Laser direct writing system, method and device, and computer equipment

Abstract

The application relates to a laser direct writing system writing method and device and computer equipment. The laser direct writing system comprises an image sensing module, a galvanometer and a displacement table. The method comprises the following steps: determining a first relationship between a first distance of displacement table movement and a second distance of image sensing module pixel point corresponding movement; determining a second relationship between the galvanometer voltage and the writing length based on the first relationship and a preset coefficient; and writing a to-be-written file based on the second relationship. According to the application, the second relationship between the galvanometer voltage and the writing length is determined, the optimal system parameter in the current writing environment can be directly determined before writing, the galvanometer voltage is accurately controlled according to the length of the required writing, the accuracy of the actual writing length is effectively improved, the splicing misalignment problem possibly existing in multi-view field writing is solved, the writing accuracy can be effectively improved in the application scene of single-view field writing or large-area writing, and the writing success rate is further improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of laser direct writing technology, in particular to a laser direct writing system engraving method and device and computer equipment BACKGROUND

[0002] Laser direct writing technology is a maskless lithography technology that directly writes with laser. Compared with other lithography technologies, it has lower processing conditions and environmental requirements, and therefore has good industrial application scenarios. In laser direct writing technology, laser direct writing technology based on edge light suppression (PPI) can achieve higher resolution, and also has the advantages of small thermal effect, low threshold damage, and simple process flow. Micro-nano functional structures processed and manufactured using PPI technology have been applied in many modern scientific research fields, such as optical super surface processing, photonic bandgap device manufacturing, optical storage technology application, and biological engineering.

[0003] In related technologies, laser direct writing generally uses a galvanometer to drive a light beam to move step by step in a grating scanning manner to achieve small-range engraving. For example, edge light suppression technology is combined with a galvanometer to achieve pattern engraving by controlling the switching of light through an AOM, and the galvanometer is controlled to scan line by line while cooperating with a displacement table to achieve more precise engraving of the entire pattern. However, in related technologies, the galvanometer voltage affects the length of the engraving. If the control of the galvanometer voltage is not accurate enough, there will be errors in the length of the engraving, and the errors will be further amplified in micro-nano engraving, resulting in serious splicing problems in large-area engraving, which greatly affects the accuracy and success rate of the engraving. SUMMARY

[0004] Therefore, it is necessary to provide a laser direct writing system engraving method, device and computer equipment capable of improving the accuracy of engraving to solve the above technical problems.

[0005] In a first aspect, the present application provides a laser direct writing system engraving method. The laser direct writing system includes an image sensing module, a galvanometer, and a displacement table. The method includes:

[0006] determining a first relationship between a first distance moved by the displacement table and a second distance corresponding to the movement of a pixel point of the image sensing module;

[0007] determining a second relationship between the galvanometer voltage and the length of the engraving based on the first relationship and a preset coefficient;

[0008] engraving a to-be-engraved file based on the second relationship.

[0009] In one embodiment, the determination of the first relationship between the first distance moved by the displacement table and the second distance corresponding to the movement of the pixel point of the image sensing module includes:

[0010] controlling the galvanometer to write a first mark point, controlling the displacement table to move the first distance, and controlling the galvanometer to write a second mark point;

[0011] determining a first coordinate of the first mark point and a second coordinate of the second mark point in the image sensing module coordinate system;

[0012] determining the second distance based on the first coordinate and the second coordinate, and determining the first relationship as a ratio of the first distance to the second distance.

[0013] In one embodiment, the determining a second relationship between the galvanometer voltage and the writing length based on the first relationship and a preset coefficient comprises:

[0014] determining a preset voltage based on the preset coefficient, and controlling the galvanometer to write a first preset length of a first mark line based on the preset voltage;

[0015] determining a first line length of the first mark line in the image sensing module coordinate system, and determining an actual line length of the first mark line based on the first line length and the first relationship;

[0016] determining the second relationship based on the actual line length, the preset coefficient, and the first preset length.

[0017] In one embodiment, the determining the second relationship based on the actual line length, the preset coefficient, and the first preset length comprises:

[0018] determining a preset voltage coefficient based on the actual line length, the preset coefficient, and the first preset length;

[0019] controlling the writing length of the galvanometer to gradually increase from the first preset length based on the preset voltage coefficient and a preset step value, and determining a coefficient corresponding to each writing length, wherein the preset step value is the first preset length;

[0020] determining the second relationship based on the different writing lengths and the corresponding coefficients.

[0021] In one embodiment, the writing the file to be written based on the second relationship comprises:

[0022] determining a first included angle between the X-axis galvanometer direction and a horizontal axis of the displacement table coordinate system, wherein the displacement table coordinate system and the image sensing module coordinate system are located in the same plane;

[0023] writing the file to be written based on the second relationship and the first included angle.

[0024] In one embodiment, the determining the first included angle between the X-axis galvanometer direction and the horizontal axis of the displacement table coordinate system comprises:

[0025] After the galvanometer is controlled to write the third mark, the displacement stage is controlled to move a third distance along the horizontal axis of the displacement stage coordinate system, and the galvanometer is controlled to write the fourth mark.

[0026] Determine the third coordinate of the third mark point and the fourth coordinate of the fourth mark point in the coordinate system of the image sensing module;

[0027] Based on the third coordinate and the fourth coordinate, a second included angle between the horizontal axis of the image sensing module coordinate system and the horizontal axis of the displacement stage coordinate system is determined, and the first included angle is determined based on the second included angle.

[0028] In one embodiment, determining the first included angle based on the second included angle includes:

[0029] Control the galvanometer to write the second scribe line along the X-axis galvanometer direction;

[0030] Determine the start and end coordinates of the second scribe line in the coordinate system of the image sensing module.

[0031] Based on the starting point coordinates and the ending point coordinates, determine the third angle between the X-axis galvanometer direction and the horizontal axis of the image sensing module coordinate system;

[0032] The first included angle is determined based on the second included angle and the third included angle.

[0033] In one embodiment, writing the file to be written based on the second relationship and the first included angle includes:

[0034] Based on the field of view of a single inscription, the file to be inscribed is segmented to obtain at least one sub-file, wherein the at least one sub-file includes inscription data information and original inscription coordinates;

[0035] The galvanometer scanning distance is determined based on the inscribed data information, and the galvanometer voltage range is determined based on the second relationship and the galvanometer scanning distance;

[0036] The at least one sub-file is inscribed based on the first included angle, the original inscription coordinates, and the galvanometer voltage range.

[0037] In one embodiment, writing the at least one sub-file based on the first included angle, the original writing coordinates, and the galvanometer voltage range includes:

[0038] Based on the inscribed data information and the first included angle, the converted inscribed data is determined;

[0039] The at least one sub-file is written based on the converted writing data, the original writing coordinates, and the galvanometer voltage range.

[0040] In one embodiment, the step of writing the at least one sub-file based on the first included angle, the original writing coordinates, and the galvanometer voltage range further includes:

[0041] The coordinates to be written are determined based on the preset rotation center, the first included angle and the original writing coordinates, wherein the coordinates to be written include the writing start coordinates and the writing end coordinates that match the writing data information;

[0042] The at least one sub-file is written based on the coordinates to be written and the range of the galvanometer voltage.

[0043] Secondly, this application also provides a laser direct writing system writing apparatus. The laser direct writing system includes an image sensing module, a galvanometer, and a displacement stage; the apparatus includes:

[0044] The first relationship determination module is used to determine a first relationship between the first distance the displacement stage moves and the second distance the corresponding pixel of the image sensing module moves;

[0045] The second relationship determination module is used to determine the second relationship between the galvanometer voltage and the writing length based on the first relationship and preset coefficients.

[0046] The burning module is used to burn the file to be burned based on the second relationship.

[0047] Thirdly, this application also provides a computer device. The computer device includes a memory and a processor, the memory storing a computer program, and the processor executing the computer program to implement the laser direct-writing system inscription method described in any of the embodiments of the first aspect above.

[0048] Fourthly, this application also provides a computer-readable storage medium. The computer-readable storage medium stores a computer program thereon, which, when executed by a processor, implements the laser direct-writing system inscription method described in any of the embodiments of the first aspect above.

[0049] The aforementioned laser direct writing system, including the writing method, apparatus, and computer equipment, determines a first relationship between the first distance the displacement stage moves and the second distance the corresponding pixel of the image sensing module moves; based on the first relationship and preset coefficients, it determines a second relationship between the galvanometer voltage and the writing length; and based on the second relationship, it writes the file to be written. By determining the second relationship between the galvanometer voltage and the writing length, the galvanometer voltage can be precisely controlled according to the required writing length, effectively improving the accuracy of the actual writing length. This solves the splicing misalignment problem that may exist in multi-field writing, and can effectively improve the writing accuracy and thus the writing success rate in both single-field and large-area writing applications.

[0050] Details of one or more embodiments of this application are set forth in the following drawings and description to make other features, objects and advantages of this application more readily apparent. Attached Figure Description

[0051] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0052] Figure 1 This is a flowchart illustrating the laser direct writing system inscription method in one embodiment;

[0053] Figure 2 This is a schematic diagram of the target pattern to be inscribed in related technologies;

[0054] Figure 3 A schematic diagram of the actual pattern inscribed in the related technology;

[0055] Figure 4 This is a schematic diagram of the step of determining the second relationship in one embodiment;

[0056] Figure 5 This is a schematic diagram of the step of determining the first included angle in one embodiment;

[0057] Figure 6 A schematic diagram is provided for one embodiment;

[0058] Figure 7 A schematic diagram is provided for another embodiment;

[0059] Figure 8 This is a structural block diagram of the laser direct writing system's writing apparatus in one embodiment;

[0060] Figure 9 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0061] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0062] Unless otherwise defined, the technical or scientific terms used in this application shall have the general meaning as understood by one of ordinary skill in the art to which this application pertains. Words such as “a,” “an,” “an,” “the,” “the,” and “these,” used in this application, do not indicate quantitative limitation and may be singular or plural. The terms “comprising,” “including,” “having,” and any variations thereof used in this application are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that comprises a series of steps or modules (units) is not limited to the listed steps or modules (units) but may include steps or modules (units) not listed, or may include other steps or modules (units) inherent to such processes, methods, products, or devices. The terms “connected,” “linked,” and “coupled,” used in this application, are not limited to physical or mechanical connections but may include electrical connections, whether direct or indirect. The term “multiple” used in this application refers to two or more. The "and / or" operator describes the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can represent three cases: A alone, A and B simultaneously, and B alone. Typically, the character " / " indicates that the objects before and after it are in an "or" relationship. The terms "first," "second," and "third," etc., used in this application are merely for distinguishing similar objects and do not represent a specific ordering of the objects.

[0063] The terms “module”, “unit”, etc., used below refer to a combination of software and / or hardware that can perform a predetermined function. Although the apparatus described in the following embodiments is preferably implemented in hardware, implementation in software, or a combination of software and hardware, is also possible and contemplated.

[0064] Laser direct writing is a maskless photolithography technique that uses lasers to directly write data. Compared to other photolithography techniques, it has lower requirements for processing conditions and environment, and offers high processing resolution, low thermal impact, and a wide range of processable materials, making it suitable for industrial applications. In laser direct writing, two-photon polymerization (PPI) technology can improve processing accuracy, achieving the processing of mesoscopic objects at the mm-cm level while maintaining nm-µm level precision. In contrast, laser direct writing based on edge light suppression (PPI) is a three-dimensional direct-write photolithography technique that utilizes nonlinear optical effects to improve processing precision. It can achieve even higher resolution and also has advantages such as low thermal effect, low threshold damage, and simple process flow. Micro- and nano-functional structures fabricated using PPI technology have been applied in many modern scientific research fields, such as optical metasurface fabrication, photonic bandgap device manufacturing, optical storage technology applications, and bioengineering.

[0065] In related technologies, laser direct writing commonly employs a galvanometer-driven beam scanning and step-by-step movement to achieve small-area writing, combined with a displacement stage for large-area stitching. For example, edge light suppression technology is combined with a galvanometer, and a spatial light modulator (AOM) controls the switching of light to achieve pattern writing. Controlling the galvanometer to scan line by line, along with the displacement stage, allows for more refined pattern writing. However, in these technologies, the galvanometer voltage affects the writing length. Insufficiently precise control of the galvanometer voltage leads to errors in the writing length, which are further amplified in micro- and nano-writing, causing severe stitching problems in large-area writing and significantly impacting the accuracy and success rate. Furthermore, the presence of minute, difficult-to-correct angular errors between the writing direction and the displacement platform also significantly affects the writing success rate.

[0066] Based on this, such as Figure 1 As shown in the figure, this application provides a laser direct writing system method, the laser direct writing system including an image sensing module, a galvanometer, and a displacement stage, the method including:

[0067] S201: Determine a first relationship between the first distance the displacement stage moves and the second distance the corresponding pixel of the image sensing module moves.

[0068] In this embodiment, the image sensing module may include a camera device for acquiring the inscribed image and assisting in imaging. In some embodiments, the image sensing module may include a CCD (Charge-coupled Device) camera. The galvanometer may include an X-axis galvanometer and a Y-axis galvanometer, used to drive the optical scanning head based on control signals sent by the laser direct-writing system controller, so as to control the deflection of the laser beam in the XY plane. The displacement stage is used to move based on the position information in the file to be inscribed in order to cooperate with the galvanometer for inscription.

[0069] In this embodiment, by controlling the displacement stage to move a first distance and determining the second distance the corresponding pixel of the image sensing module moves, a first relationship between the first and second distances can be determined. The first distance can be used to describe the actual writing distance of the laser direct writing system. The second distance can be used to describe the distance the pixel moves corresponding to the actual writing distance during image imaging by the image sensing module. Therefore, the first relationship determined based on the first and second distances can be used to describe the relationship between the actual writing distance of the laser direct writing system and the corresponding moving distance of the pixel of the image sensing module.

[0070] In this embodiment, the method for determining the first relationship may include: after marking a first mark, controlling the displacement stage to move a first distance and then marking a second mark; determining the distance between the first mark and the second mark in the coordinate system of the image sensing module as a second distance; and then determining the ratio of the first distance to the second distance as the first relationship. In other embodiments, the method for determining the first relationship may further include: simultaneously controlling the displacement stage to move a first distance and marking lines; determining the length of the marked line in the coordinate system of the image sensing module as the second distance; and then determining the ratio of the first distance to the second distance as the first relationship. In other embodiments, it is understood that the ratio of the second distance to the first distance may also be used to determine the first relationship.

[0071] S203: Determine the second relationship between the galvanometer voltage and the writing length based on the first relationship and the preset coefficient.

[0072] In this embodiment of the application, in order to improve the accuracy of writing, a second relationship between the galvanometer voltage and the writing length can be determined. During the writing process, the galvanometer voltage is precisely controlled based on the actual writing length and the second relationship, so as to achieve precise control of the writing length.

[0073] In this embodiment, the preset coefficient may include a pre-set relationship coefficient between the galvanometer voltage and the writing length. Determining the second relationship based on the first relationship and the preset coefficient may include determining a preset galvanometer voltage according to the preset coefficient and the pre-writing length, controlling the galvanometer to etch lines with the preset galvanometer voltage, determining the length of the etched line in the coordinate system of the image sensing module, and then determining the actual etched line length according to the first relationship and the length in the coordinate system of the image sensing module. It is understood that the ratio between the actual etched line length and the pre-writing length can be used to correct the preset coefficient to determine the second relationship. In some embodiments, the ratio of this ratio to the preset coefficient can be determined as the second relationship. In other embodiments, based on the corrected preset coefficient, the etched line length can be gradually increased with the pre-writing length as a step value to determine the corrected preset coefficient corresponding to different etched line lengths, and then the different corrected preset coefficients can be fitted to the second relationship to further improve the etch accuracy.

[0074] S205: Write the file to be written based on the second relationship.

[0075] In this embodiment, the galvanometer can be controlled to write the document to be written based on a second relationship. The actual length to be written can be determined based on the writing data information contained in the document, thereby determining the actual scanning distance of the galvanometer. The writing data information may include a writing data matrix. After determining the second relationship, the preset voltage of the galvanometer can be determined based on the actual scanning distance and the second relationship. In some embodiments, the preset voltage V can be determined based on the product of the second relationship and the actual scanning distance. By controlling the galvanometer to scan within a voltage range of [-V / 2, +V / 2], the required actual writing length can be accurately determined.

[0076] In this embodiment, by determining the second relationship between the galvanometer voltage and the writing length, the galvanometer voltage can be precisely controlled according to the required writing length, effectively improving the accuracy of the actual writing length. This solves the splicing misalignment problem that may exist in multi-field writing. Whether writing within a single field of view or in large-area writing applications, it can effectively improve the writing accuracy, thereby increasing the writing success rate. On the other hand, in the original writing process of related technologies, specific writing and splicing writing experiments need to be performed in advance, and then the laser direct writing system needs to be adjusted according to the actual error. In this embodiment, the optimal system parameters in the current writing environment can be determined directly before writing. Writing based on the determined second relationship between the galvanometer voltage and the writing length can more accurately control the length of the writing line, conveniently and quickly solve the splicing error problem, and avoid writing errors caused by differences in each writing environment and external influencing factors such as intermediate links, thus effectively improving writing efficiency.

[0077] In this embodiment of the application, determining the first relationship between the first distance the displacement stage moves and the second distance the corresponding pixel of the image sensing module moves in step S201 includes:

[0078] S301: After controlling the galvanometer to write the first mark, control the displacement stage to move the first distance, and control the galvanometer to write the second mark.

[0079] S303: Determine the first coordinate of the first mark and the second coordinate of the second mark in the coordinate system of the image sensing module.

[0080] S305: Determine the second distance based on the first coordinate and the second coordinate, and determine the ratio of the first distance to the second distance as the first relationship.

[0081] In this embodiment of the application, controlling the galvanometer for writing may include controlling the galvanometer to scan and controlling the laser for writing via an AOM (Acousto-Optic Modulator). For the sake of brevity, this application refers to it as controlling the galvanometer for writing. Figure 4 As shown, after the galvanometer writes the first mark A, the displacement stage is moved a first distance D1, and the galvanometer is then controlled to write the second mark B. For ease of understanding, Figure 4 The embodiment shown depicts a first distance D1 moved along the X-axis of the displacement stage coordinate system. In other embodiments, the displacement stage may move in other directions, and the direction of movement of the displacement stage does not affect the implementation of this embodiment. The first coordinate (X) of the first point A is determined in the image sensing module coordinate system. l0 Y l0 ) and the second coordinate (X) of the second point B l1 Y l1 The image sensing module coordinate system is a Cartesian coordinate system within the imaging screen. The positive X-axis of the image sensing module coordinate system is rotated 90 degrees clockwise to coincide with the positive Y-axis. Based on the first coordinate (X... l0 Y l0 ) and second coordinate (X) l1 Y l1 The second distance D2 can be determined according to equation (1):

[0082]

[0083] Where D2 is the distance between the first mark A and the second mark B in the coordinate system of the image sensing module, and X... l0 Y l0 These are the x and y coordinates of the first point A in the coordinate system of the image sensing module, respectively. l1 Y l1 These are the x and y coordinates of the second point B in the coordinate system of the image sensing module, respectively. Based on the first distance D1 and the second distance D2, the first relationship Pixel can be determined according to equation (2). ccd :

[0084]

[0085] Among them, Pixel ccd This is the first relationship between the first distance D1 that the displacement stage moves and the second distance D2 that the corresponding pixel of the image sensing module moves.

[0086] The method for determining the second relationship is described below through embodiments of this application. In step S203, determining the second relationship between the galvanometer voltage and the writing length based on the first relationship and preset coefficients includes:

[0087] S401: Determine a preset voltage based on the preset coefficient, and control the galvanometer to write a first etch line of a first preset length based on the preset voltage.

[0088] S403: Determine the first line length of the first etched line in the coordinate system of the image sensing module, and determine the actual line length of the first etched line based on the first line length and the first relationship.

[0089] S405: Determine the second relationship based on the actual line length, the preset coefficient, and the first preset length.

[0090] In this embodiment, the preset voltage may include a preset voltage range, and the galvanometer may include an X-axis galvanometer and / or a Y-axis galvanometer. In some embodiments, a preset coefficient γ is set, and the X-axis galvanometer is controlled to write a first scribe line of a first preset length d based on the preset coefficient γ, wherein the preset voltage is set to [-γd / 2, γd / 2]. The first line length d of the first scribe line in the coordinate system of the image sensing module is determined. ccd And determine the actual length L of the first etched line according to equation (3):

[0091] L = d ccd *Pixel ccd (3)

[0092] Where L is the actual length of the first marking line, and d ccd Pixel is the first line length of the first scribe line in the coordinate system of the image sensing module. ccd The first relationship is determined according to equation (2). After determining the actual length of the first scribe line, the second relationship k can be obtained by correcting the preset coefficient γ according to equation (4):

[0093] k=γd / L (4)

[0094] Where k represents the second relationship between the galvanometer voltage and the marking length, L represents the actual length of the first marking line determined according to equation (3), γ represents a preset coefficient, and d represents the first preset length of the first marking line. The method for determining the second relationship of the Y-axis galvanometer in this embodiment is similar to the method for determining the second relationship of the X-axis galvanometer described above, and will not be repeated here.

[0095] To further improve the accuracy of the second relationship between the galvanometer voltage and the writing length, in this embodiment of the application, determining the second relationship based on the actual line length, the preset coefficient, and the first preset length in step S405 further includes:

[0096] S501: Determine the preset voltage coefficient based on the actual line length, preset coefficient, and first preset length.

[0097] S503: Based on the preset voltage coefficient and preset step value, control the writing length of the galvanometer to gradually increase from the first preset length, and determine the coefficients corresponding to different writing lengths respectively, wherein the preset step value is the first preset length.

[0098] S505: Determine the second relationship based on the different writing lengths and the corresponding coefficients.

[0099] In this embodiment, the second relationship k determined by the actual line length L, the preset coefficient γ, and the first preset length d in equation (4) is used as the preset voltage coefficient, and the first preset length d is set as the preset step value Δd. The X-axis galvanometer is controlled to continuously etch lines with Δd as the preset step value until the maximum etch range is reached, and then the voltage coefficients corresponding to different etch lengths are calculated. The maximum etch range may include the maximum scanning range of the galvanometer. In other embodiments, the maximum etch range may also include the maximum line length that can be displayed within a single field of view.

[0100] In this embodiment of the application, determining the second relationship based on the different inscription lengths and corresponding coefficients may include determining a set of coefficients based on the coefficients corresponding to the different inscription lengths, and determining the second relationship by fitting using the least squares method. In some embodiments, the second relationship f(x) can be determined according to equation (5):

[0101] f(x) = a0 + a1x + a2x 2 +a3x 3 +...+a n x n (5)

[0102] Where f(x) represents the second relationship between the mirror voltage and the writing length, and a0, a1, ..., a n Here, x represents the inscription length, and n represents the order. The method for determining the second relationship of the Y-axis galvanometer in this embodiment is similar to the method for determining the second relationship of the X-axis galvanometer described above, and will not be repeated here.

[0103] In related technologies, a minute angular error exists between the inscription direction and the displacement platform, which is difficult to correct. This angular error, amplified during inscription, will significantly affect the success rate of inscription. In related technologies, such as... Figure 2 The image shows the target engraving pattern for the file to be engraved. Due to the horizontal axis X of the displacement stage coordinate system... 位移台 Due to angular errors in the scanning direction, patterns directly engraved using a laser engraving system will appear as... Figure 3 As shown, when the angle error is magnified, there will be blank and overlapping areas during the engraving process, which will be significantly different from the target engraving pattern, resulting in a low engraving success rate.

[0104] Based on this, in order to further improve the writing accuracy and writing success rate, in this embodiment of the application, step S205, the writing of the file to be written based on the second relationship includes:

[0105] S601: Determine the first angle between the X-axis galvanometer direction and the horizontal axis of the displacement stage coordinate system, wherein the displacement stage coordinate system and the image sensing module coordinate system are located in the same plane.

[0106] S603: Write the file to be written based on the second relationship and the first included angle.

[0107] In this embodiment, the angle between the galvanometer scanning direction and the displacement stage moving direction may cause errors in the actual writing process. Therefore, by determining the first angle between the X-axis galvanometer direction and the horizontal axis of the displacement stage coordinate system, and then writing the file to be written based on the second relationship between the galvanometer voltage and the writing length and the first angle, the writing error can be effectively reduced and the writing accuracy improved. The displacement stage coordinate system and the image sensing module coordinate system are located in the same plane and are both Cartesian coordinate systems within the imaging screen. The positive X-axis of the displacement stage coordinate system coincides with the positive Y-axis after rotating 90 degrees clockwise.

[0108] In this embodiment of the application, in step S601, determining the first angle between the X-axis galvanometer direction and the horizontal axis of the displacement stage coordinate system includes:

[0109] S701: After controlling the galvanometer to write the third mark, control the displacement stage to move a third distance along the horizontal axis of the displacement stage coordinate system, and control the galvanometer to write the fourth mark.

[0110] S703: Determine the third coordinate of the third mark and the fourth coordinate of the fourth mark in the coordinate system of the image sensing module.

[0111] S705: Based on the third coordinate and the fourth coordinate, determine the second included angle between the horizontal axis of the image sensing module coordinate system and the horizontal axis of the displacement stage coordinate system, and determine the first included angle based on the second included angle.

[0112] In the embodiments of this application, such as Figure 5 As shown, after the galvanometer marks the third mark C, the displacement stage is controlled to move along the horizontal axis X of the displacement stage coordinate system. 位移台 Move the third distance D3 and control the galvanometer to write the fourth mark D. Determine the third coordinate (X, Y) of the third mark C in the image sensing module coordinate system. l3 Y l3 ) and the fourth coordinate (X) of the fourth point D l4 Y l4 Based on the third coordinate (X) l3 Y l3) and the fourth coordinate (X) l4 Y l4 The second included angle α can be determined according to equation (6):

[0113]

[0114] Where α is the horizontal axis X of the coordinate system of the image sensing module. 图像传感模块 and the horizontal axis X of the displacement stage coordinate system 位移台 The second included angle, X l3 Y l3 These are the x and y coordinates of the third point C in the coordinate system of the image sensing module, respectively. l4 Y l4 These are the x-coordinate and y-coordinate of the fourth point D in the coordinate system of the image sensing module, respectively.

[0115] In other embodiments, such as Figure 5 As shown, determine the X-axis galvanometer direction X. 振 With respect to the horizontal axis X of the displacement stage coordinate system 位移台 The first included angle may also include controlling the galvanometer along the Y-axis. 振 After marking the third marking line l1 in the direction, control the displacement stage along the horizontal axis X of the displacement stage coordinate system. 位移台 Move the third distance D3 and control the galvanometer along the Y-axis. 振 The fourth etch line l2 is written in the direction, and the starting point coordinates (X, Y, F) of the third etch line l1 are determined in the coordinate system of the image sensing module. l3 Y l3 ) and the starting point coordinates (X) of the fourth scribe line l2 l4 Y l4 Based on the starting point coordinates (X) of the third scribe line l1 l3 Y l3 ) and the starting point coordinates (X) of the fourth scribe line l2 l4 Y l4 ), determine the horizontal axis X of the coordinate system of the image sensing module. 图像传感模块 and the horizontal axis X of the displacement stage coordinate system 位移台 The second included angle α is used to determine the first included angle θ.

[0116] In this embodiment of the application, in step S705, determining the first included angle based on the second included angle includes:

[0117] S801: Control the galvanometer to write the second scribe line along the X-axis galvanometer direction.

[0118] S803: Determine the starting point coordinates and ending point coordinates of the second scribe line in the coordinate system of the image sensing module.

[0119] S805: Based on the starting point coordinates and the ending point coordinates, determine the third angle between the X-axis galvanometer direction and the horizontal axis of the image sensing module coordinate system.

[0120] S807: Determine the first included angle based on the second included angle and the third included angle.

[0121] In the embodiments of this application, such as Figure 5 As shown, the galvanometer is controlled along the X-axis. 振 The second etched line l3 is inscribed in the direction of the image sensing module coordinate system, and the starting coordinates (X0, Y0) and ending coordinates (X1, Y1) of the second etched line l3 are determined. Based on the starting coordinates (X0, Y0) and ending coordinates (X1, Y1) of the second etched line l3, the third included angle β can be determined according to equation (7):

[0122]

[0123] Where β is the X-axis mirror direction X. 振 The coordinate system of the image sensing module is related to the horizontal axis X. 图像传感模块 The third included angle, X0 and Y0 are the x and y coordinates of the starting point of the second scribe line l3 in the coordinate system of the image sensing module, respectively, and X1 and Y1 are the x and y coordinates of the ending point of the second scribe line l3 in the coordinate system of the image sensing module, respectively. After determining the third included angle β, the first included angle θ can be determined according to equation (8):

[0124] θ=α+β (8)

[0125] Where θ is the first angle between the X-axis galvanometer direction and the horizontal axis of the displacement stage coordinate system, α is the second angle between the horizontal axis of the image sensing module coordinate system and the horizontal axis of the displacement stage coordinate system, and β is the third angle between the X-axis galvanometer direction and the horizontal axis of the image sensing module coordinate system.

[0126] In this embodiment of the application, writing the file to be written based on the second relationship and the first included angle can effectively improve the writing accuracy and writing success rate. In step S603, writing the file to be written based on the second relationship and the first included angle includes:

[0127] S901: Based on the field of view of a single writing operation, the file to be written is segmented to obtain at least one sub-file, wherein the at least one sub-file includes writing data information and original writing coordinates.

[0128] S903: Determine the galvanometer scanning distance based on the inscription data information, and determine the galvanometer voltage range based on the second relationship and the galvanometer scanning distance.

[0129] S905: Write the at least one sub-file based on the first included angle, the original writing coordinates, and the galvanometer voltage range.

[0130] In this embodiment, the inscription data information may include an inscription data matrix. The field of view for a single inscription is determined based on the inscription data matrix. Specifically, the X-axis galvanometer scanning distance can be determined based on the width (i.e., the number of columns) of the inscription data matrix, the Y-axis galvanometer scanning distance can be determined based on the length (i.e., the number of rows) of the inscription data matrix, and the galvanometer scanning range can be determined based on the X-axis and Y-axis galvanometer scanning distances. When the file to be inscribed is large, the file can be segmented based on the field of view for a single inscription to obtain at least one sub-file, which includes the original inscription coordinates and inscription data information. The field of view for a single inscription is determined based on the galvanometer scanning range. In some embodiments, the field of view for a single inscription may be less than or equal to the galvanometer scanning range.

[0131] In this embodiment, the coordinates to be written can be determined based on the first included angle θ and the original writing coordinates to correct angular errors during writing and improve writing accuracy. The galvanometer voltage range can be determined based on the second relationship and the galvanometer scanning distance. Writing is then performed by controlling the writing voltage applied to the AOM; a higher writing voltage results in higher energy of the writing laser. After determining the coordinates to be written and the galvanometer voltage range, the scanning position of the galvanometer can be controlled according to the coordinates to be written, and the AOM-controlled laser can be made to crosslink with the photoresist according to the galvanometer voltage range to achieve the writing of the document to be written.

[0132] The following describes a method for writing to a file using embodiments of this application. In step S905, writing to at least one sub-file based on the first included angle, the original writing coordinates, and the galvanometer voltage range includes:

[0133] S1101: Determine the converted writing data based on the writing data information and the first included angle.

[0134] S1103: Write the at least one sub-file based on the converted writing data, the original writing coordinates, and the galvanometer voltage range.

[0135] In this embodiment, determining the converted inscription data based on the inscription data information and the first included angle may include rotating the inscription data information according to the first included angle θ to obtain the converted inscription data. In some embodiments, the inscription data matrix may be rotated according to the first included angle θ to obtain the converted inscription data matrix. The displacement stage is controlled to move to the original inscription coordinate position, and the galvanometer is controlled to inscribe at least one sub-file according to the converted inscription data and the galvanometer voltage range.

[0136] like Figure 6 The diagram shown is a writing schematic of a specific embodiment, where the galvanometer scanning direction is the X-axis.振 The direction and the actual writing area represent a sub-file of the file to be written. After the data to be written is determined after conversion, the galvanometer scanning area can include the actual writing area. During the process of controlling the galvanometer scanning and writing, the sub-file can be written correctly and completely.

[0137] In this embodiment of the application, step S903, the inscription of the at least one sub-file based on the first included angle, the original inscription coordinates, and the galvanometer voltage range, further includes:

[0138] S1201: Determine the coordinates to be written based on the preset rotation center, the first included angle and the original writing coordinates, wherein the coordinates to be written include the writing start coordinates and the writing end coordinates that match the writing data information.

[0139] S1203: Write the at least one sub-file based on the coordinates to be written and the range of the galvanometer voltage.

[0140] In this embodiment, writing can be performed by changing the scanning direction of the galvanometer without altering the writing data information. Based on a preset rotation center (c... x c y The first included angle θ and the original marking coordinates can be used to determine the marking coordinates according to equation (9):

[0141]

[0142] Where x2 and y2 are the x and y coordinates of the original written coordinates, x new2 y new2 The x and y coordinates of the coordinates to be inscribed are to match the inscription data information, where θ is the first angle between the X-axis galvanometer direction and the x-axis of the displacement stage coordinate system, (c x c y The coordinates of the preset rotation center are denoted as . The coordinates of the starting point and ending point of the writing can be determined according to equation (9). It should be noted that the coordinates to be written in this embodiment are determined in a rectangular coordinate system composed of the X-axis and Y-axis galvanometers. It can be understood that the writing scanning direction of the galvanometer can be determined based on the starting point and ending point coordinates. The displacement stage is controlled to move to the starting point coordinate position, and the galvanometer is controlled to write at least one sub-file along the writing scanning direction according to the writing data information and the galvanometer voltage range.

[0143] like Figure 7The diagram shown is a writing schematic of one embodiment. The actual writing area is consistent with the scanning area of ​​the galvanometer. After determining the writing coordinates based on the first included angle θ and the original writing coordinates, the writing scanning direction of the galvanometer is changed accordingly to match the writing data information. By controlling the galvanometer to write along the writing scanning direction, the sub-file can be correctly and completely written.

[0144] In this embodiment, by determining the second relationship and the first included angle, the problem in related technologies that the writing process requires specific scribing and splicing scribing experiments before the scribing effect can be observed in an electron microscope to calculate the voltage coefficient of the galvanometer and the angle between the X-axis of the displacement stage coordinate system and the X-axis of the galvanometer coordinate system can be solved. This avoids the difference in measurement effect caused by environmental differences in each scribing and various external factors such as intermediate links, which will affect the scribing effect of the entire system. Among them, the accuracy of the scribing length and the angular deviation between the displacement stage and the galvanometer are the main factors affecting the splicing scribing effect. The laser direct writing system scribing method provided in this embodiment can directly determine the optimal parameter information of the current scribing environment during scribing. Based on the determined second relationship, the length of the scribing line can be controlled more precisely, and corrections can be made based on the first included angle θ parameter during scribing, which can conveniently and quickly solve the splicing problem and improve the efficiency and accuracy of scribing.

[0145] In this embodiment, writing the document to be written based on the second relationship may include using a galvanometer as a scanning module, using an acousto-optic modulator (AOM) to control the switching of a laser, and controlling the movement of a displacement stage to write on the writing material. In some embodiments, the writing material is photoresist, and the writing material is based on glass or silicon.

[0146] In this embodiment, the format of the file to be written can be any one of JPG, BMP, PNG, TIFF, GDSII, STL, and DXF. In some embodiments, segmenting the file to be written to obtain at least one sub-file may include parsing the file to be written into a data matrix according to a preset size and / or pixel size, and segmenting the data matrix according to the single writing field of view to generate at least one sub-file.

[0147] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0148] Based on the same inventive concept, this application also provides a laser direct writing system writing apparatus 1400 for implementing the laser direct writing system writing method described above. The solution provided by this apparatus is similar to the solution described in the above method. Therefore, the specific limitations of one or more laser direct writing system writing apparatus 1400 embodiments provided below can be found in the limitations of the laser direct writing system writing method above, and will not be repeated here.

[0149] In one embodiment, such as Figure 8 As shown, a laser direct writing system writing device 1400 is provided. The laser direct writing system includes an image sensing module, a galvanometer, and a displacement stage. The laser direct writing system writing device 1400 includes:

[0150] The first relationship determination module 1401 is used to determine a first relationship between the first distance the displacement stage moves and the second distance the corresponding pixel of the image sensing module moves.

[0151] The second relationship determination module 1402 is used to determine the second relationship between the galvanometer voltage and the writing length based on the first relationship and preset coefficients.

[0152] The writing module 1403 is used to write the file to be written based on the second relationship.

[0153] Each module in the laser direct writing system 1400 described above can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in or independent of the processor in a computer device, or stored in the memory of a computer device as software, so that the processor can call and execute the operations corresponding to each module.

[0154] In one embodiment, a computer device is provided, which may be a server, and its internal structure diagram may be as follows: Figure 9As shown, the computer device includes a processor, memory, and a network interface connected via a system bus. The processor provides computing and control capabilities. The memory includes a non-volatile storage medium and internal memory. The non-volatile storage medium stores an operating system, computer programs, and a database. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage medium. The database stores data related to the laser direct-writing system's inscription method. The network interface allows communication with external terminals via a network connection. When the processor executes the computer program, it implements a laser direct-writing system inscription method.

[0155] Those skilled in the art will understand that Figure 9 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0156] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, which, when executed by a processor, implements the laser direct writing system inscription method described in any of the above embodiments.

[0157] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the laser direct writing system inscription method described in any of the above embodiments.

[0158] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties.

[0159] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0160] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0161] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A laser direct writing system for engraving, characterized in that, The laser direct writing system includes an image sensing module, a galvanometer, and a displacement stage; the method includes: Determine a first relationship between the first distance the displacement stage moves and the second distance the corresponding pixel of the image sensing module moves; A second relationship between the galvanometer voltage and the writing length is determined based on the first relationship and preset coefficients. The file to be burned is written based on the second relationship; The determination of the first relationship between the first distance the displacement stage moves and the second distance the corresponding pixel of the image sensing module moves includes: After the galvanometer is controlled to write the first mark, the displacement stage is controlled to move the first distance, and the galvanometer is controlled to write the second mark. Determine the first coordinate of the first mark point and the second coordinate of the second mark point in the coordinate system of the image sensing module. The second distance is determined based on the first coordinate and the second coordinate, and the ratio of the first distance to the second distance is determined to be the first relationship; The second relationship between the galvanometer voltage and the writing length, determined based on the first relationship and a preset coefficient, includes: A preset voltage is determined based on the preset coefficient, and the galvanometer is controlled to write a first etch line of a first preset length based on the preset voltage; Determine the first line length of the first etched line in the coordinate system of the image sensing module, and determine the actual line length of the first etched line based on the first line length and the first relationship; The second relationship is determined based on the actual line length, the preset coefficient, and the first preset length; The process of writing the file to be written based on the second relationship includes: Determine the first angle between the X-axis galvanometer direction and the horizontal axis of the displacement stage coordinate system, wherein the displacement stage coordinate system and the image sensing module coordinate system are located in the same plane; The file to be written is written based on the second relationship and the first included angle.

2. The method according to claim 1, characterized in that, Determining the second relationship based on the actual line length, the preset coefficient, and the first preset length includes: The preset voltage coefficient is determined based on the actual line length, the preset coefficient, and the first preset length. Based on the preset voltage coefficient and preset step value, the writing length of the galvanometer is controlled to gradually increase from the first preset length, and the coefficients corresponding to different writing lengths are determined respectively, wherein the preset step value is the first preset length; The second relationship is determined based on the different writing lengths and the corresponding coefficients.

3. The method according to claim 1, characterized in that, The determination of the first angle between the X-axis galvanometer direction and the horizontal axis of the displacement stage coordinate system includes: After the galvanometer is controlled to write the third mark, the displacement stage is controlled to move a third distance along the horizontal axis of the displacement stage coordinate system, and the galvanometer is controlled to write the fourth mark. Determine the third coordinate of the third mark point and the fourth coordinate of the fourth mark point in the coordinate system of the image sensing module; Based on the third coordinate and the fourth coordinate, a second included angle between the horizontal axis of the image sensing module coordinate system and the horizontal axis of the displacement stage coordinate system is determined, and the first included angle is determined based on the second included angle.

4. The method according to claim 3, characterized in that, Determining the first included angle based on the second included angle includes: Control the galvanometer to write the second scribe line along the X-axis galvanometer direction; Determine the start and end coordinates of the second scribe line in the coordinate system of the image sensing module. Based on the starting point coordinates and the ending point coordinates, determine the third angle between the X-axis galvanometer direction and the horizontal axis of the image sensing module coordinate system; The first included angle is determined based on the second included angle and the third included angle.

5. The method according to claim 1, characterized in that, The process of writing the file to be written based on the second relationship and the first included angle includes: Based on the field of view of a single inscription, the file to be inscribed is segmented to obtain at least one sub-file, wherein the at least one sub-file includes inscription data information and original inscription coordinates; The galvanometer scanning distance is determined based on the inscribed data information, and the galvanometer voltage range is determined based on the second relationship and the galvanometer scanning distance; The at least one sub-file is inscribed based on the first included angle, the original inscription coordinates, and the galvanometer voltage range.

6. The method according to claim 5, characterized in that, The step of writing the at least one sub-file based on the first included angle, the original writing coordinates, and the galvanometer voltage range includes: Based on the inscribed data information and the first included angle, the converted inscribed data is determined; The at least one sub-file is written based on the converted writing data, the original writing coordinates, and the galvanometer voltage range.

7. The method according to claim 5, characterized in that, The step of writing the at least one sub-file based on the first included angle, the original writing coordinates, and the galvanometer voltage range further includes: The coordinates to be written are determined based on the preset rotation center, the first included angle and the original writing coordinates, wherein the coordinates to be written include the writing start coordinates and the writing end coordinates that match the writing data information; The at least one sub-file is written based on the coordinates to be written and the range of the galvanometer voltage.

8. A laser direct writing system engraving device, characterized in that, The laser direct writing system includes an image sensing module, a galvanometer, and a displacement stage. The device includes: The first relationship determination module is used to determine a first relationship between the first distance the displacement stage moves and the second distance the corresponding pixel of the image sensing module moves; The second relationship determination module is used to determine the second relationship between the galvanometer voltage and the writing length based on the first relationship and preset coefficients. The burning module is used to burn the file to be burned based on the second relationship; The determination of the first relationship between the first distance the displacement stage moves and the second distance the corresponding pixel of the image sensing module moves includes: After the galvanometer is controlled to write the first mark, the displacement stage is controlled to move the first distance, and the galvanometer is controlled to write the second mark. Determine the first coordinate of the first mark point and the second coordinate of the second mark point in the coordinate system of the image sensing module. The second distance is determined based on the first coordinate and the second coordinate, and the ratio of the first distance to the second distance is determined to be the first relationship; The second relationship between the galvanometer voltage and the writing length, determined based on the first relationship and a preset coefficient, includes: A preset voltage is determined based on the preset coefficient, and the galvanometer is controlled to write a first etch line of a first preset length based on the preset voltage; Determine the first line length of the first etched line in the coordinate system of the image sensing module, and determine the actual line length of the first etched line based on the first line length and the first relationship; The second relationship is determined based on the actual line length, the preset coefficient, and the first preset length; The process of writing the file to be written based on the second relationship includes: Determine the first angle between the X-axis galvanometer direction and the horizontal axis of the displacement stage coordinate system, wherein the displacement stage coordinate system and the image sensing module coordinate system are located in the same plane; The file to be written is written based on the second relationship and the first included angle.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 7.

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