Fluidic components and circuit components scattered in the fluidic mold

Abstract

In some examples, a fluidic die includes an array of fluidic elements for dispensing a fluid, wherein each of the fluidic elements includes a fluidic actuator and a fluid chamber. The fluidic die includes an array of fluid supply holes in multiple dimensions for communicating the fluid with the fluidic elements, wherein each of the multiple fluid supply holes along a first dimension of the multiple dimensions is different from the multiple fluid supply holes along a second dimension of the multiple dimensions. The fluidic die includes circuit elements interspersed in areas between the fluidic elements along different axes of the fluidic die, wherein each of the circuit elements includes an active device. The fluidic elements and the circuit elements are formed on a common substrate.

Description

Technical Field

[0001] The present disclosure generally relates to fluidic components and circuit components interspersed in a fluidic die. Background Art

[0002] The fluid dispensing system can dispense the fluid to a target. In some examples, the fluid dispensing system can include a printing system, such as a two-dimensional (2D) printing system or a three-dimensional (3D) printing system. The printing system can include a print head device that includes a fluidic actuator to cause the dispensing of the printing fluid. Summary of the invention

[0003] According to one aspect of the present disclosure, a fluidic mold is provided, comprising: an arrangement of fluidic elements for dispensing fluid, each of the fluidic elements comprising a fluidic actuator and a fluid chamber; an array of fluid supply holes in multiple dimensions across a substrate, for connecting the fluid to the fluidic elements, wherein each of the multiple fluid supply holes along a first dimension across the multiple dimensions across the substrate is different from the multiple fluid supply holes along a second dimension across the multiple dimensions across the substrate; and circuit elements interspersed in areas between the fluidic elements along different axes of the fluidic mold, resulting in alternating arrangement of the fluidic elements and the circuit elements along the different axes, wherein each of the circuit elements comprises an active device, and wherein the fluidic elements and the circuit elements are formed on a common substrate.

[0004] According to another aspect of the present disclosure, a method for forming a fluidic mold is provided, comprising: forming a layer of circuit elements on a substrate, wherein each circuit element of the circuit elements includes an active device; forming a layer of fluidic elements on the layer of circuit elements, wherein the fluidic elements are used to distribute fluid, the arrangement of the fluidic elements across the substrate has an area without flow structure between consecutive fluidic elements, and each of the fluidic elements includes a fluidic actuator and a fluid chamber; interspersing the circuit elements in the area between the fluidic elements along different axes of the fluidic mold, resulting in alternating arrangement of the fluidic elements and the circuit elements along the different axes; and forming an array of fluid supply holes in multiple dimensions for connecting the fluid to the fluidic elements, wherein each of the multiple fluid supply holes along a first dimension of the multiple dimensions is different from the multiple fluid supply holes along a second dimension of the multiple dimensions.

[0005] According to another aspect of the present disclosure, a fluidic mold is provided, comprising: a substrate; an arrangement of fluidic elements on the substrate for distributing fluids, each of the fluidic elements comprising a fluidic actuator and a fluid chamber, wherein the arrangement of fluidic elements comprises a first fluidic element along a first axis across the substrate, and a second fluidic element along a different second axis across the substrate; and circuit elements on the substrate and interspersed between the fluidic elements along each of the first axis and the second axis, resulting in the fluidic elements and the circuit elements being alternately arranged along each of the first axis and the second axis, wherein each of the circuit elements comprises an active device, and wherein the circuit elements comprise more than 10 first circuit elements along the first axis in a first region between consecutive first fluidic elements, and more than 10 second circuit elements along the second axis in a second region between consecutive second fluidic elements, wherein the fluidic elements and the circuit elements comprise an integrated circuit layer formed together on the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Some embodiments of the invention are described with reference to the following drawings.

[0007] Figure 1 is a block diagram of a fluidic die including an interspersed arrangement of fluidic cells and circuit elements according to some examples.

[0008] Figure 2 is a schematic cross-sectional view of a portion of a fluidic mold including a circuit element layer and a fluidic unit layer according to some examples.

[0009] Figure 3 is a block diagram of a portion of a fluidic die including an interspersed arrangement of fluidic cells and circuit elements, according to some embodiments.

[0010] Figure 4 is a flow chart of a process of forming a fluidic mold according to some examples.

[0011] Figure 5 is a block diagram of a fluidic die according to a further example.

[0012] Throughout the drawings, the same reference numerals denote similar, but not necessarily identical, elements. The drawings are not necessarily drawn to scale, and the dimensions of some components may be exaggerated to more clearly illustrate the examples shown. In addition, the drawings provide examples and / or implementations consistent with the description; however, the description is not limited to the examples and / or implementations provided in the drawings. DETAILED DESCRIPTION

[0013] In the present disclosure, the use of the terms "a", "an" or "the" is also intended to include plural forms, unless the context clearly indicates otherwise. In addition, the terms "include", "including", "comprise", "comprising", "have" or "having" when used in the present disclosure specify the presence of the elements described, but do not exclude the presence or addition of other elements.

[0014] The fluid dispensing device may include a fluidic actuator that causes the dispensing (e.g., ejection or other flow) of a fluid when activated. For example, the dispensing of a fluid may include ejecting fluid droplets from a corresponding nozzle of the fluid dispensing device by an activated fluidic actuator. In other examples, an activated fluidic actuator (such as a pump) may cause a fluid to flow through a fluid conduit or a fluid chamber. Thus, activating a fluidic actuator to dispense a fluid may refer to activating a fluidic actuator to eject a fluid from a nozzle, or activating a fluidic actuator to cause a fluid to flow through a flow structure, such as a flow conduit, a fluid chamber, etc.

[0015] In some examples, the fluidic actuator comprises a thermal-based fluidic actuator, comprising a heating element, such as a resistive heater. When the heating element is activated, the heating element generates heat, which can cause the fluid to evaporate, thereby causing a bubble (e.g., a steam bubble) to nucleate near the thermal-based fluidic actuator, which in turn causes a certain amount of fluid to be dispensed, such as ejected from an orifice of a nozzle or flowing through a fluid conduit or fluid chamber. In other examples, the fluidic actuator can be a deflection-type fluidic actuator, such as a piezoelectric film-based fluidic actuator, which applies a mechanical force to dispense a certain amount of fluid when activated.

[0016] In examples where the fluid dispensing device includes nozzles, each nozzle may include an orifice through which fluid is dispensed from a fluid chamber in response to activation of a fluidic actuator. Each fluid chamber provides fluid dispensed by a corresponding nozzle. In other examples, the fluid dispensing device may include a microfluidic pump having a fluid chamber.

[0017] Generally speaking, a fluidic actuator may be a jet-type fluidic actuator, to cause a fluid to be ejected, such as through an orifice of a nozzle, or a non-jet-type fluidic actuator, to cause a fluid to be displaced.

[0018] In some examples, the fluid dispensing device can take the form of a fluidic die. A "die" refers to an assembly that forms various layers on a substrate to create circuits, fluid chambers, and fluid conduits. Multiple fluidic dies can be mounted or attached to a support structure.

[0019] In some examples, the fluidic die can be a print head die that can be mounted to a print cartridge, a carriage assembly, etc. The print head die includes a nozzle through which a printing fluid (e.g., ink, a liquid reagent used in a 3D printing system, etc.) can be dispensed toward a target (e.g., a printing medium such as paper, transparent foil, fabric, etc., or a print bed including a 3D part formed by a 3D printing system to build a 3D object).

[0020] The fluidic die includes a fluidic element and a circuit for controlling the fluid dispensing operation of the fluidic element. The circuit includes logic for responding to an address signal and a control signal to generate an output signal, and the output signal controls a switch element for activating a corresponding fluidic actuator in the fluidic element.

[0021] The fluidic element includes a flow structure that provides fluid flow in the fluidic element. Examples of the flow structure include any one or some combination of the following: a fluid chamber that stores a fluid to be dispensed by the fluidic element, an orifice through which a fluid can flow from the fluid chamber to an area outside the fluid chamber, a fluid supply hole for communicating a fluid between a fluid flow conduit and the fluid chamber in the fluidic element, a fluid channel that conveys a fluid, and a fluidic actuator that causes the fluid to be dispensed through the fluidic element when activated (e.g., the fluidic actuator can include a thermal-based fluidic actuator or a deflection-type fluidic actuator).

[0022] In some examples, the fluidic mold includes a fluidic element contained in a fluidic architecture region, the fluidic architecture region not including a circuit having active devices. In such examples, the fluidic mold is divided into a fluidic architecture region and a circuit region outside the fluidic architecture region. The circuit region includes circuit elements including active devices.

[0023] As used herein, an "active device" may refer to a device that can be switched between different states, such as an on-state in which current flows through the device and an off-state in which current does not flow through the device (or the amount of current is negligible or below a certain threshold). An example of an active device is a transistor, such as a field effect transistor (FET). A transistor has a gate connected to a signal ("gate signal") to control the state of the transistor. When the gate signal is at an effective level (e.g., a low voltage or a high voltage depending on the type of transistor used), the transistor is turned on to conduct current between two other nodes of the transistor (e.g., the drain node and the source node of the FET). On the other hand, if the gate signal is at an inactive level (e.g., a high voltage or a low voltage depending on the type of transistor used), no current flows through the transistor (or the amount of current flowing through the transistor is negligible or below a specified threshold). In some cases, the gate signal of the transistor can be set to an intermediate level between the effective level and the inactive level, which causes the transistor to conduct an intermediate amount of current.

[0024] Another example of an active device is a diode. If the voltage across the two nodes of the diode exceeds a threshold voltage, the diode turns on to conduct current through the diode. However, if the voltage across the two nodes of the diode is less than the threshold voltage, the diode remains off.

[0025] Separating the fluidic die between the fluidic architecture area and the circuit area can simplify the interface between the circuit elements and the fluidic elements, or can be performed due to the arrangement of fluid supply slots in the fluidic die. Fluid supply slots refer to fluid conduits that can extend along the entire actuator column of the fluidic die. Fluid supply slots are used to carry fluid to and from the fluidic elements of the fluidic die.

[0026] Certain types of fluidic dies may employ sparsely arranged fluidic elements (the arrangement pattern density of the fluidic elements is lower than that of the fluidic elements in other fluidic dies). If a fluidic die has sparsely arranged fluidic elements, then the fluidic architecture area will occupy a larger area of ​​the fluidic die than the fluidic architecture area of ​​a fluidic die with more densely arranged fluidic elements. Given a fluidic die of the same size and assuming the same number of fluidic elements are used (compared to another fluidic die with more densely arranged fluidic elements), the larger fluidic architecture area of ​​the sparsely arranged fluidic elements will result in a smaller circuit area in the fluidic die, which results in greater compression of the circuit elements. In some cases, there may not be enough room for circuit elements in a fluidic die with sparsely arranged fluidic elements.

[0027] According to some embodiments of the present invention, Figure 1 As shown, the fluidic die 102 includes fluidic elements in the form of fluidic cells 104. "Fluidic cells" refers to a collection of flow structures, and the fluidic cells can be repeated on the fluidic die 102, such as to form an array. The fluidic cells 104 are interspersed with circuit elements along multiple different axes across the substrate 110 (of the fluidic die 102), and the fluidic cells 104 and the circuit elements are formed together on the substrate 110. If the fluidic cells are interspersed with circuit elements along a given axis, consecutive fluidic cells are separated by circuit elements, and consecutive circuit elements are separated by fluidic cells.

[0028] The different axes include a first axis 106 and a second axis 108 that is substantially orthogonal to the first axis 106. The first axis 106 and the second axis 108 are substantially orthogonal if the angle of the first axis 106 relative to the second axis 108 is within any of the following ranges: between 45° and 135°, between 60° and 120°, between 75° and 115°, and so on.

[0029] Figure 1Each circuit element in is represented as a box with a "C" in it. Each circuit element C includes one active device or multiple active devices. In some examples, the active devices of the circuit elements C can be interconnected to provide logical operations, such as logical AND, logical OR, logical inversion, etc. The active devices of the circuit elements C can also be used to perform other types of operations, such as providing latches, registers or other storage elements, providing variable resistance, etc. As an example, the circuit element C can be part of the control circuit of the injection mold 102, wherein the control circuit is used to control the operation of the injection unit 104 (more specifically, the injection actuator in the injection unit 104) in response to an input signal (such as an address signal, a control signal, data, etc.). The input signal can be received from a controller of the fluid dispensing system, such as a print controller of a printing system.

[0030] In other examples, active devices of circuit element C may be used to implement analog circuits. As described above, examples of active devices include transistors and diodes, or any other device that can switch between different states in response to an input signal.

[0031] exist Figure 1 In the example of FIG. 1 , the fluidic units 104 are arranged in a two-dimensional array along the first axis 106 and the second axis 108. In other examples, the array of fluidic units 104 can have a different pattern; for example, instead of rows or columns that are generally parallel to the axis 106 or 108, respectively, the lines of fluidic units 104 can be tilted relative to the axis 106 or 108. In addition, instead of having a regular pattern of fluidic units 104, the fluidic units 104 can have an irregular pattern or even a random pattern on the substrate 110 of the fluidic mold 102.

[0032] In some examples, a first number of circuit elements interspersed in an area between fluidic cells 104 along axis 106 is greater than a specified number (e.g., 10, 20, etc.), and a second number of circuit elements interspersed in an area between fluidic cells 104 along axis 108 is greater than a specified number (e.g., 10, 20, etc.).

[0033] exist Figure 1 In the example of FIG. 1 , each fluidic unit 104 includes a respective fluid supply hole 112 and a fluid chamber 114, and the fluid can be supplied to the fluid chamber 114 through the fluid supply hole 112. The fluidic unit 104 may also include a fluidic actuator 115, which, when activated, causes the fluid in the fluid chamber to pass through the orifice ( Figure 1 In a further example, the jet unit 104 may include a plurality of fluid supply holes and / or a plurality of orifices.

[0034] Although particular flow structures have been identified as being part of the fluidic units 104 , it should be noted that in other examples, additional or alternative types of flow structures may be included in each fluidic unit 104 .

[0035] exist Figure 1 In the example of FIG. 1 , the array of fluid supply holes 112 is arranged in multiple dimensions (e.g., along axes 106 and 108). The array of fluid supply holes 112 includes different fluid supply holes extending along a first dimension of the multiple dimensions, and different fluid supply holes extending along different second dimensions of the multiple dimensions. “Different” fluid supply holes refer to fluid supply holes that are independent of each other, as opposed to fluid supply slots that can extend a relatively long length to supply multiple jet units (such as a column of jet units). The fluid supply holes 112 are used to connect the fluid to the corresponding fluid chamber of the jet unit 104.

[0036] exist Figure 1 In the example of FIG. 1 , the injection mold 102 has multiple outer edges 102-1, 102-2, 102-3, and 102-4, which together form a roughly rectangular shape (viewed from the top or bottom). The "outer edge" of the injection mold refers to a portion of the outermost boundary of the injection mold 102. In other examples, the injection mold 102 can have different shapes.

[0037] In some examples, the first dimension or the second dimension of the multiple dimensions along which the fluid supply hole array 112 is arranged can be parallel to the outer edge (one of 102-1, 102-2, 102-3 and 102-4) of the injection mold 102. In further examples, both the first dimension and the second dimension are parallel to the corresponding outer edges of the injection mold 102.

[0038] Furthermore, each of the plurality of fluid supply apertures along a first dimension (eg, along axis 106) is different from the plurality of fluid supply apertures along a second dimension (eg, along axis 108). Figure 1 In the first row 150 of the illustrated array of fluidic units 104, each fluid supply aperture 112 in the fluidic units 104 in the second column 158 and the third column 160 is different from the plurality of fluid supply apertures 112 in the fluidic units 104 in the second row 152 and the last row 154 of the first column 156 of the array. Although there is a common fluidic unit 104 at the intersection of the first row 150 and the first column 156, the first row 150 has a plurality of fluidic units (in columns other than the first column 156) that are different from the plurality of fluidic units (in rows other than the first row 150) in the first column 156.

[0039] In some examples, the fluidic mold 102 can be mounted on a support structure (e.g., a print cartridge, a carriage, etc.) that is relatively movable relative to a target to which the fluid of the fluidic mold 102 is to be dispensed. For example, the target can be a printing substrate to which a printing fluid is dispensed in a 2D printing system, or a 3D building component to which a liquid reagent is dispensed during a 3D building operation of a 3D printing system. If one or both of the fluidic mold 102 and the target are movable, the fluidic mold 102 is movable relative to the target. In some examples, the fluidic mold 102 can be relatively movable relative to the target in a direction parallel to the axis 106 or 108.

[0040] Regions without flow structures are provided between consecutive fluidic units 104 along both the first axis 106 and the second axis 108. The fluidic units 104 do not use these regions for fluid flow. Circuit elements are placed in the regions between the fluidic units 104. As a result, the circuit elements are interspersed with the fluidic units 104 along both the axes 106 and 108. The elements of the fluidic units 104 interspersed with the circuit elements result in alternating arrangements of the fluidic elements and the circuit elements along the different axes 106 and 108.

[0041] In some examples, by alternating fluidic elements and circuit elements in a plurality of different axes, more space is provided on the substrate 110 of the fluidic die 102 to accommodate circuit elements while still allowing for a sparse arrangement of fluidic units 104 .

[0042] The fluidic unit 104 and the circuit elements are formed on a common substrate, namely, the substrate 110 of the fluidic mold 102. The substrate 110 may be a silicon substrate, or a substrate formed of another semiconductor material or a different material. Forming the fluidic unit 104 and the circuit elements on a common substrate means forming the layers of the fluidic unit 104 and the circuit elements as part of an integrated circuit process flow of a single integrated circuit device, which is Figure 1 In the figure is the fluidic mold 102. Circuit elements and the fluidic unit 104 formed on different substrates (such as as part of different integrated circuit devices formed using different integrated circuit process flows) will not be considered to be formed on a common substrate.

[0043] Figure 2 2 is a schematic cross-sectional view of a portion of a fluidic mold 200 attached to an interposer 240 or another type of structure according to a further example. The fluidic mold 200 includes layers 206, 208, 218, and 224. A "layer" (any of 206, 208, 218, and 224) may include a single layer or multiple layers that may be formed of different materials. Layers 224 and 218 constitute the substrate of the fluidic mold 200. Layers 224 and 218 may include epoxy-based photoresists (e.g., SU-8), silicon, another semiconductor material, or different materials.

[0044] Figure 2 Fluidic cells 204 and layers of circuit elements are shown (202 represents an active circuit element layer, such as a layer of an active device or multiple active devices). Circuit element layer 202 may include any or some combination of metal layers, polysilicon layers, doped regions, etc. The doped regions may be formed in layer 218. Metal layers and polysilicon layers of active devices may be formed on the doped regions. One or more thin film interconnect layers 230 (including metal or another conductive material) may be formed on layer 218, wherein thin film interconnect layers 230 may form electrical contacts or vias to electrically connect to the active devices.

[0045] The fluidic unit 204 can be connected with Figure 1 The jet units 104 are arranged in a similar manner (i.e., multiple jet units 204 can be arranged in an array along multiple axes, such as Figure 1 Axis 106 and 108 are shown). Circuit components formed using circuit component layer 202 may also be interspersed with fluidic elements 204 along a plurality of different axes.

[0046] Fluidic unit 204 includes orifice layer 206 in which orifice 207 (or multiple orifices) is formed. Chamber layer 208 is provided below orifice layer 206 and defines fluid chamber 210. Layers 206 and 208 may include any of a variety of different types of materials, such as epoxy, silicone, and the like.

[0047] The fluidic actuator 212 is formed on the layer 218 in the fluid chamber 210. If the fluidic actuator is a resistive heater, the fluidic actuator 212 can be formed using a thin film of a resistive material such as tungsten-silicon nitride, polysilicon, or any other material that exhibits resistivity. Activation of the fluidic actuator 212 causes the fluid in the fluid chamber 210 to be discharged through the orifice 207.

[0048] In some examples, circuit element layer 202 is formed on the substrate (including layers 224 and 218) of fluidic die 200 before the layers of fluidic unit 204. If the layer is directly on the substrate or if the layer is supported by the substrate through other layers, the layer is on the substrate. Chamber layer 208 is formed on layer 218 and on thin film layers (thin film layers for fluidic actuator 212 and thin film interconnect layer 230). Therefore, on Figure 2 In the embodiment, active circuit element layer 202 is formed on the substrate (including layers 224 and 218) before layers 208 and 206 for fluidic unit 204. After forming active circuit element layer 202 on the substrate, thin film layers (thin film layers for fluidic actuator 212 and thin film interconnect layer 230) are formed, followed by fluidic unit layers 208 and 206 on active circuit element layer 202.

[0049] exist Figure 2 In an example of , two fluid supply holes 214 and 216 are formed in the supply hole layer 218 (e.g., by etching the supply hole layer 218 to form fluid supply holes). The fluid supply hole 214 is an inlet fluid supply hole that allows fluid to flow into the fluid chamber 210. The fluid supply hole 216 is an outlet fluid supply hole from which the fluid in the fluid chamber 210 flows out. The inlet fluid supply hole 214 is in communication with the high-pressure chamber 220, and the outlet fluid supply hole 216 is in communication with the low-pressure chamber 222. The high-pressure chamber 220 and the low-pressure chamber 222 are formed in the layer 224 (e.g., by etching the layer 224 to form the chambers 220 and 222). The high-pressure chamber 220 is separated from the low-pressure chamber 222 by a wall 221 of the layer 224.

[0050] The pressure in the high pressure chamber 220 and the pressure in the low pressure chamber 222 may be controlled by respective pressure regulators (not shown). The pressure in the high pressure chamber 220 is higher than the pressure in the low pressure chamber 222.

[0051] The arrangement of the fluidic unit 204 allows the fluid to recirculate along the fluid path 226. The fluid may flow from the high pressure chamber 220 into the inlet fluid supply hole 214 and then into the fluid chamber 210. The fluid flows out of the fluid chamber 210 to the low pressure chamber 222 through the outlet fluid supply hole 216.

[0052] The recirculation may be performed to carry any contaminants in the fluid chamber 210 out of the fluid chamber 210. In other examples, the recirculation of fluid through the fluid chamber 210 may be performed for other purposes.

[0053] although Figure 2 A particular arrangement is shown in FIG. 2 to enable recirculation of fluid in the fluidic unit 204 , but in other examples, other arrangements may be used to achieve recirculation.

[0054] The circuit element layer 202 is formed in a region 250 of the flow structure without the jet unit 204. The region 250 is formed in each of the multiple axes (such as Figure 1 Between consecutive jet units 204 in the axes 106 and 108 shown.

[0055] The interposer 240 is a structure attached to the injection mold 200. The interposer 240 may include a fluid flow channel (not shown) to fluidly communicate with the chambers 220 and 222. The interposer 240 may be a mold separate from the injection mold 200.

[0056] Figure 3 is a block diagram of a portion of a fluidic die according to a further example, wherein fluidic cells 304 and circuit elements (represented by boxes labeled "C") are interspersed along different axes 306 and 308. Figure 3The jet units 304 in the embodiment have a stepped arrangement relative to the axis 306. Figure 1 The jet units 104 are arranged in rows and columns generally parallel to the respective axes 106 and 108, Figure 3 The arrangement of the fluidic units 304 in is a stepped arrangement, wherein the fluidic units 304 are stepped downward relative to the axis 306 such that the line of fluidic units 304 (extending generally along 320) is not parallel to the axis 306. The line of fluidic units (320) is angled (inclined) relative to the axis 306. In the stepped arrangement, each successive fluidic unit 304 along the line 320 is displaced downward (along the axis 308) from the immediately preceding fluidic unit 304 along the line 320 such that the line of fluidic units 304 320 is gradually stepped downward along the axis 308 relative to the axis 306.

[0057] Along orthogonal axis 308 , fluidic units 304 are aligned substantially parallel to axis 308 .

[0058] Each fluidic unit 304 includes fluid supply holes 310 and 312 (e.g., similar to Figure 2 In addition, each jet unit 304 includes orifices 314 and 316. For example, orifice 314 is larger than orifice 316.

[0059] Figure 4 According to some examples, a jet mold is formed (for example, according to Figure 1 , 2 or 3 jet mold) process 400.

[0060] Process 400 includes forming (at 402) a layer of circuit elements on a substrate, wherein each of the circuit elements includes an active device (eg, a transistor or a diode).

[0061] Process 400 includes forming (at 404) a layer of fluidic elements on a layer of circuit elements, wherein the fluidic elements are used to distribute fluid, the arrangement of the jet elements across the substrate having regions without flow structures between consecutive jet elements, each of the jet elements including a jet actuator and a fluid chamber.

[0062] Process 400 includes interspersing (at 406) circuit elements in areas between fluidic elements along different axes of the fluidic die.

[0063] Process 400 includes forming (at 408) an array of fluid supply holes in multiple dimensions to communicate fluid with the fluidic element, wherein each of the plurality of fluid supply holes along a first dimension of the plurality of dimensions is different from the plurality of fluid supply holes along a second dimension of the plurality of dimensions.

[0064] Figure 5is a block diagram of a fluidic die 500 according to a further example. The fluidic die 500 includes a substrate 502 and an arrangement of fluidic elements 504 on the substrate 502 for dispensing a fluid, each of the fluidic elements 504 including a fluidic actuator 520 and a fluid chamber 522. The arrangement of fluidic elements 504 includes a first fluidic element along a first axis 506 across the substrate 502, and a second fluidic element along a different second axis 508 across the substrate.

[0065] The fluidic die 500 further includes circuit elements 510 on the substrate 502. The circuit elements 510 are interspersed between the fluidic elements 504 along each of the first axis 506 and the second axis 508. Each circuit element 510 of the circuit elements 510 includes an active device. The circuit elements 510 include more than 10 first circuit elements along the first axis 506 in a first region between consecutive first fluidic elements 504, and more than 10 second circuit elements along the second axis 508 in a second region between consecutive second fluidic elements 504.

[0066] The fluidic element 504 and the circuit element 510 include integrated circuit layers formed together on the substrate 502 .

[0067] According to some examples of the present invention, the interspersed arrangement of fluidic elements and circuit elements can provide various benefits. For example, more space is provided on the substrate of the fluidic mold to accommodate circuit elements in the sparsely arranged fluidic elements. In addition, the circuit elements placed closer to the fluidic elements can reduce the parasitic impedance in the signals transmitted by the circuit elements. Interspersing the circuit elements with the fluidic elements allows for a greater density of circuit elements without increasing the overall size of the fluidic mold.

[0068] In the foregoing description, many details are set forth to aid understanding of the subject matter disclosed herein. However, implementations may be made without these details. Other implementations may include modifications and variations to the above details. The appended claims are intended to cover these modifications and variations.

Claims

1. A jet mold, comprising: an arrangement of fluidic elements for dispensing a fluid, each of the fluidic elements comprising a fluidic actuator and a fluid chamber; an array of fluid supply holes in a plurality of dimensions across a substrate for communicating the fluid with the fluidic element, wherein each of a plurality of fluid supply holes along a first dimension of the plurality of dimensions across the substrate is different from a plurality of fluid supply holes along a second dimension of the plurality of dimensions across the substrate; as well as interspersing circuit elements in regions between the fluidic elements along different axes of the fluidic die, resulting in alternating arrangements of fluidic elements and circuit elements along the different axes, wherein each of the circuit elements comprises an active device, Wherein, the fluidic element and the circuit element are formed on a common substrate.

2. The injection mold according to claim 1, wherein: The active devices include transistors.

3. The injection mold according to claim 1, wherein: The active device includes a diode.

4. The injection mold according to claim 1, wherein: A first number of circuit elements interspersed in the region between the fluidic elements along a first axis of the different axes across the substrate is greater than ten, and a second number of circuit elements interspersed in the region between the fluidic elements along a second axis of the different axes across the substrate is greater than ten.

5. The injection mold according to claim 1, wherein: A first dimension of the plurality of dimensions is parallel to an outer edge of the injection mold.

6. The injection mold according to claim 1, wherein: Each of the fluidic elements further comprises an inlet fluid supply aperture and an outlet second fluid supply aperture to recirculate fluid through the fluid chamber of the fluidic element.

7. The injection mold according to claim 1, wherein: Each of the fluidic elements further comprises an orifice through which fluid from the fluid chamber of the fluidic element is dispensed.

8. The injection mold according to claim 1, wherein: The arrangement of the fluidic elements comprises: first fluidic elements extending along a first axis of the different axes across the substrate, wherein first regions of no-flow structure are provided between consecutive ones of the first fluidic elements, and second fluidic elements extending along a second axis across the different axis of the substrate, wherein second regions of no-flow structure are provided between consecutive ones of the second fluidic elements, and Wherein, the circuit element comprises: a first circuit element in the first region, and a second circuit element in the second region.

9. The injection mold according to claim 1, wherein: The different axes are substantially orthogonal axes across the substrate.

10. The injection mold according to claim 1, wherein: The layer of fluidic elements is formed on the layer of circuit elements on the common substrate.

11. A method for forming a fluidizing mold, comprising: forming a layer of circuit elements on a substrate, wherein each circuit element of the circuit elements includes an active device; forming a layer of fluidic elements over the layer of circuit elements, wherein the fluidic elements are used to distribute fluids, an arrangement of the fluidic elements across the substrate having regions without flow structures between consecutive fluidic elements, and each of the fluidic elements comprising a fluidic actuator and a fluid chamber; interspersing the circuit elements in the region between the fluidic elements along different axes of the fluidic die, resulting in alternating arrangements of fluidic elements and circuit elements along the different axes; as well as An array of fluid supply holes is formed in multiple dimensions for communicating the fluid with the fluidic element, wherein each of the plurality of fluid supply holes along a first dimension of the plurality of dimensions is different from the plurality of fluid supply holes along a second dimension of the plurality of dimensions.

12. The method according to claim 11, wherein: The layer forming the circuit element includes a layer forming a transistor.

13. The method according to claim 11, wherein: The different axes include a first axis and a second axis substantially perpendicular to the first axis, and wherein interspersing the circuit elements in the region includes alternating the circuit elements and the fluidic elements along each of the first axis and the second axis.

14. A jet mold, comprising: substrate; an arrangement of fluidic elements on the substrate for dispensing a fluid, each of the fluidic elements comprising a fluidic actuator and a fluid chamber, wherein the arrangement of fluidic elements comprises a first fluidic element along a first axis across the substrate, and a second fluidic element along a second, different axis across the substrate; as well as circuit elements interspersed between the fluidic elements on the substrate and along each of the first axis and the second axis, resulting in an alternating arrangement of fluidic elements and circuit elements along each of the first axis and the second axis, wherein each of the circuit elements comprises an active device, and wherein the circuit elements comprise more than 10 first circuit elements along the first axis in a first region between consecutive first fluidic elements and more than 10 second circuit elements along the second axis in a second region between consecutive second fluidic elements, The fluidic element and the circuit element include an integrated circuit layer formed together on the substrate.

15. The injection mold according to claim 14, further comprising: An array of fluid supply holes in multiple dimensions is used to communicate the fluid with the ejection element, wherein a first dimension of the multiple dimensions is parallel to the outer edge of the ejection die.

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