Chip detection device, chip flipping mechanism and flipping method thereof

Abstract

The present invention discloses a chip flipping mechanism, comprising a fixed seat, two air extraction plates, two turntable units, and a synchronous driving member, wherein the air extraction plate is provided with interconnected air extraction holes and air guide grooves, the two turntable units correspond to the two air extraction plates respectively, the turntable unit is rotatably mounted on the air extraction plate, the outer circumference of the turntable unit is provided with a plurality of suction holes, the disk surface of the turntable unit is provided with air receiving holes corresponding to the plurality of suction holes, a gap is formed between the outer circumferences of the two turntable units, and the synchronous driving member is mounted on the fixed seat; based on the above arrangement, when flipping the chip, the two turntable units are driven to rotate synchronously in the same direction by the synchronous driving member, and under the air extraction action of the two air guide grooves, the suction hole of the previous turntable unit absorbs the chip and enters the gap to correspond to the suction hole of the next turntable unit, and the chip is transferred to the suction hole of the next turntable unit, so as to realize chip flipping. The present invention also discloses a method for flipping a chip and a chip detection device with a chip flipping mechanism, so as to improve the detection work efficiency.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip detection equipment, and in particular relates to a chip detection device, a chip flipping mechanism and a chip flipping method thereof. Background Art

[0002] After the chip is manufactured, the electrical performance of the chip needs to be tested, including capacity parameter test, wear test, leakage current test, voltage resistance test, etc. Among them, leakage current test and voltage resistance test generally require charging the chip first. After the chip is fully charged, leakage current test and voltage resistance test are performed, and then the chip is discharged before the product is packaged.

[0003] When the chip charging device charges the chip, the pins of the chip face upwards, and when the chip is grabbed by the robot arm and enters the electrical performance testing device for electrical performance testing, the pins of the chip need to face downwards. Therefore, the chip after charging needs to be flipped in advance so that the pins of the chip face downwards. The company previously mainly used the patented technology with patent publication number CN112635387A to flip the chip. When the patented technology is used, the chip is placed on the respective placement parts of the two reciprocating rods through the suction piece. When the reciprocating rod is reset, the chips of the two reciprocating rods are facing each other to prevent the chips from falling out. The rotating disk and the reciprocating rod are driven by the motor to rotate, so that the chips on the two reciprocating rods can be flipped. The reciprocating rod driving component is driven by another motor to rotate, and its guide part is used to make the lower reciprocating rod extend and leak the chip on its placement part. After taking it out, the lower reciprocating rod is reset by the guide part of the reciprocating rod driving component, so that the chip of the upper reciprocating rod falls into the placement part of the lower reciprocating rod, and then the chip of the lower reciprocating rod is extended by the reciprocating rod driving component, thereby realizing the function of chip flipping.

[0004] However, the chip flipping technology requires two motors to be used simultaneously during operation, which will reduce the processing efficiency. In addition, the operation also involves the chip of the upper reset rod falling into the placement part of the lower reset rod. During the falling process of the chip, it sometimes rubs against the wall and becomes stuck. Therefore, this technology still has the problems of unstable flipping transmission process and low operating efficiency. Summary of the invention

[0005] In order to overcome the shortcomings of the prior art, the purpose of the present invention is to provide a chip detection device, a chip flipping mechanism and a flipping method thereof. The flipping mechanism and the flipping method thereof can use a single component to drive the chip to complete the flipping, so as to improve work efficiency and improve chip grasping stability; the detection device adopts the chip flipping mechanism, which can improve work efficiency.

[0006] The purpose of the present invention is achieved through the following technical solutions:

[0007] A chip flipping mechanism comprises a fixing seat, two air extraction plates, two turntable units, and a synchronous driving member;

[0008] Two air extraction plates are installed side by side on the fixed seat, and the air extraction plates are provided with interconnected air extraction holes and air guide grooves, and the air guide grooves are provided on the plate surface of the air extraction plates, and the air guide grooves are arranged in a circular arc segment, and the air guide grooves of the two air extraction plates are arranged in a mirror image along the midline of the two air extraction plates, and the plate surface of the air extraction plates is provided with a shaft sleeve hole, and the shaft sleeve hole is located at the center position of the circular arc corresponding to the air guide groove;

[0009] The two turntable units are respectively installed in correspondence with the two air extraction plates, and are divided into a front turntable unit and a rear turntable unit according to the order of transmitting the chips. Each turntable unit includes a disk body and a rotating shaft vertically connected to the center of the disk surface of the disk body. The disk body is inserted into the shaft sleeve hole through the rotating shaft to be in close contact with the air extraction plate. The outer circumferential surface of the disk body is provided with a plurality of suction holes at equal intervals in the circumferential direction for sucking and holding the chip. The disk surface of the disk body is provided with a plurality of air receiving holes, each of which is connected to each suction hole correspondingly. The plurality of air receiving holes are distributed on the same circular ring at equal intervals with the center of the disk body as the center of the circle. The arc length between two adjacent air receiving holes is the same as the arc length of the air guide groove, so that when the disk body rotates, each air receiving hole passes through the air guide groove in turn and is connected to the air guide groove. A gap for accommodating the chip is formed between the outer circumferential surfaces of the two turntable units.

[0010] The synchronous driving component is installed on the fixed seat, and synchronously drives the two turntable units to rotate synchronously in the same direction. It includes a driving motor, a driving wheel, and two synchronous wheels. The driving motor is fixed on the fixed seat, and the driving wheel is fixedly connected to the driving end of the driving motor. The two synchronous wheels are respectively fixed at one end of the rotating shaft of the two turntable units. The driving motor drives the driving wheel to rotate, which drives the two synchronous wheels to rotate synchronously in the same direction, and then drives the two disk bodies to rotate synchronously in the same direction.

[0011] The present invention also provides a method for flipping a chip using the chip flipping device, comprising the following steps:

[0012] First, the two turntable units are driven by a synchronous driving member to rotate synchronously in the same direction until a suction hole on the disk body of the two turntable units is located at the top of the disk body; at this time, the air receiving hole corresponding to the suction hole at the top of the disk body of the front turntable unit is just connected to the top of the air guide groove on the corresponding air extraction plate; an air extraction device is provided to extract air from the air extraction hole on the air extraction plate matched with the front turntable unit, so as to realize air extraction from the suction hole at the top of the disk body of the front turntable unit; then a suction unit is provided to suck the chip onto the suction hole at the top of the disk body of the front turntable unit, and the chip is sucked through the suction hole at the top of the front turntable unit;

[0013] Next, the two turntable units are driven by the synchronous driving member to rotate synchronously in the same direction. After rotating 90°, the suction hole on the disk body of the front turntable unit for sucking the chip rotates to a position where the suction holes of the two turntable units are adjacent and facing each other. At this time, the air receiving hole corresponding to the suction hole on the disk body of the front turntable unit for sucking the chip has been rotated to the lower end of the air guide groove of the corresponding air extraction plate, and the chip sucked on the disk body of the front turntable unit is located in the gap; the air receiving hole on the disk body of the rear turntable unit that is connected to the suction hole opposite to the chip is just connected to the bottom end of the air guide groove on the corresponding air extraction plate; an air extraction device is provided to exhaust the air extraction holes on the air extraction plate to exhaust the air through the suction holes on the disk body of the rear turntable unit, so that the side of the chip connected to the disk body of the rear turntable unit is sucked and held by the suction hole on the disk body of the rear turntable unit;

[0014] Next, the two turntable units are driven by the synchronous driving parts to rotate synchronously in the same direction. When the suction hole of the front turntable unit that absorbs the chip just moves out of the corresponding air guide groove of the exhaust plate, the suction hole of the rear turntable unit that is opposite to the chip will absorb the chip and drive the chip to rotate together with the turntable body. After rotating 90°, the rear turntable unit body drives the absorbed chip to rotate upward to the top to realize chip flipping.

[0015] The present invention also provides a chip detection device having the chip flipping device.

[0016] A chip detection device comprises a working platform, a main turret structure and a plurality of suction units, wherein the main turret structure is mounted on the working platform, and the plurality of suction units are evenly spaced and distributed on the periphery of the main turret structure along the rotation direction of the main turret structure, and are used to absorb chips and realize chip transfer between workstations through the rotation of the main turret structure; the top surface of the working platform is sequentially provided with the chip flipping mechanism, the first regularization mechanism, the electrical performance detection mechanism, the second regularization mechanism, the appearance detection mechanism, and the chip packaging mechanism along the rotation direction of the outer periphery of the main turret structure to form corresponding workstations;

[0017] The chip flipping mechanism is used to flip the chip so as to flip the pins of the chip from facing upward to facing downward;

[0018] The first regularization mechanism is used to adjust the position and direction of the chip;

[0019] The electrical performance detection mechanism is used to test the electrical performance of the chip;

[0020] The second regularization mechanism is used to adjust the position and direction of the chip;

[0021] The appearance detection mechanism is used to detect the appearance of the chip;

[0022] The chip packaging mechanism is used to package the chips that have passed the inspection.

[0023] The present invention has the following beneficial effects:

[0024] 1) The chip flipping mechanism of the present invention utilizes the air suction principle, and provides interconnected air suction holes and air guide grooves on the air suction plate. Under the air suction action of the air suction holes, the two air guide grooves are evacuated to form a corresponding air suction range, and then a turntable unit is arranged on the air suction plate. During the rotation of the turntable unit, when the air receiving hole enters the air suction range of the air guide groove, the suction hole corresponding to the air receiving hole can be made to absorb the chip, and when the air receiving hole moves out of the air guide groove, the suction hole corresponding to the air receiving hole can be released from the absorption of the chip; at the same time, since the air guide grooves of the two air suction plates are mirror-imaged, and the two turntable units are driven to rotate synchronously in the same direction by a synchronous driving member, when the front turntable unit absorbs the chip and rotates to the gap between the two turntable units, when the two turntable units are further rotated, the air receiving hole corresponding to the chip absorbed on the front turntable unit can be moved out of the air suction range of the air guide groove, and the air receiving hole corresponding to the chip on the rear turntable unit directly facing the chip enters the air suction range of the air guide groove, so that the corresponding suction hole absorbs the chip, and then the chip is flipped after rotation. It can be seen from this that the present invention only needs a synchronous driving member to drive the two turntable units to rotate, so that the chip can be transferred from the previous turntable unit to the next turntable unit and the turntable unit can be flipped, thus having the effect of simplifying and optimizing the structure. At the same time, the present invention adopts a method of sucking the chip with a suction hole, which can grasp the chip more stably, and forms a stable suction range trajectory for sucking and transmitting the chip by setting two mirrored air guide grooves, so that the transfer and flipping process of the chip is stable, thereby achieving the function of improving work efficiency.

[0025] 2) The method for flipping the chip by the chip flipping mechanism of the present invention is disclosed in the above 1). The gas guide grooves of the two air pumping plates are distributed in a mirror image of "eight" shape, the gas guide grooves are in a 1 / 4 arc shape, and the four suction holes on the disk body and their corresponding air receiving holes are evenly spaced about the center of the circle, so that any two adjacent air receiving holes on the disk body correspond to the two ends of the corresponding air guide groove. Therefore, when the driving motor of the synchronous driving member drives the two turntable units to rotate synchronously in the same direction, when the first air receiving hole of the turntable moves out of the air pumping range of the air guide groove, the air receiving hole adjacent thereto immediately enters the air pumping range of the air guide groove, so that the flipping rhythm of the chip is 1 / 4 of the rotation cycle of the driving motor of the synchronous driving member, and the chips sucked and transmitted thereafter can be flipped continuously, thereby achieving the effect of improving the flipping efficiency.

[0026] 3) The chip detection device of the present invention uses a chip flipping mechanism to flip the chip. Since the chip is grabbed by suction during the flipping process, the damage to the chip appearance can be reduced. At the same time, a synchronous drive member, an air extraction plate and an air guide groove provided thereon, and two turntables are used to transfer and flip the chip, which can effectively improve the chip flipping efficiency. Therefore, in the subsequent chip detection work of the chip detection device, it can play a role in reducing the appearance defect rate and improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is the overall structural diagram of the chip detection device of the present invention.

[0028] Figure 2 It is the overall structural diagram of the chip flipping mechanism of the present invention.

[0029] Figure 3 It is an exploded view of the chip flipping mechanism of the present invention.

[0030] Figure 4 It is a schematic diagram of the working state of the two turntable units of the present invention when they are working.

[0031] Figure 5 It is an exploded view of the chip flipping mechanism of the present invention from another perspective.

[0032] Figure 6 It is a schematic diagram of the overall structure of the electrical performance detection mechanism of the present invention.

[0033] Figure 7 for Figure 6 Local structure diagram of .

[0034] In the figure: 101, working platform; 102, main turret structure; 103, suction unit; 104, chip; 10, chip flip mechanism; 11, fixed seat; 111, vertical plate; 12, air extraction plate; 121, air extraction hole; 122, air guide groove; 123, shaft sleeve hole; 13, turntable unit; 130, disk body; 131, suction hole; 132, air receiving hole; 133, rotating shaft; 134, bump; 135, limit block; 136, gap; 14, synchronous drive member; 141, drive motor; 142, drive Wheel; 143, synchronous wheel; 144, synchronous belt; 145, bearing plate; 146, tensioning wheel; 15, collecting box; 16, annular sheet; 20, first regularizing mechanism; 30, electrical performance detection mechanism; 31, base; 32, fixing block; 33, chip mold base; 331, accommodating groove; 332, through hole; 34, connecting block; 341, connecting hole; 35, conductive rod; 36, test probe; 40, second regularizing mechanism; 50, appearance detection mechanism; 60, defective product collection mechanism; 70, chip packaging mechanism. DETAILED DESCRIPTION

[0035] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The terms such as "upper", "inner", "middle", "left", "right" and "one" cited in this specification are only for the convenience of description, and are not used to limit the scope of the present invention. The change or adjustment of their relative relationship shall also be regarded as the scope of the present invention without substantially changing the technical content.

[0036] See also Figure 1 A chip detection device includes a working platform 101, a main turret structure 102, and a plurality of suction units 103. The main turret structure 102 is installed on the working platform 101. The plurality of suction units 103 are evenly spaced and distributed around the main turret structure 102 along the rotation direction of the main turret structure 102. The suction units 103 are used to suck chips 104 ( Figure 2 The chip 104 is transferred between workstations by the rotation of the main turret structure 102. The top surface of the working platform 101 is provided with a chip flipping mechanism 10, a first regularizing mechanism 20, an electrical performance detection mechanism 30, a second regularizing mechanism 40, an appearance detection mechanism 50, a defective product collection mechanism 60, and a chip packaging mechanism 70 in sequence along the clockwise rotation direction of the outer periphery of the main turret structure 102 (which is also the rotation transmission direction of the main turret) to form corresponding workstations. The chip flipping mechanism 10 is used to flip the chip 104 so as to flip the pins of the chip 104 from upward to downward; the first regularizing mechanism 20 is used to adjust the position of the chip 104 and the pin position of the chip 104 so as to facilitate the subsequent electrical performance test of the chip 104; the electrical performance detection mechanism 30 is used to perform corresponding electrical performance tests (such as leakage test, withstand voltage test, loss test, etc.) on the chip 104; in this embodiment, multiple electrical performance detection mechanisms 30 are provided, and different electrical performance detection mechanisms 30 can be connected according to the test needs to perform various electrical performance tests on the chip 104. The second regularization mechanism 40 is used to adjust the position of the chip 104 and the bonding state between the pins of the chip 104 and the chip 104, so as to facilitate the subsequent appearance inspection of the chip 104; the appearance inspection mechanism 50 is used to inspect the appearance of the chip 104; there are multiple unqualified product collection mechanisms 60, which are respectively arranged corresponding to the electrical performance inspection mechanism 30 and the appearance inspection mechanism 50 to collect unqualified chips 104 after electrical performance testing or appearance inspection. The chip packaging mechanism 70 is used to package the qualified chips 104, and the chip packaging mechanism 70 can adopt a bulk packaging machine or a packaging machine with a connected output as a whole.

[0037] See also Figures 2 to 4The chip flipping mechanism 10 includes a fixed seat 11, two air extraction plates 12, two turntable units 13, and a synchronous driving member 14. The fixed seat 11 is installed on the top surface of the working platform 101, and includes a vertical plate 111, which is vertically arranged on the top surface of the working platform 101 and is located on the outer peripheral side of the main turret structure 102. The two air extraction plates 12 are installed side by side on the upper end of the same plate surface of the vertical plate 111 along the transmission direction. Specifically, in this embodiment, they can be located on the plate surface of the vertical plate 111 opposite to the main turret structure 102. The air extraction plate 12 is provided with an air extraction hole 121, an air guide groove 122, and a shaft sleeve hole 123. The air extraction hole 121 is provided on the peripheral wall of the air extraction plate 12, and the air guide groove 122 is provided on the plate surface of the air extraction plate 12 and is connected with the air extraction hole 121. The shaft sleeve hole 123 is through-opened in the center of the plate surface of the air extraction plate 12 for installing the turntable unit 13.

[0038] In this embodiment, the air extraction plate 12 is a square plate body, and the air extraction hole 121 is provided on the top surface of the air extraction plate 12, which is used to connect the air extraction device for air extraction; the air guide groove 122 is provided on the plate surface of the air extraction plate 12 opposite to the vertical plate 111, and the air guide groove 122 is a 1 / 4 arc-shaped groove, and the air extraction hole 121 extends downward in the plate body of the air extraction plate 12 to communicate with the air guide groove 122. In this application, two air extraction plates 12 are installed side by side on the same plate surface of the vertical plate 111, one plate surface of each air extraction plate 12 is attached to the plate surface of the vertical plate 111, and the air guide groove 122 is provided on the other plate surface, and the air guide grooves 122 of the two air extraction plates 12 are arranged in a mirror image along the midline of the two air extraction plates 12, roughly in an inverted "eight" shape. The sleeve hole 123 is formed at the center of the plate surface of the air pumping plate 12 to match the turntable unit 13 . The air guide groove 122 can be regarded as a section formed on the outer ring of the sleeve hole 123 .

[0039] The two turntable units 13 are respectively installed in correspondence with the two air extraction plates 12, and can be regarded as the front turntable unit and the rear turntable unit according to the order of transmitting the chips 104. Each turntable unit 13 includes a disk body 130 and a rotating shaft 133 vertically connected to the center of the disk surface of the disk body 130. The rotating shaft 133 passes through the shaft sleeve hole 123 of the air extraction plate 12 and the vertical plate 111, and extends to the other side of the vertical plate 111. The disk body 130 is a disk, and the outer circumference of the disk body 130 is protruded with four protrusions 134 at equal intervals along the circumferential direction for installing the chip 104, and the protrusions 134 of the two disk bodies 130 arranged side by side are adjacent to each other ( Figure 4 As shown in FIG. 1 , there is a gap 136 between adjacent bumps 134 that is approximately the thickness of the chip 104 .

[0040] A suction hole 131 is provided on the top surface of each protrusion 134 and extends to a preset depth along the radial direction of the disc body 130. One disc surface of the disc body 130 is attached to the plate surface of the air extraction plate 12 on which the air guide groove 122 is provided, thereby covering the air guide groove 122 on the plate surface of the air extraction plate 12, which can be regarded as forming the air guide groove 122 into an air passage. Four air receiving holes 132 are provided on the disc surface of the disc body 130 attached to the plate surface of the air extraction plate 12, and the four air receiving holes 132 are evenly spaced and distributed on the same circular ring, and each air receiving hole 132 is correspondingly connected to the end of each suction hole 131, so that each air receiving hole 132 and the corresponding suction hole 131 form an "L"-shaped air guide channel, so that four "L"-shaped air guide channels are formed on each disc body 130. Furthermore, the position of each air receiving hole 132 on the disk body 130 corresponds to the position of the air guide groove 122 on the air extraction plate 12. Specifically, the air receiving holes 132 are evenly spaced and distributed on the same circle with the center of the disk body 130 as the center. The arc length between two adjacent air receiving holes 132 is the same as the arc length of the air guide groove 122. That is, the radius from the air receiving hole 132 to the center of the disk body 130 is the same as the radius from the arc where the air guide groove 122 is located to its center, and the spacing between adjacent air receiving holes 132 is the same as the spacing between the two ends of the air guide groove 122. In this way, after the disk body 130 is installed in conjunction with the air extraction plate 12 and the disk body 130 rotates, the four air receiving holes 132 will all pass through the arc where the air guide groove 122 of the air extraction plate 12 is located. When each air receiving hole 132 passes through the air guide groove 122, the corresponding air receiving hole 132 will be connected to the air guide groove 122. Since the air guide groove 122 is connected to the air extraction hole 121 for extraction, the suction hole 131 connected to the air receiving hole 132 will be sucked, thereby holding the chip 104 on the bump 134.

[0041] Furthermore, a limiting block 135 is fixedly connected to each protrusion 134 of the disk body 130 of the rear turntable unit, so that when the protrusions 134 of the two disk bodies 130 are adjacent to each other, the limiting block 135 on the protrusion 134 of the rear turntable unit will be located at the bottom of the gap 136, playing the role of supporting the chip 104 and preventing the chip 104 from falling. Specifically, in this embodiment, the limiting block 135 extends from the rear side of the top surface of the protrusion 134 along the clockwise direction of the disk body 130, so that when the two disk bodies 130 are both rotated counterclockwise, when the protrusions 134 of the two disk bodies 130 are adjacent to each other, the limiting block 135 on the protrusion 134 of the rear turntable unit will be located at the bottom of the gap 136 to support the chip 104.

[0042] Furthermore, the chip flipping mechanism 10 includes a collecting box 15 , which is mounted on the side of the vertical plate 111 . The collecting box 15 is located below the two trays 130 and is used to collect the fallen chips 104 .

[0043] Furthermore, in order to improve the sealing performance of the disk body 130 fitting on the surface of the air extraction plate 12 to cover the air guide groove 122 and to facilitate the smooth rotation of the disk body 130 relative to the air extraction plate 12, annular sheets 16 are respectively installed at the air receiving holes 132 on the disk body 130 and the air guide grooves 122 on the air extraction plate 12. The annular sheet 16 installed on the disk body 130 has corresponding holes for the air receiving holes 132, and the annular sheet 16 installed on the air extraction plate 12 has corresponding grooves for matching the air guide grooves 122. In this way, the sealing performance and the smoothness of rotation are improved by the surface fitting of the two annular sheets 16.

[0044] See also Figure 5 The synchronous driving member 14 is installed on the plate surface of the vertical plate 111 on the side opposite to the exhaust plate 12, that is, the plate surface of the vertical plate 111 on the side close to the main turret structure 102, and is used to drive the two disk bodies 130 to rotate synchronously in the same direction. The synchronous driving member 14 includes a driving motor 141, a driving wheel 142, two synchronous wheels 143, and a synchronous belt 144. The driving motor 141 is fixed on the vertical plate 111, the driving wheel 142 is fixed to the driving end of the driving motor 141, and the two synchronous wheels 143 are respectively installed on the ends of the rotating shafts 133 of the two turntable units 13 that pass through the vertical plate 111. The synchronous belt 144 is sleeved on the outer periphery of the driving wheel 142 and the two synchronous wheels 143, so as to drive the synchronous wheels 143 to rotate through the driving motor 141, and the synchronous belt 144 is used to drive the two synchronous wheels 143 to rotate synchronously in the same direction.

[0045] Furthermore, the synchronous drive member 14 includes a tensioning wheel 146, and a bearing plate 145 is installed on the side of the vertical plate 111 for installing the tensioning wheel 146, so that the tensioning wheel 146 and the two synchronous wheels 143 are arranged in an isosceles triangle, and the tensioning wheel 146 is located below the two synchronous wheels 143 and directly above the driving wheel 142. The portion of the synchronous belt 144 located between the two synchronous wheels 143 is wrapped around the outer circumference of the tensioning wheel 146, and the tensioning wheel 146 is used to tension the synchronous belt 144.

[0046] See also Figure 4 When the chip flipping mechanism 10 flips the chip 104, it is first driven by the synchronous driving member 14 to make the two turntable units 13 rotate synchronously in the same direction until a convex block 134 on the disk body 130 of the two turntable units 13 is located at the top of the disk body 130; at this time, the air receiving hole 132 corresponding to the convex block 134 at the top of the disk body 130 of the front turntable unit is just opposite to the top of the air guide groove 122 on the corresponding air extraction plate 12, and the air extraction device extracts air from the air extraction hole 121 on the air extraction plate 12 matched with the front turntable unit to realize the suction hole 131 on the top surface of the convex block 134 at the top of the disk body 130 of the front turntable unit; then the suction unit 103 sucks the chip 104 and places it on the convex block 134 at the top of the disk body 130 of the front turntable unit, and uses the corresponding suction hole 131 on the convex block 134 to suck the chip 104 (such as Figure 4 ① as shown in the figure); then, the two turntable units 13 are driven by the synchronous driving member 14 to rotate synchronously in the same direction. After rotating 90°, the protrusion 134 on the disk body 130 of the front turntable unit for sucking the chip 104 rotates to a position where the protrusions 134 of the two turntable units 13 are adjacent to each other. At this time, the suction hole 131 of the protrusion 134 on the disk body 130 of the front turntable unit for sucking the chip 104 has been rotated to the lower end of the air guide groove 122 of the corresponding air extraction plate 12. During this rotation process, the suction hole 131 of the protrusion 134 on the disk body 130 of the front turntable unit for sucking the chip 104 is always connected to the air guide groove 122, so that the chip 104 is stably sucked on the protrusion 134. The protrusion 134 of the chip 104 sucked on the disk body 130 of the front turntable unit is directly opposite to one of the protrusions 134 of the disk body 130 of the rear turntable unit (as shown in the figure). Figure 4 As shown in ② in the figure), the chip 104 held by the protrusion 134 on the disk body 130 of the front turntable unit is accommodated in the gap 136; at this time, the air receiving hole 132 of the protrusion 134 on the disk body 130 of the rear turntable unit opposite to the chip 104 is just directly connected with the bottom end of the air guide groove 122 on the corresponding air suction plate 12, and the corresponding air suction device exhausts air from the air suction holes 121 on the rear end air suction plate 12, thereby exhausting air from the suction holes 131 on the protrusion 134 on the disk body 130 of the rear turntable unit, so that the side of the chip 104 connected to the disk body 130 of the rear turntable unit is held by the suction hole 131 on the disk body 130 of the rear turntable unit.

[0047] Then, the synchronous driving member 14 is further driven to drive the two disk bodies 130 to rotate synchronously in the same direction. When the suction hole 131 of the disk body 130 of the front turntable unit sucks the chip 104 and just moves out of the corresponding air guide groove 122 of the air extraction plate 12, the suction hole 131 of the disk body 130 of the rear turntable unit opposite to the chip 104 will suck the chip 104 and drive the chip to rotate together with the disk body 130; the disk body 130 of the rear turntable unit continues to drive the sucked chip 104 to rotate upward to the top end. After rotating 90°, the air receiving hole 132 of the bump 134 on the disk body 130 of the rear turntable unit that sucks the chip 104 rotates to the top end of the corresponding air guide groove 122 on the air extraction plate 12. During this rotation process, the suction hole 131 of the bump 134 on the disk body 130 of the rear turntable unit that sucks the chip 104 is always maintained in communication with the air guide groove 122, so that the chip 104 is stably sucked on the bump 134. Thus, the chip 104 is flipped over, and the pins of the chip 104 are flipped from facing upward to facing downward (such as Figure 4 (as shown in ③).

[0048] Then, the chip 104 on the protrusion 134 on the top surface of the disk body 130 of the rear turntable unit is sucked by the suction unit 103, and the two disk bodies 130 are further driven to rotate by the synchronous driving member 14. The air receiving hole 132 of the disk body 130 of the rear turntable unit is disengaged from the air guide groove 122 on the corresponding exhaust plate 12, and its suction hole 131 will be disengaged from the suction of the chip 104. The suction unit 103 can smoothly suck the flipped chip 104.

[0049] It can be seen from the flipping action process of the upper chip flipping mechanism 10 that the two turntable units 13 are driven to rotate cyclically by the synchronous driving member 14. When one of the air receiving holes 132 of the turntable unit 13 moves out of the air suction range of the air guide groove 122, the adjacent air receiving hole 132 immediately enters the air suction range of the air guide groove 122, so that the flipping rhythm of the chip 104 is 1 / 4 of the rotation period of the driving motor 141 of the synchronous driving member 14, so that the chips 104 sucked and transmitted thereafter can be continuously flipped, and the chips 104 can be flipped one by one, thereby achieving the effect of improving the flipping efficiency.

[0050] It is understandable that the protrusions 134 protruding at equal intervals on the outer surface of the disk body 130 along the circumferential direction can be omitted, and the suction holes 131 can be directly opened at equal intervals on the outer surface of the disk body 130 along the circumferential direction, and the chip 104 can be sucked by the opening ends of the suction holes 131.

[0051] See also Figure 6 and Figure 7 The electrical performance detection mechanism 30 includes a base 31 , a fixing block 32 , a chip die 33 , a connecting block 34 , a conductive rod 35 , and a test probe 36 . The base 31 is installed on the work platform 101, the fixing block 32 is installed on the side of the top of the base 31, and the chip mold base 33 is installed on the top surface of the fixing block 32. The top surface of the chip mold base 33 is provided with a receiving groove 331 for the chip 104 to be placed. The inner bottom surface of the receiving groove 331 corresponds to the detection point of the chip 104 pin and has four through holes 332. The four through holes 332 all correspond to the corresponding pin contacts of the chip 104. The connecting block 34 is installed on the side of the base 31. The bottom surface of the connecting block 34 is provided with four connecting holes 341. The four connecting holes 341 correspond to the four through holes 332. The number of the conductive rods 35 is consistent with the number of the connecting holes 341. The conductive rods 35 are fixed in the connecting holes 341. The number of the test probes 36 is consistent with the number of the conductive rods 35. The test probes 36 are fixed to the top of the conductive rods 35, and the ends of the test probes 36 pass through the through holes 332 and extend into the receiving groove 331.

[0052] In this way, by rotating the main turret structure 102, the suction unit 103 sucks the chip 104 and places it in the receiving groove 331, so that the pins of the chip 104 are in contact with the corresponding test probes 36 in the receiving groove 331, and then according to the needs of electrical performance testing, the corresponding electrical performance testing mechanism 30 is selected. The electrical performance testing mechanism 30 has a number of probe interfaces, and a corresponding number of conductive rods 35 in the electrical performance testing mechanism 30 are selected for electrical docking, so as to use the electrical performance testing mechanism 30 to test the electrical performance of the chip 104.

[0053] When the chip detection device is working, the main turret structure 102 drives the suction unit 103 to rotate along the transmission direction, and the suction unit 103 sucks the fully charged chip 104 at the end of the chip charging device, and then places it on the protrusion 134 at the top of the front turntable unit disk body 130 in the chip flipping mechanism 10, and uses the suction hole 121 to evacuate the air guide groove 122 and the air receiving hole 132 connected to the air guide groove 122, so that the suction hole 131 absorbs the chip 104, and then, driven by the synchronous driving member 14 and the suction effect of the suction hole 121, the chip 104 is transferred from the disk body 130 of the front turntable unit to the disk body 130 of the rear turntable unit, until the disk body 130 of the rear turntable unit rotates and the chip 104 is at its top, the chip 104 is flipped, and the pins of the chip 104 are facing downwards; then the suction unit 103 is used to suck the chip 104 on the disk body 130 of the rear turntable unit and transfer it to On the first tidying mechanism 20, the position and direction of the chip 104 are adjusted by the first tidying mechanism 20; then the chip 104 of the first tidying mechanism 20 is sucked by the suction unit 103 and transferred to the receiving groove 331 of the electrical performance testing mechanism 30, and the corresponding electrical performance testing machine is connected to the conductive rod 35 to detect the electrical performance of the chip 104; after the test is qualified, the chip 104 on the electrical performance testing mechanism 30 is sucked by the suction unit 103 and transferred to the second tidying mechanism 40, and the position and direction of the chip 104 is adjusted by the second tidying mechanism 40; then the chip 104 of the second tidying mechanism 40 is sucked by the suction unit 103 and transferred to the appearance testing mechanism 50, and the appearance of the chip 104 is tested; after the appearance test is qualified, the chip 104 is transferred to the chip packaging mechanism 70 by the suction unit 103, and the qualified chip 104 is packaged.

[0054] In summary, compared with the prior art, the chip flipping mechanism 10 of the present invention utilizes the air suction principle, by arranging the air pumping plates 12 side by side and the turntable unit 13 corresponding to each air pumping plate 12, by opening the connected air pumping holes 121 and the air guide grooves 122 on the air pumping plates 12, under the air pumping action of the air pumping holes 121, the two air guide grooves 122 are evacuated, so that the air guide grooves 122 form a corresponding air pumping range as a whole, and by opening the air guide channel on the turntable unit 13, during the rotation of the disk body 130, When the air receiving hole 132 of the air guide channel enters the air extraction range of the air guide groove 122, the suction hole 131 connected to the air receiving hole 132 can suck the chip 104. When the air receiving hole 132 is out of contact with the air guide groove 122, the suction hole 131 corresponding to the air receiving hole 132 can be released from sucking the chip 104. The air guide grooves 122 of the two air extraction plates 12 are mirror-distributed, and the two disks 130 rotate synchronously in the same direction. Therefore, the chip 104 sucked by the disk 130 of the front turntable unit is When the two disk bodies 130 are rotated to the gap 136 between them, the two disk bodies 130 are further rotated, so that the air receiving holes 132 corresponding to the chip 104 sucked on the disk body 130 of the front turntable unit can be moved out of the air extraction range of the air guide groove 122, and the air receiving holes 132 corresponding to the chip 104 on the disk body 130 of the rear turntable unit facing the chip 104 can enter the air extraction range of the air guide groove 122, so that the corresponding suction holes 131 can suck the chip 104, and then the chip 104 can be turned over after the rotation.

[0055] It can be seen from this that the present invention only needs the synchronous driving member 14 to drive the two disks 130 to rotate, so as to transfer the chip 104 from the front turntable unit to the rear turntable unit and realize the flipping of the chip 104, which has the effect of simplifying and optimizing the structure. At the same time, the present invention adopts the method of sucking the chip 104 by the suction hole 131, which can grasp the chip 104 more stably, and by setting two mirror-image air guide grooves 122, a stable air extraction range trajectory for sucking and transmitting the chip 104 is formed, so that the transfer and flipping process of the chip 104 is stable, thereby achieving the function of improving work efficiency.

[0056] At the same time, the chip flipping mechanism 10 of the present invention is applied to the chip detection device. Since the chip 104 is grasped by suction during the flipping process, the damage to the appearance of the chip 104 can be reduced. At the same time, the synchronous driving member 14, the air pumping plate 12 and the air guide groove 122 provided thereon, and the two disks 130 are used to transfer and flip the chip 104, which can effectively improve the flipping efficiency of the chip 104. Therefore, in the subsequent chip 104 detection work of the chip 104 detection device, it can play a role in reducing the appearance defect rate and improving the work efficiency.

[0057] It can be understood that the number of suction holes 131 on the tray 130 corresponds to the number of workstations, which can be 4, 8, 16, etc., among which 4 is the most suitable. Each workstation has a corresponding number of air receiving holes 132, and the arc length distance between adjacent air receiving holes 132 is the same as the arc length of the air guide groove 122.

[0058] The implementation methods of the present invention are not limited to this. According to the above content of the present invention, using common technical knowledge and customary means in the field, without departing from the above basic technical ideas of the present invention, the present invention can also make other various forms of modification, replacement or combination, all of which fall within the scope of protection of the present invention.

Claims

1. A chip flipping mechanism, characterized in that: It comprises a fixed seat (11), two air extraction plates (12), two turntable units (13), and a synchronous driving member (14); Two air extraction plates (12) are mounted side by side on the fixing seat (11); the air extraction plates (12) are provided with interconnected air extraction holes (121) and air guide grooves (122); the air guide grooves (122) are provided on the plate surface of the air extraction plates (12); the air guide grooves (122) are arranged in the form of circular arc segments; the air guide grooves (122) of the two air extraction plates (12) are arranged in a mirror image along the midline of the two air extraction plates (12); the plate surface of the air extraction plates (12) is provided with shaft sleeve holes (123); the shaft sleeve holes (123) are located at the center position of the circular arc corresponding to the position of the air guide grooves (122); The two turntable units (13) are respectively installed in correspondence with the two air extraction plates (12), and are divided into a front turntable unit and a rear turntable unit according to the order of transmitting the chips (104). Each turntable unit (13) includes a disk body (130) and a rotating shaft (133) vertically connected to the center of the disk surface of the disk body (130). The disk body (130) is connected to the air extraction plate (12) by inserting the rotating shaft (133) into the shaft sleeve hole (123). The disc (130) is fitted against each other, and a plurality of suction holes (131) are provided at equal intervals on the outer circumferential surface of the disc body (130) in the circumferential direction for sucking the chip (104). A plurality of air receiving holes (132) are provided on the disc surface of the disc body (130), and each air receiving hole (132) is correspondingly connected to each suction hole (131). The plurality of air receiving holes (132) are distributed on the same circular ring at equal intervals with the center of the disc body (130) as the center of the circle. The arc length between two adjacent air receiving holes (132) is the same as the arc length of the air guide groove (122), so that when the disc body (130) rotates, each air receiving hole (132) passes through the air guide groove (122) in sequence and is connected to the air guide groove (122). A gap (136) for accommodating the chip (104) is formed between the outer circumferential surfaces of the two rotating disc units (13); The synchronous driving member (14) is mounted on the fixed seat (11) and synchronously drives the two turntable units (13) to rotate synchronously in the same direction. The synchronous driving member (14) comprises a driving motor (141), a driving wheel (142), and two synchronous wheels (143). The driving motor (141) is fixed on the fixed seat (11). The driving wheel (142) is fixedly connected to the driving end of the driving motor (141). The two synchronous wheels (143) are respectively fixedly arranged on one end of the rotating shaft (133) of the two turntable units (13). The driving motor (141) drives the driving wheel (142) to rotate. The driving wheel (142) drives the two synchronous wheels (143) to rotate synchronously in the same direction, thereby driving the two disk bodies (130) to rotate synchronously in the same direction.

2. The chip flipping mechanism according to claim 1, characterized in that: The outer peripheral surface of the disk body (130) of the turntable unit (13) is protruded with a bump (134), and the suction hole (131) is opened on the top surface of the bump (134) and extends to a preset depth along the radial direction of the disk body (130). When the bumps (134) of two disk bodies (130) arranged side by side are adjacent to each other, a gap (136) for accommodating a chip (104) is formed between adjacent bumps (134).

3. The chip flipping mechanism according to claim 2, characterized in that: The protrusion (134) of the rear turntable unit is fixedly connected to a limiting block (135), and the limiting block (135) extends out from one side of the top surface of the protrusion (134), so that when the protrusions (134) of the two turntable units (13) are adjacent to each other, the limiting block (135) is located at the bottom of the gap (136) to support the chip (104) sucked by the suction hole (131).

4. The chip flipping mechanism according to claim 1, characterized in that: The fixing seat (11) comprises a vertical plate (111), two air extraction plates (12) are installed side by side on the upper end of the same plate surface of the vertical plate (111) along the transmission direction, and an air extraction hole (121) is provided on the top surface of the air extraction plate (12) for connecting an air extraction device for air extraction; an air guide groove (122) is provided on the plate surface of the air extraction plate (12) opposite to the vertical plate (111), and the air extraction hole (121) extends downward in the plate body of the air extraction plate (12) to communicate with the air guide groove (122); a plate surface of the plate body (130) is attached to the plate surface of the air extraction plate (12) provided with the air guide groove (122), so as to cover the air guide groove (122) on the plate surface of the air extraction plate (12).

5. The chip flipping mechanism according to claim 4, characterized in that: The air guide groove (122) is arranged in the shape of a quarter arc, and four air receiving holes (132) are provided on the disk surface of the disk body (130) which is attached to the surface of the air extraction plate (12), and the four air receiving holes (132) are evenly spaced and distributed on the same circular ring, and each air receiving hole (132) is correspondingly connected to the end of each suction hole (131), so that each air receiving hole (132) and the corresponding suction hole (131) form an "L"-shaped air guide channel, thereby forming four "L"-shaped air guide channels on each disk body (130).

6. The chip flipping mechanism according to claim 1, characterized in that: The synchronous driving member (14) comprises a tensioning wheel (146) which is rotatably mounted on a fixed seat (11); a portion of a synchronous belt (144) located between two synchronous wheels (143) is wound around an outer peripheral surface of the tensioning wheel (146); and the tensioning wheel (146) is used to tension the synchronous belt (144).

7. A method for flipping a chip using a chip flipping mechanism as claimed in any one of claims 1 to 6, characterized in that: The steps include: First, the two turntable units (13) are driven to rotate synchronously in the same direction by a synchronous driving member (14) until a suction hole (131) on the disk body (130) of the two turntable units (13) is located at the top of the disk body (130); the suction hole (131) at the top of the disk body (130) of the front turntable unit corresponds to the connected air receiving hole (132), which is just in direct communication with the top of the air guide groove (122) on the corresponding air extraction plate (12); an air extraction device is provided to extract air from the air extraction hole (121) on the air extraction plate (12) matched with the front turntable unit, so as to realize air extraction from the suction hole (131) at the top of the disk body (130) of the front turntable unit; a suction unit (103) is provided to suck the chip (104) and place it on the suction hole (131) at the top of the disk body (130) of the front turntable unit, and the chip (104) is sucked through the suction hole (131) at the top of the front turntable unit; Then, the two turntable units (13) are driven to rotate synchronously in the same direction through the synchronous driving member (14). After rotating 90 degrees, the suction hole (131) on the disk body (130) of the front turntable unit for sucking the chip (104) rotates to a position adjacent to and facing the suction holes (131) of the two turntable units (13). At this time, the suction hole (131) on the disk body (130) of the front turntable unit for sucking the chip (104) and the corresponding connected air receiving hole (132) have been rotated to the lower end of the air guide groove (122) of the corresponding air extraction plate (12), and the chip (104) sucked on the disk body (130) of the front turntable unit is rotated to the lower end of the air guide groove (122) of the corresponding air extraction plate (12). 4) is located in the gap (136); the air receiving hole (132) on the disk body (130) of the rear turntable unit, which is connected to the suction hole (131) connected to the chip (104), is exactly connected to the bottom end of the air guide groove (122) on the corresponding air extraction plate (12), and an air extraction device is provided to evacuate the air extraction hole (121) on the air extraction plate (12), so as to evacuate the suction hole (131) on the disk body (130) of the rear turntable unit, so that the side of the chip (104) connected to the disk body (130) of the rear turntable unit is sucked and held by the suction hole (131) on the disk body (130) of the rear turntable unit; Next, the two turntable units (13) are driven to rotate synchronously in the same direction through the synchronous driving member (14). When the suction hole (131) of the disk body (130) of the front turntable unit sucking the chip (104) just moves out of the corresponding air guide groove (122) of the air extraction plate (12), the suction hole (131) on the disk body (130) of the rear turntable unit facing the chip (104) will suck the chip (104) and drive the chip (104) to rotate together with the disk body (130). After rotating 90°, the disk body (130) of the rear turntable unit drives the sucked chip (104) to rotate upward to the top, thereby realizing the flipping of the chip (104).

8. The method for flipping a chip by a chip flipping mechanism as claimed in claim 7, characterized in that: When the disk body (130) of the rear turntable unit drives the chip (104) to the top, the air receiving hole (132) on the disk body (130) of the rear turntable unit that holds the chip (104) rotates to the top of the corresponding air guide groove (122) on the exhaust plate (12), providing the suction unit (103) with the chip (104) on the top surface of the disk body (130) of the rear turntable unit, and further driving the two disk bodies (130) to rotate through the synchronous driving member (14), the air receiving hole (132) of the disk body (130) of the rear turntable unit will be separated from the air guide groove (122) on the corresponding exhaust plate (12), and its suction hole (131) will be separated from the holding of the chip (104), and the suction unit (103) will suck the flipped chip (104).

9. A chip detection device, comprising a working platform (101), a main turret structure (102), and a plurality of suction units (103), wherein the main turret structure (102) is installed on the working platform (101), and the plurality of suction units (103) are evenly spaced and distributed on the periphery of the main turret structure (102) along the rotation direction of the main turret structure (102), and are used to suck chips (104) and realize chip (104) transfer between workstations through the rotation of the main turret structure (102); characterized in that: The top surface of the working platform (101) is provided with a chip flipping mechanism (10) according to any one of claims 1 to 6, a first tidying mechanism (20), an electrical performance testing mechanism (30), a second tidying mechanism (40), an appearance testing mechanism (50), and a chip packaging mechanism (70) in sequence along the rotation direction of the outer periphery of the main turret structure (102) to form corresponding workstations; The chip flipping mechanism (10) is used to flip the chip (104) so ​​as to flip the pins of the chip (104) from facing upward to facing downward; The first regularization mechanism (20) is used to adjust the position and direction of the chip (104); The electrical performance detection mechanism (30) is used to test the electrical performance of the chip (104); The second regularization mechanism (40) is used to adjust the position and direction of the chip (104); The appearance detection mechanism (50) is used to detect the appearance of the chip (104); The chip packaging mechanism (70) is used to package the chips (104) that have passed the inspection.

10. The chip detection device according to claim 9, characterized in that: The electrical performance detection mechanism (30) comprises a base (31), a fixing block (32), a chip mold base (33), a connecting block (34), a conductive rod (35), and a test probe (36); the base (31) is mounted on a working platform (101), the fixing block (32) is mounted on the side of the top of the base (31), the top surface of the fixing block (32) on which the chip mold base (33) is mounted, the top surface of the chip mold base (33) is provided with a receiving groove (331) for the chip (104) to be placed, the inner bottom surface of the receiving groove (331) is provided with a plurality of through holes (332) corresponding to the detection points of the pins of the chip (104), the connecting block (34) is provided with a conductive rod (35), and a test probe (36) is provided. The connecting block (34) is mounted on the side of the base (31). The bottom surface of the connecting block (34) is provided with a plurality of connecting holes (341). The plurality of connecting holes (341) correspond to the plurality of through holes (332). The number of the conductive rods (35) is consistent with the number of the connecting holes (341). The conductive rods (35) are fixed in the connecting holes (341). The number of the testing probes (36) is consistent with the number of the conductive rods (35). The testing probes (36) are fixed to the top ends of the conductive rods (35). The ends of the testing probes (36) pass through the through holes (332) and then extend into the receiving groove (331), so as to perform an electrical performance test on the chip (104) in the receiving groove (331).

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