A reflow soldering system that facilitates Mini LED production

By designing an automated reflow soldering system, the problem of inconvenient operation of Mini LED preparation equipment was solved, the automated processing and protection of the substrate was realized, and the processing efficiency and flexibility were improved.

CN116352209BActive Publication Date: 2025-09-19STARRY ELECTRONIC TECH SHENZHEN CO LTD
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Patent Information

Application Number
CN202310468553.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-04-27
Publication Date
2025-09-19
Estimated Expiration
2043-04-27

AI Technical Summary

Technical Problem

Existing Mini LED preparation equipment requires manual operation during use, which is time-consuming and labor-intensive, and the processing progress is slow, affecting efficiency.

Method used

A reflow soldering system is designed to facilitate the preparation of Mini LEDs. It includes a workbench, a reflow soldering machine body, a mounting plate, a conveyor belt, and a clamping assembly. Through the automated operation of the clamping assembly, the substrate can be automatically placed, processed, and removed, reducing manual operations.

Benefits of technology

It improves the processing efficiency of Mini LED modules, reduces manual operation time, improves working performance, and provides protection for the substrate to prevent dust and debris from adhering, with high flexibility.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates to the field of MiniLED processing technology, and discloses a reflow soldering system that is convenient for MiniLED preparation, comprising a workbench, a reflow soldering machine body fixed inside the workbench, and a mounting plate sliding inside the workbench, wherein the mounting plate is located above the reflow soldering machine body, a carrier plate fixed inside the workbench is provided on one side of the reflow soldering machine body, a conveyor belt installed inside the workbench is provided on the other side of the reflow soldering machine body, a protective shell is provided on the outside of the carrier plate, a sliding opening is provided at one end of the protective shell, the carrier plate slides inside the sliding opening, a plurality of bearing grooves are provided on the top of the carrier plate, a substrate is placed inside the bearing groove, and a clamping assembly for clamping the substrate is also provided on the mounting plate. The present invention can help workers quickly place the substrate into the reflow soldering machine, and can take the substrate out of the reflow soldering machine after the substrate processing is completed, and can help the processed substrate quickly detach from the clamping assembly, with high working performance and easy use.
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Description

Technical Field

[0001] The present invention relates to the field of Mini LED processing technology, and in particular to a reflow soldering system that facilitates Mini LED production. Background Art

[0002] Mini LED modules are usually made of a substrate and a Min LED chip mounted on it. During the preparation process of the Mini LED module, a reflow oven is required to heat the solder paste so that the solder paste melts and the Min LED chip and substrate are reliably bonded together through the solder paste alloy.

[0003] Although existing reflow machines can heat solder paste, during use, the user needs to manually open the reflow machine, then place the substrate inside the reflow machine, wait for the substrate processing to be completed, and then use tweezers and other tools to remove the substrate. This process is not only time-consuming and labor-intensive, but also the processing progress is extremely slow. For this reason, we have proposed a reflow system that is convenient for Mini LED preparation. Summary of the Invention

[0004] In order to solve the technical problem that existing Mini LED production equipment is inconvenient to use, the present invention provides a reflow soldering system that facilitates Mini LED production.

[0005] The present invention is implemented by the following technical solution: a reflow soldering system that is convenient for Mini LED preparation, comprising a workbench, a reflow soldering machine main body fixed inside the workbench, and a mounting plate sliding inside the workbench, wherein the mounting plate is located above the reflow soldering machine main body, a carrier plate fixed inside the workbench is provided on one side of the reflow soldering machine main body, and a conveyor belt installed inside the workbench is provided on the other side of the reflow soldering machine main body, the outer shell of the carrier plate is covered with a protective shell, one end of the protective shell is provided with a sliding opening, the carrier plate slides inside the sliding opening, a plurality of carrying slots are provided on the top of the carrier plate, a substrate is placed inside the carrying slot, and a clamping assembly for clamping the substrate is also provided on the mounting plate, and the substrate can be placed inside the reflow soldering machine main body through the operation of the clamping assembly, and the substrate can be taken out of the reflow soldering machine after the substrate processing is completed, and the processed substrate can be transported to facilitate the next processing step, and the substrate to be processed can be protected.

[0006] The top of described sliding panel also is provided with an interlocking structure, and the interlocking structure of described sliding panel also is provided with an interlocking structure, and the interlocking structure of described sliding panel is connected with the interlocking structure of described sliding panel.

[0007] As a further improvement of the above scheme, the clamping block 2 slides inside the slot of the slide groove, the width of the slider is greater than the width of the slot of the slide groove, the clamping block 2 is provided with multiple through-holes, and the internal sliding through-holes are provided with a guide block, one end of the guide block is fixed on the clamping block 1, and the other end of the guide block is fixed with a stop block, the width of the stop block is greater than the aperture of the through-hole, and the slider whose width is greater than the width of the slot of the slide groove can prevent the slider from falling off from the slide groove, and the cooperation of the through-hole and the guide block can guide the displaced clamping block 2 to prevent the clamping block 2 from offsetting during the displacement process, thereby improving the stability of the clamping block 2, and the stop block whose width is greater than the aperture of the through-hole can prevent the guide block from detaching from the through-hole.

[0008] As a further improvement of the above scheme, a sliding groove is provided on the inner wall of the clamping block 1, and the sliding groove is internally slidably connected to a sliding block fixed on the driving block. Through the cooperation of the sliding groove and the sliding block, the driving block can be limited to avoid displacement of the driving block during the displacement process, thereby improving the stability of the driving block.

[0009] As a further improvement of the above solution, a motor 1 is fixed to the bottom side of one end of the mounting plate, one end of the threaded rod 1 is transmission-connected to the output end of the motor 1, and the other end of the threaded rod 1 is rotatably connected to a connecting block fixed to the bottom side of the mounting plate. The operation of the motor 1 can drive the threaded rod 1 to rotate.

[0010] As a further improvement of the above scheme, a stabilizing groove is provided at the bottom of the mounting plate, and a stabilizing block fixed to one end of the clamping block is slidably connected to the inside of the stabilizing groove. The width of the stabilizing block is greater than the width of the notch of the stabilizing groove. Through the cooperation of the stabilizing groove and the stabilizing block, the displaced clamping block 1 can be stabilized to prevent the clamping block 1 from offsetting during the displacement process, thereby effectively improving the stability performance of the clamping block 1.

[0011] As a further improvement of the above-mentioned scheme, motor 2 is fixed to the inner walls at both ends of the top side of the work frame, and the output end of motor 2 is transmission-connected to threaded rod 2. The end of threaded rod 2 away from motor 2 is rotatably connected to the inner wall of the bottom of the work frame, and the outer wall of threaded rod 2 is threadedly sleeved with threaded sleeve 2 embedded in the mounting plate. The operation of motor 2 can drive threaded rod 2 to rotate, and the rotating threaded rod 2 and the threaded sleeve 2 cooperate to drive the threaded sleeve 2 to perform vertical displacement, thereby driving the mounting plate to perform vertical displacement.

[0012] As a further improvement of the above scheme, a sliding groove is provided on the inner wall of the bottom of the working frame, and the sliding groove is internally slidably connected to a sliding block fixed to the bottom of the protective shell. A plurality of guide holes are provided in the middle of the sliding block, and a guide rod fixed to the inside of the sliding groove is slidably penetrated inside the guide hole. A push spring is provided on the outside of the guide rod, and one end of the push spring is fixed on the sliding block, and the other end of the push spring is fixed on the inner wall of the sliding groove. The displaced protective shell can be driven to reset by the reset elasticity of the push spring.

[0013] As a further improvement of the above solution, a linkage block is fixed on the outside of the material drawer of the reflow soldering machine body. The linkage block is an L-shaped structure. The material drawer of the reflow soldering machine body slides on the workbench. Through the linkage block, the clamping block one and the clamping block two can conveniently open or close the material drawer of the reflow soldering machine.

[0014] As a further improvement of the above solution, a sealing ring is provided on the inner wall of the sliding port along the circumferential direction, the length of the sliding groove is greater than the length of the protective shell, and the protective shell slides on the working frame. The sealing ring can increase the sealing performance of the protective shell.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. The present invention can help workers quickly place the substrate into the reflow soldering machine, and can take the substrate out of the reflow soldering machine after the substrate processing is completed, avoiding the workers from using tweezers to take out the processed substrate, thereby effectively improving the processing efficiency of the Mini LED module, having high working performance, and can help the processed substrate quickly detach from the clamping component to avoid the processed substrate from sticking to the clamping component, and is easy to use.

[0017] 2. The present invention can protect the substrate to be processed, preventing the substrate to be processed from being directly exposed to the outside world and being attached by external dust and debris, thereby effectively protecting the substrate and adaptively adjusting the processing components according to the processing needs of the staff, with high flexibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the structure of a reflow soldering system that facilitates the preparation of Mini LEDs;

[0019] Figure 2 A schematic diagram of the structure of a clamping block 1 in a reflow soldering system that facilitates Mini LED production;

[0020] Figure 3 for Figure 1 A schematic diagram of the structure enlarged in the middle;

[0021] Figure 4 for Figure 1 The enlarged structural diagram at B in the middle;

[0022] Figure 5 for Figure 1 The enlarged structural diagram at C in the middle;

[0023] Figure 6 A front view of a reflow soldering system that facilitates Mini LED production.

[0024] Description of main symbols:

[0025] 1. Work stand; 2. Mounting plate; 3. Reflow soldering machine body; 4. Carrier board; 5. Protective shell; 6. Conveyor belt; 7. Clamping block 2; 8. Slide groove; 9. Drive block; 10. Drive plate; 11. Hydraulic cylinder; 12. Clamping block 1; 13. Slide groove; 14. Slide block; 15. Guide block; 16. Stabilizing groove; 17. Stabilizing block; 18. Threaded sleeve 1; 19. Threaded rod 1; 20. Sliding block; 21. Guide rod; 22. Push spring; 23. Threaded sleeve 2; 24. Threaded rod 2. DETAILED DESCRIPTION

[0026] The present invention will be further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0027] Example 1:

[0028] Combine Figure 1, a reflow soldering system for Mini LED preparation in this embodiment includes a workbench 1, a reflow soldering machine body 3 fixed inside the workbench 1 and a mounting plate 2 sliding inside the workbench 1, the mounting plate 2 is located above the reflow soldering machine body 3, and one side of the reflow soldering machine body 3 is provided with a carrier plate 4 fixed inside the workbench 1, and the other side of the reflow soldering machine body 3 is provided with a conveyor belt 6 installed inside the workbench 1, a protective shell 5 is provided on the outside of the carrier plate 4, and a sliding opening is opened at one end of the protective shell 5, and the carrier plate 4 slides inside the sliding opening, and a plurality of carrying grooves are opened on the top of the carrier plate 4, and a substrate is placed inside the carrying groove. The mounting plate 2 is also provided with a clamping component for clamping the substrate.

[0029] The implementation principle of a reflow soldering system that is convenient for Mini LED preparation in the embodiment of the present application is: when it is necessary to process the substrate, the protective shell 5 is driven to slide through the operation of the clamping component. After the sliding protective shell 5 opens the carrier 4, the substrate inside the carrier 4 can be clamped by the clamping component. When it is basically clamped by the clamping component, the substrate can be sent to the interior of the reflow soldering machine body 3 through the clamping component. Then, the material drawer of the reflow soldering machine body 3 is closed by the clamping component. At this time, the substrate can be processed by the reflow soldering machine body 3. When the processing of the substrate inside the reflow soldering machine body 3 is completed, the material drawer of the reflow soldering machine body 3 is opened by the clamping component, and the processed substrate inside the material drawer is taken out and transported to the conveyor belt 6. The processed substrate is transported by the conveyor belt 6.

[0030] Example 2:

[0031] Combine Figure 2 、 Figure 3 and Figure 4, based on Example 1, this embodiment is further improved in that the clamping assembly includes a clamping block 12 and a clamping block 2 7 arranged on one side of the clamping block 12, the clamping block 12 is located between the mounting plate 2 and the reflow soldering machine body 3, the inner wall of the top of the clamping block 12 is provided with a slide groove 8, the inner sliding connection of the slide groove 8 is provided with a slider, the top of the clamping block 2 7 is fixed on the slider, and a plurality of connecting springs are fixed on one end of the slider away from the driving block 9, and the other end is fixed on the inner wall of the slide groove 8, a driving block 9 is provided between the clamping block 12 and the clamping block 2 7, and a driving plate 10 is hinged on both sides of the driving block 9, and a fixed block is hinged on one end of the driving plate 10 away from the driving block 9, and a hydraulic cylinder 11 fixed on the clamping block 12 is provided on one side of the fixed block. The hydraulic cylinder 11 The piston end is fixed on the adjacent fixed block, and the top of the clamping block 12 is embedded with a threaded sleeve 18. The internal thread of the threaded sleeve 18 is penetrated by a threaded rod 19. A linkage block is fixed on the outside of the material drawer of the reflow soldering machine body 3. The linkage block is an L-shaped structure. The threaded sleeve 18 is driven to move by the rotation of the threaded rod 19, which drives the clamping block 12 to move. When the clamping block 12 is located above the protective shell 5 and the material drawer of the flow soldering machine body 3, the mounting plate 2 is vertically displaced at this time, which drives the clamping block 12 to move. When the clamping block 12 is located between the protective shell 5 and the material drawer of the flow soldering machine body 3, the threaded sleeve 18 is driven to move by the rotation of the threaded rod 19, which drives the clamping block 12 to move. When the support plate 4 is opened, the fixing block 12 is displaced, and the driving plate 10 is deflected and the driving block 9 is displaced vertically. When the driving block 9 contacts the clamping block 2 7, the displaced driving block 9 will push the clamping block 2 7 to displace. When the clamping block 2 7 corresponds to the end of the other end of the substrate, the mounting plate 2 is displaced vertically, driving the clamping block 12 and the clamping block 2 7 to displace. When the clamping block 12 and the clamping block 2 7 enter the interior of the bearing groove, and the inner sides of the clamping block 12 and the clamping block 2 7 are in contact with the substrate inside the bearing groove, The hydraulic cylinder 11 runs, driving the fixed block to reset displacement, driving the driving plate 10 to deflect, and driving the driving block 9 to reset displacement. When the driving block 9 is separated from the clamping block 2 7, the reset elasticity of the connecting spring pushes the clamping block 2 7 to reset displacement. At this time, the substrate can be clamped by the reset-displaced clamping block 2 7 and the clamping block 1 12. At this time, the mounting plate 2 is vertically displaced, driving the clamping block 12 and the clamping block 2 7 to vertically displace, and driving the substrate to vertically displace. When the substrate is out of the bearing groove and is located above the flow welding machine body 3, the threaded sleeve 18 can be driven to displace by the rotation of the threaded rod 19, driving the clamping block 12 and the clamping block 2 7 to displace, and driving the substrate to displace.When the substrate is located above the material drawer of the reflow soldering machine main body 3, the vertical displacement of the mounting plate 2 can drive the clamping block 12 and the clamping block 2 7 to be vertically displaced, thereby driving the substrate to be vertically displaced. After the substrate enters the material drawer of the reflow soldering machine main body 3, the operation of the hydraulic cylinder 11 can drive the fixed block to be displaced, drive the driving plate 10 to be deflected, and drive the driving block 9 to be vertically displaced. When the driving block 9 contacts the clamping block 2 7, the displaced driving block 9 will push the clamping block 2 7 to be displaced. When the clamping block 2 7 is separated from the end of the substrate, the substrate will fall into the material drawer of the reflow soldering machine main body 3. At this time, the mounting plate 2 is vertically displaced, driving the clamping block 12 and the clamping block 2 7 to be vertically displaced. After block 12 and clamping block 2 7 are separated from the material drawer of the reflow soldering machine main body 3, the threaded rod 19 rotates to drive the clamping block 12 and clamping block 2 7 to move horizontally. When the clamping block 2 7 is above the linkage block, the vertical displacement of the mounting plate 2 can be used to drive the clamping block 12 and clamping block 2 7 to move vertically. When the clamping block 2 7 enters the interior of the linkage block, the rotation of the threaded rod 19 can drive the clamping block 12 and clamping block 2 7 to move horizontally. At this time, the clamping block 12 and clamping block 2 7 that move horizontally can push the material drawer of the reflow soldering machine main body 3 to move. When the material drawer enters the interior of the reflow soldering machine main body 3, the reflow soldering machine main body 3 can be used to adjust the material drawer. The substrate is processed, and when the substrate processing inside the reflow soldering machine main body 3 is completed, the threaded rod 19 can be rotated to drive the clamping block 12 and the clamping block 2 7 to perform lateral displacement. At this time, the material drawer of the reflow soldering machine main body 3 can be pulled out of the interior of the reflow soldering machine main body 3 through the cooperation of the clamping block 2 7 and the linkage block. When the substrate inside the material drawer slides is located outside the reflow soldering machine main body 3, the mounting plate 2 can be vertically displaced to drive the clamping block 12 and the clamping block 2 7 to perform vertical displacement. When the clamping block 2 7 is separated from the linkage block, the threaded rod 19 can be rotated to drive the clamping block 12 and the clamping block 2 7 to perform lateral displacement. When the clamping block 12 corresponds to the end of one end of the substrate, the hydraulic cylinder 11 is used to move the clamping block 12 to the end of the substrate. The operation of the drive block drives the fixed block to displace, drives the driving plate 10 to deflect, and drives the driving block 9 to perform vertical displacement. When the driving block 9 contacts the clamping block 2 7, the displaced driving block 9 will push the clamping block 2 7 to displace. When the clamping block 2 7 corresponds to the end of the other end of the substrate, the mounting plate 2 is vertically displaced, driving the clamping block 12 and the clamping block 2 7 to displace. When the inner sides of the clamping block 12 and the clamping block 2 7 contact the substrate inside the bearing groove, the hydraulic cylinder 11 is operated, driving the fixed block to reset displacement, driving the driving plate 10 to deflect, and driving the driving block 9 to reset displacement. When the driving block 9 is separated from the clamping block 2 7, the reset elasticity of the connecting spring pushes the clamping block 2 7 to reset displacement.At this time, the substrate can be clamped by the clamping block 2 7 and the clamping block 12 of the reset displacement. At this time, the mounting plate 2 is vertically displaced, driving the clamping block 12 and the clamping block 2 7 to be vertically displaced, and driving the substrate to be vertically displaced. After the substrate is separated from the material drawer of the reflow soldering machine body 3, the threaded sleeve 18 can be driven to be displaced by the rotation of the threaded rod 19, driving the clamping block 12 and the clamping block 2 7 to be displaced, and driving the substrate to be displaced. When the substrate is located above the conveyor belt 6, the vertical displacement of the mounting plate 2 drives the clamping block 12 and the clamping block 2 7 to be vertically displaced, and drives the substrate to be vertically displaced. When the substrate falls on the conveyor belt 6, the operation of the hydraulic cylinder 11 can drive the fixed block to be displaced, drive the drive plate 10 to deflect, and the belt The dynamic driving block 9 is displaced vertically. When the driving block 9 contacts the clamping block 2 7, the displaced driving block 9 will push the clamping block 2 7 to displace. When the clamping block 2 7 is separated from the end of the substrate, the substrate will fall onto the conveyor belt 6. The conveyor belt 6 can then transport the processed substrate. When the end of the processed substrate is separated from the clamping block 2 7, but the other end of the substrate is bonded to the inner side of the clamping block 12, the operation of the hydraulic cylinder 11 can drive the fixed block to displace, drive the driving plate 10 to deflect, and drive the driving block 9 to displace vertically. When the end of the driving block 9 contacts the substrate, the displaced driving block 9 can push the substrate bonded to the inner side of the clamping block 12, causing the substrate to separate from the clamping block 12.

[0032] The clamping block 27 slides inside the slot of the slide 8, and the width of the slider is greater than the width of the slot of the slide 8. The clamping block 27 is provided with multiple through-holes, and a guide block 15 is slidingly penetrated inside the through-holes. One end of the guide block 15 is fixed on the clamping block 12, and the other end of the guide block 15 is fixed with a stopper. The width of the stopper is greater than the aperture of the through-hole. By using a slider whose width is greater than the width of the slot of the slide 8, the slider can be prevented from falling off from the slide 8. By cooperating with the through-hole and the guide block 15, the displaced clamping block 27 can be guided to avoid the clamping block 27 from offsetting during the displacement process, thereby improving the stability of the clamping block 27. By using a stopper whose width is greater than the aperture of the through-hole, the guide block 15 can be prevented from detaching from the through-hole.

[0033] A sliding groove 13 is provided on the inner wall of the clamping block 12, and a sliding block 14 fixed on the driving block 9 is slidably connected inside the sliding groove 13. Through the cooperation of the sliding groove 13 and the sliding block 14, the driving block 9 can be limited to avoid the driving block 9 from deflecting during the displacement process, thereby improving the stability of the driving block 9.

[0034] A motor 1 is fixed to the bottom side of one end of the mounting plate 2. The motor 1 is a forward and reverse stepping motor. One end of the threaded rod 19 is transmission-connected to the output end of the motor 1. The other end of the threaded rod 19 is rotationally connected to a connecting block fixed to the bottom side of the mounting plate 2. The operation of the motor 1 can drive the threaded rod 19 to rotate.

[0035] A stabilizing groove 16 is provided at the bottom of the mounting plate 2, and a stabilizing block 17 fixed to the end of the clamping block 12 is slidably connected inside the stabilizing groove 16. The width of the stabilizing block 17 is greater than the width of the notch of the stabilizing groove 16. Through the cooperation of the stabilizing groove 16 and the stabilizing block 17, the displaced clamping block 12 can be stabilized to prevent the clamping block 12 from deflecting during the displacement process, thereby effectively improving the stability performance of the clamping block 12.

[0036] Motor 2 is fixed to the inner wall at both ends of the top side of the work frame 1. Motor 2 is a forward and reverse stepping motor. The output end of motor 2 is connected to threaded rod 24. The end of threaded rod 24 away from motor 2 is rotatably connected to the inner wall of the bottom of the work frame 1. The outer wall of threaded rod 24 is threadedly sleeved with threaded sleeve 23 embedded in the mounting plate 2. The operation of motor 2 can drive threaded rod 24 to rotate. The rotating threaded rod 24 and the threaded sleeve 23 work in coordination, which can drive threaded sleeve 23 to perform vertical displacement, thereby driving the mounting plate 2 to perform vertical displacement.

[0037] Example 3:

[0038] Combine Figure 5 and Figure 6 The present embodiment is a further improvement on the basis of embodiment 2 in that a sliding groove is provided on the inner wall of the bottom of the working frame 1, and a sliding block 20 fixed to the bottom of the protective shell 5 is slidably connected inside the sliding groove. A plurality of guide holes are provided in the middle of the sliding block 20, and a guide rod 21 fixed inside the sliding groove is slidably penetrated inside the guide hole. A push spring 22 is sleeved on the outside of the guide rod 21, and one end of the push spring 22 is fixed on the sliding block 20, and the other end of the push spring 22 is fixed on the inner wall of the sliding groove. When the clamping block 12 pushes the protective shell 5 to move, the sliding block 20 will move accordingly, and the displaced sliding block 20 will compress the push spring 22. When the clamping block 12 is separated from the protective shell 5, the sliding block 20 will be pushed to reset by the reset elasticity of the push spring 22, thereby driving the protective shell 5 to reset and drive the protective shell 5 to be re-sheathed on the outside of the carrier plate 4 to protect the substrate inside the carrier plate 4.

[0039] The material drawer of the reflow soldering machine body 3 slides on the working frame 1 .

[0040] A sealing ring is provided on the inner wall of the sliding port along the circumference. The length of the sliding groove is greater than the length of the protective shell 5. The protective shell 5 slides on the working frame 1. The sealing ring can increase the sealing performance of the protective shell 5 and improve the protective performance of the protective shell 5.

[0041] Working principle: When the substrate needs to be processed, the motor 1 is operated to drive the threaded rod 19 to rotate, drive the threaded sleeve 18 to move laterally, and drive the clamping block 12 to move laterally. When the clamping block 12 is located above the material drawer between the protective shell 5 and the flow soldering machine body 3, the motor 2 is operated to drive the threaded rod 24 to rotate. The threaded rod 24 and the threaded sleeve 23 work together to drive the threaded sleeve 23 to move vertically, drive the mounting plate 2 to move vertically, and drive the clamping block 12 to move. When the clamping block 12 is located between the protective shell 5 and the material drawer of the flow soldering machine body 3, the threaded sleeve 18 is driven to move by the rotation of the threaded rod 19, which drives The clamping block 12 is displaced. At this time, the displaced clamping block 12 will push the protective shell 5 to displace. After the protective shell 5 opens the carrier plate 4, and the clamping block 12 corresponds to the end of one end of the substrate, the operation of the hydraulic cylinder 11 drives the fixed block to displace, drives the driving plate 10 to deflect, and drives the driving block 9 to vertically displace. When the driving block 9 contacts the clamping block 2 7, the displaced driving block 9 will push the clamping block 2 7 to displace. When the clamping block 2 7 corresponds to the end of the other end of the substrate, the mounting plate 2 is vertically displaced, driving the clamping block 12 and the clamping block 2 7 to displace. When the clamping block 12 and the clamping block 2 7 enter the inside of the bearing groove, and the inner sides of the clamping block 12 and the clamping block 2 7 are aligned with the substrate inside the bearing groove. When they are in contact, the hydraulic cylinder 11 runs, driving the fixed block to reset displacement, driving the driving plate 10 to deflect, and driving the driving block 9 to reset displacement. When the driving block 9 is separated from the clamping block 2 7, the reset elasticity of the connecting spring pushes the clamping block 2 7 to reset displacement. At this time, the substrate can be clamped by the reset-displaced clamping block 2 7 and the clamping block 1 12. At this time, the mounting plate 2 is vertically displaced, driving the clamping block 12 and the clamping block 2 7 to vertically displace, and driving the substrate to vertically displace. When the substrate is out of the bearing groove and the substrate is located above the flow welding machine body 3, the threaded sleeve 18 can be driven to displace by the rotation of the threaded rod 19, driving the clamping block 12 and the clamping block 2 7 to displace, and driving the substrate When the substrate is located above the material drawer of the reflow soldering machine main body 3, the vertical displacement of the mounting plate 2 can drive the clamping block 12 and the clamping block 2 7 to be vertically displaced, thereby driving the substrate to be vertically displaced. After the substrate enters the material drawer of the reflow soldering machine main body 3, the operation of the hydraulic cylinder 11 can drive the fixed block to be displaced, drive the driving plate 10 to be deflected, and drive the driving block 9 to be vertically displaced. When the driving block 9 contacts the clamping block 2 7, the displaced driving block 9 will push the clamping block 2 7 to be displaced. When the clamping block 2 7 is separated from the end of the substrate, the substrate will fall into the material drawer of the reflow soldering machine main body 3. At this time, the mounting plate 2 is vertically displaced, driving the clamping block 12 and the clamping block 2 7 to be vertically displaced.When the clamping block 12 and the clamping block 2 7 are separated from the material drawer of the reflow soldering machine main body 3, the threaded rod 19 rotates to drive the clamping block 12 and the clamping block 2 7 to move horizontally. When the clamping block 2 7 is above the linkage block, the vertical displacement of the mounting plate 2 can be used to drive the clamping block 12 and the clamping block 2 7 to move vertically. When the clamping block 2 7 enters the interior of the linkage block, the rotation of the threaded rod 19 can drive the clamping block 12 and the clamping block 2 7 to move horizontally. At this time, the clamping block 12 and the clamping block 2 7 that can move horizontally can push the material drawer of the reflow soldering machine main body 3 to move. When the material drawer enters the interior of the reflow soldering machine main body 3, the reflow soldering machine main body 3 can be used to adjust the material drawer. The substrate at the bottom is processed, and when the substrate processing inside the reflow soldering machine main body 3 is completed, the rotation of the threaded rod 19 can drive the clamping block 12 and the clamping block 2 7 to move horizontally. At this time, the material drawer of the reflow soldering machine main body 3 can be pulled out of the interior of the reflow soldering machine main body 3 through the cooperation of the clamping block 2 7 and the linkage block. When the substrate inside the material drawer slides is located outside the reflow soldering machine main body 3, the vertical displacement of the mounting plate 2 can be driven to drive the clamping block 12 and the clamping block 2 7 to move vertically. When the clamping block 2 7 is separated from the linkage block, the rotation of the threaded rod 19 can drive the clamping block 12 and the clamping block 2 7 to move horizontally. When the clamping block 12 corresponds to the end of one end of the substrate, the operation of the hydraulic cylinder 11 When the driving block 9 is separated from the clamping block 2 7, the clamping block 2 7 is pushed to reset the displacement by the reset elasticity of the connecting spring, and the clamping block 2 7 is pushed to reset the displacement by the reset elasticity of the connecting spring. The clamping block 2 7 and the clamping block 1 12 of the reset displacement clamp the substrate. At this time, the mounting plate 2 is vertically displaced, driving the clamping block 12 and the clamping block 2 7 to be vertically displaced, and driving the substrate to be vertically displaced. After the substrate is separated from the material drawer of the reflow soldering machine body 3, the threaded sleeve 18 can be driven to be displaced by the rotation of the threaded rod 19, driving the clamping block 12 and the clamping block 2 7 to be displaced, and driving the substrate to be displaced. When the substrate is located above the conveyor belt 6, the vertical displacement of the mounting plate 2 drives the clamping block 12 and the clamping block 2 7 to be vertically displaced, and drives the substrate to be vertically displaced. When the substrate falls on the conveyor belt 6, the operation of the hydraulic cylinder 11 can drive the fixed block to be displaced, and drive the drive plate 10 to deflect.The driving block 9 is driven to move vertically. When the driving block 9 contacts the clamping block 2 7, the displaced driving block 9 will push the clamping block 2 7 to move. When the clamping block 2 7 is separated from the end of the substrate, the substrate will fall onto the conveyor belt 6. The conveyor belt 6 can then transport the processed substrate. When the end of the processed substrate is separated from the clamping block 2 7, but the other end of the substrate is bonded to the inner side of the clamping block 12, the operation of the hydraulic cylinder 11 can drive the fixed block to move, drive the driving plate 10 to deflect, and drive the driving block 9 to move vertically. When the end of the driving block 9 contacts the substrate, the displaced driving block 9 can push the substrate bonded to the inner side of the clamping block 12, causing the substrate to separate from the clamping block 12.

[0042] The above embodiments are only preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and replacements made by technicians in this field on the basis of the present invention fall within the scope of protection required by the present invention.

Claims

1. A reflow soldering system for Mini LED production, comprising a workbench, a reflow soldering machine body fixed inside the workbench, and a mounting plate sliding inside the workbench, characterized in that: The mounting plate is located above the reflow soldering machine body. A carrier plate fixed inside the work frame is provided on one side of the reflow soldering machine body. A conveyor belt installed inside the work frame is provided on the other side of the reflow soldering machine body. A protective shell is provided on the outside of the carrier plate. A sliding opening is provided at one end of the protective shell. The carrier plate slides inside the sliding opening. A plurality of bearing grooves are provided on the top of the carrier plate. Substrates are placed inside the bearing grooves. A clamping assembly for clamping the substrate is also provided on the mounting plate. The cam is fixed to the top of the support frame, and the cam is fixed on the top of the support frame, and the cam is fixed on the top of the support frame. The second clamping block slides inside the slot of the slide groove, the width of the slider is greater than the width of the slot of the slide groove, the second clamping block is provided with a plurality of through holes, a guide block is slidably penetrated inside the through holes, one end of the guide block is fixed on the first clamping block, and a stop block is fixed on the other end of the guide block, the width of the stop block is greater than the aperture of the through hole.

2. A reflow soldering system for facilitating Mini LED production as claimed in claim 1, characterized in that: A sliding groove is provided on the inner wall of the clamping block 1, and a sliding block fixed on the driving block is slidably connected inside the sliding groove.

3. A reflow soldering system for facilitating Mini LED production as claimed in claim 1, characterized in that: A motor 1 is fixed to the bottom side of one end of the mounting plate, one end of the threaded rod 1 is transmission-connected to the output end of the motor 1, and the other end of the threaded rod 1 is rotatably connected to a connecting block fixed to the bottom side of the mounting plate.

4. A reflow soldering system for facilitating Mini LED production as claimed in claim 1, characterized in that: A stabilizing groove is provided at the bottom of the mounting plate. A stabilizing block fixed to one end of the clamping block is slidably connected to the inside of the stabilizing groove. The width of the stabilizing block is greater than the width of the notch of the stabilizing groove.

5. A reflow soldering system for facilitating Mini LED production as claimed in claim 1, characterized in that: Motor 2 is fixed to the inner walls at both ends of the top side of the work frame, and the output end of motor 2 is transmission-connected to threaded rod 2. The end of threaded rod 2 away from motor 2 is rotatably connected to the inner wall of the bottom of the work frame, and the outer wall of threaded rod 2 is threadedly sleeved with threaded sleeve 2 embedded in the mounting plate.

6. A reflow soldering system for facilitating Mini LED production as claimed in claim 1, characterized in that: A sliding groove is provided on the inner wall of the bottom of the working frame, and a sliding block fixed to the bottom of the protective shell is slidably connected to the inside of the sliding groove. A plurality of guide holes are provided in the middle of the sliding block, and a guide rod fixed to the inside of the sliding groove is slidably passed through the inside of the guide hole. A push spring is sleeved on the outside of the guide rod, and one end of the push spring is fixed on the sliding block, and the other end of the push spring is fixed on the inner wall of the sliding groove.

7. A reflow soldering system for facilitating Mini LED production according to claim 1, characterized in that: A linkage block is fixed on the outside of the material drawer of the reflow soldering machine body. The linkage block is an L-shaped structure. The material drawer of the reflow soldering machine body slides on the workbench.

8. A reflow soldering system for facilitating Mini LED production as claimed in claim 6, characterized in that: A sealing ring is provided on the inner wall of the sliding opening along the circumferential direction. The length of the sliding groove is greater than the length of the protective shell, and the protective shell slides on the working frame.

Citation Information

Patent Citations

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    CN208549095U

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