Ultra-thin superhigh pressure resistant optical fiber packaging element and packaging method thereof

Abstract

The present application relates to the technical field of optical fiber packaging, in particular to an ultrathin superhigh pressure resistant optical fiber packaging element and a packaging method thereof, comprising a pressure bearing area and a transition area, the pressure bearing area is symmetrically arranged on both sides of the transition area, and the pressure bearing area and the transition area are integrated by water-based polyurethane bonding; wherein the optical fiber is packaged in the transition area by water-based polyurethane, and the pressure bearing area is bonded by quartz sand and water-based polyurethane. The thickness of the ultrathin superhigh pressure resistant optical fiber packaging element can reach 0.3mm, and at the same time, it has super strong compression resistance, and the compression strength can withstand 540Mpa superhigh pressure. Moreover, during the pressurization process within 400Mpa strength, the optical fiber only has 0.01-0.02dBm optical loss, which does not affect the transmission performance of the optical fiber under the action of superhigh pressure. Therefore, the optical fiber packaging element can be normally used under the condition that the space size is limited and at the same time, it can withstand superhigh pressure, which lays a foundation for the development of the field of optical fiber packaging technology.

Description

Technical Field

[0001] This invention relates to the field of optical fiber packaging technology, and in particular to an ultra-thin, ultra-high voltage resistant optical fiber packaging element and its packaging method. Background Technology

[0002] In recent years, with the development and maturation of fiber optic technology, fiber optic sensing technology has experienced rapid growth. Fiber optic sensors utilize optical fibers to modulate the optical wave parameters transmitted within the fiber, and then demodulate and detect the modulated optical signal to obtain the measurement result. Fiber optic sensors offer advantages such as simple and reliable manufacturing processes, strong resistance to electromagnetic interference, corrosion resistance, high integration, low signal attenuation, and the ability to operate underwater without a power supply. They are widely used in various fields including civil engineering, machinery, medicine, aerospace, resource extraction and transportation, geological and structural monitoring, and infrastructure safety monitoring.

[0003] However, bare optical fibers are very fragile. Without encapsulation and protection, they are prone to a significant drop in optical power under certain high-voltage conditions, which can affect the monitoring effect or even cause breakage, rendering the optical fiber unusable.

[0004] For example, the HP-RTM (High Pressure Resin Molding) process requires extremely high airtightness. Using small optical fibers enables non-destructive monitoring of the molding process. However, due to the extremely high airtightness requirements of the HP-RTM process, the upper and lower molds must fit tightly together during operation, and the pressure generated at the mold edges due to mold clamping is extremely high. If unencapsulated optical fibers are used under such conditions, they will break, rendering the optical fibers ineffective for internal condition monitoring.

[0005] Therefore, in many similar situations, bare optical fibers must be protectively encapsulated to adapt to the operating conditions of the object being measured. Appropriate encapsulation of fiber optic sensors, along with the selection of suitable encapsulation materials and reasonable encapsulation processes, can improve the sensor's survivability and lifespan in various environments, ensure the compatibility of the encapsulated fiber optic sensor with the substrate material, reduce optical loss, and improve the accuracy and reliability of monitoring results. Currently, commonly used protective encapsulation methods include polyurethane encapsulation and metal tube encapsulation.

[0006] Polyurethane (PU) is a polymer with repeating urethane segments, produced by the reaction of isocyanate and polyol. Its main characteristic is the presence of multiple repeating urethane groups in its molecular chain. It combines the elasticity of rubber with the strength and excellent processability of plastics, thus possessing the dual advantages of both. Using polyurethane encapsulation in fiber optic sensors not only overcomes the compatibility issues between different materials but also protects the optical fiber, extending its lifespan.

[0007] However, thin fiber optic encapsulation elements made of pure polyurethane have the disadvantage of low compressive strength, making them unsuitable for use under high-pressure conditions. If the thickness of the fiber optic encapsulation element is forcibly increased by increasing the amount of polyurethane used, thereby improving the compressive strength, it becomes difficult to use in situations where space is limited. For example, in the HP-RTM molding process, it is difficult to meet the airtightness requirements when using thicker polyurethane fiber optic encapsulation elements.

[0008] Metal tube encapsulation refers to encapsulating fiber optic sensors within a metal tube to extend the lifespan of the fiber optic cable. While this method significantly increases the compressive strength of the fiber optic encapsulation element, and the temperature sensitivity is improved to some extent due to the different coefficients of thermal expansion between metal and fiber, metal tube encapsulation suffers from drawbacks such as higher cost, greater operational complexity, and, like thicker polyurethane encapsulation, its larger size makes it difficult to meet the airtightness requirements of the HP-RTM molding process. This limits its application in situations with limited space, and metal tube encapsulation is also unable to withstand exceptionally high pressures.

[0009] Therefore, this invention is proposed. Summary of the Invention

[0010] The purpose of this invention is to provide an ultra-thin, ultra-high pressure resistant optical fiber packaging element and its packaging method. The thickness of the prepared ultra-thin, ultra-high pressure resistant optical fiber packaging element can reach as thin as 0.3 mm, and it also has excellent pressure resistance.

[0011] The present invention provides an ultra-thin, ultra-high voltage resistant optical fiber packaging element, comprising a pressure-bearing region and a transition region, wherein the pressure-bearing region is symmetrically arranged on both sides of the transition region, and the pressure-bearing region and the transition region are bonded together by water-based polyurethane.

[0012] The optical fiber is encapsulated in the transition zone by water-based polyurethane, and the pressure-bearing zone is formed by bonding quartz sand and water-based polyurethane.

[0013] As a preferred embodiment of this technical solution, the height of the pressure-bearing zone is 0.3-0.5 mm.

[0014] As a preferred embodiment of this technical solution, the particle size of the quartz sand is 0.075-0.15mm.

[0015] As a preferred embodiment of this technical solution, a protective sleeve is provided on the outer side of the optical fiber, and the protective sleeve is encapsulated in the transition area by water-based polyurethane.

[0016] This invention also discloses a packaging method for the above-mentioned ultra-thin, ultra-high voltage resistant optical fiber packaging element, specifically including the following steps:

[0017] S1. Prepare a U-shaped packaging mold;

[0018] S2. Straighten the optical fiber and place it in the middle of the encapsulation mold;

[0019] S3. Lay a layer of quartz sand in the recess of the packaging mold and encapsulate it with water-based polyurethane.

[0020] S4. Cool and mold to obtain an ultra-thin, ultra-high voltage resistant optical fiber packaged component.

[0021] In a preferred embodiment of this technical solution, in step S1, the packaging mold includes a polytetrafluoroethylene (PTFE) plate and a first PTFE tape layer and a second PTFE tape layer spaced apart on the PTFE plate. The first PTFE tape layer is symmetrically arranged on both sides of the second PTFE tape layer, wherein the height of the first PTFE tape layer is greater than that of the second PTFE tape layer.

[0022] As a preferred embodiment of this technical solution, step S2 specifically includes: straightening the optical fiber and placing it at the axis of the second polytetrafluoroethylene tape layer, pre-tightening both ends of the optical fiber with tape, and sealing both ends of the encapsulation mold with clay.

[0023] As a preferred embodiment of this technical solution, step S3 specifically includes: laying quartz sand in the depression between the first polytetrafluoroethylene tape layer and the second polytetrafluoroethylene tape layer, wherein the thickness of the quartz sand is the same as the thickness of the second polytetrafluoroethylene tape layer; continuing to pour water-based polyurethane into the depression between the two first polytetrafluoroethylene tape layers, and scraping off the excess water-based polyurethane based on the height of the first polytetrafluoroethylene tape layer.

[0024] As a preferred embodiment of this technical solution, step S2 specifically includes: placing the optical fiber with a protective sleeve on its outer side at the center of the second polytetrafluoroethylene tape layer.

[0025] As a preferred embodiment of this technical solution, the thickness of the ultra-thin, high-voltage-resistant optical fiber packaging element is the same as the thickness of the second polytetrafluoroethylene tape layer.

[0026] The ultra-thin, ultra-high voltage resistant optical fiber packaging element of the present invention has at least the following technical effects:

[0027] 1. The ultra-thin, ultra-high-pressure resistant optical fiber encapsulation element of the present invention includes a pressure-bearing region and a transition region. The pressure-bearing region and the transition region, symmetrically arranged on both sides of the transition region, are bonded together by water-based polyurethane. The optical fiber is encapsulated in the transition region by water-based polyurethane, while the pressure-bearing region is formed by bonding quartz sand and water-based polyurethane. Therefore, this optical fiber encapsulation element mainly has a "U"-shaped structure. The protruding pressure-bearing regions on both sides are mainly used to withstand pressure, effectively protecting the optical fiber in the transition region. The optical power changes very little under enormous pressure, effectively ensuring the transmission of optical signals in a high-pressure environment and meeting the requirements for optical fiber use under ultra-high-pressure conditions.

[0028] 2. The pressure-bearing zone is physically composited with waterborne polyurethane and quartz sand. On the one hand, the adhesion of waterborne polyurethane can ensure that the quartz sand will not undergo large displacement during the preparation process. On the other hand, because quartz sand has excellent compressive strength, the compressive strength of the pressure-bearing zone with the addition of quartz sand and waterborne polyurethane composite material is significantly improved.

[0029] 3. The ultra-thin, ultra-high-pressure resistant optical fiber packaging element of this invention can be as thin as 0.3 mm, while simultaneously possessing superior compressive strength. Its compressive strength can withstand ultra-high pressures of 540 MPa, and during pressurization up to 400 MPa, the optical fiber experiences only 0.01-0.02 dBm of optical loss, completely unaffected by the fiber's transmission performance under ultra-high pressure. Therefore, the optical fiber packaging element of this invention can be used normally even under space constraints and ultra-high pressure conditions, providing a reference for the development of optical fiber packaging technology. Attached Figure Description

[0030] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0031] Figure 1 This is a model of the ultra-thin, ultra-high voltage resistant optical fiber packaging element of the present invention;

[0032] Figure 2 This is a schematic diagram of the packaging mold used in the ultra-thin, ultra-high voltage resistant optical fiber packaging element of the present invention;

[0033] Figure 3 This is a right view of the packaging mold used for the ultra-thin, ultra-high voltage resistant optical fiber packaging element of the present invention.

[0034] Figure 4 This is a schematic diagram illustrating the fabrication process of the ultrathin, ultra-high voltage resistant optical fiber packaging element of the present invention.

[0035] Figure 5 This is a schematic diagram of the ultra-thin, ultra-high voltage resistant optical fiber packaging element of the present invention;

[0036] Figure 6 This is a schematic diagram of the operation of the ultra-thin, ultra-high voltage resistant optical fiber packaging element of the present invention at the edge of the HP-RTM mold;

[0037] Figure 7 This is a graph showing the relationship between fiber power and pressure in the ultra-thin, ultra-high pressure resistant optical fiber packaging element prepared in Example 1 of the present invention.

[0038] Figure 8 The graph shows the relationship between optical power and pressure under a 2mm pure polyurethane package.

[0039] Explanation of reference numerals in the attached figures:

[0040] 1: Pressure zone; 2: Transition zone; 3: Optical fiber; 4: Quartz sand; 5: Waterborne polyurethane; 6: Polytetrafluoroethylene (PTFE) sheet; 7: First PTFE tape layer; 8: Second PTFE tape layer; 9: HP-RTM upper mold; 10: HP-RTM lower mold. Detailed Implementation

[0041] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0043] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified. Furthermore, the terms "installed," "connected," and "linked" should be interpreted broadly; for example, they may refer to a fixed connection, a detachable connection, or an integral connection; they may refer to a mechanical connection or an electrical connection; they may refer to a direct connection or an indirect connection through an intermediate medium; and they may refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0044] Example 1

[0045] like Figure 1-6 As shown, this embodiment provides an ultra-thin, ultra-high-pressure resistant optical fiber packaging element, including a pressure-bearing region 1 and a transition region 2. The pressure-bearing region 1 is symmetrically arranged on both sides of the transition region 2, and the pressure-bearing region 1 and the transition region 2 are bonded together by water-based polyurethane 5. The optical fiber 3 is encapsulated in the transition region 2 by water-based polyurethane 5, and the pressure-bearing region 1 is formed by bonding quartz sand 4 and water-based polyurethane 5.

[0046] The optical fiber encapsulation element is mainly in the shape of a "U". The pressure-bearing areas 1 protruding on both sides are mainly used to withstand pressure, so that the optical fiber 3 in the transition area 2 can be effectively protected. The optical power changes very little under huge pressure conditions, which effectively ensures the transmission of optical signals in the optical fiber 3 under high pressure environment and meets the usage requirements of the optical fiber 3 under ultra-high pressure conditions.

[0047] Among them, waterborne polyurethane 5 is a polymer material that not only possesses some of the important performance characteristics of polyurethane, but is also non-toxic, pollution-free, and more environmentally friendly. It can cure at room temperature, has low viscosity and good fluidity, and can fully combine with quartz sand 4 for rapid molding. Quartz sand 4, widely used as a support material in the construction industry, has good compressive strength and low cost, but is prone to loosening. The physical composite of waterborne polyurethane 5 and quartz sand 4 ensures that the adhesive force of waterborne polyurethane 5 prevents significant displacement of quartz sand 4 during preparation. Furthermore, due to the excellent compressive strength of quartz sand 4, the compressive strength of the waterborne polyurethane 5 composite material with added quartz sand 4 is significantly improved. Using quartz sand 4 and waterborne polyurethane 5 as raw materials for optical fiber encapsulation results in optical fiber encapsulation elements with advantages such as thinness, high flexibility, simple molding, rapid preparation, and high compressive strength. This allows for use in applications with limited space and high pressure, solving the problem that the compressive strength and volume of existing optical fiber encapsulation processes cannot meet certain specific working conditions.

[0048] Based on the above technical solution, and more preferably, the height of the pressure-bearing area 1 is 0.3-0.5mm, and the height of the pressure-bearing area 1 is the thickness of the optical fiber packaging element. Therefore, in this embodiment, the thickness of the optical fiber packaging element can be as thin as 0.3mm.

[0049] The quartz sand used has a particle size of 0.075mm-0.15mm. Using this specification of quartz sand will not make the thickness of the prepared ultra-high voltage resistant optical fiber packaging element too thick, thus well meeting the needs of use in situations where space is limited.

[0050] As another embodiment, depending on the required thickness, a protective sleeve can be fitted over the outer side of the optical fiber 3. The protective sleeve is encapsulated in the transition region 2 by water-based polyurethane 5, providing further protection for the optical fiber 3 fitted with the protective sleeve. Specifically, the protective sleeve can be a polyimide tube with a diameter of 0.4 mm.

[0051] The packaging mold used to prepare the above-mentioned ultra-thin, ultra-high voltage resistant optical fiber packaging element is made of polytetrafluoroethylene (PTFE) plate 6 and PTFE tape. The self-lubricating and non-stick properties of PTFE plate 6 make it easier to remove the optical fiber packaging element from the mold, greatly reducing the probability of optical fiber damage caused by demolding. PTFE tape has strong adhesion and thinness, with a common thickness as thin as 0.05 mm. During the preparation process, the number of tape layers can be flexibly selected according to the required packaging thickness to obtain the required thickness of the optical fiber packaging element, thereby meeting the thickness requirements of different applications.

[0052] The present invention uses the above-mentioned packaging mold to prepare ultra-thin optical packaging elements with ultra-high pressure resistance of different thicknesses.

[0053] Example 2

[0054] Ultra-thin fiber optic packaging element with a thickness of 0.3mm and designed to withstand ultra-high voltage.

[0055] S21. Prepare a U-shaped packaging mold. Select a polytetrafluoroethylene (PTFE) plate 6 and attach two layers of PTFE tape with thicknesses of 0.25mm and 0.05mm respectively in the middle position, with a total thickness of 0.3mm, as the second PTFE tape layer 8; attach two layers of PTFE tape with a thickness of 0.25mm to both sides of the second PTFE tape layer 8, with a total thickness of 0.5mm, as the first PTFE tape layer 7.

[0056] S22. Straighten the optical fiber 3 and place it at the axis of the second polytetrafluoroethylene tape layer 8, and use the tape to pre-tighten both ends of the optical fiber 3 to prevent the optical fiber 3 from shifting during the preparation and curing process. Use clay to seal both ends of the encapsulation mold to control the flow of waterborne polyurethane 5.

[0057] S23. Quartz sand 4 is laid in the depression between the first polytetrafluoroethylene tape layer 7 and the second polytetrafluoroethylene tape layer 8. The quartz sand 4 is controlled by the second polytetrafluoroethylene tape layer 8 in the middle. The thickness of the quartz sand 4 on both sides is scraped to 0.3mm, which is the same as the second polytetrafluoroethylene tape layer 8, using a scraper. Water-based polyurethane 5 is poured into the depression between the two first polytetrafluoroethylene tape layers 7, and the excess water-based polyurethane 5 is scraped out based on the height of the first polytetrafluoroethylene tape layer 7.

[0058] S24. Cool and mold to obtain an ultra-thin, high-pressure-resistant fiber optic packaged component with a thickness of 0.3 mm.

[0059] Example 3

[0060] Ultra-thin, high-voltage resistant fiber optic packaged components with a protective sleeve, 0.5mm thick.

[0061] S31. To prepare a U-shaped packaging mold, a polytetrafluoroethylene (PTFE) plate 6 is selected, and two layers of PTFE tape with a thickness of 0.25 mm are attached to the middle position, with a total thickness of 0.5 mm, as the second PTFE tape layer 8; three layers of PTFE tape with a thickness of 0.25 mm are attached to both sides of the second PTFE tape layer 8, with a total thickness of 0.75 mm, as the first PTFE tape layer 7.

[0062] S32. Insert the optical fiber 3 into a polyimide protective sleeve with a diameter of 0.4 mm, straighten it and place it at the axis of the second polytetrafluoroethylene tape layer 8, and use tape to pre-tighten both ends of the optical fiber 3 to prevent the optical fiber 3 from shifting during the preparation and curing process. Use clay to seal both ends of the encapsulation mold to control the flow of waterborne polyurethane 5.

[0063] S33. Quartz sand 4 is laid in the depression between the first polytetrafluoroethylene tape layer 7 and the second polytetrafluoroethylene tape layer 8. The quartz sand 4 is controlled by the second polytetrafluoroethylene tape layer 8 in the middle. The thickness of the quartz sand 4 on both sides is scraped to 0.5mm, which is the same as the second polytetrafluoroethylene tape layer 8, using a scraper. Water-based polyurethane 5 is poured into the depression between the two first polytetrafluoroethylene tape layers 7, and the excess water-based polyurethane 5 is scraped out based on the height of the first polytetrafluoroethylene tape layer 7.

[0064] S34. Cool and mold to obtain an ultra-thin, ultra-high voltage resistant optical fiber encapsulation element with a protective sleeve and a thickness of 0.5mm.

[0065] Compare with Example 1

[0066] Using pure polyurethane encapsulation, a 2mm fiber optic encapsulation element was obtained.

[0067] The fiber optic packaging elements of Example 2 and Comparative Example 1 were used for HP-RTM forming process monitoring. The specific test steps are as follows:

[0068] Fiber optic sensors are installed inside the mold according to the monitoring area;

[0069] The pressure-bearing area of ​​optical fiber 3 is determined according to the parting surface of the mold. The pressure-bearing area is then fused with the optical fiber packaging element to ensure that the pressure-bearing area of ​​optical fiber 3 is protected by the packaging.

[0070] The other end of the fiber optic sensor is connected to the fiber optic demodulation device. After the connection is completed, the mold is closed and locked.

[0071] In Example 2, the area where the mold and the optical fiber packaging element are in direct contact, i.e. the pressure area of ​​the optical fiber 3, is protected by the packaging, which allows the optical signal to be transmitted normally.

[0072] At the same time, by Figure 7 The power-pressure relationship graph of the ultra-thin, ultra-high pressure resistant optical fiber encapsulation element 3 shows that the optical fiber encapsulation element prepared in Example 2 has superior compressive strength, capable of withstanding ultra-high pressure of 540 MPa. Furthermore, during pressurization up to 400 MPa, the optical fiber 3 exhibits only 0.01-0.02 dBm of optical loss. Compared to the pure polyurethane encapsulated optical fiber element in Comparative Example 1, its compressive strength is significantly improved. Figure 8 ).

[0073] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An ultra-thin, ultra-high voltage resistant optical fiber packaging element, characterized in that, It includes a pressure-bearing area (1) and a transition area (2), wherein the pressure-bearing area (1) is symmetrically arranged on both sides of the transition area (2), and the pressure-bearing area (1) and the transition area (2) are bonded together by water-based polyurethane (5); In this process, the optical fiber (3) is encapsulated in the transition zone (2) by water-based polyurethane (5), and the pressure-bearing zone (1) is formed by bonding quartz sand (4) and water-based polyurethane (5). The height of the pressure-bearing zone (1) is 0.3-0.5 mm; The particle size of the quartz sand (4) is 0.075-0.15 mm.

2. The ultra-thin, ultra-high voltage resistant optical fiber packaging element according to claim 1, characterized in that, The outer side of the optical fiber (3) is covered with a protective sleeve, which is encapsulated in the transition region (2) by water-based polyurethane (5).

3. The packaging method of the ultra-thin, ultra-high voltage resistant optical fiber packaging element according to any one of claims 1-2, characterized in that, Includes the following steps: S1. Prepare a U-shaped packaging mold; S2. Straighten the optical fiber (3) and place it in the middle of the packaging mold; S3. Lay a layer of quartz sand (4) in the recess of the encapsulation mold and encapsulate it with water-based polyurethane (5); S4. Cool and mold to obtain ultra-thin ultra-high pressure resistant optical fiber (3) encapsulation element.

4. The packaging method for the ultra-thin, ultra-high voltage resistant optical fiber packaging element according to claim 3, characterized in that, In step S1, the encapsulation mold includes a polytetrafluoroethylene plate (6) and a first polytetrafluoroethylene tape layer (7) and a second polytetrafluoroethylene tape layer (8) spaced apart on the polytetrafluoroethylene plate (6). The first polytetrafluoroethylene tape layer (7) is symmetrically arranged on both sides of the second polytetrafluoroethylene tape layer (8), wherein the height of the first polytetrafluoroethylene tape layer (7) is greater than that of the second polytetrafluoroethylene tape layer (8).

5. The packaging method for the ultra-thin, ultra-high voltage resistant optical fiber packaging element according to claim 4, characterized in that, Step S2 specifically includes: straightening the optical fiber (3) and placing it at the axis of the second polytetrafluoroethylene tape layer (8), and using tape to pre-tighten both ends of the optical fiber (3), and using clay to seal both ends of the encapsulation mold.

6. The packaging method for the ultra-thin, ultra-high voltage resistant optical fiber packaging element according to claim 4, characterized in that, Step S3 specifically includes: laying quartz sand (4) in the recess between the first polytetrafluoroethylene tape layer (7) and the second polytetrafluoroethylene tape layer (8), and the thickness of the quartz sand (4) is the same as the thickness of the second polytetrafluoroethylene tape layer (8); continuing to pour water-based polyurethane (5) into the recess between the two first polytetrafluoroethylene tape layers (7), and scraping off the excess water-based polyurethane (5) based on the height of the first polytetrafluoroethylene tape layer (7).

7. The packaging method for the ultra-thin, ultra-high voltage resistant optical fiber packaging element according to claim 4, characterized in that, Step S2 specifically includes: placing the optical fiber (3) with a protective sleeve on the outside at the center of the second polytetrafluoroethylene tape layer (8).

8. The packaging method for the ultra-thin, ultra-high voltage resistant optical fiber packaging element according to claim 4, characterized in that, The thickness of the ultra-thin, high-pressure resistant optical fiber (3) encapsulation element is the same as the thickness of the second polytetrafluoroethylene tape layer (8).

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