Power module and power device

Abstract

A power module and a power device are disclosed. The power device includes a screw, a heat dissipation element and the power module. The power module includes a substrate, a package and two fixing structures. Each fixing structure includes a first through hole, two arc-shaped second through holes, a ring structure and two sinking structures. The ring structure is between the first through hole and the two second through holes. The two sinking structures are connected with the ring structure. When the two screws pass through the two first through holes to fix the power module on the heat dissipation element, each sinking structure is bent towards the heat dissipation element, and each ring structure is fixed on a flat surface of the heat dissipation element by the screw. Through the design of the two fixing structures, the heat dissipation surface of the substrate can be flatly attached to the flat surface of the heat dissipation element, so that the heat generated by the operation of the power module can be effectively transmitted outward through the heat dissipation element.

Description

Technical Field

[0001] The present invention relates to a power module and a power device, and in particular to a power module and a power device suitable for high-power applications. Background Art

[0002] Existing high-power power modules generate a large amount of heat during operation. Therefore, a heat sink must be connected to one side of the power module to allow the heat generated during operation to be transferred outward through the heat sink. Generally, such power modules are secured to the heat sink with screws. In practice, power modules secured to the heat sink with screws often fail to effectively transfer the heat generated during operation through the heat sink due to various factors (e.g., the screws fail to effectively secure the power module to the heat sink). Summary of the Invention

[0003] The present invention discloses a power module and a power device, which are mainly used to improve the existing common power module. When the power module is screwed to the relevant heat dissipation element, the heat dissipation surface of the power module cannot be effectively flattened with the surface of the heat dissipation element. As a result, the large amount of heat energy generated by the power module during operation cannot be effectively discharged to the outside through the heat dissipation element.

[0004] One embodiment of the present invention discloses a power module, which includes a substrate, one side of which is provided with at least one electronic component, and the other side of the substrate is a heat dissipation surface; a package body, which covers the side of the substrate provided with the electronic component, and the heat dissipation surface is exposed to the package body; a plurality of pins, one end of each pin is fixed to the substrate, and the other end of each pin passes through the package body; two fixing structures, which are provided at opposite ends of the package body; each fixing structure includes: a first through-hole, which passes through the fixing structure; at least two second through-holes, each of which passes through the fixing structure, and the at least two second through-holes are located with the first through-hole as the center. On both sides of the first through-hole, at least two second through-holes are arranged facing each other; each second through-hole is arc-shaped; an annular structure is located between the at least two second through-holes and the first through-hole; two sunken structures are located on both sides of the annular structure, each sunken structure is connected to the annular structure, and a sunken structure is formed between one end of each second through-hole and one end of another second through-hole; wherein, when the power module is fixed to a heat dissipation element by two screws, a stud of each screw will pass through the first through-hole, and a head of each screw will press against the corresponding annular structure, and make the annular structure flat against a flat surface of the heat dissipation element.

[0005] Preferably, each first through-hole is a circular hole, the centers of each first through-hole are located on the same axis, and each sinking structure is located on the axis.

[0006] Preferably, the two sinking structures of each fixed structure are respectively defined as an inner sinking structure and an outer sinking structure, the inner sinking structure is arranged close to the packaging body, and the outer sinking structure is arranged away from the packaging body. Each fixed structure also includes an auxiliary perforation, which passes through the fixed structure. The auxiliary perforation is located between the inner sinking structure and the packaging body. The aperture of the auxiliary perforation is smaller than the aperture of the first perforation, and the center of each auxiliary perforation is located on the axis.

[0007] Preferably, each fixing structure includes four second through-holes, two of which are arranged on one side of the first through-hole, and the other two second through-holes are arranged on the other side of the first through-hole, and a weakening structure is formed between the two second through-holes located on the same side; when the power module is fixed to the heat dissipation element by two screws, each weakening structure can be broken by being squeezed by the screws.

[0008] Preferably, the power module further includes a frame, which is located around the package body and is integrally formed with the two fixing structures.

[0009] Preferably, each fixing structure includes an inner fixing portion, the packaging body is fixed to the two fixing structures by injection molding, and each inner fixing portion is covered by the packaging body.

[0010] Preferably, the two first perforations are located on an axis, each sinking structure is not located on the axis, and the two sinking structures of each fixed structure are located on a longitudinal line, which is not parallel to the axis. Each fixed structure also includes an auxiliary perforation, which is arranged adjacent to one of the sinking structures, and the aperture of the auxiliary perforation is smaller than the aperture of the first perforation.

[0011] One embodiment of the present invention provides a power module, comprising: a substrate having at least one electronic component disposed on one side thereof and a heat dissipation surface on the other side thereof; a package covering the side of the substrate on which the electronic component is disposed, with the heat dissipation surface exposed to the package; a plurality of pins, each of which has one end fixed to the substrate and the other end extending through the package; and two fixing structures disposed at opposite ends of the package. Each fixing structure comprises: a first through-hole extending through the fixing structure; a second through-hole extending through the fixing structure, the second through-hole being arc-shaped and disposed around the first through-hole; an annular structure located between the second through-hole and the first through-hole; and a sinking structure located on one side of the annular structure, the sinking structure being located between the package and the first through-hole and connected to the annular structure. When the power module is fixed to a heat dissipation component using two screws, a stud of each screw passes through the first through-hole, and a head of each screw presses against the corresponding annular structure, causing the annular structure to lie flush against a flat surface of the heat dissipation component.

[0012] One embodiment of the present invention provides a power device comprising: a heat dissipation element; two screws; a power module comprising: a substrate having at least one electronic component disposed on one side thereof, and the other side of the substrate being a heat dissipation surface; a package body covering the side of the substrate on which the electronic component is disposed, with the heat dissipation surface exposed to the package body; a plurality of pins, one end of each pin being fixed to the substrate, and the other end of each pin passing through the package body; two fixing structures disposed at opposite ends of the package body; each fixing structure comprising: a first through-hole passing through the fixing structure; at least two second through-holes, each of which passes through the fixing structure, and the at least two second through-holes passing through the first through-holes. A through-hole is the center and is located on both sides of the first through-hole, and at least two second through-holes are arranged facing each other; each second through-hole is arc-shaped; an annular structure is located between the at least two second through-holes and the first through-hole; two sunken structures are located on both sides of the annular structure, each sunken structure is connected to the annular structure, and a sunken structure is formed between one end of each second through-hole and one end of another second through-hole; wherein, when the power module is fixed to the heat dissipation element by two screws, a stud of each screw will pass through the first through-hole, and a head of each screw will press against the corresponding annular structure, and make the annular structure flat against a flat surface of the heat dissipation element.

[0013] Preferably, each first through-hole is a circular hole, the centers of each first through-hole are located on the same axis, and each sinking structure is located on the axis.

[0014] Preferably, the two sinking structures of each fixed structure are respectively defined as an inner sinking structure and an outer sinking structure, the inner sinking structure is arranged close to the packaging body, and the outer sinking structure is arranged away from the packaging body. Each fixed structure also includes an auxiliary perforation, which passes through the fixed structure. The auxiliary perforation is located between the inner sinking structure and the packaging body. The aperture of the auxiliary perforation is smaller than the aperture of the first perforation, and the center of each auxiliary perforation is located on the axis.

[0015] Preferably, each fixing structure includes four second through-holes, two of which are arranged on one side of the first through-hole, and the other two second through-holes are arranged on the other side of the first through-hole, and a weakening structure is formed between the two second through-holes located on the same side; when the power module is fixed to the heat dissipation element by two screws, each weakening structure can be broken by being squeezed by the screws.

[0016] Preferably, the power module further includes a frame, which is located around the package body and is integrally formed with the two fixing structures.

[0017] Preferably, each fixing structure includes an inner fixing portion, the packaging body is fixed to the two fixing structures by injection molding, and each inner fixing portion is covered by the packaging body.

[0018] Preferably, the two first perforations are located on an axis, each sinking structure is not located on the axis, and the two sinking structures of each fixed structure are located on a longitudinal line, which is not parallel to the axis. Each fixed structure also includes an auxiliary perforation, which is arranged adjacent to one of the sinking structures, and the aperture of the auxiliary perforation is smaller than the aperture of the first perforation.

[0019] In summary, the power module and power device of the present invention, through the design of the first through-hole, the second through-hole, the annular structure, and the two sunken structures of each fixing structure, allow the heat dissipation surface of the power module to be flush with the flat surface of the heat dissipation element when the power module is fixed to the flat surface of the heat dissipation element using two screws. As a result, the large amount of heat energy generated by the power module during operation can be effectively transferred outward through the heat dissipation element.

[0020] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the scope of protection of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 Schematic diagram of the exploded view of the power device of the present invention.

[0022] Figure 2 It is an exploded side view of the power device of the present invention.

[0023] Figure 3 FIG. 1 is a top view of a first embodiment of a power module according to the present invention.

[0024] Figure 4 It is a cross-sectional side view of the power device of the present invention.

[0025] Figure 5 for Figure 4 A partial enlarged schematic diagram.

[0026] Figure 6 FIG. 1 is a top view of a second embodiment of a power module according to the present invention.

[0027] Figure 7 FIG. 1 is a top view of a power module according to a third embodiment of the present invention.

[0028] Figure 8 FIG. 1 is a top view of a power module according to a fourth embodiment of the present invention.

[0029] Figure 9 FIG. 1 is a top view of a fifth embodiment of a power module according to the present invention.

[0030] Figure 10 for Figure 9 Schematic cross-section along section line XX.

[0031] Figure 11 FIG. 1 is a top view of a sixth embodiment of a power module according to the present invention. DETAILED DESCRIPTION

[0032] In the following description, if it is indicated to refer to a specific figure or as shown in a specific figure, it is only used to emphasize that most of the relevant content described in the subsequent description appears in the specific figure, but it does not limit the subsequent description to only referring to the specific figure.

[0033] Please also refer to Figures 1 to 5 The power device 100 of the present invention includes a heat sink 1, two screws 2, and a power module 3. One side of the heat sink 1 has a flat surface 11 and two screw holes 12. The other side of the heat sink 1 may, for example, include multiple heat sink fins 13. The specific appearance of the heat sink 1 is not limited to that shown in the figure. The heat sink 1 is primarily used to dissipate heat generated during the operation of the power device 100. The two screw holes 12 are used to secure the two screws 2, thereby securing the power module 3 to the flat surface 11 of the heat sink 1.

[0034] It should be noted that when the power module 3 is operating, it will generate a large amount of heat energy. Therefore, whether the power module 3 is tightly connected to the heat dissipation element 1 will directly affect the operating efficiency of the power module 3. In other words, if the power module 3 is not tightly connected to the heat dissipation element 1, the large amount of heat energy generated by the power module 3 during operation will not be effectively discharged, which will directly affect the operating efficiency of the power module 3 and may even cause damage to the power module 3. The power device 100 of the present invention is designed with two fixing structures 35, etc., so that when the two screws 2 fix the power module 3 to the heat dissipation element 1, the power module 3 can be tightly contacted with the heat dissipation element 1. This allows the large amount of heat energy generated by the power module 3 during operation to be smoothly discharged outward through the heat dissipation element 1, thereby improving the operating efficiency of the power module 3.

[0035] like Figure 1 and Figure 2 As shown, the power module 3 includes a substrate 31, a plurality of pins 32, a frame 33, a package 34, and two fixing structures 35. At least one electronic component 36 is disposed on one side of the substrate 31. The other side of the substrate 31 serves as a heat dissipation surface 311, which is configured to contact the flat surface 11 of the heat dissipation element 1. The electronic component 36 can be, for example, various microprocessor units (MPUs) or metal oxide semiconductors (MOSs), and other electronic components, without limitation.

[0036] like Figure 1 and Figure 2As shown, the substrate 31 may include, for example, a ceramic substrate 312, a routing layer 313, a heat sink layer 314, and a thermal interface material layer 315. The routing layer 313 is provided on one side of the ceramic substrate 312, and the heat sink layer 314 is provided on the other side of the ceramic substrate 312. The routing layer 313 is connected to the electronic components 36, and the routing layer 313 is connected to the plurality of pins 32. The heat sink layer 314 is connected to the thermal interface layer 315 on the side opposite to the side connected to the ceramic substrate 312. The thermal interface layer 315 is exposed outside the bottom of the frame 33, and the side of the thermal interface layer 315 opposite to the side connected to the heat sink layer 314 serves as the heat dissipation surface 311. The heat dissipation layer 314 is formed, for example, from copper. However, since its surface cannot be completely smooth, a thermal interface layer 315 is added between the heat dissipation layer 314 and the flat surface 11 of the heat dissipation element 1 to achieve closer contact between the substrate 31 and the flat surface 11 of the heat dissipation element 1. The thermal interface layer 315 is formed, for example, from thermal grease. By designing the substrate 31 with a combination of various structures, the heat energy generated by the power module 3 during operation can be transferred to the heat dissipation element 1 more quickly.

[0037] Figure 3 FIG. 1 is a top view of a first embodiment of a power module of the present invention, Figures 1 to 3 As shown, the package body 34 is disposed in the frame body 33 , and the package body 34 covers one side of the substrate 31 where the electronic component 36 is disposed, while the heat dissipation surface 311 on the other side of the substrate 31 is exposed to the package body 34 .

[0038] One end of each pin 32 is fixed to the side of the substrate 31 where the electronic component 36 is mounted. The other end of each pin 32 protrudes from the package 34. The end of each pin 32 protruding from the package 34 is used to electrically connect to another circuit board. The number of pins 32 included in the power module 3 and the location of each pin 32 on the substrate 31 can be designed according to needs and are not limited here.

[0039] like Figure 3 As shown, the two fixing structures 35 and the frame 33 can be integrally formed, and both can be made of the same metal material (such as aluminum or other stress-resistant materials). The two fixing structures 35 are located on opposite sides of the frame 33, and the two fixing structures 35 are also located on opposite sides of the package body 34. Figure 2 As shown, each fixing structure 35 is not flush with the heat dissipation surface 311, but there is a height difference between each fixing structure 35 and the heat dissipation surface 311; Figure 2 and Figure 4As shown, when the fixing structure 35 is coupled to the frame 33 via screws 2, the portions of the two fixing structures 35 proximal to the package body 34 remain suspended. This allows for the material stress and angle control of the fixing structure 35 to maintain a high and stable locking effect. In practical applications, the frame 33 can be first fixed to the periphery of the substrate 31, and then liquid encapsulating adhesive can be injected into the groove formed between the frame 33 and the substrate 31. Finally, after the liquid encapsulating adhesive is cured, the package body 34 can be formed in the groove formed by the frame 33 and the substrate 31.

[0040] As described above, by forming the frame 33 and the two fixing structures 35 into an integral unit, and by injecting packaging glue into the groove formed by the frame 33 and the substrate 31 to form the packaging body 34, the overall manufacturing cost of the power module 3 can be greatly reduced. Specifically, in the existing common power module process, the packaging body is manufactured using a mold. Therefore, the manufacturing cost of the existing power module requires the cost of opening the mold. In addition, in practice, the setting positions of the multiple pins on the substrate will be adjusted according to the needs of each different product or customer. Therefore, the relevant manufacturers must open different molds according to different products. For this reason, the manufacturing cost of the power module cannot be reduced. On the other hand, the power module 3 of the present invention, through the design of the frame 33 and the like, basically does not affect the manufacturing cost of the power module 3 regardless of the setting position of the pin 32.

[0041] In practical applications, the frame 33 and the two fixing structures 35 can be made of metal. Preferably, the frame 33 and the fixing structures 35 can also be made of a material with high thermal conductivity. When the power module 3 is in operation, part of the heat energy generated can be transferred to the heat dissipation element 1 through the frame 33 and the two fixing structures 35, or directly transferred to the air.

[0042] like Figure 3 As shown, each fixing structure 35 includes: a first through hole 351, two second through holes 352, a ring structure 353 and two sinking structures 354. In order to clearly indicate the specific area of ​​each sinking structure 354, Figure 3 The imaginary line marks the boundary of the sunken structure 354. In practice, the two fixing structures 35 can be identical. In this way, when the power module 3 is fixed to the flat surface 11 of the heat dissipation element 1 via the two screws 2, the heat dissipation surface 311 of the substrate 31 can be more flatly attached to the flat surface 11 of the heat dissipation element 1.

[0043] The first through-hole 351 passes through the fixing structure 35, and the first through-hole 351 is used to allow a screw 2 to pass through. Each first through-hole 351 can be a circular hole, but is not limited to this. Each second through-hole 352 passes through the fixing structure 35, and the two second through-holes 352 are located on both sides of the first through-hole 351 with the first through-hole 351 as the center, and the two second through-holes 352 are arranged facing each other. Each second through-hole 352 is arc-shaped, and each second through-hole 352 is arranged around a portion of the outer edge of the first through-hole 351. In practice, each second through-hole 352 can be arc-shaped, and the center of each arc-shaped second through-hole 352 overlaps with the center of the circular first through-hole 351.

[0044] The annular structure 353 is located between the two second through-holes 352 and the first through-hole 351. The outer diameter of each annular structure 353 can be approximately equal to the outer diameter of the head 22 of each screw 2. Two sunken structures 354 are located on either side of the annular structure 353. Each sunken structure 354 is connected to the annular structure 353, and a sunken structure 354 is formed between one end of each second through-hole 352 and one end of another second through-hole 352.

[0045] Figure 4 is a side view of the power device of the present invention, Figure 5 for Figure 4 A partial enlarged schematic diagram of Figure 1 、 Figure 3 、 Figure 4 、 Figure 5 As shown, when the power module 3 is secured to the heat sink 1 using two screws 2, a stud 21 of each screw 2 passes through the first through-hole 351, and the head 22 of each screw 2 presses against the corresponding annular structure 353, causing one side of the annular structure 353 to lie flush against the flat surface 11 of the heat sink 1. The two sunken structures 354 connected to each annular structure 353 bend toward the flat surface 11 of the heat sink 1, generating a downward force that further securely secures the heat sink 311 against the flat surface 11 of the heat sink 1. The outer diameter of each annular structure 353 is approximately equal to the outer diameter of the head 22 of each screw 2.

[0046] As described above, the power module 3 of the present application, when each screw 2 fixes the fixing structure 35 to the heat dissipation element 1, the two sinking structures 354 will bend towards the flat surface 11 of the heat dissipation element 1, and the annular structure 353 can be more firmly and flatly fixed to the flat surface 11 of the heat dissipation element 1 under the locking of the head 22 of the screw 2, and the annular structure 353 and the heat dissipation element 1 will not easily have a gap, and the annular structure 353 and the head 22 of the screw 2 will not easily have a gap, thereby greatly improving the stability of the power module 3, the two screws 2 and the heat dissipation element 1.

[0047] In practice, the power device 100 may be installed in a vibrating environment (for example, the power device 100 is installed on a vehicle) according to different products to be installed, and if the screw 2 cannot tightly fix the relevant structure to the flat surface 11 of the heat dissipation element 1, the power device 100 in a vibrating environment will easily have a gap between the screw 2 and the relevant fixing structure 35, so that the heat dissipation surface 311 of the power module 3 cannot be tightly fixed to the flat surface 11 of the heat dissipation element 1, and even the screw 2 may be loose. As described above, if the heat dissipation surface 311 of the power module 3 is not tightly fixed to the flat surface 11 of the heat dissipation element 1, a large amount of heat generated during operation of the power module 3 cannot be effectively dissipated to the outside through the heat dissipation element 1, which will result in a decrease in the operating efficiency of the power module 3, and even the power module 3 may be damaged.

[0048] It should be particularly emphasized that the two sinking structures 354 are arranged to face each other, so that the annular structure 353 can be relatively smoothly sunk towards the flat surface 11 of the heat dissipation element 1 during mutual locking of the threaded hole 12 of the heat dissipation element 1 and the threaded shank 21 of the screw 2, and finally the annular structure 353 can be flatly fixed to the flat surface 11 of the heat dissipation element 1.

[0049] The power device 100 of the present application can make each section of the annular structure 353 bear approximately the same downward force through the design of the two sinking structures 354, so that the annular structure 353 can be effectively pushed by the screw 2 to be flatly fixed to the flat surface 11 of the heat dissipation element 1, and the annular structure 353 and the heat dissipation element 1 will not easily have a gap when the power module 3 is in a vibrating environment.

[0050] In addition, the main function of the two fixing structures 35 is to use the two screws 2 to fix the power module 3 to the flat surface 11 of the heat dissipation element 1. Therefore, when the power module 3 is locked to the flat surface 11 of the heat dissipation element 1 using the two screws 2, not only must each of the annular structures 353 be able to lie flat against the flat surface 11 of the heat dissipation element 1, but the locking force provided by the two screws 2 to the heat dissipation element 1 must also be effectively transmitted to the power module 3 through the two fixing structures 35, so that the heat dissipation surface 311 of the power module 3 can lie flat against the flat surface 11 of the heat dissipation element 1. As a result, the heat energy generated by the power module 3 during operation can be effectively transferred outward through the heat dissipation element 1.

[0051] like Figure 3 As shown, in a preferred embodiment, the first through-hole 351 of the power module 3 of the present invention is a circular hole, the center of each first through-hole 351 is located on the same axis L, a portion of each sinking structure 354 is located on the axis L, and each first through-hole 351 and two adjacent second through-holes 352 further divide the fixing structure 35 into two first external connection parts 35A, a second external connection part 35B and an internal connection part 35C, each first external connection part 35A is located on the side of the second through-hole 352 opposite to the first through-hole 351, the second external connection part 35B is located on the side of the first through-hole 351 away from the package body 34, and the internal connection part 35C is located between the first through-hole 351 and the package body 34; when the power module 3 is fixed by two screws 2 (such as Figure 1 As shown), fixed to the heat dissipation element 1 (as Figure 1 As shown), the sinking structure 354 of each fixing structure 35 away from the package body 34 will be connected to the package body 34 through the second external connection portion 35B and the two first external connection portions 35A, while the sinking structure 354 close to the package body 34 will be connected to the package body 34 through the internal connection portion 35C. In this way, each screw 2 (as shown) Figure 1 As shown) can effectively make the substrate 31 (as shown) in the package body 34 through the fixing structure 35. Figure 1 The heat dissipation surface 311 (as shown) Figure 1 As shown), it fits tightly against the flat surface 11 of the heat dissipation element 1.

[0052] One side of each annular structure 353 is flatly attached to the flat surface 11 of the heat dissipation element 1, and the heat dissipation surface 311 of the heat dissipation element 1 is also tightly and flatly attached to the flat surface 11 of the heat dissipation element 1, and the downward force borne by each area of ​​each annular structure 353 is roughly the same. Therefore, when the power module 3 is in a vibrating environment, it is not easy for a gap to appear between each annular structure 353 and the heat dissipation element 1. When the power module 3 is in a normal vibration environment, each annular structure 353 and the heat dissipation surface 311 can still be flatly attached to the flat surface 11 of the heat dissipation element 1.

[0053] See also Figure 6 , a top view of a second embodiment of a power module according to the present invention. The similarities between this embodiment and the previous embodiment will not be repeated below. The major difference between this embodiment and the previous embodiment lies in: the two sinking structures 354 of each fixing structure 35A of the power module 3A of this embodiment are defined as an inner sinking structure 354A1 and an outer sinking structure 354A2, respectively. The inner sinking structure 354A1 is located closer to the package body 34, while the outer sinking structure 354A2 is located farther away from the package body 34. Each fixing structure 35A also includes an auxiliary through-hole 355 that passes through the fixing structure 35A and is located between the inner sinking structure 354A1 and the package body 34. The diameter of the auxiliary through-hole 355 is smaller than that of the first through-hole 351, and the center of each auxiliary through-hole 355 is located on the axis L. In the figures of this embodiment, each auxiliary through-hole 355 is shown as a circular hole, but the shape of each auxiliary through-hole 355 is not limited to this.

[0054] The design of the auxiliary through-holes 355 can weaken the structural strength of each fixing structure 35A in the area surrounding the inner sunken structure 354A1. When the power module 3 is in a high-vibration frequency environment, the stress on the fixing structure 35A will tend to concentrate around the auxiliary through-holes 355. Therefore, if each fixing structure 35A is subjected to vibration energy exceeding the original design, the fixing structure 35A will preferentially break around the auxiliary through-holes 355, while the power module 3 can still be used for a period of time.

[0055] See also Figure 7 , which is a top view of a third embodiment of a power module according to the present invention. The similarities between this embodiment and the previous embodiment will not be repeated below. The major difference between this embodiment and the previous embodiment lies in: each fixing structure 35B of the power module 3B of this embodiment includes four second through-holes 352, two of which are located on one side of the first through-hole 351, and the other two second through-holes 352 are located on the other side of the first through-hole 351. A weakening structure 356 is formed between the two second through-holes 352 on the same side. When the power module 3 is fixed to the heat dissipation element 1 with two screws 2, each weakening structure 356 is squeezed by the screws 2 and breaks.

[0056] See also Figure 8, which is a top view of a fourth embodiment of a power module according to the present invention. The similarities between this embodiment and the previous embodiments will not be repeated below. The major difference between this embodiment and the previous embodiments is that the two first through-holes 351 of each fixing structure 35C included in the power module 3C of this embodiment are located on an axis L, and no portion of each sinking structure 354 is located on the axis L. Instead, a portion of the two sinking structures 354 of each fixing structure 35C is located on a longitudinal line P, which is not parallel to the axis L. In actual applications, the longitudinal line P can be perpendicular to the axis L.

[0057] Each fixing structure 35C further includes an auxiliary through-hole 355, which is disposed adjacent to one of the sinking structures 354. The diameter of the auxiliary through-hole 355 is smaller than the diameter of the first through-hole 351. In a variation of this embodiment, each fixing structure 35C may not include the auxiliary through-hole 355.

[0058] Please also refer to Figure 9 and Figure 10 , Figure 9 is a schematic diagram of a fifth embodiment of a power module of the present invention, Figure 10 for Figure 9 A schematic cross-sectional view taken along line XX. The major difference between this embodiment and the previous embodiment lies in the fact that the package 34D of the power module 3D in this embodiment is injection molded to cover an inner fixing portion 357 of each fixing structure 35 and a portion of each fixing structure 35D, thereby securing the two fixing structures 35D to each other. Furthermore, the package 34D includes a plurality of through-holes 341, with a portion of each pin 32 extending through one of these through-holes 341. In practical applications, the package 34D can be manufactured using, for example, a mold, but is not limited thereto.

[0059] See also Figure 11 , which is a schematic diagram of a sixth embodiment of a power module according to the present invention. The portions of this embodiment that are identical to the previous embodiments will not be repeated below. This embodiment differs from the previous embodiments in that each fixing structure 35Y includes only a single second through-hole 352Y and a single sinking structure 354Y. Each second through-hole 352Y is arc-shaped and is disposed partially around the first through-hole 351Y, centered around the first through-hole 351Y. Each fixing structure 35Y has a first through-hole 351Y, and each second through-hole 352Y is disposed approximately around the first through-hole 351Y. An annular structure 353Y is formed between each first through-hole 351Y and the second through-hole 352Y. The annular structure 353Y is connected to the sinking structure 354Y, and the sinking structure 354Y is located between the package body 34 and the first through-hole 351Y. No second through-hole 352Y exists between the package body 34 and the first through-hole 351Y.

[0060] The power module 3E of this embodiment is connected by two screws 2 (such as Figure 1 As shown) is fixed to the heat dissipation element 1 (as Figure 1 As shown), each screw 2 (as Figure 1 A stud 21 (as shown) Figure 1 As shown) will pass through the first through hole 351Y, each screw 2 (as shown) Figure 1 A head 22 (as shown) Figure 1 As shown) presses the corresponding annular structure 353Y, and makes the annular structure 353Y flat against the heat dissipation element 1 (as shown) Figure 1 As shown in FIG), the flat surface 11, so that when the power module 3C is in operation, the large amount of heat energy generated can be effectively passed through the heat dissipation element 1 (as shown in FIG). Figure 1 It should be noted that the power modules described in the above embodiments may also be manufactured, implemented, or sold separately, and the power modules described in the embodiments are not limited to being manufactured, implemented, or sold together with the two screws and the heat sink.

[0061] In summary, the power device and power module of the present invention, through the design of the first through-hole, the second through-hole, the annular structure, and the two sunken structures, allow two screws to firmly fix the power module to the flat surface of the heat dissipation element, so that the heat dissipation surface of the power module is flush with the flat surface of the heat dissipation element. As a result, the large amount of heat energy generated by the power module during operation can be effectively discharged outward through the heat dissipation element. In addition, the power device and power module of the present invention have a relatively long service life in relevant vibration tests or vibration environments.

[0062] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Therefore, any equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the present invention.

Claims

1. A power module, characterized in that: The power module comprises: a substrate, one side of which is provided with at least one electronic component, and the other side of the substrate is a heat dissipation surface; a package body covering the side of the substrate where the electronic component is disposed, wherein the heat dissipation surface is exposed from the package body; a plurality of pins, one end of each pin being fixed to the substrate, and the other end of each pin passing through the package body; Two fixing structures are provided at opposite ends of the package body; each fixing structure comprises: a first through-hole passing through the fixing structure; at least two second through-holes, each of which penetrates the fixing structure, the at least two second through-holes being centered on the first through-hole and located on either side of the first through-hole, and the at least two second through-holes being arranged facing each other; each of the second through-holes being arc-shaped; an annular structure located between at least two of the second through-holes and the first through-hole; Two sinking structures are located on both sides of the annular structure, each of the sinking structures is connected to the annular structure, and a sinking structure is formed between one end of each second through-hole and one end of another second through-hole; When the power module is fixed to a heat dissipation element by two screws, a stud of each screw will pass through the first through-hole, and a head of each screw will press against the corresponding annular structure, making the annular structure flat against a flat surface of the heat dissipation element.

2. The power module according to claim 1, wherein: Each of the first through-holes is a circular hole, the center of each of the first through-holes is located on the same axis, and each of the sinking structures is located on the axis.

3. The power module according to claim 2, wherein: The two sinking structures of each of the fixed structures are respectively defined as an inner sinking structure and an outer sinking structure, the inner sinking structure is arranged close to the packaging body, and the outer sinking structure is arranged away from the packaging body. Each of the fixed structures also includes an auxiliary through-hole, which passes through the fixed structure. The auxiliary through-hole is located between the inner sinking structure and the packaging body. The aperture of the auxiliary through-hole is smaller than the aperture of the first through-hole, and the center of each of the auxiliary through-holes is located on the axis.

4. The power module according to claim 3, wherein: Each of the fixing structures includes four second through-holes, two of which are arranged on one side of the first through-hole, and the other two are arranged on the other side of the first through-hole. A weakening structure is formed between the two second through-holes on the same side. When the power module is fixed to the heat dissipation element by the two screws, each of the weakening structures can be squeezed and broken by the screws.

5. The power module according to claim 1, wherein: The power module further includes a frame body, which is located around the packaging body and is integrally formed with the two fixing structures.

6. The power module according to claim 1, wherein: Each of the fixing structures includes an inner fixing portion. The packaging body is fixed to the two fixing structures by injection molding, and each of the inner fixing portions is covered by the packaging body.

7. The power module according to claim 1, wherein: The two first through-holes are located on an axis, each of the sinking structures is not located on the axis, and the two sinking structures of each of the fixed structures are located on a longitudinal line, which is not parallel to the axis. Each of the fixed structures further includes an auxiliary through-hole, which is arranged adjacent to one of the sinking structures, and the aperture of the auxiliary through-hole is smaller than the aperture of the first through-hole.

8. A power module, characterized in that: The power module comprises: a substrate, one side of which is provided with at least one electronic component, and the other side of the substrate is a heat dissipation surface; a package body covering the side of the substrate where the electronic component is disposed, wherein the heat dissipation surface is exposed from the package body; a plurality of pins, one end of each pin being fixed to the substrate, and the other end of each pin passing through the package body; Two fixing structures are provided at opposite ends of the package body; each fixing structure comprises: a first through-hole passing through the fixing structure; a second through-hole passing through the fixing structure, wherein the second through-hole is arc-shaped and is arranged around the first through-hole with the first through-hole as the center; an annular structure located between the second through-hole and the first through-hole; a sinking structure located on one side of the annular structure, the sinking structure being located between the package body and the first through-hole, and the sinking structure being connected to the annular structure; When the power module is fixed to a heat dissipation element by two screws, a stud of each screw will pass through the first through-hole, and a head of each screw will press against the corresponding annular structure, so that the annular structure is flat against a flat surface of the heat dissipation element.

9. A power device, characterized in that: The power device comprises: a heat dissipation element; Two screws; A power module comprising: a substrate, one side of which is provided with at least one electronic component, and the other side of the substrate is a heat dissipation surface; a package body covering the side of the substrate where the electronic component is disposed, wherein the heat dissipation surface is exposed from the package body; a plurality of pins, one end of each pin being fixed to the substrate, and the other end of each pin passing through the package body; Two fixing structures are provided at opposite ends of the package body; each fixing structure comprises: a first through-hole passing through the fixing structure; at least two second through-holes, each of which penetrates the fixing structure, the at least two second through-holes being centered on the first through-hole and located on either side of the first through-hole, and the at least two second through-holes being arranged facing each other; each of the second through-holes being arc-shaped; an annular structure located between at least two of the second through-holes and the first through-hole; Two sinking structures are located on both sides of the annular structure, each of the sinking structures is connected to the annular structure, and a sinking structure is formed between one end of each second through-hole and one end of another second through-hole; When the power module is fixed to the heat dissipation element by two screws, a stud of each screw will pass through the first through-hole, and a head of each screw will press against the corresponding annular structure, making the annular structure flat against a flat surface of the heat dissipation element.

10. The power device according to claim 9, characterized in that Each of the first through-holes is a circular hole, the center of each of the first through-holes is located on the same axis, and each of the sinking structures is located on the axis.

11. The power device according to claim 10, characterized in that The two sinking structures of each of the fixed structures are respectively defined as an inner sinking structure and an outer sinking structure, the inner sinking structure is arranged close to the packaging body, and the outer sinking structure is arranged away from the packaging body. Each of the fixed structures also includes an auxiliary through-hole, which passes through the fixed structure. The auxiliary through-hole is located between the inner sinking structure and the packaging body. The aperture of the auxiliary through-hole is smaller than the aperture of the first through-hole, and the center of each of the auxiliary through-holes is located on the axis.

12. The power device according to claim 11, characterized in that Each of the fixing structures includes four second through-holes, two of which are arranged on one side of the first through-hole, and the other two are arranged on the other side of the first through-hole. A weakening structure is formed between the two second through-holes on the same side. When the power module is fixed to the heat dissipation element by the two screws, each of the weakening structures can be squeezed and broken by the screws.

13. The power device according to claim 9, characterized in that The power module further includes a frame body, which is located around the packaging body and is integrally formed with the two fixing structures.

14. The power device according to claim 9, characterized in that Each of the fixing structures includes an inner fixing portion. The packaging body is fixed to the two fixing structures by injection molding, and each of the inner fixing portions is covered by the packaging body.

15. The power device according to claim 9, characterized in that The two first through-holes are located on an axis, each of the sinking structures is not located on the axis, and the two sinking structures of each of the fixed structures are located on a longitudinal line, which is not parallel to the axis. Each of the fixed structures further includes an auxiliary through-hole, which is arranged adjacent to one of the sinking structures, and the aperture of the auxiliary through-hole is smaller than the aperture of the first through-hole.

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