A delivery system for storing samples

Abstract

The application provides a sample storage conveying system, which comprises a fixed frame, a heat accumulator fixedly installed on one side of the heat accumulator, mounting holes formed in the two sides of the fixed frame, an installation door hingedly connected to the inner wall surface of the mounting hole, and a semiconductor sample arranged in the fixed frame; and a temperature control assembly arranged in the fixed frame and used for controlling the temperature of the semiconductor sample. The fixed frame is composed of a heating chamber and a central isolation chamber and a cooling chamber, so that the heat carried by the conveying system between the heating chamber and the cooling chamber is reduced when the semiconductor sample is conveyed, thereby improving the practicability of the conveying system. The fan can be installed through the fixed hole, so that the conveying system can be circulated and cooled by the fan, air is blown from the lower structure, and air circulation is realized through a separate heat exchanger.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor handling, and in particular to a sample storage and handling system. BACKGROUND

[0002] Processes for manufacturing semiconductors have stringent standards that require wafers and packaged chips to be tested in a variety of ways to ensure that they can survive the most extreme environments and hazardous conditions. One phase of the testing process is to evaluate whether the chips can operate at extremely low and high temperatures. Depending on the standards for a particular type of chip, the temperature range can be -20°C to +40°C, -50°C to +60°C, -65°C to +150°C, or a combination of various temperatures. Some standards require multiple repeated cycles of these extreme temperatures, alternating between very high and very low temperatures, for as many as 100, 500, 1000, 5000 times, or until the chip fails. Other standards can require rapid changes in temperature, sometimes referred to as "thermal shocks," and apply these shocks to the packaged chip for hundreds or thousands of times.

[0003] There are currently two types of equipment designs used in the market. In one version, the sample being tested is fixed in a chamber, and separate hot and cold chambers are connected to this chamber by air ducts. The equipment automatically opens or closes different valves by programming and uses fans to blow hot or cold air through the sample area. This method is the simplest in design and has the lowest manufacturing cost, but the energy consumption is extremely high because the entire chamber needs to be heated and cooled for each cycle. In addition, the air flow is not very uniform, and the time required to complete all cycles is long. The second method uses two chambers that maintain cold and hot temperatures. An elevator moves the sample between the two chambers, and the air inside the chambers is blown to change the temperature of the sample. This seems more efficient at first glance because there is no separate heating and cooling chamber for each cycle. However, the elevator structure retains a large amount of heat that must be exchanged in each cycle, and the method of elevating the elevator allows heat to leak between the chambers, and the close proximity of the hot and cold chambers allows heat to transfer between them. SUMMARY

[0004] The present application aims to provide a sample storage and handling system that overcomes the above problems or at least partially solves the above problems to solve the problem of the elevator structure retaining a large amount of heat that must be exchanged in each cycle, the method of elevating the elevator allowing heat to leak between the chambers, and the close proximity of the hot and cold chambers allowing heat to transfer between them.

[0005] To achieve the above purpose, the technical scheme of the present application is as follows:

[0006] The application provides a sample storage conveying system, which comprises a fixed frame, the top surface and the bottom surface of the fixed frame are fixedly provided with bearing plates, one side of the bearing plate is fixedly provided with a heat accumulator, both sides of the fixed frame are provided with mounting holes, the inner wall surface of the mounting hole is hingedly connected with a mounting door, the inside of the fixed frame is provided with a semiconductor sample and a temperature control assembly.

[0007] By adopting the above technical scheme, the fixed frame is provided, the fixed frame is composed of a heating chamber and a central isolation chamber and a cooling chamber, the heat carried by the conveying system between the heating chamber and the cooling chamber is reduced when the semiconductor sample is conveyed, and the practicability of the conveying system is improved.

[0008] As a further scheme of the application, the temperature control assembly comprises a heating module, the heating module is fixedly installed on the bottom surface of the bearing plate, the bottom surface of the bearing plate is fixedly provided with a cooling module, the inner wall surface of the fixed frame is fixedly provided with two isolation plates, the side of the isolation plate is provided with a limiting hole, one side of the fixed frame is provided with a fixed hole, the inner circular wall surface of the fixed hole is fixedly provided with a fan, and the heat accumulator corresponds to the fan.

[0009] By adopting the above technical scheme, the fixed hole is provided, the fan can be installed through the fixed hole, the conveying system can circulate and radiate heat through the fan, air is blown out from the lower structure, and the air is circulated through a separate heat exchanger, after the semiconductor sample is heated by the heating module, the heat of the conveying system is stored by the separate heat exchanger in the heat accumulator, after the semiconductor sample is cooled by the cooling assembly, the heat of the conveying system is released by the separate heat exchanger in the heat accumulator, and the temperature control efficiency of the temperature control assembly is improved.

[0010] As a further scheme of the application, the top surface of the bearing plate is provided with two mounting frames, the inner wall surface of the mounting frame is provided with a conveyor belt, the bottom surface of the mounting frame is fixedly provided with a top plate, and the bottom surface of the top plate is fixedly provided with a plurality of heat exchange fins.

[0011] By adopting the above technical scheme, the top plate is provided, the heat exchange fins can be installed through the top plate, the material of the top plate is graphene, which is an ideal material, and the top plate has high thermal conductivity and low density, and the material of the heat exchange fins is aluminum, which has low density and high thermal conductivity.

[0012] As a further scheme of the application, the bottom surface of the mounting frame is fixedly provided with a support column at four corners, the bottom surface of the support column is provided with a limiting groove, the inner wall surface of the limiting groove is provided with a rotating groove on both sides, and the inner circular wall surface of the rotating groove is movably provided with a wheel.

[0013] By adopting the technical scheme, the support column is made of stainless steel sheet to provide strength and store a small amount of heat.

[0014] As a further scheme of the present application, one side of the mounting frame is fixedly provided with a placing plate, the top surface of the conveying belt is provided with a placing block, the top surface of the placing block is provided with two placing grooves, and the inner wall surface of the placing grooves movably sleeves the outer wall surface of the semiconductor sample.

[0015] By adopting the technical scheme, the placing grooves are arranged to place the semiconductor sample, avoid shaking of the semiconductor sample on the conveying belt, and improve the conveying efficiency of the conveying system.

[0016] As a further scheme of the present application, the top surface of the mounting frame is fixedly provided with a mounting block, the bottom surface of the mounting block is provided with a containing groove, and the inner wall surface of the containing groove is fixedly provided with an infrared scanner.

[0017] By adopting the technical scheme, the mounting block is arranged to mount the infrared scanner, so that the infrared scanner can identify and track each sample and cooperate with the database of the computer control system.

[0018] As a further scheme of the present application, the bottom surface of the bearing plate is fixedly provided with a fixed block, the top surface of the fixed block is provided with a fixed groove, and the inner circular wall surface of the fixed groove is fixedly sleeved with a driving motor.

[0019] By adopting the technical scheme, the fixed block is arranged to mount the driving motor, so that the driving motor can drive the rotating disc and the mechanical hand to rotate, thereby facilitating taking and moving the semiconductor sample.

[0020] As a further scheme of the present application, one end of the rotating shaft of the driving motor is fixedly provided with a rotating disc, and the top surface of the rotating disc is fixedly provided with a mechanical hand.

[0021] By adopting the technical scheme, the mechanical hand is arranged to exchange the semiconductor sample on the left conveying belt with the semiconductor sample on the right conveying belt, thereby avoiding manual intervention and saving a large amount of labor cost.

[0022] The present application provides a conveying system for storing samples, which has the following advantages:

[0023] By setting the temperature control assembly, the fan can be installed through the fixing hole, the conveying system can circulate heat dissipation through the fan, air is blown under the structure, and air circulation is realized through the separate heat exchanger. After the semiconductor sample is heated by the heating module, the conveying system stores heat through the separate heat exchanger inside the heat accumulator, and after the semiconductor sample is cooled by the cooling assembly, the heat of the conveying system is released through the separate heat exchanger inside the heat accumulator, thereby improving the temperature control efficiency of the temperature control assembly. The heat exchange fins can be installed on the top plate, and the material of the top plate is graphene, which is an ideal material with high thermal conductivity and low density. The material of the heat exchange fins is aluminum, which has low density and high thermal conductivity.

[0024] By setting the fixed frame, the fixed frame is composed of a heating chamber and a central isolation chamber, and a cooling chamber, so that the heat carried by the conveying system between the heating chamber and the cooling chamber is reduced when the semiconductor sample is transported, thereby improving the practicality of the conveying system. By setting the support column, the support column is made of stainless steel sheet to provide strength and store a small amount of heat.

[0025] By setting the placing groove, the semiconductor sample can be placed in the placing groove, avoiding the shaking of the semiconductor sample on the conveyor belt, thereby improving the conveying efficiency of the conveying system. By setting the mounting block, the infrared scanner can be installed on the mounting block, so that the infrared scanner can identify and track each sample and cooperate with the database of the computer control system.

[0026] By setting the fixing block, the driving motor can be installed on the fixing block, so that the driving motor can drive the rotating disc and the mechanical hand to rotate, thereby facilitating the taking and moving of the semiconductor sample. By setting the mechanical hand, the semiconductor sample on the left conveyor belt can be exchanged with the semiconductor sample on the right conveyor belt through the mechanical hand, thereby avoiding manual intervention and saving a large amount of labor cost. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without creative labor.

[0028] Figure 1 The three-dimensional structure schematic diagram provided by the embodiment of the present application;

[0029] Figure 2 The split structure schematic diagram provided by the embodiment of the present application;

[0030] Figure 3 The placement plate structure schematic diagram provided for the embodiment of the present application;

[0031] Figure 4 The mounting block structure schematic diagram provided for the embodiment of the present application;

[0032] Figure 5 The fixing block structure schematic diagram provided for the embodiment of the present application;

[0033] Figure 6 For Figure 3 The local structure amplification schematic diagram of A in the middle;

[0034] Figure 7 The system block schematic diagram provided for the embodiment of the present application.

[0035] In the figure: 1, fixed frame; 2, bearing plate; 3, heat accumulator; 4, mounting hole; 5, mounting door; 6, heating module; 7, cooling module; 8, isolation plate; 9, limiting hole; 10, fixed hole; 11, fan; 13, mounting frame; 14, conveyor belt; 15, top plate; 16, heat exchange fin; 17, support column; 18, limiting groove; 19, rotating groove; 20, wheel; 21, placement plate; 22, placement block; 23, placement groove; 24, semiconductor sample; 25, mounting block; 26, containing groove; 27, infrared scanner; 28, fixing block; 29, fixed groove; 30, driving motor; 31, rotating disc; 32, mechanical hand. DETAILED DESCRIPTION

[0036] Exemplary embodiments of the present disclosure will be described hereinafter in greater detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it is understood that the present disclosure can be embodied in various forms without being limited by the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art.

[0037] Referring to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7The embodiment of the application provides a conveying system for storing samples, which comprises a fixed frame 1, the top surface and the bottom surface of the fixed frame 1 are fixedly connected with bearing plates 2, one side of the bearing plate 2 is fixedly connected with a heat accumulator 3, both sides of the fixed frame 1 are provided with mounting holes 4, the inner wall surface of the mounting hole 4 is hingedly connected with a mounting door 5, one side of the fixed frame 1 is fixedly provided with a PLC controller, the PLC controller is electrically connected with the heat accumulator 3, a fan 11, a conveying belt 14, an infrared scanner 27, a driving motor 30 and a mechanical hand 32, the PLC controller, the heat accumulator 3, the fan 11, the conveying belt 14, the infrared scanner 27, the driving motor 30 and the mechanical hand 32 are existing structures and will not be repeated, the inside of the fixed frame 1 is provided with a semiconductor sample 24, the semiconductor sample 24 is an existing structure and will not be repeated, the inside of the fixed frame 1 is provided with a temperature control assembly for temperature control of the semiconductor sample 24, the fixed frame 1 is composed of a heating chamber and a central isolation chamber and a cooling chamber, so that the heat carried by the conveying system between the heating chamber and the cooling chamber is reduced when the semiconductor sample 24 is conveyed, thereby improving the practicability of the conveying system, the top surface of the bearing plate 2 is provided with two mounting frames 13, the inner wall surface of the mounting frame 13 is provided with the conveying belt 14, the bottom surface of the mounting frame 13 is fixedly connected with a top plate 15, the bottom surface of the top plate 15 is fixedly connected with a plurality of heat exchange fins 16, the top plate 15 can be used for mounting the heat exchange fins 16, the material of the top plate 15 is graphene which is an ideal material and has high thermal conductivity and low density, and the material of the heat exchange fins 16 is aluminum which has low density and high thermal conductivity.

[0038] Referring to Figure 2 , Figure 3 and Figure 6 , the bottom surface of the mounting frame 13 is fixedly connected with support columns 17 at four corners, the bottom surface of the support column 17 is provided with a limiting groove 18, the inner wall surface of the limiting groove 18 is provided with rotating grooves 19 at both sides, the inner circular wall surface of the rotating groove 19 is movably sleeved with wheels 20, the support column 17 is made of stainless steel sheet to provide strength and store a small amount of heat, one side of the mounting frame 13 is fixedly connected with a placing plate 21, the top surface of the conveying belt 14 is provided with a placing block 22, the top surface of the placing block 22 is provided with two placing grooves 23, the inner wall surface of the placing groove 23 is movably sleeved with the outer wall surface of the semiconductor sample 24, the placing groove 23 can be used for placing the semiconductor sample 24, and the semiconductor sample 24 is prevented from shaking on the conveying belt 14, thereby improving the conveying efficiency of the conveying system.

[0039] Referring to Figure 2 , Figure 3 , Figure 4 and Figure 5The top surface of the mounting frame 13 is fixedly connected with a mounting block 25, the bottom surface of the mounting block 25 is provided with an accommodating groove 26, the inner wall surface of the accommodating groove 26 is fixedly connected with an infrared scanner 27, the infrared scanner 27 can be installed through the mounting block 25, the infrared scanner 27 can identify and track each sample and cooperate with a database of a computer control system, the bottom surface of the bearing plate 2 is fixedly connected with a fixed block 28, the top surface of the fixed block 28 is provided with a fixed groove 29, the inner circular wall surface of the fixed groove 29 is fixedly sleeved with a driving motor 30, the driving motor 30 can be installed through the fixed block 28, the driving motor 30 can drive the rotating disc 31 and the mechanical hand 32 to rotate, thereby facilitating the semiconductor sample 24 to be taken and moved.

[0040] Referring to Figure 1 , Figure 2 and Figure 5 , one end of the rotating shaft of the driving motor 30 is fixedly connected with the rotating disc 31, the top surface of the rotating disc 31 is fixedly connected with the mechanical hand 32, the semiconductor sample 24 on the left conveying belt 14 and the semiconductor sample 24 on the right conveying belt 14 can be exchanged back and forth through the mechanical hand 32, thereby avoiding manual intervention, and a large amount of labor cost is saved, the temperature control assembly comprises a heating module 6, the heating module 6 is fixedly connected to the bottom surface of the bearing plate 2, the bottom surface of the bearing plate 2 is fixedly connected with a cooling module 7, the inner wall surface of the fixed frame 1 is fixedly connected with two isolation plates 8, the side of the isolation plate 8 is provided with a limiting hole 9, one side of the fixed frame 1 is provided with a fixed hole 10, the inner circular wall surface of the fixed hole 10 is fixedly sleeved with a fan 11, the heat accumulator 3 corresponds to the fan 11, the fan 11 can be installed through the fixed hole 10, the conveying system can circulate and radiate heat through the fan 11, air is blown from the lower structure, and air is circulated through a separate heat exchanger, after the semiconductor sample 24 is heated by the heating module 6, the heat of the conveying system is stored through the separate heat exchanger in the heat accumulator 3, after the semiconductor sample 24 is cooled by the cooling assembly, the heat of the conveying system is released through the separate heat exchanger in the heat accumulator 3, thereby improving the temperature control efficiency of the temperature control assembly.

[0041] Working principle: please refer to Figures 1-7As shown, in use, the worker can first place the semiconductor sample 24 in the placement groove 23, and then place the placement block 22 on the top surface of the conveying belt 14, and then start the heating module 6 and the cooling module 7, the fan 11 and the heat accumulator 3 through the PLC controller, the fan 11 can be installed through the fixing hole 10, so that the conveying system can be circulated and cooled through the fan 11, air is blown from the lower structure, and the air is circulated through a separate heat exchanger, after the semiconductor sample 24 is heated by the heating module 6, the heat of the conveying system is stored through the separate heat exchanger inside the heat accumulator 3, after the semiconductor sample 24 is cooled by the cooling assembly, the heat of the conveying system is released through the separate heat exchanger inside the heat accumulator 3, thereby improving the temperature control efficiency of the temperature control assembly, the infrared scanner 27 can be installed through the mounting block 25, so that the infrared scanner 27 can identify and track each sample and cooperate with the database of the computer control system, and then the placement block 22 is transmitted under the action of the conveying belt 14, the driving motor 30 can be installed through the fixing block 28, so that the driving motor 30 can drive the rotating disc 31 and the mechanical hand 32 to rotate, thereby facilitating the taking and moving of the semiconductor sample 24.

[0042] When the air circulates under the conveying system and through the heat exchanger, it releases heat from the conveying system and saves it to the heat storage material, in this way, nearly 50% of the heat can be discharged and stored, which will significantly reduce the energy consumption of the cold room cooling system, when the samples complete the test in the cold room, they pass through the central isolation chamber again. The fan 11 circulates the air between the conveying system and the heat exchanger again, and returns part of the stored heat to the conveying system, which also reduces the energy consumption in the hot room heating system.

[0043] The above is only an embodiment of the present application and is not intended to limit the present application. Those skilled in the art can make various changes and modifications to the present application. Any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application shall be included in the scope of the claims of the present application.

Claims

1. A transport system for storing samples, characterized in that, The utility model relates to a semiconductor sample storage device, including: Fixed frame (1), the top surface and bottom surface of fixed frame (1) are fixedly installed with load bearing plate (2), one side of load bearing plate (2) is fixedly installed with heat accumulator (3), both sides of fixed frame (1) are all set up with mounting hole (4), the inner wall surface of mounting hole (4) is hinged with installation door (5), the inside of fixed frame (1) is provided with semiconductor sample (24); Temperature control assembly, temperature control assembly is set up in the inside of fixed frame (1), is used for the temperature control of semiconductor sample (24), temperature control assembly includes heating module (6), heating module (6) is fixedly installed at the bottom of load bearing plate (2), the bottom of load bearing plate (2) is fixedly installed with cooling module (7), the inner wall surface of fixed frame (1) is fixedly installed with two isolation plates (8), one side of isolation plate (8) is set up with limit hole (9), one side of fixed frame (1) is set up with fixed hole (10), the inner circular wall surface of fixed hole (10) is fixedly covered with fan (11), heat accumulator (3) corresponds with fan (11); The top surface of load bearing plate (2) is provided with two mounting frames (13), the inner wall surface of mounting frame (13) is provided with a conveyor belt (14), the bottom surface of mounting frame (13) is fixedly installed with a top plate (15), the bottom surface of top plate (15) is fixedly installed with a plurality of heat exchange fins (16).

2. A transport system for storing samples as claimed in claim 1, wherein, The bottom surface of the mounting frame (13) is fixedly installed with a support column (17) at the four corners, a limiting groove (18) is formed in the bottom surface of the support column (17), rotating grooves (19) are formed in the inner wall surface on both sides of the limiting groove (18), and a wheel (20) is movably sleeved on the inner circular wall surface of the rotating groove (19).

3. A transport system for storing samples as claimed in claim 2, wherein, One side of the mounting frame (13) is fixedly installed with a placing plate (21), the top surface of the conveyor belt (14) is provided with a placing block (22), two placing grooves (23) are formed in the top surface of the placing block (22), and the inner wall surface of the placing groove (23) is movably sleeved with the outer wall surface of the semiconductor sample (24).

4. A transport system for storing samples as claimed in claim 3, wherein, The top surface of the mounting frame (13) is fixedly installed with a mounting block (25), a receiving groove (26) is formed in the bottom surface of the mounting block (25), and an infrared scanner (27) is fixedly installed on the inner wall surface of the receiving groove (26).

5. The transport system for storing samples of claim 1, wherein, The bottom surface of the load bearing plate (2) is fixedly installed with a fixed block (28), a fixed groove (29) is formed in the top surface of the fixed block (28), and a drive motor (30) is fixedly sleeved on the inner circular wall surface of the fixed groove (29).

6. A transport system for storing samples as claimed in claim 5, wherein, One end of the rotating shaft of the drive motor (30) is fixedly installed with a rotating disc (31), and a mechanical hand (32) is fixedly installed on the top surface of the rotating disc (31).

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