A plating apparatus and a plating method

Abstract

The application discloses an electroplating jig and an electroplating method. The electroplating jig comprises a material table, a material pressing guide wheel and a groove structure for bearing an electroplating solution. The material table is used for bearing a material belt structure. The material pressing guide wheel is located above the material table and is used for pressing the material belt structure. The area where the material pressing guide wheel contacts the material belt structure is made of conductive material. The groove structure comprises a left side table structure and a right side table structure. An electroplating area is formed between the left side table structure and the right side table structure. The left side table structure is located between the material table and the right side table structure. An anode grid is arranged between the left side table structure and the right side table structure. The electroplating jig further comprises a pumping mechanism. The pumping mechanism is used for driving the electroplating solution to flow from the lower part of the electroplating area to the upper part of the electroplating area in the direction close to the left side table structure. The electroplating jig can save the electroplating solution and reduce the production cost.

Description

Technical Field

[0001] This invention relates to the field of electroplating equipment technology, and more particularly to an electroplating fixture and an electroplating method. Background Technology

[0002] To extend the lifespan and improve the conductivity of the terminals in connector products, most manufacturers choose to electroplate precious metals onto the surface of the terminals.

[0003] Figure 1 A material strip structure is shown, which is equipped with a terminal 11. One end face and the peripheral wall of the terminal 11 need to be electroplated with a metal plating layer. In the prior art, when electroplating the terminal 11 on the material strip structure 1, the end of the material strip structure 1 equipped with the terminal 11 is completely inserted into the electroplating tank. This results in the end faces of both ends of the terminal 11 and the connecting part 12 of the material strip structure 1 being plated with a plating layer. The ineffective electroplating area is too large, resulting in a large consumption of electroplating solution and high production costs. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide an electroplating fixture and an electroplating method that can reduce production costs.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: an electroplating fixture, comprising a material platform, a pressure guide roller, and a tank structure for carrying electroplating solution. The material platform is used to carry the material strip structure, the pressure guide roller is located above the material platform, and the pressure guide roller is used to press against the material strip structure. The area of ​​the pressure guide roller in contact with the material strip structure is made of conductive material. The tank structure includes a left platform structure and a right platform structure, and an electroplating area is formed between the left platform structure and the right platform structure. The left platform structure is located between the material platform and the right platform structure, and an anode grid is provided between the left platform structure and the right platform structure. The fixture also includes a pumping mechanism, which drives the electroplating solution from the lower part of the electroplating area towards the upper part of the electroplating area in a direction closer to the left platform structure.

[0006] To solve the above-mentioned technical problems, the second technical solution adopted by the present invention is: an electroplating method, based on the above-mentioned electroplating fixture, comprising the following steps.

[0007] Place the strip structure onto the material platform and position the terminals mounted on the strip structure within the electroplating area;

[0008] The pressure guide roller is connected to the negative terminal of the power supply, and the anode grid is connected to the positive terminal of the power supply.

[0009] The pumping mechanism is activated, causing the electroplating solution to flow from the lower part of the electroplating area toward the upper part of the electroplating area in a direction closer to the left platform structure, and from above the right platform structure toward the side of the right platform structure away from the material platform, and the electroplating solution is circulated through the pumping mechanism.

[0010] The beneficial effects of this invention are as follows: In this electroplating fixture, the pressure guide wheel is connected to the negative terminal of the power supply, and the anode grid is connected to the positive terminal. When electroplating is performed using terminals mounted on the material strip structure of this electroplating fixture, only one end face and peripheral wall of the terminal are in contact with the electroplating solution, thereby achieving selective plating, reducing the ineffective plating area, and effectively reducing the consumption of electroplating solution. At the same time, the electroplating solution in the upper part of the electroplating area can flow down from the top of the right-side platform structure to the right, thereby forming a closed loop of electroplating solution flow and realizing control of the outflow direction of the electroplating solution, allowing the electroplating in the tank structure to be more efficient. The liquid can circulate, ensuring a stable industrial batch production process and improving the electroplating effect. More importantly, during the actual electroplating process, due to the surface tension of the electroplating solution and the direction of its flow, the structures on both sides of the terminal will also be contaminated with plating. This part is considered an ineffective electroplating area. Since the width of the connecting part in the strip structure is narrower than the width of the structure on the other side of the terminal, the electroplating solution can be directed towards the connecting part using a pumping mechanism. This helps reduce the waste of precious metal plating and further reduces the consumption of electroplating solution, thereby reducing production costs. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0012] Figure 1 This is a schematic diagram of the material strip structure in the prior art;

[0013] Figure 2 This is a simplified structural diagram of the electroplating fixture according to Embodiment 1 of the present invention.

[0014] Explanation of icon numbers:

[0015] 1. Material strip structure; 11. Terminal; 12. Connecting part; 13. Head;

[0016] 2. Material table;

[0017] 3. Material guide rollers;

[0018] 4. Tank structure; 41. Outer shell; 42. Left side platform structure; 421. First guide surface; 43. Right side platform structure; 431. Second guide surface; 44. Gap; 45. Electroplating area; 46. Anode grid;

[0019] 5. XYZ three-axis moving platform. Detailed Implementation

[0020] The objectives, features, and advantages of this invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0022] It should be noted that if the embodiments of the present invention involve directional indicators such as up, down, left, right, front, back, etc., the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the figure. If the specific posture changes, the directional indicators will also change accordingly.

[0023] Furthermore, if the embodiments of the present invention involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature.

[0024] Furthermore, if the meaning of "and / or" appears throughout the text, it refers to three parallel solutions. For example, "and / or" includes solution 1, solution 2, and solution 3, which simultaneously satisfy the above conditions. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0025] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0026] Example 1

[0027] Please refer to Figure 1 and Figure 2 One embodiment of the present invention is: an electroplating fixture for electroplating a coating onto a terminal 11 mounted on a strip structure 1, wherein one end face and the peripheral wall of the terminal 11 need to be plated with a coating.

[0028] The electroplating fixture includes a material platform 2, a pressure guide roller 3, and a tank structure 4 for carrying the electroplating solution. The material platform 2 carries the material strip structure 1. During electroplating, the pulling direction of the material strip structure 1 is set along the length direction of the material platform 2. The pressure guide roller 3 is located above the material platform 2 and is used to press against the material strip structure 1. The area of ​​the pressure guide roller 3 that contacts the material strip structure 1 is made of conductive material. The pressure guide roller 3 is connected to the negative terminal of the power supply so that the material strip structure 1 is connected to the terminal 11 connected to the negative terminal of the power supply. The tank structure 4 includes an outer shell 41 and a left platform structure 42 and a right platform structure respectively disposed in the outer shell 41. Structure 43, the bottom end of the right platform structure 43 has a gap 44 between it and the bottom plate of the outer shell 41, the left platform structure 42 and the right platform structure 43 form an electroplating area 45, the left platform structure 42 is located between the material platform 2 and the right platform structure 43, an anode grid 46 is provided between the left platform structure 42 and the right platform structure 43, the anode grid 46 is connected to the positive terminal of the power supply, and a pumping mechanism (not shown in the figure) is also included, which is used to drive the electroplating solution from the lower part of the electroplating area 45 towards the upper part of the electroplating area 45 in a direction closer to the left platform structure 42, the electroplating solution circulates through such... Figure 2 As indicated by the middle arrow. In this embodiment, the pumping mechanism is located outside the housing 41. In other embodiments, the pumping mechanism may also be connected to the housing 41.

[0029] During the electroplating process, when the electroplating solution flows out from the top of the right-side platform structure 43 in the electroplating area 45, the electroplating solution exerts an upward force on the head 13 of the terminal 11 (the area away from the connecting part 12). To ensure that the size of the terminal 11 does not change after electroplating, there is a slight gap between the right-side platform structure 43 and the head 13 of the terminal 11. That is, the right-side platform structure 43 does not contact any area of ​​the strip structure 1. It should be noted that, in this embodiment, since the width of the connecting part 12 in the strip structure 1 is smaller than the width of the head 13, the electroplating solution flows towards the connecting part 12, thereby reducing the ineffective electroplating area.

[0030] The left platform structure 42 is trapezoidal, and the surface of the left platform structure 42 near the right platform structure 43 is a first guiding surface 421. The first guiding surface 421 can guide the electroplating solution to flow towards the connecting part 12 near the material strip structure 1, so that the peripheral wall area of ​​the terminal 11 near the connecting part 12 can be better plated, which helps to ensure the electroplating quality of the terminal 11. Preferably, the first guiding surface 421 is an inclined surface.

[0031] Optionally, the left platform structure 42 is rotatably configured with its top point as the center, so that the tilt angle of the first guide surface 421 relative to the horizontal plane can be adjusted. According to the structure of the terminal 11 and combined with the flow direction of the electroplating solution, the slope of the left platform structure 42 near the right platform structure 43 is rationally designed, which can effectively reduce the ineffective electroplating area of ​​the connecting part 12 and save electroplating solution.

[0032] Furthermore, the distance between the left-side platform structure 42 and the material platform 2 is adjustable, allowing the electroplating fixture to adapt to various sizes of strip structures 1, thus improving the versatility of the electroplating fixture. Specifically, the electroplating fixture also includes a first driving component (not shown in the figure), which is connected to the left-side platform structure 42. The first driving component is used to drive the left-side platform structure 42 closer to or further away from the material platform 2. Optionally, the first driving component is located on the outer casing 41, and the first driving component may be a linear push rod, a cylinder, a motor screw mechanism, etc.

[0033] Similarly, the distance between the right-side platform structure 43 and the material table 2 is adjustable. The electroplating fixture also includes a second drive assembly (not shown in the figure), which is connected to the right-side platform structure 43. The second drive assembly is used to drive the right-side platform structure 43 to move closer to or away from the material table 2. Optionally, the second drive assembly is disposed on the outer shell 41, and the second drive assembly may be a linear push rod, a cylinder, a motor screw mechanism, etc.

[0034] To ensure smoother circulation of the electroplating solution within the tank structure 4, the side of the right platform structure 43 furthest from the left platform structure 42 is designated as a second guiding surface 431. This second guiding surface 431 is used to guide the electroplating solution back to the right side of the right platform structure 43.

[0035] Optionally, the electroplating fixture also includes an XYZ three-axis moving platform 5, which is connected to the pressure guide roller 3. The position of the pressure guide roller 3 is adjustable, which can achieve the purpose of using the same electroplating fixture for products of different part numbers.

[0036] The left platform structure 42 and / or the right platform structure 43 are made of plastic; the top of the left platform structure 42 is provided with a rounded corner structure on the side near the right platform structure 43, and / or the top of the right platform structure 43 is provided with a rounded corner structure on the side near the left platform structure 42. The rounded corner structure of the left platform structure 42 and / or the right platform structure 43 can avoid scratching the plating layer on the terminal 11 and help ensure the electroplating effect.

[0037] This embodiment also provides an electroplating method, based on the above-mentioned electroplating fixture, including the following steps.

[0038] Place the strip structure 1 onto the tray 2, and position the terminal 11 mounted on the strip structure 1 within the electroplating area 45;

[0039] The pressure guide roller 3 presses down the material belt structure 1;

[0040] The pressure guide roller 3 is connected to the negative terminal of the power supply, and the anode grid 46 is connected to the positive terminal of the power supply.

[0041] The pumping mechanism is turned on, so that the electroplating solution flows from the lower part of the electroplating area 45 toward the upper part of the electroplating area 45 in the direction of approaching the left platform structure 42, and flows from the top of the right platform structure 43 toward the side of the right platform structure 43 away from the material platform 2, and the electroplating solution is circulated through the pumping mechanism and the gap 44.

[0042] An external material pulling mechanism pulls the material belt structure 1 to move on the material platform 2.

[0043] The above are merely optional embodiments of the present invention and do not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. An electroplating fixture, characterized in that: The device includes a material platform, a pressure guide roller, and a tank structure for carrying the electroplating solution. The material platform carries the material strip structure, and the pressure guide roller is located above the material platform and presses against the material strip structure. The area of ​​the pressure guide roller in contact with the material strip structure is made of a conductive material. The tank structure includes a left platform structure and a right platform structure, forming an electroplating zone between the left and right platform structures. The left platform structure is located between the material platform and the right platform structure, and an anode grid is provided between the left and right platform structures. The device also includes a pumping mechanism for driving the electroplating solution from the lower part of the electroplating zone towards the upper part of the electroplating zone, closer to the left platform structure.

2. The electroplating fixture according to claim 1, characterized in that: The left platform structure is in the shape of a trapezoid, and the side of the left platform structure closest to the right platform structure is the first guiding surface.

3. The electroplating fixture according to claim 2, characterized in that: The left-side platform structure is rotatably configured with its top point as the center.

4. The electroplating fixture according to claim 1, characterized in that: It also includes an XYZ three-axis moving platform, which is connected to the pressure guide roller.

5. The electroplating fixture according to claim 1, characterized in that: The top of the left platform structure is provided with a rounded corner structure on the side near the right platform structure, and / or the top of the right platform structure is provided with a rounded corner structure on the side near the left platform structure.

6. The electroplating fixture according to claim 1, characterized in that: The distance between the left-side platform structure and the material platform is adjustable.

7. The electroplating fixture according to claim 6, characterized in that: It also includes a first drive component, which is connected to the left side platform structure and is used to drive the left side platform structure to move closer to or away from the material table.

8. The electroplating fixture according to claim 1, characterized in that: The distance between the right-side platform structure and the material platform is adjustable.

9. The electroplating fixture according to claim 8, characterized in that: It also includes a second drive component, which is connected to the right side platform structure and is used to drive the right side platform structure to move closer to or away from the material table.

10. An electroplating method, characterized in that: The electroplating fixture according to any one of claims 1-9 includes the following steps. Place the strip structure onto the material platform and position the terminals mounted on the strip structure within the electroplating area; The pressure guide roller is connected to the negative terminal of the power supply, and the anode grid is connected to the positive terminal of the power supply. The pumping mechanism is activated, causing the electroplating solution to flow from the lower part of the electroplating area toward the upper part of the electroplating area in a direction closer to the left platform structure, and from above the right platform structure toward the side of the right platform structure away from the material platform, and the electroplating solution is circulated through the pumping mechanism.

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