Semiconductor package sorting apparatus and method

Abstract

The present application provides a semiconductor package sorting device and method, comprising: a cutting unit for cutting a semiconductor strip into semiconductor packages; a unit picker for vacuum-sucking and picking up the semiconductor packages to pass through a cleaning unit; a cleaning unit for cleaning the cut semiconductor packages; a transfer table for placing the semiconductor packages; a buffer table arranged between the cleaning unit and the transfer table; a flipper comprising a rotating unit for vacuum-sucking the semiconductor packages and rotating around a first direction, and a moving unit connected with the rotating unit and horizontally moving the rotating unit to a second direction perpendicular to the first direction between an upper portion of the buffer table and an upper portion of the transfer table; and an inspection unit arranged on a moving path of the semiconductor packages for inspecting the semiconductor packages.

Description

TECHNICAL FIELD

[0001] The present invention relates to a semiconductor package sorting apparatus and method. More particularly, the present invention relates to a semiconductor package sorting apparatus and method for sawing a semiconductor tape composed of a plurality of semiconductor packages, singulating the semiconductor packages, inspecting the singulated semiconductor packages, and sorting them according to the results. BACKGROUND

[0002] Generally, semiconductor elements can be formed on a silicon wafer serving as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor elements thus formed can be manufactured into a semiconductor tape composed of a plurality of semiconductor packages through a wafer sawing process and a die bonding process and an injection molding process.

[0003] The manufactured semiconductor tape is singulated into a plurality of semiconductor packages through a sawing & sorting process, and is sorted according to a good or a bad product judgment. For example, after the semiconductor tape is loaded onto a vacuum chuck, it is singulated into a plurality of semiconductor packages using a sawing blade, the singulated semiconductor packages are cleaned and dried, and then inspected through a vision module, and sorted into a good product and a bad product according to the inspection results of the vision module.

[0004] An apparatus for performing the sawing & sorting process can include a tape picker for transferring the semiconductor tape, and a unit picker for transferring the singulated semiconductor packages. The semiconductor packages can be picked up by the unit picker, cleaned by a cleaning module, and then moved to a transfer table.

[0005] On the other hand, in the process of transferring to the transfer table, when the semiconductor packages need to be converted to be upward or downward, a rotation table (inverter) that receives the semiconductor packages from the unit picker and rotates them to transfer them to the transfer table is added.

[0006] However, in the related art, the apparatuses when the semiconductor packages need to be converted to be upward or downward are different in structure from the apparatuses when the semiconductor packages do not need to be converted to be upward or downward, and thus there is a problem that one sawing & sorting apparatus cannot handle the semiconductor packages that need to be converted to be upward or downward and the semiconductor packages that do not need to be converted or the productivity is reduced.

[0007] Prior Art Documents:

[0008] Reference Document 1: Korean Patent 10-1594965 B. SUMMARY

[0009] Technical Problem to be Solved

[0010] The present invention relates to a semiconductor package sorting apparatus and method, and more particularly, to a semiconductor package sorting apparatus and method which can process a semiconductor package to be turned or maintained in an upward or downward direction.

[0011] Means for solving the problem

[0012] The present invention relates to a semiconductor package sorting apparatus and method, and more particularly, to a semiconductor package sorting apparatus and method which can process a semiconductor package to be turned or maintained in an upward or downward direction.

[0013] A semiconductor package sorting apparatus according to an embodiment of the present invention includes a unit picker for vacuum-sucking and picking up a semiconductor package; a buffer stage including a tray on which the semiconductor package is loaded; a transfer stage disposed on an opposite side of the buffer stage from the unit picker and loading and transferring the semiconductor package; a flipper including a rotating part for vacuum-sucking the semiconductor package and rotating in a first direction, a moving part connected to the rotating part and horizontally moving the rotating part in a second direction perpendicular to the first direction between an upper portion of the buffer stage and an upper portion of the transfer stage; and an inspection part disposed on a moving path of the semiconductor package to inspect the semiconductor package.

[0014] In an embodiment of the present invention, the apparatus further includes a cutting part for cutting a semiconductor strip into semiconductor packages and a cleaning part for cleaning the cut semiconductor packages, the unit picker passes through the cleaning part in a state of picking up the semiconductor packages, and the buffer stage can be disposed between the cleaning part and the transfer stage.

[0015] In an embodiment of the present invention, the apparatus further includes a control part connected to the unit picker, the buffer stage, and the flipper, the control part loads the semiconductor package on the buffer stage by the unit picker while maintaining the semiconductor package in an upward or downward direction within the apparatus, and transfers the semiconductor package loaded on the buffer stage to the transfer stage by the flipper.

[0016] In an embodiment of the present invention, a semiconductor package sorting method includes a transfer step for transferring a semiconductor package to a transfer stage, an inspection step for inspecting the semiconductor package disposed on the transfer stage, and a sorting step for sorting the semiconductor package according to a result of the inspection step, the semiconductor package is turned or maintained in an upward or downward direction in the transfer step, the semiconductor package is turned in the upward or downward direction by a flipper and moved when turned in the upward or downward direction, and the semiconductor package is moved by the flipper when maintained in the upward or downward direction.

[0017] As an embodiment of the present invention, a cutting section is also provided, comprising: a cutting section for cutting semiconductor strips into semiconductor packages; a cleaning section for cleaning the cut semiconductor packages; a unit picker for vacuum adsorbing and picking up the semiconductor packages, allowing them to pass through the cleaning section; a transfer stage for transferring the semiconductor packages; a buffer stage disposed between the cleaning section and the transfer stage, and including a disk for loading the semiconductor packages; and a flipper comprising a rotating section for vacuum adsorbing the semiconductor packages and rotating about a first direction, and a moving section connected to the rotating section and horizontally moving the rotating section in a second direction perpendicular to the first direction between the upper part of the buffer stage and the upper part of the transfer stage. A first inspection unit is placed on the upper side of the movement path of the conveyor; a chip picker moves the semiconductor package of the conveyor that has passed through the first inspection unit; a second inspection unit is provided at the lower part of the movement path of the chip picker; multiple trays for placing the semiconductor package according to the inspection results of the first and second inspection units; and a control unit at least connected to the unit picker, the buffer table, and the flipper, wherein the control unit, when maintaining the semiconductor package facing up or down in the device, loads the semiconductor package onto the buffer table via the unit picker and causes the flipper to transfer the semiconductor package loaded on the buffer table to the conveyor.

[0018] Beneficial effects

[0019] The present invention can provide a semiconductor package sorting device and method, both of which can handle the conversion or maintenance of semiconductor packages facing up or down. Attached Figure Description

[0020] Figure 1 This is a schematic structural diagram of a semiconductor package sorting device according to an embodiment of the present invention;

[0021] Figure 2 for Figure 1 A schematic side view of the flipper, buffer table, and conveyor of a semiconductor package sorting device;

[0022] Figure 3 for Figure 1 A schematic perspective view of the flipper and buffer stage of a semiconductor package sorting device;

[0023] Figure 4 for Figure 3 A schematic 3D view of the buffer platform;

[0024] Figure 5 In order to be in Figure 3 A schematic side view of a flipper and buffer stage showing the semiconductor package in an up- or down-facing state.

[0025] Figure 6 and Figure 7 to maintain the upside-down state of the semiconductor packages in the flipper and the buffer table of Figure 3

[0026] Figure 8 schematic structural diagram of a semiconductor package sorting apparatus according to another embodiment of the present application;

[0027] Figure 9 to maintain the upside-down state of the semiconductor packages in the flipper and the buffer table of Figure 8

[0028] Figure 10 schematic partial perspective view of the flipper of Figure 8

[0029] Figure 11 schematic plan view of the flipper of Figure 8

[0030] Figure 12 partial sectional view of the flipper of Figure 8

[0031] Figure 13 plan view of a modification of the flipper of Figure 8

[0032] Figure 14 plan view of another modification of the flipper of Figure 8

[0033] Figures 15 to 18 schematic plan view of maintaining the upside-down state of the semiconductor packages in the flipper and the buffer table of Figure 8

[0034] Figure 19 schematic structural diagram of a semiconductor package sorting apparatus according to another embodiment of the present application;

[0035] Figure 20 schematic flowchart of a semiconductor package sorting method according to an embodiment of the present application;

[0036] BRIEF DESCRIPTION OF THE DRAWINGS

[0037] 10: semiconductor strip; 20: semiconductor package

[0038] 30: magazine; 100: semiconductor package sorting apparatus

[0039] 102: cutting section; 104: cutting spindle

[0040] ​​​​​​​​110: tape picker; 120: vacuum chuck;

[0041] 130: unit picker; 140: cleaning section;

[0042] 150: sorting section; 160: inspection section;

[0043] 170: tray; 190: chip picker;

[0044] 210: buffer stage; 250: flipper;

[0045] 251: frame; 252, 253: rotation shaft;

[0046] 255: rotation section; 256: first suction line;

[0047] 257: second suction line; 262: third suction line;

[0048] 258: first suction disk; 259: second suction disk;

[0049] 161, 205, 205a, 205b, 269: moving section;

[0050] 131, 201, 201a, 201b, 270, 271: transfer rail;

[0051] 202, 211: disk; 203, 213, 203a, 203b: height adjustment section. DETAILED DESCRIPTION

[0052] Hereinafter, preferred embodiments will be described in detail so that those skilled in the art can easily implement the present application with reference to the accompanying drawings. However, in describing the preferred embodiments of the present application, if it is determined that a detailed description of related known configurations or functions can obscure the gist of the present application, a detailed description thereof will be omitted. Also, for components having similar functions and actions, the same reference numerals are used throughout the drawings. Also, in the present specification, the terms "upper", "upper portion", "upper surface", "lower", "lower portion", "lower surface", "side surface", and the like are based on the drawings, and in fact, elements or constituent elements can differ depending on the placement direction.

[0053] Also, throughout the specification, when one part is "connected" with another part, it not only refers to the case of "direct connection", but also includes the case of "indirect connection" with another element interposed therebetween. Also, "including" a certain constituent element means that other constituent elements can be further included, rather than excluding other constituent elements, unless otherwise specified.

[0054] Figure 1FIG. 1 is a schematic diagram of a semiconductor package sorting apparatus according to an embodiment of the present application.

[0055] Referring to Figure 1 A semiconductor package sorting apparatus 100 according to an embodiment of the present application is used to sort semiconductor packages 20 after inspecting the semiconductor packages 20, and can use a cut to singulate the semiconductor packages 20 from a semiconductor tape 10 formed of a plurality of semiconductor packages 20.

[0056] The semiconductor package sorting apparatus 100 according to an embodiment of the present application includes a sorting part 150 to sort the semiconductor packages 20 after inspecting the semiconductor packages 20, and can further include a cutting part 102 to cut the semiconductor tape 10 in order to singulate the semiconductor packages 20. Although the cutting part 102 is optionally included in the semiconductor package sorting apparatus 100, the semiconductor package sorting apparatus 100 according to the present embodiment can also be referred to as a semiconductor tape cutting and sorting apparatus since the cutting part 102 is included in the present embodiment.

[0057] A cassette 30 in which a plurality of semiconductor tapes are accommodated can be provided at one side of the semiconductor package sorting apparatus 100. Although not shown in detail, the cutting part 102 can have a gripper (not shown) to draw out the semiconductor tape 10 from the cassette 30, and the semiconductor tape 10 drawn out from the cassette 30 can be guided by a guide rail 32.

[0058] The semiconductor tape 10 can be transferred onto a vacuum chuck 120 after being picked up by a tape picker 110. Although not shown in detail, the tape picker 110 can be moved by a tape transfer unit, and can be configured to be rotatable in order to adjust a set direction of the semiconductor tape 10. For example, the semiconductor tape 10 drawn out from the cassette 30 can be rotated by the tape picker 110, and then the rotated semiconductor tape 10 can be transferred onto the vacuum chuck 120.

[0059] The vacuum chuck 120 can be supported by a chuck table 122, and the chuck table 122 can move the semiconductor tape 10 to a cutting spindle 104. The cutting spindle 104 is a structure to cut the semiconductor tape 10. The chuck table 122 can move the semiconductor tape 10 to below the cutting spindle 104 by a separate driving part (not shown). The semiconductor packages 20 singulated by the cutting part 102 can be picked up and transferred by a unit picker 130.

[0060] The strip pickers 110 and the unit pickers 130 can move on a transfer rail 131 extending in the X direction, and the transfer rail 131 guiding the movement of the unit pickers 130 extends to the vacuum chuck 120, the cleaning part 140, and the buffer stage 210.

[0061] The semiconductor package sorting apparatus 100 includes a cleaning part 140 for cleaning the singulated semiconductor packages 20. After the unit pickers 130 pick up the semiconductor packages 20, the unit pickers 130 can move to the upper portion of the cleaning part 140 along the transfer rail 131. The cleaning part 140 can remove foreign substances from the semiconductor packages 20 using a brush and a cleaning liquid. That is, the semiconductor packages 20 can be cleaned by the cleaning part 140 in a state of being picked up by the unit pickers 130.

[0062] After the cleaning of the semiconductor packages 20 is completed, the semiconductor packages 20 are dried by a configuration such as an air knife provided at one side of the cleaning part 140, and then moved to the transfer stage 200.

[0063] While moving to the transfer stage 200, the semiconductor packages 20 can be changed or maintained to be upward or downward.

[0064] When the change to upward or downward is made, the semiconductor packages 20 are transferred from the unit pickers 130 to the flipper 250, and then flipped to be upward or downward by the rotation of the flipper 250 and loaded to the transfer stage 200.

[0065] On the contrary, in the case where the upward or downward is not changed, the semiconductor packages 20 are transferred from the unit pickers 130 to the buffer stage 210, and then the flipper 250 adsorbs the semiconductor packages 20 of the buffer stage 210, moves along the transfer rail 270, and is transferred to the transfer stage 200. The process in which the semiconductor packages 20 move to the transfer stage 200 through the cleaning part 140 and the buffer stage 210 and the flipper 250 will be described later with reference to Figures 2 to 7 Again, it will be described.

[0066] The semiconductor packages 20 moved from the transfer stage 200 are moved by the chip pickers 190, and the semiconductor package sorting apparatus 100 includes an inspection part 160 for inspecting the semiconductor packages 20 before moving to the tray 170. The inspection part 160 can include a first inspection part 160a provided at the upper portion of the movement path of the transfer stage 200 and a second inspection part 160b provided at the lower portion of the movement path of the chip pickers 190.

[0067] The semiconductor package sorting device 100 may include a tray 170 for holding semiconductor packages 20 that are determined to be good by the inspection unit 160, a container 180 for holding semiconductor packages 20 that are determined to be defective, a tray moving part (not shown) for moving the tray 170 along a moving guide rail 172, and a tray supply unit 174 for supplying the tray 170.

[0068] Furthermore, although not illustrated, the semiconductor package sorting device 100 includes a control unit (not shown) that is structurally connected to and controls the cutting section 102 and the sorting section 150.

[0069] Figure 2 The middle shows Figure 1 A schematic side view of the flipper 250, buffer stage 210, and conveyor stage 200 of the semiconductor package sorting device 100. Figure 3 The middle shows Figure 1 A schematic perspective view of the flipper 250 and buffer stage 210 of the semiconductor package sorting device 100. Figure 4 A schematic perspective view of the buffer platform 210 is shown in the middle.

[0070] The guide rail 131, which guides the unit pickup 130 and extends in the X direction, extends through the cleaning section 140 to the upper part of the buffer platform 210. The guide rail 270, which connects to the flipper 250 at a lower position than the guide rail 131, extends in the same direction as the guide rail 131 that guides the unit pickup 130.

[0071] The conveyor 200 includes: a disk 202 containing an adsorption groove for adsorbing semiconductor packages 20; a height adjustment part 203 connected to the disk 202 to adjust the height of the disk 202; and a moving part 205 connected to the disk 202 and moving the disk 202 along a conveyor rail 201 extending in the Y direction.

[0072] The buffer stage 210 is disposed between the cleaning section 140 and the transfer stage 200, and includes a disk 211 for loading the semiconductor package 20, and a height adjustment section 213 connected to the disk 211 and adjusting the height of the disk 211.

[0073] The disk 211 has an adsorption hole 211a connected to the adsorption pipeline for receiving the semiconductor package 20 from the unit pickup 130 or transferring the received semiconductor package 20 to the flipper 250.

[0074] The height adjustment part 213 can include a lifting structure that lifts or lowers the tray 211 when receiving the semiconductor package 20 from the unit pick-up 130 or transferring the semiconductor package 20 to the flipper 250, and can include, for example, a motor, a screw shaft connected to the motor, a moving block formed with a screw thread corresponding to the screw shaft and connected to the tray 211, but is not limited thereto.

[0075] On the other hand, the semiconductor package 20 disposed on the tray 211 of the buffer stage 210 can also be dried by a configuration such as an air knife or a heater provided in or around the buffer stage 210.

[0076] The flipper 250 includes a moving part 269 connected to a transfer rail 270 extending in the X direction from the upper portion of the buffer stage 210 and the upper portion of the transfer stage 200 so that the flipper 250 can move between the upper portion of the buffer stage 210 and the upper portion of the transfer stage 200, a rotating part 255 that adsorbs the semiconductor package 20 received from the unit pick-up 130 or the buffer stage 210 and rotates about the Y direction, and a frame 251 surrounding the rotating part 255.

[0077] The rotating part 255 of the flipper 250 is connected to a pair of rotating shafts 252, 253 inside the frame 251 and is connected to a driving part (not shown) in the rotating shafts 252, 253 so that the rotating part 255 rotates with respect to the frame 251.

[0078] The rotating part 255 includes at least one first adsorption disc 258, and the first adsorption disc 258 has an adsorption hole connected to an adsorption line, can adsorb and receive the semiconductor package 20 from the unit pick-up 130 or the buffer stage 210, or transfer the semiconductor package 20 to the transfer stage 200. The adsorption line is connected to an adsorption source to provide an adsorption force for adsorbing the semiconductor package 20.

[0079] Figures 5 to 7 FIG. 4 is a side view illustrating a state in which the semiconductor package 20 is transferred to the transfer stage 200 through the flipper 250 and the buffer stage 210 in the unit pick-up 130, Figure 5 FIG. 5 is a side view when the semiconductor package 20 is flipped upside down or upside up, Figure 6 and Figure 7 FIG. 6 is a side view when the semiconductor package 20 is maintained upside down or upside up. The maintenance and flipping of upside down or upside up are controlled by a control part.

[0080] The turning upside down or upside up of the semiconductor package 20 means a case where the semiconductor package 20 is introduced into the device in a ball up or dead bug state, is discharged from the device in a ball down or live bug state after passing through the device, and vice versa, and the maintaining upside down or upside up means a case where the semiconductor package 20 is introduced into the device in a dead bug or live bug state and is discharged from the device in the same state.

[0081] In order to turn upside down or upside up, the rotating part 255 of the turner 250 is rotated by 180 degrees, Figure 5 Such a case is shown in FIG. 6. Figure 5 As shown, the unit picker 130 delivers the semiconductor package 20 to the turner 250 waiting above the buffer stage 210, and after the turner 250 receives the semiconductor package 20, moves to the upper part of the transfer stage 200 and rotates the rotating part by 180 degrees, delivers the semiconductor package 20 to the transfer stage 200. At this time, since the rotating part 255 of the turner 250 is rotated by 180 degrees, the upside down or upside up of the semiconductor package 20 is turned.

[0082] When turning upside down or upside up, the dry structure of the semiconductor package 20 is provided around the buffer stage 210, so that the semiconductor package 20 can be delivered to the buffer stage 210 and an additional drying function can be performed, and thus, after the turner 250 receives the semiconductor package 20 from the unit picker 130, the semiconductor package 20 can be delivered to the buffer stage 210 for additional drying and then returned.

[0083] In the present embodiment, the present application can realize the maintaining upside down or upside up and the turning upside down or upside up in one device by including the buffer stage 210 and the turner 250. Since the turner 250 is used not only for turning and moving of the semiconductor package 20 but also for moving only, a unit picker additional structure for moving of the semiconductor package 20 is not required, and the maintaining upside down or upside up and the turning upside down or upside up can be realized without increasing the size of the device.

[0084] For the unit pickup 130, it is necessary to pass the semiconductor package 20 to the flipper 250 or receive the semiconductor package 20 from the flipper 250. Therefore, it needs to be located above the flipper 250, and when the unit pickup 130 is used to pass the semiconductor package to the conveyor 200, such a unit pickup needs to extend to the upper part of the conveyor 200. Therefore, when the unit pickup 130 is used to pass the semiconductor package 200 to the conveyor 200, it occupies space on the upper part of the conveyor 200, creating a need for a structure to avoid interference between additional components.

[0085] However, in this embodiment of the present invention, the flipper 250 is used to transfer the semiconductor package 20 to the conveyor 200 regardless of whether it is flipped up or down. Therefore, the unit picker 130 does not need to reach above the conveyor 200, which ensures the space above the conveyor 200, which is convenient for the application and design of the inspection unit 160 or other structures.

[0086] Furthermore, in this embodiment, the unit pickup 130 and the buffer stage 210 move up and down in the height direction with the flipper 250 located between the unit pickup 130 and the buffer stage 210 as the center, while transferring the semiconductor package to the flipper 250. Therefore, the flipper 250 does not move up and down, and its X-direction movement and rotation are more stable, which can achieve the effect of saving the time required to transfer the semiconductor package and improving productivity.

[0087] In addition, the structure of the buffer platform 210 is not complicated, and even if the buffer platform 210 is added, there is no need to change the flipper 250 or the conveyor 200. The upward or downward maintenance and flipping can be achieved through a simple structure.

[0088] Figure 8 A schematic structural diagram of a semiconductor package sorting device according to another embodiment of the present invention is shown.

[0089] Figure 8 The semiconductor package sorting device 100 according to the embodiment and Figure 1 The embodiments are the same, all of which are used to monolithize the semiconductor package 20 by cutting semiconductor strips 10 formed by multiple semiconductor packages 20, and after inspecting the monolithized semiconductor package 20, classify it according to the results.

[0090] A semiconductor package sorting device 100 according to an embodiment of the present invention may include a cutting section 102 for cutting the semiconductor strip 10 for monolithic semiconductor package 20, and a sorting section 150 for inspecting the semiconductor package 20 and sorting the semiconductor package 20 according to the inspection results.

[0091] The semiconductor package sorting apparatus 100 is provided with a magazine 30 which accommodates a plurality of semiconductor strips, and the semiconductor strip 10 drawn from the magazine 30 is guided by a guide rail 32.

[0092] The semiconductor strip 10 is picked up by a strip picker 110 and transferred onto a vacuum chuck 120. The vacuum chuck 120 can be supported by a chuck table 122, and the chuck table 122 can move the semiconductor strip 10 to a cutting spindle 104. The semiconductor package 20 singulated by the cutting part 102 is picked up by a unit picker 130 and transferred, and a transfer rail 131 which guides the movement of the unit picker 130 extends at least over the upper portions of the vacuum chuck 120, a cleaning part 140, and a buffer table 210.

[0093] The semiconductor package sorting apparatus 100 includes the cleaning part 140 for cleaning the singulated semiconductor package 20, and after the unit picker 130 picks up the semiconductor package 20, it moves to the upper portion of the cleaning part 140, and the cleaning part 140 can remove foreign substances from the semiconductor package 20 using a brush and a cleaning liquid.

[0094] After the cleaning of the semiconductor package 20 is completed, the semiconductor package 20 is dried by a configuration such as an air knife provided at one side of the cleaning part 140, and then moves to the transfer table 200. The transfer table 200 in this embodiment includes a first transfer table 200a and a second transfer table 200b, and the upward or downward direction of the semiconductor package 20 can be changed or maintained when moving to the transfer table 200.

[0095] When the upward or downward direction is changed, the semiconductor package 20 is transferred from the unit picker 130 to a flipper 250, and then flipped by the rotation of the flipper 250 and seated on the transfer table 200. On the contrary, when the upward or downward direction is not changed, the semiconductor package 20 is transferred from the unit picker 130 to the buffer table 210, and then the flipper 250 adsorbs the semiconductor package 20 of the buffer table 210 and moves it to the transfer table 200.

[0096] During the transfer to the transfer table 200, all of the semiconductor packages 20 can be transferred to one of the first transfer table 200a and the second transfer table 200b, but a part of them can be transferred to the first transfer table 200a and the remaining to the second transfer table 200b, and for this purpose, both sides of the flipper 250 can have a first adsorption plate 258 and a second adsorption plate 259, and the part can be adsorbed to the first adsorption plate 258 and the remaining part can be adsorbed to the second adsorption plate 259.

[0097] The semiconductor packages 20 moved to the transfer table 200 are moved to the tray 170 by the chip picker 190, and the semiconductor package sorting apparatus 100 includes an inspection unit 160 for inspecting the semiconductor packages 20 before being moved to the tray 170. The inspection unit 160 can include a first inspection unit 160a provided at an upper portion of a movement path of the transfer table 200, a second inspection unit 160b, and a third inspection unit 160c provided at a lower portion of a movement path of the chip picker 190.

[0098] The sorting unit 150 can include the tray 170 for accommodating the semiconductor packages 20 determined as good by the inspection unit 160, a container 180 for accommodating the semiconductor packages 20 determined as defective, a tray moving unit for moving the tray 170 along a movement rail 172, and a tray supply unit 174 for supplying the tray 170.

[0099] Further, although not shown in the drawings, the semiconductor package sorting apparatus 100 includes a control unit (not shown in the drawings) connected to the structures of the cutting unit 102 and the sorting unit 150 and controlling the apparatus.

[0100] Figure 9 A schematic side view of the flipper 250, the buffer table 210, and the transfer table 200 of the semiconductor package sorting apparatus 100 is shown in FIG. 1. The transfer table 200 in the present embodiment includes a first transfer table 200a and a second transfer table 200b, and the first transfer table 200a and the second transfer table 200b each include a first disk 202a and a second disk 202b on which the semiconductor packages 20 are placed, a height adjusting unit 203a, 203b connected to the first disk 202a and the second disk 202b to adjust the height, and a moving unit 205a, 205b connected to the first disk 202a and the second disk 202b and moving the first disk 202a and the second disk 202b along a transfer rail 201a, 201b extending in the Y direction, and can further include a horizontal rotating unit (not shown in the drawings) rotating the first disk 202a and the second disk 202b about the height direction as a center.

[0101] Figures 10 to 12 The flipper 250 is shown in FIG. 2. Specifically, Figure 10 A partial perspective view of the flipper 250 is shown in FIG. 3, Figure 11 A partial plan view of the flipper 250 is shown in FIG. 4, Figure 12 A partial sectional view of the flipper 250 is shown in FIG. 5.

[0102] On the other hand, the buffer table 210 is configured in the same manner as Figure 1 the embodiment of the buffer table 210 shown in FIG. 1, and thus a description of the buffer table 210 is omitted.

[0103] The flipper 250 includes a frame 251, a rotating portion 255 surrounded by the frame 251, and a moving portion 269 (see Figure 9 ), and the frame 251 and the rotating portion 255 are rotatably connected by a pair of rotating shafts 252, 253.

[0104] The rotating portion 255 includes a first adsorption disk 258 on one face and a second adsorption disk 259 on the opposite face of the one face, the first adsorption disk 258 includes a first adsorption portion formed by a plurality of adsorption holes 258a, and the second adsorption disk 259 includes a second adsorption portion formed by a plurality of adsorption holes 259a.

[0105] In order to connect an external adsorption source to the adsorption holes 258a, 259a so as to adsorb or release semiconductor packages, the rotating portion 255 includes a first adsorption line 256 on the inner side of the first adsorption disk 258, a first adsorption cavity 260 connected to the first adsorption disk 258 and the first adsorption line 256, a second adsorption line 257 separate from the first adsorption line 256, and a second adsorption cavity 261 connected to the second adsorption line 257 and the second adsorption disk 259 on the inner side of the second adsorption disk 259. The first adsorption line 256 and the second adsorption line 257 enter the rotating portion 255 through the rotating shafts 252, 253, respectively, even though Figure 11 they are shown as entering different rotating shafts 252, 253 in the drawings, but the present application is not limited thereto, and it is obvious that they can enter from one shaft.

[0106] The first adsorption disk 258 includes a first adsorption portion for adsorbing semiconductor packages of odd columns in odd rows and even columns in even rows, and the second adsorption disk 259 can include a second adsorption portion for adsorbing semiconductor packages of even columns in odd rows and odd columns in even rows, by such a configuration, the first adsorption disk 258 can adsorb semiconductor packages 20 in a zigzag shape, and the second adsorption disk 259 can adsorb the remaining semiconductor packages 20 not adsorbed by the first adsorption disk 258 in a zigzag shape. However, the first adsorption disk 258, the second adsorption disk 259, the first adsorption line 256, and the second adsorption line 257 can be variously deformed, Figure 13 and Figure 14 deformation examples of the adsorption disk and the adsorption line are shown in the drawings.

[0107] As Figure 13 can be seen, the first adsorption line 256 and the second adsorption line 257 can be connected to the adsorption holes 258a, 259a, and the first adsorption line 256 and the second adsorption line 257 can be formed in a zigzag line. At this time, the first adsorption disk 258 can be provided with a first adsorption portion, and the second adsorption disk 259 can be provided with a second adsorption portion.

[0108] On the other hand, such as Figure 14 As shown, the first and second adsorption portions are arranged entirely on one side of the adsorption disk, such as the first adsorption disk 258, while the second adsorption portion can be arranged on the opposite side of the second adsorption disk 259. To allow the first and second adsorption portions arranged on the first adsorption disk 258 to operate independently, they are connected to different adsorption lines. That is, the first adsorption portion of the first adsorption disk 258 is connected to the first adsorption line 256, the second adsorption portion of the first adsorption disk 258 is connected to the third adsorption line 262, and the second adsorption portion of the second adsorption disk 259 is connected to the second adsorption line 257.

[0109] Therefore, the first adsorption disk 258 of the rotating part 255 adsorbs the entire semiconductor package 20, or can only adsorb a portion of it, while the second adsorption disk 259 can adsorb the remaining semiconductor package 20 except for the aforementioned portion.

[0110] The first adsorption line to the third adsorption line 256, 257, 262 can enter the rotating part 255 from one rotating shaft 252, 253, or they can enter from two rotating shafts 252, 253.

[0111] By configuring it so that one side can hold the entire semiconductor package 20, sorting can be performed in various ways without changing the semiconductor package sorting device 100, and various situations can be dealt with.

[0112] for Figure 14 The structure of the first adsorption disk 258 can also be applied to the unit pickup 130, the buffer stage 210 and the conveyor 200. When the unit pickup 130, the buffer stage 210 and the conveyor 200 transfer or receive semiconductor packages 20 between each other or with the flipper 250, they can be divided into a first adsorption part and a second adsorption part to correspond to each other.

[0113] Figures 15 to 18 A schematic top view showing the state of the cell pickup 130, buffer stage 210, flipper 250 and conveyor 200 is provided to illustrate the operation of each structure when the semiconductor package is held facing up or down.

[0114] like Figure 15 As shown, the unit pickup 130 enters the buffer stage 210 while adsorbing the semiconductor package 20 that has passed through the cleaning section 140, and the flipper 250 reaches the second transfer stage 200b. In this state, the unit pickup 130 transfers the semiconductor package 20 to the buffer stage 210. Figure 16As shown, after the semiconductor packages 20 are transferred to the buffer table 210, the flipper 250 moves to the upside of the buffer table 210. Since both sides of the rotating part 255 of the flipper 250 include the first suction plate 258 and the second suction plate 259, a part of the semiconductor packages 20 is sucked to the suction part of one of the first suction plate 258 and the second suction plate 259 and rotated, and the remaining semiconductor packages are sucked to the suction part of the other suction plate. When the rotating part 255 of the flipper 250 rotates, the buffer table 210 temporarily descends to avoid interference, and then rises again to transfer the semiconductor packages 20 after the rotation is completed.

[0115] As shown, the flipper 250 moves to the first transfer table 200a to transfer the semiconductor packages 20 sucked to the first suction part to the first transfer table 200a, and then moves to the second transfer table 200b to rotate the rotating part 255 to transfer the semiconductor packages 20 sucked to the second suction part to the second transfer table 200b. Figure 17 18 As shown, the flipper 250 moves to the first transfer table 200a to transfer the semiconductor packages 20 sucked to the first suction part to the first transfer table 200a, and then moves to the second transfer table 200b to rotate the rotating part 255 to transfer the semiconductor packages 20 sucked to the second suction part to the second transfer table 200b.

[0116] On the other hand, when flipping up or down, the flipper 250 directly receives the semiconductor packages 20 from the unit pickers 130, receives a part through the first suction plate 258, and receives the remaining part through the second suction plate 259, and then is transferred to the first transfer table 200a and the second transfer table 200b again.

[0117] In this embodiment, the flipper 250 can diversely perform the handling of the semiconductor packages 20 by effectively utilizing multiple surfaces and including multiple transfer tables 200, and can achieve the desired alignment and inspection through a simple structure.

[0118] Figure 19 A schematic structural diagram of a semiconductor package sorting apparatus according to another embodiment of the present application is shown in FIG. 10.

[0119] Since the cutting part 102, the cleaning part 140, the buffer table 210, and the rotating part 255 of the embodiment of Figure 19 are the same as those of the embodiment of Figure 1 , the description of Figure 1 is replaced for the same parts, and only the different parts are described.

[0120] In this embodiment, the basic structure of the flipper 250 is the same as that of the embodiment of Figure 1 , but the rotating part 255 of the flipper 250 is different from that of the embodiment of Figure 19 ​In an embodiment, one side of the flipper 250 is connected to the first inspection unit 160a, and the flipper 250 is supported by two conveyance rails 270, 271 spaced apart in the Y direction and moves in the X direction. The conveyance rails 270, 271 extend to the first inspection unit 160a to the extent that the semiconductor package 20 placed on the conveyance table 200 can be inspected.

[0121] In the present embodiment, the inspection unit 160 includes the first inspection unit 160a connected to one side of the flipper 250 and moving together with the flipper 250, and the second inspection unit 160b. The first inspection unit 160a includes a vision camera and a moving unit 161 moving the vision camera in the Y direction, and moves in the X direction together with the flipper 250 and in the Y direction by the moving unit 161. The vision camera is disposed to face upward or downward, and can inspect the upper surface of the semiconductor package 20 located below the flipper 250.

[0122] The first inspection unit 160a photographs the semiconductor package placed on the buffer table 210 or the semiconductor package 20 placed on the conveyance table 200.

[0123] On the other hand, the conveyance table 200 (see Figure 1 ) moves in the Y direction, and the semiconductor package 20 on the conveyance table 200 is inspected for the lower surface by the second inspection unit 160b in a state of being sucked by the chip picker 190. The semiconductor package 20 is placed on the tray 170 according to the inspection result.

[0124] Figure 20 A schematic flowchart of a semiconductor package sorting method according to an embodiment of the present application is shown.

[0125] The semiconductor package sorting method according to an embodiment includes a step S140 of checking whether or not to flip the upward or downward setting of the semiconductor package, a flipper transfer step S150 of transferring the semiconductor package to be cleaned to a flipper in the case of flipping, and a buffer table transfer step S200 of transferring the semiconductor package to be cleaned to a buffer table in the case of not flipping.

[0126] In addition, the semiconductor package classification method can further include a material supply step S100 of supplying a semiconductor strip to inside of the apparatus, a material transfer step S110 of moving the supplied material to the cutting section, a cutting step S120 of cutting the transferred semiconductor strip into semiconductor packages, and a cleaning step S130 of cleaning the cut semiconductor packages with a cleaning liquid. Since the semiconductor package classification method of the present embodiment includes the cutting step S120 of cutting the semiconductor strip into semiconductor packages, it can also be referred to as a semiconductor strip cutting and classification method, and on the other hand, the step of checking the setting of the upside down of the semiconductor packages is performed after the cleaning step S130.

[0127] In addition, the semiconductor package classification method can further include a flip and transfer stage S160 of continuously performing after the flipper transfer step S150 and changing the upside down of the semiconductor packages by the flipper and transferring to the transfer stage, a first face inspection step S170 of inspecting the upper surface of the semiconductor packages seated on the transfer stage, and a second face inspection step S180 of inspecting the lower surface of the semiconductor packages in a state of being sucked by the chip picker.

[0128] The semiconductor package classification method can further include a transfer stage transfer step S210 of continuously performing after the buffer stage transfer step S200 and moving the semiconductor packages transferred to the buffer stage to the transfer stage by the flipper, a second face inspection step S220 of inspecting the upper surface of the semiconductor packages seated on the transfer stage, a first face inspection step S230 of inspecting the lower surface of the semiconductor packages in a state of being sucked by the chip picker, and a classification step S190 of performing after the second face inspection step S180 or the first face inspection step S230 and classifying the semiconductor packages into a plurality of trays according to the first face and second face inspection results.

[0129] The plurality of steps from after the cleaning step S130 to before the first face inspection or second face inspection step is performed can be referred to as a transfer stage, and the first face inspection steps S170, S230 and the second face inspection steps S180, S220 can be referred to as inspection steps.

[0130] When entering in a dead bug state and the upside down is flipped, the mark inspection can be performed in the first face inspection step S170, and the ball inspection and the alignment inspection can be performed in the second face inspection step S180.

[0131] When entering in a dead bug state and the upside down is not flipped, the ball inspection can be performed in the second face inspection step S220, and the mark inspection and the alignment inspection can be performed in the first face inspection step S230.

[0132] In the classification method of the present embodiment, when the semiconductor package is changed in its upward or downward direction or not, the semiconductor package is moved to the transfer table by the turner, so that an additional unit picker is not required, or the unit picker is not required to be moved to the transfer table, and thus the structure and operation of the apparatus can be simplified.

[0133] On the other hand, when the buffer table transfer step S200 is performed without the turn of the semiconductor package, a drying step of drying the semiconductor package in a state where the semiconductor package is seated on the buffer table can be performed at the same time. The drying can be performed by heating the semiconductor package, and such a drying step is performed in a state where the semiconductor package is seated on the buffer table, so that the semiconductor package does not need to be moved to another structure for drying.

[0134] In addition, the transfer table transfer step includes a first transfer step in which the buffer table is moved to the upper side to transfer a part of the semiconductor package to the turner, a rotation step in which the buffer table is moved to the lower side and the rotating part of the turner is rotated by 180 degrees, and a second transfer step in which the buffer table is moved to the upper side again to transfer the remaining part of the semiconductor package to the turner. As such, since the transfer table transfer step includes a plurality of steps, the semiconductor package can be transferred to a plurality of transfer tables with the buffer table.

[0135] Although the above description is centered on the embodiments of the present application, the present application is not limited thereto, and various modifications can be made to implement it.

Claims

1. A semiconductor package sorting device, characterized in that, include: Unit pickup, used for vacuum adsorption and pickup of semiconductor packages; A buffer platform, including a disk on which the semiconductor package is loaded; A conveyor is positioned on the opposite side of the unit pickup with the buffer platform at its center, and loads and conveys the semiconductor package. The flipper includes a rotating part that vacuum-adsorbs the semiconductor package and rotates about a first direction, and a moving part connected to the rotating part that moves the rotating part horizontally in a second direction perpendicular to the first direction between the upper part of the buffer stage and the upper part of the transfer stage. An inspection unit is disposed on the moving path of the semiconductor package to inspect the semiconductor package; as well as A control unit is connected to the unit pickup, the buffer platform, and the flipper. The control unit controls the unit pickup, the buffer platform, and the flipper in the following manner: When the semiconductor package is kept facing up or down in the semiconductor package sorting device, the semiconductor package is loaded onto the buffer table by the unit picker, and the flipper adsorbs the semiconductor package loaded on the buffer table and then conveys it to the transfer table while keeping the semiconductor package facing up or down. When the semiconductor package is flipped up or down in the semiconductor package sorting device, the unit picker loads the semiconductor package onto the flipper, and the flipper flips the semiconductor package up or down and then conveys it to the conveyor.

2. The semiconductor package sorting device as described in claim 1, characterized in that, Also includes: The cutting section cuts the semiconductor strip into the semiconductor package; and The cleaning unit cleans the cut semiconductor package. The unit pickup passes through the cleaning section while picking up the semiconductor package, and the buffer stage is disposed between the cleaning section and the transfer stage.

3. The semiconductor package sorting device as described in claim 2, characterized in that, The buffer platform also includes a height adjustment unit for adjusting the height of the disk.

4. The semiconductor package sorting device as described in claim 1, characterized in that, The inspection section includes a first inspection section connected to one side of the flipper and moving together with the flipper, and disposed facing downward.

5. The semiconductor package sorting device as described in claim 1, characterized in that, The flipper also includes a frame surrounding the rotating part; The rotating part includes a first adsorption disk disposed on one side and a second adsorption disk disposed on the opposite side of the first adsorption disk.

6. The semiconductor package sorting device as described in claim 5, characterized in that, The rotating part further includes: a first adsorption line connected to the adsorption source; a first adsorption cavity located inside the first adsorption disk and connected to the first adsorption disk and the first adsorption line; a second adsorption line separated from the first adsorption line; and a second adsorption cavity located inside the second adsorption disk and connected to the second adsorption line and the second adsorption disk.

7. The semiconductor package sorting device as described in claim 5, characterized in that, The first and second adsorption disks are divided into multiple columns and rows; The first adsorption disk includes a first adsorption portion that adsorbs the semiconductor package in odd-numbered columns of odd-numbered rows and even-numbered columns of even-numbered rows; The second adsorption disk includes a second adsorption portion that adsorbs the semiconductor package in odd-numbered rows and even-numbered columns.

8. The semiconductor package sorting device as described in claim 7, characterized in that, The first adsorption disk also includes a second adsorption section; The rotating part further includes: a first adsorption line connected to the first adsorption part of the first adsorption disk; a second adsorption line connected to the second adsorption part of the second adsorption disk; and a third adsorption line connected to the second adsorption part of the first adsorption disk.

9. The semiconductor package sorting device as described in claim 7, characterized in that, The transmission station includes a first transmission station and a second transmission station; The first conveyor includes a first tray that receives the semiconductor package attached to the first adsorption portion of the flipper at its upper part, a first height adjustment portion connected to the first tray to adjust its height, and a first moving portion connected to the first tray and moving the first tray in the first direction; The second conveyor includes a second disk that receives the semiconductor package attached to the second adsorption portion of the flipper at its upper part, a second height adjustment portion connected to the second disk to adjust its height, and a second moving portion connected to the second disk and moving the second disk in the first direction.

10. The semiconductor package sorting device as described in claim 9, characterized in that, Also includes: A chip picker for moving the semiconductor package of the first conveyor and the second conveyor; Multiple trays are used to place the semiconductor package according to the inspection results of the inspection unit; The inspection unit includes a first inspection unit disposed on the upper side of the movement path of the first conveyor and the second conveyor, and a second inspection unit disposed on the lower part of the movement path of the chip pickup.

11. The semiconductor package sorting device as described in claim 2, characterized in that, The unit picker moves along a first transfer guide rail extending in the second direction above the cutting section and the buffer table. The flipper moves along a second conveying rail that extends in the second direction at a lower height than the first conveying rail.

12. The semiconductor package sorting device as claimed in claim 1, characterized in that, Only the flipper conveys the semiconductor package to the transfer table.

13. A method for classifying semiconductor packages, characterized in that, include: The transfer step involves transferring the semiconductor package to the transfer table; Inspection steps include inspecting the semiconductor package placed on the conveyor. as well as The classification step involves classifying the semiconductor package based on the results of the inspection step. During the transfer step, the semiconductor package may be flipped or maintained in either the upward or downward orientation. In the transfer step, when the semiconductor package is flipped up or down, the semiconductor package is loaded onto the flipper by the unit picker, and the flipper is transferred to the transfer table in the flipped-up or flipped-down state. In the transfer step, while maintaining an upward or downward orientation, the semiconductor package is loaded onto the buffer stage by the unit picker, and the flipper transfers the semiconductor package loaded on the buffer stage to the transfer stage while maintaining an upward or downward orientation.

14. The semiconductor package classification method as described in claim 13, characterized in that, Also includes: The dicing step involves cutting the semiconductor strip into the semiconductor package. as well as The cleaning step involves cleaning the cut semiconductor package. The transfer step includes a buffer table transfer step performed while maintaining an upward or downward orientation, wherein the cleaned semiconductor package is loaded onto the buffer table. The process includes a transfer step where the flipper is used to pick up the semiconductor package loaded on the buffer platform and transfer it to the transfer platform.

15. The semiconductor package classification method as described in claim 14, characterized in that, The drying step of drying the semiconductor package is performed together with the buffer stage transfer step.

16. The semiconductor package classification method as described in claim 14, characterized in that, The transmission steps of the conveyor platform include: In the first transfer step, the buffer stage moves upward to transfer a portion of the semiconductor package to the flipper. In the rotation step, the buffer platform moves downward and the rotating part of the flipper rotates 180 degrees. In the second transfer step, the buffer platform moves upward again to transfer the remaining semiconductor package to the flipper.

17. A semiconductor package sorting device, characterized in that, include: The dicing section cuts semiconductor strips into semiconductor packages; The cleaning unit cleans the cut semiconductor package. The unit pickup vacuum adsorbs and picks up the semiconductor package, causing it to pass through the cleaning section; A conveyor platform for loading the semiconductor package; A buffer table is disposed between the cleaning section and the transfer table, and includes a tray loaded with the semiconductor package. The flipper includes a rotating part that vacuum-adsorbs the semiconductor package and rotates about a first direction, and a moving part connected to the rotating part that moves the rotating part horizontally in a second direction perpendicular to the first direction between the upper part of the buffer stage and the upper part of the transfer stage. The first inspection unit is located on the upper side of the moving path of the conveyor; A chip picker moves the semiconductor package that has passed through the transfer table of the first inspection unit. The second inspection unit is located at the lower part of the moving path of the chip pickup; Multiple trays are used to place the semiconductor packages according to the inspection results of the first inspection unit and the second inspection unit; as well as The control unit is at least connected to the unit pickup, the buffer platform, and the flipper. The control unit controls the unit pickup, the buffer platform, and the flipper in the following manner: When the semiconductor package is kept facing up or down in the semiconductor package sorting device, the semiconductor package is loaded onto the buffer table by the unit picker, and the flipper adsorbs the semiconductor package loaded on the buffer table and then conveys it to the transfer table while keeping the semiconductor package facing up or down. When the semiconductor package is flipped up or down in the semiconductor package sorting device, the unit picker loads the semiconductor package onto the flipper, and the flipper flips the semiconductor package up or down and then conveys it to the conveyor.

18. The semiconductor package sorting apparatus as described in claim 17, characterized in that, The buffer platform includes a height adjustment unit connected to the disk to adjust the height of the disk.

19. The semiconductor package sorting apparatus as described in claim 17, characterized in that, The flipper also includes a frame surrounding the rotating part. The rotating part includes: A pair of rotating shafts are connected to the frame; The first adsorption plate is located on one side; The second adsorption disk is located on the opposite side of the first adsorption disk; The first adsorption line enters the rotating part through one of the rotating shafts and is connected to the first adsorption disk. The second adsorption line enters the rotating part through another of the rotating shafts and is connected to the second adsorption disk; The first adsorption line and the second adsorption line operate independently.

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