Heterojunction PVD substrate cooling method

Abstract

The present application relates to the technical field of coating equipment, and in particular to a method for cooling a heterojunction PVD carrier plate. The method comprises the following steps: preparing a gas supply; installing a gas supply device on a carrier plate discharge chamber to deliver cooling gas into the carrier plate discharge chamber; detecting the carrier plate temperature; detecting the temperature of the carrier plate outputted from the carrier plate discharge chamber; forming a detection group with each of N consecutive carrier plates; setting M predetermined temperature intervals for the temperature detection results of the detection group, and adjusting the flow rate of the cooling gas according to different predetermined temperature intervals until the temperature of the detection group is no higher than the target temperature; and both N and M are positive integers. The heterojunction PVD carrier plate cooling method provided in the present application can effectively cool the carrier plate and the battery cells carried by the carrier plate, achieve rapid cooling, avoid excessively high output carrier plate temperatures that could easily burn workers, and shorten the cooling time of the carrier plate and battery cells.

Description

Technical Field

[0001] The present application relates to the technical field of coating equipment, and in particular to a cooling method for a heterojunction PVD carrier plate. Background Art

[0002] At present, vacuum coating technology, as a technology for producing specific film layers, is widely used in real production and life.

[0003] With the demand for increased heterojunction PVD (Physical Vapor Deposition) coating output, the temperature of the substrate is relatively high when it leaves the equipment cavity. The built-in water cooling device in the cavity cannot meet the cooling requirements, resulting in excessively high discharge temperatures. The high discharge temperature not only poses a risk of scalding to workers, but also requires a longer natural cooling time, resulting in the inability to increase PVD coating production capacity, affecting processing efficiency and output. Summary of the Invention

[0004] The purpose of this application is to provide a heterojunction PVD carrier cooling method to solve, to a certain extent, the technical problem in the prior art that the temperature of the existing coating equipment is high when the carrier is discharged, which not only easily burns the staff but also affects the equipment production capacity.

[0005] The present application provides a heterojunction PVD carrier cooling method, comprising the following steps:

[0006] Gas supply preparation: installing gas supply equipment on the carrier plate discharge cavity to deliver cooling gas into the carrier plate discharge cavity;

[0007] Detecting the temperature of the carrier plate; detecting the temperature of the carrier plate output through the carrier plate discharge cavity; each N consecutive carrier plates constitute a detection group;

[0008] M predetermined temperature intervals are set for the temperature detection results of the detection group, and the flow rate of the cooling gas is adjusted accordingly according to different predetermined temperature intervals until the temperature of the detection group is no higher than the target temperature; N and M are both positive integers.

[0009] In the above technical solution, further, the predetermined temperature range includes at least:

[0010] A first predetermined temperature range T1, T1 ≥ 80°C, at which the cooling gas supply flow rate is not less than 800 sccm;

[0011] The second predetermined temperature range T2 is 60°C≤T2<80°C, and the supply flow rate of the cooling gas is not less than 600 sccm;

[0012] The third predetermined temperature range T3 is 40°C≤T3<60°C, and the supply flow rate of the cooling gas is not less than 400 sccm;

[0013] In the fourth predetermined temperature range T4, 30° C. ≤ T4 < 40° C., the supply flow rate of the cooling gas is not less than 200 sccm.

[0014] In any of the above technical solutions, further, the carrier plate discharging chamber selects the detection group once every time H carrier plates are continuously output; H is a natural number.

[0015] In any of the above technical solutions, further, the carrier plate discharge cavity has multiple side walls, and multiple air inlets are set on at least one of the multiple side walls, and the air supply equipment transports the cooling gas into the carrier plate discharge cavity through the multiple air inlets.

[0016] In any of the above technical solutions, further, a water cooling device is provided inside the carrier plate discharge cavity; and a cooling liquid flows in the water cooling device.

[0017] In any of the above technical solutions, further, before the step of detecting the temperature of the carrier plate, the method further includes:

[0018] Cooling the internal environment of the carrier plate discharge cavity; starting the water cooling device to make the internal temperature of the carrier plate discharge cavity at a first temperature;

[0019] Detecting the temperature of the battery cell; the carrier carries the battery cell, and detecting the temperature of the battery cell in the carrier discharge cavity;

[0020] The temperature of the battery cell is compared with the first temperature, and the gas supply device is started when the difference is greater than or equal to a predetermined threshold.

[0021] In any of the above technical solutions, further, a mass flow meter and a control valve are provided at each of the air inlets, and the mass flow meter and the control valve are connected to the host.

[0022] In any of the above technical solutions, further, in the carrier plate discharge chamber, an upper air inlet is provided above the carrier plate, and a lower air inlet is provided below the carrier plate; the upper air inlet and the lower air inlet are respectively connected to the air supply device;

[0023] The cooling air supply flow rate of the lower air inlet is greater than the cooling air supply flow rate of the upper air inlet.

[0024] In any of the above technical solutions, further, a side wall of the carrier discharge chamber facing the air inlet is provided with an exhaust device, and after the exhaust device is started, the cooling gas flows directionally in the carrier discharge chamber and blows the carrier and the battery cell.

[0025] In any of the above technical solutions, further, a filtering device is installed on the air extraction device, and the air supply equipment is connected to the filtering device.

[0026] Compared with the prior art, the present invention has the following advantages:

[0027] The heterojunction PVD carrier cooling method provided in the present application comprises the following steps:

[0028] Gas supply preparation: Install gas supply equipment on the carrier plate discharge cavity to deliver cooling gas into the carrier plate discharge cavity;

[0029] Detect the temperature of the carrier plate; detect the temperature of the carrier plate output through the carrier plate discharge cavity; each N consecutive carrier plates constitute a detection group;

[0030] M predetermined temperature intervals are set for the temperature detection results of the detection group, and the flow rate of the cooling gas is adjusted accordingly according to different predetermined temperature intervals until the temperature of the detection group is no higher than the target temperature; N and M are both positive integers.

[0031] The heterojunction PVD carrier cooling method provided in the present application can effectively cool down the carrier and the battery cells carried by the carrier by blowing cooling gas across the carrier, thereby avoiding the output carrier temperature being too high, which may easily burn the staff. Compared with the traditional natural cooling method, it can also shorten the cooling time of the carrier and battery cells, and accelerate subsequent material unloading, storage and other process flows, which not only helps to improve the process quality of the product, but also speeds up production efficiency and process progress.

[0032] It should be noted that in this embodiment, the contact area between the cooling gas and the carrier is sufficiently large, effectively improving cooling efficiency and achieving rapid cooling. As the gas flow rate increases, the carrier cooling rate correspondingly increases, resulting in a lower carrier temperature after discharge within the same timeframe. Furthermore, the gas supply volume of the gas supply device can be dynamically adjusted based on the carrier temperature being discharged. This allows for a reasonable allocation of gas supply and consumption while ensuring effective cooling, helping to reduce gas costs and the overall operating costs of the coating equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the specific implementation methods or the description of the prior art. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0034] Figure 1 A schematic diagram of a heterojunction PVD carrier cooling method provided in an embodiment of the present application;

[0035] Figure 2 A schematic diagram of the structure of a carrier discharge chamber of a heterojunction PVD carrier cooling method provided in an embodiment of the present application;

[0036] Figure 3 The relationship between temperature and time during the execution of the heterojunction PVD carrier cooling method provided in the embodiment of the present application.

[0037] Reference numerals:

[0038] 1-carrier plate discharge cavity, 101-first wall plate, 102-second wall plate, 103-cover plate, 2-carrier plate, 3-air inlet, 4-water cooling device, 5-exhaust device. DETAILED DESCRIPTION

[0039] The technical solution of the present application will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0040] The components of the embodiments of the present application generally described and shown in the drawings herein may be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of the present application.

[0041] Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative work shall fall within the scope of protection of this application.

[0042] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0043] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0044] Refer to the following Figures 1 to 3 A heterojunction PVD carrier cooling method according to an embodiment of the present application is described.

[0045] See also Figures 1 to 3 As shown, an embodiment of the present application provides a heterojunction PVD carrier cooling method, which specifically includes the following steps:

[0046] S100 , gas supply preparation; installing a gas supply device (not shown in the figure) on the carrier discharge cavity 1 to deliver cooling gas into the carrier discharge cavity 1 .

[0047] Specifically, the carrier discharge chamber 1 has a box structure, and a gas supply device is installed on one side wall of the carrier discharge chamber 1. The gas supply device delivers cooling gas into the carrier discharge chamber 1. The cooling gas blows over the carrier 2 and the battery cells supported by the carrier 2, thereby cooling the carrier 2 and preventing it from overheating after leaving the carrier discharge chamber 1, which could easily burn workers. Natural cooling takes a long time, affecting the progress of subsequent processing processes such as material unloading, and affecting the production rate of the equipment. Preferably, the cooling gas is nitrogen, which can meet the requirements of purging and cooling while also avoiding reactions with the battery cells.

[0048] Furthermore, two of the wall panels of the carrier discharge chamber 1 are respectively a first wall panel 101 and a second wall panel 102. Of the first wall panel 101 and the second wall panel 102, at least the first wall panel 101 is provided with a plurality of air inlets 3. Preferably, the plurality of air inlets 3 are sequentially spaced apart along the width direction of the first wall panel 101. The plurality of air inlets 3 can simultaneously deliver cooling gas into the carrier discharge chamber 1. More preferably, the air inlets 3 are located at a height slightly higher than the upper surface of the carrier 2, so that the gas delivered into the carrier discharge chamber 1 through the air inlets 3 can blow over the carrier 2 and the battery cells on the carrier 2, thereby cooling the carrier 2 and the battery cells.

[0049] S200, detecting the temperature of the carrier plate 2; detecting the temperature of the carrier plate 2 outputted from the carrier plate discharge cavity 1; each N consecutive carrier plates 2 constitute a detection group.

[0050] Preferably, the first wall panel 101 and the second wall panel 102 are arranged facing each other and parallel to each other. A carrier inlet is defined on the first wall panel 101, and a carrier outlet is defined on the second wall panel 102 directly opposite the carrier inlet. The carrier 2 enters the carrier feed chamber 2 through the carrier inlet and then exits the carrier discharge chamber 1 through the carrier outlet. More preferably, the air inlet 3 is located above the carrier inlet, so that each carrier 2 is exposed to cooling gas upon entering the carrier discharge chamber 1. Cooling gas continues to flow through the carrier discharge chamber 1 until the carrier 2 exits through the carrier outlet, ensuring that the cooling gas sweeps a sufficient area for the carrier 2.

[0051] In addition, the carrier plate discharge chamber 1 also includes a third wall plate, a fourth wall plate, a bottom wall plate and a cover plate 103. The third wall plate and the fourth wall plate are arranged facing each other, and the first wall plate 101, the third wall plate, the second wall plate 102 and the fourth wall plate are connected end to end in sequence and arranged on the bottom wall plate. The cover plate 103 is arranged above the four wall plates.

[0052] The temperatures of N carriers 2 output through the carrier outlet are continuously detected. The temperatures of the N carriers 2 as detection targets can reflect the cooling capacity of the carrier 2 in the carrier discharge chamber 1 at that time. Each N carriers 2 output continuously is defined as a detection group. The N carriers 2 in each detection group are temperature-detected one by one in the output order. The detection results are used to set M predetermined temperature intervals. The delivery rate of cooling gas is adjusted according to the temperature range of different predetermined temperature intervals, thereby adjusting the temperature of the carriers 2 in the carrier discharge chamber 1 until the temperature of the subsequently output carriers 2 reaches the target temperature and meets expectations. In this way, the temperature in the carrier discharge chamber 1 is dynamically adjusted. It should be noted that N and M are both positive integers.

[0053] Preferably, in this embodiment, N=5, M=4, that is, when detecting the temperature of the carrier 2 output through the carrier discharge chamber 1, 5 carriers 2 are selected continuously each time, and the temperatures of the 5 carriers 2 are detected respectively. The temperatures of 5 or more carriers 2 are detected continuously. By increasing the number of samples, the current temperature in the carrier discharge chamber 1 can be more accurately reflected. It should be noted that by increasing the number of carriers 2 in a detection group for temperature detection, the accuracy of subsequent control of the cooling gas flow rate can be improved, but the number of detection samples should not be too many, which not only wastes time but also affects the overall operating efficiency and production rhythm of the coating equipment.

[0054] The four predetermined temperature intervals are respectively a first predetermined temperature interval T1, a second predetermined temperature interval T2, a third predetermined temperature interval T3, and a fourth predetermined temperature interval T4. Preferably, T1 ≥ 80°C. When the temperature of the carrier plate 2 included in the selected first detection group is detected, if the detection results all fall within the temperature range of ≥ 80°C, it means that the temperature of the carrier plate 2 output at this time is too high, and the amount of cooling gas introduced should be increased. Preferably, the supply flow rate of the cooling gas at this time is not less than 800sccm, preferably 800sccm, compared with the 600sccm and 400sccm mentioned below, the carrier plate 2 that is about to be output from the carrier plate discharge chamber 1 is fully cooled with a large flow rate and flow velocity.

[0055] When the test results of the test group fall within the range of 60°C ≤ T2 < 80°C, the cooling gas supply flow rate is not less than 600 sccm, preferably 600 sccm; when the test results of the test group fall within the range of 40°C ≤ T3 < 60°C, the cooling gas supply flow rate is not less than 400 sccm, preferably 400 sccm; when the test results of the test group fall within the range of 30°C ≤ T4 < 40°C, the cooling gas supply flow rate is not less than 200 sccm, preferably 200 sccm. According to the above settings, the temperature of the carrier plate 2 subsequently output through the carrier plate discharge chamber 1 can reach the target temperature or be lower than the target temperature. At or below the target temperature, the temperature is in line with the human body's tolerance, and workers will not be burned.

[0056] It should be noted that the selection of the detection group can have various situations:

[0057] (1) After the coating equipment is started, the first N carriers 2 output are selected as the detection group. After the temperature of the detection group is detected, the supply flow rate of the cooling gas is adjusted according to the above method. The gas is blown continuously for a period of time according to the current supply flow rate, and then the detection group is selected again to repeat the above steps.

[0058] (2) After the coating equipment is started, a detection group is selected every time H carriers 2 are continuously output. Each detection group includes N carriers 2 that are continuously output, where H is a natural number. As the cooling gas is blown into the carrier discharge chamber 1 for an extended period of time, the temperature in the carrier discharge chamber 1 and the temperature of the carriers 2 will change. By intermittently selecting the detection group and performing temperature detection, and then adjusting the supply of cooling gas, a cliff-like temperature increase or decrease in the carriers 2 can be avoided.

[0059] (3) Continuously selecting the detection group, or H=0. When the detection result of the detection group is in the range of T3 or T4, the temperature of the carrier 2 is not too high. At this time, the carrier 2 is cooled. The temperature of the carrier 2 drops faster than the temperature drop from above 80°C. Therefore, by continuously measuring the temperature of the detection group and adjusting the supply of cooling gas in real time, not only can the temperature of the carrier 2 be adjusted, but also the cooling gas can be prevented from being supplied at a high flow rate for a long time, which helps to save the consumption of cooling gas and thus save the overall operating cost of the coating equipment.

[0060] Furthermore, N temperature detection devices are provided at the carrier outlet, each detecting the temperature of a corresponding carrier 2 output from the carrier discharge chamber 1. Preferably, each temperature detection device is connected to a main unit of the coating apparatus, which is equipped with a control system, such as a conventional PLC. The temperature detection devices transmit the detection results to the main unit in real time, which then automatically controls the cooling gas supply to each air inlet 3. The temperature detection devices may be, but are not limited to, temperature sensors, and the control process is highly timely and accurate.

[0061] Furthermore, each air inlet 3 is provided with a mass flow meter and a control valve, and the control valve can be a solenoid valve. Preferably, the mass flow meter and the control valve are respectively connected to the host, and the host controls and adjusts the opening of the control valve to adjust the supply amount of the cooling gas. The mass flow meter can display the intake flow of the air inlet 3 in real time and can transmit the result to the host.

[0062] Furthermore, a water cooling device 4 is provided on the inner wall of the carrier plate discharge chamber 1. The water cooling device 4 can cool the internal environment of the carrier plate discharge chamber 1. By combining water cooling and air cooling, the internal environment of the carrier plate discharge chamber 1 and the carrier plate 2 are cooled, further enhancing the cooling efficiency. Preferably, the inner wall surface of the bottom wall of the carrier plate discharge chamber 1 and the inner wall surface of the cover plate 103 are both provided with the water cooling device 4.

[0063] The water cooling device 4 includes a water cooling pipe with multiple bends. Cooling liquid circulates in the water cooling pipe and removes heat from the carrier plate discharge cavity 1 through heat exchange with the internal environment of the carrier plate discharge cavity 1, thereby achieving the purpose of cooling.

[0064] Preferably, when cooling the carrier plate 2 and the carrier plate discharge cavity 1 , the water cooling device 4 and the air supply device operate simultaneously to ensure cooling effect and efficiency.

[0065] Furthermore, the cover plate 103 of the carrier plate discharge chamber 1 is provided with an upper air inlet, and the bottom wall plate of the carrier plate discharge chamber 1 is provided with a lower air inlet. The upper air inlet and the lower air inlet are also connected to the air supply equipment, and can also blow cooling gas into the carrier plate discharge chamber 1 to further improve the cooling efficiency of the carrier plate 2 and the battery cells on the carrier plate 2.

[0066] The upper air inlet blows cooling gas to the carrier plate 2 and the battery cells from top to bottom, and the lower air inlet blows cooling gas to the carrier plate 2 from bottom to top. Preferably, the flow rate and flow rate of the cooling gas of the lower air inlet are greater than the flow rate and flow rate of the cooling gas of the upper air inlet. On the upper surface of the carrier plate 2, not only the upper air inlet delivers cooling gas, but the gas entering the carrier plate discharge chamber 1 through the air inlet 3 also blows the carrier plate 2 and the battery cells on the upper surface of the carrier plate 2. Therefore, by increasing the air inlet flow rate and flow rate of the lower air inlet, not only the upper and lower surfaces of the carrier plate 2 can be effectively cooled, thereby improving the cooling effect of the carrier plate 2, but also heat sinking can be avoided, resulting in excessive temperature difference between the upper and lower surfaces of the carrier plate 2.

[0067] Furthermore, an exhaust device 5 is provided on the second wall panel 102, that is, the side wall panel facing the first wall panel 101. The exhaust device 5 can specifically be a molecular pump, and the number of the exhaust devices 5 is multiple. Preferably, in this embodiment, the number of the exhaust devices 5 is at least three. When the exhaust device 5 is started, under the action of the exhaust device 5, the cooling gas can flow in the carrier plate discharge cavity 1. During the flow process, the cooling gas can blow the carrier plate 2 and the battery cell, thereby achieving a cooling and temperature reduction effect. Figure 1 The direction indicated by the arrow a is the flow direction of the cooling gas. An air inlet 3 is provided on the first wall plate 101, and an exhaust device 5 is provided on the second wall plate 102 facing the first wall plate 101, so that there is a sufficient distance between the exhaust device 5 and the air inlet 3, so that the cooling gas has a sufficiently long purge distance in the carrier discharge chamber 1 under the action of the exhaust device 5, thereby further improving the cooling effect and efficiency of the carrier plate 2 and the battery cell.

[0068] Furthermore, the exhaust device 5 is connected to a filtering device. Preferably, the air inlet of the air supply device is connected to the filtering device. The gas extracted by the exhaust device 5 enters the filtering device for cooling, filtering, and purification, and then flows to the gas supply device, and is re-introduced into the carrier plate discharge cavity 1 by the gas supply device, thereby circulating to realize the circulating supply of cooling gas. When the amount of gas supplied by the filtering device is insufficient, new gas is added to effectively reduce the gas cost.

[0069] Furthermore, the heterojunction PVD carrier cooling method further includes, before step S200:

[0070] S1. Pre-cool the carrier plate discharge chamber 1; before starting the air supply equipment, start the water cooling device 4 first.

[0071] The water cooling device 4 first performs water-cooling constant temperature regulation on the internal environment of the carrier discharge chamber 1 so that the temperature inside the carrier discharge chamber 1 reaches the first temperature. That is to say, when the carrier 2 carrying the battery cells enters the carrier discharge chamber 1, the temperature inside the carrier discharge chamber 1 is at the first temperature.

[0072] S2. Detecting the cell temperature: A conveyor capable of conveying the carrier 2 is provided within the carrier discharge chamber 1. A detection component for detecting the cell temperature is provided on the conveyor. The detection component is connected to the host. The detection component may be, but is not limited to, a temperature sensor.

[0073] After the detection component detects the temperature of the battery cell, the host controller calculates and compares the temperature of the battery cell with the target temperature. The difference between the temperature of the battery cell and the target temperature can reflect whether the temperature conditions of the internal environment of the carrier discharge chamber 1 can meet the temperature regulation of the battery cell and the carrier 2. When the difference is large, even if the air intake flow rate of the cooling gas is adjusted to the maximum, it is difficult to effectively cool the carrier 2 and the battery cell in a short time.

[0074] When there is a certain difference between the detection result of the detection component and the target temperature, before the carrier 2 leaves the carrier discharge chamber 1, the air supply equipment is started to cool down the internal environment of the carrier discharge chamber 1, and the above steps are repeated. Under the joint action of the water cooling device 4 and the air supply equipment, the first temperature gradually decreases, and the temperature of the battery cell also gradually decreases until the difference between the result of the detection component and the target temperature reaches a predetermined threshold value. The conveying device is started to make the carriers 2 be output one by one through the carrier outlet, and then execute according to step S200.

[0075] It should be noted that there may be a temperature difference between the carrier board 2 that has undergone step S2 and the subsequent carrier boards 2 . Therefore, when selecting a test group, such noisy carrier boards 2 should be avoided.

[0076] In summary, the heterojunction PVD carrier cooling method provided by the present application can effectively cool down and cool the carrier 2 and the battery cells carried by the carrier 2 by blowing cooling gas across the carrier 2, thereby avoiding the output carrier 2 temperature being too high, which can easily burn the staff. Compared with the traditional natural cooling method, it can also shorten the cooling time of the carrier 2 and the battery cells, accelerate the subsequent material unloading, storage and other process flows, and not only help to improve the process quality of the product, but also speed up production efficiency and process progress. It should be noted that in this embodiment, the cooling gas has a sufficiently large contact area with the carrier 2, thereby effectively improving the cooling efficiency, thereby achieving rapid cooling. When the gas flow rate increases, the corresponding carrier 2 cooling rate increases, and the carrier 2 temperature after discharge is lower in the same time. Moreover, the gas supply of the gas supply equipment can be dynamically adjusted according to the output carrier 2 temperature. While ensuring the cooling effect, the supply and consumption of gas are reasonably allocated, which helps to save gas costs and the overall operating costs of the coating equipment.

[0077] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A method for cooling a heterojunction PVD carrier, characterized in that: The following steps are involved: Gas supply preparation: installing gas supply equipment on the carrier plate discharge cavity to deliver cooling gas into the carrier plate discharge cavity; Detecting the temperature of the carrier plate; detecting the temperature of the carrier plate output through the carrier plate discharge cavity; each N consecutive carrier plates constitute a detection group; Setting M predetermined temperature intervals for the temperature detection results of the detection group, and adjusting the flow rate of the cooling gas accordingly according to different predetermined temperature intervals until the temperature of the detection group is no higher than the target temperature; N and M are both positive integers; The predetermined temperature range includes at least: A first predetermined temperature range T1, T1 ≥ 80°C, at which the cooling gas supply flow rate is not less than 800 sccm; The second predetermined temperature range T2 is 60°C≤T2<80°C, and the supply flow rate of the cooling gas is not less than 600 sccm; The third predetermined temperature range T3 is 40°C≤T3<60°C, and the supply flow rate of the cooling gas is not less than 400 sccm; a fourth predetermined temperature range T4, 30° C. ≤ T4 < 40° C., at which the cooling gas supply flow rate is not less than 200 sccm; The detection group is selected once each time the carrier plate discharging cavity continuously outputs H carrier plates; H is a natural number.

2. The heterojunction PVD carrier cooling method according to claim 1, characterized in that: The carrier plate discharge cavity has a plurality of side walls, and a plurality of air inlets are provided on at least one of the plurality of side walls. The air supply device delivers the cooling gas into the carrier plate discharge cavity through the plurality of air inlets.

3. The heterojunction PVD carrier cooling method according to claim 2, characterized in that: A water cooling device is provided inside the carrier plate discharge cavity; a cooling liquid flows in the water cooling device.

4. The heterojunction PVD carrier cooling method according to claim 3, characterized in that: Before the step of detecting the temperature of the carrier board, the method further includes: Cooling the internal environment of the carrier plate discharge cavity; starting the water cooling device to make the internal temperature of the carrier plate discharge cavity at a first temperature; Detecting the temperature of the battery cell; the carrier carries the battery cell, and detecting the temperature of the battery cell in the carrier discharge cavity; The temperature of the battery cell is compared with the first temperature, and the gas supply device is started when the difference is greater than or equal to a predetermined threshold.

5. The heterojunction PVD carrier cooling method according to claim 2, characterized in that: A mass flow meter and a control valve are provided at each of the air inlets, and the mass flow meter and the control valve are connected to a host.

6. The heterojunction PVD carrier cooling method according to any one of claims 1 to 5, characterized in that: In the carrier plate discharge cavity, an upper air inlet is provided above the carrier plate, and a lower air inlet is provided below the carrier plate; the upper air inlet and the lower air inlet are respectively connected to the air supply equipment; The cooling air supply flow rate of the lower air inlet is greater than the cooling air supply flow rate of the upper air inlet.

7. The heterojunction PVD carrier cooling method according to claim 4, characterized in that: A side wall of the carrier discharge cavity facing the air inlet is provided with an exhaust device. After the exhaust device is started, the cooling gas flows directionally in the carrier discharge cavity and blows the carrier and the battery cell.

8. The heterojunction PVD carrier cooling method according to claim 7, characterized in that: A filtering device is added to the air extraction device, and the air supply equipment is connected to the filtering device.

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