Heating element assembly, method of manufacturing the same, cooking appliance and cooking apparatus

Abstract

The application provides a heating body assembly, a preparation method thereof, a cooking utensil and a cooking device. The heating body assembly comprises a first substrate, a heating layer arranged on one side of the first substrate, wherein the heating layer has at least one first protrusion close to the surface of the first substrate, the first protrusion is embedded in the first substrate, a second substrate connected with the first substrate, and a first gap is formed between the second substrate and the heating layer. Thus, the heating layer is embedded in the first substrate, the second substrate and the heating layer have the first gap, and the two substrates are connected. The influence of bubbles caused by the re-softening and bonding between the already solidified heating layer and the second substrate can be avoided, and the heating body assembly has the advantages of high heating efficiency, high safety, long service life and the like.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electrical appliances, in particular, to a heating element assembly, a preparation method thereof, a cooking appliance and a cooking device. BACKGROUND

[0002] Inorganic materials such as ceramics and glass have been widely applied to cooking appliances, such as ceramic inner containers in electric stew pots, glass material inner containers in glass health-care water pots, microcrystalline pots, ceramic pots and the like used in induction cookers. Glass and ceramic materials have very good chemical stability, and glass and ceramic materials are healthy and environmentally friendly materials. However, these inorganic materials also have some defects, such as low heat transfer efficiency, poor toughness and easy breakage.

[0003] For glass heating vessels, the conventional application scheme mainly uses heating components such as heating tubes and heating discs for heating. The glass vessel is in contact with the heating disc or the heating tube for heat transfer. This scheme has the characteristics of simple overall assembly, but has some problems, such as small contact area, difficult close contact, and too low heat transfer efficiency. When the glass vessel is applied to a water pot and the like, the time for heating 1L of water will be close to or even exceed 15 minutes. The heating speed is slow and the heat efficiency is too low, which is difficult to meet the user's use demand, resulting in poor user experience.

[0004] Some manufacturers will use a thick film heating technology scheme. This scheme heats by printing a thick film circuit on a glass plate. Although this scheme has high heat efficiency and uniform heating, it has high requirements for glass vessels, and needs to use temperature-resistant quartz glass and the like. In addition, there is also a problem of safety regulations. In the case of glass breakage, the current is large, which will pose a great risk to the safety of consumers.

[0005] Therefore, the heating element assembly based on inorganic materials such as glass and its preparation method still needs to be improved. SUMMARY

[0006] As mentioned above, the heating element assembly based on inorganic materials such as glass still needs to be improved. The inventors find that, in the case of using a covering heating layer / heating layer combined with a substrate, if the heating layer / heating layer is bonded with another substrate after the heating layer / heating layer has been firmly combined with one substrate of the heating element assembly through solidification, the heating layer / heating layer needs to be softened again, at this time, the whole layer of the heating layer / heating layer has poor wettability, and bubbles will be generated and accumulated in the heating layer / heating layer during the process of softening again, and the bubbles will exist in the interface between the heating layer / heating layer and the substrate, and the generated bubbles are not easy to diffuse, which will affect the yield of the product, and the bubbles in the heating layer / heating layer and the bubbles in the interface will have adverse effects on the use of the heating element assembly, therefore, it is necessary to avoid bonding the whole layer of the heating layer / heating layer with the second substrate through softening again. The present application aims to at least solve one of the problems in the related art. To this end, one object of the present application is to provide a heating element assembly which does not need to soften the whole layer of the heating layer again to bond with the second substrate, and the heating element assembly has the advantages of high heating efficiency, high safety, long service life, etc.

[0007] In one aspect of the present application, a heating element assembly is provided, which comprises: a first substrate, a heating layer arranged on one side of the first substrate, the heating layer having at least one first protrusion near the surface of the first substrate, the first protrusion being embedded in the first substrate, a second substrate arranged in connection with the first substrate, and a first gap being formed between the second substrate and the heating layer. In this way, the heating layer is embedded in the first substrate, the second substrate and the heating layer have the first gap therebetween, and the two substrates are connected, which can avoid the influence of bubbles caused by bonding the whole layer of the heating layer which has been solidified with the second substrate through softening again, and the heating element assembly has the advantages of high heating efficiency, high safety, long service life, etc.

[0008] According to an embodiment of the present application, at least one of the first substrate and the second substrate has a first groove, at least part of the first groove forming the first gap.

[0009] According to an embodiment of the present application, the first substrate and the second substrate are connected through the heating layer, the heating layer having a concave-convex structure near the surface of the second substrate, the protruding part of the concave-convex structure being arranged in contact with the second substrate, and the gap between the recessed part of the concave-convex structure and the second substrate constituting the first gap.

[0010] According to an embodiment of the present application, a support member is arranged between the first substrate and the second substrate, the support member connecting the first substrate and the second substrate.

[0011] According to an embodiment of the present application, the area of the orthographic projection of the protrusion on the first substrate is a, and the area of the orthographic projection of the heating layer on the first substrate is b, a is 40% b to 80% b.

[0012] According to an embodiment of the present application, the heating element assembly further comprises a support, which is located on the surface of the heating layer close to the second substrate and is in contact with the second substrate, wherein the area of the orthographic projection of the support on the first substrate is smaller than the area of the orthographic projection of the heating layer on the first substrate, and the gap between the surface of the heating layer not in contact with the support and the second substrate constitutes the first gap.

[0013] According to an embodiment of the present application, the area of the orthographic projection of the support on the first substrate is A, and the area of the orthographic projection of the heating layer on the first substrate is B, A is 40% B to 80% B.

[0014] According to an embodiment of the present application, the end of the heating layer and the end of the first substrate have a spacing, and the end of the heating layer and the end of the second substrate have a spacing, and the surface of the first substrate not covered by the heating layer and the second substrate have a second gap.

[0015] According to an embodiment of the present application, the height of the first gap is 10 to 30 microns.

[0016] According to an embodiment of the present application, the heating layer comprises a heating layer and a transition layer arranged in layers, and the transition layer is in contact with the first substrate.

[0017] According to an embodiment of the present application, the heating layer comprises a heating material selected from at least one of silver, copper, and aluminum, and a first inorganic oxide matrix selected from at least one of bismuth oxide, aluminum oxide, and silicon oxide; and the transition layer comprises a second inorganic oxide matrix, and the first inorganic oxide matrix and the second inorganic oxide matrix have the same composition.

[0018] According to an embodiment of the present application, the heating layer further comprises a bonding layer arranged on the surface of the heating layer away from the first substrate.

[0019] According to an embodiment of the present application, the bonding layer comprises a third inorganic oxide matrix selected from at least one of bismuth oxide, aluminum oxide, and silicon oxide.

[0020] According to an embodiment of the present application, the heating layer satisfies at least one of the following conditions: the square resistance of the heating layer is 0.1 mΩ to 20 mΩ, and the thickness of the heating layer is 10 to 25 microns.

[0021] According to an embodiment of the present application, the thickness of the transition layer is 0.1-5 microns, and the thickness of the adhesive layer is 10-30 microns.

[0022] According to an embodiment of the present application, the thickness of the first substrate is less than the thickness of the second substrate.

[0023] In another aspect of the present application, a heating element assembly is provided, which comprises a first substrate, a heating layer arranged on one side of the first substrate, the heating layer having at least one first protrusion close to the surface of the first substrate, the first protrusion being embedded in the first substrate, the heating layer comprising a heating layer and an adhesive layer, the heating layer being arranged in contact with the first substrate, the adhesive layer having at least one second protrusion away from the surface of the heating layer, a second substrate arranged on the surface of the heating layer away from the first substrate, the second protrusion being embedded in the second substrate. In this way, the heating layer is embedded in the first substrate, and the adhesive layer is embedded in the second substrate, and the heating layer and the adhesive layer are bonded together, which can avoid the influence of air bubbles when the whole heating layer is softened and bonded to the second substrate, and the heating element assembly has high heating efficiency, high safety, long service life and other advantages.

[0024] According to an embodiment of the present application, the adhesive layer has a smaller orthographic projection on the first substrate than the heating layer, and a first gap is formed between the heating layer and the second substrate, or the adhesive layer has an orthographic projection on the first substrate equal to the orthographic projection of the heating layer on the first substrate.

[0025] According to an embodiment of the present application, the thickness of the adhesive layer is 10-30 microns.

[0026] According to an embodiment of the present application, the end of the heating layer and the end of the first substrate have a spacing, and the end of the heating layer and the end of the second substrate have a spacing, and the surface of the first substrate not covered by the heating layer has a second gap with the second substrate.

[0027] According to an embodiment of the present application, the heating layer further comprises a transition layer arranged between the heating layer and the first substrate.

[0028] According to an embodiment of the present application, the heating layer comprises a heating material selected from at least one of silver, copper and aluminum, and a first inorganic oxide base selected from at least one of bismuth oxide, aluminum oxide and silicon oxide; the transition layer comprises a second inorganic oxide base, the first inorganic oxide base and the second inorganic oxide base have the same composition; optionally, the adhesive layer comprises a third inorganic oxide base, the third inorganic oxide base and the first inorganic oxide base have the same composition.

[0029] According to an embodiment of the present application, the thickness of the transition layer is 0.1-5 microns.

[0030] According to an embodiment of the present application, the thickness of the first substrate is less than the thickness of the second substrate.

[0031] According to an embodiment of the present application, the heating layer satisfies at least one of the following conditions: the square resistance is 0.1-20 mΩ; the thickness is 10-25 microns.

[0032] In another aspect of the present application, a method for manufacturing the heating body assembly is provided, which comprises: providing a first substrate, forming a heating layer on the first substrate; providing a second substrate, connecting the second substrate with the first substrate, and forming a first gap between the second substrate and the heating layer, to obtain the heating body assembly. Thus, the heating body assembly can be formed by a simple method, and the method can avoid the adverse effects of air bubbles caused by the re-softening and bonding of the whole heating layer with the second substrate. The heating body assembly manufactured by the method has the advantages of high heating efficiency, high safety, long service life, etc.

[0033] According to an embodiment of the present application, the method for forming the heating layer comprises: applying a conductive paste on the first substrate, and sintering and curing the conductive paste to obtain the heating layer with a heating layer and a transition layer, and the transition layer is arranged in contact with the first substrate, wherein the conductive paste comprises a heating material and a first inorganic oxide base.

[0034] According to an embodiment of the present application, the method for forming the heating layer further comprises: applying an adhesive coating on the surface of the heating layer away from the first substrate, and sintering and curing the adhesive coating to obtain an adhesive layer.

[0035] In still another aspect of the present application, the present application provides a method for preparing the heating element assembly as described above, which comprises: providing a first substrate, coating a conductive paste on the first substrate, and sintering and solidifying the conductive paste to obtain a heating layer; providing a second substrate, coating a bonding paste on the second substrate, and sintering and solidifying the bonding paste to obtain a bonding layer; and sintering the heating layer and the bonding layer to obtain the heating element assembly. Thus, the method can also avoid the adverse effects caused by the bubbles generated when the whole heating layer is softened again and bonded to the second substrate, and the heating element assembly prepared by the method has the advantages of high heating efficiency, high safety, long service life, etc.

[0036] In still another aspect of the present application, the present application provides a cooking appliance, which comprises a container body and a container bottom connected with the container body and constituting a containing space, and the container bottom comprises the heating element assembly as described above or is prepared by the method as described above. Thus, the cooking appliance has all the features and advantages of the heating element assembly as described above, which will not be repeated here. In general, the cooking appliance has the advantages of high heating efficiency, high safety, long service life, etc.

[0037] In still another aspect of the present application, the present application provides a cooking device, which comprises the cooking appliance as described above. Thus, the cooking device has all the features and advantages of the cooking appliance as described above, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0038] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the following description, taken in conjunction with the following drawings, in which:

[0039] Figure 1 shows a structural schematic diagram of a heating element assembly according to one embodiment of the present application;

[0040] Figure 2 shows a structural schematic diagram of a heating element assembly according to another embodiment of the present application;

[0041] Figure 3 shows a structural schematic diagram of a heating element assembly according to still another embodiment of the present application;

[0042] Figure 4 shows a structural schematic diagram of a heating element assembly according to still another embodiment of the present application;

[0043] Figure 5 shows a structural schematic diagram of a heating element assembly according to still another embodiment of the present application;

[0044] Figure 6A structural diagram of a heating element assembly according to still another embodiment of the present application is shown.

[0045] Figure 7 A structural diagram of a heating element assembly according to still another embodiment of the present application is shown.

[0046] Figure 8 A structural diagram of a heating element assembly according to still another embodiment of the present application is shown.

[0047] Figure 9 A structural diagram of a heating element assembly according to still another embodiment of the present application is shown.

[0048] Figure 10 A structural diagram of a heating element assembly according to still another embodiment of the present application is shown.

[0049] Figure 11 A structural diagram of a heating element assembly according to still another embodiment of the present application is shown.

[0050] Figure 12 A structural diagram of a heating element assembly according to still another embodiment of the present application is shown.

[0051] Figure 13 A partial structural diagram of a heating element assembly according to one embodiment of the present application is shown.

[0052] Figure 14 A partial structural diagram of a heating element assembly according to another embodiment of the present application is shown.

[0053] Figure 15 A partial structural diagram of a heating element assembly according to still another embodiment of the present application is shown.

[0054] Figure 16 A structural diagram of a heating element assembly according to still another embodiment of the present application is shown.

[0055] Figure 17 A structural diagram of a cooking appliance according to one embodiment of the present application is shown.

[0056] Figure 18 A structural diagram of a cooking appliance according to another embodiment of the present application is shown. DETAILED DESCRIPTION

[0057] The schemes of the present application will be explained below with reference to examples. Those skilled in the art will understand that the examples below are only for illustration of the present application and should not be considered as limiting the scope of the present application. If no specific technique or condition is specified in the examples, the technique or condition described in the literature in the art or according to the product manual is used. If no manufacturer of the reagent or instrument is specified, it is a conventional product that can be obtained commercially.

[0058] In one aspect of the present application, the present application provides a heating element assembly, referring to Figures 1 to 10 The heating element assembly comprises a first substrate 100, a heating layer 200 and a second substrate 300.

[0059] According to an embodiment of the present application, referring to Figures 1 to 10 The heating layer 200 is arranged on one side of the first substrate 100, and the heating layer 200 has at least one first protrusion 211 near the surface of the first substrate 100, i.e. the number of the first protrusions 211 can be one or more, the first protrusion 211 is embedded in the first substrate 100, the second substrate 300 is arranged in connection with the first substrate 100, and a first gap 10 is formed between the second substrate 300 and the heating layer 200. The arrangement of the first protrusion can make the heating layer embedded in the first substrate, so that the heating layer and the first substrate have strong bonding force, the two substrates are connected, and the second substrate and the heating layer have a first gap. In this case, at least part of the heating layer does not need to be connected by sintering and solidification with the second substrate, which can avoid the influence of bubbles when at least part of the heating layer is softened again and bonded with the second substrate. Moreover, the heating element assembly has high heating efficiency, high safety, long service life and other advantages.

[0060] According to an embodiment of the present application, the material of the first substrate 100 can be glass, specifically, the material of the first substrate 100 can be microcrystalline glass, high borosilicate glass or alkali-free glass, etc., and the material of the second substrate 300 can also be glass, specifically, the material of the second substrate 300 can also be microcrystalline glass, high borosilicate glass or alkali-free glass, etc. It should be noted that microcrystalline glass, high borosilicate glass, alkali-free glass, etc. have good high-temperature resistance, and using these glass materials to form the first substrate and / or the second substrate can help to improve the stability of the heating element assembly, and can make the safety factor of the heating element assembly higher during use.

[0061] According to an embodiment of the present application, the first gap 10 can be formed by part of the groove of the first substrate and / or the second substrate, or can be defined by the protruding structure of the heating layer and the second substrate, or can be defined by the support.

[0062] According to an embodiment of the present application, referring to Figures 1 to 6The first substrate 100 and the second substrate 300 are connected, and at least one of the first substrate 100 and the second substrate 300 has the first recess 20, at least part of the first recess 20 forming the first gap 10. For reference Figure 1 The second substrate 300 has the first recess 20, that is, the side surface of the second substrate 300 close to the first substrate 100 is formed with the first recess 20, and at least part of the first recess 20 forms the first gap 10. According to another specific embodiment of the present application, for reference Figure 2 The first substrate 100 has the first recess 20, that is, the side surface of the first substrate 100 close to the second substrate 300 is formed with the first recess 20, and at least part of the first recess 20 forms the first gap 10. According to still another specific embodiment of the present application, for reference Figure 3 Both the first substrate 100 and the second substrate 300 have the first recess 20, that is, the opposite surfaces of the first substrate 100 and the second substrate 300 are both formed with the first recess 20, and at least part of the second recess 20 of the second substrate 300 forms the first gap.

[0063] According to an embodiment of the present application, for reference Figures 4 to 6 The heating layer 200 can include the heat generation layer 220 and the transition layer 210 which are stacked, and the transition layer 210 is arranged in contact with the first substrate 100. According to an embodiment of the present application, for reference Figures 4 to 6 The surface of the transition layer 210 close to the first substrate 100 can have at least one first protrusion 201, that is, the number of the first protrusions 201 can be one or more, in which case, the transition layer can be firmly bonded with the first substrate, which is conducive to further improving the overall stability of the heating element assembly. In addition, according to some specific embodiments of the present application, for reference Figures 4 to 6 The side surface of the transition layer 210 close to the heat generation layer 220 can be a rough surface, that is, the transition layer 210 and the heat generation layer 220 can be connected by embedding each other, in which case, it is more conducive to improving the overall stability of the heating element assembly.

[0064] According to some specific embodiments of the present application, the orthographic projection of the transition layer 210 on the first substrate 100 coincides with the orthographic projection of the heating layer 200 on the first substrate 100. The orthographic projection of the transition layer and the heating layer on the first substrate coincides, which can improve the bonding force between the heating layer and the first substrate, and further improve the overall stability of the heating element assembly.

[0065] According to an embodiment of the present application, for reference Figure 5The end of the heating layer 200 and the end of the first substrate 100 have a spacing, and the end of the heating layer 200 and the end of the second substrate 300 have a spacing. The surface of the first substrate 100 not covered by the heating layer 200 and the second substrate 300 have a second gap 30. In this case, when the heating element assembly is combined with the side wall or bottom of the cooking utensil by welding, the edges of the two substrates soften and do not adversely affect the heating layer, and the heating performance of the heating layer can be better maintained. The end of the heating layer and the end of the first substrate and the end of the second substrate have a certain spacing, which can also form a negative pressure space during the heating process of the cooking utensil, further reducing the accumulation of heat at the connection position of the substrate of the heating element assembly and the side wall or bottom of the cooking utensil, thereby reducing the risk of cracking at the connection position.

[0066] According to an embodiment of the present application, referring to Figure 6 The heating layer 200 can further include a bonding layer 230 disposed on the surface of the heating layer 220 away from the first substrate 100. The bonding layer can further improve the thermal resistance of heat transfer to the first substrate, reduce the transfer of heat generated by the heating layer to the second substrate, thereby promoting the transfer of heat to the first substrate and improving the utilization rate of heat and the heating efficiency. The surface of the bonding layer 230 in contact with the heating layer 220 can be a flat surface as shown in Figure 6 Of course, it can also be a rough surface, that is, the bonding layer 230 and the heating layer 220 can be embedded in each other. In this case, the bonding layer and the heating layer are firmly combined, which is beneficial to further improve the overall stability of the heating element assembly.

[0067] According to some embodiments of the present application, referring to Figures 7 to 9 The first substrate 100 and the second substrate 300 can be connected by the heating layer 200. The surface of the heating layer 200 close to the second substrate 300 has a concave-convex structure, wherein the convex part 202 of the concave-convex structure is in contact with the second substrate 300, and the gap between the concave part 203 of the concave-convex structure and the second substrate 300 constitutes the first gap 10. According to some specific embodiments of the present application, referring to Figure 8 The heating layer 200 has a heating layer 220 and a transition layer 210 arranged in layers. In this case, the heating layer 220 can have the above-mentioned concave-convex structure; according to some other specific embodiments of the present application, referring to Figure 9 The heating layer 200 can further include a bonding layer 230, which can have the above-mentioned concave-convex structure.

[0068] According to some embodiments of the present application, the area of the orthographic projection of the protrusion 202 on the first substrate 100 is a, and the area of the orthographic projection of the heating layer 200 on the first substrate 100 is b, wherein a is 40% b to 80% b, for example, a can be 40% b, 50% b, 60% b, 70% b, 80% b, etc.

[0069] According to an embodiment of the present application, referring to Figure 10 , the heating element assembly can further include a support 400 located on the surface of the heating layer 200 close to the second substrate 300 and arranged in contact with the second substrate 300, wherein the area of the orthographic projection of the support 400 on the first substrate 100 is smaller than the area of the orthographic projection of the heating layer 200 on the first substrate 100, and the gap between the surface of the heating layer 200 not in contact with the support 400 and the second substrate 300 constitutes the first gap 10. In this case, the first substrate 100 and the second substrate 300 can be indirectly connected through the heating layer 200 and the support 400.

[0070] According to an embodiment of the present application, the area of the orthographic projection of the support 400 on the first substrate 100 is A, and the area of the orthographic projection of the heating layer 200 on the first substrate 100 is B, wherein A is 40% B to 80% B, and specifically, A can be 40% B, 45% B, 50% B, 55% B, 60% B, 65% B, 70% B, 75% B, 80% B, etc. Thus, it can not only ensure a larger gap, but also reduce the heat concentration phenomenon when the heat generated by the heating layer is transmitted to the second substrate through the support, thereby reducing the risk of rupture of the second substrate.

[0071] According to an embodiment of the present application, the height of the first gap 10 can be 10 to 30 microns, for example, it can be 10 microns, 15 microns, 20 microns, 25 microns, 30 microns, etc. Thus, when heating with the heating element assembly, the air in the first gap can effectively improve the thermal resistance of heat transfer to the second substrate, thereby improving the thermal efficiency of heat transfer to the first substrate and improving the heating rate; and it can reduce the unevenness of heat transfer and reduce the risk of rupture of the second substrate.

[0072] According to an embodiment of the present application, the heating layer 220 includes a heating material and a first inorganic oxide matrix, whereby the heating material can be dispersed in the first inorganic oxide matrix, and the heating layer can have good stability.

[0073] According to some embodiments of the present application, the heat-generating material can be selected from at least one of silver, copper and aluminum, i.e. the heat-generating material can be silver, copper or aluminum, or an alloy formed by at least two of the above-mentioned silver, copper and aluminum. The above-mentioned materials have good electrical conductivity, and are weakly magnetosensitive metal materials, with a relative magnetic permeability less than 1, and can induce a magnetic field to generate an electric current eddy current to generate heat, thereby facilitating the improvement of the heating efficiency of the heating layer.

[0074] According to some embodiments of the present application, the first inorganic oxide base can be selected from at least one of bismuth oxide, aluminum oxide and silicon oxide, i.e. the first inorganic oxide base can be bismuth oxide, aluminum oxide or silicon oxide, or a mixture formed by at least two of the above-mentioned bismuth oxide, aluminum oxide and silicon oxide. The first inorganic oxide base is formed by the above-mentioned materials, which can reduce the sintering and curing temperature of the heat-generating paste layer, and can firmly bond the heating layer to the first substrate.

[0075] According to some embodiments of the present application, the transition layer 210 can include a second inorganic oxide base, and the second inorganic oxide base and the first inorganic oxide base have the same composition. According to some other embodiments of the present application, the bonding layer 230 can include a third inorganic oxide base, wherein the third inorganic oxide base can be selected from at least one of bismuth oxide, aluminum oxide and silicon oxide, so that the bonding layer formed by the above-mentioned materials can improve the bonding force between the heating layer and the second substrate, and can effectively improve the thermal resistance of heat transfer from the heating layer to the second substrate, further improving the heating efficiency of the heating element assembly.

[0076] According to some embodiments of the present application, with reference to Figure 9 The thickness d4 of the heating layer 220 can be 10-25 microns, specifically, the thickness d4 of the heating layer 220 can be 10 microns, 12 microns, 15 microns, 18 microns, 20 microns, 22 microns, 25 microns, etc., at this time, the heating layer has a suitable thickness, which is conducive to improving the heating efficiency.

[0077] According to some embodiments of the present application, the square resistance of the heating layer 220 can be 0.1-20 mΩ, specifically, the square resistance of the heating layer 220 can be 0.1 mΩ, 0.2 mΩ, 0.5 mΩ, 1 mΩ, 5 mΩ, 10 mΩ, 15 mΩ, 20 mΩ, etc., the heating layer has a small square resistance, which is conducive to improving the heating rate and the heating efficiency of the heating element assembly.

[0078] According to some embodiments of the present application, with reference to Figure 10The thickness d5 of the transition layer 210 can be 0.1-5 microns. Specifically, the thickness d5 of the transition layer 210 can be 0.1 micron, 0.2 micron, 0.5 micron, 1 micron, 2 microns, 3 microns, 5 microns, etc. The thickness of the transition layer is set in the above range, which is thin, and is conducive to heat transfer from the heat generating layer to the first substrate, and improves the heat transfer efficiency of the heat generating layer and the effective utilization rate of heat.

[0079] According to some embodiments of the present application, referring to Figures 4 to 6 , Figures 8 to 10 The thickness d1 of the first substrate 100 is less than the thickness d2 of the second substrate 300. At this time, the surface of the first substrate 100 away from the heating layer 200 is the heating surface, and the second substrate 300 is thick, which can improve the heat transfer efficiency of the heat generating layer to the heating surface, and can reduce the noise during the operation of the heat generating body assembly, and can also improve the thermal resistance of the second substrate and reduce the heat transfer efficiency of the heat generating layer to the second substrate.

[0080] According to some embodiments of the present application, the surface of the first substrate 100 away from the heating layer 200 is the heating surface, and the thermal conductivity of the second substrate 300 can be less than the thermal conductivity of the first substrate 100. The heat transfer efficiency of the heat generating layer to the heating surface can be improved, the noise during the operation of the heat generating body assembly can be reduced, and the thermal resistance of the second substrate can be improved, and the heat transfer efficiency of the heat generating layer to the second substrate can be reduced.

[0081] According to an embodiment of the present application, the material of the support 400 can include at least one of glass glaze, high-temperature-resistant inorganic glue, or high-temperature-resistant organic glue. The glass glaze can include at least one of bismuth oxide, aluminum oxide, silicon oxide, etc., which can generate strong bonding force between the support and the heating layer, thereby improving the overall stability of the heat generating body assembly. The specific material of the high-temperature-resistant inorganic glue or the high-temperature-resistant organic glue is not particularly limited in the present application, and can be selected and set by those skilled in the art according to actual needs, as long as the formed support can be firmly combined with the heating layer and the second substrate. In addition, the specific curing conditions of the above-mentioned glass glaze, high-temperature-resistant inorganic glue, and high-temperature-resistant organic glue are not particularly limited in the present application, and the curing temperature and curing time thereof can be selected and set by those skilled in the art according to the specific material.

[0082] Further, when the heat generating body assembly simultaneously includes the adhesive layer and the support, the adhesive layer and the support can be prepared by the same step of manufacturing process, so that the process can be simplified, and the bonding force between the support and the adhesive layer can be improved. Those skilled in the art can understand that the composition of the support and the adhesive layer is the same at this time.

[0083] In another aspect of the present application, the present application provides a method for preparing the heating body assembly as described above, comprising the following steps:

[0084] S110: providing a first substrate, and forming a heating layer on the first substrate.

[0085] In this step, the first substrate 100 is provided, and the heating layer 200 is formed on the first substrate 100. The structure of the first substrate 100 is shown in the following figure. Figures 1 to 10

[0086] According to some embodiments of the present application, the method for forming the heating layer 200 can comprise: applying a conductive paste on the first substrate 100, and sintering and curing the conductive paste to obtain the heating layer 200 with the heating layer 220 and the transition layer 210, and the transition layer 210 is arranged in contact with the first substrate 100. According to some embodiments of the present application, the conductive paste comprises a heating material and a first inorganic oxide matrix. After the conductive paste is applied on the surface of the first substrate 100, part of the heating material and the inorganic oxide in the conductive paste will seep out of the conductive paste layer during the sintering and curing process of the conductive paste, forming the transition layer 210 as described above. At this time, the heating layer 200 comprises the heating layer 220 and the transition layer 210, and the transition layer 210 is arranged close to the first substrate 100. It should be noted that the sintering temperature and the sintering time of the sintering and curing of the conductive paste in the present application are not particularly limited, and can be set and adjusted according to actual needs by those skilled in the art, as long as a heating layer with good performance can be formed.

[0087] According to some other embodiments of the present application, the heating layer 200 can be formed by pasting a metal film layer, specifically, a silver film layer can be formed by a water transfer printing method. In some other embodiments of the present application, the heating layer 200 can also be formed by a thermal spraying method. In addition, the specific conditions of the thermal spraying in the present application are not particularly limited, as long as a uniform and flat heating layer can be formed.

[0088] According to some other embodiments of the present application, the method for forming the heating layer 200 can further comprise: applying a bonding coating on the surface of the heating layer 220 away from the first substrate 100, and sintering and curing the bonding coating to obtain the bonding layer 230.

[0089] The material and structure of the first substrate, the transition layer, the heating layer, and the bonding layer have been described in detail above, and will not be repeated here.

[0090] S120: providing a second substrate, arranging the second substrate in connection with the first substrate, and forming a first gap between the second substrate and the heating layer to obtain the heating body assembly.

[0091] ​In this step, a second substrate 300 is provided, wherein the structure of the second substrate 300 is as shown in Figures 1 to 10 The material of the second substrate has been described above and will not be repeated here. The second substrate 300 is arranged in connection with the first substrate 100, and a first gap 10 is formed between the second substrate 300 and the heating layer 200 to obtain a heating body assembly. The method of forming the first gap 10 has been described above and will not be repeated here.

[0092] The heating body assembly formed by the above method can avoid the whole heating layer to soften again and combine with the second substrate, thereby improving the yield of the product. The heating body assembly formed has the first gap, and in the process of heating by the heating body assembly, the air in the first gap forms a large thermal resistance to the heat transfer to the second substrate, thereby reducing the heat transfer to the second substrate and improving the thermal efficiency of the heat transfer to the first substrate.

[0093] In another aspect of the present application, another heating body assembly is provided, which is described with reference to Figure 11 、 Figure 12 and Figure 16 The heating body assembly comprises a first substrate 100, a heating layer 200 and a second substrate 300.

[0094] According to embodiments of the present application, with reference to Figure 11 、 Figure 12 and Figure 16 The heating layer 200 is arranged on one side of the first substrate 100, and the heating layer 200 has at least one first protrusion 201 near the surface of the first substrate 100, i.e. the number of first protrusions 201 can be one or more, and the first protrusion 201 is embedded in the first substrate 100; the heating layer 200 comprises a heating layer 220 and a bonding layer 230, the heating layer 220 is arranged in contact with the first substrate 100, and the surface of the bonding layer 230 away from the heating layer 220 has at least one second protrusion 202, and the number of second protrusions 202 can also be one or more; the second substrate is arranged on the surface of the heating layer 200 away from the first substrate 100, and the second protrusion 202 is embedded in the second substrate 300. In this case, the bonding layer is firmly bonded to the second substrate, the heating layer is firmly combined with the first substrate, and the heating layer is also combined with the bonding layer by sintering and solidification, which can avoid the adverse effects of bubbles caused by the softening of the whole heating layer after being combined with the first substrate and then combined with the second substrate.

[0095] According to some embodiments of the present application, with reference to Figure 11The orthogonal projection of the bonding layer 230 on the first substrate 100 is equal to the orthogonal projection of the heat-generating layer 220 on the first substrate 100. Thus, the bonding force between the bonding layer and the second substrate can be further improved, and the overall stability of the heat-generating component can be effectively improved.

[0096] According to some embodiments of the present application, referring to Figure 14 The orthogonal projection of the bonding layer 230 on the first substrate 100 is less than the orthogonal projection of the heat-generating layer 220 on the first substrate 100. In this case, the bonding force between the bonding layer and the second substrate can be improved, and the overall stability of the heat-generating component can be improved. It should be noted that, in order to more clearly describe the technical solutions of the present application, Figure 14 Only the first substrate 100, the heat-generating layer 220, and the bonding layer 230 are shown.

[0097] According to some embodiments of the present application, referring to Figure 12 、 Figure 13 and Figure 15 The orthogonal projection of the bonding layer 230 on the first substrate 100 is less than the orthogonal projection of the heat-generating layer 220 on the first substrate 100, and a first gap 10 is formed between the heat-generating layer 220 and the second substrate 300. Thus, during the welding of the heat-generating component and the sidewall of the cooking utensil, there is a certain negative pressure air at the gap site. During the heating process using the cooking utensil, the air in the gap site will produce a huge thermal resistance to heat, thereby greatly improving the heating efficiency, transmitting the heat generated by the heating layer to the water or food in the cooking utensil, and thereby improving the heat utilization rate and the heating rate of the cooking utensil.

[0098] It should be noted that, in order to more clearly describe the technical solutions of the present application, Figure 13 and Figure 15 only show part of the structure of the heat-generating component. As shown in Figure 13 and Figure 15 , the heat-generating layer 220 covers part of the surface of the first substrate 100, and the bonding layer 230 is arranged on part of the surface of the heat-generating layer 220 away from the first substrate 100. From Figure 13 and Figure 15 , it can be clearly seen that the orthogonal projection of the bonding layer 230 on the first substrate 100 is less than the orthogonal projection of the heat-generating layer 220 on the first substrate 100.

[0099] It should be further noted that, Figures 13 to 15 only shows the case in some specific embodiments of the present application. Specifically, according to some specific embodiments of the present application, referring to Figure 13 The orthogonal projection of the bonding layer 230 on the first substrate 100 is annular. According to some other specific embodiments of the present application, referring to Figure 14The normal projection of the adhesive layer 230 on the first substrate 100 is a circle. According to some specific embodiments of the present application, referring to Figure 15 The normal projection of the adhesive layer 230 on the first substrate 100 comprises two sub-portions, each of which is a part of a ring, the two sub-portions are not connected, and the two sub-portions are substantially symmetrical about the center of the ring (in the manufacturing process, it is difficult to ensure that the two sub-portions are absolutely symmetrical about the center of the ring, therefore, the substantial symmetry can make the heating element assembly be able to heat the heated objects more uniformly). According to some specific embodiments of the present application, the normal projection of the adhesive layer 230 on the first substrate 100 can also be a quadrilateral, a circle, an ellipse, a pentagon, a hexagon, or an octagon, etc., or can be composed of multiple sub-portions, each of which can be a part of one or more of the above-mentioned figures.

[0100] According to an embodiment of the present application, referring to Figure 16 The heating layer 200 further comprises a transition layer 210, wherein the transition layer 210 is arranged between the heating layer 220 and the first substrate 100, at this time, the surface of the transition layer 210 close to the first substrate 100 can have at least one first protrusion 201, that is, the number of the first protrusions 201 can be one or more, in this case, the transition layer can be firmly bonded with the first substrate, which is conducive to further improving the overall stability of the heating element assembly.

[0101] According to an embodiment of the present application, referring to Figure 11 The end of the heating layer 200 and the end of the first substrate 100 and the end of the heating layer 200 and the end of the second substrate 300 all have a spacing, and the surface of the first substrate 100 not covered by the heating layer 200 and the second substrate 300 have a second gap 30. In this case, when the heating element assembly is combined with the side wall or the bottom of the cooking utensil by welding, the edges of the two substrates will not adversely affect the heating layer after being softened, and the heating performance of the heating layer can be better maintained; the end of the heating layer and the end of the first substrate and the end of the second substrate all have a certain spacing, which can also form a negative pressure space during the heating process of the cooking utensil, further reducing the accumulation of heat at the connection position of the substrate of the heating element assembly and the side wall or the bottom of the cooking utensil, thereby reducing the risk of cracking at the connection position.

[0102] According to an embodiment of the present application, the heating layer 220 comprises a heating material and a first inorganic oxide matrix, whereby the heating material can be dispersed in the first inorganic oxide matrix, and the heating layer can have good stability.

[0103] According to some embodiments of the present application, the heat-generating material can be selected from at least one of silver, copper and aluminum, i.e. the heat-generating material can be silver, copper or aluminum, or an alloy formed by at least two of the above-mentioned silver, copper and aluminum. The above-mentioned materials have good electrical conductivity, and are weakly magnetosensitive metal materials, with a relative magnetic permeability less than 1, and can induce a magnetic field to generate an electric current eddy current to generate heat, thereby facilitating the improvement of the heating efficiency of the heating layer.

[0104] According to some embodiments of the present application, the first inorganic oxide base can be selected from at least one of bismuth oxide, aluminum oxide and silicon oxide, i.e. the first inorganic oxide base can be bismuth oxide, aluminum oxide or silicon oxide, or a mixture formed by at least two of the above-mentioned bismuth oxide, aluminum oxide and silicon oxide. The first inorganic oxide base is formed by the above-mentioned materials, which can reduce the sintering and curing temperature of the heat-generating paste layer, and can firmly bond the heating layer to the first substrate.

[0105] According to some embodiments of the present application, the transition layer 210 can include a second inorganic oxide base, and the second inorganic oxide base and the first inorganic oxide base have the same composition. According to some other embodiments of the present application, the bonding layer 230 can include a third inorganic oxide base, wherein the third inorganic oxide base can be selected from at least one of bismuth oxide, aluminum oxide and silicon oxide, so that the bonding layer formed by the above-mentioned materials can improve the bonding force between the heating layer and the second substrate, and can effectively improve the thermal resistance of heat transfer from the heating layer to the second substrate, further improving the heating efficiency of the heating element assembly.

[0106] According to some embodiments of the present application, referring to Figure 11 The thickness d4 of the heating layer 220 can be 10-25 microns, specifically, the thickness d4 of the heating layer 220 can be 10 microns, 12 microns, 15 microns, 18 microns, 20 microns, 22 microns, 25 microns, etc., at this time, the heating layer has a suitable thickness, which is conducive to improving the heating efficiency.

[0107] According to some embodiments of the present application, the square resistance of the heating layer 220 can be 0.1-20 mΩ, specifically, the square resistance of the heating layer 220 can be 0.1 mΩ, 0.2 mΩ, 0.5 mΩ, 1 mΩ, 5 mΩ, 10 mΩ, 15 mΩ, 20 mΩ, etc., the heating layer has a small square resistance, which is conducive to improving the heating rate and the heating efficiency of the heating element assembly.

[0108] According to some embodiments of the present application, referring to Figure 16The thickness d5 of the transition layer 210 can be 0.1-5 microns, and specifically, the thickness d5 of the transition layer 210 can be 0.1 micron, 0.2 micron, 0.5 micron, 1 micron, 2 microns, 3 microns, 5 microns, etc. The thickness of the transition layer is set within the above range, and the thickness is thin, which is beneficial to heat transfer of the heat generated by the heat generating layer to the first substrate, and improves the heat transfer efficiency of the heat generating layer and the effective utilization rate of the heat.

[0109] According to an embodiment of the present application, referring to Figure 11 The thickness d3 of the bonding layer 230 can be 10-30 microns, and specifically, the thickness d3 of the bonding layer 230 can be 10 microns, 13 microns, 15 microns, 18 microns, 20 microns, 25 microns, 28 microns, 30 microns, etc. The bonding layer with the above thickness can be firmly combined with the second substrate, and the bonding layer with the above thickness can reduce the heat transfer of the heat generated by the heat generating layer to the second substrate to a certain extent, and further can make more heat transferred to the first substrate and the article to be heated on the side of the first substrate away from the second substrate, which is beneficial to improve the heating efficiency of the heat generating body assembly.

[0110] According to an embodiment of the present application, referring to Figure 11 The thickness d1 of the first substrate 100 is less than the thickness d2 of the second substrate 300. At this time, the surface of the first substrate 100 away from the heat generating layer 200 is a heating surface, and the second substrate 300 is thick, which can improve the heat transfer efficiency of the heat generating layer to the heating surface, and can reduce the noise during the operation of the heat generating body assembly, and can also improve the thermal resistance of the second substrate and reduce the heat transfer efficiency of the heat to the second substrate.

[0111] In another aspect of the present application, the present application provides a method for preparing the heat generating body assembly described above, which comprises the following steps:

[0112] S210: providing a first substrate, coating a conductive paste on the first substrate, and sintering and curing the conductive paste to obtain a heat generating layer.

[0113] In this step, the first substrate 100 is provided, and a conductive paste is coated on the first substrate 100, wherein the conductive paste can include the heat generating material and the first inorganic oxide matrix described above; the conductive paste is sintered and cured to form a heat generating layer 220.

[0114] Of course, during the sintering and curing of the conductive paste, the first inorganic oxide matrix also seeps in the direction close to the first substrate to form a transition layer 210. In addition, the specific conditions for sintering and curing the conductive paste in the present application are not particularly limited, and those skilled in the art can select and set according to the actual situation.

[0115] S220: providing a second substrate, coating a bonding paste on the second substrate, and sintering and curing the bonding paste to obtain a bonding layer.

[0116] In this step, a second substrate 300 is provided, and a bonding paste is coated on the second substrate 300. The bonding paste can include a third inorganic oxide base selected from at least one of bismuth oxide, aluminum oxide, and silicon oxide, so that the bonding layer formed by the above-mentioned materials can improve the bonding force between the heating layer and the second substrate, and can effectively improve the thermal resistance of heat transfer to the second substrate, further improving the heating efficiency of the heating element assembly. The bonding paste is sintered and cured to obtain a bonding layer 230, wherein the bonding layer 230 has a second protrusion 202 embedded in the second substrate 300. In addition, the specific conditions for sintering and curing the bonding paste in the present application are not particularly limited, and can be selected and set by those skilled in the art according to actual conditions.

[0117] According to the embodiment of the present application, the first inorganic oxide base and the third inorganic oxide base have the same composition, so that the bonding layer formed on the surface of the heating layer can have better wettability with the heating layer, so that the bonding layer can be more firmly combined with the heating layer.

[0118] S230: sintering the heating layer and the bonding layer to obtain a heating element assembly.

[0119] In this step, the heating layer 220 and the bonding layer 230 are sintered to firmly combine the heating layer 220 and the bonding layer 230 to obtain a heating element assembly. The specific conditions for sintering the heating layer and the bonding layer in the present application are not particularly limited, and can be selected and set by those skilled in the art according to actual conditions.

[0120] The above method can obtain a heating element assembly with excellent performance, and the bonding layer can be sintered directly with the second substrate, rather than being sintered first to form the bonding layer and then being wet bonded with the second substrate, reducing the formation of bubbles. This process necessarily has two layers, because if there is only one heating layer, it is sintered and cured with the first substrate, and then connected with the second substrate, which belongs to wet connection. Therefore, the bonding layer needs to be sintered and cured with the second substrate first, and then the bonding layer and the heating layer are wet bonded. At this time, the composition of the bonding layer and the heating layer is close, the wettability is strong, and bubbles are not easy to produce. In addition, bubbles will not be produced between the bonding layer and the second substrate, and the overall appearance is good. Furthermore, it is beneficial to improve the yield of the product.

[0121] In another aspect of the present application, a cooking appliance is provided, which is described with reference to Figure 17 and Figure 18The cooking utensil 1000 comprises a container body 1100 and a container bottom. The container bottom is connected to the container body 1100 and forms a containing space 1200 in which water or food to be heated can be placed. The container bottom comprises the heating element assembly described above or is made by the method described above.

[0122] According to some embodiments of the present application, referring to Figure 17 and Figure 18 at least a part of the container bottom of the cooking utensil 1000 can be formed by the heating element assembly described above, i.e. the container bottom can be formed only by the heating element assembly. According to other embodiments of the present application, only a part of the container bottom of the cooking utensil 1000 can be formed by the heating element assembly described above. The cooking utensil has all the features and advantages of the heating element assembly described above, which will not be repeated here. In general, the cooking utensil has the advantages of fast heating rate, high heat utilization rate, high safety and long service life.

[0123] According to some embodiments of the present application, referring to Figure 18 The heating layer 200 can have a certain spacing from the side edge of the bottom of the cooking utensil. The spacing can form a space in which air exists. During the heating process using the cooking utensil, the air in the space can generate negative pressure, reducing the accumulation of heat at the connection position of the heating element assembly and the side wall of the cooking utensil, and reducing the risk of rupture at the connection position.

[0124] The specific combination mode between the heating element assembly and the container body is not limited in the present application. The combination can be achieved by welding (fusion welding) or bonding, or other modes. Those skilled in the art can set the combination mode according to actual needs, as long as the heating element assembly and the container body can be well combined.

[0125] According to embodiments of the present application, the cooking utensil 1000 can be a glass kettle, an electromagnetic induction microcrystalline pot, an electric rice cooker or a stew pot, etc. The cooking utensil 1000 can also be other electromagnetic induction cooking utensils, such as a frying pan, a pressure cooker, etc.

[0126] Those skilled in the art can understand that the cooking utensil 1000 can further comprise a heating base which comprises a functional module capable of heating the heating element assembly. According to one embodiment of the present application, the functional module can be an electromagnetic induction coil which can form a magnetic field to generate eddy current in the heating layer and / or the heating layer to generate heat and heat water, food, etc. in the containing space.

[0127] In another aspect of the present application, the present application provides a cooking device comprising the cooking appliance as described above. The cooking device has all the features and advantages of the cooking appliance as described above, which will not be repeated here. In general, the cooking device has the advantages of high heating efficiency, high safety, long service life, etc.

[0128] In the description of the present application, it should be noted that the terms "first", "second", "third", etc. are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second", "third" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0129] In the present application, the terms "connected", "connected", "fixed" and the like should be interpreted broadly, and specifically, can be fixed connection, or detachable connection, or integral; can be mechanical connection, or electrical connection; can be directly connected, or indirectly connected through intermediate media, or the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0130] In addition, in the description of the present application, the description of the terms "one embodiment", "another embodiment", "still another embodiment", "some specific embodiments", "other specific embodiments", "still other specific embodiments" and the like means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, the skilled in the art can combine and combine the different embodiments or examples described in the present application and the features of different embodiments or examples without contradiction.

[0131] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

Claims

1. A heat generating body assembly characterized by comprising: Comprise: a first substrate, a heating layer, the heating layer is arranged on one side of the first substrate, the heating layer has at least one first protrusion near the surface of the first substrate, the first protrusion is embedded in the first substrate, a second substrate, the second substrate is arranged in connection with the first substrate, and a first gap is formed between the second substrate and the heating layer. The heating layer comprises a heating layer and a transition layer arranged in layers, and the transition layer is arranged in contact with the first substrate.

2. The heat generating body assembly according to claim 1, wherein At least one of the first substrate and the second substrate has a first groove, and at least part of the first groove forms the first gap.

3. The heat generating body assembly according to claim 1, wherein The first substrate and the second substrate are connected by a heating layer, and the heating layer has a concave-convex structure near the surface of the second substrate, the convex part of the concave-convex structure is arranged in contact with the second substrate, and the gap between the concave part of the concave-convex structure and the second substrate constitutes the first gap.

4. The heat generating body assembly according to claim 3, wherein The area of the orthographic projection of the convex part on the first substrate is a, and the area of the orthographic projection of the heating layer on the first substrate is b, a is 40%b-80%b.

5. The heat generating body assembly according to claim 1, wherein Further comprising a support, the support is located on the surface of the heating layer near the second substrate, and is arranged in contact with the second substrate, wherein the area of the orthographic projection of the support on the first substrate is less than the area of the orthographic projection of the heating layer on the first substrate, and the gap between the surface of the heating layer not in contact with the support and the second substrate constitutes the first gap.

6. The heat generating body assembly according to claim 5, wherein The area of the orthographic projection of the support on the first substrate is A, and the area of the orthographic projection of the heating layer on the first substrate is B, A is 40%B-80%B.

7. The heat generating body assembly according to any one of claims 1 to 6, characterized by The end of the heating layer and the end of the first substrate and the end of the heating layer and the end of the second substrate have a spacing, and the surface of the first substrate not covered by the heating layer and the second substrate have a second gap.

8. The heat generating body assembly according to any one of claims 1 to 6, characterized by The height of the first gap is 10-30 microns.

9. The heat generating body assembly according to claim 1, wherein The heating layer comprises a heating material and a first inorganic oxide matrix, the heating material is selected from at least one of silver, copper, aluminum, and the inorganic oxide matrix is selected from at least one of bismuth oxide, aluminum oxide, and silicon oxide; The transition layer comprises a second inorganic oxide matrix, and the first inorganic oxide matrix and the second inorganic oxide matrix have the same composition.

10. The heat generating body assembly according to claim 1, wherein The heating layer further comprises a bonding layer arranged on the surface of the heating layer away from the first substrate.

11. The heat-generating body assembly according to claim 10, wherein The bonding layer comprises a third inorganic oxide matrix, and the third inorganic oxide matrix is selected from at least one of bismuth oxide, aluminum oxide, and silicon oxide.

12. The heat generating body assembly according to claim 1, wherein The heating layer satisfies at least one of the following conditions: The square resistance of the heating layer is 0.1mΩ-20mΩ, The thickness of the heating layer is 10-25 microns.

13. The heat-generating body assembly according to claim 10, wherein The thickness of the transition layer is 0.1-5 microns, and the thickness of the bonding layer is 10-30 microns.

14. The heat generating component assembly according to any one of claims 1 to 6, characterized in that The thickness of the first substrate is less than the thickness of the second substrate.

15. A heat generating body assembly characterized by comprising: Comprise: a first substrate, a heating layer disposed on one side of the first substrate, the heating layer having at least one first protrusion close to the surface of the first substrate, the first protrusion embedded in the first substrate, the heating layer comprising a heating layer and a bonding layer, the heating layer being in contact with the first substrate, the bonding layer having at least one second protrusion away from the surface of the heating layer, a second substrate disposed on the surface of the heating layer away from the first substrate, the second protrusion embedded in the second substrate.

16. The heat-generating body assembly according to claim 15, wherein The normal projection of the bonding layer on the first substrate is smaller than the normal projection of the heating layer on the first substrate, and a first gap is formed between the heating layer and the second substrate, Or, the normal projection of the bonding layer on the first substrate is equal to the normal projection of the heating layer on the first substrate.

17. The heat-generating body assembly according to claim 15, wherein The thickness of the bonding layer is 10-30 microns.

18. The heat-generating body assembly according to claim 15, wherein The end of the heating layer and the end of the first substrate and the end of the heating layer and the end of the second substrate have a spacing, and the surface of the first substrate not covered by the heating layer and the second substrate have a second gap.

19. The heat-generating body assembly according to any one of claims 15 to 18, characterized by The heating layer further comprises a transition layer disposed between the heating layer and the first substrate.

20. The heat-generating body assembly according to claim 19, wherein The heating layer comprises a heating material selected from at least one of silver, copper, aluminum and a first inorganic oxide matrix, and the inorganic oxide matrix is selected from at least one of bismuth oxide, aluminum oxide and silicon oxide; The transition layer comprises a second inorganic oxide matrix, and the first inorganic oxide matrix and the second inorganic oxide matrix have the same composition; Optionally, the bonding layer comprises a third inorganic oxide matrix, and the third inorganic oxide matrix and the first inorganic oxide matrix have the same composition.

21. The heat-generating body assembly according to claim 19, wherein The thickness of the transition layer is 0.1-5 microns.

22. The heat-generating body assembly according to any one of claims 15 to 18, characterized by The thickness of the first substrate is less than the thickness of the second substrate.

23. The heat-generating body assembly according to any one of claims 15 to 18, characterized by The heating layer satisfies at least one of the following conditions: The square resistance is 0.1 mΩ-20 mΩ; The thickness is 10-25 microns.

24. A method of producing the heat generating element assembly according to any one of claims 1 to 14, characterized by, Comprising: Providing a first substrate, forming a heating layer on the first substrate; Providing a second substrate, disposing the second substrate and the first substrate, and forming a first gap between the second substrate and the heating layer to obtain the heating body assembly.

25. The method of claim 24, wherein, The method for forming the heating layer comprises: Coating a conductive paste on the first substrate and sintering and curing the conductive paste to obtain the heating layer with a heating layer and a transition layer, and the transition layer is in contact with the first substrate, wherein the conductive paste comprises a heating material and a first inorganic oxide matrix.

26. The method of claim 25, wherein, The method for forming the heating layer further comprises: Coating a bonding coating on the surface of the heating layer away from the first substrate and sintering and curing the bonding coating to obtain a bonding layer.

27. A method of manufacturing the heat generating element assembly according to any one of claims 15 to 23, characterized by, Comprising: Providing a first substrate, coating a conductive paste on the first substrate, and sintering and curing the conductive paste to obtain a heating layer; Providing a second substrate, coating a bonding paste on the second substrate, and sintering and curing the bonding coating to obtain a bonding layer; The heat generating layer and the adhesive layer are subjected to a sintering process to obtain the heat generating body assembly.

28. A cooking appliance characterized by, The container body; and A container bottom connected to the container body and constituting a containing space, the container bottom comprising the heat generating body assembly according to any one of claims 1 to 23 or the heat generating body assembly obtained by the method according to any one of claims 24 to 27.

29. A cooking apparatus, characterized by, The cooking appliance according to claim 28.

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