An inspection apparatus for semiconductor devices and an inspection method thereof

By designing testing equipment for semiconductor components, acid washing is used to remove the oxide layer and flexible metal strips are used to connect the leads, solving the problem of the oxide layer affecting the accuracy of testing and realizing lead repair and efficient automated testing.

CN116482502BActive Publication Date: 2025-11-21HUBEI UNIV OF TECH
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Patent Information

Application Number
CN202310472313.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-04-27
Publication Date
2025-11-21
Estimated Expiration
2043-04-27

AI Technical Summary

Technical Problem

In existing semiconductor component resistance testing, the oxide layer on the lead surface forms impedance, affecting the accuracy of the measurement results. Furthermore, the leads are prone to bending after being pressed by the testing mechanism, which fails to meet product quality requirements.

Method used

An inspection device was designed, comprising a conveyor belt, a clamping mechanism, an acid pickling mechanism, a lead wire treatment mechanism, and a testing mechanism. The device removes the oxide layer by acid pickling, connects the lead wire using an elastic metal strip for inspection, and repairs bent lead wires using clamping rollers.

Benefits of technology

It enables automated connection testing of semiconductor components, improves testing accuracy, repairs bent leads, and meets the requirements of high-efficiency automated testing.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to the field of testing, and discloses a detection device for semiconductor elements and a detection method thereof. The detection device comprises two parallel conveying belts, a detection box and a first adjusting mechanism. A clamping mechanism is arranged on the conveying belt. The clamping mechanism comprises a clamping seat and an elastic clamping jaw. The length direction of the clamping seat is perpendicular to the conveying direction of the conveying belt. The elastic clamping jaw is arranged on the upper end of the clamping seat. The elastic clamping jaw is used for clamping the package of the element. The element is in a lying state with the lead wires at both ends extending out of the clamping seat on the clamping seat. An acid pickling mechanism, a lead wire processing mechanism and a testing mechanism are arranged in the detection box. The acid pickling mechanism, the lead wire processing mechanism and the testing mechanism are distributed along the conveying direction of the conveying belt. The application can realize the function of automatic on-off testing of the semiconductor elements, has high testing efficiency, can remove the lead wire oxide layer of the element, effectively improves the testing accuracy, can repair the bent lead wire in the testing process, and meets the requirements of the high-efficiency automatic testing.
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Description

TECHNICAL FIELD

[0001] The present application relates to the field of testing, more particularly, it relates to a detection device for semiconductor elements and a detection method thereof. BACKGROUND

[0002] Semiconductor elements are electronic elements that have electrical conductivity between that of a good conductor and an insulator, and that use the special electrical characteristics of semiconductor materials to achieve a specific function. Semiconductor elements are basic elements in electronic circuits, and are usually individually packaged and have two or more leads or metal contacts.

[0003] One type of semiconductor element has a long strip-shaped package, and has a straight lead at each end of the package. After this type of semiconductor element is manufactured, it needs to be subjected to resistance detection. A common detection method is to connect the leads at both ends to perform detection. However, since the leads at both ends of this type of more precise element are usually metal, the surface of the leads has an oxide layer. When the electronic element is subjected to resistance measurement, the oxide layer forms impedance, which interferes with the detection result and affects the accuracy of the measurement result. Moreover, after the leads at both ends are pressed by the testing mechanism, they are bent, which causes the leads to deform and cannot meet the current product quality requirements. SUMMARY

[0004] The present application provides a detection device for semiconductor elements, which comprises two parallel conveying belts, a detection box and a first adjusting mechanism. The upper surface of the conveying belt is horizontally arranged, and the upper surface of the conveying belt is inserted into the detection box. A clamping mechanism is installed on the conveying belt. The clamping mechanism comprises a clamping seat and a resilient jaw. The length direction of the clamping seat is perpendicular to the conveying direction of the conveying belt. The resilient jaw is installed on the upper end of the clamping seat. The resilient jaw is used to clamp the package of the element. The element is in a flat state with the leads at both ends extending out of the clamping seat on the clamping seat.

[0005] An acid washing mechanism, a lead processing mechanism and a testing mechanism are installed in the detection box. The acid washing mechanism, the lead processing mechanism and the testing mechanism are distributed along the conveying direction of the conveying belt.

[0006] The lead processing mechanism comprises a flushing assembly and a drying assembly. The flushing assembly is used to flush the acid washing liquid on the leads. The drying assembly is used to dry the leads.

[0007] The clamping mechanism further comprises a fixed sleeve, a supporting sleeve and a rotating shaft, the supporting sleeve is fixedly connected with the clamping seat at the upper end, the fixed sleeve is fixedly installed on the two conveying belts at the lower end, the fixed sleeve and the supporting sleeve are arranged in matching correspondence, the supporting sleeve is fixedly connected with the rotating shaft at the lower end, the rotating shaft is rotatably installed on the fixed sleeve at both ends, the rotating shaft is horizontally arranged and arranged along the conveying direction of the conveying belt, the pickling mechanism comprises two pickling tanks, the two pickling tanks are spaced apart along the conveying direction of the conveying belt, and the two pickling tanks are arranged on the two sides of the conveying belt, and the detection box further comprises a first adjusting mechanism, the first adjusting mechanism is used for adjusting the reciprocating rotation of the rotating shaft, so that the lead wires at both ends of the element on the clamping seat can be respectively inserted into the corresponding pickling tank.

[0008] The clamping mechanism is equidistantly spaced apart along the conveying direction of the conveying belt.

[0009] The lower end of the supporting sleeve is provided with an A passive rod on both sides, the axes of the two A passive rods are collinear, the A passive rod is horizontally arranged, the A passive rod and the rotating shaft are vertically distributed, the rotating shaft is connected with an A torsion spring, the A torsion spring is installed on the fixed sleeve, and the A torsion spring is used to maintain the rotating shaft stationary to maintain the clamping seat in a horizontal distribution state.

[0010] The first adjusting mechanism comprises two guide rails, namely an A guide rail and a B guide rail, the A guide rail, the B guide rail and the two A passive rods are arranged in correspondence, the A guide rail is composed of an A1 segment and an A2 segment, the B guide rail is composed of a B1 segment and a B2 segment, the A1 segment is arranged obliquely upward, the B1 segment is arranged obliquely downward, the lengths of the A1 segment and the B1 segment are the same, and the inclination angles are the same, the A2 segment is arranged obliquely downward, the B2 segment is arranged obliquely upward, the lengths of the A2 segment and the B2 segment are the same, and the inclination angles are the same, and the length of the A2 segment is twice the length of the A1 segment.

[0011] The testing mechanism comprises two elastic metal strips, the two elastic metal strips are arranged on both sides of the conveying belt, the two elastic metal strips are arranged above the conveying belt, the elastic metal strips are used to lap the lead wires of the elements on the clamping mechanism when the clamping mechanism passes, and the two elastic metal strips are connected with a testing host.

[0012] The clamping mechanism further comprises two sets of repair mechanisms, the two sets of repair mechanisms are arranged at both ends of the clamping seat, the repair mechanism comprises two parallel clamping rollers, the two clamping rollers are connected with a second adjusting mechanism, and the second adjusting mechanism is used to adjust the two clamping rollers to be in the following three states.

[0013] The first state is that the two clamping rollers are spaced apart and separated vertically from the rotating shaft.

[0014] The second state is that the two clamping rollers are close to each other, and the two clamping rollers are rotated around the lead wires as the axis to be in a clamping state parallel to the rotating shaft.

[0015] The third state is that the two clamping rollers clamp the lead wires and are parallel to the rotating shaft, and are away from the clamping seat.

[0016] Two clamping rollers are rotatably arranged at the same end of the A slider, the A slider is slidably arranged in the slide, the length direction of the slide is consistent with the axial direction of the rotating shaft, and the two clamping rollers are in a separated state.

[0017] The second adjusting mechanism comprises a supporting assembly, the supporting assembly comprises two slide rods and two supporting plates, the cross section of the two slide rods is rectangular, the two slide rods are arranged in sequence, the two slide rods are fixedly arranged on the two sides of the supporting sleeve, the length direction of the two slide rods is consistent with the length direction of the clamping seat, the two supporting plates are arranged correspondingly to the two slide rods, the supporting plates are slidably arranged on the corresponding slide rods, the slide rods are perpendicular to the plate surface of the supporting plates, the supporting plates are provided with circular arc sliding grooves, the centers of the circular arc sliding grooves are located on the axis of the lead wire, the B slider is slidably arranged on the circular arc sliding grooves, the slide is fixedly arranged on the B slider, the two A sliders are connected with the adjusting assembly, and the adjusting assembly is used for adjusting the two A sliders to move close to or away from each other and adjusting the B slider to move along the circular arc sliding grooves.

[0018] The adjusting assembly comprises an adjusting rod and a triggering assembly, the length direction of the adjusting rod is consistent with the length direction of the slide rod, the adjusting rod is slidably arranged on the B slider, the A spring is arranged between the adjusting rod and the B slider, the A spring is used for maintaining the position between the adjusting rod and the B slider unchanged, the end of the adjusting rod close to the slide is fixedly connected with two supporting rods, the two supporting rods are arranged correspondingly to the two A sliders, the two supporting rods are inserted into the two A sliders, the adjusting rod drives the two supporting rods to move close to or away from the slide, the two supporting rods drive the two A sliders to move away from each other or away from each other, the end of the adjusting rod away from the two supporting rods is provided with a B passive rod, the B passive rod is arranged correspondingly to the triggering assembly, and the triggering assembly is used for abutting and lifting the B passive rod.

[0019] The triggering assembly comprises two triggering pieces and two B springs, the two B springs are arranged correspondingly to the two slide rods, the B spring is sleeved on the slide rod, one end of the B spring is connected with the supporting plate, the other end of the B spring is connected with the supporting sleeve, the two triggering pieces are arranged correspondingly to the two B passive rods, the end face of the triggering piece close to the B passive rod is an inclined plane, the inclined plane is distributed along an a track, the a track is a spiral line around the axis of the lead wire, the triggering piece and the B passive rod form an inclined plane driving cooperation, the triggering piece can abut and lift the B passive rod when the triggering piece is away from the supporting sleeve, the triggering piece is connected with a transmission assembly, and the transmission assembly is used for driving the triggering piece to move along the length direction of the slide rod.

[0020] The transmission assembly comprises two telescopic rods, the two telescopic rods are arranged correspondingly to the two slide rods, the two telescopic rods are connected with the two triggering pieces respectively, the two telescopic rods are connected with a linkage assembly, and the linkage assembly is used for driving the two telescopic rods to synchronously stretch and retract.

[0021] The linkage assembly comprises two A racks and an A gear, the A gear is fixedly installed on a transmission shaft, the axial direction of the transmission shaft is consistent with the axial direction of the rotating shaft, the transmission shaft is rotatably installed on a support sleeve, the two A racks are engaged with the A gear, the two A racks are respectively arranged above and below the A gear, the length direction of the two A racks is consistent with the length direction of the slide rod, the two A racks are fixedly connected with the two telescopic rods respectively, the transmission shaft is connected with the driving assembly, the transmission shaft is connected with a B torsional spring, and the B torsional spring is used for maintaining the transmission shaft.

[0022] The driving assembly comprises a B rack, a B gear and a driving guide rail, the B gear is installed on the transmission shaft, the B rack is engaged with the B gear, the B rack is arranged along the length direction of the support sleeve, the B rack is slidably installed in the support sleeve, a lifting rod is installed in the fixed sleeve, the length direction of the lifting rod is consistent with the length direction of the fixed sleeve, and the lifting rod and the B rack are arranged correspondingly, a C spring is sleeved on the lifting rod, and the C spring is used for maintaining the position of the lifting rod in the fixed sleeve, and the driving guide rail is used for adjusting the lifting of the lifting rod.

[0023] The driving guide rail is arranged between the two conveying belts, the driving guide rail is arranged along the conveying direction of the conveying belt, the driving guide rail is arranged at the discharging end of the conveying belt, the driving guide rail comprises an A rising section, a maintaining section and a B rising section, the A rising section is used for abutting against the lifting rod, the lifting rod is driven to rise and abut against the B rack, the maintaining section is used for maintaining the disengagement of the clamping roller from the lead wire, a vacancy is formed in the part of the clamping seat corresponding to the B rack, the B rising section is used for abutting against the lifting rod, the lifting rod is driven to rise and abut against the B rack, and the B rack rises through the vacancy to push out the elastic clamping jaw.

[0024] A detection method for semiconductor elements, comprising the following steps:

[0025] S1: first, the semiconductor elements are conveyed by the conveying belt in sequence, the semiconductor elements are in a flat-lying state on the conveying belt, and the lead wires at both ends of the semiconductor elements extend out of the conveying belt;

[0026] S2: the lead wires at both ends of the semiconductor elements are pickled to remove the oxide layer on the lead wires;

[0027] S3: the pickling solution on the lead wires at both ends of the semiconductor elements is rinsed clean, and the semiconductor elements are dried;

[0028] S4: the semiconductor elements conveyed in sequence are connected in sequence by using the elastic metal strip to overlap, and the semiconductor elements are detected by being connected in sequence;

[0029] S5: finally, the lead wires bent by the elastic metal strip are straightened in sequence.

[0030] The beneficial effect of the present application is that the testing device for semiconductor components can realize the function of automatic on-off testing of semiconductor components, has high testing efficiency, can remove the lead oxidation layer of components, effectively improves the testing accuracy, can repair the bent lead in the testing process, and meets the requirements of high-efficiency automatic testing. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 is the upper belt surface plan view of the detection equipment for semiconductor components proposed in the present application located in the detection box;

[0032] Figure 2 is the structural schematic view of the clamping mechanism in the detection equipment for semiconductor components proposed in the present application;

[0033] Figure 3 is the structural schematic view of the A guide rail in the detection equipment for semiconductor components proposed in the present application;

[0034] Figure 4 is the structural schematic view of the B guide rail in the detection equipment for semiconductor components proposed in the present application;

[0035] Figure 5 is the structural schematic view of the repairing mechanism in the detection equipment for semiconductor components proposed in the present application;

[0036] Figure 6 is the structural schematic view of the adjusting rod and A slider in the detection equipment for semiconductor components proposed in the present application;

[0037] Figure 7 is the side structural schematic view of the clamping roller and sliding seat in the detection equipment for semiconductor components proposed in the present application;

[0038] Figure 8 is the structural schematic view of the support plate in the detection equipment for semiconductor components proposed in the present application;

[0039] Figure 9 is the internal structural schematic view of the support sleeve and fixing sleeve in the detection equipment for semiconductor components proposed in the present application;

[0040] Figure 10 is the structural schematic view of the elastic metal strip in the detection equipment for semiconductor components proposed in the present application;

[0041] Figure 11 is the structural schematic view of the driving guide rail in the detection equipment for semiconductor components proposed in the present application.

[0042] In the figure: 100, clamping mechanism; 110, clamping seat; 120, elastic jaw; 130, fixed sleeve; 131, lifting rod; 132, C spring; 140, rotating shaft; 150, supporting sleeve; 151, A passive rod; 152, A gear; 153, B torsional spring; 154, B gear; 155, B rack; 156, transmission shaft; 160, A torsional spring; 200, conveying belt; 300, first adjusting mechanism; 310, A guide rail; 311, A1 section; 312, A2 section; 320, B guide rail; 321, B1 section; 322, B2 section; 400, pickling mechanism; 500, lead processing mechanism; 600, testing mechanism; 610, elastic metal strip; 700, driving guide rail; 710, A rising section; 720, maintaining section; 730, B rising section; 800, repairing mechanism; 810, clamping roller; 811, sliding seat; 812, A slider; 820, adjusting rod; 821, supporting rod; 822, B passive rod; 823, A spring; 830, supporting plate; 831, circular arc slide; 832, B slider; 840, sliding rod; 841, B spring; 850, trigger; 860, telescopic rod; 861, A rack. DETAILED DESCRIPTION

[0043] The subject matter described herein will now be discussed with reference to example implementations. It should be understood that the discussion of these implementations is merely meant to provide a better understanding of the subject matter described herein and can be changed in function and arrangement without departing from the scope of the present disclosure. Various processes or components can be omitted, substituted, or added according to desired implementations. Additionally, features described with respect to some examples can be combined in other examples.

[0044] Embodiment One

[0045] Reference is made to the accompanying drawings that form a part of this disclosure. Figures 1-11 In this embodiment, a detection device for semiconductor elements is proposed, which includes two parallel conveying belts 200, a detection box, and a first adjusting mechanism 300. The upper surface of the conveying belt 200 is horizontally arranged, and the upper surface of the conveying belt 200 is inserted into the detection box. The clamping mechanism 100 is installed on the conveying belt 200, which includes the clamping seat 110 and the elastic jaw 120. The length direction of the clamping seat 110 is perpendicular to the conveying direction of the conveying belt 200. The elastic jaw 120 is installed on the upper end of the clamping seat 110, and is used to clamp the package of the elements. The elements on the clamping seat 110 are in a flat state with the lead extending out of the clamping seat.

[0046] The pickling mechanism 400, the lead processing mechanism 500, and the testing mechanism 600 are installed in the detection box and are distributed along the conveying direction of the conveying belt 200.

[0047] The lead processing mechanism 500 comprises a rinsing assembly for rinsing the pickling liquid on the lead and a drying assembly for drying the lead;

[0048] The clamping mechanism 100 further comprises a fixed sleeve 130, a supporting sleeve 150 and a rotating shaft 140, the supporting sleeve 150 is fixedly connected with the clamping seat 110 at the upper end, the fixed sleeve 130 is fixedly installed on the two conveying belts 200 at the lower end, the fixed sleeve 130 and the supporting sleeve 150 are arranged in matching correspondence, the supporting sleeve 150 is fixedly connected with the rotating shaft 140 at the lower end, the rotating shaft 140 is rotatably installed on the fixed sleeve 130 at both ends, the rotating shaft 140 is horizontally arranged along the conveying direction of the conveying belt 200, the pickling mechanism 400 comprises two pickling tanks, the two pickling tanks are spaced apart along the conveying direction of the conveying belt 200, and the two pickling tanks are respectively arranged on the two sides of the conveying belt 200, and the detection box further comprises a first adjusting mechanism 300, the first adjusting mechanism 300 is used for adjusting the reciprocating rotation of the rotating shaft 140, so that the lead at both ends of the element on the clamping seat 110 can be respectively inserted into the corresponding pickling tank.

[0049] The clamping mechanism 100 is equidistantly spaced apart along the conveying direction of the conveying belt 200.

[0050] The supporting sleeve 150 is provided with an A passive rod 151 on each side at the lower end, the axes of the two A passive rods 151 are collinear, the A passive rod 151 is horizontally arranged, the A passive rod 151 and the rotating shaft 140 are vertically distributed, the rotating shaft 140 is connected with an A torsional spring 160, the A torsional spring 160 is installed on the fixed sleeve 130, and the A torsional spring 160 is used for maintaining the rotating shaft 140 to be stationary, so as to maintain the clamping seat 110 in a horizontally distributed state.

[0051] The first adjusting mechanism 300 comprises two guide rails, namely an A guide rail 310 and a B guide rail 320, the A guide rail 310, the B guide rail 320 and the two A passive rods 151 are arranged in correspondence, the A guide rail 310 is composed of an A1 segment 311 and an A2 segment 312, the B guide rail 320 is composed of a B1 segment 321 and a B2 segment 322, the A1 segment 311 is arranged in an upward inclination, the B1 segment 321 is arranged in a downward inclination, the A1 segment 311 and the B1 segment 321 have the same length and the same inclination angle, the A2 segment 312 is arranged in a downward inclination, the B2 segment 322 is arranged in an upward inclination, the A2 segment 312 and the B2 segment 322 have the same length and the same inclination angle, and the length of the A2 segment 312 is twice the length of the A1 segment 311.

[0052] The testing mechanism 600 comprises two elastic metal strips 610, the two elastic metal strips 610 are respectively arranged on the two sides of the conveying belt 200, and the two elastic metal strips 610 are arranged above the conveying belt 200, the elastic metal strip 610 is used for being overlapped with the lead of the element on the clamping mechanism 100 when the clamping mechanism 100 passes, and the two elastic metal strips 610 are connected with a testing host.

[0053] The clamping mechanism 100 further comprises two sets of repairing mechanisms 800, which are arranged at two ends of the clamping base 110. The repairing mechanism 800 comprises two parallel clamping rollers 810, which are connected to a second adjusting mechanism for adjusting the two clamping rollers 810 to be in the following three states:

[0054] The first state is that the two clamping rollers 810 are spaced apart and separated from the rotating shaft 140;

[0055] The second state is that the two clamping rollers 810 are close to each other and rotate around the lead wire as an axis to be parallel to the rotating shaft 140 in a clamping state;

[0056] The third state is that the two clamping rollers 810 clamp the lead wire and are parallel to the rotating shaft 140 and away from the clamping base 110 in a repairing state.

[0057] The two clamping rollers 810 are rotatably arranged at the same end of an A sliding block 812, which is slidingly arranged in a sliding base 811. The length direction of the sliding base 811 is consistent with the axial direction of the rotating shaft 140, and the sliding base 811 is located below the clamping base 110 when the two clamping rollers 810 are in the separated state.

[0058] The second adjusting mechanism comprises a supporting assembly, which comprises two sliding rods 840 and two supporting plates 830. The cross section of the two sliding rods 840 is rectangular, and the two sliding rods 840 are arranged in sequence. The two sliding rods 840 are fixedly arranged at two sides of the supporting sleeve 150, and the length direction of the two sliding rods 840 is consistent with the length direction of the clamping base 110. The two supporting plates 830 are arranged correspondingly to the two sliding rods 840, and the supporting plate 830 is slidingly arranged on the corresponding sliding rod 840. The sliding rod 840 is perpendicular to the plate surface of the supporting plate 830. The supporting plate 830 is provided with a circular arc-shaped sliding groove 831, and the center of the circular arc-shaped sliding groove 831 is located on the axis of the lead wire. The B sliding block 832 is slidingly arranged on the circular arc-shaped sliding groove 831, and the sliding base 811 is fixedly arranged on the B sliding block 832. The two A sliding blocks 812 are connected to an adjusting assembly for adjusting the two A sliding blocks 812 to be close to or away from each other, and adjusting the B sliding block 832 to move along the circular arc-shaped sliding groove.

[0059] The adjusting assembly comprises an adjusting rod 820 and a trigger assembly. The length direction of the adjusting rod 820 is consistent with the length direction of the slide rod 840. The adjusting rod 820 is slidingly installed on the B slider 832. An A spring 823 is installed between the adjusting rod 820 and the B slider 832, and the A spring 823 is used to maintain the position between the adjusting rod 820 and the B slider 832 unchanged. The end of the adjusting rod 820 close to the slide base 811 is fixedly connected with two support rods 821. The two support rods 821 and two A sliders 812 are correspondingly arranged. The two support rods 821 are inserted into the two A sliders 812. The adjusting rod 820 drives the two support rods 821 to be close to or away from the slide base 811. The two support rods 821 drive the two A sliders 812 to be away from each other or away from the slide base 811. The end of the adjusting rod 820 away from the two support rods 821 is provided with a B passive rod 822. The B passive rod 822 and the trigger assembly are correspondingly arranged. The trigger assembly is used to abut and lift the B passive rod 822.

[0060] The trigger assembly comprises two trigger pieces 850 and two B springs 841. The two B springs 841 and the two slide rods 840 are correspondingly arranged. The B spring 841 is sleeved on the slide rod 840. One end of the B spring 841 is connected with the support plate 830, and the other end is connected with the support sleeve 150. The two trigger pieces 850 and the two B passive rods 822 are correspondingly arranged. The end face of the trigger piece 850 close to the B passive rod 822 is a bevel face. The bevel face is distributed along an a track. The a track is a spiral line around the lead axis. The trigger piece 850 and the B passive rod 822 form a bevel driving cooperation. When the trigger piece 850 is away from the support sleeve 150, the trigger piece 850 can abut and lift the B passive rod 822. The trigger piece 850 is connected with a transmission assembly. The transmission assembly is used to drive the trigger piece 850 to move along the length direction of the slide rod 840.

[0061] The transmission assembly comprises two telescopic rods 860. The two telescopic rods 860 and the two slide rods 840 are correspondingly arranged. The two telescopic rods 860 are respectively connected with the two trigger pieces 850. The two telescopic rods 860 are connected with a linkage assembly. The linkage assembly is used to drive the two telescopic rods 860 to synchronously stretch and retract.

[0062] The linkage assembly comprises two A racks 861 and an A gear 152. The A gear 152 is fixedly installed on a transmission shaft 156. The axial direction of the transmission shaft 156 is consistent with the axial direction of the rotating shaft 140. The transmission shaft 156 is rotatably installed on the support sleeve 150. The two A racks 861 and the A gear 152 are meshed. The two A racks 861 are respectively above and below the A gear 152. The length direction of the two A racks 861 is consistent with the length direction of the slide rod 840. The two A racks 861 are respectively fixedly connected with the two telescopic rods 860. The transmission shaft 156 is connected with a driving assembly. The transmission shaft 156 is connected with a B torsional spring 153. The B torsional spring 153 is used to maintain the transmission shaft 156 unchanged.

[0063] The driving assembly comprises a B rack 155, a B gear 154 and a driving guide rail 700. The B gear 154 is mounted on a transmission shaft 156. The B rack 155 and the B gear 154 are engaged. The B rack 155 is arranged along the length direction of the cylinder of the supporting sleeve 150. The B rack 155 is slidingly mounted in the supporting sleeve 150. The lifting rod 131 is mounted in the fixing sleeve 130. The length direction of the lifting rod 131 is consistent with the length direction of the fixing sleeve 130. The lifting rod 131 and the B rack 155 are correspondingly arranged. The C spring 132 is sleeved on the lifting rod 131. The C spring 132 is used for maintaining the position of the lifting rod 131 in the fixing sleeve 130. The driving guide rail 700 is used for adjusting the lifting of the lifting rod 131.

[0064] The driving guide rail 700 is arranged between the two conveying belts 200. The driving guide rail 700 is arranged along the conveying direction of the conveying belt 200. The driving guide rail 700 is arranged at the discharging end of the conveying belt 200. The driving guide rail 700 comprises an A rising section 710, a maintaining section 720 and a B rising section 730. The A rising section 710 is used for abutting against the lifting rod 131. The A rising section 710 drives the lifting rod 131 to rise and abut against the B rack 155. The A rising section 710 realizes the adjustment of the two clamping rollers 810 to straighten the lead wire. The maintaining section 720 is used for maintaining the disengagement of the clamping roller 810 from the lead wire. The clamping seat 110 is provided with a vacancy portion corresponding to the position of the B rack 155. The B rising section 730 is used for abutting against the lifting rod 131. The B rising section 730 drives the lifting rod 131 to rise and abut against the B rack 155. The B rack 155 rises through the vacancy portion. The B rack 155 drives the component to be ejected from the elastic clamping jaw 120.

[0065] The working process of the testing device in the embodiment is as follows:

[0066] Firstly, the semiconductor component is clamped into the elastic clamping jaw 120 at the feeding end of the conveying belt 200. The component is clamped in the encapsulation. The component is in a flat state on the clamping seat 110. The two ends of the component are extended out of the clamping seat 110. Further, a groove matched with the encapsulation of the component can be formed on the clamping seat 110.

[0067] It should be noted that the feeding can be completed by a robot or manually.

[0068] The conveying belt 200 moves at a constant speed. The clamping mechanism 100 is conveyed to the pickling mechanism 400. At this time, the rotation shaft 140 is maintained from rotating under the action of the A torsional spring 160. The clamping seat 110 is in a horizontal state. After the clamping mechanism 100 enters the pickling mechanism 400, the two A passive rods 151 are in contact with the A guide rail 310 and the B guide rail 320 respectively. Under the action of the two guide rails, firstly, the supporting sleeve 150 is driven to swing to the left around the rotation shaft 140. The left lead wire of the component is inserted into the pickling tank. The surface oxidation layer of the lead wire is removed. Then, the supporting sleeve 150 is driven to swing to the right around the rotation shaft 140. The right lead wire of the component is inserted into the pickling tank. The surface oxidation layer of the lead wire is removed.

[0069] With the continuous advancing of the conveying belt 200, the A passive rod 151 is disengaged from the two guide rails, and the clamping seat 110 returns to the horizontal state under the restoring action of the A torsion spring 160.

[0070] The clamping mechanism 100 enters the lead wire processing mechanism 500, and the residual pickling solution on the lead wire is first washed clean by the flushing assembly, and then the lead wire is dried by the drying assembly. In this process, nitrogen protection can be used to avoid the oxidation of the lead wire again.

[0071] With the continuous advancing of the conveying belt 200, the clamping mechanism 100 enters the testing mechanism 600 and contacts and overlaps with the elastic metal strip 610, and the testing host realizes the connection of the element and the detection of the impedance of the element. With the continuous advancing of the conveying belt 200, the continuous and automatic overlapping connection of the semiconductor element can be realized, and the purpose of testing each element one by one can be realized.

[0072] Because the lead wire is flexible, when the elastic metal strip 610 contacts and overlaps with it, it will exert a downward force on the lead wire, causing the lead wire to bend downward. After detection, it needs to be repaired.

[0073] With the continuous advancing of the conveying belt 200, the clamping mechanism 100 advances to the driving guide rail 700, and first, the lifting rod 131 contacts the A rising section 710 of the driving guide rail 700. With the advancing of the conveying belt 200, the lifting rod 131 is pressed upward by the A rising section 710, the lifting rod 131 extends and abuts against the B rack 155, driving the B rack 155 to rise, the B rack 155 drives the B gear 154 to rotate, the B gear 154 drives the A gear 152 to rotate through the transmission shaft 156, the A gear 152 drives the two A racks 861 to extend, the two A racks 861 drive the two telescopic rods 860 to extend, and the two telescopic rods 860 drive the two trigger pieces 850 to move away from each other.

[0074] During the movement of the trigger piece 850, it contacts and abuts against the B passive rod 822, and the trigger piece 850 presses and lifts the B passive rod 822. During the pressing process, the relative position of the support plate 830 on the slide rod 840 does not change under the limitation of the B spring 841, so the B passive rod 822 can drive the adjustment rod 820 to extend, the adjustment rod 820 drives the two support rods 821 to move, and the two support rods 821 drive the two A sliders 812 to move close to each other, thereby adjusting the two clamping rollers 810 to move close to each other.

[0075] At the same time that the two clamping rollers 810 move close to each other, the B passive rod 822 drives the B slider 832 to lift synchronously through the adjustment rod 820 during the lifting process. The B slider 832 rotates and rises by ninety degrees along the circular arc-shaped slide 831, thereby adjusting the two clamping rollers 810 from the separated state to the clamped state.

[0076] B slider 832 is blocked after rotating up ninety degrees along the circular arc slide 831, and does not rise. With the continued movement of the trigger 850, the support plate 830 is driven to move synchronously, and the B spring 841 is pulled up. The two clamping rollers 810 move synchronously, achieving the purpose of straightening the pressed and bent lead wire, and with the movement, the clamping rollers 810 are separated from the lead wire.

[0077] With the continued movement of the conveying belt 200, the lifting rod 131 moves to the maintenance section 720 of the driving guide rail 700, achieving the purpose of maintaining the clamping roller 810 away from the lead wire.

[0078] With the continued movement of the conveying belt 200, the lifting rod 131 moves to the B lifting section 730 of the driving guide rail 700, and the lifting rod 131 continues to extend. Similarly, the B rack 155 is adjusted to synchronously extend into the empty part of the clamping seat 110, achieving the purpose of ejecting the component package from the elastic clamping jaw 120, and achieving the purpose of automatic unloading.

[0079] With the continued movement of the conveying belt 200, the lifting rod 131 is separated from the driving guide rail 700, and under the restoring action of the B torsion spring 153 and the A spring 823, the B spring 841, and the C spring 132, the B rack 155 and the clamping roller 810 return to the initial state.

[0080] Embodiment 2

[0081] In this embodiment, a detection method for semiconductor components is proposed, which comprises the following steps:

[0082] S1: First, the semiconductor components are conveyed in sequence by a conveying belt. The semiconductor components are in a flat-lying state on the conveying belt, and the lead wires at both ends of the semiconductor components extend out of the conveying belt;

[0083] S2: The lead wires at both ends of the semiconductor components are pickled to remove the oxide layer on the lead wires;

[0084] S3: The pickling solution on the lead wires at both ends of the semiconductor components is then rinsed clean, and dried;

[0085] S4: The semiconductor components conveyed in sequence are connected in sequence by using the lapping method of elastic metal strips, and are subjected to connection detection;

[0086] S5: Finally, the lead wires bent by the elastic metal strips are straightened in sequence.

[0087] The above describes the embodiments of the present embodiment, but the present embodiment is not limited to the specific embodiments described above. The specific embodiments described above are only illustrative and not limiting. Those skilled in the art can make many forms under the inspiration of the present embodiment, which are all within the protection scope of the present embodiment.

Claims

1. An inspection apparatus for a semiconductor device, characterized by comprising: The device comprises two parallel conveying belts, a detection box and a first adjusting mechanism, the upper surface of the conveying belts is horizontally arranged, the upper surface of the conveying belts is inserted into the detection box, a clamping mechanism is installed on the conveying belts, the clamping mechanism comprises a clamping seat and an elastic jaw, the length direction of the clamping seat is perpendicular to the conveying direction of the conveying belts, the elastic jaw is installed on the upper end of the clamping seat, the elastic jaw is used for clamping the packaging of the components, and the components are in a lying state with the lead wires at both ends extending out of the clamping seat. An acid pickling mechanism, a lead wire processing mechanism and a testing mechanism are installed in the detection box, the acid pickling mechanism, the lead wire processing mechanism and the testing mechanism are distributed at intervals along the conveying direction of the conveying belts, the testing mechanism comprises two elastic metal strips, the two elastic metal strips are arranged on the two sides of the conveying belts, the two elastic metal strips are arranged above the conveying belts, the elastic metal strips are used for overlapping the lead wires of the components on the clamping mechanism when the clamping mechanism passes, and the two elastic metal strips are connected with a testing host. The clamping mechanism further comprises a fixed sleeve, a supporting sleeve and a rotating shaft, the upper end of the supporting sleeve is fixedly connected with the clamping seat, the lower end of the fixed sleeve is fixedly installed on the two conveying belts, the fixed sleeve and the supporting sleeve are matched and correspondingly arranged, the lower end of the supporting sleeve is fixedly connected with the rotating shaft, the two ends of the rotating shaft are rotatably installed on the fixed sleeve, the rotating shaft is horizontally arranged, and the rotating shaft is arranged along the conveying direction of the conveying belts. The clamping mechanism further comprises two groups of repairing mechanisms, the two groups of repairing mechanisms are arranged at the two ends of the clamping seat, the repairing mechanism comprises two clamping rollers which are arranged in parallel, the two clamping rollers are connected with a second adjusting mechanism, and the second adjusting mechanism is used for adjusting the two clamping rollers to be in the following three states: (1) the two clamping rollers are distributed at intervals, and the two clamping rollers are separated from the rotating shaft in a perpendicular state; (2) the two clamping rollers are close to each other, and the two clamping rollers are rotated around the lead wires to be in a clamping state which is parallel to the rotating shaft; (3) the two clamping rollers clamp the lead wires and are parallel to the rotating shaft, and the two clamping rollers are away from the clamping seat in a repairing state; The two clamping rollers are rotatably installed on an A sliding block at the same end, the A sliding block is slidably installed in a sliding seat, the length direction of the sliding seat is consistent with the axial direction of the rotating shaft, and when the two clamping rollers are in the separated state, the sliding seat is located below the clamping seat. The second adjusting mechanism comprises a supporting assembly, the supporting assembly comprises two sliding rods and two supporting plates, the cross section of the two sliding rods is rectangular, the two sliding rods are arranged in sequence, the two sliding rods are fixedly installed on the two sides of the supporting sleeve, the rod length direction of the two sliding rods is consistent with the length direction of the clamping seat, the two supporting plates are correspondingly arranged with the two sliding rods, the supporting plates are slidably installed on the corresponding sliding rods, the sliding rods are perpendicular to the plate surface of the supporting plates, the supporting plates are provided with circular arc sliding grooves, the centers of the circular arc sliding grooves are located on the axial line of the lead wires, B sliding blocks are slidably installed on the circular arc sliding grooves, the sliding seat is fixedly installed on the B sliding blocks, the two A sliding blocks are connected with an adjusting assembly, and the adjusting assembly is used for adjusting the two A sliding blocks to be close to or away from each other and adjusting the B sliding blocks to move along the circular arc sliding grooves.

2. An apparatus for inspecting a semiconductor device according to claim 1, wherein The acid pickling mechanism comprises two acid pickling tanks, the two acid pickling tanks are distributed at intervals along the conveying direction of the conveying belts, and the two acid pickling tanks are arranged on the two sides of the conveying belts, the detection box is further provided with a first adjusting mechanism, and the first adjusting mechanism is used for adjusting the reciprocating rotation of the rotating shaft, so that the lead wires at both ends of the components on the clamping seat can be inserted into the corresponding acid pickling tanks.

3. An apparatus for inspecting a semiconductor device according to claim 2, wherein Two A passive rods are arranged on both sides of the lower end of the support sleeve, the axes of the two A passive rods are collinear, the A passive rods are horizontally arranged, the A passive rods and the rotating shaft are vertically distributed, the rotating shaft is connected with an A torsion spring, the A torsion spring is installed on the fixed sleeve, the A torsion spring is used for maintaining the rotating shaft stationary, and the state of maintaining the clamping seat in horizontal distribution is realized. The first adjusting mechanism comprises two guide rails, namely an A guide rail and a B guide rail, the A guide rail and the B guide rail are correspondingly arranged with the two A passive rods, the A guide rail is composed of an A1 segment and an A2 segment, the B guide rail is composed of a B1 segment and a B2 segment, the A1 segment is arranged in an upward inclination, the B1 segment is arranged in a downward inclination, the A1 segment and the B1 segment have the same length and the same inclination angle, the A2 segment is arranged in a downward inclination, the B2 segment is arranged in an upward inclination, the A2 segment and the B2 segment have the same length and the same inclination angle, and the length of the A2 segment is twice the length of the A1 segment.

4. An apparatus for inspecting a semiconductor device according to claim 3, wherein The adjusting assembly comprises an adjusting rod and a triggering assembly, the length direction of the adjusting rod is consistent with the length direction of the slide rod, the adjusting rod is slidingly installed on the B slide block, an A spring is installed between the adjusting rod and the B slide block, the A spring is used for maintaining the position between the adjusting rod and the B slide block unchanged, the end of the adjusting rod close to the slide base is fixedly connected with two support rods, the two support rods are correspondingly arranged with the two A slide blocks, the two support rods are inserted into the two A slide blocks, the adjusting rod drives the two support rods to approach or move away from the slide base, the two support rods drive the two A slide blocks to approach or move away from each other, and the end of the adjusting rod away from the two support rods is installed with a B passive rod, the B passive rod is correspondingly arranged with the triggering assembly, and the triggering assembly is used for abutting and lifting the B passive rod.

5. An apparatus for inspecting a semiconductor device according to claim 4, wherein The triggering assembly comprises two triggering pieces and two B springs, the two B springs are correspondingly arranged with the two slide rods, the B spring is sleeved on the slide rod, one end of the B spring is connected with the support plate, the other end of the B spring is connected with the support sleeve, the two triggering pieces are correspondingly arranged with the two B passive rods, the end face of the triggering piece close to the B passive rod is an inclined surface, the inclined surface is distributed along an a track, the a track is a spiral line around the lead axis, the triggering piece and the B passive rod form an inclined surface driving cooperation, the triggering piece can abut and lift the B passive rod when the triggering piece moves away from the support sleeve, the triggering piece is connected with a transmission assembly, and the transmission assembly is used for driving the triggering piece to move along the length direction of the slide rod.

6. An apparatus for inspecting a semiconductor device according to claim 5, wherein The transmission assembly comprises two telescopic rods, the two telescopic rods are correspondingly arranged with the two slide rods, the two telescopic rods are respectively connected with the two triggering pieces, and the two telescopic rods are connected with a linkage assembly, and the linkage assembly is used for driving the two telescopic rods to synchronously stretch and retract.

7. The apparatus according to claim 6, wherein The linkage assembly comprises two A racks and an A gear, the A gear is fixedly installed on a transmission shaft, the axial direction of the transmission shaft is consistent with the axial direction of the rotating shaft, the transmission shaft is rotatably installed on the support sleeve, the two A racks are engaged with the A gear, the two A racks are respectively arranged above and below the A gear, the length direction of the two A racks is consistent with the length direction of the slide rod, the two A racks are respectively fixedly connected with the two telescopic rods, the transmission shaft is connected with a driving assembly, the transmission shaft is connected with a B torsion spring, and the B torsion spring is used for maintaining the transmission shaft stationary.

8. An apparatus for inspecting a semiconductor device according to claim 7, wherein The driving assembly comprises a B rack, a B gear and a driving guide rail, the B gear is installed on a transmission shaft, the B rack and the B gear are engaged, the B rack is arranged along the length direction of the cylinder of the supporting sleeve, the B rack is slidingly installed in the supporting sleeve, a lifting rod is installed in the fixing sleeve, the length direction of the lifting rod is consistent with the length direction of the fixing sleeve, the lifting rod and the B rack are correspondingly arranged, a C spring is sleeved on the lifting rod, the C spring is used for maintaining the position of the lifting rod in the fixing sleeve, and the driving guide rail is used for adjusting the lifting of the lifting rod.

Citation Information

Patent Citations

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