Flexible sensor device manufacturing tool and use method thereof

Abstract

The present invention discloses a flexible sensor device manufacturing tool and a method for using the same, and belongs to the field of sensor production technology. The flexible sensor device manufacturing tool includes a base, a fixed cover plate, an inner circuit cover plate, a sensor fitting cover plate, and an outer circuit cover plate. The base is used to support the bottom layer. The fixed cover plate can be detachably covered on the base to fix the bottom layer on the base. The inner circuit cover plate, the sensor fitting cover plate, and the outer circuit cover plate can be alternately covered on the fixed cover plate in sequence. The inner circuit cover plate is provided with an inner circuit groove capable of accommodating an inner measurement circuit, the sensor fitting cover plate is provided with a receiving groove capable of accommodating a flexible sensor, and the outer circuit cover plate is provided with an outer circuit groove matching the area occupied by the outer measurement circuit. It can improve the production efficiency and quality of flexible sensor devices.

Description

Technical Field

[0001] The present invention relates to the technical field of sensor production, and in particular to a flexible sensor device manufacturing tool and a use method thereof. Background Art

[0002] Flexible sensing is currently finding innovative applications in numerous fields. Flexible sensor components consist of a base layer, cover layer, flexible circuits, and flexible sensors. Initial applications typically require small-batch trial production to verify the signal model and reliability of the flexible sensor components. These trials are often prohibitive due to the costly automation required, and the production process requires continuous iteration. Consequently, these trials are often manually produced, which presents the following challenges: 1) low production efficiency; 2) inaccurate circuit layout; 3) high production difficulty; and 4) difficulty ensuring quality. Summary of the Invention

[0003] An object of the present invention is to provide a flexible sensor device manufacturing tool that can improve the production efficiency and quality of flexible sensor devices.

[0004] Another object of the present invention is to provide a method for using a flexible sensor device manufacturing tool. The flexible sensor device manufacturing tool is easy to operate and can improve the production efficiency and quality of flexible sensor devices.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] A flexible sensor device manufacturing tool, the flexible sensor device includes a bottom layer, a cover layer, a flexible circuit and a flexible sensor, the flexible circuit includes an inner measurement circuit and an outer measurement circuit, the flexible sensor device manufacturing tool includes:

[0007] A base, used for supporting the bottom layer;

[0008] a fixed cover plate, detachably covering the base to fix the bottom layer on the base;

[0009] The inner circuit cover plate, the sensor fitting cover plate and the outer circuit cover plate can be alternately covered on the fixed cover plate in sequence; the inner circuit cover plate is provided with an inner circuit groove capable of accommodating the inner measurement circuit, the sensor fitting cover plate is provided with a receiving groove capable of accommodating the flexible sensor, and the outer circuit cover plate is provided with an outer circuit groove matching the area occupied by the outer measurement circuit.

[0010] Optionally, a limiting structure for limiting the bottom layer is provided on the base.

[0011] Optionally, the limiting structure includes a first boss, a second boss and a third boss arranged in sequence along the circumference of the top surface of the base, the first boss and the third boss are opposite and parallel to each other, and the extension direction of the second boss is perpendicular to the extension direction of the first boss and the third boss.

[0012] Optionally, the fixed cover plate is provided with a first clamping groove and a second clamping groove corresponding to the first boss and the third boss on a one-to-one basis, and the fixed cover plate can abut against the second boss.

[0013] Optionally, a through hole is provided on the fixed cover plate, and the inner circuit cover plate, the sensor fitting cover plate and the outer circuit cover plate can all be matched and installed in the through hole.

[0014] Optionally, lugs are provided on the tops of the inner circuit cover plate, the sensor fitting cover plate and / or the outer circuit cover plate.

[0015] Optionally, the top surface of the base is an arc-shaped concave surface, and the bottom surfaces of the fixed cover plate, the inner circuit cover plate, the sensor fitting cover plate and the outer circuit cover plate are all arc surfaces matching the top surface of the base.

[0016] A method for using the flexible sensor device manufacturing tool includes the following steps:

[0017] S10, cutting out the bottom layer;

[0018] S20, placing the bottom layer on the base;

[0019] S30, placing a fixed cover plate on the base and pressing it at a preset position on the bottom layer;

[0020] S40, placing an inner circuit cover plate on the fixed cover plate, arranging an inner test circuit in the inner circuit groove, and then removing the inner circuit cover plate;

[0021] S50, placing a sensor fitting cover plate on the fixed cover plate, fitting the flexible sensor in the receiving groove, and then removing the sensor fitting cover plate, wherein the flexible sensor is electrically connected to the inner test circuit;

[0022] S60, placing an external circuit cover on the fixed cover, arranging an external measuring circuit in the external circuit groove, removing the external circuit cover, and electrically connecting the external measuring circuit to the sensor;

[0023] S70, removing the fixed cover plate;

[0024] S80 , adhering the covering layer to the bottom layer, the inner test circuit, the flexible sensor, and the outer test circuit.

[0025] Optionally, the length and width of the fixed cover plate match the length and width of the covering layer.

[0026] The beneficial effects of the present invention are:

[0027] The flexible sensor device manufacturing tool of the present invention supports the bottom layer of the flexible sensor device through a base and fixes the bottom layer through a fixed cover plate to prevent the bottom layer from moving on the base. The inner circuit cover plate, the sensor fitting cover plate and the outer circuit cover plate can be alternately covered on the fixed cover plate in sequence, so that the inner measurement circuit can be manufactured in the inner circuit groove, the flexible sensor can be manufactured in the accommodating groove, and the outer measurement circuit can be manufactured in the outer circuit groove in sequence. In this way, the relative positions of the various components of the flexible sensor device can be installed more accurately, the manufacturing process is standardized, and it can be suitable for small-batch trial production, thereby improving production quality and production efficiency.

[0028] The method for using the flexible sensor device manufacturing tool of the present invention is convenient for operation and can improve the production efficiency and quality of the flexible sensor device. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is an exploded view of a flexible sensor device manufacturing tool provided in a specific embodiment of the present invention;

[0030] Figure 2 is a top view of a base and a fixed cover provided in a specific embodiment of the present invention;

[0031] Figure 3 yes Figure 2 Cross-section at AA in the middle;

[0032] Figure 4 It is a flow chart of a method for using a flexible sensor device manufacturing tool provided in a specific embodiment of the present invention.

[0033] In the picture:

[0034] 1. Base; 11. Limiting structure; 111. First boss; 112. Second boss; 113. Third boss; 2. Fixed cover; 21. First slot; 22. Second slot; 23. Through hole; 3. Inner circuit cover; 31. Inner circuit slot; 4. Sensor fitting cover; 41. Accommodating slot; 5. Outer circuit cover; 51. Outer circuit slot; 6. Lug. DETAILED DESCRIPTION

[0035] In the description of the present invention, it should be noted that the terms "center," "up," "down," "left," "right," "vertical," "horizontal," "inside," and "outside" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions.

[0036] Unless otherwise expressly specified or limited, the terms "mounted," "connected," "connect," and "fixed" should be interpreted broadly. For example, they may refer to fixed or removable connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of these terms in the present invention based on specific circumstances.

[0037] Unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first feature being in direct contact with the second feature, or may include the first feature being in contact with the second feature through another feature between them instead of being in direct contact. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0038] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0039] A tool for manufacturing a flexible sensor device, wherein the flexible sensor device includes a bottom layer, a covering layer, a flexible circuit and a flexible sensor, and the flexible circuit includes an inner test circuit and an outer test circuit.

[0040] In order to improve the production efficiency and processing quality of flexible sensor devices during the trial production process, this embodiment provides a flexible sensor device manufacturing tool. Figures 1 to 3As shown, the flexible sensor device manufacturing tool includes a base 1, a fixed cover plate 2, an inner circuit cover plate 3, a sensor bonding cover plate 4, and an outer circuit cover plate 5. The base 1 is used to support the bottom layer. The fixed cover plate 2 can be detachably placed on the base 1 to fix the bottom layer on the base 1. The inner circuit cover plate 3, the sensor bonding cover plate 4, and the outer circuit cover plate 5 can be alternately placed on the fixed cover plate 2 in sequence. The inner circuit cover plate 3 has an inner circuit groove 31 that can accommodate the inner test circuit. The sensor bonding cover plate 4 has an accommodating groove 41 that can accommodate the flexible sensor. The outer circuit cover plate 5 has an outer circuit groove 51 that matches the area occupied by the outer test circuit.

[0041] In this embodiment, the bottom layer of the flexible sensor device is supported by the base 1 and fixed by the fixed cover 2 to prevent the bottom layer from moving on the base 1. The inner circuit cover 3, the sensor fitting cover 4 and the outer circuit cover 5 can be alternately covered on the fixed cover 2 in sequence, so that the inner measurement circuit can be made in the inner circuit groove 31, the sensor can be made in the accommodating groove 41, and the outer measurement circuit can be made in the outer circuit groove 51 in sequence. In this way, the relative positions of the various components of the flexible sensor device are installed more accurately, the production process is standardized, and it can be suitable for small-batch trial production, thereby improving production quality and production efficiency.

[0042] In order to facilitate the positioning of the bottom layer placed on the base 1, as shown in FIG. Figure 2 and Figure 3 As shown, a limiting structure 11 for limiting the bottom layer is provided on the base 1. When the bottom layer is placed on the base 1, it is limited by the limiting structure 11, which improves the accuracy of the bottom layer position and makes the placement of the bottom layer more convenient and quick.

[0043] In some optional embodiments, the limiting structure 11 includes a first boss 111, a second boss 112, and a third boss 113 arranged in sequence along the circumference of the top surface of the base 1. The first boss 111 and the third boss 113 are opposite and parallel to each other, and the extension direction of the second boss 112 is perpendicular to the extension direction of the first boss 111 and the third boss 113. It is understandable that the bottom layer is placed between the first boss 111, the second boss 112, and the third boss 113, and the three sides of the bottom layer can respectively abut the first boss 111, the second boss 112, and the third boss 113, thereby achieving the limitation of the bottom layer. In detail, the length of the first boss 111 and the third boss 113 matches the length of the bottom layer, and the distance between the first boss 111 and the third boss 113 matches the width of the bottom layer.

[0044] Furthermore, the fixed cover plate 2 is provided with a first latching groove 21 and a second latching groove 22 on the bottom surface facing the base 1, which correspond one-to-one with the first boss 111 and the third boss 113, and the fixed cover plate 2 can abut against the second boss 112. Specifically, when the fixed cover plate 2 is placed on the base 1, the first latching groove 21 is engaged with the first boss 111, the second latching groove 22 is engaged with the third boss 113, and the fixed cover plate 2 abuts against the second boss 112. This allows the fixed cover plate 2 to be positioned accurately in a preset position, thereby improving production efficiency.

[0045] In particular, a through hole 23 is provided on the fixed cover plate 2, and the inner circuit cover plate 3, the sensor fitting cover plate 4 and the outer circuit cover plate 5 can all be matched and installed in the through hole 23. This can improve the accuracy of the installation position of the inner circuit cover plate 3, the sensor fitting cover plate 4 and the outer circuit cover plate 5, which is conducive to improving the relative position accuracy of the internal measurement circuit, sensor and external measurement circuit.

[0046] In this embodiment, preferably, lugs 6 are provided on the tops of the inner circuit cover 3, the sensor cover 4, and / or the outer circuit cover 5. Specifically, lugs 6 are provided on the tops of the inner circuit cover 3, the sensor cover 4, and the outer circuit cover 5; alternatively, lugs 6 are provided on the tops of the inner circuit cover 3, the sensor cover 4, or the outer circuit cover 5. Grasping the lugs 6 facilitates handling by removing and placing the inner circuit cover 3, the sensor cover 4, or the outer circuit cover 5.

[0047] In some optional embodiments, when the flexible sensor element is used to adhere to the inner wall of a tire, the top surface of the base 1 is an arc-shaped, concave surface, and the bottom surfaces of the fixed cover plate 2, the inner circuit cover plate 3, the sensor bonding cover plate 4, and the outer circuit cover plate 5 are all arc-shaped surfaces that match the top surface of the base 1. This allows for better adhesion to the inner wall of the tire. Of course, the shapes of the base 1, fixed cover plate 2, the inner circuit cover plate 3, the sensor bonding cover plate 4, and the outer circuit cover plate 5 can also be set to other forms. Those skilled in the art can set them according to the application scenario of the product, and this is not limited here.

[0048] like Figure 4 As shown, this embodiment also provides a method for using the flexible sensor device manufacturing tool, comprising the following steps:

[0049] S10, cutting out the bottom layer.

[0050] S20, placing the bottom layer on the base 1.

[0051] S30: Place the fixed cover plate 2 on the base 1 and press it to the preset position of the bottom layer. Specifically, the first slot 21 and the second slot 22 of the fixed cover plate 2 are respectively engaged with the first boss 111 and the third boss 113.

[0052] S40 , the inner circuit cover 3 is placed on the fixed cover 2 , and after the inner circuit is arranged in the inner circuit groove 31 , the inner circuit cover 3 is removed. Specifically, the inner circuit cover 3 is placed in the through hole 23 of the fixed cover 2 .

[0053] S50: Place the sensor-attaching cover plate 4 on the fixed cover plate 2, attach the sensor to the receiving groove 41, and then remove the sensor-attaching cover plate 4. The sensor is then electrically connected to the internal test circuit. Specifically, place the sensor-attaching cover plate 4 in the through hole 23 of the fixed cover plate 2.

[0054] S60: Place the external circuit cover 5 on the fixed cover 2, arrange the external test circuit in the external circuit slot 51, remove the external circuit cover 5, and electrically connect the external test circuit to the sensor. Specifically, place the external circuit cover 5 in the through hole 23 of the fixed cover 2.

[0055] S70, remove the fixed cover 2.

[0056] S80, attaching a cover layer to the bottom layer, the inner test circuit, the sensor, and the outer test circuit.

[0057] Through the above-mentioned standardized process, the relative positions of the various components of the flexible sensor device are installed more accurately, which can be applied to small-batch trial production, thereby improving production quality and efficiency.

[0058] Specifically, the length and width of the fixed cover plate 2 match those of the covering layer, so that the bottom layer, inner circuit, sensor and outer circuit can all be covered under the covering layer.

[0059] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are intended solely to illustrate the principles of the present invention and are not to be construed in any way as limiting the scope of protection of the present invention. Based on the explanations herein, those skilled in the art will readily conceive of other specific embodiments of the present invention without inventive effort, and such embodiments will fall within the scope of protection of the present invention.

Claims

1. A tool for manufacturing a flexible sensor device, wherein the flexible sensor device comprises a bottom layer, a cover layer, a flexible circuit, and a flexible sensor, wherein the flexible circuit comprises an inner measuring circuit and an outer measuring circuit, and wherein: include: A base (1) for supporting the bottom layer; A fixed cover plate (2) is detachably mounted on the base (1) to fix the bottom layer on the base (1); The inner circuit cover plate (3), the sensor fitting cover plate (4) and the outer circuit cover plate (5) can be alternately covered on the fixed cover plate (2) in sequence; the inner circuit cover plate (3) is provided with an inner circuit groove (31) capable of accommodating the inner measuring circuit, the sensor fitting cover plate (4) is provided with an accommodating groove (41) capable of accommodating the flexible sensor, and the outer circuit cover plate (5) is provided with an outer circuit groove (51) matching the area occupied by the outer measuring circuit.

2. The flexible sensor device manufacturing tool according to claim 1, characterized in that: A limiting structure (11) for limiting the bottom layer is provided on the base (1).

3. The flexible sensor device manufacturing tool according to claim 2, characterized in that: The limiting structure (11) comprises a first boss (111), a second boss (112) and a third boss (113) which are sequentially arranged along the circumference of the top surface of the base (1); the first boss (111) and the third boss (113) are opposite to and parallel to each other; and the extension direction of the second boss (112) is perpendicular to the extension direction of the first boss (111) and the third boss (113).

4. The flexible sensor device manufacturing tool according to claim 3, characterized in that: The fixed cover plate (2) is provided with a first card slot (21) and a second card slot (22) on the bottom surface facing the base (1), which correspond to the first boss (111) and the third boss (113) on a one-to-one basis, and the fixed cover plate (2) can abut against the second boss (112).

5. The flexible sensor device manufacturing tool according to claim 1, characterized in that: The fixed cover plate (2) is provided with a through hole (23), and the inner circuit cover plate (3), the sensor fitting cover plate (4) and the outer circuit cover plate (5) can all be matched and installed in the through hole (23).

6. The flexible sensor device manufacturing tool according to claim 1, characterized in that: The tops of the inner circuit cover plate (3), the sensor fitting cover plate (4) and / or the outer circuit cover plate (5) are all provided with lugs (6).

7. The flexible sensor device manufacturing tool according to any one of claims 1 to 6, characterized in that: The top surface of the base (1) is an arc-shaped concave surface, and the bottom surfaces of the fixed cover plate (2), the inner circuit cover plate (3), the sensor fitting cover plate (4) and the outer circuit cover plate (5) are all arc surfaces that match the top surface of the base (1).

8. A method for using the flexible sensor device manufacturing tool according to any one of claims 1 to 7, characterized in that: The steps include: S10, cutting out the bottom layer; S20, placing the bottom layer on the base (1); S30, placing the fixed cover plate (2) on the base (1) and pressing it into a preset position on the bottom layer; S40, placing the inner circuit cover plate (3) on the fixed cover plate (2), arranging the inner test circuit in the inner circuit groove (31), and then taking out the inner circuit cover plate (3); S50, placing a sensor fitting cover plate (4) on the fixed cover plate (2), fitting the flexible sensor in the receiving groove (41), and then removing the sensor fitting cover plate (4), wherein the flexible sensor is electrically connected to the internal test circuit; S60, placing the external circuit cover plate (5) on the fixed cover plate (2), arranging the external measurement circuit in the external circuit groove (51), removing the external circuit cover plate (5), and electrically connecting the external measurement circuit and the sensor; S70, taking out the fixed cover plate (2); S80 , adhering the covering layer to the bottom layer, the inner test circuit, the flexible sensor, and the outer test circuit.

9. The method for using the flexible sensor device manufacturing tool according to claim 8, wherein: The length and width of the fixed cover plate (2) match the length and width of the covering layer.

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