Ultra-thin glass and thinning method thereof

Abstract

Ultra-thin glass and its thinning method relate to the field of ultra-thin glass processing technology. The method includes: cutting a motherboard into multiple ultra-thin glass substrates; immersing the first end of the ultra-thin glass substrate below the liquid surface of a thinning liquid and exposing the second end above the liquid surface of the thinning liquid, and causing the ultra-thin glass substrate to reciprocate linearly so that the second end of the ultra-thin glass substrate switches between being at least partially immersed below the liquid surface of the thinning liquid and being exposed above the liquid surface of the thinning liquid; immersing the second end of the ultra-thin glass substrate below the liquid surface of the thinning liquid and exposing the first end at least partially above the liquid surface of the thinning liquid, and causing the ultra-thin glass substrate to reciprocate linearly so that the first end of the ultra-thin glass substrate exposed above the liquid surface of the thinning liquid repeatedly switches between being at least partially immersed below the liquid surface of the thinning liquid and being exposed above the liquid surface of the thinning liquid; and cutting the outer edge of the ultra-thin glass substrate. This method is simple in process and can cause the thickness of the ultra-thin glass to change gradually after thinning.

Description

Technical Field

[0001] The present invention relates to the technical field of ultra-thin glass processing, and in particular to ultra-thin glass and a thinning method thereof. Background Art

[0002] Ultra-thin glass (UTG) refers to flexible glass with a thickness of less than 100μm. Due to its ultra-thin nature, excellent bendability, and high scratch resistance, it has become a key material in the field of foldable flexible covers, following CPI (colorless polyimide) film. Currently, ultra-thin glass has been applied to foldable display terminals. Due to the existence of ultra-thin glass, the form factor of display terminals is no longer limited to flat bar phones or conventional flip phones, and is showing a trend of diversified and popular development.

[0003] The conventional production method of ultra-thin glass is to first etch and thin thick glass with a thickness between 0.2mm and 0.5mm to a thickness of less than 0.1mm. However, after thinning using the existing ultra-thin glass thinning process, two situations may occur. First, after thinning, all areas are thinned to the same thickness (i.e., the folding area and the non-folding area have the same thickness), resulting in the same strength and impact resistance of the folding area and the non-folding area, and the strength and impact resistance of the non-folding area cannot be improved; second, after chemical thinning, a "step" connection exists at the junction of the non-folding area and the folding area (i.e., the connection is not smooth), resulting in light and shadow, and damaged folding strength and toughness, making it difficult to meet the requirements of the number of folds and folding radius of ultra-thin glass. Summary of the Invention

[0004] The object of the present invention is to provide an ultra-thin glass and a thinning method thereof. The thinning method has a simple process and is easy to operate, and can make the thickness of the ultra-thin glass change gradually after thinning, thereby improving the problem of "steps" at the junction of the non-folding area and the folding area, and improving the processing yield of the ultra-thin glass.

[0005] The embodiment of the present invention is achieved as follows:

[0006] In one aspect of the present invention, a method for thinning ultra-thin glass is provided, the method comprising: cutting a motherboard into a plurality of ultra-thin glass substrates, wherein the size of the ultra-thin glass substrates is larger than the size of the target ultra-thin glass; immersing a first end of the ultra-thin glass substrate below the liquid surface of a thinning liquid and exposing a second end thereof above the liquid surface of the thinning liquid, and causing the ultra-thin glass substrate to perform a linear reciprocating motion relative to a direction perpendicular to the liquid surface of the thinning liquid, so that the second end of the ultra-thin glass substrate is at least partially immersed below the liquid surface of the thinning liquid and exposed above the liquid surface of the thinning liquid. The method comprises the following steps: repeatedly switching between being at least partially immersed in the thinning liquid and being above the liquid surface of the thinning liquid; immersing the second end of the ultra-thin glass substrate below the liquid surface of the thinning liquid and exposing the first end thereof at least partially above the liquid surface of the thinning liquid, and causing the ultra-thin glass substrate to perform a linear reciprocating motion relative to a direction perpendicular to the liquid surface of the thinning liquid, so that the first end of the ultra-thin glass substrate exposed above the liquid surface of the thinning liquid repeatedly switches between being at least partially immersed in the thinning liquid and being exposed above the liquid surface of the thinning liquid; and cutting the outer edge of the ultra-thin glass substrate after thinning to obtain the target ultra-thin glass. This thinning method is simple and easy to operate, and can cause the thickness of the ultra-thin glass to change gradually after thinning, thereby improving the problem of a "step" at the junction of the non-folding area and the folding area and improving the processing yield of the ultra-thin glass.

[0007] Optionally, the difference between the length of the ultra-thin glass substrate and the length of the target ultra-thin glass is between 2 cm and 4 cm; and / or the difference between the width of the ultra-thin glass substrate and the width of the target ultra-thin glass is between 1 cm and 2 cm.

[0008] Optionally, the thinning liquid is hydrofluoric acid, and the mass fraction of hydrofluoric acid is between 0.2% and 2.0%; and / or, the speed of the ultra-thin glass substrate performing linear reciprocating motion relative to the liquid surface direction perpendicular to the thinning liquid is between 0.1 mm / s and 10 mm / s.

[0009] Optionally, the target ultra-thin glass is symmetrically arranged about a first plane, and the first plane is a plane formed by a thickness direction of the target ultra-thin glass and a width direction of the target ultra-thin glass.

[0010] Optionally, the target ultra-thin glass is further symmetrically arranged about a second plane, where the second plane is a plane formed by the length direction of the target ultra-thin glass and the width direction of the target ultra-thin glass; and the target ultra-thin glass includes a first part and a second part arranged along its length direction and connected to each other, the thickness of the first part gradually decreases from the direction toward the second part, and the thickness of the second part gradually decreases from the direction toward the first part.

[0011] Optionally, the target ultra-thin glass is further symmetrically arranged about a second plane, where the second plane is a plane formed by the length direction of the target ultra-thin glass and the width direction of the target ultra-thin glass; and the target ultra-thin glass includes a first part, a second part, and a third part arranged along its length direction and connected in sequence; the thickness of the first part gradually decreases in the direction toward the second part, the thickness of the third part gradually decreases in the direction toward the second part, and the thickness of the second part, the end of the first part connected to the second part, and the thickness of the end of the third part connected to the second part are the same.

[0012] Optionally, after cutting the motherboard into multiple ultra-thin glass substrates, the size of the ultra-thin glass substrates being larger than the size of the target ultra-thin glass, the method further comprises: coating an acid-proof coating on one side of the ultra-thin glass substrate.

[0013] Another aspect of the present invention provides a method for thinning ultra-thin glass, comprising: cutting a mother board into a plurality of ultra-thin glass substrates, wherein the size of the ultra-thin glass substrates is larger than the size of the target ultra-thin glass; immersing a first end of the ultra-thin glass substrate below the liquid surface of a thinning liquid and exposing a second end thereof above the liquid surface of the thinning liquid, and causing the ultra-thin glass substrate to perform a linear reciprocating motion relative to a direction perpendicular to the liquid surface of the thinning liquid, so that the second end of the ultra-thin glass substrate is repeatedly cut between being at least partially immersed below the liquid surface of the thinning liquid and being exposed above the liquid surface of the thinning liquid. The method comprises the steps of: immersing a portion of the second end of the ultra-thin glass substrate below the liquid surface of the thinning liquid, while exposing the other portion of the second end of the ultra-thin glass substrate and the first end thereof above the liquid surface of the thinning liquid, and causing the ultra-thin glass substrate to perform a linear reciprocating motion relative to a direction perpendicular to the liquid surface of the thinning liquid, so that the other portion of the second end of the ultra-thin glass substrate is repeatedly switched between being at least partially immersed below the liquid surface of the thinning liquid and being exposed above the liquid surface of the thinning liquid; and cutting the outer edge of the ultra-thin glass substrate after thinning to obtain a target ultra-thin glass.

[0014] Optionally, the target ultra-thin glass is symmetrically arranged about a first plane, which is a plane formed by the thickness direction of the target ultra-thin glass and the width direction of the target ultra-thin glass; the target ultra-thin glass is also symmetrically arranged about a second plane, which is a plane formed by the length direction of the target ultra-thin glass and the width direction of the target ultra-thin glass; and the target ultra-thin glass includes a first part and a second part arranged along its length direction and connected to each other, the thickness of the first part gradually increases from the direction toward the second part, and the thickness of the second part gradually increases from the direction toward the first part.

[0015] Another aspect of the present invention provides an ultra-thin glass, which is prepared by the above-mentioned ultra-thin glass thinning method.

[0016] The beneficial effects of the present invention include:

[0017] The present application provides a method for thinning ultra-thin glass, comprising: cutting a motherboard into a plurality of ultra-thin glass substrates, wherein the size of the ultra-thin glass substrates is larger than the size of a target ultra-thin glass; immersing a first end of the ultra-thin glass substrate below the liquid surface of a thinning liquid and exposing a second end thereof above the liquid surface of the thinning liquid, and causing the ultra-thin glass substrate to perform a linear reciprocating motion relative to a direction perpendicular to the liquid surface of the thinning liquid, so that the second end of the ultra-thin glass substrate repeatedly switches between being at least partially immersed below the liquid surface of the thinning liquid and being exposed above the liquid surface of the thinning liquid; immersing the second end of the ultra-thin glass substrate below the liquid surface of the thinning liquid and exposing a first end thereof at least partially above the liquid surface of the thinning liquid, and causing the ultra-thin glass substrate to perform a linear reciprocating motion relative to a direction perpendicular to the liquid surface of the thinning liquid, so that the first end of the ultra-thin glass substrate exposed above the liquid surface repeatedly switches between being at least partially immersed below the liquid surface of the thinning liquid and being exposed above the liquid surface of the thinning liquid; and cutting the outer edge of the ultra-thin glass substrate after thinning to obtain the target ultra-thin glass. The present application involves first immersing one end of an ultra-thin glass substrate in a thinning liquid, and then moving the portion of the ultra-thin glass substrate exposed outside the thinning liquid up and down, so that the portion can switch between being immersed in the thinning liquid and being exposed to the thinning liquid; then the ultra-thin glass substrate is inverted and the same operation is performed; and finally, the outer edge of the ultra-thin glass substrate is removed. In this way, the thickness of the opposite ends of the ultra-thin glass substrate can exhibit a uniform gradient. This thinning method is simple and easy to operate, and can achieve a gradual change in the thickness of the ultra-thin glass after thinning, thereby improving the problem of "steps" at the junction of the non-folding area and the folding area and improving the processing yield of the ultra-thin glass. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 One of the flow charts of the method for thinning ultra-thin glass provided in an embodiment of the present invention;

[0020] Figure 2 A second flow chart of the method for thinning ultra-thin glass provided in an embodiment of the present invention;

[0021] Figure 3 A diagram illustrating a first preparation process of the method for thinning ultra-thin glass provided in an embodiment of the present invention;

[0022] Figure 4 A diagram illustrating a second preparation process of the method for thinning ultra-thin glass provided in an embodiment of the present invention;

[0023] Figure 5 A diagram illustrating a third preparation process of the method for thinning ultra-thin glass provided in an embodiment of the present invention;

[0024] Figure 6 This is a schematic diagram of the structure of the ultra-thin glass substrate and base provided in an embodiment of the present invention;

[0025] Figure 7 The second structural diagram of the ultra-thin glass substrate and base provided by an embodiment of the present invention;

[0026] Figure 8 The third structural diagram of the ultra-thin glass substrate and base provided by an embodiment of the present invention;

[0027] Figure 9 A fourth structural diagram of an ultra-thin glass substrate and a base provided in an embodiment of the present invention;

[0028] Figure 10 The fifth structural diagram of the ultra-thin glass substrate and base provided by an embodiment of the present invention;

[0029] Figure 11 A schematic structural diagram of a loading box, an ultra-thin glass substrate, and a metal frame provided in an embodiment of the present invention;

[0030] Figure 12 A third flow chart of the method for thinning ultra-thin glass provided in an embodiment of the present invention;

[0031] Figure 13 This is a diagram of the fourth preparation process of the ultra-thin glass thinning method provided in an embodiment of the present invention.

[0032] Icon: 10-ultra-thin glass substrate; 11-first end; 12-second end; 20-base; 30-robotic arm; 40-lifting mechanism; 50-loading box; 61-immersion area; 62-semi-immersion area; 63-non-immersion area; 70-metal frame. DETAILED DESCRIPTION

[0033] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0034] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0035] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0036] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" and the like indicate positions or locations based on the positions shown in the accompanying drawings, or the positions or locations in which the inventive product is typically placed when in use. These terms are intended solely to facilitate the description of the present invention and to simplify the description, and are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third," etc., are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0037] Furthermore, terms such as "horizontal" and "vertical" do not necessarily mean that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0038] In the description of the present invention, it should also be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections or electrical connections; they may refer to direct connections or indirect connections through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0039] Please refer to Figure 1 This embodiment provides a method for thinning ultra-thin glass, which includes the following steps:

[0040] S100 , cutting the motherboard into multiple ultra-thin glass substrates 10 , wherein the size of the ultra-thin glass substrates 10 is larger than the size of the target ultra-thin glass.

[0041] That is, a large motherboard (i.e., raw glass) is first cut into multiple ultra-thin glass substrates 10. It should be noted that a large-sized motherboard can be cut into multiple ultra-thin glass substrates 10 of smaller sizes. This application does not limit the number of ultra-thin glass substrates 10 obtained by cutting the motherboard. The user can customize the size of the ultra-thin glass substrate 10, and the size of the ultra-thin glass substrate 10 is determined by the size of the target ultra-thin glass. The target ultra-thin glass is the ultra-thin glass to be ultimately formed.

[0042] Generally, the size of the target ultra-thin glass is slightly larger than that of the ultra-thin glass substrate 10, so that the edge of the ultra-thin glass substrate 10 can be removed after the subsequent thinning process. It should be noted that after the ultra-thin glass substrate 10 is thinned, there will be a clear boundary between the unthinned area and the thinned area. In order to improve the performance of the target ultra-thin glass and make the thickness of the target ultra-thin glass obtained ultimately uniform and gradual, in this embodiment, it is necessary to remove the edge of the ultra-thin glass substrate 10 after thinning to remove the clear boundary between the thinned area and the unthinned area of ​​the ultra-thin glass substrate 10. Therefore, the size of the ultra-thin glass substrate 10 obtained after cutting the motherboard in this application should be larger than the size of the target ultra-thin glass.

[0043] Illustratively, the difference between the length of the ultra-thin glass substrate 10 and the length of the target ultra-thin glass is between 2 cm and 4 cm; and / or the difference between the width of the ultra-thin glass substrate 10 and the width of the target ultra-thin glass is between 1 cm and 2 cm.

[0044] That is, the length of the ultra-thin glass substrate 10 is between 2 cm and 4 cm greater than the length of the target ultra-thin glass, and the width of the ultra-thin glass substrate 10 is between 1 cm and 2 cm greater than the width of the target ultra-thin glass. In addition, in this embodiment, the arc radii of the four corners of the ultra-thin glass substrate 10 remain consistent.

[0045] Furthermore, the present application does not limit the cutting method of the motherboard, and may be chemical cutting, mechanical cutting, laser cutting, or a combination of at least two cutting methods. To simplify the steps, facilitate operation, and improve cutting efficiency, laser cutting may be used to cut the motherboard.

[0046] S200, immersing the first end 11 of the ultra-thin glass substrate 10 below the liquid surface of the thinning liquid and exposing the second end 12 thereof above the liquid surface of the thinning liquid, and causing the ultra-thin glass substrate 10 to perform a linear reciprocating motion relative to a direction perpendicular to the liquid surface of the thinning liquid, so that the second end 12 of the ultra-thin glass substrate 10 repeatedly switches between being at least partially immersed below the liquid surface of the thinning liquid and being exposed above the liquid surface of the thinning liquid.

[0047] It should be noted that, first, the ultra-thin glass substrate 10 includes a first end 11 and a second end 12 that are opposite to each other. Step S200 involves first inserting the first end 11 of the ultra-thin glass substrate 10 below the surface of the thinning liquid and then exposing the second end 12 above the surface. In short, a portion of the ultra-thin glass substrate 10 is inserted into the thinning liquid, while the other portion is exposed outside the thinning liquid.

[0048] Then, the ultra-thin glass substrate 10 is made to perform linear reciprocating motion relative to the liquid surface of the thinning liquid, so that the second end 12 of the ultra-thin glass substrate 10 can be switched back and forth between being at least partially immersed in the thinning liquid and being completely exposed outside the thinning liquid. Figures 3 to 5 The immersion area 61 in the figure is the area where the thinning liquid is located, the semi-immersion area 62 is the area where the ultra-thin glass substrate 10 can switch between the immersion area 61 and the area outside the immersion area 61, the junction of the immersion area 61 and the semi-immersion area 62 is the liquid surface of the thinning liquid, and the non-immersion area 63 is the area where the ultra-thin glass substrate 10 is located when it is vertically reciprocating relative to the thinning liquid surface.

[0049] That is to say, when the second end 12 of the ultra-thin glass substrate 10 can switch back and forth between being at least partially immersed in the thinning liquid and being completely exposed outside the thinning liquid, the ultra-thin glass substrate 10 in the immersion area 61 is always located in the thinning liquid; the ultra-thin glass substrate 10 in the semi-immersion area 62 can perform a linear reciprocating motion relative to a direction perpendicular to the liquid surface of the thinning liquid, so that it is sometimes located in the immersion area 61 and sometimes outside the immersion area 61; the ultra-thin glass substrate 10 in the non-immersion area 63 is always located outside the immersion area 61 (that is, located above the liquid surface of the thinning liquid).

[0050] Second, when the second end 12 of the ultra-thin glass substrate 10 can be switched back and forth between being at least partially immersed in the thinning liquid and being completely exposed outside the thinning liquid, the thickness of this portion of the ultra-thin glass substrate 10 will change linearly (i.e., uniformly and gradually) under the action of the thinning liquid, such as Figures 3 to 5 The specific thinning degree can be determined by limiting the concentration of the thinning liquid, the time of immersion in the thinning liquid, etc. This application does not impose specific restrictions, and those skilled in the art can determine it according to actual conditions.

[0051] Third, after step S200, the thickness of the first end 11 of the ultra-thin glass substrate 10 will become thinner and uniform at all locations, and the thickness of the second end 12 will become thinner linearly and uniformly. Figure 3 (b) Figure 4 (b) and Figure 5 (b) in the.

[0052] Fourth, the above-mentioned ultra-thin glass substrate 10 performs a linear reciprocating motion relative to the liquid surface direction perpendicular to the thinning liquid. In this embodiment, the ultra-thin glass substrate 10 can be driven to move toward the thinning liquid, or the thinning liquid can be driven to move toward the ultra-thin glass substrate 10. The present application does not limit the subject of movement, as long as the ultra-thin glass substrate 10 can move relative to the thinning liquid so that it can switch between extending into the thinning liquid and being exposed outside the thinning liquid.

[0053] For example, Figure 6 and Figure 7 As shown, in the first method, the thinning liquid can be set in a receiving groove in the base 20, and the ultra-thin glass substrate 10 can be clamped by a glass clamp. The clamp is connected to a robotic arm 30 above the clamp, and the ultra-thin glass substrate 10 is driven by the robotic arm 30 to move toward the receiving groove so as to be immersed in the thinning liquid or exposed from the thinning liquid.

[0054] In the second method, if Figure 8 , the ultra-thin glass substrate 10 can be clamped by using a glass clamp, and a robotic arm 30 is connected above the clamp, and the robotic arm 30 is stationary; a lifting mechanism 40 (such as a jack) is set on the base 20, and the lifting mechanism 40 is used to drive the base 20 to move up and down, so that the thinning liquid and the ultra-thin glass substrate 10 move relative to each other.

[0055] In the third method, if Figure 9 The ultra-thin glass substrate 10 can be placed in a loading box 50 (the structure of the loading box 50 is not limited, as long as it can relatively limit the ultra-thin glass substrate 10), so that the ultra-thin glass substrate 10 is in a vertical state; the loading box 50 is placed in a metal frame 70, and the metal frame 70 brings the ultra-thin glass substrate 10 into the receiving groove of the base 20; the metal frame 70 is connected to a robotic arm 30 above, and the robotic arm 30 drives the ultra-thin glass substrate 10 to perform up and down reciprocating motion.

[0056] In the fourth method, if Figure 10 The ultra-thin glass substrate 10 is placed in a loading box 50 (the structure of the loading box 50 is not limited, as long as it can relatively position the ultra-thin glass substrate 10), so that the ultra-thin glass substrate 10 is in a vertical position; the loading box 50 is placed in a metal frame 70, and the metal frame 70 brings the ultra-thin glass substrate 10 into the receiving groove of the base 20; the metal frame 70 is fixed in the receiving groove of the base 20. A lifting mechanism 40 (such as a jack) is provided on the base 20 to drive the base 20 up and down, thereby causing the thinning liquid and the ultra-thin glass substrate 10 to move relative to each other.

[0057] The specific structures of the loading box 50 and the metal frame 70 are not limited and can be configured by those skilled in the art. Figure 11The structures of the loading box 50 and the metal frame 70 shown are for illustration only.

[0058] S300, immersing the second end 12 of the ultra-thin glass substrate 10 below the liquid surface of the thinning liquid and at least partially exposing the first end 11 thereof above the liquid surface of the thinning liquid, and causing the ultra-thin glass substrate 10 to perform a linear reciprocating motion relative to a direction perpendicular to the liquid surface of the thinning liquid, so that the first end 11 of the ultra-thin glass substrate 10 exposed above the liquid surface of the thinning liquid repeatedly switches between being at least partially immersed below the liquid surface of the thinning liquid and being exposed above the liquid surface of the thinning liquid.

[0059] That is, the ultra-thin glass substrate 10 after the thinning process in step S200 is inverted so that the second end 12 is immersed below the liquid surface of the thinning liquid and at least a portion of the first end 11 is exposed above the liquid surface of the thinning liquid. It should be noted that in this step, the first end 11 can be completely exposed above the liquid surface of the thinning liquid (e.g., Figure 3 As shown), it can also be partially immersed in the liquid surface of the thinning liquid and the other part is exposed above the liquid surface of the thinning liquid (as shown Figure 4 and Figure 5 shown).

[0060] It should be noted that the principles of step S300 and step S200 are the same, the only difference is that step S300 is to invert the ultra-thin glass substrate 10 obtained in step S200 and then perform thinning treatment. Therefore, please refer to the previous description for the same places, and the same situation will not be explained here.

[0061] In this embodiment, in step S300, the ultra-thin glass substrate 10 obtained in step S200 is inverted and immersed in the thinning liquid. The length of the ultra-thin glass substrate 10 is the same as the length of the ultra-thin glass substrate 10 immersed in the thinning liquid in step S200. Figures 3 to 5 As shown, the ultra-thin glass substrate 10 after thinning in step S200 and step S300 will be symmetrically arranged, and the thickness will be uniformly gradient.

[0062] Furthermore, optionally, the thinning liquid is hydrofluoric acid, and the mass fraction of the hydrofluoric acid is between 0.2% and 2.0%. For example, the mass fraction of the hydrofluoric acid is 0.2%, 0.5%, 1.0%, 1.5% or 2.0%.

[0063] Optionally, in steps S200 and S300, the ultra-thin glass substrate 10 performs a linear reciprocating motion relative to a direction perpendicular to the liquid surface of the thinning liquid at a speed between 0.1 mm / s and 10 mm / s. For example, the speed may be 0.1 mm / s, 1 mm / s, 2 mm / s, 5 mm / s, 8 mm / s, or 10 mm / s.

[0064] S400 , cutting the outer edge of the ultra-thin glass substrate 10 after thinning to obtain target ultra-thin glass.

[0065] It should be noted that due to the surface tension and viscosity of the liquid, the ultra-thin glass substrate 10 after thinning has obvious thinning marks at the junction of the thinned area and the unthinned area at the upper and lower ends, that is, the junction is stepped rather than a uniform linear slope. Therefore, the present application needs to remove this part after the thinning process to obtain an ultra-thin glass with a uniform and gradual thickness as a finished product.

[0066] In summary, the present application provides a method for thinning ultra-thin glass, comprising: cutting a motherboard into a plurality of ultra-thin glass substrates 10, wherein the size of the ultra-thin glass substrates 10 is larger than the size of the target ultra-thin glass; immersing a first end 11 of the ultra-thin glass substrate 10 below the liquid surface of a thinning liquid and exposing a second end 12 thereof above the liquid surface of the thinning liquid, and causing the ultra-thin glass substrate 10 to perform a linear reciprocating motion relative to a direction perpendicular to the liquid surface of the thinning liquid, so that the second end 12 of the ultra-thin glass substrate 10 is at least partially immersed in the liquid surface of the thinning liquid and exposed above the liquid surface of the thinning liquid. The second end 12 of the ultra-thin glass substrate 10 is immersed in the liquid surface of the thinning liquid, and the first end 11 thereof is at least partially exposed above the liquid surface of the thinning liquid, and the ultra-thin glass substrate 10 is subjected to a linear reciprocating motion relative to a direction perpendicular to the liquid surface of the thinning liquid, so that the first end 11 of the ultra-thin glass substrate 10 exposed above the liquid surface of the thinning liquid is repeatedly switched between being at least partially immersed in the liquid surface of the thinning liquid and being exposed above the liquid surface of the thinning liquid; the outer edge of the ultra-thin glass substrate 10 after thinning is cut to obtain the target ultra-thin glass. The present application involves first immersing one end of an ultra-thin glass substrate 10 in a thinning liquid, and allowing the portion of the ultra-thin glass substrate 10 exposed outside the thinning liquid to move up and down, so that the portion can switch between being immersed in the thinning liquid and being exposed to the thinning liquid; then the ultra-thin glass substrate 10 is inverted and the same operation is performed; and finally, the outer edge of the ultra-thin glass substrate 10 is removed. In this way, the thickness of the opposite ends of the ultra-thin glass substrate 10 can be uniformly and gradually changed. This thinning method is simple and easy to operate, and can make the thickness of the ultra-thin glass change gradually after thinning, thereby improving the problem of "steps" at the junction of the non-folding area and the folding area, and improving the processing yield of the ultra-thin glass.

[0067] It should be noted that the target ultra-thin glass with a gradient thickness obtained in the above steps has different thicknesses at different places. In this way, the target ultra-thin glass can have different thicknesses. In this way, areas of different thicknesses can be used as folding areas and non-folding areas respectively. The specific positions and sizes of the folding areas and non-folding areas can be set by technicians in this field according to actual needs, and this application does not impose any restrictions.

[0068] Please refer to Figures 3 to 5Optionally, the target ultra-thin glass is symmetrically arranged about a first plane, and the first plane is a plane formed by a thickness direction of the target ultra-thin glass and a width direction of the target ultra-thin glass.

[0069] Please refer to Figure 1 and Figure 3 Optionally, the target ultra-thin glass is further symmetrically arranged about a second plane, where the second plane is a plane formed by the length direction of the target ultra-thin glass and the width direction of the target ultra-thin glass; and the target ultra-thin glass includes a first part and a second part arranged along its length direction and connected to each other, the thickness of the first part gradually decreases toward the second part, and the thickness of the second part gradually decreases toward the first part.

[0070] The target ultra-thin glass can be realized by the following method: first perform step S100, then perform step S200 (such as Figure 3 (a) and (b) in step S200, when the first end 11 of the ultra-thin glass substrate 10 is placed under the liquid surface of the thinning liquid, the center line of the ultra-thin glass substrate 10 should be flush with the liquid surface of the thinning liquid), and when step S300 (such as Figure 3 (c) and (d) in step S300, when the second end 12 of the ultra-thin glass substrate 10 is placed below the liquid surface of the thinning liquid, the centerline of the ultra-thin glass substrate 10 should be flush with the liquid surface of the thinning liquid, and then step S400 is performed. It should also be noted that in steps S200 and S300, the amplitude, speed, and duration of the linear reciprocating motion of the ultra-thin glass substrate 10 relative to the direction perpendicular to the liquid surface of the thinning liquid are the same.

[0071] Please refer to Figure 1 and Figure 4 Optionally, the target ultra-thin glass is further symmetrically arranged about a second plane, where the second plane is a plane formed by the length direction of the target ultra-thin glass and the width direction of the target ultra-thin glass; and the target ultra-thin glass includes a first part, a second part, and a third part arranged along its length direction and connected in sequence; the thickness of the first part gradually decreases toward the second part, the thickness of the third part gradually decreases toward the second part, and the thickness of the second part, the end of the first part connected to the second part, and the thickness of the end of the third part connected to the second part are the same.

[0072] The target ultra-thin glass can be realized by the following method: first perform step S100, then perform step S200 (such as Figure 4(a) and (b) in step S200, when the first end 11 of the ultra-thin glass substrate 10 is placed below the liquid surface of the thinning liquid, the center line of the ultra-thin glass substrate 10 should be set below the liquid surface of the thinning liquid, for example, 2 cm below the liquid surface). Figure 4 (c) and (d) in step S300, when the second end 12 of the ultra-thin glass substrate 10 is placed below the liquid surface of the thinning liquid, the centerline of the ultra-thin glass substrate 10 should also be positioned below the liquid surface of the thinning liquid, for example, 2 cm), and then step S400 is performed. It should also be noted that in steps S200 and S300, the amplitude, speed, and duration of the linear reciprocating motion of the ultra-thin glass substrate 10 relative to a direction perpendicular to the liquid surface of the thinning liquid are the same.

[0073] Please refer to Figure 2 and Figure 5 Optionally, after the motherboard is cut into multiple ultra-thin glass substrates 10 in step S100, and the size of the ultra-thin glass substrates 10 is larger than the size of the target ultra-thin glass, the method further comprises the following steps:

[0074] S500 , coating an acid-proof coating on one side of the ultra-thin glass substrate 10 .

[0075] It should be noted that, first, the present application sets step S500 after step S100 and before step S200, so that the ultra-thin glass substrate 10 can be thinned on one side. Specifically, those skilled in the art can select the coating surface of the acid-proof coating according to actual needs.

[0076] Second, under this method, the present application does not impose any restrictions on the relative positions of the center line of the ultra-thin glass substrate 10 and the liquid surface of the thinning liquid when the first end 11 of the ultra-thin glass substrate 10 is immersed in the thinning liquid in step S200 (for example, they can be flush, or one can be higher than the other). When the second end 12 of the ultra-thin glass substrate 10 is immersed in the thinning liquid in step S300, the relative positions of the center line of the ultra-thin glass substrate 10 and the liquid surface of the thinning liquid are also not imposed (for example, they can be flush, or one can be higher than the other). As long as the length of immersion in the thinning liquid is the same in step S200 and step S300, it is sufficient. Figure 5 The example is given below the liquid level of the thinning liquid, where the center line of the ultra-thin glass substrate 10 is located. Figure 5 In, such as Figure 5 (a) and (b) in step S200, when the first end 11 of the ultra-thin glass substrate 10 is placed below the liquid surface of the thinning liquid, the center line of the ultra-thin glass substrate 10 is located below the liquid surface of the thinning liquid; Figure 5(c) and (d), in step S300, when the second end 12 of the ultra-thin glass substrate 10 is placed below the liquid surface of the thinning liquid, the center line of the ultra-thin glass substrate 10 is located below the liquid surface of the thinning liquid).

[0077] Please refer to Figure 12 Another aspect of the present invention provides another method for thinning ultra-thin glass, comprising:

[0078] S101 , cutting a motherboard into multiple ultra-thin glass substrates 10 , wherein the size of the ultra-thin glass substrates 10 is larger than the size of the target ultra-thin glass.

[0079] This step is the same as the above-mentioned step S100. The same parts will not be explained here. For details, please refer to the relevant description in the above text.

[0080] S201, immersing the first end 11 of the ultra-thin glass substrate 10 below the liquid surface of the thinning liquid and exposing the second end 12 thereof above the liquid surface of the thinning liquid, and causing the ultra-thin glass substrate 10 to perform a linear reciprocating motion relative to a direction perpendicular to the liquid surface of the thinning liquid, so that the second end 12 of the ultra-thin glass substrate 10 repeatedly switches between being at least partially immersed below the liquid surface of the thinning liquid and being exposed above the liquid surface of the thinning liquid.

[0081] This step is the same as the above-mentioned step S200. The same parts will not be repeated here in this application. For details, please refer to the relevant description in the previous text.

[0082] S301, immersing a portion of the second end 12 of the ultra-thin glass substrate 10 below the liquid surface of the thinning liquid, while exposing the other portion of the second end 12 and the first end 11 of the ultra-thin glass substrate 10 above the liquid surface of the thinning liquid, and causing the ultra-thin glass substrate 10 to perform a linear reciprocating motion relative to a direction perpendicular to the liquid surface of the thinning liquid, so that the other portion of the second end 12 of the ultra-thin glass substrate 10 repeatedly switches between being at least partially immersed below the liquid surface of the thinning liquid and being exposed above the liquid surface of the thinning liquid.

[0083] The difference between this step and the above step S300 is that in step S301 , a portion of the second end 12 is immersed under the liquid surface of the thinning liquid, and the other portion of the second end 12 and the first end 11 are exposed outside the thinning liquid.

[0084] In step S300, the second end 12 is completely immersed in the thinning liquid. The first end 11 can be completely exposed outside the thinning liquid, or a portion of the first end 11 can be exposed outside the thinning liquid and the other portion can be immersed in the thinning liquid.

[0085] The rest of the parts are the same, so the same parts will not be described here to avoid repetition.

[0086] S401 , cutting the outer edge of the ultra-thin glass substrate 10 after thinning to obtain target ultra-thin glass.

[0087] The parts in step S401 that are the same as those in step S400 will not be described again in this application. For example, the basis and method for cutting the outer edge of the ultra-thin glass substrate 10 can be found in the above description.

[0088] Please refer to Figure 12 and Figure 13 Optionally, the target ultra-thin glass is further symmetrically arranged about a second plane, where the second plane is a plane formed by the length direction of the target ultra-thin glass and the width direction of the target ultra-thin glass; and the target ultra-thin glass includes a first part and a second part arranged along its length direction and connected to each other, the thickness of the first part gradually increases from the direction toward the second part, and the thickness of the second part gradually increases from the direction toward the first part.

[0089] The target ultra-thin glass can be realized by the following method: first perform step S101, then perform step S201 (such as Figure 13 (a) and (b) in step S201, when the first end 11 of the ultra-thin glass substrate 10 is placed below the liquid surface of the thinning liquid, the center line of the ultra-thin glass substrate 10 should be set above the liquid surface of the thinning liquid). Figure 13 In (c) and (d), when a portion of the second end 12 of the ultra-thin glass substrate 10 is immersed in the thinning liquid in step S301, the center line of the ultra-thin glass substrate 10 should also be set above the thinning liquid. In this embodiment, the lengths of the portions immersed in the thinning liquid in steps S201 and S301 are the same. Figure 13 ), then execute step S401. Also, it should be noted that in step S201 and step S301, the ultra-thin glass substrate 10 performs a linear reciprocating motion relative to the direction perpendicular to the liquid surface of the thinning liquid with the same conditions such as the amplitude, speed and duration.

[0090] Another aspect of the present invention provides an ultra-thin glass, which is prepared by the above-mentioned ultra-thin glass thinning method.

[0091] It should be noted that the ultra-thin glass may be prepared by the thinning method of the ultra-thin glass provided in steps S100 to S400, or may be prepared by the thinning method of the ultra-thin glass provided in steps S101 to S401, and this application does not impose any limitation.

[0092] Since the specific steps and effects of the above-mentioned steps S100 to S400, as well as the specific steps and effects of steps S101 to S401 have been explained in detail above, they will not be repeated here in this application.

[0093] The foregoing description is merely an optional embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

[0094] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any appropriate manner without contradiction. In order to avoid unnecessary repetition, the present invention will not further describe various possible combinations.

Claims

1. A method for thinning ultra-thin glass, characterized in that: include: Cutting the motherboard into multiple ultra-thin glass substrates, wherein the size of the ultra-thin glass substrates is larger than the size of the target ultra-thin glass; Immersing a first end of the ultra-thin glass substrate below the surface of a thinning liquid and exposing a second end thereof above the surface of the thinning liquid, and causing the ultra-thin glass substrate to perform a linear reciprocating motion relative to a direction perpendicular to the surface of the thinning liquid, such that the second end of the ultra-thin glass substrate repeatedly switches between being at least partially immersed below the surface of the thinning liquid and being exposed above the surface of the thinning liquid; The second end of the ultra-thin glass substrate is immersed in a thinning liquid and the first end thereof is at least partially exposed above the thinning liquid surface, and the ultra-thin glass substrate is subjected to a linear reciprocating motion relative to a direction perpendicular to the thinning liquid surface, so that the first end of the ultra-thin glass substrate exposed above the thinning liquid surface repeatedly switches between being at least partially immersed in the thinning liquid surface and being exposed above the thinning liquid surface; The outer edge of the ultra-thin glass substrate after thinning is cut to remove the stepped slope at the junction of the thinned area and the unthinned area, so as to obtain the target ultra-thin glass with uniform and gradual thickness.

2. The method for thinning ultra-thin glass according to claim 1, wherein: The difference between the length of the ultra-thin glass substrate and the length of the target ultra-thin glass is between 2 cm and 4 cm; and / or the difference between the width of the ultra-thin glass substrate and the width of the target ultra-thin glass is between 1 cm and 2 cm.

3. The method for thinning ultra-thin glass according to claim 1, wherein: The thinning liquid is hydrofluoric acid, and the mass fraction of the hydrofluoric acid is between 0.2% and 2.0%; and / or the speed of the linear reciprocating motion of the ultra-thin glass substrate relative to the liquid surface direction perpendicular to the thinning liquid is between 0.1 mm / s and 10 mm / s.

4. The method for thinning ultra-thin glass according to claim 1, wherein: The target ultra-thin glass is symmetrically arranged about a first plane, and the first plane is a plane formed by a thickness direction of the target ultra-thin glass and a width direction of the target ultra-thin glass.

5. The method for thinning ultra-thin glass according to claim 4, characterized in that: The target ultra-thin glass is further symmetrically arranged about a second plane, where the second plane is a plane formed by the length direction of the target ultra-thin glass and the width direction of the target ultra-thin glass; and the target ultra-thin glass includes a first portion and a second portion arranged along its length direction and connected to each other, wherein the thickness of the first portion gradually decreases toward the second portion, and the thickness of the second portion gradually decreases toward the first portion.

6. The method for thinning ultra-thin glass according to claim 4, characterized in that: The target ultra-thin glass is also symmetrically arranged about a second plane, which is a plane formed by the length direction of the target ultra-thin glass and the width direction of the target ultra-thin glass; and the target ultra-thin glass includes a first part, a second part, and a third part arranged along its length direction and connected in sequence; the thickness of the first part gradually decreases toward the second part, the thickness of the third part gradually decreases toward the second part, and the thickness of the second part, the end of the first part connected to the second part, and the thickness of the end of the third part connected to the second part are the same.

7. The method for thinning ultra-thin glass according to any one of claims 4 to 6, characterized in that: After cutting the motherboard into a plurality of ultra-thin glass substrates, wherein the size of the ultra-thin glass substrates is larger than the size of the target ultra-thin glass, the method further comprises: An acid-proof coating is applied on one side of the ultra-thin glass substrate.

8. A method for thinning ultra-thin glass, characterized in that: include: Cutting the motherboard into multiple ultra-thin glass substrates, wherein the size of the ultra-thin glass substrates is larger than the size of the target ultra-thin glass; Immersing a first end of the ultra-thin glass substrate below the surface of a thinning liquid and exposing a second end thereof above the surface of the thinning liquid, and causing the ultra-thin glass substrate to perform a linear reciprocating motion relative to a direction perpendicular to the surface of the thinning liquid, such that the second end of the ultra-thin glass substrate repeatedly switches between being at least partially immersed below the surface of the thinning liquid and being exposed above the surface of the thinning liquid; immersing a portion of the second end of the ultra-thin glass substrate below the surface of a thinning liquid, while exposing the other portion of the second end of the ultra-thin glass substrate and the first end thereof above the surface of the thinning liquid, and causing the ultra-thin glass substrate to perform a linear reciprocating motion relative to a direction perpendicular to the surface of the thinning liquid, so that the other portion of the second end of the ultra-thin glass substrate repeatedly switches between being at least partially immersed below the surface of the thinning liquid and being exposed above the surface of the thinning liquid; The outer edge of the ultra-thin glass substrate after thinning is cut to remove the stepped slope at the junction of the thinned area and the unthinned area, so as to obtain the target ultra-thin glass with uniform and gradual thickness.

9. The method for thinning ultra-thin glass according to claim 8, characterized in that: The target ultra-thin glass is symmetrically arranged about a first plane, where the first plane is a plane formed by a thickness direction of the target ultra-thin glass and a width direction of the target ultra-thin glass; the target ultra-thin glass is also symmetrically arranged about a second plane, where the second plane is a plane formed by a length direction of the target ultra-thin glass and a width direction of the target ultra-thin glass; and the target ultra-thin glass includes a first portion and a second portion arranged along its length direction and connected to each other, the thickness of the first portion gradually increases from a direction toward the second portion, and the thickness of the second portion gradually increases from a direction toward the first portion.

10. An ultra-thin glass, characterized in that: The ultra-thin glass is prepared by the thinning method of any one of claims 1 to 7.

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