A chip removal control circuit for a CNC optical machine

Abstract

The present invention discloses a CNC optical machine chip removal control circuit, comprising: a drive circuit, the drive circuit being connected to a chip conveyor control circuit and a chip conveyor detection circuit via a wire; the chip conveyor detection circuit comprising an overload detection circuit and a chain abnormality detection circuit, for detecting the current actual working power of the chip conveyor and the chain output condition respectively; the rotation direction of the motor is controlled by controlling the on-off control of the drive circuit, thereby realizing the rotation switching of the output device connected to the chip conveyor control circuit; the chip conveyor can be switched to chain chip removal or spiral chip removal, and is connected to a first drive circuit when the chip conveyor is chain chip removal, and is connected to a second drive circuit when the chip conveyor is spiral chip removal, and the switching between chain chip removal and spiral chip removal is realized by switching the first drive circuit and the second drive circuit. The device simplifies the switching control mode of the chip removal mode by designing the CNC optical machine chip removal control circuit, and can quickly switch the chip removal form.

Description

Technical Field

[0001] The present invention relates to the field of numerical control optical machines, and in particular to a chip removal control circuit for numerical control optical machines. Background Art

[0002] Existing CNC optical machines are usually divided into chain chip removal or spiral chip removal during the processing process. However, during the processing process, existing CNC optical machines replace different chip conveyors for chip discharge and transportation according to the processing form of different metal workpieces. However, the drive circuits of chain chip removal or spiral chip removal are different, and the adaptation requirements of some control circuits are relatively high. Each time a different chip conveyor is replaced, the control system must be readjusted.

[0003] Furthermore, CNC machine tools require circuit protection to extend the lifespan of circuit systems during control. The wire coating material prepared in Chinese patent CN107148655A exhibits excellent resistance to trauma, low-temperature bending, and tearing when used in insulated wires. The coating material in Chinese patent CN102575077B also exhibits excellent cold resistance, wear resistance, and damage resistance. Summary of the Invention

[0004] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a chip removal control circuit for a numerically controlled optical machine.

[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solution: a CNC optical machine chip removal control circuit, comprising:

[0006] drive circuit,

[0007] The driving circuit is connected to the chip conveyor control circuit and the chip conveyor detection circuit via a wire;

[0008] The chip conveyor detection circuit includes an overload detection circuit and a chain abnormality detection circuit, which respectively detect the actual working power of the chip conveyor and the chain output;

[0009] By controlling the on-off of the driving circuit to control the rotation direction of the motor, the rotation switching of the output device connected to the chip conveyor control circuit is realized;

[0010] The chip conveyor can be switched to chain chip conveyor or spiral chip conveyor. When the chip conveyor is chain chip conveyor, it is connected to a first drive circuit, and when it is spiral chip conveyor, it is connected to a second drive circuit. The switching between chain chip conveyor and spiral chip conveyor is achieved by switching the first drive circuit and the second drive circuit.

[0011] As a further description of the above technical solution: the drive circuit includes a motor, the three-phase output port and the negative port of the motor are respectively connected to a plug socket connector, and the plug socket connector of the negative port; the three-phase output port is connected to a thermal overload relay, and a three-phase arc extinguisher is connected between the three-phase output port and the thermal overload relay.

[0012] As a further description of the above technical solution: two parallel contactors are connected to the other side of the thermal overload relay, and the contactors are three-stage contactors. The connection lines of the two contactors are in opposite order, and the rotation direction of the motor is switched by switching the two contactors on and off.

[0013] As a further description of the above technical solution: the chip conveyor control circuit is connected to a normally closed switch, and the normally closed switch is respectively connected to two identical control circuits. The control circuit is connected to a DC relay coil, and the DC relay coil is connected in parallel with a first protection circuit for protecting the DC relay coil circuit. The other end of the DC relay is connected to a normally closed switch, and the normally closed switch is connected to the chip removal control module.

[0014] As a further description of the above technical solution: the input end of the chip removal control module is connected to the chip conveyor control circuit, and the output end is connected to the indicating device. The input end of the chip removal control module is connected to the plug socket connector, and the plug socket connector is connected to the normally open switch. The normally open switch is connected to the chip conveyor output device. The other side of the chip conveyor output device is connected to a DC relay coil, and the DC relay coil is connected in parallel with the second protection circuit. The other side of the DC relay coil is connected to the plug socket connector, and the connecting plug socket is connected to the indicating device.

[0015] As a further description of the above technical solution: the overload detection circuit includes a first power supply device, the first power supply device is provided with a plurality of wiring terminals, connected to the motor circuit through a plug socket connector, a normally open switch is connected between the wiring terminals on both sides of the first power supply device, and the other wiring terminal is connected to a first warning device.

[0016] As a further description of the above technical solution: the chain abnormality detection circuit includes a second power supply device, the second power supply device is provided with a plurality of wiring terminals, which are connected to the motor circuit through a plug socket connector, three wiring terminals of the second power supply device are connected to a proximity switch, a plug socket connector is connected between the proximity switch and the second power supply device, and another wiring terminal of the second power supply device is connected to a second warning device.

[0017] As a further description of the above technical solution: when the chip conveyor is selected as a spiral chip conveyor, the motor in the driving circuit is added to control two spiral chip conveying and removal devices respectively.

[0018] As a further description of the above technical solution: the surface of the wire in the chip removal control circuit has a coating layer.

[0019] As a further description of the above technical solution: in parts by weight, the raw materials of the coating layer include: 80-120 parts of TPE resin, 15-35 parts of plasticizer, 3-5 parts of antioxidant, 4-9 parts of filler, and 5-7 parts of polyethylene substances.

[0020] In parts by weight, the raw materials of the coating layer are: 115 parts of TPE resin, 24 parts of plasticizer, 4.2 parts of antioxidant, 6 parts of filler, and 5 parts of polyethylene substance.

[0021] Preferably, the weight ratio of the polyethylene material to the filler is 5:6.

[0022] Preferably, the TPE resin is selected from one or more of styrenes, olefins, dihydrocarbons, and urethanes.

[0023] Preferably, the TPE resin is urethane, brand 1298AU, purchased from Guangzhou Jingchen Plastics Co., Ltd.

[0024] Preferably, the plasticizer is selected from one or more of dibutyl phthalate, acetyl tributyl citrate, phenoxyethanol, triethylene glycol diisooctanoate, sebacic acid, and tri-n-butyl citrate.

[0025] Preferably, the plasticizer is tri-n-butyl citrate.

[0026] Preferably, the antioxidant is antioxidant 168.

[0027] More preferably, the antioxidant 168 is tris(2,4-di-tert-butylphenyl)phosphite.

[0028] Preferably, the filler is selected from one or both of inorganic fillers and organic fillers.

[0029] Preferably, the filler is ceramic powder among inorganic fillers.

[0030] Preferably, the ceramic powder is of brand TCB03, has a porosity of 0.2, and is purchased from Tuolin Mineral Products Processing Plant.

[0031] Preferably, the polyethylene substance is polyethylene wax, brand D1103, purchased from Guangzhou Binlong Chemical Co., Ltd.

[0032] During the preparation process, the applicant unexpectedly discovered that after polyethylene substances were added to the system, the plasticity of the prepared wire coating layer increased. This may be because the molecular chains of the polyethylene substances were inserted between the resin molecules, especially the polyethylene substances with a viscosity of 800-1200mPa·s, which increased the distance between the resin molecules, making the coating layer more plastic; but it was not resistant to high temperatures. When the polyethylene substances and inorganic filler ceramic powders acted together, the high temperature resistance of the coating material was improved; especially when the porosity of the polyethylene substances and the inorganic filler ceramic powder was 0.2 and their weight ratio was 5:6, the interaction force between the components in the system was increased, and the coating material had better high temperature resistance without affecting the low-temperature flexibility of the coating material.

[0033] The present invention also discloses a chip removal control circuit for a numerically controlled optical machine, wherein the wires in the circuit are provided with a coating layer, and a method for preparing the coating layer material is as follows:

[0034] S1: Place the above raw materials into a single-screw kneader, knead at 180-200°C for 20-60 minutes, and then discharge.

[0035] S2: using a granulator to granulate the material discharged from step S1 to obtain a coating layer material.

[0036] Preferably, the preparation method is:

[0037] S1: The above raw materials were placed in a single-screw kneader and kneaded at 195°C for 45 minutes before discharging.

[0038] S2: using a granulator to granulate the material discharged from step S1 to obtain a coating layer material.

[0039] The above technical solution has the following advantages or beneficial effects:

[0040] 1. By designing the CNC optical machine chip removal control circuit, when replacing chain chip removal and spiral chip removal, only a connected drive circuit needs to be added to the drive circuit to realize the switching between chain and spiral chip removal. In the specific circuit, only two drive circuits need to be switched to control different chip removal methods, which simplifies the switching control method of the chip removal method and can quickly switch the chip removal form.

[0041] 2. By providing a coating layer on the outside of the control circuit, the circuit is protected from corrosion without affecting the bending performance of the circuit, and has good weather resistance under outdoor conditions.

[0042] 3. By adding polyethylene wax, the plasticity of the wire covering can be increased, so that the wire covering has better flexibility even at low temperatures. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1This is a circuit diagram of the drive circuit of the chain-type chip removal system of the present invention;

[0044] Figure 2 is a circuit diagram of the control circuit in the present invention;

[0045] Figure 3 is a circuit schematic diagram of the overload detection circuit in the present invention;

[0046] Figure 4 Schematic diagram of the circuit of the chain abnormality detection circuit in the present invention;

[0047] Figure 5 This is a circuit diagram of the driving circuit of the spiral chip removal in the present invention.

[0048] Legend:

[0049] 1. Driving circuit; 2. Control circuit; 3. Overload detection circuit; 4. Chain abnormality detection circuit; 5. Indication device. DETAILED DESCRIPTION

[0050] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0051] Example:

[0052] Example 1

[0053] This embodiment 1 discloses a chip removal control circuit for a CNC optical machine:

[0054] Reference Figure 1-Figure 2 An embodiment of the present invention provides: a CNC optical machine chip removal control circuit, comprising: a drive circuit 1, the drive circuit 1 is connected to the chip conveyor control circuit 2 and the chip conveyor detection circuit through a wire; the chip conveyor detection circuit comprises an overload detection circuit 3 and a chain abnormality detection circuit 4, which respectively detect the current actual working power of the chip conveyor and the chain output condition; by controlling the on-off control direction of the drive circuit 1, the rotation switching of the output device connected to the chip conveyor control circuit 2 is realized; the chip conveyor can be switched to chain chip removal or spiral chip removal. When the chip conveyor is chain chip removal, it is connected to the first drive circuit, and when it is spiral chip removal, it is connected to the second drive circuit. The switching between chain chip removal and spiral chip removal is realized by switching the first drive circuit and the second drive circuit.

[0055] In this embodiment, the chip conveyor is controlled to perform chain chip removal by connecting the control circuit 2, the overload detection circuit 3 and the chain abnormality detection circuit 4 through the drive circuit 1. The drive circuit 1 adopts a three-phase motor, in which the UVW terminals are connected to the control circuit 2, the overload detection circuit 3 and the chain abnormality detection circuit 4. The motor power is 0.4KW, the working voltage is 220V, and the frequency is 50-60HZ.

[0056] Reference Figure 1 The drive circuit 1 includes a motor, the three-phase output port and the negative port of the motor are respectively connected to a plug socket connector, and the negative port is connected to a plug socket connector; the three-phase output port is connected to a thermal overload relay, and a three-phase arc extinguisher is connected between the three-phase output port and the thermal overload relay.

[0057] In this embodiment, the UVW output ends of the motor are connected to a three-phase arc extinguisher, which can eliminate arcs, suppress overvoltage, and eliminate electromagnetic interference to the maximum extent. The PE end of the motor is protectively grounded, and a thermal overload relay is connected on the other side of the three-phase arc extinguisher to achieve overload protection for the motor. When the motor overload reaches the set threshold, the thermal overload relay is disconnected.

[0058] In conjunction with the attached drawings, two parallel contactors are connected to the other side of the thermal overload relay. The contactors are three-stage contactors. The connection lines of the two contactors are in opposite order. By switching the two contactors on and off, the rotation direction of the motor is switched.

[0059] In this embodiment, two three-stage contactors are connected to the other side of the thermal overload relay. Specifically, one three-stage contactor is connected to the UVW lines of the motor output end, and the connection line of the other three-stage contactor is connected to the WVU of the motor output end. By switching the connection between the two three-stage contactors, the rotation direction of the three-phase motor is controlled. The output end of the drive circuit 1 is the R1, S1, and T1 lines.

[0060] Reference Figure 2 The chip conveyor control circuit 2 is connected to the normally closed switch, and the normally closed switches are respectively connected to two identical control circuits. The control circuit is connected to the DC relay coil, and the DC relay coil is connected in parallel with a first protection circuit for protecting the DC relay coil circuit. The other end of the DC relay is connected to a normally closed switch, and the normally closed switch is connected to the chip removal control module.

[0061] In this embodiment, the R1 line of the output end of the driving circuit 1 is connected to the input end of the control circuit, the input end of the control circuit 2 is connected to the normally closed switch, and the normally closed switch is connected to the two control circuits in the control circuit 2, which are respectively used to control the forward and reverse rotation of the chip removal motor chain chip removal. The control circuit 2 includes a DC relay coil, which can control the conduction and cutoff of large current with a smaller current, thereby playing a role of automatic control. The DC relay coil is connected in parallel with a first protection circuit, which can be specifically a surge suppressor. When a peak current or voltage suddenly occurs in the electrical circuit or communication line due to external interference, the surge protector can conduct and shunt in a very short time, thereby avoiding damage to other equipment in the circuit caused by the surge. The other end of the DC relay is connected to a normally closed switch, and the normally closed switch is connected to the chip removal control module.

[0062] In conjunction with the accompanying drawings, the input end of the chip removal control module is connected to the chip conveyor control circuit 2, and the output end is connected to the indicating device. The input end of the chip removal control module is connected to a plug socket connector, the plug socket connector is connected to a normally open switch, the normally open switch is connected to the chip conveyor output device, and the other side of the chip conveyor output device is connected to a DC relay coil, the DC relay coil is connected in parallel with the second protection circuit, and the other side of the DC relay coil is connected to a plug socket connector, which is connected to the plug socket connection indicating device 5.

[0063] In this embodiment, the DC relay coil is connected in parallel to a second protection circuit, specifically a diode, so that the control module operates at a certain voltage, and the output end of the control module is connected to an indicating device, specifically an indicator light.

[0064] Reference Figure 3 The overload detection circuit 3 includes a first power supply device, which is provided with a plurality of terminals, connected to the motor circuit through a plug connector, a normally open switch is connected between the terminals on both sides of the first power supply device, and the other terminal is connected to a first warning device, specifically the first warning device is an indicator light.

[0065] Reference Figure 4 The chain abnormality detection circuit 4 includes a second power supply device, which is provided with a plurality of terminals, connected to the motor circuit through a plug socket connector, three terminals of the second power supply device are connected to a proximity switch, a plug socket connector is connected between the proximity switch and the second power supply device, and another terminal of the second power supply device is connected to a second warning device, which is specifically an indicator light.

[0066] Reference Figure 5 When the chip conveyor is selected as spiral chip conveyor, the motor in the drive circuit 1 is added to control the two spiral chip conveying devices respectively.

[0067] In this embodiment, two motors are designed to control the chip conveyors at the left and right ends of the spiral chip conveyor respectively. The UVW segments of the two motors are connected correspondingly, and the three connected output lines are connected to two or three-level contactors to switch the rotation direction of the two motors.

[0068] There is a coating layer on the wires in the circuit. The raw materials of the coating layer include, by weight: 80 parts of TPE resin, 15 parts of plasticizer, 3 parts of antioxidant, 4 parts of filler, and 5 parts of polyethylene substances.

[0069] The TPE resin is a urethane resin with a brand name of 1298AU, purchased from Guangzhou Jingchen Plastics Co., Ltd.

[0070] The plasticizer is tri-n-butyl citrate.

[0071] The antioxidant is tris(2,4-di-tert-butylphenyl)phosphite.

[0072] The filler is ceramic powder among inorganic fillers.

[0073] The ceramic powder has a porosity of 0.2, a brand name TCB03, and was purchased from Tuolin Mineral Products Processing Plant.

[0074] The polyethylene material is polyethylene wax with a viscosity of 800 mPa·s and a brand name of D1103, purchased from Guangzhou Binlong Chemical Co., Ltd.

[0075] There is a coating layer on the wires in the circuit, and the preparation method of the coating layer material is as follows:

[0076] S1: The above raw materials were placed in a single-screw kneader, kneaded at 180°C for 20 minutes and then discharged.

[0077] S2: using a granulator to granulate the material discharged from step S1 to obtain a coating layer material.

[0078] Example 2

[0079] This embodiment 2 discloses a chip removal control circuit for a CNC optical machine. The specific implementation method is the same as that of embodiment 1, except that: there is a coating layer on the wires in the circuit. The raw materials of the coating layer include, by weight: 120 parts of TPE resin, 35 parts of plasticizer, 5 parts of antioxidant, 9 parts of filler, and 7 parts of polyethylene substances.

[0080] The TPE resin is a urethane resin with a brand name of 1298AU, purchased from Guangzhou Jingchen Plastics Co., Ltd.

[0081] The plasticizer is tri-n-butyl citrate.

[0082] The antioxidant is tris(2,4-di-tert-butylphenyl)phosphite.

[0083] The filler is ceramic powder among inorganic fillers.

[0084] The ceramic powder has a porosity of 0.2, a brand name TCB03, and was purchased from Tuolin Mineral Products Processing Plant.

[0085] The polyethylene material is polyethylene wax with a viscosity of 1000 mPa·s and a brand name of D1103, purchased from Guangzhou Binlong Chemical Co., Ltd.

[0086] There is a coating layer on the wires in the circuit, and the preparation method of the coating layer material is as follows:

[0087] S1: The above raw materials were placed in a single-screw kneader, kneaded at 200°C for 60 minutes, and then discharged.

[0088] S2: using a granulator to granulate the material discharged from step S1 to obtain a coating layer material.

[0089] Example 3

[0090] This embodiment 3 discloses a chip removal control circuit for a CNC optical machine. The specific implementation method is different from that of embodiment 1 in that: there is a coating layer on the wires in the circuit. The raw materials of the coating layer include, by weight: 115 parts of TPE resin, 24 parts of plasticizer, 4.2 parts of antioxidant, 6 parts of filler, and 5 parts of polyethylene substances.

[0091] The TPE resin is a urethane resin with a brand name of 1298AU, purchased from Guangzhou Jingchen Plastics Co., Ltd.

[0092] The plasticizer is tri-n-butyl citrate.

[0093] The antioxidant is tris(2,4-di-tert-butylphenyl)phosphite.

[0094] The filler is ceramic powder among inorganic fillers.

[0095] The ceramic powder has a porosity of 0.2, a brand name TCB03, and was purchased from Tuolin Mineral Products Processing Plant.

[0096] The polyethylene material is polyethylene wax with a viscosity of 1000 mPa·s and a brand name of D1103, purchased from Guangzhou Binlong Chemical Co., Ltd.

[0097] There is a coating layer on the wires in the circuit, and the preparation method of the coating layer material is as follows:

[0098] S1: The above raw materials were placed in a single-screw kneader and kneaded at 195°C for 45 minutes before discharging.

[0099] S2: using a granulator to granulate the material discharged from step S1 to obtain a coating layer material.

[0100] Comparative Example 1

[0101] This comparative example 1 discloses a chip removal control circuit for a CNC optical machine. The specific implementation method is different from that of Example 3 in that: in parts by weight, the raw materials of the coating layer are: 130 parts of TPE resin, 20 parts of plasticizer, 4.2 parts of antioxidant, 6 parts of filler, and 5 parts of polyethylene substances.

[0102] Comparative Example 2

[0103] Comparative Example 2 discloses a chip removal control circuit for a CNC optical machine. The specific implementation method is different from that of Example 3 in that: the polyethylene material is polytetrafluoroethylene, brand JF-4DCA, purchased from Xinshengli Plastic New Material Technology Co., Ltd.

[0104] Comparative Example 3

[0105] Comparative Example 3 discloses a chip removal control circuit for a CNC optical machine. The specific implementation method is different from that of Example 3 in that the viscosity of the polyethylene wax is 1500 mPa·s.

[0106] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

[0107] Performance Testing

[0108] 1. Weather resistance test: The wire coating materials of Examples 1-3 and Comparative Examples 1-2 in the CNC optical machine chip removal control circuit of the present invention were tested at a low temperature of -30°C and a high temperature of 100°C, respectively, with reference to the NES M0135 test method. The test criteria were the presence of wrinkles and breakage. The test results are recorded in Table 1.

[0109] 2. Flexibility Test: The wire coatings of Examples 1-3 and Comparative Examples 1-2 in the CNC optical machine chip removal control circuit of the present invention were bent 90 degrees using a 300-gram weight. The bending test was terminated when the first wrinkle appeared on the material surface. The number of bends was recorded, with 0-800 times considered poor, 800-2000 times considered good, and 2000-3000 times considered excellent. The results are recorded in Table 1.

[0110] Table 1

[0111]

[0112]

Claims

1. A chip removal control circuit for a numerically controlled optical machine, characterized in that: include: drive circuit (1), The driving circuit (1) is connected to the chip conveyor control circuit (2) and the chip conveyor detection circuit via a wire; The chip conveyor detection circuit includes an overload detection circuit (3) and a chain abnormality detection circuit (4), which respectively detect the actual working power of the chip conveyor and the chain output condition; By controlling the on-off of the driving circuit (1) to control the rotation direction of the motor, the rotation switching of the output device connected to the chip conveyor control circuit (2) is achieved; The chip conveyor can be switched to chain chip conveyor or spiral chip conveyor. When the chip conveyor is chain chip conveyor, it is connected to a first drive circuit, and when it is spiral chip conveyor, it is connected to a second drive circuit. The switching between chain chip conveyor and spiral chip conveyor is achieved by switching the first drive circuit and the second drive circuit.

2. The chip removal control circuit of a CNC optical machine according to claim 1, characterized in that: The drive circuit (1) comprises a motor, wherein the three-phase output port and the negative electrode port of the motor are respectively connected to a plug socket connector, and the plug socket connector of the negative electrode port; the three-phase output port is connected to a thermal overload relay, and a three-phase arc extinguisher is connected between the three-phase output port and the thermal overload relay.

3. The chip removal control circuit of a CNC optical machine according to claim 2, characterized in that: The other side of the thermal overload relay is connected to two parallel contactors, which are three-stage contactors. The connection lines of the two contactors are in opposite order. By switching the two contactors on and off, the rotation direction of the motor is switched.

4. The chip removal control circuit of a CNC optical machine according to claim 1, characterized in that: The chip conveyor control circuit (2) is connected to a normally closed switch, and the normally closed switch is respectively connected to two identical control circuits. The control circuit is connected to a DC relay coil, and the DC relay coil is connected in parallel with a first protection circuit for protecting the DC relay coil circuit. The other end of the DC relay is connected to a normally closed switch, and the normally closed switch is connected to a chip removal control module.

5. The chip removal control circuit of a CNC optical machine according to claim 2, characterized in that: The input end of the chip removal control module is connected to the chip conveyor control circuit (2), and the output end is connected to the indicating device. The input end of the chip removal control module is connected to the plug socket connector, the plug socket connector is connected to the normally open switch, the normally open switch is connected to the chip conveyor output device, the other side of the chip conveyor output device is connected to a DC relay coil, the DC relay coil is connected in parallel with the second protection circuit, the other side of the DC relay coil is connected to the plug socket connector, and the connecting plug socket is connected to the indicating device (5).

6. The chip removal control circuit of a CNC optical machine according to claim 1, characterized in that: The overload detection circuit (3) comprises a first power supply device, the first power supply device is provided with a plurality of connection terminals, connected to the motor circuit via a plug socket connector, a normally open switch is connected between the connection terminals on both sides of the first power supply device, and the other connection terminal is connected to a first warning device.

7. The chip removal control circuit of a CNC optical machine according to claim 1, characterized in that: The chain abnormality detection circuit (4) includes a second power supply device, the second power supply device is provided with a plurality of terminals, connected to the motor circuit via a plug socket connector, three terminals of the second power supply device are connected to a proximity switch, a plug socket connector is connected between the proximity switch and the second power supply device, and another terminal of the second power supply device is connected to a second warning device.

8. The chip removal control circuit of a CNC optical machine according to claim 1, characterized in that: When the chip conveyor is selected as a spiral chip conveyor, the motor in the drive circuit (1) is added to control two spiral chip conveying and removal devices respectively.

9. The chip removal control circuit of a CNC optical machine according to claim 1, characterized in that: The electric wires in the control circuit are covered with a coating.

10. The chip removal control circuit of a CNC optical machine according to claim 9, characterized in that: In parts by weight, the raw materials of the coating layer include: 80-120 parts of TPE resin, 15-35 parts of plasticizer, 3-5 parts of antioxidant, 4-9 parts of filler, and 5-7 parts of polyethylene substances.

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