Method for removing adhesive tape pasted on substrate

Abstract

The present invention relates to the field of thin film preparation technology, and in particular to a method for removing an adhesive tape adhered to a substrate. A starting portion of the adhesive tape is provided on the substrate, and the adhesive tape adheres to at least a portion of the starting portion. The adhesive tape is removed from the starting portion and gradually peeled off the substrate, while the peeled tape is simultaneously wound and collected. Advantages of the present invention include: fully automatic removal of the adhesive tape adhered to the substrate, improved removal efficiency and quality, and avoidance of damage to the substrate; substrates with the starting portion still meet the requirements of the coating process, without affecting the quality of the coating process; and a simple and reasonable structure, ease of use, and suitability for widespread use.

Description

Technical Field

[0001] The invention relates to the technical field of thin film preparation, in particular to a method for removing an adhesive tape stuck on a substrate. Background Art

[0002] Vacuum coating technology is increasingly being used, playing a significant role in industrial production and scientific research. Simultaneously, due to the advantages of automation in reducing costs and increasing efficiency, market demand for automated vacuum coating equipment is also increasing.

[0003] The automated substrate handling system is an important component of automated vacuum coating equipment, and is divided into a vacuum automated handling mechanism and an automated loading and unloading mechanism in an atmospheric environment. During the magnetron sputtering vacuum coating process of substrates, the substrate is usually first attached to a carrier substrate and then enters the coating chamber for vacuum coating. In practical applications, the substrate can be attached to the carrier substrate by utilizing the adhesive effect of the tape. In the above application scenario, the automated unloading process in an atmospheric environment mainly includes two processes: automatic substrate removal and automatic tape tearing. In order to ensure the stability of the substrate during coating, a double-sided tape with strong adhesion is generally used, which is bonded between the substrate and the substrate. At present, how to use an automated mechanism to remove the tape with strong adhesion from the substrate without damaging the substrate is an urgent problem to be solved in the automatic tape tearing process. Summary of the Invention

[0004] The purpose of the present invention is to provide a method for removing the tape pasted on a substrate based on the above-mentioned deficiencies of the prior art. By setting a starting part of the tape on the substrate and cooperating with a lifting mechanism, the tape can be removed from the starting part position. At the same time, it can also cooperate with a walking and winding mechanism to realize automatic tape removal and collection.

[0005] The purpose of the present invention is achieved by the following technical solutions:

[0006] A method for removing an adhesive tape stuck on a substrate is characterized in that: a starting portion of the adhesive tape is provided on the substrate, and the sticking range of the adhesive tape at least covers a portion of the starting portion; the adhesive tape is peeled off from the starting portion and gradually peeled off from the substrate, and the peeled adhesive tape is wound and collected at the same time.

[0007] The starting portion is a lifting groove opened on the substrate, and the sticking range of the adhesive tape at least covers a part of the lifting groove, that is, the sticking of the adhesive tape is suspended across at least a part of the lifting groove.

[0008] A liftable top block is provided on one side of the lifting groove, and the top block is used to partially fill the through portion of the lifting groove when the adhesive tape is pasted.

[0009] The width of the top block and the lifting groove adapted therewith are less than or equal to the width of the adhesive tape.

[0010] The groove is a diameter-changing groove body, the upper opening of which is larger than the lower opening and a step is formed at the diameter-changing connection.

[0011] The starting portion is located outside a film forming area of ​​the substrate.

[0012] The lifting of the adhesive tape refers to clamping the adhesive tape at the starting portion by a lifting mechanism, and then the lifting mechanism moves along the peeling direction of the adhesive tape to lift the adhesive tape.

[0013] The peeling and winding collection of the tape refers to sticking the peeled tape on a winding shaft of a walking winding mechanism, and the walking winding mechanism gradually peels the tape from the substrate by walking, while the winding shaft rotates and winds the tape for collection.

[0014] A plurality of adhesive tapes are pasted on the substrate, and each of the adhesive tapes has a corresponding starting portion on the substrate.

[0015] A plurality of adhesive tapes are pasted on the substrate, and each of the adhesive tapes has a corresponding starting portion on the substrate.

[0016] The advantages of the present invention are: it realizes the full-automatic removal of the tape pasted on the substrate, improves the removal efficiency and quality, and avoids damage to the substrate; the substrate with the starting head still meets the requirements of the coating process and does not affect the quality of the coating process; the structure is simple and reasonable, easy to use, and suitable for promotion. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Schematic diagram of the structure of the substrate and the tape in the present invention;

[0018] Figure 2 This is a schematic diagram of the use state of the lifting mechanism of the present invention;

[0019] Figure 3 It is a structural diagram of the lifting mechanism in the present invention;

[0020] Figure 4 Schematic diagram of the lifting action of the lifting mechanism in the present invention;

[0021] Figure 5 It is a structural schematic diagram of the walking and winding mechanism in the present invention;

[0022] Figure 6 Schematic diagram of the cooperation between the lifting mechanism and the traveling and winding mechanism in the present invention;

[0023] Figure 7Schematic diagram of the installation structure of the winding shaft in the present invention;

[0024] Figure 8 It is a structural schematic diagram of the pasting structure in the present invention;

[0025] Figure 9 This is a schematic diagram of the use status of the top block in the present invention. DETAILED DESCRIPTION

[0026] The features of the present invention and other related features are further described in detail below through embodiments in conjunction with the accompanying drawings to facilitate understanding by those skilled in the art:

[0027] like Figure 1-9 As shown in the figure, the marks 1-16 respectively represent: substrate 1, lifting groove 2, tape 3, lifting mechanism 4, clamping hand 5, cylinder 6, air claw 7, clamping finger 8, walking and winding mechanism 9, winding shaft 10, winding motor 11, walking motor 12, clamping nut 13, top block 14, drive device 15, positioning pin 16.

[0028] Example: Figure 1 As shown, the method for removing the tape pasted on the substrate in this embodiment is used to remove several tapes 3 pasted on the substrate 1. The several tapes 3 are used to bond the substrate to the substrate 1 so that the substrate is carried on the substrate 1 and coated in the film forming chamber.

[0029] like Figure 1 As shown, a lift-off groove 2 is defined within the application area of ​​each tape 3 on the substrate 1. This lift-off groove 2 serves as the starting point for the tape 3 when removing it. The lift-off groove 2 is a groove-shaped structure extending through the substrate 1. The application area of ​​the tape 3 covers at least a portion of the lift-off groove 2, meaning that the tape 3 is suspended over at least a portion of the lift-off groove 2.

[0030] In this embodiment, the lift-off groove 2 is located outside the film-forming area of ​​the substrate 1 to avoid adversely affecting the coating process. Furthermore, the groove body of the lift-off groove 2 should be as small as possible to avoid adversely affecting the bonding strength of the individual adhesive tapes 3 and ensure that the adhesive tapes 3 can stably adhere the substrate to the substrate. Furthermore, at least a portion of the lift-off groove 2 is positioned within the adhesive tape 3's adhesion range. In this embodiment, the groove body of the lift-off groove 2 is slightly wider than the width of the adhesive tape 3 to ensure a certain gap between the lift-off groove 2 and the adhesive tape 3, allowing the actuator for lifting the adhesive tape 3 to pass through this gap to lift the adhesive tape 3.

[0031] Combine Figure 2 and Figure 3 As shown, the method for removing the tape stuck on the substrate in this embodiment is achieved by adopting the lifting mechanism 4, but in actual use it is not limited to the lifting mechanism 4 in this embodiment.

[0032] The lifting mechanism 4 is composed of a gripper 5, a cylinder 6 and an air claw 7, wherein the cylinder 6 drives the gripper 5 to extend or retract, and the air claw 7 drives the gripper 5 to clamp or release.

[0033] In this embodiment, the gripper 5 has multiple groups of gripping fingers 8 corresponding to the number of adhesive tapes 3 adhered to the substrate 1. Each group of gripping fingers 8 can perform a gripping or releasing action under the drive of the air gripper 7. Each group of gripping fingers 8 can extend into the gap between the corresponding lifting groove 2 and the adhesive tape 3 to grip the adhesive tape 3.

[0034] The lifting mechanism 4 in this embodiment has the following execution process:

[0035] The air cylinder 6 extends, driving each group of clamping fingers 8 of the clamping hand 5 to enter the gap between the corresponding lifting groove 2 and the tape 3; the air claw 7 drives each group of clamping fingers 8 to close to clamp the tape 3; while the clamping fingers 8 maintain the state of clamping the tape 3, the air cylinder 6 retracts, and each group of clamping fingers 8 of the clamping hand 5 can then lift each tape 3 from the position of each lifting groove 2.

[0036] like Figure 6 As shown, after the lifting mechanism 4 lifts the tape 3, this embodiment uses the walking and winding mechanism 9 to achieve the winding and recycling of the tape 3, but in actual use it is not limited to the walking and winding mechanism 9 in this embodiment.

[0037] like Figure 5 As shown, the walking and winding mechanism 9 is composed of a winding shaft 10, a winding motor 11 and a walking motor 12, wherein the winding motor 11 can drive the winding shaft 10 to rotate, and the walking motor 12 can control the position of the walking and winding mechanism 9 so that it can move back and forth along the direction of the tape and cooperate with the lifting mechanism 4.

[0038] Specifically, the walking and winding mechanism 9 in this embodiment has the following execution process:

[0039] Combine Figure 4 and Figure 6 As shown, after the lifting mechanism 4 grips and lifts the tape 3, the traveling winding mechanism 9, via its traveling motor 12, moves to the position of the lifted tape 3, establishing effective contact between the winding shaft 10 and the tape 3. At this point, the tape 3 and the winding shaft 10 generate a certain degree of adhesion due to the force contact, that is, the tape 3 adheres to the winding shaft 10. Subsequently, the pneumatic gripper 7 of the lifting mechanism 4 releases, and the groups of fingers 8 of the gripper 5 release the tape 3. The traveling winding mechanism 9 then performs the subsequent peeling, winding, and collection of the tape 3.

[0040] Specifically, after the lifting mechanism 4 releases the adhesive tape 3 and the adhesive tape 3 has been bonded to the winding shaft 10, the winding motor 11 drives the winding shaft 10 to start rotating, and the winding shaft 10 starts to wind the adhesive tape 3 and pull the adhesive tape 3 to realize the peeling action. At the same time, the traveling motor 12 drives the traveling winding mechanism 9 to move along the peeling direction of the adhesive tape ( Figure 6 The adhesive tape 3 is moved in the direction of the arrow shown in the figure until the adhesive tape 3 is peeled off from the substrate 1 as a whole. At this time, the entire adhesive tape 3 is wound on the winding shaft 10 to realize the collection of the adhesive tape 3.

[0041] In this embodiment, the winding motor 11 drives the winding shaft 10 to rotate via a belt, ensuring that the traveling winding mechanism 9 continuously peels and collects the waste tape 3 from the substrate 1 while also balancing the difference in tape stripping speed caused by the different diameters of the tape roll on the winding shaft 10. For example, if the diameter of the tape roll on the winding shaft 10 is relatively large, its linear speed will be too fast, resulting in an inability to match the tape stripping speed. In this case, the tension exerted by the tape 3 on the winding shaft 10 will cause the belt to slip, thereby adjusting the winding linear speed and avoiding stripping failures such as tape breakage caused by the linear speed difference.

[0042] like Figure 7 As shown, the ends of the winding shaft 10 in this embodiment are fixed with clamping nuts 13. When the tape roll on the winding shaft 10 reaches a certain diameter, the clamping nuts 13 can be loosened to replace the winding shaft 10. After installing the new winding shaft 10, the clamping nuts 13 at both ends are tightened to continue the automated operation.

[0043] In this embodiment, the lifting structure 4 is only used for the start of the tape 3 on the substrate 1, while the walking and winding mechanism 9 is used for the overall peeling and winding collection of the tape 3 after the start of the tape 3 is lifted up, wherein the overall peeling of the tape 3 is completed by the winding action and the walking action of the walking and winding mechanism 9; through the coordinated action of the above two mechanisms, the tape peeling effect is ensured while avoiding damage to the substrate 1.

[0044] In the specific implementation of this embodiment, the winding shaft 10 can be a consumable material and can be made of economical materials. After being fully wound, it can be directly discarded, which facilitates operation. When selecting the material of the winding shaft 10, the adhesion performance between the winding shaft 10 and the adhesive tape 3 to be removed should be considered. In other words, the adhesive tape 3 to be removed can be effectively adhered to the winding shaft 10 to avoid removal failure due to lack of adhesion between the two.

[0045] The adhesive tape 3 can be automatically bonded to the substrate 1 by an automated mechanism. Generally, the automatic adhesive tape 3 is bonded to the substrate 1 by a pressure wheel. However, since the adhesive tape 3 in the present application is suspended across the lifting groove 2, it will be suspended when the pressure wheel passes through the lifting groove 2, which directly causes the adhesive tape 3 to fail to be bonded.

[0046] Therefore, the peeling method in this embodiment also provides a sticking structure at one side of the peeling groove 2. Figure 8 and Figure 9 As shown, the pasting mechanism includes a liftable top block 14 and a drive device 15. The drive device 15 is used to drive the top block 14 to move, for example, lift and lower in this embodiment. During use, the top block 14 rises during the automatic application of the tape 3 and partially fills the through portion of the lifting groove 2 to support the pressure roller. At this time, the two sides of the tape 3 pasted in the lifting groove 2 are restrained by the top block 14 and the pressure roller, respectively, to straighten it, preventing failure in the automatic application of the tape and further ensuring the flatness of the tape 3 pasted in the lifting groove 2. When the automatic application of the tape is completed, the top block 14, driven by the drive device 15, overcomes the adhesive force between it and the tape through its own power and directly descends and retreats.

[0047] In this embodiment, positioning pins 16 are further provided on the surface of the pasting mechanism, and the positioning pins 16 are used to position the pasting mechanism to ensure that after the pasting mechanism is installed, the positions of the top blocks 14 thereof correspond one to one with the positions of the lifting grooves 2 .

[0048] The structure of the lifting groove 2 can be a groove structure that extends entirely through the substrate 1 or partially through the substrate 1. The structure of the top block 14 is compatible with the through portion of the lifting groove 2, that is, the top block 14 can pass through the through portion of the lifting groove 2 to provide support during the automatic application of the adhesive tape 3.

[0049] In this embodiment, the lifting groove 2 is a variable-diameter groove, with its upper opening larger than its lower opening and a step formed at the junction. The relatively large upper opening allows for a gap between it and the tape 3 for the actuator that lifts the tape, while the relatively small lower opening facilitates the positioning of the lifter block 14, ensuring that it can effectively support the pressure roller that applies the tape.

[0050] At the same time, the width of the top block 14 and the width of the lift-off groove 2 to which it is adapted are generally less than or equal to the width of the tape 3. In this way, the tape 3 can block the through part of the lift-off groove 2 through which the top block 14 passes, thereby minimizing the impact of the lift-off groove 2 on the film forming process, especially avoiding film leakage, that is, avoiding the film material passing through the through part of the lift-off groove 2 to the surface of the substrate 1.

[0051] The tail length of the tape 3 after the groove 2 is removed should be adjusted based on actual conditions. If the tail length of the tape 3 is set too long, it will make it difficult to remove and result in significant tape waste. Conversely, if the tail length is too short and the adhesive strength is weak, there is a risk that the tail of the tape will be deflected when the top block 14 descends. Therefore, the tail length of the tape can be determined through debugging. Furthermore, the top surface of the top block 14 can be sprayed with a coating such as Teflon to reduce the adhesive strength between the top block 14 and the tape 3, thereby appropriately reducing the tail length of the tape 3 and reducing tape waste.

[0052] In addition to using the lifting groove 2 as the starting portion of the adhesive tape 3 in this embodiment, the substrate 1 may also be provided with an undulating adhesive surface, with the lower portion of the adhesive surface being the starting portion of the adhesive tape 3 .

[0053] Although the above embodiments have described in detail the concepts and embodiments of the present invention with reference to the accompanying drawings, ordinary technicians in this field can recognize that various improvements and modifications can still be made to the present invention without departing from the scope of the claims, so they are not described in detail here.

Claims

1. A method for removing an adhesive tape attached to a substrate, characterized in that: A starting portion of the adhesive tape is provided on the substrate, wherein the adhesive tape covers at least a portion of the starting portion; the adhesive tape is peeled off from the starting portion and gradually removed from the substrate, while the peeled adhesive tape is wound and collected; The lifting of the adhesive tape refers to clamping the adhesive tape at the starting portion by a lifting mechanism, and then the lifting mechanism moves along the peeling direction of the adhesive tape to lift the adhesive tape; The stripping and winding collection of the adhesive tape refers to sticking the peeled adhesive tape on a winding shaft of a traveling winding mechanism, wherein the traveling winding mechanism gradually strips the adhesive tape from the substrate by traveling, and the winding shaft rotates to wind the adhesive tape for collection; The starting portion is a lifting groove formed on the substrate, and the adhesive tape is applied to at least a portion of the lifting groove, that is, the adhesive tape is suspended and spans at least a portion of the lifting groove; The starting portion is located outside the film forming area of ​​the substrate; The width of the lifting groove is greater than the width of the adhesive tape, so as to ensure that a gap is left between the lifting groove and the adhesive tape, so that a lifting mechanism for lifting the adhesive tape can lift the adhesive tape through the gap.

2. The method for removing an adhesive tape adhered to a substrate according to claim 1, wherein: A liftable top block is provided on one side of the lifting groove, and the top block is used to partially fill the through portion of the lifting groove when the adhesive tape is pasted.

3. The method for removing an adhesive tape adhered to a substrate according to claim 2, wherein: The width of the top block is less than or equal to the width of the adhesive tape.

4. The method for removing an adhesive tape adhered to a substrate according to claim 3, wherein: The lifting groove is a variable diameter groove body, the upper opening of which is larger than the lower opening and a step is formed at the variable diameter connection point.

5. The method for removing an adhesive tape adhered to a substrate according to claim 1, wherein: A plurality of adhesive tapes are pasted on the substrate, and each of the adhesive tapes has a corresponding starting portion on the substrate.

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