A scalable tiled manufacturing method for Ka-Ku dual polarized microstrip antenna assembly units

Abstract

The application discloses a kind of expandable splicing manufacturing methods of Ka-Ku dual polarization microstrip antenna assembly unit, it is related to radar electronic antenna feed subsystem manufacturing technical field, comprising the following steps: step one: process multiple recesses on multiple housings, spot solder paste in the recess of housing;Step two: by transfer tooling, multiple groups of Ka frequency band elastic connectors and multiple groups of Ku frequency band elastic connectors are respectively installed into the multiple recesses of housing;Step three: by low-temperature welding, the interconnection of Ka frequency band elastic connector, Ku frequency band elastic connector and housing is completed;Step four: conductive adhesive film is laid on multiple antenna microstrip boards, and positioning pin is installed on multiple housings;The application realizes the dual polarization, high integration, high reliability of microstrip antenna assembly unit by the elastic vertical interconnection of antenna microstrip board and elastic connector;It can be used in Ka frequency band and above high frequency band, standing wave can be realized ≤2.2, and the electrical performance is excellent in millimeter wave use range.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of radar electronic antenna feeder subsystem manufacturing, in particular to a scalable splicing manufacturing method of Ka-Ku dual-polarized microstrip antenna assembly units. BACKGROUND

[0002] Although the traditional dual-polarized cross microstrip antenna can optimize the gain of the dual-polarized array antenna by increasing the number of units and changing the spatial position distribution mode of the units, with the increase of the frequency band of the antenna, the frequency band becomes wider, and the antenna unit needs to realize the reception and transmission of the Ku band and the Ka band and vertical interconnection in a three-dimensional space of 200mm*200mm*10mm. The traditional interconnection mode of welding the inner conductor of the cross microstrip antenna and the SMP elastic connector cannot meet the design requirements of the Ku / Ka dual-band dual-polarized mode.

[0003] The existing dual-polarized implementation method mainly relies on the cross formation of the antenna array elements by the horizontal polarization antenna microstrip board and the vertical polarization antenna microstrip board, which has the problems of large profile thickness, high assembly precision requirement and low integration. The dual-polarized antenna microstrip board also needs to complete the interconnection with the inner conductor of the SMP through the welding point. According to this mode, the elastic connector needs to be distributed on the reflector shell, which has the problems of space limitation and influence on the strength of the shell.

[0004] Based on the manufacturing process of the multi-layer antenna microstrip board, the antenna reception and transmission functions of the Ku band and the Ka band can be realized in different inner layers, and the feed points are finally introduced to the bottom layer circuit of the antenna microstrip board through vertical transition between layers. However, the existing SMP elastic connector and low-temperature welding process cannot guarantee the high integration and high reliable vertical interconnection of the elastic connector and the antenna microstrip board. Therefore, it is urgent to establish a new manufacturing method of scalable splicing of Ka / Ku dual-polarized microstrip antenna assembly units, and to efficiently and reliably manufacture the microstrip antenna assembly units, so as to realize stable and reliable processing and assembly, simple and fast process flow, excellent telecommunication index and high reliability.

[0005] In view of the above-mentioned defects, the present inventors have finally obtained the present application after long-term research and practice. SUMMARY

[0006] The purpose of the present application is to provide a scalable splicing manufacturing method of Ka-Ku dual-polarized microstrip antenna assembly unit, and the technical problem to be solved is to provide a scalable splicing manufacturing method of Ka / Ku dual-polarized microstrip antenna assembly unit, effectively solve the problems of low cross-integration, high profile, low welding point interconnection density between the existing inner conductor and the antenna microstrip board feed line, and the large spacing of the existing shell and the inner conductor welding type SMP elastic connector which does not meet the requirements of antenna miniaturization, and provide a solution for the miniaturization and high integration of millimeter wave dual-band dual-polarized microstrip antenna assembly unit.

[0007] The present application solves the above technical problems by the following technical solutions, and the present application comprises the following steps:

[0008] Step one: process a plurality of grooves on each of the plurality of shells, and point solder paste in the grooves of the shells;

[0009] Step two: install a plurality of Ka-band elastic connectors and a plurality of Ku-band elastic connectors into the plurality of grooves of the shells through a transfer tool;

[0010] Step three: complete the interconnection of the Ka-band elastic connector, the Ku-band elastic connector and the shell by low-temperature welding;

[0011] Step four: lay conductive adhesive film on each of the plurality of antenna microstrip boards, and install positioning pins on each of the plurality of shells;

[0012] Step five: position and install the plurality of antenna microstrip boards on the plurality of shells with the elastic connectors welded thereon through the positioning pins, and assemble the plurality of antenna microstrip boards to the gluing tool;

[0013] Step six: complete the curing of the conductive adhesive film by vacuum bag pressing, bond the antenna microstrip board and the shell, keep the inner conductor of the elastic connector and the antenna microstrip board closely attached, and obtain the microstrip antenna assembly unit;

[0014] Step seven: assemble the plurality of microstrip antenna assembly units on the adapter plate to form an antenna array, and interconnect the KK adapter and the elastic connector.

[0015] Preferably, in step one, the solder paste is point-coated using a screw valve point-coating device; the diameter of the spray head is selected to be 0.1-0.5mm needle; the screw rotation speed is 50-200RPM; the spray head moving speed is 3-8mm / s; the point-coating circle number is 2-3 circles; and the air pressure is set to 40-100Kpa.

[0016] Preferably, in step one, the parameters of the solder paste point-coating are as follows:

[0017] The point-coating circle number is calculated by the required point-coating height / the height of a single solder paste;

[0018] The required spot coating height is calculated by the required spot coating volume / the laying surface level;

[0019] The required spot coating volume is calculated by the installation hole volume-the elastic connector volume.

[0020] Preferably, the outer conductor material of the elastic connector is selected from one of brass and Kovar, and adopts gold plating surface treatment; the gold plating thickness of the outer conductor of the elastic connector is 1.2-2.0 um; the inner conductor material of the elastic connector is selected from one of beryllium bronze and Kovar; the inner conductor adopts gold plating surface treatment, and the gold plating thickness of the inner conductor is 2.0-3.0 um.

[0021] Preferably, the insulating medium material of the elastic connector is one of glass body and PTFE or a combination of both.

[0022] Preferably, in step three, the interconnection of the elastic connector and the shell is completed by one of vacuum vapor welding, hot air reflow welding and vacuum reflow welding, and the brazing penetration rate is greater than or equal to 70%.

[0023] Preferably, in step four, before laying the conductive adhesive film, the dual-polarized dual-band antenna microstrip plate needs to be pre-baked, the baking temperature is 110-130 DEG C, and the baking time is 1.5-4.5 hours.

[0024] Preferably, in step six, the assembled bonding tool and the antenna microstrip plate are put into a vacuum bag and a vacuum hot pressing tank; the curing conditions are as follows: the pressure is 0.1 Mpa, the temperature is 120-130 DEG C, and the curing time is 1.5-3 hours.

[0025] Preferably, in step seven, a plurality of installation grooves corresponding to the elastic connectors are formed on the adapter plate, the KK adapter passes through the installation grooves and is interconnected with the elastic connectors, and the adapter plate and the shell are interconnected through screws.

[0026] The application further provides an antenna array surface manufactured by the above method.

[0027] Compared with the prior art, the application has the following beneficial effects:

[0028] 1. The dual-band dual-polarized assembly is vertically interconnected with the elastic connector through the antenna microstrip plate, so that the dual-polarized, high-integration and high-reliability of the microstrip antenna assembly unit are realized; the assembly can be used in the Ka frequency band and above high frequency bands, the standing wave can be less than or equal to 2.2, and the electrical performance is excellent in the millimeter wave use range.

[0029] 2. In the application, the dual-polarized antenna transceiver with a unit spacing of less than or equal to 9.2 mm x 9.2 mm and a profile thickness of less than or equal to 9.2 mm can be realized, the integration is high, the method is simple, the profile thickness is reduced by 50% and the integration is increased by more than 30% compared with the previous process method, and an effective technical path is provided for higher frequency band and higher integration radar electronic antenna feeder systems.

[0030] 3、The dual-polarized microstrip antenna assembly unit in the application can be expanded into an antenna array with different sizes and shapes by adjusting the number of microstrip antenna assembly units and the number of splicing combinations, and has the advantages of being repairable, detachable, assemblable and replaceable.

[0031] 4、The dual-polarized microstrip antenna assembly unit in the application can meet the environmental test requirements of 50 times of temperature cycling (-40℃~+75℃) and 13.88g random vibration, has good reliability and environmental adaptability, and can meet the requirements of high service environments such as airborne, missile-borne and satellite-borne. BRIEF DESCRIPTION OF DRAWINGS

[0032] Fig. 1 is a structural schematic diagram of the Ka / Ku dual-polarized microstrip antenna assembly unit of the application;

[0033] Fig. 2 is a structural schematic diagram of the Ka / Ku dual-polarized microstrip antenna assembly unit after assembly

[0034] Fig. 3 is a process flow chart of the application. DETAILED DESCRIPTION

[0035] The above and other technical features and advantages of the application will be described in more detail below with reference to the accompanying drawings.

[0036] Example 1

[0037] The embodiment provides a technical solution: a scalable splicing manufacturing method of a Ka-Ku dual-polarized microstrip antenna assembly unit, referring to Figs. 1-3 , comprising the following steps:

[0038] Step 1: Process a plurality of grooves 8 on each of the plurality of housings 4, and point coat solder paste in the grooves 8 of the housings 4;

[0039] The solder paste composition is one of 62Sn36Pb2Ag, SAC305 and Sn54Pb26In20; the solder paste point coating is realized by using a screw valve point coating device; the nozzle diameter, screw rotation speed, nozzle moving speed, point coating number and air pressure are adjusted during the point coating of the solder paste to complete the accumulation of the solder paste on the laying surface; in order to avoid the solder paste from being disconnected during laying, the parameters for point coating the solder paste are as follows: the nozzle diameter is selected to be a 0.1-0.5mm needle; the screw rotation speed is 50-200RPM; the nozzle moving speed is 3-8mm / s; the point coating number is 2-3 circles; and the air pressure is set to be 40-100Kpa.

[0040] The parameters for point coating the solder paste are as follows:

[0041] Number of dot coating circles = required dot coating height / single strip solder paste height;

[0042] Required dot coating height = Required dot coating volume / Coverage level;

[0043] The required volume for spot coating is calculated as: mounting hole volume - flexible connector volume.

[0044] The housing 4 is made of metal; the groove 8 on the housing 4 is partially silver-plated with a thickness of 6-9 μm; other parts outside the groove 8 are conductively oxidized; the groove 8 is designed according to the shape of the elastic connector, and a solder paste laying surface is provided inside it. The width of the laying surface is 120%-150% of the width of the solder paste to increase the positional error when applying the solder paste. After the solder paste is applied, it needs to be inspected.

[0045] Step 2: Using a transfer fixture, install multiple sets of Ka-band flexible connectors 15 and multiple sets of Ku-band flexible connectors 17 into the multiple grooves 8 of the housing 4 respectively;

[0046] In this embodiment, there are 16 sets of Ka-band flexible connectors 15 and 16 sets of Ku-band flexible connectors 17. The 16 sets of Ka-band flexible connectors 15 and 16 sets of Ku-band flexible connectors 17 are respectively installed into the transfer fixture. The transfer fixture maintains the normal height accuracy of multiple flexible connectors through mechanical holding force, ensuring that multiple flexible connectors correspond one-to-one with the grooves 8 of the housing 4. The transfer fixture is snapped into the grooves 8 of the housing 4 that have been coated with solder paste. At the same time, the Ka-band flexible connectors 15 and Ku-band flexible connectors 17 are respectively assembled into place. The Ka-band flexible connectors 15 and Ku-band flexible connectors 17 are in contact with the solder paste. The solder paste in the grooves 8 will have a preliminary fixing effect on the flexible connectors. Then the holding force is removed, the Ka-band flexible connectors 15 and Ku-band flexible connectors 17 are released, and the transfer fixture is removed.

[0047] The outer conductor 6 of the flexible connector is made of either brass or Kovar alloy and is gold-plated. The gold plating thickness of the outer conductor 6 is 1.2-2.0 μm. The inner conductor 7 of the flexible connector is made of either beryllium bronze or Kovar alloy and is gold-plated. The gold plating thickness of the inner conductor 7 is 2.0-3.0 μm.

[0048] The insulating medium material of the flexible connector is one or a combination of two of glass and PTFE;

[0049] Step 3: Complete the interconnection between the Ka-band flexible connector 15, the Ku-band flexible connector 17 and the housing 4 by low-temperature welding;

[0050] Install the welding tool, the end surface of the elastic connector is flush with the bottom surface of the tool, install the fastening device, and complete the interconnection of the elastic connector and the shell by one of the vacuum air welding, hot air reflow welding, and vacuum reflow welding methods, with a brazing penetration rate of ≥70%; complete the welding through a vacuum air welding furnace;

[0051] After the welding is completed, remove the welding tool, and perform ultrasonic cleaning and drying of the shell 4 to ensure the dryness and cleanliness of the shell 4;

[0052] Step four: lay the conductive adhesive film 3 on each of the multiple antenna microstrip boards 1, and install the positioning pin 12 on each of the multiple shells 4;

[0053] The bottom of the antenna microstrip board 1 has multiple large-area grounds 10;

[0054] Before laying the conductive adhesive film, pre-dry the dual-polarized dual-band antenna microstrip board 1, with a drying temperature of 110-130°C and a drying time of 1.5-4.5 hours;

[0055] The shell 4 has a first positioning hole corresponding to the position, and the positioning pin 12 is installed in the first positioning hole by insertion; at the same time, the conductive adhesive film 3 is cut into a shape consistent with the antenna microstrip board 1, and the conductive adhesive film 3 is CF3350 of Hengko Company, wherein the elastic connector contact and the positioning pin 12 installation area are hollowed out to avoid interference, the cut conductive adhesive film is laid on the antenna microstrip board 1 by hand, the hollow size is increased by 0.05-0.15mm from the original pad radius size, which increases the error amount of the conductive adhesive film 3 and the antenna microstrip board 1 during laying, and then the positioning pin 12 is assembled;

[0056] Step five: position and install the multiple antenna microstrip boards 1 on the multiple shells with the elastic connectors through the positioning pins 12, and assemble them to the bonding tool;

[0057] Assemble the multiple assembled antenna microstrip boards 1 and the shells 4 in the bonding tool to complete the splicing and assembly, and the antenna microstrip board 1 has a second positioning hole adapted to the positioning pin 12, which positions the antenna microstrip board 1 through the adaptation of the positioning pin 12 and the second positioning hole, and the thickness of the antenna microstrip board 1 is ≥2.0mm;

[0058] Through the bonding tool and the additional fastening device, ensure the close contact between the antenna microstrip board 1 and the conductive adhesive film 3, the conductive adhesive film 3 and the shell 4, and the inner conductor 7 and the antenna microstrip board 1, and then remove the positioning pin 12;

[0059] Step six: complete the curing of the conductive adhesive film 3 by vacuum bag pressing to bond the antenna microstrip board 1 and the shell 4, keep the inner conductor 7 of the elastic connector in close contact with the contact pad 2 of the antenna microstrip board 1, make the antenna microstrip board 1 interconnected with the elastic connector, and obtain a microstrip antenna assembly unit;

[0060] The assembled cementing tool and the antenna microstrip board 1 are put into a vacuum bag and a vacuum hot-pressing tank; the curing conditions are: pressure 0.1 Mpa, temperature 120-130℃, and curing time 1.5-3 hours, thereby producing a plurality of microstrip antenna assembly units;

[0061] Step seven: assembling the plurality of microstrip antenna assembly units on the adapter plate 13 to form an antenna array surface, and interconnecting the KK adapter and the elastic connector;

[0062] After the hot pressing is completed, the cementing tool is removed, 64 groups (8 rows and 8 columns) of microstrip antenna assembly units are assembled on the adapter plate 13 to form an antenna array surface, and the tolerance between each microstrip antenna assembly unit is ±0.075 mm; the spliced and combined microstrip antenna assembly units are installed on the adapter plate 13 through the screws 16, specifically, the screws 16 pass through the adapter plate 13 without penetrating the shell 4, and a plurality of installation grooves 14 corresponding to the elastic connector are formed on the adapter plate 13, the installation grooves 14 are used for inserting and mounting the adapter, and the elastic connector on the shell 4 is interconnected with the transceiver system through the KK adapter;

[0063] During use, if a microstrip antenna assembly unit is damaged, it can be disassembled by loosening the screws 16 for repair or replacement;

[0064] After the antenna array surface is assembled, the elastic connector on the shell 4 is interconnected with the transceiver system through the KK adapter, and the KK adapter is divided into a Ka-band KK adapter 17 and a Ku-band KK adapter 15, and the Ka-band KK adapter 17 and the Ku-band KK adapter 15 are interconnected with the Ka-band elastic connector and the Ku-band elastic connector, respectively.

[0065] The dual-band dual-polarized assembly of the embodiment realizes dual-polarization, high integration, and high reliability of the microstrip antenna assembly unit through the elastic vertical interconnection of the antenna microstrip board 1 and the elastic connector; the Ka / Ku dual-polarized microstrip antenna assembly unit has a Ka-band unit standing wave ≤2.0 and a Ku-band unit standing wave ≤2.2. The profile thickness is reduced by 50%, and the integration is increased by more than 30%. The environmental test requirements of 50 times of temperature cycle (-40℃-+75℃) and 13.88g random vibration can be met, and the assembly unit has good reliability and environmental adaptability.

[0066] Embodiment two

[0067] The embodiment is further optimized on the basis of the above embodiment, and the same parts as the foregoing technical solutions will not be described here again, such as Figs. 1-3As shown, the Ka / Ku dual-polarized microstrip antenna assembly unit of the embodiment comprises 16 sets of Ku-band elastic connectors and 16 sets of Ka-band elastic connectors, and the structure is composed of 8-unit antenna microstrip board 1, conductive adhesive film 3, and shell 4 from top to bottom. The antenna microstrip board 1 is bonded to the shell 4 through the conductive adhesive film 3. Among them:

[0068] A plurality of grooves 8 are formed on the shell 4, and the elastic connectors are fixed by soldering 5. The elastic connectors have an outer conductor 6 and an inner conductor 7 in an elastic compression state.

[0069] The antenna microstrip board 1 has 8 antenna units for Ku-band and Ka-band respectively, and the bottom layer of the antenna microstrip board 1 is provided with a contact pad 2 in contact with the inner conductor 7 of the elastic connector.

[0070] The antenna assembly unit is assembled in the manner of Fig. 2 The antenna assembly unit and the adapter plate 13 are spliced to form an antenna array surface in a ratio of 64:1. The antenna assembly unit is fixed to the adapter plate 13 by a fixing screw 16.

[0071] The preparation process of the antenna assembly unit is as follows:

[0072] 62Sn36Pb2Ag solder paste is applied to the grooves 8 of the partially silver-plated shell 4; the Ka-band elastic connector 15 and the Ku-band elastic connector 17 are installed into the shell 4 through a transfer tool, and the Kovar gold-plated conductor (gold-plated thickness 1.5 um) and the beryllium bronze gold-plated inner conductor (gold-plated thickness 2.0-3.0 um) are assembled and soldered; the interconnection of the elastic connector and the shell 4 is completed by vacuum vapor welding; the conductive adhesive film 3 is laid on the 8-unit antenna microstrip board 1, and a positioning pin 12 is installed; the antenna microstrip board 1 is installed on the shell with the elastic connector soldered thereon through the positioning pin 12, and is assembled into a gluing tool; the vacuum bag is pressed and cured at 120°C for 2 hours to complete the curing of the conductive adhesive film 3, bond the antenna microstrip board 1 and the shell 4, and keep the inner conductor 7 of the elastic connector in close contact with the antenna microstrip board 1; 64 sets (8 rows by 8 columns) of antenna assembly units are assembled on the adapter plate 13 to form an antenna array surface, and the tolerance between each antenna assembly unit is ±0.075 mm.

[0073] The Ka-Ku dual-polarized microstrip antenna assembly unit in the embodiment has a Ka-band unit standing wave ≤2.0 and a Ku-band unit standing wave ≤2.2, a cross-sectional thickness reduction of 50%, and an integration degree improvement of more than 30%, which can meet the environmental test requirements of 50 times of temperature cycling (-40°C to +75°C) and 13.88g random vibration, and has good reliability and environmental adaptability.

[0074] Embodiment Three

[0075] This embodiment is a further optimization based on the above embodiments. The parts that are the same as those in the foregoing technical solutions will not be repeated here. Figs. 1-3 As shown, the Ka / Ku dual-polarized microstrip antenna assembly unit in this embodiment includes 16 sets of Ku-band flexible connectors and 16 sets of Ka-band flexible connectors. The remaining operations are similar to those in Embodiment 1, as detailed below:

[0076] Apply 62Sn36Pb2Ag solder paste to the groove 8 of the partially silver-plated housing 4; install the Ka-band and Ku-band flexible connectors with Kovar gold-plated conductors (1.5µm gold plating thickness) and beryllium bronze gold-plated inner conductors (2.0-3.0µm gold plating thickness) into the housing 4 using a transfer fixture; assemble the welding fixture and complete the interconnection between the flexible connectors and the housing by hot air reflow soldering; place the conductive adhesive film 3 on the 32-element antenna microstrip board 1 and install the positioning pins 12; install the antenna microstrip board 1 on the housing with the welded flexible connectors using the positioning pins 12, and assemble it into the bonding fixture; cure the conductive adhesive film 3 by vacuum bag pressing at 130℃ for 1.5 hours, and bond the antenna microstrip board 1 and the housing 4, keeping the inner conductor 7 in close contact with the antenna microstrip board 1; assemble 16 groups (4 rows and 4 columns) of microstrip antenna assembly units on the adapter plate 13 to form an antenna array, with a tolerance of ±0.1mm between each microstrip antenna assembly unit.

[0077] The Ka / Ku dual-polarized microstrip antenna assembly in this embodiment has a Ka-band VSWR ≤1.9 and a Ku-band VSWR ≤2.0. The profile thickness is reduced by 50%, and the integration density is increased by more than 30%. It can meet the environmental test requirements of 50 temperature cycles (-40℃ to +75℃) and 13.88g random vibration, demonstrating good reliability and environmental adaptability.

[0078] Example 4

[0079] This embodiment provides a technical solution: a dual-polarized cross microstrip antenna 1 manufactured using the method described in the above embodiment, such as... Figs. 1-3 As shown, the dual-polarized cross microstrip antenna 1 in this embodiment includes an adapter plate 13 and multiple microstrip antenna component units, and the multiple microstrip antenna component units are fixed to the adapter plate 13 by screws 16.

[0080] The antenna array surface of different sizes and shapes can be expanded arbitrarily by adjusting the number of microstrip antenna assembly units and the number of splicing combinations of the antenna units; the dual-polarized antenna transceiving with a unit spacing of 9.2mm*9.2mm or less and a profile thickness of less than 9.2mm is realized; the integration degree is high, the method is simple, compared with the previous process method, the profile thickness is reduced by 50%, the integration degree is increased by more than 30%, and an effective technical path is provided for the radar electronic antenna feed system of higher frequency bands and higher integration degrees; and the corresponding microstrip antenna assembly unit can be disassembled by disassembling the screw 16 for repair and replacement.

[0081] The above only describes the preferred embodiments of the present application, which are only illustrative but not limiting. Those skilled in the art understand that many changes, modifications and even equivalents can be made to the present application within the spirit and scope defined by the claims of the present application, but all will fall within the protection scope of the present application.

Claims

1. A scalable tiled manufacturing method for Ka-Ku dual polarized microstrip antenna assembly units, characterized by: The method comprises the following steps: Step 1: processing a plurality of grooves on a plurality of housings, and spot coating solder paste in the grooves of the housings; Step 2: installing a plurality of groups of Ka-band elastic connectors and a plurality of groups of Ku-band elastic connectors into the plurality of grooves of the housings through a transfer tool; Step 3: completing the interconnection of the Ka-band elastic connectors, the Ku-band elastic connectors and the housings through low-temperature welding; Step 4: laying conductive adhesive film on a plurality of antenna microstrip boards, and installing positioning pins on the plurality of housings; Step 5: positioning and installing the plurality of antenna microstrip boards on the plurality of housings with the elastic connectors welded thereon through the positioning pins, and assembling the antenna microstrip boards to a gluing tool; Step 6: completing the curing of the conductive adhesive film through vacuum bag pressing, bonding the antenna microstrip boards and the housings, and keeping the inner conductors of the elastic connectors in close contact with the antenna microstrip boards to obtain a microstrip antenna assembly unit; Step 7: assembling a plurality of groups of the microstrip antenna assembly units on a transfer plate to form an antenna array surface, and interconnecting KK adapters and the elastic connectors. In step 1, the solder paste spot coating is realized by using a screw valve spot coating device; the diameter of the nozzle is selected to be 0.1-0.5 mm; the screw rotation speed is 50-200 RPM; the nozzle moving speed is 3-8 mm / s; the spot coating circle number is 2-3; and the air pressure is set to be 40-100 Kpa. The outer conductor material of the elastic connector is selected to be one of brass and Kovar alloy, and the outer conductor is treated by gold plating; the gold plating thickness of the outer conductor of the elastic connector is 1.2-2.0 um; the inner conductor material of the elastic connector is selected to be one of beryllium bronze and Kovar alloy; the inner conductor is treated by gold plating, and the gold plating thickness of the inner conductor is 2.0-3.0 um. In step 3, the interconnection of the elastic connector and the housing is completed by one of vacuum vapor welding, hot air reflow welding and vacuum reflow welding, and the brazing penetration rate is greater than or equal to 70%. In step 4, before laying the conductive adhesive film, the dual-polarized dual-band antenna microstrip board needs to be pre-baked, the baking temperature is 110-130 DEG C, and the baking time is 1.5-4.5 hours. In step 6, the assembled gluing tool and the antenna microstrip board are put into a vacuum bag and a vacuum hot pressing tank; the curing conditions are as follows: the pressure is 0.1 Mpa, the temperature is 120-130 DEG C, and the curing time is 1.5-3 hours. In step 7, a plurality of mounting grooves corresponding to the elastic connectors are formed on the transfer plate, the KK adapter passes through the mounting grooves to interconnect with the elastic connectors, and the transfer plate and the housing are interconnected by screws.

2. The scalable tiled manufacturing method of a Ka-Ku dual-polarized microstrip antenna assembly unit according to claim 1, wherein, In step 1, the parameters of the solder paste spot coating are as follows: The spot coating circle number is calculated according to the required spot coating height / the height of a single solder paste; The required spot coating height is calculated according to the required spot coating volume / the laying surface level; The required spot coating volume is calculated according to the installation hole volume-the volume of the elastic connector.

3. The scalable tiled manufacturing method of a Ka-Ku dual-polarized microstrip antenna assembly unit according to claim 1, wherein, The insulating medium material of the elastic connector is one of glass and PTFE or a combination of the two.

4. An antenna array surface manufactured by the manufacturing method in any one of claims 1-3.

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