Pickup device for semiconductor die

Abstract

The pick-up device (100) for a semiconductor die includes: a stage (20) including an adsorption surface (22a) for adsorbing a wafer (12) and a rectangular opening (23) provided on the adsorption surface (22a); and a columnar moving element (30) disposed in the opening (23) of the stage (20) and moving in such a manner that a front end surface (31) protrudes from the adsorption surface (23). The columnar moving element (30) is a rectangular columnar member, and a plurality of recesses (32) are provided at respective corner portions (38a, 38b) of the front end surface (31) and respective side surfaces (33, 34).

Description

Technical Field

[0001] The present invention relates to a structure of a semiconductor die pickup device for picking up semiconductor dies from a wafer Background Art

[0002] Semiconductor dies are manufactured by cutting a wafer with a size of 6 inches or 8 inches into a specified size. At the time of cutting, in order to prevent the cut semiconductor dies from becoming scattered, a wafer is attached to the back surface, and the wafer is cut from the front surface side using a dicing saw or the like. At this time, the wafer attached to the back surface is cut to a certain extent but not completely cut, and remains in a state of holding each semiconductor die. Then, each of the cut semiconductor dies is picked up from the wafer one by one and sent to the next process such as die bonding.

[0003] As a method of picking up semiconductor dies from a wafer, the following method has been proposed: while the wafer is adsorbed on the surface of a disk-shaped adsorption wedge and the semiconductor die is adsorbed on a nozzle, the semiconductor die is lifted by a lift module disposed at the center of the adsorption wedge, and the nozzle is lifted, thereby picking up the semiconductor die from the wafer (for example, refer to paragraph Figures 9 to 2 3) of Patent Document 1).

[0004] Moreover, the following method has also been proposed: while the wafer is adsorbed on the surface of a disk-shaped ejector lid and the semiconductor die is adsorbed on a nozzle, after the nozzle and the surrounding, middle, and central lift modules are lifted to a specified height higher than the surface of the ejector lid, the height of the nozzle is maintained at the height of the said state, and the surrounding lift module and the middle lift module are sequentially lowered to positions below the surface of the ejector lid, thereby peeling the wafer from the semiconductor die (for example, refer to Patent Document 2).

[0005] Prior Art Documents

[0006] Patent Documents

[0007] Patent Document 1: Japanese Patent No. 4945339 Gazette

[0008] Patent Document 2: U.S. Patent No. 8092645 Specification Summary of the Invention

[0009] Problems to be Solved by the Invention

[0010] However, in the case of peeling a wafer from a semiconductor die by the methods described in Patent Document 1 and Patent Document 2, as shown in FIGS. 40, 42, and 44 of Patent Document 1, FIGS. Figure 4 A to Figure 4 D, Figure 5 A to Figure 5As described in D, the portion where the outer end of the lifting module of the semiconductor die abuts causes bending stress in the semiconductor die, and there is a case where the semiconductor die is damaged.

[0011] On the other hand, in order to pick up the semiconductor die from the wafer by the methods described in Patent Document 1 and Patent Document 2, it is necessary to increase the overhang amount of the semiconductor die that extends outward from the outer end of the lifting unit to increase the peeling force of the wafer. In this case, the bending radius in the portion located at the outer peripheral edge of the lifting module becomes larger, and excessive stress is applied to the die. Therefore, in order to prevent the bending stress in the portion located at the outer peripheral edge of the lifting module of the semiconductor die from becoming large, it is necessary to slowly raise the lifting module according to the peeling speed of the wafer.

[0012] Therefore, in the method of the prior art, there is a problem that the speed of picking up the semiconductor die from the wafer becomes slow.

[0013] On the other hand, it is required to shorten the time for picking up the semiconductor die from the wafer.

[0014] Therefore, an object of the present invention is to shorten the time for picking up the semiconductor die from the wafer.

[0015] Technical means for solving the problem

[0016] The semiconductor die picking device of the present invention picks up a semiconductor die attached to the surface of a wafer, and the semiconductor die picking device is characterized by including: a stage including a suction surface that sucks the back surface of the wafer and a rectangular opening provided in the suction surface; and a columnar moving element disposed in the opening of the stage and moving in such a manner that the front end surface protrudes from the suction surface, and the columnar moving element is a rectangular columnar member, and a plurality of recesses are provided at the corners of the front end surface and each side surface.

[0017] As described above, by providing a plurality of recesses at the corners of the front end surface of the columnar moving element, a groove-like notch is formed at the outer peripheral edge of the rectangular front end surface. Moreover, the connecting line between the outer peripheral end of the portion without the notch on the front end surface and the side surface forms the side edge of the front end surface. And the connection point between the side edge and one side edge constituting the notch forms the outer corner of the notch. If the columnar moving element is moved upward, the wafer is stretched downward starting from one side edge and the side edge constituting the notch. Therefore, the outer corner at the connection point of one side edge and the side edge becomes the starting point of peeling of the wafer. Since a plurality of outer corners are provided on the front end surface, the wafer peels off from a plurality of starting points of peeling. Therefore, the wafer can be peeled off in a short time. Moreover, since the peeling speed of the wafer becomes faster, the speed of raising the columnar moving element can be increased compared with the case without recesses, the speed of picking up the semiconductor die from the wafer can be increased, and the picking time can be shortened.

[0018] Moreover, the semiconductor die located on the evacuated notch is supported by the edges forming the grooved notch, so that the bending stress of the semiconductor die at the notched part on the front end face of the columnar moving element can be reduced. Thereby, the bending stress applied to the semiconductor die can be reduced, and the occurrence of damage to the semiconductor die when picking up the semiconductor die can be suppressed.

[0019] In the semiconductor die picking device of the present invention, the plurality of recesses may be provided with a rectangular groove cross-sectional shape extending to the front end face along the moving direction or in a direction inclined with respect to the moving direction.

[0020] Thereby, a rectangular groove-shaped notch can be easily formed on the front end face of the columnar moving element.

[0021] In the semiconductor die picking device of the present invention, a plurality of annular moving elements may be included. The plurality of annular moving elements are arranged around the columnar moving element in a nested manner and move in such a way that the annular front end faces protrude from the adsorption surface. Each annular moving element is a rectangular annular member, and a plurality of outer side recesses extending to the annular front end face are provided at each corner of the annular front end face and each outer side face.

[0022] As described above, by respectively providing outer side recesses on the outer side faces of the respective annular moving elements, similarly to the columnar moving element, a plurality of notches and a plurality of outer corner portions are formed on the annular front end faces of the annular moving elements. And, starting from the plurality of outer corner portions arranged on the annular front end face as the starting points of peeling, peeling from the semiconductor die starts, and the wafer can be peeled in a short time. Moreover, since the speed of peeling the wafer becomes faster, the speed of raising the annular moving element can be increased compared with the case without the outer side recesses, and the speed of picking up the semiconductor die from the wafer can be increased. Thereby, the picking time of the semiconductor die can be shortened.

[0023] In the semiconductor die picking device of the present invention, the plurality of outer side recesses may be provided with a rectangular groove cross-sectional shape extending to the annular front end face along the moving direction or in a direction inclined with respect to the moving direction.

[0024] Thereby, a rectangular groove-shaped notch can be easily formed on the annular front end face of the annular moving element.

[0025] In the semiconductor die picking device of the present invention, the positions in the width direction of the side faces of the respective recesses provided on the side face of the columnar moving element and the positions in the width direction of the outer side faces of the respective outer side recesses provided on the outer side face of the annular moving element may deviate from each other.

[0026] Thus, since the positions of the starting points of peeling when the columnar moving element and each annular moving element are raised are deviated, the overall peeling of the wafer can be promoted, and the picking-up speed of the semiconductor die can be increased. Moreover, the picking-up time of the semiconductor die can be shortened.

[0027] In the semiconductor die picking-up device of the present invention, when picking up a semiconductor die, after making the annular front end faces of all the annular moving elements and the front end face of the columnar moving element protrude from the adsorption surface to the same height, the annular front end faces of the annular moving elements arranged on the inner peripheral side can be made to protrude in sequence from the annular front end faces of the annular moving elements arranged on the outer peripheral side, and then, the front end face of the columnar moving element can be made to protrude from the annular front end face of the annular moving element arranged on the inner peripheral side.

[0028] In the semiconductor die picking-up device of the present invention, when picking up a semiconductor die, after making the annular front end faces of all the annular moving elements and the front end face of the columnar moving element protrude from the adsorption surface to the same height, the annular front end faces can be made to descend from the adsorption surface in sequence from the annular moving elements arranged on the outer peripheral side to the annular moving elements arranged on the inner peripheral side among the plurality of annular moving elements, and then, the front end face of the columnar moving element can be made to descend from the adsorption surface.

[0029] Thus, the wafer can be peeled off step by step from the outer peripheral side of the semiconductor die toward the center, damage to the semiconductor die can be suppressed, and the semiconductor die can be picked up.

[0030] Effects of the Invention

[0031] The present invention can shorten the time for picking up a semiconductor die from a wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a system diagram showing the structure of the semiconductor die picking-up device of the embodiment.

[0033] Figure 2 It shows Figure 1 A perspective view of the stage of the semiconductor die picking-up device shown.

[0034] Figure 3 It shows the arrangement of Figure 2 A perspective view of part A shown, which is a view showing a state in which the front end face of the columnar moving element protrudes upward compared to the annular front end face of the first annular moving element.

[0035] Figure 4 It shows Figure 2 A plan view of the stage shown, the columnar moving element arranged on the stage, the first annular moving element, and the second annular moving element.

[0036] Figure 5It is an explanatory diagram of the pick-up operation of a semiconductor die, showing the state where the columnar moving element, the first annular moving element, and the second annular moving element are raised to positions where the front end surface of the columnar moving element, the first annular front end surface of the first annular moving element and the second annular moving element, and the second annular front end surface are in contact with the back surface of the wafer 12, and the nozzle is lowered so that the lower surface of the nozzle is in contact with the surface of the semiconductor die 15.

[0037] Figure 6 It is a diagram showing the pick-up operation of a semiconductor die, showing Figure 5 an elevation view of the state where the columnar moving element, the first annular moving element, the second annular moving element, and the nozzle are raised from the state shown.

[0038] Figure 7 It is used to Figure 6 explain the notch of the second annular moving element and the starting point of the peeling of the wafer in the state shown, and is Figure 4 a detailed plan view of part B shown in Figure 6 and part C shown in

[0039] Figure 8 It is a diagram showing the pick-up operation of a semiconductor die, showing Figure 6 an elevation view of the state where the columnar moving element, the first annular moving element, and the nozzle are raised from the state shown.

[0040] Figure 9 It is a diagram showing the pick-up operation of a semiconductor die, showing Figure 8 an elevation view of the state where the columnar moving element and the nozzle are raised from the state shown.

[0041] Figure 10 It is a diagram showing the pick-up operation of a semiconductor die, showing Figure 9 an elevation view of the state where the nozzle is raised from the state shown.

[0042] Figure 11 It is a diagram showing another pick-up operation of a semiconductor die, showing Figure 6 a diagram of the state where the second annular moving element is lowered from the state shown.

[0043] Figure 12 It is a diagram showing another pick-up operation of a semiconductor die, showing Figure 11 an elevation view of the state where the first annular moving element is lowered from the state shown.

[0044] Figure 13It is a three-dimensional view showing a columnar moving element of another shape arranged on the stage and first and second annular moving elements of another shape, and is a view showing a state in which the front end surface of the columnar moving element protrudes upward compared to the first annular front end surface and the second annular front end surface of the first and second annular moving elements.

[0045] Explanation of symbols

[0046] 10: Wafer holder

[0047] 11: Wafer

[0048] 12: Wafer piece

[0049] 12a: Surface

[0050] 12b: Back surface

[0051] 13: Ring

[0052] 14: Gap

[0053] 15: Semiconductor die

[0054] 16: Expansion ring

[0055] 18: Suction nozzle

[0056] 19: Suction hole

[0057] 20: Stage

[0058] 21: Body

[0059] 22: Upper end plate

[0060] 22a: Adsorption surface

[0061] 23: Opening

[0062] 23a: End face

[0063] 26: Adsorption groove

[0064] 27: Communication hole

[0065] 28: Linkage mechanism

[0066] 29: Motor

[0067] 30, 130: Columnar moving element

[0068] 31: Front end face

[0069] 32: Recess

[0070] 32a, 32b, 42a, 42b, 52a, 52b: Lateral face

[0071] 32c, 42c, 52c: Bottom surface

[0072] 33, 34: Side surface

[0073] 35, 45, 55: Notch

[0074] 35a, 35b, 45a, 45b, 55a, 55b: Edge

[0075] 36a, 36b: Side

[0076] 37a, 37b, 47a, 47b, 57a, 57b: Outer corner part

[0077] 38a, 38b, 48a, 48b, 58a, 58b: Corner part

[0078] 40, 140: First annular moving element

[0079] 41, 51: Annular front end face

[0080] 42, 52: Outer concave part

[0081] 43, 44, 53, 54: Outer side face

[0082] 49, 59: Inner face

[0083] 50, 150: Second annular moving element

[0084] 61: Wafer holder horizontal direction drive part

[0085] 62: Stage vertical direction drive part

[0086] 63: Nozzle drive part

[0087] 64, 65: Vacuum valve

[0088] 70: Control part

[0089] 71: CPU

[0090] 72: Memory

[0091] 100, 200: Semiconductor die pickup device Detailed implementation mode

[0092] Hereinafter, the semiconductor die pickup device 100 of the implementation mode will be described with reference to the drawings. As Figure 1 shown, the semiconductor die pickup device 100 of the implementation mode includes a wafer holder 10, a stage 20, a nozzle 18, a wafer holder horizontal direction drive part 61, a stage vertical direction drive part 62, a nozzle drive part 63, a vacuum valve 64, a vacuum valve 65, and a control part 70.

[0093] The wafer holder 10 includes an annular expansion ring 16 having a flange portion and a press ring portion 17, and a wafer piece 12 with a holding surface 12a to which semiconductor chips 15 cut from a wafer 11 are attached. The wafer holder 10 is moved in the horizontal direction by a wafer holder horizontal direction drive unit 61.

[0094] Here, as described below, the wafer piece 12 with the semiconductor chips 15 attached to the surface 12a is held by the wafer holder 10. A wafer piece 12 is attached to the back surface of the wafer 11, and a metal ring 13 is mounted on the outer peripheral portion of the wafer piece 12. The wafer 11 is cut from the surface side by a dicing saw or the like during the dicing process to become the respective semiconductor chips 15, and a gap 14 is formed between the respective semiconductor chips 15 during dicing. Even when the wafer 11 is cut, the wafer piece 12 is not cut, and the respective semiconductor chips 15 are held by the wafer piece 12.

[0095] The ring 13 of the wafer piece 12 with the semiconductor chips 15 attached to the surface 12a is placed on the flange of the expansion ring 16, and as shown by the arrow 80 in Figure 1 , the ring 13 is pressed against the flange of the expansion ring 16 from above by the press ring portion 17 and fixed to the flange. Thereby, the wafer piece 12 with the semiconductor chips 15 attached to the surface 12a is held by the wafer holder 10.

[0096] The stage 20 is disposed on the lower surface of the wafer holder 10. The stage 20 includes a main body 21, a columnar moving element 30, a first annular moving element 40 as an annular moving element disposed on the inner peripheral side, a second annular moving element 50 as an annular moving element disposed on the outer peripheral side, a link mechanism 28, and a motor 29. The stage 20 is moved in the vertical direction by a stage vertical direction drive unit 62. The detailed structures of the stage 20, the columnar moving element 30, the first annular moving element 40, and the second annular moving element 50 will be described below with reference to Figures 2 to 4 FIG.

[0097] The nozzle 18 is disposed above the wafer piece 12, adsorbs and holds the semiconductor chips 15 on the lower surface, and picks up the semiconductor chips 15 from the surface 12a of the wafer piece 12. The nozzle 18 is provided with a suction hole 19 for vacuum-adsorbing the semiconductor chips 15 on the lower surface inside. The suction hole 19 is connected to a vacuum device (not shown) via a vacuum valve 65. The nozzle 18 is moved in the vertical and horizontal directions by a nozzle drive unit 63.

[0098] The horizontal drive unit 61 of the wafer holder, the vertical drive unit 62 of the stage, the nozzle drive unit 63, the vacuum valves 64 and 65, and the motor 29 are connected to the control unit 70 and operate according to the instructions of the control unit 70. The control unit 70 is a computer including a central processing unit (CPU) 71 that serves as a processor for internal information processing and a memory 72 that stores programs and the like.

[0099] Next, refer to Figures 2 to 4 The detailed structures of the stage 20, the columnar moving element 30, the first annular moving element 40, and the second annular moving element 50 will be described. In addition, in the following description, the horizontal direction of the surface along the side surface 33 of the columnar moving element 30, the outer side surface 43 of the first annular moving element 40, and the outer side surface 53 of the second annular moving element 50 will be set as the first width direction, and the horizontal direction of the surface along the side surface 34 of the columnar moving element 30, the outer side surface 44 of the first annular moving element 40, and the outer side surface 54 of the second annular moving element 50 will be set as the second width direction for the description.

[0100] As Figure 2 shown, the main body 21 of the stage 20 is cylindrical and includes a circular upper end plate 22. The upper surface of the upper end plate 22 constitutes the adsorption surface 22a for adsorbing the back surface 12b of the wafer 12. A rectangular opening 23 penetrating the upper end plate 22 is provided at the center of the upper end plate 22. In the opening 23, a columnar moving element 30, a first annular moving element 40 arranged around the columnar moving element 30 in a nested manner, and a second annular moving element 50 are arranged. As Figure 1 shown, the columnar moving element 30, the first annular moving element 40, and the second annular moving element 50 are connected to a link mechanism 28 stored inside the main body 21. The link mechanism 28 is driven by the motor 29 to move the columnar moving element 30, the first annular moving element 40, and the second annular moving element 50 in the vertical direction.

[0101] An adsorption groove 26 is provided outside the opening 23 on the adsorption surface 22a of the upper end plate 22. A communication hole 27 connected to the inside of the main body 21 is provided in the adsorption groove 26. As Figure 1 shown, the inside of the main body 21 is connected to a vacuum device (not shown) via the vacuum valve 64.

[0102] As Figure 3As shown, the columnar moving element 30 is a rectangular columnar member, and a plurality of concave portions 32 having a rectangular groove-shaped cross-section are provided at the corners 38a and 38b of the front end face 31 and the side faces 33 and 34. The concave portions 32 are in the shape of a rectangular groove that extends along the up-and-down direction, which is the moving direction, to the front end face 31 on the side faces 33 and 34. A plurality of the concave portions 32 are provided at a prescribed interval in the first width direction and the second width direction. The concave portion 32 includes two transverse faces 32a, 32b and one bottom face 32c, and the transverse faces 32a, 32b and the bottom face 32c form a rectangular groove-shaped notch 35 including three sides 35a, 35b, 35c on the front end face 31. Moreover, in the portion without the concave portion 32, the connecting line between the front end face 31 and the side face 33 constitutes the side edges 36a, 36b of the front end face 31. And the connection point between the side edge 36a and one side 35a of the notch 35 constitutes the outer corner portion 37a of the notch 35. Moreover, the connection point between the side edge 36b and the other side 35b constitutes the outer corner portion 37b of the notch 35.

[0103] The first annular moving element 40 is a rectangular annular member, and a plurality of outer concave portions 42 having a rectangular groove-shaped cross-section are provided at the corners 48a and 48b of the annular front end face 41 and the outer side faces 43 and 44. The outer concave portions 42 are in the shape of a rectangular groove that extends along the up-and-down direction, which is the moving direction, to the annular front end face 41 in the outer side faces 43 and 44. A plurality of the outer concave portions 42 are provided at a prescribed interval in the first width direction and the second width direction. The first annular moving element 40 is arranged around the columnar moving element 30 in a nested manner such that the side faces 33 and 34 of the columnar moving element 30 are fitted into the rectangular inner surface 49.

[0104] Similar to the concave portion 32 of the columnar moving element 30, the outer concave portion 42 of the first annular moving element 40 includes two transverse faces 42a, 42b and one bottom face 42c, and the transverse faces 42a, 42b and the bottom face 42c form a rectangular groove-shaped notch 45 including three sides 45a, 45b, 45c on the annular front end face 41. Moreover, in the portion without the outer concave portion 42, the connecting line between the annular front end face 41 and the outer side face 43 constitutes the side edges 46a, 46b of the annular front end face 41. And the connection point between the side edge 46a and one side 45a of the notch 45 constitutes the outer corner portion 47a of the notch 45. Moreover, the connection point between the side edge 46b and the other side 45b constitutes the outer corner portion 47b of the notch 45.

[0105] As Figure 4As shown, the second annular moving element 50 is also a rectangular annular member like the first annular moving element 40. A plurality of outer concave portions 52 having a rectangular groove-shaped cross-section are provided at the corners 58a and 58b of the annular front end face 51 and the respective outer side faces 53 and 54. The outer concave portions 52 are in the shape of a rectangular groove extending in the vertical direction, which is the moving direction, along the respective outer side faces 53 and 54 to the annular front end face 51. A plurality of outer concave portions 52 are provided at regular intervals in the first width direction and the second width direction. The second annular moving element 50 is arranged around the first annular moving element 40 in a nested manner such that the respective outer side faces 43 and 44 of the first annular moving element 40 are fitted into the rectangular inner surface 59.

[0106] Similar to the outer concave portions 42 of the first annular moving element 40, the outer concave portions 52 of the second annular moving element 50 include two transverse faces 52a, 52b and one bottom face 52c. The transverse faces 52a, 52b and the bottom face 52c form a rectangular groove-shaped notch 55 including three sides 55a, 55b, 55c on the annular front end face 51. Moreover, in the portion without the outer concave portions 52, the connecting lines of the annular front end face 51 and the outer side face 53 constitute the side edges 56a, 56b of the annular front end face 51. And the connection point of the side edge 56a and one side 55a of the notch 55 constitutes the outer corner portion 57a of the notch 55. Moreover, the connection point of the side edge 56b and the other side 55b constitutes the outer corner portion 57b of the notch 55.

[0107] As Figure 4 shown, the width W1 in the first width direction of the second annular moving element 50 is smaller than Figure 4 the width W2 in the first width direction of the semiconductor die 15 shown by the dashed line in

[0108] Moreover, as Figure 4As shown, the positions in the first width direction of the outer concave portions 52 provided at the corners 58a of the outer side surface 53 of the second annular moving element 50, the positions in the first width direction of the outer concave portions 42 provided at the corners 48a of the outer side surface 43 of the first annular moving element 40, and the positions in the first width direction of the concave portions 32 provided at the corners 38a of the side surface 33 of the columnar moving element 30 are offset from each other. Similarly, the positions in the second width direction of the outer concave portions 52 provided at the corners 58b of the outer side surface 54, the positions in the second width direction of the outer concave portions 42 provided at the corners 48b of the outer side surface 44, and the positions in the second width direction of the concave portions 32 provided at the corners 38b of the side surface 34 are offset from each other.

[0109] Therefore, as Figure 4 shown, the positions in the first width direction of the notches 55 formed in the annular front end surface 51 of the second annular moving element 50, the notches 45 formed in the annular front end surface 41 of the first annular moving element 40, and the notches 35 formed in the front end surface 31 of the columnar moving element 30 are offset from each other. Similarly, the positions in the second width direction of these notches are also offset from each other.

[0110] The operation of picking up the semiconductor die 15 from the wafer 12 by the picking device 100 using the semiconductor die configured in the above-described manner will be described.

[0111] As Figure 5 shown, the CPU 71 of the processor as the control unit 70 moves the wafer holder 10 in the horizontal direction through the wafer holder horizontal direction driving unit 61, and adjusts the horizontal position of the wafer holder 10 such that the center of the semiconductor die 15 to be picked up becomes the center of the stage 20 with respect to the center of the stage 20.

[0112] Then, as Figure 5 indicated by the arrow 81 in Figure 1 shown, the CPU 71 of the control unit 70 raises the stage 20 through the stage vertical direction driving unit 62 shown until the adsorption surface 22a comes into contact with the back surface 12b of the wafer 12. Moreover, after the CPU 71 of the control unit 70 adjusts the center of the suction nozzle 18 to be the center position of the semiconductor die 15 to be picked up through the suction nozzle driving unit 63 shown, as Figure 1 indicated by the arrow 82 in Figure 5 shown, the suction nozzle 18 is lowered until the lower surface comes into contact with the semiconductor die 15.

[0113] As Figure 5As shown, after the position adjustment of the wafer holder 10 and the nozzle 18 is completed, as described above, the outer peripheral end of the semiconductor die 15 is directly above the gap S of the width d between the end face 23a of the opening 23 and the outer side surface 53 of the second annular moving element 50, and is in a state of protruding length E from the outer side surface 53 of the second annular moving element 50.

[0114] Next, the CPU 71 of the control unit 70 turns on Figure 1 the vacuum valve 64 shown in the figure, making the inside of the main body 21 of the stage 20 vacuum. The air in the suction grooves 26 on the suction surface 22a is drawn into the vacuum device through the communication holes 27, so the suction grooves 26 become vacuum, and the back surface 12b of the wafer 12 is vacuum-sucked onto the suction surface 22a. Moreover, the CPU 71 turns on Figure 1 the vacuum valve 65 shown in the figure, making the suction holes 19 of the nozzle 18 vacuum, and vacuum-sucking the lower surface of the nozzle 18 to the semiconductor die 15.

[0115] Next, the CPU 71 of the control unit 70 drives the link mechanism 28 through the motor 29, as Figure 6 shown by the arrow 83 in the figure, raising the columnar moving element 30, the first annular moving element 40, and the second annular moving element 50 to the same height. Moreover, at the same time, the nozzle 18 is raised by the nozzle driving unit 63. After the columnar moving element 30, the first annular moving element 40, and the second annular moving element 50 are raised, the wafer 12 attached to the lower side of the outer peripheral end of the semiconductor die 15 is stretched obliquely downward and is about to peel off from the semiconductor die 15.

[0116] As Figure 7 shown in the figure, the wafer 12 between the side edges 56a, 56b of the annular front end face 51 of the second annular moving element 50 and the end face 23a of the opening 23 is stretched downward starting from the side edges 56a, 56b. Moreover, since a notch 55 is formed in the annular front end face 51 of the second annular moving element 50, if the gap S between the outer side surface 53 and the end face 23a of the opening 23 becomes vacuum, the outer concave portion 52 also becomes vacuum. Thus, the wafer 12 is stretched downward starting from the two edges 55a, 55b of the notch 55. In this way, the wafer 12 is stretched downward starting from the side edges 56a, 56b and the edges 55a, 55b. Therefore, the respective outer corner portions 57a, 57b at the connection points of the side edges 56a, 56b and the edges 55a, 55b become the starting points of the peeling of the wafer 12, and Figure 7 as shown in the figure, peeling of the regions Fa, Fb including the respective outer corner portions 57a, 57b occurs. The peeling that occurs is as Figure 7As shown by arrow 85a and arrow 85b in [reference], they extend from each outer corner portion 57a and outer corner portion 57b toward the inner circumference of the annular front end face 51. In this way, the wafer 12 starts to peel off from each outer corner portion 57a and outer corner portion 57b of the plurality of notches 55. Since a plurality of outer corner portions 57a and outer corner portions 57b are arranged on the annular front end face 51, the wafer 12 starts to peel off from a plurality of peeling starting points. Therefore, the wafer 12 attached to the outer peripheral portion of the semiconductor die 15 can be peeled off in a short time. Moreover, since the peeling speed of the wafer 12 is increased, the speed of raising the second annular moving element 50 can be increased compared with the case without the outer concave portion 52, and the speed of picking up the semiconductor die 15 from the wafer 12 can be increased. Thereby, the time for picking up the semiconductor die 15 can be shortened.

[0117] Moreover, the semiconductor die 15 located on the evacuated notch 55 is supported by the three sides 55a, side 55b, and side 55c that form the groove-shaped notch 55. Therefore, the bending stress of the semiconductor die 15 in the portion of the annular front end face 51 of the second annular moving element 50 where the notch 55 is located can be reduced. Thereby, the bending stress applied to the semiconductor die 15 can be reduced, and the occurrence of damage to the semiconductor die 15 when picking up the semiconductor die 15 can be suppressed.

[0118] Next, the CPU 71 of the control unit 70 drives the link mechanism 28 through the motor 29, as Figure 8 shown by arrow 87 in [reference], to further raise the columnar moving element 30 and the first annular moving element 40. Moreover, in coordination with the columnar moving element 30 and the first annular moving element 40, as Figure 8 shown by arrow 88 in [reference], the suction nozzle 18 is further raised.

[0119] Thereby, similar to the description with reference to Figure 7 above, Figure 3 , Figure 4 a plurality of outer corner portions 47a and outer corner portions 47b of the annular front end face 41 of the first annular moving element 40 shown in [reference] become the starting points for peeling of the wafer 12, and the wafer 12 peels off from the outer corner portions 47a and outer corner portions 47b.

[0120] Next, the CPU 71 of the control unit 70 drives the link mechanism 28 through the motor 29, as Figure 9 shown by arrow 89 in [reference], to further raise the columnar moving element 30. Moreover, in coordination with the columnar moving element 30, as Figure 9 shown by arrow 90 in [reference], the suction nozzle 18 is further raised. Thereby, similar to the description with reference to Figure 7 above, Figure 3 , Figure 4Multiple outer corner portions 37a and 37b of the columnar moving element 30 shown become the starting points for the peeling of the wafer 12, and the wafer 12 peels off from the outer corner portions 37a and 37b.

[0121] Next, as Figure 10 indicated by the arrow 91 in Figure 1 , the CPU 71 of the control unit 70 raises the suction nozzle 18 through the

[0122] suction nozzle driving unit 63 shown and picks up the semiconductor die 15 from the surface 12a of the wafer 12.

[0122] As described above, the semiconductor die pickup device 100 according to the embodiment uses the outer corner portions 37a and 37b of the multiple notches 35 on the columnar moving element 30 and the front end surface 31, the annular front end surface 41 of the first annular moving element 40, and the outer corner portions 47a and 47b, outer corner portions 57a and 57b of the multiple notches 45 and 55 on the annular front end surface 51 of the second annular moving element 50 as the starting points to peel the wafer 12. Therefore, there are many starting points for the peeling of the wafer 12, and the wafer 12 can be peeled in a short time.

[0123] Moreover, the starting points for the peeling of the wafer 12 appear more frequently on the outer peripheral edge of the second annular moving element 50. Therefore, even if the amount by which the outer peripheral end of the semiconductor die 15 extends from the outer side surfaces 53 and 54 of the second annular moving element 50 is less than that of the prior art described in Patent Document 1 and Patent Document 2, sufficient peeling force can be ensured. As a result, the amount of overhang of the outer peripheral end of the semiconductor die 15 can be reduced, and the bending stress applied to the semiconductor die near the corner portions 58a and 58b of the second annular element 50 can be reduced, thereby suppressing damage to the semiconductor die 15.

[0124] Moreover, the positions in the width direction of the multiple notches 35 on the columnar moving element 30 and the front end surface 31 deviate from the positions in the width direction of the notches 45 and 55 on the annular front end surface 41 of the first annular moving element 40 and the annular front end surface 51 of the second annular moving element 50. Therefore, the outer corner portions 37a and 37b of the columnar moving element 30 and the front end surface 31 that become the starting points for peeling deviate from the outer corner portions 47a and 47b, outer corner portions 57a and 57b of the annular front end surface 41 of the first annular moving element 40 and the annular front end surface 51 of the second annular moving element 50 in the width direction. Therefore, the starting points for peeling are dispersed in the width direction, and the overall peeling of the wafer 12 can be promoted. As a result, the semiconductor die 15 can be picked up in a short time.

[0125] Moreover, in the semiconductor die pickup device 100 of the embodiment, the semiconductor die 15 is supported by three sides 55a, 55b, and 55c that form the notch 55 in a groove shape. Therefore, the bending stress of the semiconductor die 15 at the portion with the notch 55 on the annular front end face 51 of the second annular moving element 50 can be reduced. As a result, the bending stress applied to the semiconductor die 15 can be reduced, thereby suppressing the occurrence of damage to the semiconductor die 15 when picking up the semiconductor die 15.

[0126] In the above description, it is assumed that when picking up the semiconductor die 15, after the annular front end face 41 of the first annular moving element 40, the annular front end face 51 of the second annular moving element 50, and the front end face 31 of the columnar moving element 30 protrude from the adsorption surface 22a to the same height, the annular front end face 41 of the first annular moving element 40 disposed on the inner peripheral side protrudes from the annular front end face 51 of the second annular moving element 50 disposed on the outer peripheral side, and then the front end face 31 of the columnar moving element 30 protrudes from the annular front end face 41 of the first annular moving element 40 for the description, but it is not limited thereto.

[0127] For example, as follows, after the annular front end face 41 of the first annular moving element 40, the annular front end face 51 of the second annular moving element 50, and the front end face 31 of the columnar moving element 30 protrude from the adsorption surface 22a to the same height, the annular front end faces 51 and 41 are sequentially lowered from the adsorption surface 22a from the second annular moving element 50 disposed on the outer peripheral side to the first annular moving element 40 disposed on the inner peripheral side, and then the front end face 31 of the columnar moving element 30 is lowered from the adsorption surface 22a. Hereinafter, refer to Figure 6 、 Figure 11 、 Figure 12 for the description.

[0128] As Figure 6 shown, the CPU 71 of the control unit 70 drives the link mechanism 28 through the motor 29 to raise the columnar moving element 30, the first annular moving element 40, and the second annular moving element 50 to the same height. As a result, as described above with reference to Figure 7 , the wafer 12 is peeled off from the outer peripheral portion of the semiconductor die 15.

[0129] Next, with the height of the suction nozzle 18 maintained, the CPU 71 of the control unit 70 drives the link mechanism 28 through the motor 29 as shown by the arrow 92 in Figure 11 to lower the annular front end face 51 of the second annular moving element 50 on the outer peripheral side below the adsorption surface 22a. As a result, the same as described with reference to Figure 8 is obtained, Figure 3 、 Figure 4The plurality of outer corner portions 47a and 47b of the annular front end surface 41 of the first annular moving element 40 shown serve as the starting points for the peeling of the wafer 12, and the wafer 12 peels off from the outer corner portions 47a and 47b.

[0130] Next, the CPU 71 of the control unit 70 drives the link mechanism 28 by the motor 29 while maintaining the height of the suction nozzle 18, as shown by the arrow 93 in Figure 12 the figure, so that the annular front end surface 41 of the first annular moving element 40 on the inner peripheral side descends below the adsorption surface 22a. Thus, as described with reference to Figure 9 the same, Figure 3 、 Figure 4 the plurality of outer corner portions 37a and 37b of the front end surface 31 of the columnar moving element 30 shown serve as the starting points for the peeling of the wafer 12, and the wafer 12 peels off from the outer corner portions 37a and 37b.

[0131] Then, as described with reference to Figure 10 the CPU 71 of the control unit 70 raises the suction nozzle 18 through the suction nozzle drive unit 63 to pick up the semiconductor die 15.

[0132] In the above operation, similar to the operation described above, the wafer 12 can be peeled off in a short time, and the bending stress applied to the semiconductor die 15 can be reduced.

[0133] Next, referring to Figure 13 the other-shaped columnar moving element 130 and the other-shaped first annular moving element 140 disposed on the stage 20 will be described.

[0134] Figure 13 In the columnar moving element 130 shown, the recess 132 (formed by the horizontal surfaces 132a, 132b and the bottom surface 132c) provided at the corners 38a and 38b of the front end surface 31 and the side surfaces 33 and 34 of the columnar moving element 30 described above with reference to Figure 3 、 Figure 4 is in the shape of a rectangular groove extending along a direction inclined from the up-down direction as the moving direction. Except for this, it is the same as the columnar moving element 30 described above, and a notch 35 identical to that of the columnar moving element 30 is formed on the front end surface 31.

[0135] Moreover, Figure 13 in the first annular moving element 140 shown, the above-mentioned reference Figure 3 、 Figure 4The outer concave portions 142 (formed by the transverse surfaces 142a, 142b and the bottom surface 142c) provided at the corner portions 48a, 48b of the circumferential front end surface 41 and the respective outer side surfaces 43, 44 of the first circumferential moving element 40 are in the shape of a rectangular groove extending along a direction inclined from the up-and-down direction as the moving direction. Except for this, the circumferential front end surface 41 is formed with the same notch 45 as the first circumferential moving element 40 described above.

[0136] Although Figure 13 not shown in the figure, the outer concave portions 152 provided at the corner portions 58a, 58b of the circumferential front end surface 51 and the respective outer side surfaces 53, 54 of the second circumferential moving element 50 may be in the shape of a rectangular groove extending along a direction inclined from the up-and-down direction as the moving direction, and used as the second circumferential moving element 150.

[0137] In the case where the columnar moving element 130, the first circumferential moving element 140, and the second circumferential moving element 150 configured in the above-described manner are arranged in the opening 23 of the stage 20 to form a semiconductor die pickup device 200 (not shown), its effects are the same as those of the semiconductor die pickup device 100 described above.

[0138] In addition, the concave portions 132 of the columnar moving element 30 and the columnar moving element 130, the outer concave portions 142 of the first circumferential moving element 40 and the first circumferential moving element 140, and the outer concave portions 152 of the second circumferential moving element 50 and the second circumferential moving element 150 have been described as having a rectangular groove cross-sectional shape, but are not limited thereto. For example, they may also be in a U-shaped or semi-circular groove cross-sectional shape.

[0139] Moreover, in the above description, it has been described that a plurality of circumferential moving elements of the columnar moving element 30, the first circumferential moving element 40, and the second circumferential moving element 50 are arranged in a nested manner in the opening 23 of the stage 20, but are not limited thereto. For example, the columnar moving element 30 and the first circumferential moving element 40 may be arranged in a nested manner in the opening 23, or only the columnar moving element 30 may be arranged in the opening 23. Moreover, the number of the plurality of circumferential moving elements can be appropriately selected according to the size of the semiconductor die 15 to be picked up, the thickness, material, etc. of the wafer 12, and three or more circumferential moving elements can be arranged together with the columnar moving element 30 in the opening 23.

Claims

1. A semiconductor die pick-up device that picks up semiconductor dies attached to the surface of a wafer. The semiconductor die pick-up device is characterized by including: A stage, including a suction surface that sucks the back surface of the wafer and a rectangular opening provided on the suction surface; A columnar moving element, disposed in the opening of the stage, and moving in such a manner that the front end surface protrudes from the suction surface; And A plurality of annular moving elements, the plurality of annular moving elements being arranged around the columnar moving element in a nested manner, and moving in such a manner that the annular front end surfaces protrude from the suction surface; The columnar moving element is a rectangular columnar member, and a plurality of recesses are provided at each corner of the front end surface and each side surface; Each of the annular moving elements is a rectangular annular member, and a plurality of outer recesses are provided at each corner of the annular front end surface and each outer side surface; The plurality of recesses and the plurality of outer recesses have a rectangular groove cross-sectional shape extending along a direction inclined with respect to the moving direction.

2. The semiconductor die pick-up device according to claim 1, characterized in that: Each position in the width direction of the side surface of each recess provided on the side surface of the columnar moving element, and Each position in the width direction of the outer side surface of each outer recess provided on the outer side surface of the annular moving element are offset from each other.

3. The semiconductor die pick-up device according to claim 1 or 2, characterized in that: When picking up the semiconductor die, After making the annular front end surfaces of all the annular moving elements and the front end surface of the columnar moving element protrude from the suction surface to the same height, Making the annular front end surfaces of the annular moving elements arranged on the inner peripheral side protrude from the annular front end surfaces of the annular moving elements arranged on the outer peripheral side in sequence, and then making the front end surface of the columnar moving element protrude from the annular front end surfaces of the annular moving elements arranged on the inner peripheral side.

4. The semiconductor die pick-up device according to claim 1 or 2, characterized in that: When picking up the semiconductor die, After making the annular front end surfaces of all the annular moving elements and the front end surface of the columnar moving element protrude from the suction surface to the same height, Sequentially lowering the annular front end surfaces from the suction surface from the annular moving elements arranged on the outer peripheral side to the annular moving elements arranged on the inner peripheral side within the plurality of annular moving elements, and then lowering the front end surface of the columnar moving element from the suction surface.

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