An electronic paper and a method for producing the same

Abstract

The present application relates to a kind of electronic paper and its production method, wherein electronic paper includes: TFT backplane;Electronic ink layer is set on TFT backplane;Transparent electrode layer is set on electronic ink layer and is located at the side away from TFT backplane;Wherein, TFT backplane has common electrode, transparent electrode layer is electrically connected between common electrode by conductive silver paste, conductive silver paste penetrates electronic ink layer, transparent electrode layer is opened with through hole corresponding to the position of conductive silver paste.Corresponding production method is to open through hole on transparent electrode layer, so that it is communicated with the silver paste hole opened in electronic ink layer, so that when needing to confirm the VCOM conduction of electronic paper film and TFT backplane, only need to remove top protective film layer, measure exposed silver paste from through hole, without removing electronic paper film electronic ink layer and transparent electrode layer, so as to save material, improve the accuracy of measurement, while reducing the damage probability in measurement process.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic paper display device, and particularly relates to an electronic paper and a production method thereof. BACKGROUND

[0002] Electronic paper is a technology of realizing black and white or color display by driving electronic ink through an array substrate. Due to its extremely low power consumption and the advantage of being suitable for human eye reading, the electronic paper gradually attracts people's attention. In order to promote paperless, electronic billboards such as electrophoretic display (EPD) or electronic paper display device can replace traditional printed billboards. The electronic billboards are not only light in weight and thin in thickness, but also have bendability, so they are also rapidly promoted to the fields of electronic tags, billboards, word cards, digital chest cards, digital table cards, subway rings, digital currencies and the like.

[0003] The electronic paper is mainly composed of an electronic paper film, a TFT back plate and a driving chip. The electronic paper film is mainly composed of electronic ink and a surface ITO electrode. In the use process, sometimes the picture refresh speed is slow or display abnormalities occur. Usually, whether the silver paste point for connecting the VCOM pad on the electronic paper film and the VCOM pad on the TFT is abnormal is confirmed. However, due to the limitation of the existing electronic paper structure, the electronic paper film needs to be taken off from the TFT back plate, and then the resistance value of the silver paste point can be measured. However, the detection process is often destructive measurement, which may cause damage to the electronic paper structure, and there is a problem of large measurement error. SUMMARY

[0004] One of the main purposes of the present application is to overcome at least one of the above-mentioned defects, and to provide an electronic paper capable of conveniently measuring the silver paste point for maintenance.

[0005] Another main purpose of the present application is to overcome at least one of the above-mentioned defects, and to provide a production method for producing the above-mentioned electronic paper capable of conveniently measuring the silver paste point for maintenance.

[0006] To achieve the above-mentioned purposes, the technical scheme adopted by the present application is as follows:

[0007] The present application provides an electronic paper, comprising:

[0008] a TFT back plate;

[0009] an electronic ink layer arranged on the TFT back plate;

[0010] a transparent electrode layer arranged on the electronic ink layer and located on a side away from the TFT back plate;

[0011] The TFT backboard has a common electrode, the transparent electrode layer is electrically connected with the common electrode through the conductive silver paste, the conductive silver paste penetrates the electronic ink layer, and the transparent electrode layer is provided with a through hole corresponding to the position of the conductive silver paste.

[0012] According to one of the embodiments of the present application, a silver paste hole is formed in the electronic ink layer, one end of the silver paste hole is connected with the transparent electrode layer, and the other end of the silver paste hole is connected with the common electrode, and the conductive silver paste is filled in the silver paste hole.

[0013] According to one of the embodiments of the present application, the silver paste hole is connected with the through hole, and the conductive silver paste fills the silver paste hole and the through hole.

[0014] According to one of the embodiments of the present application, the silver paste hole is arranged corresponding to the common electrode, and the silver paste hole covers the common electrode.

[0015] According to one of the embodiments of the present application, the aperture of the through hole is 1 / 3-1 / 2 of the aperture of the silver paste hole.

[0016] According to one of the embodiments of the present application, the conductive silver paste is filled in the through hole.

[0017] According to one of the embodiments of the present application, a protective film layer is arranged above the transparent electrode layer, and the protective film layer is located away from the electronic ink layer.

[0018] According to one of the embodiments of the present application, the protective film layer covers the through hole.

[0019] In particular, the present application provides a production method of the electronic paper as described above, which comprises:

[0020] arranging an electronic ink layer on the TFT backboard;

[0021] punching the electronic ink layer to form a silver paste hole;

[0022] arranging the transparent electrode layer above the electronic ink layer;

[0023] punching the transparent electrode layer to form a through hole, and the through hole is arranged above the silver paste hole;

[0024] filling the conductive silver paste from the through hole, and the conductive silver paste is filled in the silver paste hole.

[0025] According to one of the embodiments of the present application, the conductive silver paste fills the silver paste hole and the through hole.

[0026] Compared with the prior art, the electronic paper and the production method thereof have the advantages and beneficial effects that:

[0027] The electronic paper of the present application is specially designed for the silver paste hole connecting the TFT back plate and the transparent electrode layer. The corresponding production method is to form a through hole on the transparent electrode layer, so as to communicate with the silver paste hole formed in the electronic ink layer. Therefore, when it is necessary to confirm the VCOM conduction of the electronic paper film and the TFT back plate, the top protective film layer only needs to be removed, and the exposed silver paste is measured through the through hole, without removing the electronic ink layer and the transparent electrode layer of the electronic paper film, thereby saving materials, improving the measurement accuracy, and reducing the damage probability in the measurement process. BRIEF DESCRIPTION OF DRAWINGS

[0028] Some specific embodiments of the present application will be described in detail hereinafter with reference to the accompanying drawings in an exemplary and non-limiting manner. The same reference signs in the drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that the drawings are not necessarily drawn to scale. In the drawings:

[0029] Figure 1 is a structural schematic diagram of an electronic paper according to an embodiment of the present application, in which the conductive silver paste is not filled;

[0030] Figure 2 is a structural schematic diagram of an electronic paper according to an embodiment of the present application, in which the conductive silver paste is filled.

[0031] The reference signs are explained as follows:

[0032] 1. TFT back plate, 11. common electrode, 12. substrate, 13. TFT array circuit layer, 14. lower electrode layer;

[0033] 2. Electronic ink layer, 21. silver paste hole;

[0034] 3. Transparent electrode layer, 31. through hole, 32. electrode connection area;

[0035] 4. Conductive silver paste;

[0036] 5. Protective film layer;

[0037] 6. Edge sealing glue;

[0038] 7. Driving IC. DETAILED DESCRIPTION

[0039] The technical solutions of the present application will be described clearly and completely below in conjunction with the drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0040] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0041] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0042] Embodiment 1:

[0043] This embodiment describes an electronic paper, as shown in Figure 1 、 Figure 2 , comprising:

[0044] a TFT backplane 1;

[0045] an electronic ink layer 2 disposed on the TFT backplane 1;

[0046] a transparent electrode layer 3 disposed on the electronic ink layer 2 and located away from the TFT backplane 1;

[0047] wherein the TFT backplane 1 has a common electrode 11, the transparent electrode layer 3 is electrically connected to the common electrode 11 through a conductive silver paste 4, the conductive silver paste 4 penetrates the electronic ink layer 2, and the transparent electrode layer 3 has a through hole 31 corresponding to the position of the conductive silver paste 4.

[0048] Generally, the TFT backplane 1 can include a substrate 12, a TFT array circuit layer 13 and a lower electrode layer 14 arranged in layers from bottom to top, the electronic ink layer 2 is arranged above the lower electrode layer 14, the electronic ink layer 2 is arranged between the transparent electrode layer 3 and the lower electrode layer 14, the transparent electrode layer 3 is a common electrode layer, the lower electrode layer 14 is connected with the TFT array circuit layer 13, and the common electrode 11 is connected with the lower electrode layer 14 and used for providing a common voltage. The TFT array circuit layer 13 receives a driving waveform from an external driving IC and then selects to inject positive charges or negative charges into the lower electrode layer 14 to complete color display switching of a corresponding pixel unit in the electronic ink layer 2, and the amount of the injected charges can also be selected to realize the color display degree of the pixel unit.

[0049] Since the electrode connecting area 32 on the electronic paper film is connected with the common electrode 11 of the TFT backplane 1, the common electrode 11 and the electrode connecting area 32 are electrically connected through the conductive silver paste 4. Since the through hole 31 is arranged on the transparent electrode layer 3, when it is necessary to confirm the VCOM conductivity between the transparent electrode layer 3 and the TFT backplane 1, the exposed silver paste can be directly measured from the through hole, without removing the electronic ink layer and the transparent electrode layer of the electronic paper film, thereby saving materials, improving the measurement accuracy, and reducing the damage probability in the measurement process.

[0050] In an embodiment, a silver paste hole 21 is arranged in the electronic ink layer 2, the silver paste hole 21 penetrates the electronic ink layer, one end of the silver paste hole 21 is connected with the transparent electrode layer 3, the other end of the silver paste hole 21 is connected with the common electrode 11, and the conductive silver paste 4 is filled in the silver paste hole 21. The arrangement of the silver paste hole 21 distinguishes from the traditional processing mode of “pointing silver paste”, and facilitates the arrangement of the conductive silver paste 4 in the electronic paper.

[0051] In an embodiment, the silver paste hole 21 is arranged corresponding to the common electrode 11, and the silver paste hole 21 covers the common electrode 11. The size of the silver paste hole 21 corresponds to the area of the common electrode 11, which can improve the fullness of the arrangement of the conductive silver paste 4 between the transparent electrode layer 3 and the TFT backplane 1, ensure the good VCOM conductivity between the transparent electrode layer 3 and the lower electrode layer 14, and improve the product yield.

[0052] In an embodiment, the aperture of the through hole 11 is 1 / 3-1 / 2 of the aperture of the silver paste hole 21, which can facilitate the conductive silver paste 4 to fill the entire silver paste hole 21 after flowing into the silver paste hole 21 through the through hole 11, and avoid the generation of gaps. If the aperture of the through hole 11 is too small or too large, the conductive silver paste 4 is accumulated in a sharp shape when being poured into the silver paste hole 21, so that gaps are generated in the upper part of the conductive silver paste 4, which affects the conductivity.

[0053] In an embodiment, the silver paste hole 21 is connected with the through hole 31, and the conductive silver paste 4 is filled and expanded into the through hole 31. In order to ensure good VCOM conductivity, the conductive silver paste 4 is usually filled in the silver paste hole, but it is not limited whether it is filled into the through hole 31, because the through hole 31 is used to measure the resistance and other parameters of the silver paste point by inserting the probe, metal conductive medium and the like into the through hole to contact the internal conductive silver paste 4, which can achieve the purpose of the application, so that the filling state of the conductive silver paste 4 in the through hole 31 is not limited.

[0054] In a preferred embodiment, the conductive silver paste 4 fills the silver paste hole 21 and the through hole 31. The aperture of the silver paste hole 21 and the through hole 31 is certain in the production process, so that the overall resistance is certain after being filled with the conductive silver paste 4, which is basically maintained at a certain value, which can ensure the uniformity of the product silver paste point resistance and is beneficial to product development and maintenance.

[0055] In an embodiment, a protective film layer 5 is arranged above the transparent electrode layer 3, and the protective film layer 5 is located away from the electronic ink layer 2. The electronic ink layer 2 and the transparent electrode layer 3 form an electronic paper film, and the electronic paper film is attached to the TFT backboard 1 by the self-provided OCA glue. The protective film layer 5 is arranged above the electronic paper film, i.e., the electronic ink layer 2, and is protected and further fixed by the edge sealing glue 6 around. A driving IC 7 connected with the TFT array circuit layer 13 is further arranged on the TFT backboard 1, and the driving IC 7 inputs a control waveform to the TFT array circuit layer 13 for controlling the specific display of the electronic paper.

[0056] In a further embodiment, the protective film layer 5 covers the through hole 31.

[0057] Embodiment 2:

[0058] This embodiment describes a production method of the electronic paper as described above, which comprises:

[0059] An electronic ink layer 2 is arranged on the TFT backboard 1;

[0060] The electronic ink layer 2 is punched to form a silver paste hole 21;

[0061] The transparent electrode layer 3 is arranged above the electronic ink layer 2 to form an electronic paper film;

[0062] The transparent electrode layer 3 is punched to form a through hole 31, and the position of the through hole 31 is above the silver paste hole 21, and the through hole 31 is arranged in the electrode connection area 32 of the transparent electrode layer 3.

[0063] The electronic paper film is fixed on the TFT back plate 1 by the edge sealing glue, and the electronic ink layer 2 is located between the transparent electrode layer and the TFT back plate 1. The conductive silver paste 4 is filled in the through hole 31, and the conductive silver paste 4 fills the silver paste hole 21, so that the conductive silver paste 4 can conductively connect the electrode connecting area 32 and the common electrode 11.

[0064] The traditional conductive silver paste is set by first printing the edge sealing glue around the TFT back plate, then printing the silver paste in the edge sealing glue, and the position of the silver paste is located at the position of the common electrode of the TFT back plate, then the electronic paper film is attached to the edge sealing glue, and the electrode connecting area of the transparent electrode layer of the electronic paper film is attached to the silver paste, and then the transparent electrode layer and the lower electrode layer of the TFT back plate are electrically connected through the silver paste after the attachment is completed.

[0065] Compared with the traditional silver paste setting method, the production method of the present application adopts a production method different from the traditional silver paste setting method, which can ensure the reliability of the electrical connection, facilitate the resistance measurement of the silver paste point in the later stage, facilitate testing, and reduce the destructive risk of component damage caused by maintenance.

[0066] In an embodiment, the conductive silver paste 4 fills the silver paste hole 21 and the through hole 31. After the silver paste hole 21 and the through hole 31 are filled with the conductive silver paste 4, the overall resistance is determined, which is basically maintained at a certain value, which can ensure the uniformity of the silver paste point resistance of the product, which is beneficial to product development and maintenance. The electronic paper production method of the present embodiment specially designs the silver paste hole 21 connecting the TFT back plate 1 and the upper transparent electrode layer 3, and the corresponding production method is to open a through hole 31 on the transparent electrode layer 3, so that it is communicated with the silver paste hole 21 opened in the electronic ink layer 2, so that when it is necessary to confirm the VCOM conduction of the transparent electrode layer 3 of the electronic paper film and the TFT back plate 1, only the top protective film layer 5 needs to be removed, and the exposed silver paste can be measured through the through hole 31, without removing the electronic ink layer and the transparent electrode layer of the electronic paper film, thereby improving the accuracy of measurement, avoiding damage to the components, and reducing the damage probability in the measurement process.

[0067] Compared with the traditional electronic paper and its display device, when measuring the silver paste point in the fault state, due to the limitation of the existing electronic paper structure, the electronic paper film needs to be removed from the TFT back plate, and then the resistance of the silver paste point can be measured. In this disassembly process, the electronic paper film or the TFT back plate may be damaged, causing secondary damage in the maintenance process and unnecessary economic loss.

[0068] The above examples are only for illustrating the technical concept and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and to implement it, and cannot limit the protection scope of the present application. Any equivalent changes or modifications made according to the spirit and essence of the present application shall be covered within the protection scope of the present application.

Claims

1. An electronic paper, characterized by comprising: The application relates to an electronic ink display device, which comprises: a TFT backboard (1); an electronic ink layer (2) arranged on the TFT backboard (1); a transparent electrode layer (3) arranged on the electronic ink layer (2) and located on a side away from the TFT backboard (1); wherein the TFT backboard (1) is provided with a common electrode (11), the transparent electrode layer (3) is electrically connected with the common electrode (11) through conductive silver paste (4), the conductive silver paste (4) penetrates the electronic ink layer (2), and the transparent electrode layer (3) is provided with a through hole (31) corresponding to the position of the conductive silver paste (4).

2. The electronic paper of claim 1, wherein, A silver paste hole (21) is arranged in the electronic ink layer (2), the silver paste hole (21) penetrates the electronic ink layer, one end of the silver paste hole (21) is connected with the transparent electrode layer (3), and the other end of the silver paste hole (21) is connected with the common electrode (11), and the conductive silver paste (4) is filled in the silver paste hole (21).

3. The electronic paper of claim 2, wherein, The silver paste hole (21) is connected with the through hole (31), and the conductive silver paste (4) fills the silver paste hole (21) and the through hole (31).

4. The electronic paper of claim 2, wherein, The silver paste hole (21) is arranged corresponding to the common electrode (11), and the silver paste hole (21) covers the common electrode (11).

5. The electronic paper of claim 2, wherein, The aperture of the through hole (31) is 1 / 3-1 / 2 of the aperture of the silver paste hole (21).

6. The electronic paper according to any one of claims 1 to 5, wherein, The conductive silver paste (4) is filled and expanded into the through hole (31).

7. The electronic paper of claim 1, wherein, A protective film layer (5) is arranged above the transparent electrode layer (3), and the protective film layer (5) is located on a side away from the electronic ink layer (2).

8. The electronic paper of claim 7, wherein, The protective film layer (5) covers the through hole (31).

9. A method for producing the electronic paper according to any one of claims 1 to 7, characterized by, The application relates to an electronic ink display device, which comprises: arranging an electronic ink layer (2) on the TFT backboard (1); punching the electronic ink layer (2) to form a silver paste hole (21); arranging the transparent electrode layer (3) above the electronic ink layer (2); punching the transparent electrode layer (3) to form a through hole (31), and the position of the through hole (31) is located above the silver paste hole (21); filling the conductive silver paste (4) from the through hole (31), and the conductive silver paste (4) is filled in the silver paste hole (21).

10. The production method according to claim 9, characterized by, The conductive silver paste (4) fills the silver paste hole (21) and the through hole (31).

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