A modular multi-steam chamber heat dissipation device

Abstract

The present invention discloses a modular multi-steam chamber heat dissipation device, comprising multiple steam chamber bodies and gas and liquid pipelines for connecting the multiple steam chamber bodies. The steam chamber body is a closed cavity formed by a condensing end shell at the top, a middle shell, and an evaporating end shell at the bottom. The evaporating end shells are interconnected by liquid pipelines, and the condensing end shells are interconnected by gas pipelines. The condensing end shells are provided with a plurality of heat dissipation ribs; the evaporating end shells are provided with an evaporating end capillary wick; the gas pipelines are provided with a first switching valve and a first connecting structure; the liquid pipelines are provided with a pipeline capillary wick; and the liquid pipelines are provided with a second switching valve and a second connecting structure. The second switching valve is a ball valve, and a ball valve capillary wick is provided within the ball valve of the second switching valve. When the second switching valve is in the open state, the pipeline capillary wick contacts and connects with the ball valve capillary wick. The device of the present invention can be manufactured in a modular manner and has high heat dissipation efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of electronic components, and in particular to a modular multi-steam chamber heat dissipation device. Background Art

[0002] With the development of high frequency, high speed, and integration of electronic components, people are demanding higher power while shrinking their size. The heat density of electronic components is increasing. If heat is not dissipated in time, the device temperature will rise and even local overheating will occur. This poses a great challenge to the long life and efficient operation of electronic components. Therefore, there is an urgent need to develop more efficient heat dissipation solutions with simpler structures to meet the growing heat dissipation needs of high-power electronic components.

[0003] Currently common heat dissipation devices include loop heat pipes, steam chamber radiators, micro-groove group composite phase change radiators, etc. Among them, the steam chamber radiator is essentially a flat heat pipe based on a whole substrate. It is an extension of the heat pipe radiator, which achieves good temperature uniformity of the substrate, thereby further improving the overall performance of the radiator. The steam chamber radiator is similar to the heat pipe in principle, but differs in the conduction method. The heat pipe is a one-dimensional linear heat conduction, while the heat in the vacuum chamber heat sink is conducted on a two-dimensional surface, so it is more efficient, but the price is also relatively high. In addition, the steam chamber radiator also has a certain condensation limit, which limits the development of the radiator. Therefore, how to expand the condensation area and improve the condensation efficiency is an important research direction for the steam chamber radiator. As for the problem of heat pipe condensation limit, in addition to increasing the condensation area of ​​a single heat pipe, people have also proposed a connection structure that uses multiple evaporators to connect a single condenser for centralized heat dissipation. This connection structure can increase the heat dissipation area and enhance the heat dissipation capacity of the evaporator. However, the current multi-evaporator connection structure still has certain defects: First, the working fluid is difficult to reflux. The working fluid of the evaporator with a larger heat output may flow to other evaporators with a smaller heat output. Due to the connection characteristics of the structure, the working fluid is prone to not being able to reflux in time. It is necessary to equip the evaporator with a liquid reservoir to ensure that there is enough working fluid in the evaporator; Second, the overall connection structure has many parts, including evaporator, condenser and liquid reservoir. The overall structure is complex, which is not conducive to modular manufacturing of the overall structure; Third, the overall structure has no suitable connection scheme and is easily damaged during transportation and installation, which is inconvenient. The above defects limit the development of the multi-evaporator connection structure. Summary of the Invention

[0004] The purpose of the present invention is to address the above problems and provide a multi-steam chamber heat dissipation device that can be manufactured in a modular manner, which can solve the defects of the current multi-evaporator connection structure, meet the heat dissipation requirements of multi-module electronic components, realize efficient and coordinated utilization of the heat dissipation structure, and improve heat dissipation efficiency.

[0005] In order to achieve its purpose, the present invention adopts the following technical solutions:

[0006] A modular multi-steam chamber heat dissipation device includes multiple steam chamber bodies, and gas pipelines and liquid pipelines for connecting the multiple steam chamber bodies. The steam chamber body is a closed cavity composed of a condensing end shell at the top, a middle shell, and an evaporating end shell at the bottom. The evaporating end shells of different steam chamber bodies are interconnected via the liquid pipeline, and the condensing end shells are interconnected via the gas pipeline.

[0007] The condensing end shell is provided with a number of heat dissipation ribs; the evaporating end shell is provided with an evaporating end capillary wick;

[0008] The gas pipeline is provided with a first switch valve and a first connecting structure;

[0009] A pipeline capillary core is provided in the liquid pipeline, and a second switch valve and a second connecting structure are provided on the liquid pipeline. The second switch valve is a ball valve, and a ball valve capillary core is provided in the ball valve ball of the second switch valve. When the second switch valve is in an open state, the pipeline capillary core is in contact and connected with the ball valve capillary core.

[0010] Preferably, the first connection structure or the second connection structure is a flange connection, a threaded connection, a socket connection, a clamp connection, a sleeve connection or a press connection.

[0011] Preferably, the second connecting structure includes a spring, and the material of the spring is a capillary wick material. The spring is used to connect the pipeline capillary wicks in the two liquid pipelines to allow the liquid working medium in the pipeline capillary wicks to flow smoothly.

[0012] Preferably, the steam chamber body is cylindrical or rectangular, and the condensing end shell, the middle shell and the evaporating end shell are detachably connected; the middle shell is made of insulating material.

[0013] Preferably, the heat dissipation fins are cylindrical, and their interior is connected to the interior of the condensing end shell. The heat dissipation fins are circumferentially arranged around the side walls of the condensing end shell and are inclined upward to facilitate the condensate in the heat dissipation fins to flow downward along the inner wall of the steam chamber body back to the evaporation end through gravity.

[0014] Preferably, the end of the pipeline capillary core that contacts the ball valve is an arc that fits the outer wall of the sphere inside the ball valve, and the two ends of the ball valve capillary core are arcs that fit the inner wall of the sphere inside the ball valve. When the ball valve is in an open state, the arc-shaped end of the pipeline capillary core matches the arc-shaped end of the ball valve capillary core to achieve contact connection between the pipeline capillary core and the ball valve capillary core.

[0015] Preferably, the gas pipeline includes a plurality of first gas pipelines and a second gas pipeline, the first gas pipeline is fixedly connected to the condensing end shell, and a first switch valve is provided on the first gas pipeline; the second gas pipeline is provided with a plurality of interconnected branch gas pipelines, and the branch gas pipelines are connected to the first gas pipeline via the first connection structure;

[0016] The liquid pipeline includes multiple first liquid pipelines and second liquid pipelines. The first liquid pipeline is fixedly connected to the evaporation end shell, and a second switch valve is provided on the first liquid pipeline; the second liquid pipeline is provided with multiple branch liquid pipelines that are interconnected, and the branch liquid pipelines are connected to the first liquid pipeline through the second connection structure.

[0017] Preferably, the first connection structure and the second connection structure are flange connection structures.

[0018] Preferably, the first switching valve is a ball valve.

[0019] Preferably, the evaporation end capillary wick includes a base plate and a plurality of capillary columns arranged in an array and disposed on the base plate.

[0020] The beneficial effects of the present invention are: the device of the present invention can be manufactured in a modular manner, and its structure is simplified while ensuring the condensation effect, thereby achieving the effect of modular manufacturing. The ball valve structure designed on the liquid pipeline and the connection structure on the gas pipeline / liquid pipeline facilitate the transportation and installation connection of the device of the present invention.

[0021] 1. When the device of the present invention is in use, each steam chamber body corresponds to a heat-generating electronic component module, and the placement of the steam chamber body is set according to the heat-generating electronic component module. Generally, different electronic component modules generate different amounts of heat, some at high temperatures and some at relatively low temperatures. The device of the present invention can utilize multiple steam chamber bodies for efficient heat dissipation. When different electronic component modules generate different amounts of heat, the steam chamber body on the electronic component module with relatively low heat generation can take over the heat from the high-heating electronic component module for efficient heat dissipation. In the device of the present invention, the steam flow between the multiple steam chamber bodies is achieved by the pressure difference caused by the temperature difference within the different steam chamber bodies. The pressure difference causes the steam to flow from the high-temperature steam chamber body to the relatively low-temperature steam chamber body. The design of the middle shell can reduce the heat consumption of the steam when it rises from the evaporation end at the bottom of the steam chamber body to the condensation end at the top, reduce the temperature loss of the steam reaching the condensation end, avoid the situation where the flow rate of the steam in the steam chamber body slows down when it flows to other steam chamber bodies, and causes the heat dissipation rate of the overall structure to slow down accordingly, thereby ensuring rapid heat dissipation of the overall structure. The evaporator body is set to a detachable structure. When cooling electronic components that do not generate much heat, the middle shell can also be removed to make the evaporation chamber body flat and reduce the volume to adapt to the heat dissipation of miniaturized electronic components.

[0022] 2. The modular multi-steam chamber heat dissipation device of the present invention does not require an additional liquid reservoir to be added to the overall structure, which not only increases the heat dissipation capacity of the overall structure, but also reduces the complexity of its structure. The overall structure has fewer parts, which is conducive to the modular preparation of the overall structure of the steam chamber. Its working principle is: when it is first used, the mass of the liquid working fluid in the multiple steam chambers is the same, and as the calorific value of different modules of the electronic components is different, the evaporation amount of the liquid working fluid in the steam chamber is also different. After the liquid working fluid is transformed into steam, the steam rises to the condensation end to dissipate heat. At this time, the steam in the steam chamber body on the module with a larger calorific value will have a higher temperature and steam volume than the steam in other steam chamber bodies. Under the action of the pressure difference, part of the high-temperature steam will flow along the gas pipeline to other steam chamber bodies and condense in other steam chamber bodies. The widespread flow of the vapor working medium inevitably leads to differences in the quality of the liquid working medium within different steam chambers. This is achieved through a liquid pipeline connected to the evaporation end capillary wick structure. The liquid pipeline is designed with a capillary wick that provides capillary pumping. This allows the liquid working medium to flow back into the evaporation chamber through the liquid pipeline, thereby maintaining a dynamic balance of working medium within each steam chamber. After the working medium returns, it evaporates again on the surface of the capillary wick structure at the evaporation end of each steam chamber, thereby exchanging heat.

[0023] 3. Considering the convenience of transporting and installing the steam chamber structure, on-off valve structures are designed for the gas and liquid pipelines. When closed, they maintain the airtightness of the steam chamber body during transport and installation, and when opened, they do not damage the capillary pumping function of the liquid pipeline. The second on-off valve provided on the liquid pipeline is a ball valve, which also contains a ball valve capillary wick. During the transportation of the device of the present invention and its connection to the liquid pipeline, the ball valve is closed. At this time, the smooth surface of the ball inside the ball valve contacts the pipeline capillary wick structure in the liquid pipeline, preventing liquid and gas from flowing through the ball valve structure. After the steam chamber bodies are connected, the ball valve is opened, and the ball valve capillary wick contacts the pipeline capillary wick, allowing the liquid working medium to be transferred and circulated between the two, maintaining the integrity of the liquid pipeline capillary pump function and allowing the liquid working medium to circulate in the device under the action of capillary force. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the three-dimensional structure of the multi-steam chamber heat dissipation device of the present invention.

[0025] Figure 2 It is a top view of the multi-steam chamber heat dissipation device of the present invention.

[0026] Figure 3 It is a side view of the multi-steam chamber heat dissipation device of the present invention.

[0027] Figure 4 yes Figure 1 Schematic diagram of the enlarged structure of the second switch valve in.

[0028] Figure 5 yes Figure 1 Schematic diagram of the enlarged structure of the second connection structure.

[0029] Figure 6 yes Figure 1 Exploded diagram of the steam chamber structure.

[0030] Figure 7 yes Figure 6 Schematic diagram of the enlarged structure of the evaporation end capillary core.

[0031] The elements or structures represented by the reference numerals are:

[0032] Steam chamber body 1, condensation end shell 11, heat dissipation fins 11a, middle shell 12, evaporation end shell 13,

[0033] Gas pipeline 2, first gas pipeline 21, second gas pipeline 22, branch gas pipeline 23,

[0034] Liquid pipeline 3, first liquid pipeline 31, second liquid pipeline 32, branch liquid pipeline 33,

[0035] Evaporation end capillary core 4, bottom plate 41, capillary column 42,

[0036] The first switch valve 5,

[0037] The first connecting structure 6,

[0038] Pipeline capillary core 7,

[0039] The second switch valve 8, the ball valve capillary core 81,

[0040] Second connecting structure 9 and spring 91 . DETAILED DESCRIPTION

[0041] The following is a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the following embodiments are used to illustrate the present invention, but are not used to limit the scope of the present invention.

[0042] Example 1

[0043] like Figure 1-4 The modular multi-steam chamber heat dissipation device shown in the figure includes multiple steam chamber bodies 1, and gas pipelines 2 and liquid pipelines 3 for connecting the multiple steam chamber bodies 1. The steam chamber body 1 is a closed cavity composed of a condensing end shell 11 at the top, a middle shell 12 and an evaporating end shell 13 at the bottom. The condensing end shell 11 is in the shape of a lid, the middle shell 12 is in the shape of a ring, and the evaporating end shell 13 is in the shape of an open cylinder. The evaporating end shells 13 of different steam chamber bodies 1 are connected to each other through the liquid pipeline 3, and the condensing end shells 11 are connected to each other through the gas pipeline 3. The pipelines 2 are interconnected; a plurality of heat dissipation ribs 11a are provided on the condensing end shell 11; an evaporating end capillary wick 4 is provided in the evaporating end shell 13; a first switch valve 5 and a first connecting structure 6 are provided on the gas pipeline 2; a pipeline capillary wick 7 is provided in the liquid pipeline 3, and a second switch valve 8 and a second connecting structure 9 are provided on the liquid pipeline 3. The second switch valve 8 is a ball valve, and a ball valve capillary wick 81 is provided in the ball of the second switch valve 8. When the second switch valve 8 is in the open state, the pipeline capillary wick 7 is in contact and connected with the ball valve capillary wick 81.

[0044] Preferably, the multi-steam chamber heat dissipation device of the present invention is composed of three steam chamber bodies 1, the condensation end shells 11 of the three steam chamber bodies 1 are interconnected through the gas pipeline 2, and the evaporation end shells 13 of the three steam chamber bodies 1 are interconnected through the liquid pipeline 3.

[0045] In some embodiments, the first connection structure 6 or the second connection structure 9 is a flange connection, a threaded connection, a socket connection, a clamp connection, a sleeve connection, or a press connection.

[0046] In some embodiments, as Figure 5As shown, the second connection structure 9 includes a spring 91 . The spring 91 is made of a capillary wick material. The spring 91 is used to connect the capillary wicks 7 in the two liquid pipelines 3 , so that the liquid working medium in the capillary wicks 7 can flow smoothly.

[0047] In some embodiments, the steam chamber body 1 is cylindrical or rectangular, and the condensing end shell 11, the middle shell 12 and the evaporating end shell 13 are detachably connected; the middle shell 12 is made of heat-insulating material. When the device of the present invention is in use, each steam chamber body corresponds to a heat-generating electronic component module, and the placement of the steam chamber body is set according to the heat-generating electronic component module. Usually, different electronic component modules generate different amounts of heat, some with high temperatures and some with relatively low temperatures. The device of the present invention can utilize multiple steam chamber bodies for efficient heat dissipation. When different electronic component modules generate different amounts of heat, the steam chamber body on the electronic component module with relatively small heat generation can take over the heat from the high-heating electronic component module for efficient heat dissipation. In the device of the present invention, steam circulation between multiple steam chamber bodies is achieved through the pressure difference caused by the temperature difference within different steam chamber bodies. The pressure difference causes steam to flow from the high-temperature steam chamber body to the relatively low-temperature steam chamber body. The middle shell is made of a heat-insulating material, which can reduce the heat consumption of steam when it rises from the evaporation end at the bottom of the steam chamber body to the condensation end at the top, reduce the temperature loss of the steam reaching the condensation end, and avoid the situation where the flow speed of steam in the steam chamber body slows down when flowing into other steam chamber bodies, resulting in a corresponding slowdown in the heat dissipation speed of the overall structure, thereby ensuring rapid heat dissipation of the overall structure. The evaporator body is set as a detachable structure. When dissipating heat to electronic components with low heat generation, the middle shell can also be removed, making the evaporation chamber body flat, reducing the volume, and cooperating with the heat dissipation of miniaturized electronic components.

[0048] In some embodiments, the heat dissipation fins 11a are cylindrical, and their interior is connected to the interior of the condensing end shell 11. The heat dissipation fins 11a are circumferentially arranged around the side wall of the condensing end shell 11, and are inclined upward (meaning that one end of the heat dissipation fin 11a away from the condensing end shell 11 is upward, and the other end is the connection end with the condensing end shell 11) to facilitate the condensate in the heat dissipation fins 11a to flow downward along the inner wall of the steam chamber body 1 back to the evaporation end through the action of gravity.

[0049] In some embodiments, as Figure 4 As shown, the end of the pipeline capillary core 7 that contacts the ball valve is an arc that fits the outer wall of the sphere inside the ball valve, and the two ends of the ball valve capillary core 81 are arcs that fit the inner wall of the sphere inside the ball valve. When the ball valve is in the open state, the arc-shaped end of the pipeline capillary core 7 matches the arc-shaped end of the ball valve capillary core 81 to achieve contact connection between the pipeline capillary core 7 and the ball valve capillary core 81.

[0050] In some embodiments, as Figure 1 、 Figure 6 As shown, the gas pipeline 2 includes a plurality of first gas pipelines 21 and a second gas pipeline 22, the first gas pipeline 21 is fixedly connected to the condensing end shell 11, and a first switch valve 5 is provided on the first gas pipeline 21; a plurality of mutually connected branch gas pipelines 23 are provided on the second gas pipeline 22, and the branch gas pipeline 23 is connected to the first gas pipeline 21 through a first connecting structure 6; the liquid pipeline 3 includes a plurality of first liquid pipelines 31 and a second liquid pipeline 32, the first liquid pipeline 31 is fixedly connected to the evaporating end shell 13, and a second switch valve 8 is provided on the first liquid pipeline 31; a plurality of mutually connected branch liquid pipelines 33 are provided on the second liquid pipeline 32, and the branch liquid pipeline 33 is connected to the first liquid pipeline 31 through a second connecting structure 9. During the manufacture of the device of the present invention, the first gas line 21 can be fixedly connected to the condensing end housing 11 when the product leaves the factory, and the cavity of the steam chamber body 1 is filled with liquid working medium, and the first switch valve 5 provided on the first gas line 21 is closed to prevent the liquid working medium from flowing out; at the same time, the first liquid line 31 can also be fixedly connected to the evaporating end housing 13 when the product leaves the factory, and the second switch valve 8 provided on the first liquid line 31 is closed to prevent the liquid working medium from flowing out of the steam chamber body 1; during installation, the first gas line 21 and the second gas line 22 are connected via the first connecting structure 6, and the first liquid line 31 and the second liquid line 32 are connected via the second connecting structure 9. After connecting multiple steam chamber bodies 1, the first switch valve 5 and the second switch valve 8 are opened, and the device can be put into operation. Such a structural arrangement is more conducive to modular production and manufacturing. Steam chamber bodies 1 fixedly connected to the first gas line 21 and the first liquid line 31 can be mass-produced in the factory. The steam chamber bodies 1 have the same structure, which is convenient for mass production. When in use, multiple steam chamber bodies 1 can be connected with pipelines.

[0051] In some embodiments, the first connection structure 6 and the second connection structure 9 are flange connection structures, which include flange plates, nuts, and screws for easy operation and installation.

[0052] In some implementation schemes, the first switch valve 5 also adopts a ball valve, and other conventional switch valves may also be adopted. If a ball valve is adopted, both the first switch valve 5 and the second switch valve 8 are ball valves, which facilitates centralized procurement.

[0053] In some embodiments, as Figure 7 As shown, the evaporation end capillary core 4 includes a base plate 41 and a plurality of capillary columns 42 arranged in an array on the base plate 41. The provision of a plurality of capillary columns 42 is beneficial to increasing the evaporation area and improving the heat exchange efficiency.

[0054] The modular multi-steam chamber heat dissipation device of the present invention does not require an additional liquid reservoir to be added to the overall structure, which not only increases the heat dissipation capacity of the overall structure, but also reduces its structural complexity. The overall structure has fewer parts, which is conducive to the modular preparation of the overall structure of the steam chamber. Its working principle is: when it is first used, the mass of the liquid working fluid in the multiple steam chambers is the same, and as the calorific value of different modules of the electronic components is different, the evaporation amount of the liquid working fluid in the steam chamber is also different. After the liquid working fluid is phase-changed into steam, the steam rises to the condensation end to dissipate heat. At this time, the steam in the steam chamber body on the module with a larger calorific value will have a higher temperature and steam volume than the steam in other steam chamber bodies. Under the action of the pressure difference, part of the high-temperature steam will flow along the gas pipeline to other steam chamber bodies and condense in other steam chamber bodies. The widespread flow of the vapor working medium inevitably leads to differences in the quality of the liquid working medium within different steam chambers. This is achieved through a liquid pipeline connected to the evaporation end capillary wick structure. The liquid pipeline is designed with a capillary wick that provides capillary pumping. This allows the liquid working medium to flow back into the evaporation chamber through the liquid pipeline, thereby maintaining a dynamic balance of working medium within each steam chamber. After the working medium returns, it evaporates again on the surface of the capillary wick structure at the evaporation end of each steam chamber, thereby exchanging heat.

[0055] Considering the convenience of transporting and installing the steam chamber structure, on-off valve structures are designed for the gas and liquid pipelines. When closed, they maintain the airtightness of the steam chamber body during transport and installation, while opening them without disrupting the capillary pumping function of the liquid pipeline. The second on-off valve provided on the liquid pipeline is a ball valve, which also contains a capillary wick. During transportation of the device and connection to the liquid pipeline, the ball valve is closed, and the smooth surface of the ball inside the ball valve contacts the capillary wick structure in the liquid pipeline, preventing liquid and gas from flowing through the ball valve structure. After the steam chamber bodies are connected, the ball valve is opened, and the capillary wick contacts the capillary wick, allowing liquid to flow between the two, maintaining the integrity of the capillary pump function of the liquid pipeline and allowing the liquid to circulate within the device under the action of capillary force.

[0056] A spring can be incorporated into the second connection structure designed for the liquid pipeline. This structure preserves the capillary pumping function of the capillary wick within the liquid pipeline during connection, while also simplifying the connection method and achieving high connection precision. The spring, made from the same material used to make capillary wicks and capable of stretching and deforming, is placed at the connection between the two liquid pipelines. After connection, the spring is squeezed by the capillary wick within the liquid pipeline, ensuring good contact with the capillary wicks at both ends. Liquid fluid can flow continuously through the capillary structure of the spring to the capillary wick at the other end, further ensuring the capillary pumping function of the capillary wick within the liquid pipeline and ensuring that the liquid fluid can maintain flow under the action of capillary force.

Claims

1. A modular multi-steam chamber heat dissipation device, characterized by: The steam chamber comprises a plurality of steam chamber bodies, and gas pipelines and liquid pipelines for connecting the plurality of steam chamber bodies. The steam chamber body is a closed cavity consisting of a condensing end shell at the top, a middle shell, and an evaporating end shell at the bottom. The evaporating end shells of different steam chamber bodies are interconnected via the liquid pipelines, and the condensing end shells are interconnected via the gas pipelines. The condensing end shell is provided with a number of heat dissipation ribs; the evaporating end shell is provided with an evaporating end capillary wick; The gas pipeline is provided with a first switch valve and a first connecting structure; A pipeline capillary wick is provided in the liquid pipeline, and a second switch valve and a second connection structure are provided on the liquid pipeline. The second switch valve is a ball valve, and a ball valve capillary wick is provided in the ball of the second switch valve. When the second switch valve is in an open state, the pipeline capillary wick is in contact and connected with the ball valve capillary wick; Each steam chamber body corresponds to a heat-generating electronic component module. The placement of the steam chamber body is set according to the heat-generating electronic component module. When different electronic component modules generate different amounts of heat, the steam chamber body on the electronic component module with relatively small heat generation will take over the heat from the high-heating electronic component module for efficient heat dissipation.

2. The modular multi-steam chamber heat dissipation device according to claim 1, characterized in that: The first connection structure or the second connection structure is a flange connection, a threaded connection, a socket connection, a clamp connection, a sleeve connection or a press connection.

3. The modular multi-steam chamber heat dissipation device according to claim 2, characterized in that: The second connection structure includes a spring. The material of the spring is a capillary wick material. The spring is used to connect the pipeline capillary wicks in two liquid pipelines to allow the liquid working medium in the pipeline capillary wicks to flow smoothly.

4. The modular multi-steam chamber heat dissipation device according to claim 1, characterized in that: The steam chamber body is cylindrical or rectangular, and the condensing end shell, the middle shell and the evaporating end shell are detachably connected; the middle shell is made of thermal insulation material.

5. The modular multi-steam chamber heat dissipation device according to claim 1, characterized in that: The heat dissipation fins are cylindrical, and their interior is connected to the interior of the condensing end shell. The heat dissipation fins are circumferentially arranged around the side wall of the condensing end shell and are inclined upward to facilitate the condensate in the heat dissipation fins to flow downward along the inner wall of the steam chamber body back to the evaporation end through gravity.

6. The modular multi-steam chamber heat dissipation device according to claim 1, characterized in that: One end of the pipeline capillary core that contacts the ball valve is an arc that fits the outer wall of the sphere inside the ball valve, and both ends of the ball valve capillary core are arcs that fit the inner wall of the sphere inside the ball valve. When the ball valve is in an open state, the arc-shaped end of the pipeline capillary core matches the arc-shaped end of the ball valve capillary core to achieve contact connection between the pipeline capillary core and the ball valve capillary core.

7. The modular multi-steam chamber heat dissipation device according to claim 1, characterized in that: The gas pipeline includes a plurality of first gas pipelines and a second gas pipeline, wherein the first gas pipeline is fixedly connected to the condensing end shell and a first switch valve is provided on the first gas pipeline; the second gas pipeline is provided with a plurality of branch gas pipelines that are interconnected, and the branch gas pipelines are connected to the first gas pipeline via the first connection structure; The liquid pipeline includes multiple first liquid pipelines and second liquid pipelines. The first liquid pipeline is fixedly connected to the evaporation end shell, and a second switch valve is provided on the first liquid pipeline; the second liquid pipeline is provided with multiple branch liquid pipelines that are interconnected, and the branch liquid pipelines are connected to the first liquid pipeline through the second connection structure.

8. The modular multi-steam chamber heat dissipation device according to claim 7, characterized in that: The first connection structure and the second connection structure are flange connection structures.

9. The modular multi-steam chamber heat dissipation device according to claim 1, characterized in that: The first switch valve is a ball valve.

10. The modular multi-steam chamber heat dissipation device according to claim 1, characterized in that: The evaporation end capillary core comprises a base plate and a plurality of capillary columns arranged in an array and arranged on the base plate.

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