

[0027] In a preferred implementation form, further comprising: a machine body, the upper die driving device, the lower die fixing device, the wire feeding device, and the wire heating device are fixedly connected to the upper surface of the machine body.

[0028] In a preferred implementation form, the lower die fixing device comprises: an upper shell, a lower shell, and a support frame, the lower shell is connected to the upper surface of the machine body, the support frame is fixedly connected to one side of the lower shell, and the upper shell is drivingly connected above the support frame, so that the upper shell and the lower shell are separably connected.

[0029] In a preferred implementation form, further comprising: a first driving device, the first driving device is fixedly connected to the upper side of the support frame, the extending end of the first driving device is fixedly connected to the upper shell, and drives the upper shell to move up and down above the lower shell.

[0030] In a preferred embodiment, the lower shell and the upper shell are centrally provided with a wire extension cavity, and the wire extension cavity is provided with a lower die fixing cavity at one end close to the upper die driving device, so that the lower die of the wire upsetting machining die is fixed in the lower die fixing cavity.

[0031] In a preferred embodiment, the upper die driving device comprises an upper die fixing plate, a mounting frame and a second driving device, the mounting frame is fixedly connected to the upper side of the machine body, the second driving device is fixedly connected to the side of the mounting frame away from the lower die fixing device, the driving rod of the second driving device is fixedly connected to the upper die fixing plate through the mounting frame, and the upper die fixing plate is fixedly connected to the upper die of the wire upsetting machining die at the side close to the lower die fixing device.

[0032] In a preferred embodiment, the lower bottom surface of the upper die fixing plate is fixedly connected with a dovetail groove structure, the surface of the machine body is fixedly connected with a dovetail structure, and the dovetail groove structure is slidably connected with the dovetail structure.

[0033] In a preferred embodiment, the wire feeding device comprises a wire bracket and a driving wire feeding structure, the wire bracket is fixedly connected to the end of the lower die fixing device away from the upper die driving device, the upper surface of the wire bracket is provided with a wire limiting groove, and the end of the wire bracket away from the lower die fixing device is fixedly connected with the driving wire feeding structure, so that the to-be-processed wire is arranged in the wire limiting groove and the driving wire feeding structure, and the driving wire feeding structure drives the to-be-processed wire to move.

[0034] In a preferred embodiment, the driving wire feeding structure comprises a driving frame and a driving wheel, the driving frame is fixedly connected to the tail end of the wire bracket, and the driving wheel is connected to the driving frame.

[0035] In a preferred embodiment, the driving wheel is provided in two rows, and the two rows of driving wheels are staggered, and the middle part of the driving wheel is provided with a groove structure, so that the to-be-processed wire is limited in the groove structure.

[0036] In a preferred embodiment, the wire heating device comprises a guide rail device and a high-frequency coil, the guide rail device is fixedly connected to the upper side of the machine body, and the sliding direction of the guide rail device is perpendicular to the central axis of the upper die driving device and the lower die fixing device.

[0037] In a preferred embodiment, the high-frequency coil is fixedly connected to the upper side of the guide rail device, the high-frequency coil slides along the guide rail device, so that the high-frequency coil is in contact with the to-be-processed wire for heating or is separated from the position between the upper die driving device and the lower die fixing device.

[0038] The wire upsetting processing system has the following beneficial effects:

[0039] The wire upsetting processing system, the wire upsetting processing die is connected to the upside of the wire upsetting processing equipment; the upper die and the lower die are coaxially arranged, the wire upsetting structure is arranged in the inside of the upper die; the lower die is arranged in a two-lobed structure, the wire to be processed is clamped in the middle of the two-lobed structure, and the end to be upset of the wire to be processed extends into the wire upsetting structure in the inside of the upper die; the upper die driving device and the lower die fixing device are oppositely arranged, the wire feeding device is arranged at the end of the lower die fixing device away from the upper die driving device; the upper die is fixedly connected with the upper die driving device; the lower die fixing device is arranged in an upper and lower two-lobed structure, and the two-lobed structure of the lower die is fixedly connected in the inside of the lower die fixing device.

[0040] The wire upsetting processing system solves the defect that the upsetting processing structure in the prior art can only realize the upsetting processing procedure requirement for the short and thick structure wire, and cannot realize the upsetting requirement for the wire with a large length-diameter ratio.

[0041] The wire upsetting processing system has a reasonable structure design, can meet the upsetting processing requirement of the wire with a large length-diameter ratio, the horizontally arranged upsetting structure further meets the supporting action for the wire with a large length, and avoids the bending damage of the wire. BRIEF DESCRIPTION OF DRAWINGS

[0042] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only show some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0043] Figure 1 Fig. 1 is a structure schematic view of the wire upsetting processing system according to an embodiment of the present application without installing the wire upsetting processing die;

[0044] Figure 2 Fig. 2 is a structure schematic view of the wire upsetting processing system according to an embodiment of the present application; Figure 1 Fig. 3 is a local enlarged view of the position A of the wire upsetting processing system according to an embodiment of the present application;

[0045] Figure 3 Fig. 4 is another angle structure schematic view of the wire upsetting processing system according to an embodiment of the present application; Figure 1

[0046] Figure 4 Fig. 5 is a structure schematic view of the wire upsetting processing system according to an embodiment of the present application;

[0047] Figure 5 Fig. 6 is another angle structure schematic view of the wire upsetting processing system according to an embodiment of the present application; Figure 4 ​Another angle structural schematic diagram of a wire upsetting processing system according to an embodiment of the present disclosure is shown in FIG. 1.

[0048] Figure 6 A structural schematic diagram of a wire upsetting processing die of a wire upsetting processing system according to an embodiment of the present disclosure is shown in FIG. 2.

[0049] Figure 7 A structural schematic diagram of a wire upsetting processing system according to an embodiment of the present disclosure is shown in FIG. 3. Figure 6 A structural schematic diagram of a wire upsetting processing die of a wire upsetting processing system according to an embodiment of the present disclosure is shown in FIG. 4.

[0050] Figure 8 A structural schematic diagram of a wire upsetting processing system according to an embodiment of the present disclosure is shown in FIG. 5. Figure 6 A sectional view of a wire upsetting processing die of a wire upsetting processing system according to an embodiment of the present disclosure is shown in FIG. 6.

[0051] Figure 9 A sectional view of a wire upsetting processing die of a wire upsetting processing system according to an embodiment of the present disclosure is shown in FIG. 7. Figure 7

[0052] A sectional view of a lower die of a wire upsetting processing die of a wire upsetting processing system according to an embodiment of the present disclosure is shown in FIG. 8. Figure 10

[0053] A structural schematic diagram of a ram of a wire upsetting processing die of a wire upsetting processing system according to an embodiment of the present disclosure is shown in FIG. 9. Figure 11

[0054] A front view of a ram of a wire upsetting processing die of a wire upsetting processing system according to an embodiment of the present disclosure is shown in FIG. 10. Figure 12

[0055]

Main component symbol explanation

[0056] 01, wire to be processed;

[0057] 02, upsetting end to be processed;

[0058] 03, wire upsetting processing die;

[0059] 1, upper die;

[0060] 11, die handle; 12, fixed plate; 13, guide column; 14, limiting plate;

[0061] 2, lower die;

[0062] 21, upper split die; 22, lower split die; 23, clamping hole;

[0063] 3, wire upsetting structure;

[0064] 31, floating die plate; 311, guide hole;​

[0065] 32, pressing head; 321, guide portion; 322, pressing rod portion; 323, step head;

[0066] 33, vent hole;

[0067] 34, rebound spring; 341, lower ring groove; 342, upper ring groove;

[0068] 4, forming cavity;

[0069] 41, forming head portion; 42, forming hole portion; 43, guide hole portion;

[0070] 5, upper mold driving device;

[0071] 51, upper mold fixed plate; 52, mounting frame; 53, second driving device;

[0072] 6, lower mold fixing device;

[0073] 61, upper housing; 62, lower housing; 63, support frame;

[0074] 64, first driving device; 65, lower mold fixing cavity;

[0075] 7, wire feeding device;

[0076] 71, wire carrier; 72, driving wire feeding structure;

[0077] 721, driving frame; 722, driving wheel;

[0078] 8, wire heating device;

[0079] 81, guide rail device; 82, high-frequency coil;

[0080] 9, machine body; 91, dovetail structure. DETAILED DESCRIPTION

[0081] The wire upsetting processing system of the present application will be further described in detail below in combination with the accompanying drawings and embodiments of the present application.

[0082] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0083] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0084] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0085] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0086] like Figures 1-12 As shown, the wire upsetting processing system includes: a wire upsetting processing device that supports and restricts the movement trajectory, and a wire upsetting processing mold 03 that mainly performs the upsetting function on the wire 01 to be processed. The wire upsetting processing mold 03 is connected to the upper side of the wire upsetting processing device.

[0087] The wire upsetting processing die 03 comprises: an upper die 1 mainly realizing the upsetting process of the wire to be processed 01; and a lower die 2 mainly clamping and fixing the wire to be processed 01 to avoid distortion of the wire to be processed 01. In order to ensure the upsetting process, especially during the combination of the upper die 1 and the lower die 2, the wire to be processed 01 is ensured to be on the same axis. The upper die 1 and the lower die 2 are coaxially arranged. In order to meet the upsetting process of the wire, the upper die 1 is internally provided with a wire upsetting structure 3.

[0088] In order to conveniently clamp the wire to be processed 01, especially the wire to be processed 01 with a long length, such as the wire to be processed 01 with a length greater than 1 m, the clamping operation of the wire to be processed 01 cannot be quickly and conveniently ensured in the existing structure. The lower die 2 is arranged in a two-lobed structure, and the wire to be processed 01 is clamped in the middle of the two-lobed structure. When the upsetting operation of the wire to be processed 01 is needed, the lower die 2 of the two-lobed structure is separated and opened, and then the wire to be processed 01 is placed in the middle position of the two-lobed structure, so as to meet the precise and rapid clamping of the wire to be processed 01. In order to upset the wire to be processed 01, the wire to be processed 01 is inserted into the wire upsetting structure 3 in the interior of the upper die 1, so as to meet the upsetting process requirements.

[0089] The wire upsetting processing device comprises: an upper die driving device 5 fixedly connected to the upper die and having a telescopic driving effect; a lower die fixing device 6 realizing opening of the lower die, placing the wire to be processed 01 into the lower die, and clamping and fixing the wire to be processed 01; and a wire feeding device 7 driving the wire to be processed 01 to move to a position, so as to meet the processing requirements. In order to meet the working requirements of the wire upsetting processing die 03 and finally realize the processing requirements of the wire to be processed 01, the upper die driving device 5 and the lower die fixing device 6 are oppositely arranged, and the wire upsetting processing die 03 is connected in the middle position of the opposite arrangement. Through the relative movement of the upper die driving device 5 and the lower die fixing device 6, the relative movement of the upper die and the lower die of the wire upsetting processing die 03 is realized, and then the upsetting processing process of the wire to be processed 01 is realized. In order to meet the position adjustment of the wire to be processed 01 and improve the processing accuracy, the wire feeding device 7 is arranged at one end of the lower die fixing device 6 away from the upper die driving device 5. Through the adjustment of the wire feeding device 7, the wire to be processed 01 can be smoothly moved to the set position, so as to meet the processing requirements of the upsetting process.

[0090] The upper die 1 is fixedly connected to the upper die driving device 5, and the upsetting process of the upper die is realized through the upper die driving device 5.

[0091] In order to adapt to the two-lobed structure of the lower die, the lower die fixing device is arranged in an upper and lower two-lobed structure, and the two-lobed structure of the lower die is fixedly connected in the interior of the lower die fixing device.

[0092] As Figures 6-12As shown, in order to facilitate the clamping of the to-be-processed wire 01, especially the to-be-processed wire 01 with a long length, such as the to-be-processed wire 01 with a length greater than 1 m, to avoid the existing structure that cannot quickly and conveniently ensure the clamping operation of the to-be-processed wire 01. The lower die 2 is provided in a two-lobed structure, and the to-be-processed wire 01 is clamped in the middle of the two-lobed structure. When the upsetting operation of the to-be-processed wire 01 is needed, the lower die 2 of the two-lobed structure is separated and opened, and then the to-be-processed wire 01 is placed in the middle position of the two-lobed structure, satisfying the precise and rapid clamping of the to-be-processed wire 01. In order to upset the to-be-processed wire 01, the to-be-upset end 02 of the to-be-processed wire 01 extends into the wire upsetting structure 3 inside the upper die 1, satisfying the process requirement of upsetting.

[0093] Specifically, in order to ensure the coaxiality processing requirement, and also in order to satisfy the to-be-processed wire 01 being arranged at the axial position, satisfying the upsetting action with the upper die 1. The lower die 2 comprises: an upper lobe die 21 and a lower lobe die 22, both of which are semi-cylindrical structures. The semi-cylindrical structure can ensure the coaxiality of the center axis during the lathe processing. Of course, in order to ensure that the to-be-processed wire 01 is arranged at the axial position, a clamping hole 23 is provided at the center of the upper lobe die 21 and the lower lobe die 22, and the to-be-processed wire 01 is clamped in the clamping hole 23. That is: as long as the clamping hole 23 is coaxial with the wire upsetting structure 3 in the upper die 1, the coaxiality requirement of the upsetting process can be ensured.

[0094] In order to clamp and fix the upper die 1, the upper die 1 comprises: a die handle 11. In order to satisfy the upsetting process, the wire upsetting structure 3 comprises: a floating die plate 31 and a pressure head 32.

[0095] In order to satisfy the upsetting process, the pressure head 32 is fixedly connected to the end of the die handle 11, and the floating die plate 31 is slidingly connected to the end of the die handle 11. A forming cavity 4 is provided at the center of the floating die plate 31, the pressure head 32 extends into the forming cavity 4, and the to-be-processed wire 01 extends into the forming cavity 4. The pressure head 32 tightly forms the to-be-upset end 02 of the to-be-processed wire 01.

[0096] During the upsetting process, the to-be-processed wire 01 extends into the forming cavity 4, the distance between the floating die plate 31 and the die handle 11 is maximum, so that the pressure head 32 does not extend into the forming cavity 4. By pushing the upper die 1 and the lower die 2 coaxially, the pressure head 32 extends into the forming cavity 4 to tightly form the to-be-processed wire 01. Of course, in order to satisfy the forming requirement, facilities required by the hot processing process can be provided outside.

[0097] In order to meet the requirements of the forming structure, meet the requirements of the wire 01 forming. The forming cavity 4 includes: meet the requirements of the wire 01 forming head structure forming head 41, deformation of the wire 01 extending size requirements of the forming hole 42, the guide hole 43 of the guide head. Forming head 41 is opened in the floating template 31 away from the handle 11 of one end, the guide hole 43 is opened in the floating template 31 close to the handle 11 of one end, the forming hole 42 is opened between the forming head 41 and the guide hole 43. When the pressure head 32 along the guide hole 43 into, the pressure head 32 of the pressure rod 322 along the forming hole 42 to the wire 01 forming pressure.

[0098] In order to adapt to the structure of the forming cavity 4, meet the requirements of the guide and pressure forming. The pressure head 32 includes: the guide hole 43 of the guide hole 43 and the pressure rod 322 of the wire 01 pressure forming. The guide hole 321 and the pressure rod 322 are integrally formed, the diameter of the guide hole 321 is the same as the diameter of the guide hole 43, the diameter of the pressure rod 322 is the same as the diameter of the forming hole 42, the guide hole 321 and the pressure rod 322 are inserted into the guide hole 43 and the forming hole 42, and the pressure rod 322 is inserted into the forming head 41 to form the wire 01 of the wire 01. Meet the requirements of the wire 01 processing forming.

[0099] In order to ensure that in the case of close cooperation, when the pressure head 32 along the forming cavity 4 pressure forming process. The wire upsetting structure 3 also includes: meet the requirements of the vent hole 33, the guide hole 43 is opened near the forming hole 42 of the vent hole 33, the other end of the vent hole 33 is extended outside the wall of the floating template 31. When the pressure head 32 along the forming cavity 4 sliding process, the air in the forming cavity 4 can be discharged and entered along the vent hole 33, to ensure that the pressure head 32 sliding process, not by the resistance of the compressed air.

[0100] In order to fix the pressure head 32 and guide the floating template 31. The upper die 1 also includes: the fixed plate 12 for connecting and fixing the pressure head 32, the fixed plate 12 is fixedly connected with the handle 11 (preferably by bolt connection, which is convenient for the fixed plate 12 to install the pressure head 32 and the guide column 13). In order to ensure that the pressure head is coaxial with the forming cavity 4, it is convenient to process and fix. The pressure head 32 is fixedly connected in the center of the fixed plate 12. In order to meet the requirements of the floating template, the guide column 13 is fixedly connected with the edge of the fixed plate 12, the guide hole 311 is opened through the floating template 31, and the guide column 13 passes through the guide hole 311. The floating template 31 slides along the guide column 13, which ensures the movement direction of the floating template 31.

[0101] In order to ensure that the floating template 31 rebound automatically away from the fixed plate 12, and then ensure that the pressure head 32 extends into the forming cavity 4. The wire upsetting structure 3 also includes: the rebound spring 34 of the push rebound effect. In order to ensure the limiting effect of the rebound spring 34, ensure the support direction of the push rebound force. The pressure head 32 outer ring is provided with a lower ring groove 341, and the rebound spring 34 is fixedly connected inside the lower ring groove 341, and the other end of the rebound spring 34 supports the floating template 31.

[0102] Further in order to ensure the constraint effect of the rebound spring 34. The floating template 31 is provided with an upper ring groove 342 in the extension direction of the lower ring groove 341 at one end close to the fixed plate 12, and the other end of the rebound spring 34 extends into the upper ring groove 342. The floating template 31 and the fixed plate 12 are provided with the upper ring groove 342 and the lower ring groove 341, and the upper ring groove 342 and the lower ring groove 341 are combined together to form the installation cavity of the rebound spring 34.

[0103] In order to ensure that the floating template 31 and the fixed plate 12 do not separate, ensure the compactness of the whole mold structure, improve the working efficiency. The mold also includes: the limiting plate 14 limiting the floating template 31, the limiting plate 14 is fixedly connected at the end of the guide column 13 through the bolt, so that the limiting plate 14 limits the stroke of the floating template 31. The floating template 31 is limited on the guide column 13.

[0104] In order to conveniently fix the guide column 13 and ensure the positioning effect of the guide column 13. The fixed plate 12 is provided with a guide column hole at the edge, one end of the guide column hole close to the handle 11 is a stepped first counterbore, the end of the guide column 13 is a stepped column, the stepped column and the first counterbore have the same structure size, the guide column 13 passes through the guide column hole, and the fixed plate 12 is pressed and fixed to the stepped column through the first counterbore. Through the cooperation of the first counterbore and the stepped column, the direction of the guide column 13 is positioned, and further the first counterbore can press the stepped column, so as to ensure the fixing effect of the guide column 13.

[0105] In order to ensure the pressure head 32 pressure positioning and fixing effect. The fixed plate 12 is provided with a pressure head hole at the center, one end of the pressure head hole close to the handle 11 is a stepped second counterbore, the end of the pressure head 32 away from the pressure rod 322 is a stepped head 323, the stepped head 323 and the second counterbore have the same structure size, the pressure head 32 passes through the pressure head hole, and the fixed plate 12 is pressed and fixed to the stepped head 323 through the second counterbore. Similarly, the pressure head 32 is positioned and fixed through the cooperation between the second counterbore and the stepped head 323.

[0106] As Figures 1-5As shown, to ensure the smooth progress of the upsetting process and the upsetting effect of the wire 01 to be processed, the wire upsetting processing equipment also includes a wire heating device 8 for heating. To ensure the upsetting effect, the wire heating device 8 is slidably connected to one side of the junction of the upper die drive device 5 and the lower die fixing device 6, avoiding interference with the upsetting process of the wire upsetting die 03. Before upsetting, the wire 01 to be processed is heated by the wire heating device 8. After heating, it slides away from the middle position between the upper die drive device 5 and the lower die fixing device 6 (it can be only away from the upper and lower dies, reducing the requirements for the sliding of the wire heating device 8).

[0107] To provide an operating platform and to securely support all components, the wire upsetting equipment also includes a machine body 9. The upper die drive device 5, lower die fixing device 6, wire feeding device 7, and wire heating device 8 are respectively fixedly connected to the upper surface of the machine body 9. The machine body 9 satisfies the requirement for fixation and also allows for raising the processing position, ensuring the processing steps are performed at an ergonomic height and reducing the labor intensity of workers.

[0108] To facilitate the insertion and clamping of the wire 01 to be processed, thereby improving the upsetting effect, the lower die fixing device 6 includes: an upper housing 61 that can move up and down to open the lower die fixing device 6; a lower housing 62 that cooperates with the upper housing 61 to clamp the wire 01 to be processed; and a support frame 63 that supports the upper housing 61 at a certain height. The lower housing 62 is connected to the upper surface of the machine body 9 (its fixed position can be adjusted by a fine-tuning structure to meet the fitting accuracy with the upper die drive device 5). The support frame 63 is fixedly connected to one side of the lower housing 62, and the upper housing 61 is driven and connected above the support frame 63, so that the upper housing 61 and the lower housing 62 can be detachably connected.

[0109] To satisfy the driving force for the up-and-down movement of the upper housing 61, the lower mold fixing device 6 further includes: a first driving device 64 that drives the upper housing 61. The first driving device 64 is fixedly connected to the upper side of the support frame 63, and the extended end of the first driving device 64 is fixedly connected to the upper housing 61, driving the upper housing 61 to move up and down directly above the lower housing 62.

[0110] Preferably, the support frame 63 has an L-shaped structure, and the first driving device 64 is fixed to the upper surface of the support frame 63. The telescopic rod structure of the first driving device 64 passes through the support frame 63, and its lower end is fixedly connected to the upper housing 61. Preferably, the upper housing 61 is provided with guide posts to ensure the telescopic accuracy between the upper housing 61 and the lower housing 62 and improve the clamping accuracy of the wire 01 to be processed.

[0111] More preferably, the first drive device 64 is a hydraulic cylinder structure.

[0112] In order to meet the clamping action of the wire rod 01 to be processed, the position of the wire rod 01 to be processed is limited. The lower shell 62 and the upper shell 61 are provided with a wire rod extension cavity in the center, the wire rod 01 to be processed is arranged inside the wire rod extension cavity, and the wire rod extension cavity is provided with a lower die fixing cavity 65 near one end of the upper die driving device 5, so that the lower die 2 of the wire upsetting machining die 03 is fixed inside the lower die fixing cavity 65. Thus, the wire rod 01 to be processed is extended into the lower die, meeting the requirements of the upsetting machining process.

[0113] In order to fix the upper die and realize the telescopic action of the upper die, meeting the requirements of the upsetting process. The upper die driving device 5 comprises: an upper die fixing plate 51 for fixing connection of the upper die, a mounting bracket 52 for position connection of the upper die fixing plate 51, and a second driving device 53 for driving action of the upper die fixing plate 51. The mounting bracket 52 is fixedly connected to the upper side of the machine body 9, and the second driving device 53 is fixedly connected to the side of the mounting bracket 52 away from the lower die fixing device 6. The driving rod of the second driving device 53 passes through the mounting bracket 52 to fixedly connect the upper die fixing plate 51, and the upper die fixing plate 51 is fixedly connected to the upper die 1 of the wire upsetting machining die 03 near the side of the lower die fixing device 6.

[0114] In order to further ensure the telescopic precision of the upper die, and further improve the machining precision of the upsetting machining process. The lower bottom surface of the upper die fixing plate 51 is fixedly connected with a dovetail groove structure, the upper surface of the machine body 9 is fixedly connected with a dovetail structure 91, and the dovetail groove structure is slidably connected with the dovetail structure 91.

[0115] In order to adjust and support the position of the wire rod 01 to be processed. The wire feeding device 7 comprises: a wire cradle 71 for supporting the wire rod 01 to be processed, and a driving wire feeding structure 72 for driving the wire rod 01 to be processed to slide to meet the position adjustment. The wire cradle 71 is fixedly connected to the end of the lower die fixing device 6 away from the upper die driving device 5, meeting the requirement of extending the supporting length of the wire rod 01 to be processed, and realizing the upsetting machining requirement of the wire rod 01 to be processed with longer size. In order to limit the position of the wire rod 01 to be processed and ensure the supporting effect, a wire limiting groove is formed in the upper surface of the wire cradle 71. The end of the wire cradle 71 away from the lower die fixing device 6 is fixedly connected with the driving wire feeding structure 72, so that the wire rod 01 to be processed is arranged inside the wire limiting groove and the driving wire feeding structure 72. The driving wire feeding structure 72 drives the wire rod 01 to be processed to move, meeting the requirement of adjusting the position of the wire rod 01 to be processed.

[0116] In order to meet the drive action to the wire 01 to be processed, the drive wire feeding structure 72 comprises a drive frame 721 connected with a supporting action and a drive wheel 722 for driving the wire 01 to be processed. The drive frame 721 is fixedly connected to the tail end of the wire cradle 71 (the end far away from the lower die fixing device 6 is the tail end), and the drive wheel 722 is connected to the drive frame 721.

[0117] In order to ensure the constraint action to the wire 01 to be processed and ensure the stable driving action of the wire 01 to be processed, the drive wheel 722 is provided in two rows, and the two rows of drive wheels 722 are staggered, and the middle part of the drive wheel 722 is provided with a groove structure, so that the wire 01 to be processed is limited in the groove structure. Through the rotating friction action of the drive wheel 722, the wire 01 to be processed is driven.

[0118] In order to realize the heating action of the wire heating device 8, the wire heating device 8 is withdrawn during the die upsetting process, so as to avoid the interference between the wire heating device 8 and the die. The distance between the wire heating device 8 and the wire 01 to be processed is reduced, and the heating efficiency of the wire heating device 8 to the wire 01 to be processed is improved. The wire heating device 8 comprises a guide rail device 81 meeting the translation requirement and a high-frequency coil 82 meeting the heating requirement to the wire 01 to be processed. The guide rail device 81 is fixedly connected to the upper side of the machine body 9, and the sliding direction of the guide rail device 81 is perpendicular to the central axis of the upper die driving device 5 and the lower die fixing device 6.

[0119] The high-frequency coil 82 is fixedly connected to the upper side of the guide rail device 81, and the high-frequency coil 82 slides along the guide rail device 81, so that the high-frequency coil 82 is in contact with the wire 01 to be processed for heating or is separated from the position between the upper die driving device 5 and the lower die fixing device 6.

[0120] The above only describes the preferred embodiments of the present application, and is not used to limit the protection scope of the present application.

Claims

1. A wire upsetting system, characterized in that, include: Wire upsetting equipment and wire upsetting die (03), wherein the wire upsetting die (03) is connected to the upper side of the wire upsetting equipment; The wire upsetting die (03) includes an upper die (1) and a lower die (2), which are coaxially arranged. The upper die (1) has a wire upsetting structure (3) inside. The lower die (2) is configured in a two-lobed structure, and the wire to be processed (01) is clamped between the two lobes. The upsetting end (02) of the wire to be processed (01) extends into the wire upsetting structure (3) inside the upper die (1). The wire upsetting equipment includes: an upper die driving device (5), a lower die fixing device (6) and a wire feeding device (7). The upper die driving device (5) and the lower die fixing device (6) are arranged opposite to each other, and the wire feeding device (7) is provided at the end of the lower die fixing device (6) away from the upper die driving device (5). The upper mold (1) is fixedly connected to the upper mold driving device (5); The lower mold fixing device is arranged in two parts, upper and lower, and the two parts of the lower mold structure are respectively fixedly connected inside the lower mold fixing device. The lower mold (2) includes an upper mold (21) and a lower mold (22). Both the upper mold (21) and the lower mold (22) are semi-cylindrical structures, and clamping holes (23) are provided at the center of the upper mold (21) and the lower mold (22). The wire to be processed (01) is clamped in the clamping holes (23). The upper mold (1) includes a mold handle (11), and the wire upsetting structure (3) includes a floating template (31) and a pressure head (32). The pressure head (32) is fixedly connected to the end of the mold handle (11), the floating template (31) is slidably connected to the end of the mold handle (11), a forming cavity (4) is provided in the center of the floating template (31), the pressure head (32) extends into the forming cavity (4), the end of the wire to be processed (01) extends into the forming cavity (4), and the pressure head (32) presses and forms the upsetting end (02) of the wire to be processed (01); The wire upsetting processing equipment further includes: a wire heating device (8), which is slidably connected to one side of the junction of the upper die driving device (5) and the lower die fixing device (6), so that the wire heating device (8) can slide away from the middle position of the upper die driving device (5) and the lower die fixing device (6) after heating the wire (01) to be processed; It also includes: a machine body (9), wherein the upper mold driving device (5), the lower mold fixing device (6), the wire feeding device (7) and the wire heating device (8) are respectively fixedly connected to the upper surface of the machine body (9); The wire heating device (8) includes: a guide rail device (81) and a high-frequency coil (82). The guide rail device (81) is fixedly connected to the upper side of the machine body (9). The sliding direction of the guide rail device (81) is perpendicular to the central axis of the upper mold driving device (5) and the lower mold fixing device (6). The high-frequency coil (82) is fixedly connected to the upper side of the guide rail device (81). The high-frequency coil (82) slides along the guide rail device (81) so that the high-frequency coil (82) contacts and heats the wire (01) to be processed or moves away from the middle position between the upper mold drive device (5) and the lower mold fixing device (6).

2. The wire upsetting system according to claim 1, characterized in that, The molding cavity (4) includes: a molding head (41), a molding hole (42), and a guide hole (43). The molding head (41) is located at one end of the floating template (31) away from the mold handle (11), and the guide hole (43) is located at one end of the floating template (31) near the mold handle (11). The molding hole (42) is formed between the molding head (41) and the guide hole (43) to form a conductive connection. The pressure head (32) includes a guide part (321) and a clamping rod part (322). The guide part (321) and the clamping rod part (322) are integrally formed. The diameter of the guide part (321) is the same as the diameter of the guide hole part (43). The diameter of the clamping rod part (322) is the same as the diameter of the forming hole part (42). The guide part (321) and the clamping rod part (322) press and extend into the guide hole part (43) and the forming hole part (42), so that the clamping rod part (322) extends into the forming head (41) to press and form the rough end (02) of the wire (01) to be processed.

3. The wire upsetting system according to claim 2, characterized in that, The wire upsetting structure (3) further includes: a vent (33), the vent (33) is provided at one end of the guide hole (43) near the forming hole (42), and the other end of the vent (33) extends out of the outer wall of the floating template (31); The upper mold (1) further includes: a fixing plate (12), the fixing plate (12) is fixedly connected to the mold handle (11), the pressure head (32) is fixedly connected to the center of the fixing plate (12), a guide post (13) is fixedly connected to the edge of the fixing plate (12), a guide hole (311) is opened through the floating template (31), and the guide post (13) passes through the guide hole (311).

4. The wire upsetting system according to claim 3, characterized in that, The wire upsetting structure (3) further includes: a spring (34), the outer ring of the pressure head (32) is provided with a lower ring groove (341), the spring (34) is fixedly connected inside the lower ring groove (341), and the other end of the spring (34) supports the floating template (31). The floating template (31) is located near one end of the fixed plate (12), and an upper ring groove (342) is provided in the extending direction of the lower ring groove (341). The other end of the rebound spring (34) extends into the upper ring groove (342).

5. The wire upsetting system according to claim 3, characterized in that, Also includes: Limiting plate (14), the limiting plate (14) is fixedly connected to the end of the guide post (13) so that the limiting plate (14) limits the stroke of the floating template (31); The fixing plate (12) has a guide post hole on its edge. The end of the guide post hole near the mold handle (11) is a stepped first enlarged hole. The end of the guide post (13) is a stepped post. The stepped post and the first enlarged hole have the same structural dimensions. The guide post (13) passes through the guide post hole. The fixing plate (12) presses and fixes the stepped post through the first enlarged hole. The fixing plate (12) has a pressure head hole in the center. The end of the pressure head hole near the mold handle (11) is a stepped second expansion hole. The end of the pressure head (32) away from the clamping rod (322) is a stepped head (323). The stepped head (323) and the second expansion hole have the same structural dimensions. The pressure head (32) passes through the pressure head hole. The fixing plate (12) presses and fixes the stepped head (323) through the second expansion hole.

6. The wire upsetting system according to claim 1, characterized in that, The lower mold fixing device (6) includes: an upper shell (61), a lower shell (62) and a support frame (63). The lower shell (62) is connected to the upper surface of the machine body (9). The support frame (63) is fixedly connected to one side of the lower shell (62). The upper shell (61) is driven to be connected above the support frame (63), so that the upper shell (61) and the lower shell (62) can be separated and connected. It also includes: a first driving device (64), which is fixedly connected to the upper side of the support frame (63), and the extended end of the first driving device (64) is fixedly connected to the upper housing (61), driving the upper housing (61) to move up and down directly above the lower housing (62); The lower housing (62) and the upper housing (61) have a wire insertion cavity in the center. The wire insertion cavity has a lower mold fixing cavity (65) at one end near the upper mold driving device (5), so that the lower mold (2) of the wire upsetting die (03) is fixed inside the lower mold fixing cavity (65).

7. The wire upsetting system according to claim 1, characterized in that, The upper mold driving device (5) includes: an upper mold fixing plate (51), a mounting frame (52), and a second driving device (53). The mounting frame (52) is fixedly connected to the upper side of the machine body (9). The second driving device (53) is fixedly connected to the side of the mounting frame (52) away from the lower mold fixing device (6). The driving rod of the second driving device (53) passes through the mounting frame (52) and is fixedly connected to the upper mold fixing plate (51). The upper mold fixing plate (51) is fixedly connected to the upper mold (1) of the wire upsetting roughing die (03) on the side of the upper mold fixing plate (51) close to the lower mold fixing device (6). The bottom surface of the upper mold fixing plate (51) is fixedly connected to a dovetail groove structure, and the upper surface of the body (9) is fixedly connected to a dovetail tenon structure (91). The dovetail groove structure is adapted to slide with the dovetail tenon structure (91). The wire feeding device (7) includes: a wire bracket (71) and a driving wire feeding structure (72). The wire bracket (71) is fixedly connected to one end of the lower mold fixing device (6) away from the upper mold driving device (5). A wire limiting groove is provided on the upper surface of the wire bracket (71). The driving wire feeding structure (72) is fixedly connected to one end of the wire bracket (71) away from the lower mold fixing device (6), so that the wire to be processed (01) is placed inside the wire limiting groove and the driving wire feeding structure (72). The driving wire feeding structure (72) drives the wire to be processed (01) to move. The drive wire feeding structure (72) includes: a drive frame (721) and a drive wheel (722). The drive frame (721) is fixedly connected to the tail end of the wire bracket (71), and the drive wheel (722) is connected to the drive frame (721). The drive wheel (722) is provided in two rows, and the two rows of drive wheels (722) are staggered. The middle part of the drive wheel (722) is a groove structure, so that the wire (01) to be processed is limited inside the groove structure.

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