Bus bar assembly and method for manufacturing bus bar assembly

Abstract

According to the manufacturing method of the present invention, the following bus bar assembly can be efficiently manufactured, which bus bar assembly comprises: a plurality of bus bars arranged in parallel in the same plane; and an insulating layer, including a gap filling portion filled in the gap between adjacent bus bars and a lower surface side laminate portion extending integrally from the gap filling portion in a manner arranged on the lower surfaces of the plurality of bus bars, at least a portion of the upper surface of the bus bar is exposed to form an upper surface side connecting portion, and the lower surface of the bus bar has a first lower surface region which is located at the same position in the thickness direction as the lower end of the gap and on which the lower surface side laminate portion is provided, and a second lower surface region which is exposed to the outside at a position protruding to the side opposite to the upper surface than the first lower surface region to form a lower surface side connecting portion.

Description

Technical Field

[0001] The present invention relates to a busbar assembly in which a plurality of busbars are mechanically connected in an electrically insulated state, and a method for manufacturing the busbar assembly. Background Art

[0002] A bus bar assembly including a plurality of bus bars mechanically coupled to each other in an electrically insulated state has been proposed and is used in various fields.

[0003] For example, a stacked bus bar assembly has been proposed in which one flat-plate bus bar and another flat-plate bus bar are stacked vertically in parallel with each other (see Patent Documents 1 and 2 listed below).

[0004] The stacked bus bar assembly has a problem in that it is difficult to ensure sufficient reliability regarding insulation because the facing planes of one flat bus bar and the facing planes of the other flat bus bars are arranged facing each other across the insulating layer.

[0005] In particular, if the thickness of the insulating layer between the one flat-plate bus bar and the other flat-plate bus bar is reduced in order to achieve miniaturization in the vertical direction, leakage current may flow between the two bus bars.

[0006] In order to solve the problems of the stacked busbar assembly, the applicant of this application filed an application related to a planar busbar assembly in which the first and second busbars of the conductive metal flat plate are arranged side by side in the same plane, and obtained a patent authorization (see patent documents 3 and 4 below).

[0007] In a semiconductor module in which semiconductor elements such as LEDs are mounted on a bus bar assembly, a sealing resin body is provided that surrounds the semiconductor elements and wires connected to the semiconductor elements (see Patent Document 5 below).

[0008] exist Figure 17 (a) shows a longitudinal cross-sectional view of a semiconductor module 600 using a busbar assembly 500 proposed by the applicant of this application. Figure 17 (b) shows the Figure 17 Cross-sectional view along line XVII(b)-XVII(b) in (a).

[0009] Figure 17 The semiconductor module 600 shown in (a) and (b) includes a planar bus bar assembly 500 , an LED 110 mounted on the planar bus bar assembly 500 , and a sealing resin body 130 provided so as to surround the LED 110 .

[0010] The planar busbar assembly 500 comprises: a first and a second busbar 510(1), 510(2), which are arranged side by side in the same plane with a gap 519 therebetween; and an insulating layer 520, which comprises a gap filling portion 529 filling the gap 519, and an upper surface side laminate portion 521 and a lower surface side laminate portion 525 extending integrally from the gap filling portion 529 and covering the upper surface and lower surface of the first and second busbars 510(1), 510(2), respectively.

[0011] The upper surface side laminate portion 521 is provided with the first and second upper surface side central openings 522 (1) and 522 (2) for exposing predetermined portions of the upper surfaces of the first and second bus bars 510 (1) and 510 (2), respectively, and an upper surface side peripheral opening 523 surrounding the first and second upper surface side central openings 522 (1) and 522 (2) when viewed from above.

[0012] The area of the upper surface 511 of the first bus bar 510 (1) exposed through the first upper surface side central opening 522 (1) forms the upper surface side connection portion 512 of the first bus bar 510 (1), and the area of the upper surface 511 of the second bus bar 510 (2) exposed through the second upper surface side central opening 522 (2) forms the upper surface side connection portion 512 of the second bus bar 510 (2).

[0013] The LED 110 comprises an element body 115 and an upper electrode layer 111 and a lower electrode layer 112 respectively arranged on one side and the other side of the thickness direction of the element body 115, wherein the lower electrode layer 112 is connected to one of the first and second bus bars 510 (1) and 510 (2) (in the embodiment of FIG. Figure 17 In (a) and (b), the upper surface side connection portion 512 of the first bus bar 510 (1) is mechanically and electrically connected, for example, via a plating layer (not shown), and the upper electrode layer 111 is connected to the other of the first and second bus bars 510 (1) and 510 (2) (in the embodiment of FIG. Figure 17 In (a) and (b), the second bus bar 510 ( 2 ) is electrically connected via the lead wire 120 .

[0014] The sealing resin body 130 is a member for protecting the LED 110 and the lead wire 120 , and is formed by applying an insulating resin so as to surround the LED 110 and the lead wire 120 and curing the insulating resin.

[0015] In the bus bar assembly 500 , the outer edge of the upper peripheral opening 523 functions as a blocking portion that prevents the sealing resin body 130 from flowing out.

[0016] The lower surface 513 of the first and second bus bars 510 (1) and 510 (2) has a first lower surface area 513a located at the same position in the thickness direction as the lower end of the gap 519 and a second lower surface area 513b located below the first lower surface area 513a (in the direction away from the upper surface 511).

[0017] The lower surface side laminated portion 525 is provided in the first lower surface region 513 a .

[0018] The second lower surface region 513b extends downward from the lower surface side laminate portion 513a and is exposed to the outside, and functions as a lower surface side connection portion for electrically connecting the first and second bus bars 510(1) and 510(2) to the outside.

[0019] According to the structure, the second lower surface area 513b of the first and second bus bars 510 (1) and 510 (2) can be used as a mounting surface for fixing the bus bar assembly 500 (the semiconductor module 600) to a setting component such as a substrate, and the bus bar assembly 500 (the semiconductor module 600) can be fixed while maintaining the parallelism of the first and second bus bars 510 (1) and 510 (2).

[0020] Prior art literature

[0021] Patent Literature

[0022] Patent Document 1: Japanese Patent No. 4432913

[0023] Patent Document 2: Japanese Patent No. 6487769

[0024] Patent Document 3: Japanese Patent No. 6637002

[0025] Patent Document 4: Japanese Patent No. 6637003

[0026] Patent Document 5: Japanese Patent Application Laid-Open No. 2020-035824 Summary of the Invention

[0027] An object of the present invention is to provide a manufacturing method capable of efficiently manufacturing the following bus bar assembly, which comprises: a plurality of bus bars arranged in parallel in the same plane; and an insulating layer, including a gap filling portion filled in the gap between adjacent bus bars and a lower surface side laminate portion extending integrally from the gap filling portion in a manner arranged on the lower surfaces of the plurality of bus bars, at least a portion of the upper surface of the bus bar is exposed to form an upper surface side connecting portion, and the lower surface of the bus bar has a first lower surface area located at the same position in the thickness direction as the lower end of the gap and for the lower surface side laminate portion to be provided, and a second lower surface area exposed to the outside at a position protruding to the side opposite to the upper surface than the first lower surface area to form a lower surface side connecting portion.

[0028] In order to achieve the above object, the present invention provides a method for manufacturing a busbar assembly, the busbar assembly comprising: a plurality of busbars formed of conductive flat plate-shaped members, arranged in the same plane with gaps between opposing side surfaces; and a busbar-side insulating layer, comprising a gap-filling portion filled in the gaps and a lower surface-side laminated portion integrally extending from the gap-filling portion in a manner arranged on the lower surfaces of the plurality of busbars, at least a portion of the upper surface of the busbar being exposed to form an upper surface-side connecting portion, the lower surface of the busbar having a lower end located adjacent to the gap. The manufacturing method comprises the steps of: preparing a busbar flat plate made of a conductive metal including a busbar assembly forming region, the busbar assembly forming region having a planar outer shape corresponding to a busbar connection body formed by connecting the plurality of busbars by the busbar side insulating layer, and having a shape corresponding to the upper surface and the second lower surface region; the thickness between the bus bar assembly and the first lower surface area is the same thickness; a thickness adjustment process, adjusting the thickness of the bus bar assembly forming area so that the thickness of the first lower surface forming area corresponding to the first lower surface area in the lower surface of the bus bar assembly forming area is consistent with the thickness between the upper surface of the bus bar and the first lower surface area; a gap forming process, performed before or after the thickness adjustment process, forming one or more gaps penetrating in the thickness direction and having the same width as the gap in the bus bar assembly forming area, dividing a plurality of bus bar forming areas corresponding to the plurality of bus bars a busbar side insulating layer forming process, applying an insulating resin coating at least in the gap and the entire area of the lower surface of the busbar assembly forming area, curing it to form a busbar side insulating layer; a laser irradiation process, irradiating the laser at least to the entire area of the second lower surface forming area corresponding to the second lower surface area and the boundary between the first and second lower surface forming areas within a range not irradiated into the gap, so that the entire area of the second lower surface forming area is exposed; and a cutting process, cutting the busbar assembly forming area from the busbar with a flat plate.

[0029] According to the manufacturing method of the bus bar assembly involved in the present invention, the following bus bar assembly can be efficiently manufactured, which bus bar assembly comprises: a plurality of bus bars arranged in parallel in the same plane; and an insulating layer, including a gap filling portion filled in the gap between adjacent bus bars and a lower surface side laminate portion extending integrally from the gap filling portion in a manner arranged on the lower surfaces of the plurality of bus bars, at least a portion of the upper surface of the bus bar is exposed to form an upper surface side connecting portion, and the lower surface of the bus bar has a first lower surface area which is located at the same position in the thickness direction as the lower end of the gap and for which the lower surface side laminate portion is provided, and a second lower surface area which is exposed to the outside at a position protruding to the side opposite to the upper surface than the first lower surface area to form a lower surface side connecting portion.

[0030] For example, the bus bar side insulating layer forming step may form an insulating layer over the entire upper surface of the bus bar assembly forming region in addition to the gap and the entire lower surface of the bus bar assembly forming region.

[0031] In this case, the laser irradiation step is configured to irradiate the upper surface connection portion forming region corresponding to the upper surface connection portion on the upper surface of the bus bar assembly forming region with laser light to expose the upper surface connection portion forming region.

[0032] Preferably, the bus bar flat plate integrally includes a plurality of bus bar assembly forming regions arranged in series in a first direction along the longitudinal direction of the slit, and a connecting region connecting adjacent bus bar assembly forming regions.

[0033] In this case, one end in the longitudinal direction of the slit formed in one bus bar assembly forming area extends laterally into the connecting area connected to one side in the first direction of the one bus bar assembly forming area, and the other end in the longitudinal direction extends laterally into the connecting area connected to the other side in the first direction of the one bus bar assembly forming area.

[0034] In one embodiment, the manufacturing method according to the present invention may include a frame forming process performed before or after the process from preparing the bus bar flat plate to the laser irradiation process, or in parallel with the process; and a flat plate fixing process performed after the frame forming process and after the bus bar side insulation layer forming process.

[0035] The frame forming process includes: a process of preparing a flat plate for a frame made of conductive metal including a frame forming area, the frame forming area having a top view shape corresponding to the bus bar assembly forming area; a punching process of punching out the center of the frame forming area so that when the frame forming area is overlapped with the bus bar assembly forming area, at least the upper surface side connection portion forming area corresponding to the upper surface side connection portion is exposed upward in a state of being surrounded in a top view; and a frame side insulating layer forming process of applying an insulating resin coating to at least the lower surface of the frame forming area in a state where the center is punched out, and curing it to provide a frame side insulating layer.

[0036] The plate fixing step is configured to fix the lower surface of the frame body forming region after the frame body forming process to the upper surface of the bus bar assembly forming region after the bus bar side insulating layer forming step.

[0037] The cutting step is configured to cut the bus bar assembly forming region and the frame body forming region in a fixed state from the bus bar flat plate and the frame body flat plate after the flat plate fixing step.

[0038] In the above embodiment, it is preferred that the bus bar plate integrally include a plurality of bus bar assembly forming regions arranged in series in a first direction along the longitudinal direction of the slit, and a connecting region connecting adjacent bus bar assembly forming regions, wherein one end of the slit in the longitudinal direction extends laterally to the connecting region connected to one side of the bus bar assembly forming region in the first direction, and the other end of the slit in the longitudinal direction extends laterally to the connecting region connected to the other side of the bus bar assembly forming region in the first direction. Furthermore, the frame plate integrally includes a plurality of frame forming regions arranged in series in the first direction at the same pitch as the plurality of bus bar assembly forming regions, and a connecting region connecting adjacent frame forming regions in the first direction.

[0039] In the above-mentioned embodiment, the plate fixing step can be performed after the laser irradiation step.

[0040] Instead of this, the laser irradiation step may be performed after the plate fixing step.

[0041] In addition, the present invention provides a bus bar assembly, which comprises: a plurality of bus bars, each formed of a conductive flat plate-shaped member having an upper surface and a lower surface facing one side and the other side in a thickness direction, and a side surface connecting the upper surface and the lower surface, and arranged in the same plane with a gap between the opposing side surfaces; a bus bar side insulating layer, comprising a gap filling portion filled in the gap and a lower surface side laminate portion extending integrally from the gap filling portion in a manner arranged on the lower surface of a bus bar connection body formed by connecting the plurality of bus bars by the gap filling portion; and a frame body, which surrounds the bus bar in a plan view. The bus bar connector is fixed to the periphery of the upper surface of the bus bar connector in a manner that is close to the central area of the upper surface of the bus bar connector, and has insulating properties at least in the lower surface fixed to the upper surface of the bus bar connector. In the area surrounded by the frame, at least a portion of the upper surface of the bus bar is exposed to form an upper surface side connecting portion. The lower surface of the bus bar includes a first lower surface area that is located at the same position in the thickness direction as the lower end portion on the other side of the thickness direction of the gap and is where the lower surface side laminated portion is provided, and a second lower surface area that is exposed on the other side of the thickness direction than the lower surface side laminated portion to form a lower surface side connecting portion.

[0042] Preferably, the bus bar side insulating layer may include an upper surface side laminate portion integrally extending from the gap filling portion so as to be located on the upper surface of the bus bar coupling body.

[0043] The upper surface side laminate portion is provided with an opening that exposes the upper surface side connecting portion.

[0044] In the first aspect of the bus bar assembly according to the present invention, the first lower surface region extends over the entire periphery of the lower surface of the bus bar, and the bus bar side insulating layer includes a side surface side laminate portion integrally extending from the lower surface side laminate portion so as to cover the side surfaces of the bus bar connector.

[0045] In the second aspect of the bus bar assembly according to the present invention, the first lower surface region is provided only in a region along a side surface facing the gap, among the peripheral edges of the lower surface of the bus bar.

[0046] In various aspects of the bus bar assembly according to the present invention, the frame can be formed of an insulating member.

[0047] Instead, the frame body is formed of a conductive member, and a frame body-side insulating layer is provided on at least the lower surface of the frame body. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 (a) to (c) are respectively a top view of a bus bar assembly manufactured by a manufacturing method according to an embodiment of the present invention, a view along Figure 1A cross-sectional view taken along line I(b)-I(b) in (a) and a bottom view of the busbar assembly.

[0049] Figure 2 It is a longitudinal cross-sectional view of a semiconductor module in which semiconductor elements such as LEDs are mounted on the bus bar assembly.

[0050] Figure 3 (a) and (b) are respectively a top view and a side view of a busbar plate used in the manufacturing method. Figure 3 An enlarged cross-sectional view of line III(b)-III(b) in (a).

[0051] Figure 4 (a) and (b) are respectively a longitudinal sectional view and a bottom view of the bus bar assembly forming region of the bus bar flat plate, showing the state after the thickness adjustment step in the manufacturing method.

[0052] Figure 5 It is a plan view of the bus bar flat plate after the slit forming step in the manufacturing method.

[0053] Figure 6 (a) to (c) are Figure 5 The enlarged view of part VI(a) in the figure, along Figure 6 The cross-sectional view of line VI(b)-VI(b) in (a) and Figure 6 (b) Bottom view of .

[0054] Figure 7 (a) and (b) are respectively a top view of the bus bar flat plate after the bus bar side insulating layer forming step in the manufacturing method and a view along the Figure 7 An enlarged cross-sectional view taken along line VII(b)-VII(b) in (a).

[0055] Figure 8 (a) is a longitudinal sectional view of the bus bar assembly forming region in the laser irradiation step in the manufacturing method, Figure 8 (b) is along Figure 8 A partially enlarged bottom view of the bus bar assembly forming area when viewed along line VIII in (a) (b).

[0056] Figure 9 (a) and (b) are respectively a top view and a bottom view of the bus bar flat plate after the laser irradiation step.

[0057] Figure 10 It is along Figure 9 Cross-sectional view along line XX in (a).

[0058] Figure 11It is a top view of a frame body plate used in the frame body forming process in the above-mentioned manufacturing method.

[0059] Figure 12 It is a plan view of the frame body flat plate after the frame body side insulating layer forming step in the manufacturing method.

[0060] Figure 13 It is a plan view of the bus bar flat plate and the frame body flat plate after the flat plate fixing step in the manufacturing method.

[0061] Figure 14 (a) to (c) are respectively a top view of the bus bar assembly according to the first modification, a view along the Figure 14 A cross-sectional view taken along line XIV(b)-XIV(b) in (a) and a bottom view of the bus bar assembly according to the first modification.

[0062] Figure 15 (a) to (c) are respectively a top view of the bus bar assembly according to the second modification, a view along Figure 15 A cross-sectional view taken along line XV(b)-XV(b) in (a) and a bottom view of the bus bar assembly according to the second modification.

[0063] Figure 16 (a) to (c) are respectively a top view of the bus bar assembly according to the third modification, a view along the Figure 16 A cross-sectional view taken along line XVI(b)-XVI(b) in (a) and a bottom view of the bus bar assembly according to the third modification.

[0064] Figure 17 (a) and (b) are longitudinal cross-sectional views of a semiconductor module using a conventional bus bar assembly and a longitudinal cross-sectional view along the Figure 17 Cross-sectional view along line XVII(b)-XVII(b) in (a). DETAILED DESCRIPTION

[0065] Hereinafter, one embodiment of a method for manufacturing a bus bar assembly according to the present invention will be described with reference to the drawings.

[0066] exist Figure 1 (a) to (c) show a top view of the bus bar assembly 1 manufactured by the manufacturing method according to this embodiment, a view along the Figure 1 Cross-sectional view and bottom view along line I(b)-I(b) in (a).

[0067] like Figure 1As shown in (a) to (c), the busbar assembly 1 comprises: a plurality of busbars 10 formed by conductive flat plate members, arranged side by side in the same plane with gaps 19 existing between opposite side surfaces 15; and a busbar side insulating layer 20, comprising a gap filling portion 29 filled in the gap 19 and a lower surface side laminate portion 23 extending integrally from the gap filling portion 29 in a manner arranged on the lower surface of a busbar connection body formed by connecting the plurality of busbars 10 by the gap filling portion 29.

[0068] The bus bar 10 is formed of a conductive metal such as Cu.

[0069] The bus bar assembly 1 according to this embodiment includes three bus bars, namely, first to third bus bars 10 ( 1 ) to 10 ( 3 ), as the plurality of bus bars 10 , and includes first and second gaps 19 ( 1 ) and 19 ( 2 ) as the gaps 19 .

[0070] That is, the bus bar assembly 1 includes the first bus bar 10 ( 1 ), the second bus bar 10 ( 2 ) disposed adjacent to the first bus bar 10 ( 1 ) with a first gap 19 ( 1 ) therebetween, and the third bus bar 10 ( 3 ) disposed adjacent to the second bus bar 10 ( 2 ) with a second gap 19 ( 2 ) therebetween.

[0071] Each of the bus bars 10 ( 1 ) to 10 ( 3 ) has an upper surface 11 and a lower surface 12 facing one side and the other side in the thickness direction, respectively, and a side surface 15 connecting the upper surface 11 and the lower surface 13 . The side surfaces 15 of adjacent bus bars 10 face each other with the gap 19 therebetween.

[0072] At least a portion of the upper surface 11 of the bus bar 10 is exposed to form an upper surface-side connecting portion 12 .

[0073] The upper surface side connecting portion 12 is used as a semiconductor element 110 such as an LED to be mounted on the bus bar assembly 1 (see below). Figure 2 ) The connecting portion serves as a component for assembling or electrically connecting components.

[0074] On the other hand, Figure 1 As shown in (b), the lower surface 13 of each bus bar 10 (1) to 10 (3) has a first lower surface area 13a which is located at the same position in the thickness direction as the lower end portion on the other side of the thickness direction of the gap 19 and is provided with the lower surface side laminated portion 23, and a second lower surface area 13b which is exposed to the outside at the other side in the thickness direction (i.e., the side away from the upper surface 11) than the lower surface side laminated portion 23 provided in the first lower surface area 13a.

[0075] The second lower surface area 13 b functions as an external connection portion 14 for electrically connecting the corresponding bus bar 10 to the outside, and also functions as a placement surface when the bus bar assembly 1 is fixed to a mounting surface such as a substrate.

[0076] As described above, the second lower surface region 13 b protrudes downward from the lower surface-side laminated portion 23 . Therefore, by utilizing the second lower surface region 13 b as a placement surface, the fixed posture of the bus bar assembly can be stabilized.

[0077] In addition, in this embodiment, if Figure 1 As shown in (c), the first lower surface region 13a extends over the entire periphery of the lower surface of the bus bar 10, and the central region of the lower surface of the bus bar 10 surrounded by the first lower surface region 13a is the second lower surface region 13b.

[0078] The busbar-side insulating layer 20 is formed of an insulating resin coating having heat resistance and insulating properties, such as polyamideimide, polyimide, polyamide, or epoxy resin. Preferably, Insilid (registered trademark) is used.

[0079] like Figure 1 As shown in (a) and (b) of FIG. 1 , in this embodiment, the bus bar side insulating layer 20 includes an upper surface side laminate portion 21 in addition to the gap filling portion 29 and the lower surface laminate portion 23 .

[0080] The upper surface side lamination portion 21 integrally extends from the gap filling portion 29 so as to be located on the upper surface of the bus bar connection body formed by connecting the plurality of bus bars 10 ( 1 ) to 10 ( 3 ) by the gap filling portion 29 .

[0081] In this case, the upper surface side laminate portion 21 is provided with an opening 22 for exposing the upper surface side connecting portion 12 .

[0082] In the present embodiment, the bus bar side insulating layer 20 further includes a side surface lamination portion 25 that covers the side surfaces of the bus bar coupling body.

[0083] As described above, in this embodiment, the first lower surface area 13a of the lower surface side laminate portion 23 is provided over the entire periphery of the lower surface of each bus bar 10, and the side side laminate portion 25 extends integrally from a portion of the lower surface side laminate portion 23 located at the periphery of the lower surface of the bus bar connector.

[0084] According to this configuration, it is possible to effectively prevent the bus bar-side insulating layer 20 from being separated from the bus bar coupling body.

[0085] Furthermore, in this embodiment, the side surface-side laminated portion 25 is also integrated with the upper surface-side laminated portion 21 .

[0086] like Figure 1 As shown in (a) and (b) of FIG. 8 , the bus bar assembly 1 further includes a frame 30 .

[0087] The frame 30 is used to hold the semiconductor element 110 such as LED mounted on the upper surface side connection portion 12 (see below). Figure 2 ) and the lead 120 connected to the semiconductor element 110 (see below Figure 2 ) is protected by a sealing resin body 130 (see below Figure 2 ) components.

[0088] Specifically, the frame 30 is fixed to the periphery of the bus bar coupling body so as to integrally surround at least the upper surface side connection portions 12 of the bus bars 10 ( 1 ) to 10 ( 3 ) in a plan view.

[0089] That is, the frame body 30 is an annular body having the same outer shape as the bus bar coupling body in a plan view and provided with a central hole for opening the upper surface side connection portions 12 of the plurality of bus bars 10 ( 1 ) to 10 ( 3 ) upward.

[0090] The frame 30 is fixed to the bus bar coupling body in a state of being insulated from the plurality of bus bars 10 ( 1 ) to 10 ( 3 ).

[0091] In this embodiment, the frame 30 is formed of a conductive metal member (preferably the same member as the bus bar 10 ), and a frame-side insulating layer 40 is provided on the outer peripheral surface.

[0092] That is, in this embodiment, the frame 30 of the conductive metal component is fixed to the periphery of the upper surface of the bus bar connector in a state of being insulated relative to the multiple bus bars 10 (1) to 10 (3) via the frame side insulating layer 40 and the upper surface side laminated portion 21 of the bus bar side insulating layer 20.

[0093] Instead of this, the frame body 30 may be formed using an insulating member such as ceramic.

[0094] In addition, in the configuration in which the upper surface-side laminated portion 21 is provided on the upper surface of the bus bar connector as in the present embodiment, the frame 30 can be formed of a conductive member and the frame-side insulating layer 40 can be eliminated.

[0095] Furthermore, in a configuration in which the upper surface-side laminated portion 21 is not provided, the frame body 30 may be formed of a conductive member, and the frame-side insulating layer 40 may be provided only on the lower surface of the frame body 30 .

[0096] exist Figure 2 1 is a longitudinal sectional view of an example of a semiconductor module 101 in which semiconductor elements 110 such as LEDs are mounted on the bus bar assembly 1 .

[0097] In the semiconductor module 101 , first and second semiconductor elements 110 ( 1 ) and 110 ( 2 ) are mounted as the semiconductor element 110 .

[0098] The first and second semiconductor elements 110 ( 1 ) and 110 ( 2 ) each have an upper electrode layer 111 and a lower electrode layer 112 on the upper surface on one side in the thickness direction and the lower surface on the other side in the thickness direction, respectively, and an element body 115 is provided between the upper and lower electrode layers 111 and 112 .

[0099] In the semiconductor module 101, the first and second bus bars 10 (1) and 10 (2) function as one of the anode and cathode (e.g., the anode), i.e., the first electrode, and the third bus bar 10 (3) functions as the other of the anode and cathode (e.g., the cathode), i.e., the second electrode.

[0100] That is, the lower electrode layer 112 of the first semiconductor element 110 (1) is fixed in an electrically connected state to the upper surface side connection portion 12 of the first bus bar 10 (1) functioning as the first electrode, and the upper electrode layer 111 is electrically connected to the upper surface side connection portion 12 of the third bus bar 10 (3) functioning as the second electrode via the lead 120 (1).

[0101] The lower electrode layer 112 of the second semiconductor element 110 (2) is fixed in an electrically connected state to the upper surface side connection portion 12 of the second bus bar 10 (2) functioning as the first electrode, and the upper electrode layer 111 is electrically connected to the upper surface side connection portion 12 of the third bus bar 10 (3) functioning as the second electrode via a lead 120 (2).

[0102] Preferably, a plating layer (not shown) is provided on the upper surfaces of the first to third bus bars 10 ( 1 ) to 10 ( 3 ).

[0103] In this case, the lower electrode layers 112 of the first and second semiconductor elements 110 (1) and 110 (2) are respectively die-bonded to the plating layers on the upper surfaces of the first and second bus bars 10 (1) and 10 (2) in an electrically connected manner, and the upper electrode layers 111 of the first and second semiconductor elements 110 (1) and 110 (2) are respectively wire-bonded to the plating layers (not shown) provided on the upper surface of the third bus bar 10 (3) through the first and second leads 120 (1) and 120 (2).

[0104] The sealing resin body 130 is provided on the upper surface of the bus bar assembly 1 so as to surround the first and second semiconductor elements 110 ( 1 ) and 110 ( 2 ) and the first and second leads 120 ( 1 ) and 120 ( 2 ).

[0105] The frame 30 prevents the insulating resin material forming the sealing resin layer 130 from flowing out before being cured when the sealing resin layer 130 is provided and prevents the cured sealing resin layer 130 from being separated from the bus bar assembly 1 .

[0106] The sealing resin layer 130 is formed of a transparent resin material such as polyimide, polyamide, or epoxy resin.

[0107] Hereinafter, a method for manufacturing the bus bar assembly 1 according to the present embodiment will be described.

[0108] The manufacturing method includes a step of preparing a bus bar flat plate 200 made of a conductive metal.

[0109] exist Figure 3 (a) and (b) show the top view of the busbar plate 200 and the direction along which the busbar plate 200 is formed. Figure 3 An enlarged cross-sectional view of line III(b)-III(b) in (a).

[0110] The bus bar plate 200 has a bus bar assembly forming region 210 having a planar shape corresponding to the bus bar connection body formed by connecting a plurality of bus bars 10 (the first to third bus bars 10 ( 1 ) to 10 ( 3 )) via the bus bar side insulating layer 20 .

[0111] That is, the first direction ( Figure 3 The length of the bus bar assembly 1 in the direction parallel to the gap 19 is the same as the length of the bus bar assembly 1 in the direction parallel to the gap 19, and the second direction ( Figure 3The length (in the X direction in (a)) is the same as the length of the bus bar assembly 1 in a direction perpendicular to the longitudinal direction of the gap 19 .

[0112] In addition, if Figure 1 (b) and Figure 3 As shown in FIG. 5 ( b ), the bus bar assembly forming region 210 has the same thickness as a thickness T2 between the upper surface 11 and the second lower surface region 13 b of the bus bar 10 .

[0113] like Figure 3 As shown in (a), in this embodiment, the bus bar plate 200 has a bus bar array 205 including a plurality of bus bar assembly forming regions 210 arranged in series along a first direction (Y direction) within the plane of the plate 200 and a connecting region 230 connecting the bus bar assembly forming regions 210 adjacent to each other in the Y direction, and the plurality of bus bar assembly forming regions 210 can be processed simultaneously.

[0114] In this embodiment, the bus bar plate 200 includes a pair of holding pieces 207 connected to one side and the other side of the bus bar array 205 in the longitudinal direction (Y direction), respectively. Positioning holes 208 are provided in the pair of holding pieces 207 .

[0115] Furthermore, the plurality of bus bar arrays 205 may be arranged in parallel in the second direction (X direction) within the plane, and the plurality of bus bar arrays 205 arranged in parallel in the X direction may be integrally held by the pair of holding pieces 207 , 207 .

[0116] According to this modified structure, more bus bar assemblies 1 can be manufactured simultaneously.

[0117] The manufacturing method further includes a thickness adjustment step of adjusting the thickness of the bus bar assembly forming region 210 .

[0118] exist Figure 4 (a) shows a longitudinal cross-sectional view of the bus bar assembly forming region 210 after the thickness adjustment step.

[0119] Moreover, in Figure 4 (b) shows a bottom view of the bus bar assembly forming area 210 after the thickness adjustment step.

[0120] like Figure 4 As shown in (a) and (b), the thickness adjustment process is configured to make the thickness of the first lower surface forming area 213a corresponding to the first lower surface area 13a in the lower surface 213 of the bus bar assembly forming area 210 consistent with the thickness T1 between the upper surface 11 of the bus bar 10 and the first lower surface area 13a.

[0121] The thickness adjustment step can be performed by, for example, laser trimming or etching.

[0122] As a result, the region other than the first lower surface forming region 213 a in the lower surface 213 maintains the thickness T2 and becomes the second lower surface forming region 213 b corresponding to the second lower surface region 13 b .

[0123] The manufacturing method further includes a slit forming step.

[0124] exist Figure 5 FIG. 2 shows a top view of the bus bar plate 200 after the slit forming step.

[0125] In addition, Figure 6 (a) to (c) show Figure 5 The enlarged view of part VI(a) in the figure, along Figure 6 The cross-sectional view of line VI(b)-VI(b) in (a) and Figure 6 (b) Bottom view of .

[0126] In addition, in the present embodiment, the slit forming step is performed after the thickness adjusting step. However, instead of this, the slit forming step may be performed before the thickness adjusting step.

[0127] The gap forming process is constituted by forming one or more gaps 219 (the first and second gaps 219 (1), 219 (2)) that penetrate the bus bar assembly forming area 210 in the thickness direction and have the same width as the gap 19 (the first and second gaps 19 (1), 19 (2)), and dividing the bus bar assembly forming area 210 into a plurality of bus bar forming parts 220 (the first to third bus bar forming parts 220 (1) to 220 (3)) corresponding to the plurality of bus bars 10 (the first to third bus bars 10 (1) to 10 (3)).

[0128] In the bus bar assembly 1, the first gap 19(1) located between the first and second bus bars 10(1), 10(2) and the second gap 19(2) located between the second and third bus bars 10(2), 10(3) are provided, and therefore, the gap forming process is configured to form the first and second gaps 219(1), 219(2) having the same width as the first and second gaps 19(1), 19(2).

[0129] like Figure 6As shown in (a) to (c), in this embodiment, one side of the length direction (Y direction) of the first and second slits 219 (1) and 219 (2) formed in a bus bar assembly forming area 210A extends toward a connecting area 230A connected to one side of the length direction (Y direction) of the bus bar assembly forming area 210A, and the other side of the length direction (Y direction) extends toward another connecting area 230B connected to the other side of the length direction (Y direction) of the bus bar assembly forming area 230.

[0130] Furthermore, in the state after the gap forming process, the first to third bus bar forming portions 220 (1) to 220 (3) adjacent to each other via the first and second gaps 219 (1) and 219 (2) formed in the one bus bar assembly forming area 210A are configured to be maintained in a state of being connected to each other via the one connecting area 230A and the other connecting area 230B.

[0131] By having this structure, the first and second slits 219 ( 1 ) and 219 ( 2 ) (the first and second gaps 19 ( 1 ) and 19 ( 2 )) can be formed with high precision.

[0132] The manufacturing method includes a bus bar side insulating layer forming step performed after the thickness adjusting step and the slit forming step.

[0133] exist Figure 7 (a) and (b) show a top view of the bus bar plate 200 after the bus bar side insulating layer forming step and a view along the bus bar side insulating layer. Figure 7 An enlarged cross-sectional view taken along line VII(b)-VII(b) in (a).

[0134] The busbar side insulation layer forming process is constituted by applying an insulating resin coating at least in the gaps 219 (1), 219 (2) and on the entire area of the lower surface 213 of the busbar assembly forming area 210, and curing it to form the busbar side insulation layer 20.

[0135] The insulating resin coating can be applied by, for example, electrodeposition coating, electrostatic powder coating, or spray coating.

[0136] In the bus bar assembly, the bus bar side insulating layer 20 has, in addition to the gap filling portion 29 filling the gap 19 and the lower surface side lamination portion 23 provided on the lower surface of the bus bar connector, an upper surface side lamination portion 21 and a side surface side lamination portion 25 provided on the upper surface and side surfaces of the bus bar connector, respectively.

[0137] Therefore, the busbar side insulation layer forming process is as follows: Figure 7As shown in (a) and (b), the insulating resin coating is also applied to the upper surface 211 and the side surface 215 of the bus bar assembly forming area 210 and cured.

[0138] The manufacturing method further includes a laser irradiation step performed after the bus bar side insulating layer forming step.

[0139] exist Figure 8 (a) shows a longitudinal cross-sectional view of the bus bar assembly forming region 210 during the laser irradiation step.

[0140] In addition, Figure 8 (b) shows the Figure 8 FIG. 1 is a partially enlarged bottom view of the bus bar assembly forming area 210 when viewed along line VIII(b) in FIG. 1 . FIG.

[0141] Figure 8 Reference numeral 291 in (b) is an irradiation spot of the irradiated laser light 290 .

[0142] like Figure 8 As shown in (a) and (b), the laser irradiation process is constituted as follows: within the range not irradiating into the gap 219, the laser 290 is irradiated to at least the entire area of the second lower surface forming area 213b and the boundary 213c between the first and second lower surface forming areas 213a and 213b, so that the entire area of the second lower surface forming area 213b is exposed.

[0143] The range where the inside of the slit 219 is not irradiated can be easily identified based on the relationship between the size of the irradiation spot 291 of the laser light 290 and the width of the first lower surface forming region 213 a adjacent to the slit 219 .

[0144] Furthermore, as described above, in the bus bar assembly 1 , the bus bar-side insulating layer 20 has the upper surface-side laminated portion 21 on the upper surface of the bus bar coupling body.

[0145] In this case, the laser irradiation process includes, in addition to the laser irradiation toward the lower surface 213 of the bus bar assembly forming area 210 for exposing the entire area of the second lower surface forming area 213b, also including irradiating the upper surface side connection portion forming area 212 corresponding to the upper surface side connection portion 12 in the upper surface 211 of the bus bar assembly forming area 210 with laser to expose the upper surface side connection portion forming area 212.

[0146] exist Figure 9(a) and (b) show a top view and a bottom view of the bus bar plate 200 after the laser irradiation step, respectively.

[0147] In addition, Figure 10 Shown along Figure 9 Cross-sectional view along line XX in (a).

[0148] By providing the laser irradiation process, the gap filling portion 29 filled in the gap 219 (i.e., the gap 19) can be effectively prevented from being removed, and the insulating layer 20 can be prevented from remaining in the second lower surface forming region 213b (i.e., the second lower surface region 13b).

[0149] According to the manufacturing method, the planar bus bar assembly 1 can be efficiently manufactured in which the parallelism of the second lower surface regions 13 b forming the lower surface-side connecting portions 14 of the plurality of bus bars 10 ( 1 ) to 10 ( 3 ) is well maintained.

[0150] The manufacturing method includes a cutting step of cutting the bus bar assembly forming region 210 from the bus bar flat plate 200 after the laser irradiation step.

[0151] The cutting process is composed of: Figure 9 As shown in (a) and (b) of FIG. 1 , the bus bar assembly forming region 210 is cut along cutting lines C1 and C2 along the edges on one side and the other side in the Y direction, respectively.

[0152] In addition, as mentioned above, the bus bar assembly 1 has the frame 30 (see Figure 1 (a) to (c) and Figure 2 ).

[0153] Therefore, the manufacturing method includes a frame body forming process for forming the frame body 30 .

[0154] The frame forming process is performed before or after the process from the step of preparing the bus bar flat plate 200 to the laser irradiation step, or is performed in parallel with the process.

[0155] exist Figure 11 2 is a plan view of a frame body plate 300 used in the frame body forming process.

[0156] The frame forming process includes: a process of preparing the frame flat plate 300 made of a conductive metal including a frame forming area 310, the frame forming area 310 having the same thickness as that of the frame 30 and having an outer shape corresponding to the bus bar assembly forming area 210 when viewed from above; a punching process of punching out the center of the frame forming area 310 so that when the frame forming area 310 is overlapped with the bus bar assembly forming area 210, at least the upper surface side connection portion forming area 212 is exposed upward in a state of being surrounded when viewed from above; and a frame side insulating layer forming process of applying an insulating resin coating to at least the lower surface of the frame forming area 310 in the state after the center is punched out, and curing it to provide a frame side insulating layer 40.

[0157] also, Figure 11 The state after the punching step is shown.

[0158] exist Figure 12 3 is a plan view of the frame body plate 300 after the frame body side insulating layer forming step.

[0159] In this embodiment, the frame side insulating layer forming step is configured as follows: insulating resin coating is applied to the entire circumference of the frame forming region 310 in a state where the center is punched out and then cured, thereby forming the frame side insulating layer 40 around the entire circumference of the frame forming region 310 .

[0160] The frame plate 300 is formed of various rigid materials.

[0161] Preferably, the frame plate 300 is formed of the same material as that of the bus bar plate 200 .

[0162] The frame body plate 300 is configured such that the frame body forming region 310 is aligned with the bus bar assembly forming region 210 when the frame body plate 300 is overlapped with the bus bar plate 200 .

[0163] Specifically, as described above, the bus bar plate 200 includes a bus bar array 205 including a plurality of bus bar assembly forming regions 210 arranged in series along the Y direction and a connecting region 230 connecting adjacent bus bar assembly forming regions 210 in the Y direction.

[0164] Therefore, if Figure 11 and Figure 12 As shown, the frame plate 300 includes a frame column 305 including a plurality of frame forming regions 310 arranged in series in the Y direction at the same pitch as the plurality of bus bar assembly forming regions 210 and a connecting region 330 connecting adjacent frame forming regions 310 in the Y direction.

[0165] Furthermore, as described above, the bus bar plate 200 includes a pair of holding pieces 207 connected to one side and the other side of the bus bar array 205 in the longitudinal direction (Y direction), and positioning holes 208 are provided in the pair of holding pieces 207 .

[0166] Correspondingly, if Figure 11 and Figure 12 As shown, the frame flat plate 300 is also provided with a pair of holding pieces 307 respectively connected to one side and the other side of the length direction (Y direction) of the frame column 305, and the pair of holding pieces 307 are provided with alignment holes 308 corresponding to the alignment holes 208.

[0167] The manufacturing method further includes a plate fixing step of fixing the bus bar plate 300 and the frame plate 200 in an overlapping state after the frame forming process and the bus bar side insulating layer forming step.

[0168] exist Figure 13 2 shows a plan view of the bus bar plate 200 and the frame plate 300 after the plate fixing step.

[0169] The plate fixing step is configured to fix the lower surface of the frame body forming region 310 after the frame body forming process to the upper surface of the bus bar assembly forming region 210 after the bus bar side insulating layer forming process.

[0170] The frame forming region 310 and the bus bar assembly forming region 210 may be fixed together using an adhesive.

[0171] Alternatively, the curing action of the insulating resin coating film forming the bus bar-side insulating layer 20 or the insulating resin coating film forming the frame-side insulating layer 40 may be utilized instead of or in addition to the adhesive.

[0172] That is, the two flat plates 200 and 300 are fixed by pressing the two flat plates 200 and 300 in an overlapping state when one of the insulating resin coating film forming the busbar side insulating layer 20 and the insulating resin coating film forming the frame side insulating layer 40 is in a semi-cured state, and curing the semi-cured insulating resin coating film.

[0173] In the manufacturing method of the bus bar assembly 1 having the frame 30, the cutting step is configured as follows: after the plate fixing step, the fixed bus bar assembly forming area 210 and the frame forming area 310 are cut from the bus bar plate 200 and the frame plate 300 along the cutting lines C1 and C2 (see FIG. Figure 13 ).

[0174] Furthermore, in this embodiment, the plate fixing step is performed after the laser irradiation step.

[0175] That is, the laser irradiation process is performed on the bus bar plate 200 before the frame plate 300 is fixed, so that the second lower surface forming area 213b (in this embodiment, and the upper surface side connecting portion forming area 212) is exposed, and then the frame plate 300 after the frame forming process is fixed to the bus bar plate 200 with the second lower surface forming area 213b (in this embodiment, and the upper surface side connecting portion forming area 212) exposed.

[0176] Instead of this, the laser irradiation step may be performed after the plate fixing step.

[0177] That is, it is also possible to make the frame form the processing ( Figure 12 The frame body is fixed with a flat plate 300 after the bus bar side insulating layer forming step ( Figure 7 The bus bar flat plate 200 in the states shown in (a) and (b) is then subjected to the laser irradiation step on the bus bar flat plate 200 to which the frame flat plate 300 is fixed.

[0178] Furthermore, in this embodiment, the case of manufacturing the bus bar assembly 1 is described as an example, but the present invention can of course also be applied to the manufacturing of bus bar assemblies of other types.

[0179] exist Figure 14 (a) to (c) show a top view of the bus bar assembly 2A according to the first modification, a view along the Figure 14 Cross-sectional view and bottom view along line XIV(b)-XIV(b) in (a).

[0180] In addition, in the drawings, the same reference numerals are given to the same components as those in the present embodiment.

[0181] The bus bar assembly 2A according to the first modification example is different from the bus bar assembly 1 in that the upper surface-side laminated portion 21 is removed.

[0182] The manufacturing method of the bus bar assembly according to the first modification is changed in the following points compared to the manufacturing method according to the present embodiment.

[0183] That is, the busbar side insulating layer forming process is changed to: applying insulating resin paint in the gap 219 and the entire area of the lower surface 213 of the busbar assembly forming area 210 (and optionally on the side surface of the busbar assembly forming area 210) and curing it.

[0184] In addition, in the laser irradiation step, the laser irradiation to the upper surface 211 of the bus bar assembly forming area 210 is removed.

[0185] Furthermore, in the bus bar assembly 2A, the entire region of the upper surface 11 of the plurality of bus bars 10 (the first to third bus bars 10 ( 1 ) to 10 ( 3 )) surrounded by the frame 30 functions as the upper surface side connecting portion 12 .

[0186] exist Figure 15 (a) to (c) show a top view of the bus bar assembly 2B according to the second modification, a view along the Figure 15 Cross-sectional view and bottom view along line XV(b)-XV(b) in (a).

[0187] In the drawings, the same reference numerals are given to the same components as those in the present embodiment and the first modified example.

[0188] The bus bar assembly 2B according to the second modification example is different from the bus bar assembly 1 in that the plurality of bus bars 10 (the first to third bus bars 10 ( 1 ) to 10 ( 3 )) are changed to a plurality of bus bars 60 (the first to third bus bars 60 ( 1 ) to 60 ( 3 )).

[0189] That is, in the bus bar 10, the first lower surface region 13a extends over the entire periphery of the lower surface of the bus bar 60 (see FIG. Figure 1 (c), etc.).

[0190] In contrast, in the bus bar 60, as shown in FIG. Figure 15 As shown in (b) and (c), the first lower surface area 13a, which is located at the same position in the thickness direction as the lower end portion on the other side of the gap 19 in the thickness direction, exists only in the area along the side facing the gap 19 on the periphery of the lower surface 13 of the bus bar 60.

[0191] In addition, in the bus bar assembly 2B according to the second modified example, the side surface laminated portion 25 is removed.

[0192] exist Figure 16 (a) to (c) show a top view of a bus bar assembly 2C according to the third modification, a view along the Figure 16 Cross-sectional view and bottom view along line XVI(b)-XVI(b) in (a).

[0193] In the drawings, the same reference numerals are given to the same components as those in the present embodiment, the first modification, and the second modification.

[0194] The bus bar assembly 2C according to the third modification example differs from the bus bar assembly 1 in that the plurality of bus bars 10 (the first to third bus bars 10 (1) to 10 (3)) are changed to the plurality of bus bars 60 (the first to third bus bars 60 (1) to 60 (3)) and the upper surface side laminate portion 21 is removed.

[0195] That is, the bus bar assembly 2C according to the third modification is different from the bus bar assembly 2B according to the second modification in that the upper surface-side laminated portion 21 is removed.

[0196] Description of Reference Numerals

[0197] 10(1)~10(3) Bus bars 1~3

[0198] 11 Upper surface

[0199] 12 Upper surface side connection portion

[0200] 13 Lower surface

[0201] 13a 1st lower surface area

[0202] 13b Second lower surface area

[0203] 14 lower surface side connection portion

[0204] 15 side

[0205] 19(1), 19(2) 1st and 2nd gaps

[0206] 20 Busbar side insulation layer

[0207] 21 Upper surface side laminated portion

[0208] 22 Opening of the upper surface side laminated portion

[0209] 23 lower surface side laminated portion

[0210] 25 side laminated portion

[0211] 29 gap filling part

[0212] 30 frame

[0213] 40 frame side insulation layer

[0214] 60(1)~60(3) Busbars 1~3

[0215] 200 busbar flat plate

[0216] 210 busbar assembly forming area

[0217] 211 Upper surface of the busbar assembly forming area

[0218] 212 Upper surface side connection portion forming area

[0219] 213 lower surface of the busbar assembly forming area

[0220] 213a 1st lower surface forming area

[0221] 213b Second lower surface forming area

[0222] 213c The boundary between the first and second lower surface forming areas

[0223] 219(1), 219(2) 1st and 2nd gaps

[0224] 290 Laser

[0225] 300 frame with flat panel

[0226] 310 frame forming area

Claims

1. A method for manufacturing a busbar assembly, characterized in that: The busbar assembly comprises: a plurality of busbars formed of conductive flat plate-shaped members and arranged in the same plane with gaps between opposing side surfaces; and a busbar-side insulating layer comprising a gap-filling portion filled in the gaps and a lower surface-side laminated portion integrally extending from the gap-filling portion so as to be arranged on the lower surfaces of the plurality of busbars, at least a portion of the upper surface of the busbar is exposed to form an upper surface-side connecting portion, the lower surface of the busbar comprising a first lower surface region located at the same position in the thickness direction as the lower end of the gap and in which the lower surface-side laminated portion is provided, and a second lower surface region exposed to the outside at a position protruding toward the side opposite to the upper surface from the first lower surface region to form the lower surface-side connecting portion, the manufacturing method comprising: a step of preparing a bus bar flat plate made of a conductive metal including a bus bar assembly forming region, the bus bar assembly forming region having a planar outer shape corresponding to a bus bar connection body formed by connecting the plurality of bus bars via the bus bar-side insulating layer and having a thickness equal to a thickness between the upper surface and the second lower surface region; a thickness adjustment step of adjusting the thickness of the bus bar assembly forming region so that the thickness of a first lower surface forming region corresponding to the first lower surface region in the lower surface of the bus bar assembly forming region is consistent with the thickness between the upper surface of the bus bar and the first lower surface region; a slit forming step, performed before or after the thickness adjustment step, of forming one or more slits penetrating the bus bar assembly forming region in the thickness direction and having the same width as the gap, so as to partition a plurality of bus bar forming locations corresponding to the plurality of bus bars; a bus bar side insulating layer forming step of applying an insulating resin coating to at least the inside of the gap and the entire area of the lower surface of the bus bar assembly forming area, and curing the coating to form the bus bar side insulating layer; Laser irradiation process; and a cutting step of cutting the bus bar assembly forming area from the bus bar flat plate; In the bus bar assembly forming region, a portion of the lower surface of a bus bar forming portion forming one bus bar, at least in contact with another adjacent bus bar forming portion forming another bus bar, is defined as the first lower surface forming region. The laser irradiation process is constituted by: using a laser having an irradiation spot of a size set based on the width of a portion of the periphery of a bus bar forming portion that is connected to other adjacent bus bar forming portions, the laser is irradiated at least to the entire area of the second lower surface forming area corresponding to the second lower surface area and the boundary between the first lower surface forming area and the second lower surface forming area, so that the entire area of the second lower surface forming area is exposed within a range that is not irradiated into the gap.

2. The method for manufacturing a busbar assembly according to claim 1, wherein: The bus bar side insulating layer forming step provides an insulating layer on the entire upper surface of the bus bar assembly forming area in addition to the gap and the entire lower surface of the bus bar assembly forming area. The laser irradiation step is configured to irradiate a top surface connection portion forming region corresponding to the top surface connection portion on the top surface of the bus bar assembly forming region with laser light to expose the top surface connection portion forming region.

3. The method for manufacturing a busbar assembly according to claim 1 or 2, wherein: The bus bar plate integrally includes a plurality of bus bar assembly forming regions arranged in series in a first direction along the longitudinal direction of the slit and a connecting region connecting adjacent bus bar assembly forming regions. One longitudinal end of the slit formed in one bus bar assembly forming area extends laterally into a connecting area connected to one side of the bus bar assembly forming area in the first direction, and the other longitudinal end laterally extends laterally into a connecting area connected to the other side of the bus bar assembly forming area in the first direction.

4. The method for manufacturing a busbar assembly according to claim 1 or 2, wherein: The process comprises a frame forming process, which is performed before or after the process from the step of preparing the bus bar plate to the laser irradiation process, or simultaneously with the process; and a plate fixing process, which is performed after the frame forming process and the bus bar side insulating layer forming process. The frame forming process includes: a step of preparing a conductive metal frame flat plate including a frame forming region, the frame forming region having a planar shape corresponding to the bus bar assembly forming region; a punching step of punching out the center of the frame forming region so that when the frame forming region is overlapped with the bus bar assembly forming region, at least the upper surface side connection portion forming region corresponding to the upper surface side connection portion is exposed upward in a state of being surrounded in a plan view; and The frame side insulating layer forming step comprises applying an insulating resin coating to at least the lower surface of the frame forming region in a state where the center is punched out, and curing the coating to form the frame side insulating layer. The plate fixing step is configured to fix the lower surface of the frame forming region after the frame forming process to the upper surface of the bus bar assembly forming region after the bus bar side insulating layer forming process. The cutting step is configured to cut the bus bar assembly forming region and the frame body forming region in a fixed state from the bus bar flat plate and the frame body flat plate after the flat plate fixing step.

5. The method for manufacturing a busbar assembly according to claim 4, wherein: The bus bar plate integrally includes a plurality of bus bar assembly forming regions arranged in series in a first direction along the longitudinal direction of the slit and a connecting region connecting adjacent bus bar assembly forming regions. One end of the slit formed in a bus bar assembly forming region extends laterally toward a connection region connected to one side of the bus bar assembly forming region in the first direction, and the other end of the slit in the longitudinal direction extends laterally toward a connection region connected to the other side of the bus bar assembly forming region in the first direction. The frame plate integrally includes a plurality of frame forming regions arranged in series in the first direction at the same pitch as the plurality of bus bar assembly forming regions, and a connecting region connecting the frame forming regions adjacent to each other in the first direction.

6. The method for manufacturing a busbar assembly according to claim 4, wherein: The plate fixing step is performed after the laser irradiation step.

7. The method for manufacturing a busbar assembly according to claim 5, wherein: The plate fixing step is performed after the laser irradiation step.

8. The method for manufacturing a busbar assembly according to claim 4, wherein: The laser irradiation step is performed after the plate fixing step.

9. The method for manufacturing a busbar assembly according to claim 5, wherein: The laser irradiation step is performed after the plate fixing step.

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