Electronic device

Abstract

An electronic device includes a substrate, conductive lines, anisotropic conductive blocks, and a plastic layer. The substrate has a setting surface with a mounting area and a covering area around the mounting area. The conductive lines are disposed on the covering area and each of the conductive lines passes through the mounting area. The anisotropic conductive blocks include an anisotropic conductive layer with a first conductive surface, a second conductive surface, and a side surface. The first conductive surface is opposite to the second conductive surface. The side surface is connected between the first conductive surface and the second conductive surface and surrounds the first conductive surface and the second conductive surface. The anisotropic conductive blocks cover the mounting area through the first conductive surface. The plastic layer surrounds the side surface and covers the covering area.

Description

Technical Field

[0001] This invention relates to an electronic device, and more particularly to an electronic device made by combining plastic with a flexible electronic circuit board. Background Technology

[0002] In-mold electronics are highly reliable, lightweight electronic devices with a three-dimensional appearance and decorative function. They are made by encasing electronic flexible circuit boards (substrates) containing electronic components in a plastic shell and shaping them into a three-dimensional form. They are suitable for use in various operable electronic products, such as automobiles, home appliances, or consumer electronics, and have great development potential.

[0003] When electronic devices such as in-mold electronics are electrically connected to other devices, in addition to connecting them to other devices via ribbon cables extending from the electronic flexible circuit board, a connector can also be provided on the electronic flexible circuit board and pass through the plastic shell, and the connector can be electrically connected to other devices via lines plugged into the connector. Summary of the Invention

[0004] This invention provides an electronic device that is easy to manufacture.

[0005] To achieve the above advantages, one embodiment of the present invention provides an electronic device, including: a substrate, conductive lines, an anisotropic conductive block, and a plastic layer. The substrate has a mounting surface, a mounting area, and a covering area, the covering area surrounding the mounting area. Conductive lines are disposed in the covering area, and a portion of each conductive line passes through the mounting area. The anisotropic conductive block includes an anisotropic conductive layer, the anisotropic conductive layer having a first conductive surface, a second conductive surface, and a side surface, the first conductive surface being opposite to the second conductive surface, the side surface connecting between and surrounding the first and second conductive surfaces, and the anisotropic conductive block covering the mounting area through the first conductive surface. The plastic layer surrounds the side surface and covers the covering area.

[0006] In one embodiment of the present invention, the aforementioned anisotropic conductive block is an elastic element.

[0007] In one embodiment of the present invention, the second conductive surface described above has a plurality of sockets.

[0008] In one embodiment of the present invention, the anisotropic conductive block further includes two insulating layers, the anisotropic conductive layer being located between the two insulating layers and being connected to the two insulating layers by means of a side.

[0009] In one embodiment of the present invention, a gap is formed between the side surface of the anisotropic conductive block and a surface of the plastic layer surrounding the side surface.

[0010] In one embodiment of the present invention, the substrate is a flexible substrate.

[0011] In one embodiment of the present invention, the substrate includes a covering portion and a wire output portion. The wire output portion extends from one side of the covering portion, and the mounting surface is located only in the covering portion. The wire output portion has multiple ribbon cables, which are electrically connected to conductive lines.

[0012] Based on the above description, the electronic device of the present invention provides waterproof, dustproof, and aesthetically pleasing protection for its internal electronic components, all protected by a plastic layer. Furthermore, by employing anisotropic conductive blocks as connectors for connection to external circuitry, the conductive properties of these blocks solve the problem of accurately positioning the contacts on the connectors relative to the desired conductive lines during the manufacturing of electronic devices, thus offering the advantage of ease of manufacturing.

[0013] To make the above and other objects, features and advantages of the present invention more apparent and understandable, specific embodiments are described below in conjunction with the accompanying drawings. Attached Figure Description

[0014] Figure 1 This is a three-dimensional schematic diagram of the substrate of an electronic device according to an embodiment of the present invention;

[0015] Figure 2A and Figure 2B This is a schematic diagram of the manufacturing process of an electronic device according to an embodiment of the present invention;

[0016] Figure 3A This is a schematic diagram of an anisotropic conductive block used in one embodiment of the present invention;

[0017] Figure 3B This is a schematic diagram illustrating the internal structure of the anisotropic conductive block used in one embodiment of the present invention;

[0018] Figure 3C for Figure 3B A cross-sectional schematic diagram of line AA;

[0019] Figure 4 This is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention;

[0020] Figure 5 This is a schematic diagram of an anisotropic conductive block used in another embodiment of the present invention.

[0021] In the attached figures, the following labels are used:

[0022] 1: Electronic devices

[0023] 2:Substrate

[0024] 20: Setting surface

[0025] 21: Installation Area

[0026] 22: Coverage Area

[0027] 2a: Covering part

[0028] 2b: Outgoing cable section

[0029] S1: Surface

[0030] 3: Conductive circuit

[0031] 3': Ribbon cable

[0032] S2: Surface

[0033] 4: Anisotropic conductive block

[0034] 41: Anisotropic conductive layer

[0035] 41a: First conductive surface

[0036] 41b: Second conductive surface

[0037] 41c: Side view

[0038] L: Length

[0039] W: Width

[0040] H: Height

[0041] 42: Insulation layer

[0042] 411: Intermediate Material

[0043] 412: Conductive metal wire

[0044] S6: Side view

[0045] 5: Plastic layer

[0046] S3: Surface

[0047] S5: Surface

[0048] G: Gap

[0049] 6: Socket Detailed Implementation

[0050] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.

[0051] In the following text, the terms used in the description of embodiments according to the present invention, such as "upper" and "lower" indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings. These terms are used merely for the convenience of describing the present invention and are not intended to limit the invention; that is, they do not indicate or imply that the mentioned elements must have a specific orientation or be constructed in a specific orientation. Furthermore, the terms "first" and "second" mentioned in this specification or the claims are used only to name elements or distinguish different embodiments or scopes, and are not intended to limit the upper or lower limit of the number of elements.

[0052] Figure 1 This is a three-dimensional schematic diagram of the substrate of an electronic device according to an embodiment of the present invention. Figure 2A and Figure 2B This is a schematic diagram of the manufacturing process of an electronic device according to an embodiment of the present invention. Figure 3A This is a schematic diagram of an anisotropic conductive block used in one embodiment of the present invention. Figure 3B This is a schematic diagram illustrating the internal structure of the anisotropic conductive block used in one embodiment of the present invention. Figure 3C for Figure 3B A cross-sectional diagram of line AA. Additionally, in Figures 3A to 3C In order to illustrate the structure of the anisotropic conductive block, the dimensions of the components are only schematic and not drawn according to the actual dimensions.

[0053] like Figures 1 to 2B As shown, the electronic device 1 in this embodiment is a device using in-mold electronics manufacturing technology. In-mold electronics is also called molded electronics (IME). Electronic device 1 (see...) Figure 2B It includes: a substrate 2, conductive lines 3, an anisotropic conductive block 4, and a plastic layer 5. For example... Figure 1 As shown, the substrate 2 has a mounting surface 20, on which a mounting area 21 and a covering area 22 are provided, with the covering area 22 surrounding the mounting area 21. Conductive lines 3 are disposed in the covering area 22, and a portion of each conductive line 3 passes through the mounting area 21. Figure 3A and Figure 3C As shown, the anisotropic conductive block 4 includes an anisotropic conductive layer 41, which has a first conductive surface 41a, a second conductive surface 41b, and a side surface 41c. The first conductive surface 41a is opposite to the second conductive surface 41b, and the side surface 41c is connected between and surrounds the first conductive surface 41a and the second conductive surface 41b. The anisotropic conductive block 4 covers the mounting area 21 (see figure) through the first conductive surface 41a. Figure 1 The plastic layer 5 surrounds the side 41c and covers the coverage area 22.

[0054] like Figure 1 As shown, in this embodiment, the substrate 2 of the electronic device 1 is, for example, a flexible substrate 2, such as a flexible printed circuit board or a flexible flat cable, etc. The substrate 2 is adapted to change shape through its flexibility to meet the shape requirements of the electronic device 1. The coverage area 22 on the substrate 2 is, for example, provided with electronic components (not shown), which are electrically connected to the conductive lines 3. These electronic components can be light-emitting diodes (LEDs), chips, etc. In embodiments where the plastic layer 5 is elastic, or where its thickness does not have a sufficient impact on the electronic device 1, the electronic component can also be a pressure-sensing element. In other words, the electronic component can be selected according to requirements. Please refer to... Figure 1 and Figure 2A As shown, the conductive line 3 is formed on the substrate 2, and the conductive line 3 has a certain thickness such that the surface S2 of the conductive line 3 is higher than the surface S1 of the substrate 2.

[0055] like Figure 1 As shown, in this embodiment, the substrate 2 includes a covering portion 2a and a wiring portion 2b. The wiring portion 2b extends from one side of the covering portion 2a, and the mounting surface 20 is located only on the covering portion 2a. In other words, the plastic layer 5 of the electronic device 1 only covers the covering portion 2a. The wiring portion 2b has multiple ribbon cables 3', which are electrically connected to conductive lines 3.

[0056] like Figure 2A As shown, in this embodiment, the electronic device 1 is manufactured, for example, by first mounting the device in the mounting area 21 on the substrate 2 (e.g., ...). Figure 1 An anomalous conductive block 4 is placed on conductive line 3 (as shown). Then, as... Figure 2B As shown, the plastic layer 5 is manufactured, for example, by plastic injection molding. In this embodiment, the surface S3 of the plastic layer 5 is, for example, aligned with the position of the second conductive surface 41b of the anisotropic conductive block 4, but is not limited thereto. There is no limitation on the connection method between the first conductive surface 41a and the conductive line 3; for example, the anisotropic conductive block 4 can be placed directly on and in contact with the conductive line 3, but is not limited thereto.

[0057] Please refer to Figure 3AAs shown, the anisotropic conductive block 4 in this embodiment is conductive along the height H direction, but not conductive along the length L and width W directions. In one embodiment, the anisotropic conductive block 4 is, for example, an elastic member, including an anisotropic conductive layer 41 and two insulating layers 42, for example, made of silicone material. The anisotropic conductive layer 41 is located between the two insulating layers 42 and is connected to the two insulating layers 42 by, for example, thermoforming with side 41c. The dimensions of the anisotropic conductive block 4 are, for example, a length L between 2 mm and 150 mm, a width W between 0.4 mm and 7 mm, and a height H between 0.8 mm and 25 mm, but are not limited thereto and can be determined according to the size of the mounting area 21 (the area where the conductive lines 3 are distributed) and the thickness of the plastic layer 5, etc.

[0058] like Figure 3B and Figure 3C As shown, the anisotropic conductive layer 41 includes, for example, an intermediate material 411 and multiple conductive metal wires 412, but is not limited thereto. The intermediate material 411 of the anisotropic conductive layer 41 includes, for example, silicone, and surrounds the multiple conductive metal wires 412. The length of the conductive metal wires 412 is, for example, equal to the height H of the anisotropic conductive block 4 and extends from the first conductive surface 41a to the second conductive surface 41b. Its wire diameter is, for example, 0.023 mm to 0.03 mm, but is not limited thereto. The conductive metal wires 412 in the anisotropic conductive layer 41 are parallel to each other, and the pitch between them is, for example, 0.05 mm to 0.25 mm, but is not limited thereto. The arrangement of the conductive metal wires 412 shown in Figure 3B is only schematic and can be set as needed while maintaining the anisotropic conductivity.

[0059] Therefore, when the anisotropic conductive block 4 is placed on the conductive line 3, the anisotropic conductive block 4 can be regarded as an extension of the conductive line 3 in the thickness direction of the anisotropic conductive block 4, so as to pass through the plastic layer 5 to connect with other electronic components such as wires or circuit boards. Due to the characteristics of the anisotropic conductive block 4, during manufacturing, it is only necessary to ensure that the first conductive surface 41a of the anisotropic conductive layer 41 contacts all conductive lines 3 of the mounting part, and the tolerance requirements are lower compared to the existing connector mounting configuration with pins or contacts.

[0060] Furthermore, since the anisotropic conductive block 4 can be connected to the substrate 2 and conductive lines 3 before being placed into the mold for injection molding of the plastic layer 5, the need for a slider to create the opening in the plastic layer 5 can be avoided, preventing damage to components such as the substrate 2 or conductive lines 3. In addition, because the anisotropic conductive block 4 is elastic, it can be connected to the substrate 2 and conductive lines 3 before being placed into the mold. Even if the anisotropic conductive block 4 is subjected to pressure from the mold during manufacturing, the elastic deformation of the anisotropic conductive block 4 will not easily lead to damage to the substrate 2 or conductive lines 3, and the tolerance requirements of the mold can be reduced.

[0061] Based on the above description, in this embodiment, the electronic device 1, substrate 2, and conductive lines 3 are protected by plastic layer 5. Furthermore, by using anisotropic conductive block 4 as a connector for connecting the electronic device 1 to external circuits, the conductivity of the anisotropic conductive block 4 solves the problem of accurately positioning the contact point of the connector and the conductive line 3 to be connected during the manufacturing of the electronic device 1. It also prevents the substrate 2 and conductive lines 3 from being damaged during the fabrication of plastic layer 5, thus providing the advantage of convenient manufacturing.

[0062] Figure 4 This is a cross-sectional schematic diagram of electronic device 1 according to another embodiment of the present invention. Please refer to... Figure 4 As shown, in this embodiment, the height of the second conductive surface 41b of the anisotropic conductive block 4 is, for example, higher than the surface S3 of the plastic layer 5, thus facilitating the connection of other electronic devices (such as ribbon cables), and there is, for example, a gap G between the side surface S6 of the anisotropic conductive block 4 and the adjacent surface S5 of the plastic layer 5. This gap G is, for example, created by the anisotropic conductive block 4 being pressed and fixed by an injection mold (not shown) before the injection of the plastic layer 5, causing the anisotropic conductive block 4 to have a lateral (see reference) position. Figure 3A The expansion (in a direction other than the height L direction) and the gap G generated when the anisotropic conductive block 4 returns to its original size after the injection mold stops extruding the plastic layer 5 and the injection mold no longer squeezes the anisotropic conductive block 4, but not limited to this.

[0063] Figure 5 This is a schematic diagram of the anisotropic conductive block 4 used in another embodiment of the present invention. In this embodiment, the anisotropic conductive block 4 is, for example, an elastic element, and is located on the second conductive surface 41b of the anisotropic conductive layer 41 (see reference for location). Figure 3A The device has multiple sockets 6. When other electronic components, such as ribbon cables (not shown), are connected to the anisotropic conductive block 4, they can be aligned through the sockets 6, or a portion of the component can be inserted into the sockets 6 and fixed to the anisotropic conductive block 4 by the pressure of the wall of the socket 6.

[0064] In similar Figure 5In other embodiments with sockets 6 shown, the number of sockets 6 corresponds, for example, to the number of conductive lines 3 on the mounting portion, and the position corresponds to the position on the conductive lines 3 on the mounting area 21. The sockets 6 are formed, for example, by connecting the anisotropic conductive block 4 to the substrate 2 and then forming them through other processing, such as by needle punching.

[0065] Based on the above description, the electronic device of the present invention provides waterproof and dustproof protection for its internal electronic components by using plastic, which is also aesthetically pleasing. Furthermore, by employing anisotropic conductive blocks as connectors for connecting to external circuits, the conductive properties of the anisotropic conductive blocks solve the problem of accurately positioning the contact points on the connectors and the conductive lines to be connected during the manufacturing of the electronic device. Therefore, it has the advantage of being easy to manufacture.

[0066] Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Those skilled in the art to which this invention pertains may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. An electronic device, characterized in that, include: A substrate has a mounting surface, the mounting surface having a mounting area and a covering area, the covering area surrounding the mounting area; Multiple conductive lines are installed in the coverage area, and a portion of each of these conductive lines passes through the installation area; An anisotropic conductive block includes an anisotropic conductive layer having a first conductive surface, a second conductive surface, and a side surface. The first conductive surface is opposite to the second conductive surface, and the side surface is connected between the first conductive surface and the second conductive surface and surrounds the first conductive surface and the second conductive surface. The anisotropic conductive block covers the mounting area through the first conductive surface. and A plastic layer surrounds the side and covers the covered area.

2. The electronic device as claimed in claim 1, characterized in that, The anisotropic conductive block is an elastic element.

3. The electronic device as claimed in claim 2, characterized in that, The second conductive surface has multiple sockets.

4. The electronic device as claimed in claim 1, characterized in that, The anisotropic conductive block further includes two insulating layers, with the anisotropic conductive layer located between the two insulating layers and connected to the two insulating layers on the side.

5. The electronic device as claimed in claim 1, characterized in that, A gap is formed between the side of the anisotropic conductive block and a surface of the plastic layer surrounding the side.

6. The electronic device as claimed in claim 1, characterized in that, The substrate is a flexible substrate.

7. The electronic device as claimed in claim 1, characterized in that, The substrate includes a covering portion and a wiring portion. The wiring portion extends from one side of the covering portion. The mounting surface is located only on the covering portion. The wiring portion has multiple ribbon cables that are electrically connected to the conductive lines.

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