Plasma jet array device for large size epoxy surface modification
By using a plasma jet array device to modify large-size epoxy surfaces, the problems of long modification time and poor uniformity of traditional single-jet modification are solved, achieving rapid and uniform modification results and improving charge release capability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- GUANGDONG POWER GRID CO LTD
- Filing Date
- 2023-04-27
- Publication Date
- 2026-06-26
AI Technical Summary
In existing technologies, the modification of large-size epoxy surfaces by a single plasma jet is time-consuming and has poor uniformity, making it difficult to meet the requirements for rapid and uniform modification.
The plasma jet array device includes a tank, gas cylinder, perforated mesh, high-voltage power supply and metal inserts. The tank is flat and the jet nozzles are arranged in an array. The plasma jet is formed by inert gas to modify the surface of epoxy insulation. Combined with a multi-channel flow equalization valve and flow controller, the gas is uniformly distributed.
It achieves rapid and uniform surface modification of large-size epoxy insulation parts, improves charge release capability, and the modification rate and uniformity are significantly better than traditional scanning jet devices.
Smart Images
Figure CN116507009B_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of material surface modification technology, specifically relating to a plasma jet array device for large-size epoxy surface modification. Background Technology
[0002] Epoxy resin is commonly used as an insulating support for metal inserts and is a good insulating material. Under DC operating conditions, charge accumulates on the epoxy resin surface, which can easily lead to surface degradation. To improve the service life of the insulation, the epoxy surface is often modified to enhance its ability to release surface charge.
[0003] Plasma surface treatment is an effective modification method that can improve the charge release capability of epoxy surfaces. Atmospheric pressure plasma jets, with their advantages of small size and ease of use, have been widely applied to material surface modification. Typically, a single plasma jet is used to modify the epoxy surface; however, this method is time-consuming and produces poor uniformity, making it unsuitable for modifying large epoxy surfaces. Summary of the Invention
[0004] The purpose of this invention is to provide a plasma jet array device for large-size epoxy surface modification, which can achieve rapid and uniform surface modification of large-size epoxy insulation components and improve charge release capability.
[0005] To address the aforementioned technical problems, one aspect of the present invention provides a plasma jet array device for large-size epoxy surface modification, comprising a frame, a tank, a gas cylinder for loading inert gas, a perforated mesh, a high-voltage power supply, and a metal insert; the tank and the metal insert are both fixed on the frame; the tank is flat and has jet channels formed within it for placing epoxy insulating components; the bottom and sides of the tank are provided with jet nozzles arranged in an array; the jet nozzles are connected to the gas cylinder through inlet pipes, which are disposed inside the side plate and bottom plate of the tank; the perforated mesh is fitted onto the jet nozzles and connected to the high-voltage power supply; the tank is grounded through a wire; the metal insert is inserted above the epoxy insulating components and is grounded through a wire.
[0006] As a preferred embodiment of the plasma jet array device for large-size epoxy surface modification, the air inlet pipe includes a main air inlet pipe and multiple branch air inlet pipes. A multi-channel flow equalization valve is installed inside the bottom plate of the tank. The outlet of the multi-channel flow equalization valve is connected to the jet nozzle through the branch air inlet pipes. The inlet of the multi-channel flow equalization valve is connected to the gas cylinder through the main air inlet pipe.
[0007] As a preferred embodiment of the plasma jet array device for large-size epoxy surface modification, the multi-channel flow equalization valve is equipped with a static mixer that can perform flow equalization based on calorimetric flow measurement results.
[0008] As a preferred embodiment of the plasma jet array device for large-size epoxy surface modification, the main intake pipe is equipped with a flow controller, which is a glass rotor flow meter with a maximum flow rate of 10 L / min.
[0009] As a preferred embodiment of the aforementioned plasma jet array device for large-size epoxy surface modification, the mesh is made of brass.
[0010] As a preferred embodiment of the plasma jet array device for large-size epoxy surface modification, the high-voltage power supply is an AC power supply with a rated power of 500W.
[0011] As a preferred embodiment of the plasma jet array device for large-size epoxy surface modification, the tank is made of stainless steel.
[0012] As a preferred embodiment of the plasma jet array device for large-size epoxy surface modification, the jet nozzle is made of quartz.
[0013] As a preferred embodiment of the plasma jet array device for large-size epoxy surface modification, the air inlet pipe is a stainless steel pipe.
[0014] As a preferred embodiment of the plasma jet array device for large-size epoxy surface modification, the distance between two adjacent jet nozzles is 5 cm.
[0015] As a preferred embodiment of the plasma jet array device for large-size epoxy surface modification described above, the depth of the tank is greater than or equal to the height of the epoxy insulation component.
[0016] Another aspect of the present invention provides a method of using the plasma jet array device for large-size epoxy surface modification described in the foregoing claims, comprising the following steps:
[0017] Step S1: Set the gas flow rate of the flow controller to 0.5L / min, start the multi-channel flow equalization valve, and use the inert gas in the gas cylinder to sequentially clean the main intake pipe, the intake branch pipe and the jet gas channel for 5 minutes.
[0018] Step S2: Insert the epoxy insulating component with the metal insert into the jet air passage;
[0019] Step S3: Start the high-voltage power supply and control its output power to 300W to ignite the jet plasma;
[0020] Step S4: According to the process requirements, adjust the gas flow rate and velocity through the flow controller and adjust the output power of the high-voltage power supply to perform surface modification on the epoxy insulation component;
[0021] Step S5: After the surface modification of the epoxy insulation component is completed, first turn off the high-voltage power supply and maintain the flow of inert gas. After the surface temperature of the epoxy insulation component drops to room temperature, turn off the gas cylinder.
[0022] The plasma jet array device for large-size epoxy surface modification provided by this invention has the following advantages compared with the prior art:
[0023] In use, the metal insert is inserted above the epoxy insulator and grounded via a wire. The epoxy insulator is placed and fixed within the jet channel. Inert gas (such as argon) loaded in a gas cylinder is delivered to the jet nozzle through inlet pipes located inside the side and bottom plates of the tank. After being excited by a high-voltage power supply, a plasma jet is formed in the jet channel, thereby modifying the surface of the epoxy insulator and improving its surface charge release capability. Because the tank is flat and the jet nozzles are arranged in an array on the bottom and sides of the tank, multiple surfaces of the epoxy insulator can be modified rapidly and uniformly. The surface modification rate and uniformity are far superior to traditional scanning jet modification devices, effectively improving surface properties. Attached Figure Description
[0024] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings of the embodiments will be briefly described below.
[0025] Figure 1 This is a schematic diagram of a plasma jet array device for large-size epoxy surface modification provided in an embodiment of the present invention;
[0026] Figure 2 This is a schematic diagram of the internal structure of the tank.
[0027] Marked in the image:
[0028] 1. Tank body; 1a. Bottom plate; 1b. Side plate; 2. Jet air passage; 3. Gas cylinder; 4. Jet nozzle; 5. Inlet pipe; 5a. Main inlet pipe; 5b. Branch inlet pipe; 6. High-voltage power supply; 7. Perforated mesh; 8. Epoxy insulation component; 9. Metal insert; 10. Multi-channel flow equalization valve; 11. Flow controller. Detailed Implementation
[0029] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.
[0030] In the description of this invention, it should be understood that the terms "upper," "lower," "left," "right," "front," "rear," "top," and "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. It should be understood that the terms "first," "second," etc., are used in this invention to describe various information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this invention, "first" information can also be referred to as "second" information, and similarly, "second" information can also be referred to as "first" information.
[0031] like Figure 1 and Figure 2 As shown, a preferred embodiment of the present invention provides a plasma jet array device for large-size epoxy surface modification, comprising a frame (not shown), a tank 1, a gas cylinder 3 for loading inert gas, a perforated mesh 7, a high-voltage power supply 6, and a metal insert 9; the tank 1 and the metal insert 9 are both fixed on the frame; the tank 1 is flat and has a jet gas channel 2 formed inside for placing an epoxy insulating component 8; the bottom and sides of the tank 1 are provided with jet nozzles 4 arranged in an array; the jet nozzles 4 are connected to the gas cylinder 3 through an inlet pipe 5; the inlet pipe 5 is disposed inside the side plate 1b and the bottom plate 1a of the tank 1; the perforated mesh 7 is sleeved on the jet nozzles 4 and connected to the high-voltage power supply 6; the tank 1 is grounded through a wire; the metal insert 9 is inserted above the epoxy insulating component 8; the metal insert 9 is grounded through a wire.
[0032] According to the plasma jet array device for large-size epoxy surface modification of the present invention, in use, a metal insert 9 is inserted above the epoxy insulator 8 and grounded by a wire. The epoxy insulator 8 is placed and fixed in the jet channel 2. Inert gas (such as argon) loaded in the gas cylinder 3 is transported to the jet nozzle 4 through the air inlet pipe 5 located inside the side plate 1b and bottom plate 1a of the tank body 1. After being excited by the high-voltage power supply 6, a plasma jet is formed in the jet channel 2, thereby modifying the surface of the epoxy insulator 8 and improving the charge release capability of the epoxy insulator 8 surface. Since the tank body 1 is flat and the jet nozzles 4 are arranged in an array on the bottom and sides of the tank body 1, multiple surfaces of the epoxy insulator 8 can be modified quickly and uniformly. Its surface modification rate and uniformity are far superior to those of traditional scanning jet modification devices, and it can effectively improve surface properties.
[0033] It should be noted that the depth of the tank 1 is greater than or equal to the height of the epoxy insulation component 8, which can further ensure that the epoxy insulation component 8 can be completely sprayed by the plasma jet, thus ensuring the modification effect.
[0034] For example, the intake pipe 5 includes a main intake pipe 5a and multiple intake branch pipes 5b. A multi-channel flow equalization valve 10 is installed inside the bottom plate 1a of the tank 1. The outlet of the multi-channel flow equalization valve 10 is connected to the jet nozzle 4 through the intake branch pipes 5b, and the inlet of the multi-channel flow equalization valve 10 is connected to the gas cylinder 3 through the main intake pipe 5a. The multi-channel flow equalization valve 10 is equipped with a static mixer that can perform flow equalization based on calorimetric flow measurement results. When inert gas is delivered to the bottom plate 1a of the tank 1 through the main intake pipe 5a, the static mixer can measure the flow rate of inert gas in different intake branch pipes 5b by calorimetric measurement and feed back the measurement results to the multi-channel flow equalization valve 10. After receiving the signal, the multi-channel flow equalization valve 10 opens the valve, so that the flow rate of inert gas flowing in from each intake branch pipe 5b is the same, thereby achieving multi-channel flow equalization. The multi-channel flow equalization valve 10 ensures that the inert gas is delivered to the jet nozzle 4 through different inlet pipes 5b with a consistent flow rate. After the high-voltage power supply 6 is activated, there is a consistent plasma jet content in each region of the jet channel 2, thereby further improving the uniformity of the surface modification of the epoxy insulation component 8.
[0035] For example, the intake pipe 5a is equipped with a flow controller 11, which is preferably a glass rotor flow meter with a maximum flow rate of 10L / min. The flow rate of inert gas in the intake pipe 5a is controlled by rotating the rotary valve on the glass rotor flow meter, so as to realize the visualization and controllability of the inert gas flow rate, and facilitate the adjustment of the flow rate and velocity of the inert gas delivered to the jet nozzle 4 through the intake pipe 5 according to the process requirements.
[0036] It should be noted that, in this embodiment, the material of the perforated mesh 7 is preferably brass, which can reduce Joule heat loss; the high-voltage power supply 6 is preferably an AC power supply with a rated power of 500W to achieve dielectric barrier discharge; the materials of the tank 1 and the air inlet pipe 5 are preferably stainless steel to ensure the service life of the device; the material of the jet nozzle 4 is preferably quartz to withstand the high temperature during operation; the distance between two adjacent jet nozzles 4 is preferably 5cm to avoid mutual interference, thereby affecting the modification effect.
[0037] In addition, another aspect of the present invention provides a method of using the plasma jet array device for large-size epoxy surface modification described in the foregoing claims, comprising the following steps:
[0038] Step S1: Set the gas flow rate of the flow controller 11 to 0.5 L / min, start the multi-channel flow equalization valve 10, and use the inert gas in the gas cylinder 3 to clean the main intake pipe 5a, the intake branch pipe 5b and the jet gas channel 2 in sequence for 5 minutes.
[0039] Step S2: Insert the epoxy insulating component 8, to which the metal insert 9 is inserted, into the jet air passage 2;
[0040] Step S3: Start the high-voltage power supply 6 and control its output power to 300W to ignite the jet plasma;
[0041] Step S4: According to the process requirements, adjust the gas flow rate and velocity through the flow controller 11 and adjust the output power of the high voltage power supply 6 to perform surface modification on the epoxy insulation component 8.
[0042] Step S5: After the surface modification of the epoxy insulation component 8 is completed, first turn off the high-voltage power supply 6 and maintain the flow of inert gas. After the surface temperature of the epoxy insulation component 8 drops to room temperature, turn off the gas cylinder 3.
[0043] Since the above-described method of use is based on the plasma jet array device for large-size epoxy surface modification described above, it has the same beneficial effects as the device, and will not be repeated here.
[0044] It should be noted that in step S5, oxidation of the epoxy insulation component 8 surface at high temperature can be avoided, thereby affecting the surface modification effect of the epoxy insulation component 8.
[0045] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0046] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.
Claims
1. A plasma jet array device for large-size epoxy surface modification, characterized in that, The device includes a frame, a tank, a gas cylinder for loading inert gas, a perforated screen, a high-voltage power supply, and a metal insert. The tank and the metal insert are both fixed to the frame. The tank is flat and has jet channels within it for placing epoxy insulation components. The bottom and sides of the tank are provided with an array of jet nozzles, which are connected to the gas cylinder via inlet pipes located inside the side and bottom plates of the tank. The perforated screen is fitted over the jet nozzles and connected to the high-voltage power supply. The tank is grounded via a wire. The metal insert is inserted above the epoxy insulation components and is grounded via a wire.
2. The plasma jet array device for large-size epoxy surface modification according to claim 1, characterized in that, The air intake pipe includes a main air intake pipe and multiple branch air intake pipes. A multi-channel flow equalization valve is installed inside the bottom plate of the tank. The outlet of the multi-channel flow equalization valve is connected to the jet nozzle through the branch air intake pipes. The inlet of the multi-channel flow equalization valve is connected to the gas cylinder through the main air intake pipe.
3. The plasma jet array device for large-size epoxy surface modification according to claim 2, characterized in that, The multi-channel flow equalization valve is equipped with a static mixer that can perform flow equalization based on calorimetric flow measurement results.
4. The plasma jet array device for large-size epoxy surface modification according to claim 2, characterized in that, The intake manifold is equipped with a flow controller, which is a glass rotor flow meter with a maximum flow rate of 10 L / min.
5. The plasma jet array device for large-size epoxy surface modification according to claim 1, characterized in that, The mesh is made of brass.
6. The plasma jet array device for large-size epoxy surface modification according to claim 1, characterized in that, The high-voltage power supply is an AC power supply with a rated power of 500W.
7. The plasma jet array device for large-size epoxy surface modification according to claim 1, characterized in that, The tank is made of stainless steel.
8. The plasma jet array device for large-size epoxy surface modification according to claim 1, characterized in that, The jet nozzle is made of quartz.
9. The plasma jet array device for large-size epoxy surface modification according to claim 1, characterized in that, The air intake pipe is made of stainless steel.
10. The plasma jet array device for large-size epoxy surface modification according to claim 1, characterized in that, The distance between two adjacent jet nozzles is 5 cm.
11. The plasma jet array device for large-size epoxy surface modification according to claim 1, characterized in that, The depth of the groove is greater than or equal to the height of the epoxy insulation component.
12. A method of using the plasma jet array device for large-size epoxy surface modification as described in claim 4, characterized in that, Includes the following steps: Step S1: Set the gas flow rate of the flow controller to 0.5L / min, start the multi-channel flow equalization valve, and use the inert gas in the gas cylinder to sequentially clean the main intake pipe, the intake branch pipe and the jet gas channel for 5 minutes. Step S2: Insert the epoxy insulating component with the metal insert into the jet air passage; Step S3: Start the high-voltage power supply and control its output power to 300W to ignite the jet plasma; Step S4: According to the process requirements, adjust the gas flow rate and velocity through the flow controller and adjust the output power of the high-voltage power supply to perform surface modification on the epoxy insulation component; Step S5: After the surface modification of the epoxy insulation component is completed, first turn off the high-voltage power supply and maintain the flow of inert gas. After the surface temperature of the epoxy insulation component drops to room temperature, turn off the gas cylinder.