An accelerated storage life test evaluation system for electronic products

Abstract

The present invention relates to an accelerated storage life test and evaluation system for electronic products, belonging to the field of accelerated storage life test technology. It addresses the existing problem of low storage life test and evaluation capabilities for electronic products in China. The system comprises: a high-temperature chamber for heating the electronic product to be evaluated to provide the high-temperature stress environment required for high-temperature stress testing; a control module for controlling and adjusting the temperature of the high-temperature chamber and recording the number and duration of Class A failures that occur during the high-temperature stress test of the electronic product to be evaluated; a fault output module for obtaining the type of failure that occurs during the high-temperature stress test and outputting the fault type to the control module; a test time calculation module for calculating the total test time under normal temperature stress based on the number and duration of Class A failures; and a storage life evaluation module for evaluating the storage life of the electronic product based on the total test time under normal temperature stress.

Description

Technical Field

[0001] The present invention relates to the technical field of accelerated storage life test, and in particular to an accelerated storage life test evaluation system for electronic products. Background Art

[0002] With the rapid advancement of contemporary high-tech, newer, higher and stricter technical requirements have been put forward for various electronic product systems. Subsystem-level and important equipment-level products are required to have a longer lifespan and higher reliability indicators.

[0003] Currently, the development of electronic product systems has shifted its focus to comprehensively improving system performance and meeting actual operational needs, placing higher demands on the overall performance of the system throughout its lifecycle. Relevant data indicates that storage reliability is as important as mission reliability. To reduce support requirements and shorten technical preparation time, newly developed products are required to be shipped, tested, and maintained in full lifecycle condition. This requires higher storage reliability for their subsystems and key equipment. To ensure operational integrity and mission success, it is essential to understand the product's storage life in order to effectively improve its storage reliability.

[0004] The research on accelerated life test methods abroad has a history of more than 50 years. The test method of increasing stress is used to accelerate product failure, shorten the test time, and select the corresponding acceleration model to estimate the life (or reliability) characteristic value of the product under normal stress.

[0005] The United States and Russia are the primary foreign countries conducting accelerated life testing research. Russia has implemented a series of measures to improve the storage reliability of electronic product systems. The widespread, standardized, and effective application of accelerated life testing during engineering development has been highly successful. A six-month accelerated storage life test can yield a 10-year storage life, ensuring that the system meets the required unpacking pass rate and mission success rate requirements without requiring repairs during the 10-year storage period. This enables the electronic system to achieve the very high storage reliability indicators typically expected of electromechanical products. This accelerated testing methodology, developed in Russia, draws upon years of engineering practice. It simulates the product on simulated equipment and requires the development of several models. The test loading conditions include electrical stress, temperature stress, and mechanical stress (vibration and shock). This method can be used to perform accelerated storage life testing not only on components and materials, but also on equipment, subsystems, and systems, making it highly cost-effective. In the early stages of storage life and reliability research in the United States, natural storage methods were employed, as well as information from field storage tests. After new models were delivered, most were stored for long periods without testing, while a small number underwent periodic testing. Testing of small batches allows monitoring of the entire batch and estimation of the storage reliability of the entire batch.

[0006] For a long time, domestic storage life and reliability research has relied on analysis of system-wide vibration test data, comprehensive stress test data, system benchtop joint test data, inventory inspection data, field storage test data, and other relevant test data. Determining the storage reliability and lifespan of electronic product systems requires years of use. This approach is not only time-consuming but also requires significant human, material, and financial resources. Especially for newly developed equipment, the inability to determine the storage lifespan at the time of finalization severely impacts its use and maintenance. During the development phase, it is difficult to simulate the full lifecycle environment for testing and verification, thereby providing scientific storage reliability and lifespan indicators.

[0007] Overall, the level of equipment storage life and reliability research in China lags far behind that of international research, and storage reliability testing and evaluation capabilities are severely inadequate. Incomplete data on basic materials and corresponding accelerated performance, particularly the lack of accelerated testing methods and corresponding data, has severely hampered the implementation of accelerated storage testing for system-level, subsystem-level, and critical equipment-level products.

[0008] Typical electronic product storage life assessment methods utilize a combination of engineering and statistical analysis, assessing the storage life based on the specific product characteristics. During the engineering development phase, simulated storage testing under laboratory conditions identifies weaknesses, calculates the actual environmental conditions or aging processes to which the product will be subjected throughout its storage period, and implements effective improvement measures to achieve a product storage life that meets specified requirements. Evaluating product storage periods of up to ten or even twenty years through relatively short testing periods can improve testing efficiency, reduce testing costs, and achieve significant financial savings. In-depth research on this topic will significantly advance the development of product life extension technology.

[0009] By studying electronic product storage life assessment tests, appropriate and reasonable recommendations can be made for the development and optimization of product storage environments and related packaging technologies. Furthermore, this research can enable hierarchical management of electronic equipment storage, ensuring the integrity of electronic equipment at the lowest possible lifecycle cost, improving availability, and reducing maintenance and logistics costs, ultimately achieving the goal of "doubling reliability and halving maintenance or costs." Therefore, this research has strong practical significance. Summary of the Invention

[0010] In view of the above analysis, the embodiments of the present invention aim to provide an electronic product accelerated storage life test evaluation system to address the deficiencies in existing domestic equipment storage life and reliability research, and the low storage life test and evaluation capabilities of electronic products.

[0011] In one aspect, an embodiment of the present invention provides an electronic product accelerated storage life test evaluation system, comprising:

[0012] A high temperature chamber is used to heat the electronic product to be evaluated to provide the high temperature stress environment required for the high temperature stress test of the electronic product to be evaluated;

[0013] A control module is used to control the temperature of the high-temperature box and adjust the temperature of the high-temperature box according to the fault type of the product, and record the number of Class A faults and fault time that occur in the high-temperature stress test of the electronic product to be evaluated; a fault output module is used to obtain the fault type that occurs in the high-temperature stress test of the electronic product to be evaluated and output the fault type to the control module;

[0014] a test time calculation module, configured to calculate the total test time under normal temperature stress according to the number of Class A failures and the failure time of the electronic product to be evaluated in the high temperature stress test;

[0015] The storage life evaluation module is used to evaluate the storage life of the electronic product according to the total test time under the normal temperature stress.

[0016] Furthermore, the system also includes a power-on module;

[0017] A power-on module, used to power on the electronic product to be evaluated so as to perform a power-on test on the electronic product;

[0018] The control module is further used to control the power-on module to power on or off the electronic product.

[0019] Furthermore, the control module controls the temperature of the high temperature box and adjusts the temperature of the high temperature box according to the fault type of the product in the following manner to implement the high temperature stress test of the electronic product to be evaluated: in the stage high temperature stress test, the temperature of the high temperature box is controlled to be T j , j is initially set to 1, and T j As the high temperature stress of the j-stage high temperature stress test, n products to be evaluated are tested; the temperature of the high temperature box is controlled so that it is under the high temperature stress T j After maintaining the temperature for M days, the temperature of the high temperature box is controlled to return to the normal temperature stress T0. After maintaining the normal temperature stress for N hours, the power-on module is controlled to power on the product for power-on testing.

[0020] If the electronic product to be evaluated has no faults or has a Class B fault, the control module continues to control the high-temperature box to perform the j+1 stage high-temperature stress test using the current stage test temperature as the test temperature for the j+1 stage high-temperature stress test;

[0021] If the electronic product to be evaluated has a Class A fault, the control module controls the high temperature box to be at the current stage of high temperature stress T j Subtract T from the base thAfterwards, the j+1 stage high temperature stress test is performed as the high temperature stress of the j+1 stage high temperature stress test;

[0022] When the test time reaches the total test time Tz, or the number of Class A faults is k, the control module controls the high-temperature box to close and end the test.

[0023] Furthermore, the control module further includes:

[0024] The power-on control unit is used to control the power-on module to control the electronic product to be evaluated to be in a power-on state during normal temperature stress detection and to be in a power-off state in other stages during the test process.

[0025] Furthermore, the high temperature stress of the high temperature stress test at each stage is less than the test extreme temperature of the product to be evaluated;

[0026] During the high temperature stress test, the control module controls the temperature change rate of the high temperature box to tm℃ / min.

[0027] Furthermore, the control module is also used to start timing at the beginning of the first stage high temperature stress test, and to count the number of Class A failures i of the product to be evaluated during the high temperature stress test and the failure time ti corresponding to the i-th Class A failure.

[0028] Furthermore, the test time calculation module also includes:

[0029] A first parameter acquisition unit is used to obtain a test time conversion coefficient of the product to be evaluated;

[0030] The test time calculation unit is used to calculate the test time conversion coefficient, the number of class A failures i in the high temperature stress test, and the failure time t corresponding to the i-th class A failure. i , calculate the total test time of the product under normal temperature stress through the product test time conversion formula.

[0031] Furthermore, the conversion formula is expressed as:

[0032]

[0033] Where T is the total test time of n products converted to normal stress, b is the product test time conversion coefficient, T0 is normal stress, t1 is the failure time corresponding to the first failure, t i is the failure time corresponding to the i-th failure, and k is the upper limit of the number of failures.

[0034] Furthermore, the storage life assessment module further includes:

[0035] A second parameter acquisition unit is used to obtain the critical value and confidence level of the chi-square distribution of the product to be evaluated;

[0036] The storage life evaluation unit is used to calculate the storage life of the product by evaluating the product storage life formula based on the chi-square distribution critical value, confidence level and total test time under normal temperature stress of the product.

[0037] Furthermore, the formula for evaluating the shelf life of the product is expressed as:

[0038]

[0039] in, is the evaluation life of the product, T is the total test time of n products converted to normal stress, χ is the critical value of chi-square distribution, α is the confidence level, 1-α is the confidence level, and n is the number of products.

[0040] Compared with the prior art, the present invention can achieve at least one of the following beneficial effects:

[0041] 1. The system of the present invention is used for accelerated storage life test of electronic products, filling the gap in the relevant field in China;

[0042] 2. The present invention is applicable to my country's existing industrial base and experimental conditions and is easy to industrialize;

[0043] 3. The present invention solves the problem of life assessment of electronic products by evaluating the storage life of small samples of electronic products, while minimizing the loss of equipment or inventory equipment;

[0044] 4. Compared with previous systems that rely on obtaining large-scale comprehensive stress test data, regular inspection data, and other related test data, the system proposed by the present invention for evaluating the storage life of electronic products saves more manpower, material resources, financial resources, and other resources;

[0045] 5. The results obtained by the system of the present invention can be used to implement measures to extend the life of the product and achieve the goal of extending the life of the product.

[0046] In the present invention, the above-mentioned technical solutions can be combined with each other to achieve more preferred combinations. Other features and advantages of the present invention will be described in the following description, and some advantages will become apparent from the description or be learned through practice of the present invention. The objectives and other advantages of the present invention can be realized and obtained through the contents particularly pointed out in the description and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The accompanying drawings are only for the purpose of illustrating particular embodiments and are not to be considered limiting of the present invention. Like reference symbols denote like parts throughout the drawings.

[0048] Figure 1 This is a block diagram of an electronic product accelerated storage life test evaluation system according to one embodiment of the present application;

[0049] Figure 2 This is a cross-sectional view of a high-temperature stress test at different stages of an accelerated storage life according to an embodiment of the present application;

[0050] Figure 3 This is a schematic diagram of an accelerated storage life evaluation test shown in one embodiment of the present application. DETAILED DESCRIPTION

[0051] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, wherein the accompanying drawings constitute a part of this application and are used together with the embodiments of the present invention to illustrate the principles of the present invention, and are not used to limit the scope of the present invention.

[0052] A specific embodiment of the present invention discloses an accelerated storage life test evaluation system for electronic products, such as Figure 1 As shown, including:

[0053] The high temperature box 10 is used to heat the electronic product to be evaluated to provide a high temperature stress environment required for the high temperature stress test of the electronic product to be evaluated;

[0054] The control module 20 is used to control the temperature of the high-temperature box and adjust the temperature of the high-temperature box according to the type of product failure, and record the number and time of Class A failures that occur in the high-temperature stress test of the electronic product to be evaluated;

[0055] The fault output module 30 is used to obtain the fault type that occurs during the high temperature stress test of the electronic product to be evaluated and output the fault type to the control module 20. Specifically, the fault type includes:

[0056] Class A failure: Failure of the product under test caused by improper production of parts and components, component defects, or failure that cannot be reproduced or the cause of which has not yet been identified;

[0057] Class B failure: Failure of the test product due to failure of the test equipment provided by the laboratory, as well as the instruments and meters used for testing; or failure caused by improper operation, maintenance and repair of the test product by personnel.

[0058] During implementation, the above fault type is determined by experienced inspection personnel. When the fault type is determined to be Class A or Class B, the inspection personnel input the fault type into the fault output module, and the fault output module outputs the acquired fault type to the control module.

[0059] A test time calculation module 40 is configured to calculate the total test time under normal temperature stress according to the number of Class A failures and the failure time of the electronic product to be evaluated during the high temperature stress test;

[0060] A storage life evaluation module 50 is used to evaluate the storage life of the electronic product according to the total test time under the normal temperature stress;

[0061] A power-on module 60 is used to power on the electronic product to be evaluated so as to perform a power-on test on the electronic product;

[0062] Specifically, the control module is also used to control the power-on module to power on or off the electronic product.

[0063] Specifically, the accelerated storage life test of the product is conducted according to the step-back stress profile. The control module controls the high-temperature chamber to start from the highest stress level of the step-back stress test, and then conducts the test in a constant truncation manner. Every time a Class A fault occurs, the control module controls the high-temperature chamber to reduce one stress level. This process is repeated. When the control module receives information that three Class A faults have occurred during the test, the test is terminated and the storage life assessment module performs the life assessment. Specifically, the control module 20 controls the temperature of the high-temperature chamber in the following manner and adjusts the temperature of the high-temperature chamber according to the type of product failure to implement the high-temperature stress test of the electronic product to be evaluated: In the stage high-temperature stress test, the temperature of the high-temperature chamber is controlled to T j , j is initially set to 1, and T j As the high temperature stress of the j-stage high temperature stress test, n products to be evaluated are tested; the temperature of the high temperature box is controlled so that it is under the high temperature stress T j After being kept under normal temperature stress for M days, the temperature of the high-temperature box is controlled to return to normal temperature stress T0, and kept under normal temperature stress for N hours; the power-on module is controlled to power on the product and perform a power-on test; if the product fails, the inspection personnel will determine the fault type according to the product status and test conditions, and input the fault type to the fault output module, and the fault output module will output the acquired fault type to the control module; if the fault type output by the fault output module is a Class B fault, or the product to be evaluated is found to have no fault, the control module will continue to control the high-temperature box to use the current stage test temperature as the test temperature for the j+1 stage high-temperature stress test to perform the j+1 stage high-temperature stress test; if Figure 2 As shown, if the electronic product to be evaluated has a Class A fault, the control module controls the high temperature box to be at the current stage of high temperature stress T j Subtract T from the base th Afterwards, the j+1 stage high temperature stress test is performed as the high temperature stress of the j+1 stage high temperature stress test; when the test time reaches the total test time Tz, or the number of type A faults occurs is k, the control module controls the high temperature box to close and end the test.

[0064] Optionally, in order to ensure the authenticity, accuracy, rationality and effectiveness of the test results, at least 6 sets of products to be evaluated are selected for testing based on the rationality of sampling and the minimum sample data requirements for evaluation.

[0065] Specifically, when the following conditions are met, it is considered that no fault has occurred, that is, the product is qualified, that is, the appearance inspection does not show new bubbling, wrinkling, peeling of the paint film, and the non-metallic parts do not expand, crack, or deform, and the technical parameters of the product should meet the predetermined values; specifically, if a Class B fault occurs, after the fault is eliminated, the control module controls the high-temperature box to continue to perform high-temperature stress testing at the original test temperature.

[0066] Optionally, because the test is carried out in a high temperature section, it is close to the high temperature stress limit of the product. Even a small temperature change can cause the failure of some components. In order to ensure that the test life assessment information of the product to be tested is obtained accurately, the control module controls the high temperature stress T j Subtract T from the base th =5℃ and then proceed to the next stage of high temperature stress test.

[0067] The control module controls the high-temperature chamber temperature to maintain it for M days under high-temperature stress and N hours under normal temperature stress, ensuring that the electronic product maintains internal temperature equilibrium during the test. Maintaining the temperature for M days and N hours ensures that the electronic product is heated and cooled thoroughly during the test, thereby achieving internal temperature equilibrium. Optionally, in this embodiment, M = 7 days and N = 2 hours.

[0068] Optionally, to ensure that a sufficient amount of test information is obtained, the control module sets the total test time T z = 6 months, and the upper limit of the number of Class A faults is k = 3, that is, if the control module does not have 3 Class A faults within the set 6 months, the test will continue to 6 months and end the experiment on time.

[0069] More specifically, the control module further includes:

[0070] The power-on control unit is used to control the power-on module to control the electronic product to be evaluated to be in the power-on state during normal temperature stress detection, and to keep it in the power-off state at other stages during the test. Specifically, in order to ensure the accuracy of the life evaluation results of the product to be evaluated, the performance test of the accelerated storage life test evaluation should be carried out after the product to be evaluated is loaded into the experimental equipment to ensure that the equipment to be evaluated is in a normal state before the test. The test of the test product needs to be restored to room temperature during the test, so the power-on control unit controls the power-on module to control the product to be evaluated to be in the power-on state during normal temperature stress detection, and to keep it in the power-off state at other stages during the test.

[0071] Specifically, the high temperature stress T of each stage of the high temperature stress test is j Lower than the test extreme temperature of the product to be evaluated; optionally, the preliminary test is replaced by an accelerated storage test. For example, when the test extreme temperature of the product to be tested is 115°C, the temperature stress of the first stage high temperature stress test can be reduced by 5°C on the basis of 115°C, that is, the highest temperature in the high temperature stress test can be 110°C; in this embodiment, the temperature tolerance approximate limit value of the product components is selected by the test starting temperature, while shortening the test time of the electronic product storage life test, covering a wide temperature range, being highly time-efficient, and consuming a small number of samples, so that the results are more real, accurate, and reasonable;

[0072] Specifically, during the high temperature stress test, the control module controls the temperature change rate of the high temperature box to tm℃ / min. In order to avoid temperature shock during the accelerated storage life test, the control module controls the temperature change rate of the high temperature box to tm=5℃ / min during the test to ensure that the temperature change rate of the electronic product is 5℃ / min; for example, when the high temperature stress environment needs to be changed from high temperature stress T j Return to normal temperature stress T0, or increase from normal temperature stress T0 to high temperature stress T j , the control mode controls the temperature change rate of the high temperature box to 5℃ / min;

[0073] Specifically, the control module is further configured to count the number of Class A failures i and the corresponding failure time ti of the i-th Class A failure of the product under evaluation during the high-temperature stress test. That is, the failure time recorded by the control module is the time from the start of the first-stage high-temperature stress test to the detection of the i-th Class A failure.

[0074] Specifically, various methods can be used in engineering to obtain the total test time T of the product converted to normal stress. For example, the test can be carried out under high stress, and then the time measured in the test can be converted to normal stress. Alternatively, when the product cannot withstand excessively high stress, the test can be carried out for a sufficiently long time under the highest stress condition that the product can withstand, and then the time measured in the test can be converted to normal stress. Specifically, in this embodiment, the total test time is calculated by converting the test time under high temperature stress to that under normal temperature stress through the test time calculation module. The test time calculation module also includes:

[0075] A first parameter acquisition unit is used to obtain a test time conversion coefficient of the product to be evaluated;

[0076] The test time calculation unit is used to calculate the test time conversion coefficient, the number of class A failures i in the high temperature stress test, and the failure time t corresponding to the i-th class A failure. i , calculate the total test time of the product under normal temperature stress by the product test time conversion formula. Specifically, the conversion formula is expressed as:

[0077]

[0078] Where T is the total test time of n products converted to normal stress, b is the product test time conversion coefficient, T0 is normal stress, t1 is the failure time corresponding to the first failure, t i is the failure time corresponding to the i-th failure, and k is the upper limit of the number of failures.

[0079] Specifically, the storage life assessment module further includes:

[0080] A second parameter acquisition unit is used to obtain the critical value and confidence level of the chi-square distribution of the product to be evaluated;

[0081] The shelf life evaluation unit is used to calculate the shelf life of the product using a product shelf life evaluation formula based on the product chi-square distribution critical value, confidence level, and the total test time under normal temperature stress. Specifically, the product shelf life evaluation formula is expressed as:

[0082]

[0083] in, is the evaluation life of the product, T is the total test time of n products converted to normal stress, χ is the critical value of chi-square distribution, α is the confidence level, 1-α is the confidence level, and n is the number of products.

[0084] Compared with the existing technology, the system of the present invention is used for accelerated storage life testing of electronic products, filling the gap in the relevant domestic field; the present invention is applicable to my country's existing industrial base and test conditions and is easy to industrialize; the present invention solves the problem of life assessment of electronic products by evaluating the storage life of electronic products on a small sample, while minimizing the loss of equipment or inventory equipment; the system for evaluating the storage life of electronic products proposed by the present invention saves more manpower, material resources, financial resources and other resources than previous systems that obtain large-scale comprehensive stress test data, regular inspection data and other related test data; the results obtained by the system of the present invention can be used to implement product life extension measures to achieve the goal of extending the product life.

[0085] The following describes in detail how to obtain the number of failures and the failure time during a high-temperature stress test based on the electronic product accelerated storage life test evaluation system using a specific embodiment:

[0086] (1) Select 6 sets of products to be evaluated, install them into the test equipment, and conduct performance tests. The measured performance meets the requirements of the product performance indicators;

[0087] (2) The temperature of the high and low temperature box is controlled to be at 110°C by the control module, and 110°C is used as the high temperature stress of the first stage high temperature stress test. After reaching 110°C, it is maintained for 7 days, and then restored to 25°C. After maintaining at 25°C for 2 hours, the electronic product to be evaluated is powered on for testing by controlling the power-on module; specifically, the temperature change rate during the temperature change is 5°C / min.

[0088] (3) If the fault output module outputs that the electronic product to be evaluated has no fault or has a Class B fault after being powered on, the control module controls the temperature of the high-temperature box to rise to 110°C and continues to perform the next stage of high-temperature stress testing at 110°C;

[0089] (4) If the fault output module outputs that a Class A fault occurs after the product to be evaluated is powered on, the control module controls the high-temperature box to reduce the high-temperature stress of the current stage by 5°C, and then uses the high-temperature stress of the next stage high-temperature stress test to conduct the next stage high-temperature stress test; (For example, when a Class A fault occurs in the first stage high-temperature stress test, the control module controls the high-temperature box to reduce the high-temperature stress of the first stage 110°C by 5°C, that is, the control module controls the high-temperature box temperature to 105°C, and uses 105°C as the high-temperature stress of the second stage high-temperature stress test to conduct the second stage high-temperature stress test);

[0090] (5) The test is terminated when the test time reaches 6 months of the total test time or when Class A failures occur 3 times.

[0091] Specifically, Table 1 below describes the number of samples, test conditions, and stress of the accelerated storage life test.

[0092] Table 1

[0093]

[0094] Hereinafter, how the electronic product accelerated storage life test evaluation system evaluates the product storage life is described in detail by way of specific embodiments:

[0095] First, according to the requirements of the accelerated storage test, 6 sets of products were selected for the step-back stress accelerated storage test. The accelerated storage test was carried out for 4320 hours under the condition of accelerated stress not less than 100℃. The product function test was normal without any fault. Figure 3To estimate the product life under natural storage conditions, three failures were artificially added. Specifically, one product failure was assumed at each of the step-back accelerated stresses of 100°C, 95°C, and 90°C, with one sample reduced for each failure. Furthermore, the failure times at 100°C, 95°C, and 90°C were assumed to be 3600 hours, 3960 hours, and 4320 hours, respectively. Based on the experimental description of the accelerated storage test, the test data for the step-back test are shown in Table 2. Assuming α = 0.05 and b = 346.43, the 95% confidence lower limit for the product life under natural storage conditions is 11.32 years; this means that the product life under static storage at room temperature (25°C) is estimated to be 11.32 years. Because the number of failures was artificially increased for a conservative estimate, the actual product life should be no less than 11.32 years. Furthermore, the product had been stored under natural storage conditions for seven years before the accelerated storage life test, so the minimum static storage life under natural storage conditions is 18.32 years.

[0096] Table 2

[0097]

[0098] As can be seen from the above-described specific embodiments, the present invention provides an accelerated storage life test and evaluation system for electronic products. This system controls the test start temperature of a high-temperature chamber to the approximate temperature tolerance limit of the product's components and parts, ensuring full coverage of the product's temperature range. Compared to previous evaluation processes, the present system achieves a wide temperature range, high time efficiency, and a small number of sample consumption during the testing process, ensuring authentic, accurate, and reasonable test results, thereby achieving the goals of increasing the lifespan of the product and economically upgrading the equipment.

[0099] Those skilled in the art will appreciate that all or part of the process steps of the above-described embodiments can be implemented by instructing related hardware through a computer program, and the program can be stored in a computer-readable storage medium, such as a magnetic disk, an optical disk, a read-only memory, or a random access memory.

[0100] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by any technician familiar with this technical field within the technical scope disclosed by the present invention should be covered by the scope of protection of the present invention.

Claims

1. An electronic product accelerated storage life test evaluation system, characterized in that: include: A high temperature chamber is used to heat the electronic product to be evaluated to provide the high temperature stress environment required for the high temperature stress test of the electronic product to be evaluated; The control module is used to control the temperature of the high-temperature chamber and adjust the temperature of the high-temperature chamber according to the type of product failure, and record the number and failure time of Class A failures that occur in the high-temperature stress test of the electronic product to be evaluated; a fault output module, configured to obtain a fault type occurring during a high-temperature stress test of the electronic product to be evaluated, and output the fault type to a control module; The control module controls the temperature of the high temperature box and adjusts the temperature of the high temperature box according to the fault type of the product in the following manner to implement the high temperature stress test of the electronic product to be evaluated: in the stage high temperature stress test, the temperature of the high temperature box is controlled to be T j , j is initially set to 1, and T j As the high temperature stress of the j-stage high temperature stress test, n products to be evaluated are tested; the temperature of the high temperature box is controlled so that it is under the high temperature stress T j After maintaining the temperature for M days, the high temperature box temperature is controlled to return to the normal temperature stress T0. After maintaining the normal temperature stress for N hours, the power module is controlled to power on the product for power-on test. If the electronic product to be evaluated has no faults or has a Class B fault, the control module continues to control the high-temperature box to perform the j+1 stage high-temperature stress test using the current stage test temperature as the test temperature for the j+1 stage high-temperature stress test; If the electronic product to be evaluated has a Class A fault, the control module controls the high temperature box to be at the current stage of high temperature stress T j Subtract T from the base th Afterwards, the j+1 stage high temperature stress test is performed as the high temperature stress of the j+1 stage high temperature stress test; When the test time reaches the total test time Tz, or the number of Class A faults is k, the control module controls the high-temperature box to close and the test ends; The control module is further configured to start timing at the beginning of the first phase of the high temperature stress test, and to count the number of Class A failures i of the product to be evaluated during the high temperature stress test, as well as the failure time ti corresponding to the i-th Class A failure; a test time calculation module, configured to calculate the total test time under normal temperature stress according to the number of Class A failures and the failure time of the electronic product to be evaluated in the high temperature stress test; The storage life evaluation module is used to evaluate the storage life of the electronic product according to the total test time under the normal temperature stress.

2. The electronic product accelerated storage life test evaluation system according to claim 1, characterized in that: The system also includes a power-up module; A power-on module, used to power on the electronic product to be evaluated so as to perform a power-on test on the electronic product; The control module is further used to control the power-on module to power on or off the electronic product.

3. The electronic product accelerated storage life test evaluation system according to claim 1, characterized in that: The control module further includes: The power-on control unit is used to control the power-on module to control the electronic product to be evaluated to be in a power-on state during normal temperature stress detection and to be in a power-off state in other stages during the test process.

4. The electronic product accelerated storage life test evaluation system according to claim 3, characterized in that: The high temperature stress of the high temperature stress test at each stage is less than the test extreme temperature of the product to be evaluated; During the high temperature stress test, the control module controls the temperature change rate of the high temperature box to tm℃ / min.

5. The electronic product accelerated storage life test evaluation system according to claim 1, characterized in that: The test time calculation module also includes: A first parameter acquisition unit is used to obtain a test time conversion coefficient of the product to be evaluated; The test time calculation unit is used to calculate the test time conversion coefficient, the number of class A failures i in the high temperature stress test, and the failure time t corresponding to the i-th class A failure. i , calculate the total test time of the product under normal temperature stress through the product test time conversion formula.

6. The electronic product accelerated storage life test evaluation system according to claim 5, characterized in that: The conversion formula is expressed as: Where T is the total test time of n products converted to normal stress, b is the product test time conversion coefficient, T0 is normal stress, t1 is the failure time corresponding to the first failure, t i is the failure time corresponding to the i-th failure, and k is the upper limit of the number of failures.

7. The electronic product accelerated storage life test evaluation system according to claim 1, characterized in that: The storage life assessment module further includes: A second parameter acquisition unit is used to obtain the critical value and confidence level of the chi-square distribution of the product to be evaluated; The storage life evaluation unit is used to calculate the storage life of the product by evaluating the product storage life formula based on the chi-square distribution critical value, confidence level and total test time under normal temperature stress of the product.

8. The electronic product accelerated storage life test evaluation system according to claim 7, characterized in that: The formula for evaluating the shelf life of the product is expressed as: in, is the evaluation life of the product, T is the total test time of n products converted to normal stress, χ is the critical value of chi-square distribution, α is the confidence level, 1-α is the confidence level, and n is the number of products.

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