A method of synthesizing an imaging electrical box

Abstract

The application relates to an imaging electric box synthesis method, relates to the field of imaging electric box synthesis based on spatial application, and solves the problems that, after the assembly of an existing imaging electric box, the lap joint resistance does not meet the index requirements, and the disassembly of the electric box easily leads to the deformation of the electric box, further reduces the heat conduction efficiency and the electric connection characteristics of a circuit board and the like, the method of index decomposition and step-by-step link control of the heat conduction resistance and the lap joint resistance is provided, a link model of heat conduction and electric lap joint is established, the electric box body plate is classified according to the heat conduction and electric lap joint purposes, and reasonable working steps are set. In the application, the electric box body plate with the electric lap joint function is pre-assembled, whether the final electric lap joint index meets the requirements is determined, and the final assembly is carried out after the electric lap joint index meets the requirements, on one hand, the disassembly after the glue smearing is not needed, and on the other hand, the repeated operations such as the cleaning of the redundant objects in the electric box and the dust removal can be avoided.

Description

Technical Field

[0001] This invention relates to the field of imaging electron box synthesis technology for space applications, and more specifically to a method for synthesizing imaging electron boxes. Background Technology

[0002] For the assembly method of circuit boards stacked together to form an electrical box, the heat generated by each circuit board needs to be transferred between the circuit board frame and the electrical box body plate, and finally transferred to the external cooling plate through heat pipes. In order to improve the heat conduction efficiency, insulating thermally conductive adhesive is usually applied between the circuit board frame and the electrical box body plate to fill the gap and increase the conduction area. The lap resistance between the connectors on each circuit board and the grounding post on the electrical box requires a good electrical connection between the circuit board frame and the electrical box body plate, which conflicts with the heat conduction requirements and requires a compromise between the two requirements. In addition, after the box body plate with adhesive is assembled, the test shows that the lap resistance does not meet the requirements. Disassembling the box after the adhesive dries is not only difficult, but also easy to cause deformation of the electrical box, further reducing the thermal conductivity and electrical connection characteristics of the circuit boards. The large amount of work required for cleaning excess materials and removing dust from the electrical box must be repeated. Summary of the Invention

[0003] To address the problems of existing imaging electrical boxes, such as insufficient lap resistance after assembly and deformation of the assembled box leading to further reduction in the thermal conductivity and electrical connection characteristics of the circuit board, this invention provides a method for synthesizing an imaging electrical box.

[0004] A method for synthesizing an imaging electron box, the method comprising the following steps:

[0005] Step 1: Connect the single circuit board frame of the imaging power box to the connector via threaded connection, ensuring that the overlap resistance R between the connector and the single circuit board frame is [value missing]. 单板板框→连接器 The overlap resistance should be less than or equal to half of the specified overlap resistance. After the overlap resistance requirement is met, apply adhesive to the screw heads at the threaded connection to fix the single circuit board frame to the connector.

[0006] Step 2: Measure the height of high-power components on the circuit board, and then adjust the height of the bosses on the heat-conducting cover to ensure that the distance between the high-power components and the bosses on the heat-conducting cover is 0.3-0.35mm; use a 0.25mm insulating heat-conducting pad, and fill the 0.05-0.1mm gap with glue.

[0007] Step 3: All circuit board frames are installed and fixed on the focal surface substrate to form a whole; the focal surface substrate and each circuit board frame are not electrically connected or thermally conductive.

[0008] Step 4: Close the boxes; the specific process is as follows:

[0009] Step four one, pre-assembly, namely: after installing three box plates and left and right side plates in contact with the connector, test, and require that the grounding pile and the connector have a lap joint resistance R 接地桩→上盖板 +R 上盖板→侧板 less than or equal to the lap joint resistance index;

[0010] Step four two, glue the plate frame side wall in contact with the large heat pipe on the left and right side plates, install the remaining box plates and the corresponding probe heat pipe, and finally install the light inlet box plate;

[0011] Step four three, heat control wiring, clean the dust in the electric box, install the light inlet side box plate, retest the lap joint resistance, glue the screws to prevent loosening, and complete the assembly of the heat control box.

[0012] Advantages of the present application:

[0013] 1. In the present application, multiple electric box body plates are divided into two categories, each for heat conduction and electrical lap joint, which meets the heat dissipation requirements of high-power components in the electric box and the electromagnetic compatibility of the electric box;

[0014] 2. In the method of the present application, by establishing an electric box lap joint resistance model, the control is carried out in steps and links to ensure that the final lap joint index meets the application requirements; the work efficiency is improved while the rework workload is reduced.

[0015] 3. In the present application, the electric box body plate with electrical lap joint function is pre-assembled to determine whether the final electrical lap joint index meets the requirements, and the final assembly is carried out after the electrical lap joint index meets the requirements, which on the one hand does not need to remove the glue after assembly, and on the other hand can avoid repeated operations such as cleaning of excess materials and dust removal in the electric box with large workload. BRIEF DESCRIPTION OF DRAWINGS

[0016] Fig. 1 The structure diagram of the imaging electric box in the synthesis method of the imaging electric box according to the present application;

[0017] Fig. 2 The connection relationship diagram of the electric box side plate and the circuit board frame and the connector in the imaging electric box according to the present application;

[0018] Fig. 3 The heat transfer path diagram of the high-power chip in the synthesis method of the imaging electric box according to the present application. DETAILED DESCRIPTION

[0019] In combination Figs. 1-3 The present embodiment is a synthesis method of an imaging electric box, Fig. 1The imaging electric box of the present application is composed of an upper cover plate 1, a lower cover plate 2 and a plurality of side plates 3 to form an approximately closed body; the upper cover plate 1 is provided with a grounding stake 4. The plurality of side plates include heat-conducting cover plates specially used for heat conduction, heat-conducting cover plates specially used for electrical connection and a light inlet plate. The light inlet plate is opposite to the detector in the electric box, and external light is irradiated onto the detector through the light inlet plate;

[0020] In the embodiment, the lap joint resistance and heat conduction resistance models are established

[0021] The lap joint resistance model requires that the lap joint resistance is less than or equal to the lap joint resistance index:

[0022] R 电箱 = R 接地桩→上盖板 + R 上盖板→侧板 + R 侧板→单板板框 + R 单板板框→连接器

[0023] The heat conduction resistance model is:

[0024] θ 芯片 = θ 芯片→导热盖板 + θ 导热盖板→板框 + θ 板框→大热管侧壁 + θ 大热管侧壁→大热管

[0025] In the formula, R 电箱 is the lap joint resistance between the grounding stake on the electric box and the connector; R 接地桩→上盖板 is the lap joint resistance between the grounding stake on the electric box and the upper cover plate; R 上盖板→侧板 is the lap joint resistance between the upper cover plate on the electric box and the side plate; R 侧板→单板板框 is the lap joint resistance between the side plate on the electric box and the single plate frame; R 单板板框→连接器 is the lap joint resistance between the connector and the single plate frame; θ 芯片 is the heat conduction resistance of the high-power chip; θ 芯片→导热盖板 is the heat conduction resistance between the high-power chip and the heat-conducting cover plate; θ 导热盖板→板框 is the heat conduction resistance between the frame and the heat-conducting cover plate; θ 板框→大热管侧壁 is the heat conduction resistance between the frame and the side wall of the electric box; and θ 大热管侧壁→大热管 is the heat conduction resistance between the large heat pipe and the side wall of the electric box.

[0026] In the embodiment, the steps of assembling the electric box are as follows:

[0027] Step 1: The single circuit board frame is installed with the connector, and the thread of the fixed screw is not smeared with glue during the installation process, and the screw head is glued only after being tightened. After the installation is completed, the lap joint resistance R 单板板框→连接器 between the connector and the frame is tested to be less than or equal to half of the lap joint resistance index. If the requirement is not met, the lap joint resistance is treated (the torque is increased or the contact surface is ground, etc.) to ensure that the final requirement is met.

[0028] Step 2: Perform high-power component height measurement on the circuit board, then perform boss height grinding on the heat-conducting cover plate to ensure a spacing of 0.3-0.35mm; use a 0.25mm insulating heat-conducting pad, and fill the gap of 0.05-0.1mm with glue;

[0029] Step 3: All circuit boards are installed and fixed on the focal plane substrate to form a whole; the focal plane substrate and the circuit board are not electrically connected and conduct heat;

[0030] As shown in Fig. 2 , in this embodiment, the connector and the circuit board frame are tightly connected together; the electric box side plate is provided with a hole at the position of the connector to expose part of the connector; the circuit board frame and the electric box side plate are fixed and connected by screws, that is, the connection between the connector and the electric box side plate is mainly realized by the connection between the circuit board frame and the electric box side plate. To reduce the lap joint resistance between the connector and the electric box side plate, it is necessary to reduce the lap joint resistance between the connector and the circuit board frame, and at the same time reduce the lap joint resistance between the circuit board frame and the electric box side plate.

[0031] Step 4: Assembling the box.

[0032] (1) Pre-assemble the box, test after installing the three box body plates and left and right titanium alloy side plates in contact with the connector, and require that the lap joint resistance R 接地桩→上盖板 +R 上盖板→侧板 of the grounding pile and the connector is less than or equal to the lap joint resistance index; if not, it needs to be processed to ensure that the final requirement is met;

[0033] (2) Only the side wall of the plate frame in contact with the two large heat pipe box body plates is coated with glue, and the thickness of the glue is controlled to ensure that the glue does not overflow to other positions;

[0034] (3) Install the remaining box body plates and the corresponding probe heat pipes, and install the light inlet box body plate last;

[0035] (4) Thermal control wiring;

[0036] (5) Dust cleaning operation in the electric box, and installation of the light inlet side box body plate;

[0037] (6) Lap joint resistance retest;

[0038] (7) Screw point glue anti-looseness;

[0039] (8) Thermal control box body wiring.

[0040] In this embodiment, the imaging controller uses virtex6 device and its internal resources; the TDICMOS image sensor uses the customized product of Changguanchen Co., Ltd., the integrating sphere uses the common integrating sphere with aperture larger than the size of the detector, the image data acquisition and processor uses the PC with CameraLink acquisition card to perform image acquisition and processing; the temperature controller uses high-low temperature box.

Claims

1. A method for synthesizing an imaging box, characterized in that: In this method, an approximately closed body is formed by an upper cover plate, a lower cover plate, and multiple side plates; the upper cover plate is equipped with a grounding stake; the multiple side plates include a heat-conducting cover plate for heat conduction, a heat-conducting cover plate for electrical connection, and an inlet plate; this synthesis method is implemented by the following steps: Step 1: Connect the single circuit board frame of the imaging power box to the connector via threaded connection, ensuring the overlap resistance between the connector and the single circuit board frame is within acceptable limits. The overlap resistance should be less than or equal to half of the specified overlap resistance. After the overlap resistance requirement is met, apply adhesive to the screw heads at the threaded connection to fix the single circuit board frame to the connector. Step 2: Measure the height of high-power components on the circuit board, and then adjust the height of the bosses on the heat-conducting cover to ensure that the distance between the high-power components and the bosses on the heat-conducting cover is 0.3 to 0.35 mm; use a 0.25 mm insulating thermal pad, and fill the 0.05 to 0.1 mm gap with glue. Step 3: All circuit board frames are installed and fixed on the focal surface substrate to form a whole; the focal surface substrate and each circuit board frame are not electrically connected or thermally conductive. Step 4: Close the boxes; the specific process is as follows: Step 41: Pre-assembly of the enclosure, i.e., after installing the three enclosure panels that will contact the connector and the left and right side panels, test the connection resistance between the grounding stake and the connector. Less than or equal to the lap resistance specification; In the formula, This refers to the contact resistance between the grounding stake on the electrical box and the connector. This refers to the lap resistance between the grounding stake on the electrical box and the top cover plate. This refers to the lap resistance between the top cover and side panels of the electrical box. This refers to the overlap resistance between the side panel of the electrical box and the frame of the single-board unit. This refers to the overlap resistance between the connector and the board frame. Step 42: Apply adhesive to the side wall of the frame that contacts the large heat pipes on the left and right side panels, install the remaining cabinet panels and corresponding detector heat pipes, and install the light inlet cabinet panel last. Step 43: Thermal control wiring, cleaning dust inside the electrical box, installing the optical port side panel, retesting the lap resistance, applying adhesive to the screws to prevent loosening, and wiring the thermal control box to complete the enclosure assembly.

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