Thermal management module

Abstract

The heat management module of the present application comprises a manifold, a liquid accumulator, a first electronic expansion valve, a second electronic expansion valve and a heat exchanger mounted on the manifold; wherein the manifold is formed with a first flow channel and a second flow channel inwardly, the first flow channel and the second flow channel are independently arranged, the liquid accumulator is communicated with the second flow channel for introducing refrigerant into the second flow channel, the first electronic expansion valve and the second electronic expansion valve are connected in parallel and communicated with the first flow channel, so that the refrigerant in the first flow channel can be discharged through the first electronic expansion valve or the second electronic expansion valve, and the heat exchanger is connected and communicated with the first electronic expansion valve for heat exchange of the refrigerant discharged from the first electronic expansion valve. The present application simplifies the assembly process of the heat management module, reduces the volume of the whole heat management module, facilitates the subsequent assembly in the automobile heat management system, and reduces the leakage risk of the refrigerant passing through the heat management module.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of automobile thermal management system, and particularly relates to a thermal management module. BACKGROUND

[0002] The thermal management module is applied to an automobile thermal management system, and is used for being connected and communicated with terminal devices such as a compressor, an indoor condenser, an outdoor condenser and an evaporator, so as to assist the thermal management system to realize functions in different modes such as refrigeration, heating, dehumidification and battery super-fast charging cooling.

[0003] At present, the heat exchanger, manifold, liquid accumulator and electronic expansion valve in the existing thermal management module are usually connected and communicated through relevant interfaces, and the assembly between components needs to be realized by means of an installation bracket. The assembly process is troublesome, and the overall volume of the obtained thermal management module is large. In addition, in order to realize the circulation of refrigerant, the components in the obtained thermal management module after assembly need to be connected and communicated respectively, so that there are many connection points in the thermal management module, which makes the risk of refrigerant leakage in the circulation of the whole thermal management module be high. SUMMARY

[0004] Therefore, it is necessary to provide a thermal management module aiming at the above technical problems.

[0005] A thermal management module is applied to an automobile thermal management system, and characterized in that the thermal management module comprises a manifold, a liquid accumulator, a first electronic expansion valve, a second electronic expansion valve and a heat exchanger, wherein the liquid accumulator, the first electronic expansion valve, the second electronic expansion valve and the heat exchanger are all installed on the manifold.

[0006] The manifold is formed with a first flow channel and a second flow channel inwardly, the first flow channel and the second flow channel are independently arranged, the liquid accumulator is communicated with the second flow channel and used for guiding refrigerant into the second flow channel, the first electronic expansion valve and the second electronic expansion valve are arranged in parallel and communicated with the first flow channel, so that the refrigerant in the first flow channel can be discharged through the first electronic expansion valve or the second electronic expansion valve, and the heat exchanger is connected and communicated with the first electronic expansion valve and used for heat exchanging the refrigerant discharged from the first electronic expansion valve.

[0007] In the present application, the liquid reservoir, the first electronic expansion valve, the second electronic expansion valve and the heat exchanger are directly mounted to the manifold, so that the overall integration of the heat management module is high, and the use of mounting brackets is avoided, which not only simplifies the assembly process of the heat management module, but also reduces the overall volume of the heat management module obtained finally, so as to facilitate the subsequent assembly in the automobile heat management system; at the same time, the number of connection points in the heat management module is also reduced, so as to reduce the leakage risk of the refrigerant passing through the heat management module.

[0008] In one of the embodiments, the liquid reservoir is arranged on one end surface of the manifold and connected and communicated with the manifold;

[0009] The first inlet and the second inlet are respectively communicated with the manifold, and the outlet is communicated with the second flow channel.

[0010] It can be understood that the liquid reservoir is assembled to one end surface of the manifold and connected and communicated with the manifold, so that the assembly and connection of the liquid reservoir on the manifold are realized, and the structure characteristics of the liquid reservoir are utilized, so that the refrigerant obtained after being distributed by the liquid reservoir can be directly introduced into the second flow channel of the manifold during the operation of the heat management module, so as to meet the use requirements of the operation of the heat management module.

[0011] In one of the embodiments, the manifold further forms a first liquid inlet channel, the manifold can be communicated with the first inlet through the first liquid inlet channel, and a first liquid inlet of the first liquid inlet channel is arranged on a side surface of the manifold for mounting the heat exchanger;

[0012] The first liquid inlet channel is provided with a first one-way valve and a first temperature sensor, the first one-way valve is used to control the one-way conduction of the first liquid inlet channel, and the first temperature sensor is used to detect the temperature of the refrigerant in the first liquid inlet channel.

[0013] It can be understood that the first liquid inlet of the first liquid inlet channel is arranged on a side surface of the manifold for mounting the heat exchanger, so that the external refrigerant pipeline can be communicated with the first liquid inlet channel of the manifold, so as to introduce the refrigerant into the liquid reservoir through the first liquid inlet channel and achieve the effect of distributing the refrigerant; the first one-way valve in the first liquid inlet channel can prevent the refrigerant from flowing back when passing through the first liquid inlet channel, and the first temperature sensor in the first liquid inlet channel can monitor the temperature of the refrigerant conducted in the first liquid inlet channel.

[0014] In one of the embodiments, the manifold further forms a second liquid inlet channel, the manifold can be communicated with the second inlet through the second liquid inlet channel, and a second liquid inlet of the second liquid inlet channel is arranged on an end surface of the manifold away from the liquid reservoir;

[0015] The second inlet channel is provided with a first refrigerant valve and a second temperature sensor, the first refrigerant valve is used for controlling the opening / closing of the second inlet channel, and the second temperature sensor is used for detecting the temperature of the refrigerant in the second inlet channel.

[0016] It can be understood that the second inlet port of the second inlet channel is arranged on the end face of the manifold away from the liquid reservoir, so that the external refrigerant pipeline is communicated with the second inlet channel of the manifold, so as to guide the refrigerant into the liquid reservoir through the second inlet channel, and the effect of distributing the refrigerant is achieved. The structure of the first refrigerant valve in the second inlet channel can control the flow of the refrigerant in the second inlet channel, and the second temperature sensor in the second inlet channel can monitor the temperature of the refrigerant in the second inlet channel.

[0017] In one of the embodiments, the first electronic expansion valve and the second electronic expansion valve are arranged on both sides of one side face of the manifold, and the first electronic expansion valve is arranged adjacent to the heat exchanger.

[0018] The manifold is further provided with an outlet channel, a first outlet port of the outlet channel is arranged on the side face of the manifold for mounting the heat exchanger and is communicated with the first flow channel, so that the refrigerant in the first flow channel can also be discharged through the outlet channel.

[0019] It can be understood that through the above structure, the positions of the first electronic expansion valve and the second electronic expansion valve on the manifold are specifically realized, and the connection and communication between the first electronic expansion valve and the heat exchanger are facilitated. The structure of the outlet channel on the manifold enables the refrigerant in the first flow channel to be discharged through the outlet channel and the first electronic expansion valve at the same time when the heat management module works, so as to meet the use requirement of refrigeration when the heat management module works.

[0020] In one of the embodiments, the manifold is further provided with two third inlet channels, the two third inlet channels are independently arranged, and two third inlet ports of the two third inlet channels are arranged on two opposite side faces of the manifold and are respectively communicated with the first flow channel, so as to selectively guide the refrigerant into the first flow channel.

[0021] The second one-way valve is arranged in each of the two third inlet channels and is used for controlling the one-way conduction of the corresponding third inlet channel.

[0022] It can be understood that, by setting the positions of the two third liquid inlet openings on the manifold, the external refrigerant pipeline can be in communication with the two third liquid inlet channels on the manifold, and the refrigerant can be introduced into the first flow channel through the two third liquid inlet channels, so as to meet the use requirements of refrigeration or heating when the heat management module is working. The structure of the second one-way valve in the third liquid inlet channel can prevent the backflow of the refrigerant in the corresponding third liquid inlet channel.

[0023] In one of the embodiments, the two third liquid inlet channels are third liquid inlet channel A and third liquid inlet channel B, the third liquid inlet channel A is arranged in the area where the first electronic expansion valve is located, and the third liquid inlet channel B is arranged in the area where the second electronic expansion valve is located.

[0024] The third temperature sensor is further installed in the third liquid inlet channel B, and the third temperature sensor can detect the temperature of the refrigerant in the third liquid inlet channel B.

[0025] It can be understood that, by reasonably arranging the positions of the third liquid inlet channel A and the third liquid inlet channel B, the overall volume of the manifold can be reduced. The third temperature sensor in the third liquid inlet channel B can monitor the temperature of the refrigerant flowing through the third liquid inlet channel B.

[0026] In one of the embodiments, a fourth liquid inlet channel is further formed on the manifold, the fourth liquid inlet channel has a fourth liquid inlet opening, a fourth liquid outlet opening A and a fourth liquid outlet opening B, the fourth liquid inlet opening and the fourth liquid outlet opening A are arranged on the end face of the manifold away from the liquid reservoir, and the fourth liquid outlet opening B is arranged on the side face of the manifold for mounting the heat exchanger.

[0027] The second refrigerant valve is further installed in the fourth liquid inlet channel, and the second refrigerant valve is used to control the communication between the fourth liquid outlet opening A or the fourth liquid outlet opening B and the fourth liquid inlet opening.

[0028] It can be understood that the second refrigerant valve is used to control the flow direction of the refrigerant introduced into the fourth liquid inlet channel through the third liquid inlet opening, so as to meet different use requirements of refrigeration or heating when the heat management module is working.

[0029] In one of the embodiments, an antifreeze tank is connected and communicated with the heat exchanger, the antifreeze tank can introduce antifreeze into the heat exchanger, so that the antifreeze and the refrigerant introduced into the heat exchanger by the first electronic expansion valve can exchange heat in the heat exchanger.

[0030] The passage between the anti-freezing liquid tank and the heat exchanger is provided with a flow valve for adjusting the flow of the anti-freezing liquid from the anti-freezing liquid tank to the heat exchanger.

[0031] It can be understood that the flow valve is used to control the flow of the anti-freezing liquid from the anti-freezing liquid tank to the heat exchanger, so that the heat exchange amount of the refrigerant in the heat exchanger can be adjusted to ensure that the refrigerant passing through the heat exchanger can be completely converted into low-temperature and low-pressure refrigerant, and the use requirement of refrigeration during the operation of the heat management module can be met.

[0032] In one of the embodiments, the manifold includes a manifold body and a sealing cover plate, and the manifold body and the sealing cover plate enclose and form the first flow channel and the second flow channel.

[0033] The first flow channel includes a first sub-flow channel and a second sub-flow channel, and the first sub-flow channel and the second sub-flow channel are arranged in parallel, and the first sub-flow channel and the second sub-flow channel are arranged at the periphery of the second flow channel and surround the second flow channel, and the refrigerant in the first sub-flow channel and the refrigerant in the second sub-flow channel can exchange heat with the refrigerant in the second flow channel.

[0034] It can be understood that the manifold body and the sealing cover plate are arranged in the above manner, so that the structure of the manifold is realized, and the structure of the manifold is simplified; the first flow channel and the second flow channel formed by the manifold body and the sealing cover plate are used to guide the refrigerant, and in this process, the first sub-flow channel and the second sub-flow channel in the first flow channel surround the second flow channel, so that the refrigerant can fully exchange heat with the refrigerant in the second flow channel when passing through the first sub-flow channel and the second sub-flow channel, and the heat exchange efficiency between the two is improved, so that the manifold integrates the heat exchange function of the heat exchanger, which not only reduces the production cost, but also reduces the overall structure of the manifold, so as to facilitate the assembly and application of the manifold in the heat management module.

[0035] Compared with the prior art, the present application has the following advantages:

[0036] The heat management module claimed in the present application directly installs the liquid reservoir, the first electronic expansion valve, the second electronic expansion valve and the heat exchanger on the manifold, so that the heat management module has high integration, and the use of the mounting bracket is avoided, which not only simplifies the assembly process of the heat management module, but also reduces the overall size of the heat management module, so as to facilitate the subsequent assembly in the automobile heat management system; at the same time, the number of connection points in the heat management module is also reduced, so that the leakage risk of the refrigerant passing through the heat management module is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the technical solutions in the prior art, the accompanying drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description only only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of these drawings.

[0038] Figure 1 Structure diagram of the heat management module provided by an embodiment of the present application;

[0039] Figure 2 Exploded view of the heat management module provided by an embodiment of the present application;

[0040] Figure 3 Structure diagram of the manifold in the present application;

[0041] Figure 4 Structure diagram of the manifold body in the present application;

[0042] Figure 5 Structure diagram of the manifold body in the present application from another perspective;

[0043] Figure 6 Structure diagram of the sealing cover plate in the present application.

[0044] Reference signs: 10, manifold; 11, manifold body; 111, first flow channel; 1111, first sub-flow channel; 1112, second sub-flow channel; 112, second flow channel; 1121, bent flow channel; 113, flow channel wall; 114, first liquid inlet passage; 1141, first liquid inlet; 1142, first one-way valve; 1143, first temperature sensor; 115, second liquid inlet passage; 1151, second liquid inlet; 1152, first refrigerant valve; 1153, second temperature sensor; 116, liquid outlet passage; 1161, first liquid outlet; 1170, third liquid inlet; 1171, third liquid inlet passage A; 1172, third liquid inlet passage B; 1173, second one-way valve; 1174, third temperature sensor; 118, fourth liquid inlet passage; 1181, fourth liquid inlet; 1182, fourth liquid outlet A; 1183, fourth liquid outlet B; 1184, second refrigerant valve; 12, sealing cover plate; 121, sealing surface; 122, second liquid outlet; 13, temperature and pressure sensor; 20, liquid accumulator; 21, first inlet; 22, second inlet; 23, outlet; 30, first electronic expansion valve; 40, second electronic expansion valve; 50, heat exchanger; 51, flow valve. DETAILED DESCRIPTION

[0045] In order to make the above objectives, features and advantages of the present application more clear and comprehensible, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a variety of ways beyond the specific embodiments described herein without departing from the scope of the present application, and it is understood that similar changes in form and substitution of equivalent ones can be made by those skilled in the art without departing from the spirit and scope of the present application. Therefore, the present application is not limited to the specific working examples disclosed below.

[0046] In the description of the present application, the terms "first", "second", "third" and the like are used only for the purpose of description, and are not to be construed as indicating or implying relative importance or implying the number of the technical features indicated. Therefore, the features defined with "first", "second" and "third" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0047] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, or internal communication of two elements or interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0048] In the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can be direct contact between the first and second features, or indirect contact between the first and second features through intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0049] It should be noted that when an element is referred to as "fixed to" or "provided on" another element, it can be directly on the other element or there can be a middle element. When an element is referred to as "connected to" another element, it can be directly connected to the other element or there can be a middle element. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are for illustrative purposes only and are not the only implementation.

[0050] The thermal management module claimed in the present application is applied to the automobile thermal management system.

[0051] As Figure 1 , Figure 2 shown, the heat management module provided by an embodiment of the present application includes a manifold 10, a liquid accumulator 20, a first electronic expansion valve 30, a second electronic expansion valve 40, and a heat exchanger 50. The liquid accumulator 20, the first electronic expansion valve 30, the second electronic expansion valve 40, and the heat exchanger 50 are all mounted on the manifold 10. The manifold 10 has a first flow channel 111 and a second flow channel 112 formed inwardly. The first flow channel 111 and the second flow channel 112 are independently arranged. The liquid accumulator 20 is in communication with the second flow channel 112 and is used to introduce refrigerant into the second flow channel 112. The first electronic expansion valve 30 and the second electronic expansion valve 40 are arranged in parallel and are in communication with the first flow channel 111, so that the refrigerant in the first flow channel 111 can be discharged through the first electronic expansion valve 30 or the second electronic expansion valve 40. The heat exchanger 50 is connected to and in communication with the first electronic expansion valve 30 and is used to exchange heat with the refrigerant discharged from the first electronic expansion valve 30. It should be noted that the refrigerant in the first flow channel 111 and the second flow channel 112 is refrigerant in different states. Specifically, the refrigerant in the first flow channel 111 is high-temperature and high-pressure refrigerant discharged from a compressor, and the refrigerant in the second flow channel 112 is low-temperature and low-pressure refrigerant obtained after being separated by the liquid accumulator 20.

[0052] It can be understood that the heat management module directly mounts the liquid accumulator 20, the first electronic expansion valve 30, the second electronic expansion valve 40, and the heat exchanger 50 on the manifold 10, so that the heat management module has high overall integration and avoids the use of mounting brackets. This not only simplifies the assembly process of the heat management module, but also reduces the overall volume of the heat management module obtained ultimately, so as to facilitate subsequent assembly in an automobile heat management system. At the same time, the number of connection points in the heat management module is also reduced, so as to reduce the risk of refrigerant leakage when the refrigerant passes through the heat management module.

[0053] As Figure 3 , Figure 4As shown, in an embodiment, the manifold 10 comprises a manifold body 11 and a sealing cover plate 12, the sealing cover plate 12 is mounted on the manifold body 11 and encloses the manifold body 11 and is formed with a first flow channel 111 and a second flow channel 112; wherein the first flow channel 111 comprises a first sub-flow channel 1111 and a second sub-flow channel 1112, the first sub-flow channel 1111 and the second sub-flow channel 1112 are arranged in parallel, the first sub-flow channel 1111 and the second sub-flow channel 1112 are arranged at the periphery of the second flow channel 112 and surround the second flow channel 112, and the refrigerant in the first sub-flow channel 1111 and the refrigerant in the second sub-flow channel 1112 can exchange heat with the refrigerant in the second flow channel 112. That is, the manifold 10 integrates a heat exchanger, and by using the first sub-flow channel 1111 and the second sub-flow channel 1112 on the first flow channel 111 to surround the second flow channel 112, when the manifold 10 conducts the refrigerant, the refrigerant can realize sufficient heat exchange with the refrigerant in the second flow channel 112 when passing through the first sub-flow channel 1111 and the second sub-flow channel 1112, and the heat exchange efficiency between the two is improved, so that the manifold 10 integrates the heat exchange function of the heat exchanger, which not only can reduce the production cost, but also can reduce the volume of the overall structure of the manifold 10, so as to facilitate the subsequent assembly and application of the manifold 10 in the thermal management module.

[0054] It should be noted that the first flow channel 111 and the second flow channel 112 on the manifold 10 are specifically arranged on the manifold body 11, and the sealing cover plate 12 is mounted on the manifold body 11 and can be assembled and sealed with the manifold body 11 to form the first flow channel 111 and the second flow channel 112 into two independent refrigerant channels. Of course, for those skilled in the art, the first flow channel 111 and the second flow channel 112 on the manifold 10 can also be formed by the manifold body 11 and the sealing cover plate 12 cooperating together.

[0055] It should be explained that since the manifold 10 is assembled by the manifold body 11 and the sealing cover plate 12, the manifold 10 only needs to be prepared by using one processing method during the production and preparation process, and then the sealing cover plate 12 is welded to the manifold body 11. Compared with the existing manifold and heat exchanger, which need to be prepared by using respective processing methods respectively and then assembled together, the overall production cost of the manifold 10 is lower. Moreover, the refrigerant can directly exchange heat on the manifold body 11, avoiding the external assembly of the heat exchanger on the manifold, which reduces the overall volume and facilitates the subsequent assembly of the manifold 10 in the thermal management module.

[0056] As shown in FIG. 1, Figure 4 , Figure 5As shown, the flow channel wall 113 is arranged on the second flow channel 112, and the first branch flow channel 1111 and the second branch flow channel 1112 are isolated from the second flow channel 112 by the flow channel wall 113. The refrigerant in the first branch flow channel 1111 and the refrigerant in the second branch flow channel 1112 can exchange heat with the refrigerant in the second flow channel 112 through the flow channel wall 113, so that the refrigerant can directly exchange heat through the flow channel wall 113 when conducting, which simplifies the structure, facilitates the heat exchange between the refrigerants, and improves the heat exchange efficiency when the refrigerants exchange heat.

[0057] It should be noted that the manifold body 11 can be integrally formed by a metal piece, which can be prepared by forging or casting. The manifold body 11 itself has a heat conduction function, and the refrigerant in the first branch flow channel 1111 and the second branch flow channel 1112 can exchange heat with the refrigerant in the second flow channel 112 through the flow channel wall 113.

[0058] In an embodiment, fins are arranged in the first branch flow channel 1111, the second branch flow channel 1112, and / or the second flow channel 112 (not shown in the figure). The fins are lapped with the flow channel wall 113, so that the manifold 10 can use the fins to conduct heat when the refrigerant is conducting, thereby further improving the heat exchange efficiency when the refrigerant in the first branch flow channel 1111 and the second branch flow channel 1112 exchanges heat with the refrigerant in the second flow channel 112. It should be noted that the specific structure of the fins and how to arrange them in the first branch flow channel 1111, the second branch flow channel 1112, and / or the second flow channel 112 can be arranged according to the specific requirements, which will not be described here.

[0059] As shown in Figure 4 , Figure 5 In an embodiment, the second flow channel 112 includes a plurality of bent flow channels 1121 arranged in sequence along the length direction of the manifold body 11, and the plurality of bent flow channels 1121 are connected at the head and tail to form a wave shape, which can prolong the path of the second flow channel 112, thereby increasing the residence time of the refrigerant in the second flow channel 112 when passing through the second flow channel 112, and increasing the heat exchange area when the refrigerant in the second flow channel 112 exchanges heat with the refrigerant in the first branch flow channel 1111 and the second branch flow channel 1112, thereby further improving the heat exchange efficiency when the refrigerant in the first flow channel 111 and the second flow channel 112 exchanges heat. Of course, for those skilled in the art, the second flow channel 112 is not limited to the shape shown in the figure. For those skilled in the art, the second flow channel 112 can be arranged in a straight strip shape or other irregular shapes, which will not be described here.

[0060] The bending angle of the bending flow channel 1121 is 90°, which can increase the area of each bending flow channel 1121 on the manifold body 11, further prolong the length of the second flow channel 112 on the manifold body 11, and improve the heat exchange efficiency of the manifold 10 during operation.

[0061] In addition, it should be noted that the flow channel diameter of the first branch flow channel 1111 and the flow channel diameter of the second branch flow channel 1112 are both smaller than the flow channel diameter of the second flow channel 112. In this way, when the refrigerant in the second flow channel 112 is in a low-temperature and low-pressure state, the manifold 10 applied in the thermal management module can function as an intermediate heat exchanger, and the suction temperature of the compressor (not shown in the figure) connected and communicated with the thermal management module can be improved, thereby avoiding the formation of “liquid strike” due to the suction of wet steam, which can damage the compressor.

[0062] As shown in Figure 6 , the sealing cover plate 12 is formed with a sealing surface 121, which is attached to and connected with the manifold body 11 to install the sealing cover plate 12 on the manifold body 11. In this way, the assembly connection between the sealing cover plate 12 and the manifold body 11 is achieved, which simplifies the structure and facilitates the installation of the sealing cover plate 12 on the manifold body 11. It should be noted that the sealing cover plate 12 and the manifold body 11 can be connected and fixed by welding, bonding, or other fasteners. Of course, the sealing cover plate 12 can be provided as a whole plate covering the manifold body 11, or the sealing cover plate 12 can be provided as multiple plates covering the manifold body 11 according to the specific use requirements. Here, it is not expanded.

[0063] As shown in Figure 1 , the liquid reservoir 20 is arranged on one end surface of the manifold 10 and connected and communicated with the manifold 10, which achieves the assembly connection of the liquid reservoir 20 on the manifold 10. The liquid reservoir 20 can be fixed to the manifold 10 by welding.

[0064] As shown in Figure 2 , the liquid reservoir 20 is arranged on one end surface of the manifold 10 and connected and communicated with the manifold 10, which achieves the assembly connection of the liquid reservoir 20 on the manifold 10. The liquid reservoir 20 can be fixed to the manifold 10 by welding.

[0065] As shown in Figure 2 , Figure 5As shown, the manifold 10 is further formed with a first liquid inlet channel 114, the manifold 10 can communicate with the first inlet 21 through the first liquid inlet channel 114, and a first liquid inlet 1141 of the first liquid inlet channel 114 is arranged on a side of the manifold 10 for mounting the heat exchanger 50; in this way, the external refrigerant pipeline can be communicated with the first liquid inlet channel 114 of the manifold 10, so as to guide the refrigerant into the reservoir 20 through the first liquid inlet channel 114, and achieve the effect of distributing the refrigerant.

[0066] Among them, the first liquid inlet channel 114 is installed with a first one-way valve 1142 and a first temperature sensor 1143, the first one-way valve 1142 is used to control the one-way conduction of the first liquid inlet channel 114, and the first temperature sensor 1143 is used to detect the temperature of the refrigerant in the first liquid inlet channel 114; in this way, by using the structural characteristics of the first one-way valve 1142 and the first temperature sensor 1143, the backflow of the refrigerant in the first liquid inlet channel 114 can be prevented, and the temperature of the refrigerant conducted in the first liquid inlet channel 114 can be monitored. It should be noted that the above-mentioned first one-way valve 1142 and first temperature sensor 1143 can adopt the conventional structure on the market at present, which will not be described here.

[0067] As shown in Figure 2 , Figure 5 As shown, the manifold 10 is further formed with a second liquid inlet channel 115, the manifold 10 can communicate with the second inlet 22 through the second liquid inlet channel 115, and a second liquid inlet 1151 of the second liquid inlet channel 115 is arranged on an end face of the manifold 10 away from the reservoir 20; in this way, the external refrigerant pipeline can be communicated with the second liquid inlet channel 115 of the manifold 10, so as to guide the refrigerant into the reservoir 20 through the second liquid inlet channel 115, and achieve the effect of distributing the refrigerant.

[0068] Among them, the second liquid inlet channel 115 is installed with a first refrigerant valve 1152 and a second temperature sensor 1153, the first refrigerant valve 1152 is used to control the opening / closing of the second liquid inlet channel 115, and the second temperature sensor 1153 is used to detect the temperature of the refrigerant in the second liquid inlet channel 115; by using the structural characteristics of the first refrigerant valve 1152 and the second temperature sensor 1153, the flow control of the second liquid inlet channel 115 is realized, and the temperature monitoring of the refrigerant conducted in the second liquid inlet channel 115 is achieved.

[0069] In an embodiment, the first electronic expansion valve 30 and the second electronic expansion valve 40 are arranged on both sides of a side face of the manifold 10, and the first electronic expansion valve 30 is arranged adjacent to the heat exchanger 50; in this way, the positions of the first electronic expansion valve 30 and the second electronic expansion valve 40 on the manifold 10 are realized, and the connection and communication between the first electronic expansion valve 30 and the heat exchanger 50 are facilitated.

[0070] AsFigure 5 As shown in the figure, the manifold 10 is further formed with a liquid outlet channel 116, a first liquid outlet 1161 of the liquid outlet channel 116 is arranged on the side of the manifold 10 for mounting the heat exchanger 50 and is in communication with the first flow channel 111, so that the refrigerant in the first flow channel 111 can also be discharged outside through the liquid outlet channel 116. When the heat management module is working, the refrigerant in the first flow channel 111 can be discharged outside through the liquid outlet channel 116 and the first electronic expansion valve 30 at the same time, so as to meet the use demand of refrigeration when the heat management module is working.

[0071] As shown in the figure, Figure 2 , Figure 5 As shown in the figure, the manifold 10 is further formed with two third liquid inlet channels, the two third liquid inlet channels are arranged independently, and two third liquid inlets 1170 of the two third liquid inlet channels are arranged on two opposite sides of the manifold 10 and are in communication with the first flow channel 111 respectively, so as to selectively introduce refrigerant into the first flow channel 111. In this way, the external refrigerant pipeline can be communicated with the two third liquid inlet channels on the manifold 10, and refrigerant can be selectively introduced into the first flow channel 111 through the two third liquid inlet channels, so as to meet the use demand of refrigeration or heating when the heat management module is working.

[0072] Among them, the second one-way valve 1173 is arranged in each of the two third liquid inlet channels for controlling the one-way conduction of the corresponding third liquid inlet channel. In this way, by using the structural characteristics of the second one-way valve 1173, the backflow of refrigerant in the corresponding third liquid inlet channel can be prevented. It should be noted that the structure and working principle of the above-mentioned second one-way valve 1173 can be the same as that of the first one-way valve 1142, which will not be described here.

[0073] It should be noted that the manifold 10 is further connected with a temperature and pressure sensor 13, the temperature and pressure sensor 13 is arranged on one end of the manifold 10 for mounting the liquid reservoir 20 and extends into the first flow channel 111, so as to detect the temperature and pressure of the refrigerant introduced into the first flow channel 111 by the two third liquid inlet channels by the temperature and pressure sensor 13.

[0074] As shown in the figure, Figure 5 As shown in the figure, the two third liquid inlet channels are set as a third liquid inlet channel A 1171 and a third liquid inlet channel B 1172, the third liquid inlet channel A 1171 is arranged in the area where the first electronic expansion valve 30 is located, and the third liquid inlet channel B 1172 is arranged in the area where the second electronic expansion valve 40 is located, so as to reduce the volume of the whole manifold 10.

[0075] The third temperature sensor 1174 is installed in the third liquid inlet channel B1172 and can detect the temperature of the refrigerant in the third liquid inlet channel B1172. The third temperature sensor 1174 can monitor the temperature of the refrigerant in the third liquid inlet channel B1172.

[0076] As shown in Figure 2 , Figure 5 The manifold 10 further has a fourth liquid inlet channel 118. The fourth liquid inlet channel 118 has a fourth liquid inlet 1181, a fourth liquid outlet A1182 and a fourth liquid outlet B1183. The fourth liquid inlet 1181 and the fourth liquid outlet A1182 are arranged on the end face of the manifold 10 away from the reservoir 20. Specifically, the fourth liquid inlet 1181 and the fourth liquid outlet A1182 are arranged on the sealing cover plate 12 of the manifold 10. The fourth liquid outlet B1183 is arranged on the side face of the manifold 10 for mounting the heat exchanger 50.

[0077] The fourth liquid inlet channel 118 further has a second refrigerant valve 1184 for controlling the communication between the fourth liquid outlet A1182 or the fourth liquid outlet B1183 and the fourth liquid inlet 1181. This can meet different use requirements of refrigeration or heating when the thermal management module works. It should be noted that the number of the second refrigerant valve 1184 is two. One of the second refrigerant valves 1184 is used to control the communication between the fourth liquid inlet 1181 and the fourth liquid outlet A1182, and the other is used to control the communication between the fourth liquid inlet 1181 and the fourth liquid outlet B1183.

[0078] It should be noted that the fourth liquid outlet A1182 can be arranged as the same connection port as the second liquid inlet 1151 on the second liquid inlet channel 115. When the thermal management module works, the first refrigerant valve 1152 and the second refrigerant valve 1184 can be opened or closed to achieve control. This can simplify the structure of the manifold 10.

[0079] In an embodiment, the heat exchanger 50 is connected and communicated with an antifreeze tank (not shown). The antifreeze tank can introduce antifreeze into the heat exchanger 50, so that the antifreeze exchanges heat with the refrigerant introduced into the heat exchanger 50 by the first electronic expansion valve 30. This can achieve heat exchange of the refrigerant in the heat exchanger 50. It should be noted that the specific structure of the heat exchanger 50 and how to achieve heat exchange between the refrigerant and the antifreeze when working can adopt the conventional form of the existing heat exchanger, which will not be described here.

[0080] As shown in Figure 1 , Figure 2As shown, the flow valve 51 is installed between the anti-freezing liquid tank and the heat exchanger 50, which is used to adjust the flow of the anti-freezing liquid from the anti-freezing liquid tank to the heat exchanger 50, so as to adjust the heat exchange amount of the refrigerant in the heat exchanger 50, which can ensure that the refrigerant passing through the heat exchanger 50 can be completely changed into low-temperature and low-pressure refrigerant, and meet the refrigeration use requirement when the heat management module works. It should be noted that the refrigerant can be directly introduced into the first liquid inlet channel 114 after passing through the heat exchanger 50, that is, the outlet of the refrigerant on the heat exchanger 50 is communicated with the first liquid inlet channel 114. Of course, the flow valve 51 can be a conventional flow valve used to control the flow of the anti-freezing liquid in the existing heat management system, which will not be described here.

[0081] As shown, Figure 6 It should be noted that the second liquid outlet 122 is also formed on the sealing cover plate 12 of the manifold 10, and the second liquid outlet 122 is communicated with the second flow channel 112, so that the refrigerant in the second flow channel 112 can be discharged through the second liquid outlet 122.

[0082] For example, when the heat management module is applied to the heat management system and works in refrigeration mode, the high-temperature and high-pressure refrigerant discharged by the compressor can be introduced into the fourth liquid inlet channel 118 through the fourth liquid inlet 1181, and under the control of the second refrigerant valve 1184, the high-temperature and high-pressure refrigerant introduced into the fourth liquid inlet channel 118 can flow out through the fourth liquid outlet A 1182, and after being cooled by the outdoor heat exchanger, the high-temperature and high-pressure refrigerant becomes medium-temperature and high-pressure refrigerant, and then is introduced into the manifold 10 through the third liquid inlet channel B 1172, and enters the first flow channel 111 of the manifold 10 through the second one-way valve 1173 in the third liquid inlet channel B 1172; at the same time, the refrigerant introduced by the first liquid inlet 114 can flow into the liquid reservoir 20 through the first liquid inlet channel 114 and the first inlet 21, and under the liquid distribution of the liquid reservoir 20, can be introduced into the second flow channel 112 of the manifold 10 through the outlet 23, and discharged through the second liquid outlet 122 on the sealing cover plate 12; in this process, the high-temperature and high-pressure refrigerant in the first flow channel 111 can exchange heat with the low-temperature and low-pressure refrigerant in the second flow channel 112 through the flow channel wall 113 when passing through the first branch flow channel 1111 and the second branch flow channel 1112, which can further reduce the temperature of the refrigerant after passing through the first branch flow channel 1111 and the second branch flow channel 1112, and improve the supercooling degree; then, the refrigerant in the first flow channel 111 is divided into two paths, one of which flows out of the manifold 10 through the liquid outlet channel 116, and after throttling, enters the air conditioning box evaporator to absorb heat and becomes low-temperature and low-pressure refrigerant; the other path enters the heat exchanger 50 after throttling by the first electronic expansion valve 30, and the anti-freezing liquid in the anti-freezing liquid tank is adjusted by the flow valve 51 to control the flow of the anti-freezing liquid into the heat exchanger 50, so that the refrigerant introduced into the heat exchanger 50 is changed into low-temperature and low-pressure refrigerant after heat exchange.

[0083] When the heat management module is applied to a heat management system and works to generate heat, the high-temperature and high-pressure refrigerant led out by the compressor can be introduced into the fourth liquid inlet channel 118 through the fourth liquid inlet 1181. Under the control of the second refrigerant valve 1184, the high-temperature and high-pressure refrigerant introduced into the fourth liquid inlet channel 118 can flow out through the fourth liquid outlet B 1183, be cooled by the indoor heat exchanger, and then become medium-temperature and high-pressure refrigerant, which is then introduced into the manifold 10 through the third liquid inlet channel A 1171, enters the first flow channel 111 of the manifold 10 through the second one-way valve 1173 in the third liquid inlet channel A 1171; at the same time, the first refrigerant valve 1152 controls the opening of the second liquid inlet channel 115, so that the refrigerant introduced through the second liquid inlet 1151 can be introduced into the liquid accumulator 20 through the second inlet 22 after passing through the second liquid inlet channel 115, and can be introduced into the second flow channel 112 of the manifold 10 through the outlet 23 under the distribution of the liquid accumulator 20, and then be discharged through the second liquid outlet 122 on the sealing cover plate 12; in this process, the medium-temperature and high-pressure refrigerant in the first flow channel 111 can exchange heat with the low-temperature and low-pressure refrigerant in the second flow channel 112 through the flow channel wall 113 when passing through the first and second branch flow channels 1111 and 1112, so as to further reduce the temperature of the refrigerant after passing through the first and second branch flow channels 1111 and 1112, and improve the supercooling degree; then, the refrigerant in the first flow channel 111 can flow out after throttling by the second electronic expansion valve 40, be cooled by the outdoor heat exchanger, and then become low-temperature and low-pressure refrigerant, which is then returned to the manifold 10 through the second liquid inlet 1151.

[0084] In summary, the heat management module claimed in the present application has a reasonable structure of the manifold 10, so that the manifold 10 has a heat exchange function, and in addition to being able to directly install the liquid accumulator 20 and the heat exchanger 50, the manifold 10 can also install the first electronic expansion valve 30, the second electronic expansion valve 40, the first refrigerant valve 1152, the second refrigerant valve 1184, the first temperature sensor 1143, the second temperature sensor 1153, and the third temperature sensor 1174 to control the flow direction of the refrigerant, so that the heat management module has high integration, small overall size, and low cost.

[0085] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, but as long as the combinations of the technical features do not exist, they should be considered as within the scope of the present disclosure.

[0086] The above embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of the patent. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, several modifications and improvements can be made, which are within the scope of protection of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A thermal management module, applied in an automotive thermal management system; characterized in that, The thermal management module includes a manifold (10), a reservoir (20), a first electronic expansion valve (30), a second electronic expansion valve (40), and a heat exchanger (50). The reservoir (20), the first electronic expansion valve (30), the second electronic expansion valve (40), and the heat exchanger (50) are all installed on the manifold (10). The manifold (10) has a first flow channel (111) and a second flow channel (112) formed inward. The first flow channel (111) and the second flow channel (112) are independently arranged. The liquid reservoir (20) is connected to the second flow channel (112) and is used to introduce refrigerant into the second flow channel (112). The first electronic expansion valve (30) and the second electronic expansion valve (40) are arranged in parallel and are respectively connected to the first flow channel (111) so that the refrigerant in the first flow channel (111) can be discharged through the first electronic expansion valve (30) or the second electronic expansion valve (40). The heat exchanger (50) is connected to the first electronic expansion valve (30) and is used to perform heat exchange on the refrigerant discharged from the first electronic expansion valve (30). The manifold (10) includes a manifold body (11) and a sealing cover (12). The manifold body (11) and the sealing cover (12) enclose and form the first flow channel (111) and the second flow channel (112). The first flow channel (111) includes a first branch channel (1111) and a second branch channel (1112). The first branch channel (1111) and the second branch channel (1112) are arranged in parallel. The first branch channel (1111) and the second branch channel (1112) are arranged around the second flow channel (112) and surround the second flow channel (112). The refrigerant in the first branch channel (1111) and the refrigerant in the second branch channel (1112) can exchange heat with the refrigerant in the second flow channel (112).

2. The thermal management module according to claim 1, characterized in that, The reservoir (20) is disposed on one end face of the manifold (10) and connected to and communicates with the manifold (10); The liquid reservoir (20) is provided with a first inlet (21), a second inlet (22) and an outlet (23). The first inlet (21) and the second inlet (22) are respectively connected to the manifold (10), and the outlet (23) is connected to the second flow channel (112).

3. The thermal management module according to claim 2, characterized in that, A first liquid inlet channel (114) is also formed on the manifold (10). The manifold (10) can be connected to the first inlet (21) through the first liquid inlet channel (114). The first liquid inlet (1141) of the first liquid inlet channel (114) is located on the side of the manifold (10) where the heat exchanger (50) is installed. The first liquid inlet channel (114) is equipped with a first one-way valve (1142) and a first temperature sensor (1143). The first one-way valve (1142) is used to control the one-way flow of the first liquid inlet channel (114), and the first temperature sensor (1143) is used to detect the temperature of the refrigerant in the first liquid inlet channel (114).

4. The thermal management module according to claim 2, characterized in that, A second liquid inlet channel (115) is also formed on the manifold (10). The manifold (10) can be connected to the second inlet (22) through the second liquid inlet channel (115). The second liquid inlet (1151) of the second liquid inlet channel (115) is located on one end face of the manifold (10) away from the liquid reservoir (20). The second liquid inlet channel (115) is equipped with a first refrigerant valve (1152) and a second temperature sensor (1153). The first refrigerant valve (1152) is used to control the opening / closing of the second liquid inlet channel (115), and the second temperature sensor (1153) is used to detect the temperature of the refrigerant in the second liquid inlet channel (115).

5. The thermal management module according to claim 1, characterized in that, The first electronic expansion valve (30) and the second electronic expansion valve (40) are disposed on both sides of one side of the manifold (10), with the first electronic expansion valve (30) disposed adjacent to the heat exchanger (50); The manifold (10) also has a liquid outlet channel (116). The first liquid outlet (1161) of the liquid outlet channel (116) is located on the side of the manifold (10) where the heat exchanger (50) is installed and is connected to the first flow channel (111) so that the refrigerant in the first flow channel (111) can also be discharged through the liquid outlet channel (116).

6. The thermal management module according to claim 1, characterized in that, Two third liquid inlet channels are also formed on the manifold (10). The two third liquid inlet channels are set independently to each other. The two third liquid inlets (1170) of the two third liquid inlet channels are set on the two opposite sides of the manifold (10) and are respectively connected to the first flow channel (111) so as to selectively introduce refrigerant into the first flow channel (111). Each of the two third liquid inlet channels is equipped with a second one-way valve (1173) to control the one-way flow of the corresponding third liquid inlet channel.

7. The thermal management module according to claim 6, characterized in that, The two third liquid inlet channels are designated as third liquid inlet channel A (1171) and third liquid inlet channel B (1172). The third liquid inlet channel A (1171) is located in the area where the first electronic expansion valve (30) is located, and the third liquid inlet channel B (1172) is located in the area where the second electronic expansion valve (40) is located. The third liquid inlet channel B (1172) is also equipped with a third temperature sensor (1174), which can detect the temperature of the refrigerant in the third liquid inlet channel B (1172).

8. The thermal management module according to claim 1, characterized in that, A fourth liquid inlet channel (118) is also formed on the manifold (10). The fourth liquid inlet channel (118) has a fourth liquid inlet (1181), a fourth liquid outlet A (1182) and a fourth liquid outlet B (1183). The fourth liquid inlet (1181) and the fourth liquid outlet A (1182) are both located on one end face of the manifold (10) away from the liquid reservoir (20). The fourth liquid outlet B (1183) is located on one side face of the manifold (10) for mounting the heat exchanger (50). The fourth liquid inlet channel (118) is also equipped with a second refrigerant valve (1184), which is used to control the connection between the fourth liquid outlet A (1182) or the fourth liquid outlet B (1183) and the fourth liquid inlet (1181).

9. The thermal management module according to claim 1, characterized in that, The heat exchanger (50) is connected to and communicates with an antifreeze tank, which can introduce antifreeze into the heat exchanger (50) so that the antifreeze and the refrigerant introduced into the heat exchanger (50) by the first electronic expansion valve (30) can exchange heat in the heat exchanger (50). A flow valve (51) is installed in the passage between the antifreeze tank and the heat exchanger (50) to regulate the flow rate of antifreeze discharged from the antifreeze tank to the heat exchanger (50).

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