Light-emitting substrate and method for manufacturing the same, and display device

Abstract

A light-emitting substrate (200) and a manufacturing method thereof, and a display device (400). The light-emitting substrate (200) comprises: a substrate (101), comprising a light-emitting area (E); a first conductive portion (102), located on the substrate (101) and arranged at least in the light-emitting area (E), the first conductive portion (102) extending along a first direction (D1) in the light-emitting area (E); a second conductive portion (103), located on a side of the first conductive portion (102) away from the substrate (101) and arranged in the light-emitting area (E), the second conductive portion (103) comprising a first connecting portion (1032); and a first insulating portion (104), located in the light-emitting area (E). The first connecting portion (1032) of the second conductive portion (103) extends along a second direction (D2), and the orthographic projection of the first connecting portion (1032) on the substrate (101) at least partially overlaps with the orthographic projection of the first conductive portion (102) on the substrate (101) to form an overlapping area (R). The first insulating portion (104) is located only between the first connecting portion (1032) of the second conductive portion (103) and the first conductive portion (102), and the overlapping region (R) falls within the orthographic projection of the first insulating portion (1032) on the substrate (101).

Description

Technical Field

[0001] The present disclosure relates to the field of optical technology, and in particular to a light-emitting substrate and a manufacturing method thereof, and a display device including the light-emitting substrate. Background Art

[0002] With the continuous development of display technology, users have put forward higher and higher requirements for the reliability of display devices. Display devices are generally divided into two categories: liquid crystal display devices and organic light-emitting diode display devices. Liquid crystal display devices are widely used due to their advantages such as lightness, good shock resistance, wide viewing angle, and high contrast. Liquid crystal display devices generally include a display panel and a backlight source. The backlight source is generally arranged on the non-display side of the display panel to provide light for the display operation of the display panel. The reliability of liquid crystal display devices is related to the structure and performance of the backlight source. Summary of the invention

[0003] According to one aspect of the present disclosure, a light-emitting substrate is provided, comprising: a substrate, comprising a light-emitting area; a first conductive portion, located on the substrate and at least arranged in the light-emitting area, the first conductive portion extending along a first direction in the light-emitting area; a second conductive portion, located on a side of the first conductive portion away from the substrate and arranged in the light-emitting area, the second conductive portion comprising a first connecting portion; and a first insulating portion, located in the light-emitting area. The first connecting portion of the second conductive portion extends along a second direction intersecting the first direction, the first orthographic projection of the first connecting portion of the second conductive portion on the substrate at least partially overlaps with the second orthographic projection of the first conductive portion on the substrate, the region where the first orthographic projection overlaps with the second orthographic projection constitutes an overlapping region, the first insulating portion is located only between the first connecting portion of the second conductive portion and the first conductive portion, and the overlapping region falls within the orthographic projection of the first insulating portion on the substrate.

[0004] In some embodiments, the orthographic projections of portions of the two side edges of the first conductive portion extending along the first direction located in the overlapping area on the substrate respectively fall within the orthographic projections of the first insulating portion on the substrate, and the orthographic projections of portions of the two side edges of the first connecting portion of the second conductive portion extending along the second direction located in the overlapping area on the substrate respectively fall within the orthographic projections of the first insulating portion on the substrate.

[0005] In some embodiments, the light emitting substrate further comprises a covering layer located on a side of the second conductive portion away from the substrate. The covering layer comprises a plurality of first openings, and the orthographic projections of the plurality of first openings of the covering layer on the substrate do not overlap with the orthographic projections of the first insulating portion on the substrate.

[0006] In some embodiments, a ratio of an area of ​​an orthographic projection of the first insulating portion on the substrate to an area of ​​the substrate is approximately 10%.

[0007] In some embodiments, an area of ​​an orthographic projection of the first insulating portion on the substrate is smaller than an area of ​​an orthographic projection of the second conductive portion on the substrate.

[0008] In some embodiments, the first connection portion of the second conductive portion includes at least two sub-first connection portions extending along the second direction and spaced apart from each other, and the orthographic projections of the at least two sub-first connection portions on the substrate at least partially overlap with the orthographic projection of the same first insulating portion on the substrate.

[0009] In some embodiments, a spacing between two adjacent sub-first connecting portions of the at least two sub-first connecting portions is greater than 300 μm.

[0010] In some embodiments, the first connection portion of the second conductive portion further includes a first confluence portion and a second confluence portion, the first confluence portion and the second confluence portion are respectively located on both sides of the first conductive portion, the two ends of the at least two sub-first connection portions respectively converge at the first confluence portion and the second confluence portion, and the orthographic projections of the first confluence portion and the second confluence portion on the substrate do not overlap with the orthographic projection of the overlapping area on the substrate.

[0011] In some embodiments, one of the at least two sub-first connecting portions includes two cutouts, the two cutouts are respectively located on both sides of the first conductive portion, and the middle portion of the sub-first connecting portion is disconnected from both end portions of the sub-first connecting portion at the two cutouts.

[0012] In some embodiments, the same first insulating portion includes at least two sub-insulating portions extending along the second direction and spaced apart from each other, the number of the sub-insulating portions is equal to the number of the sub-first connecting portions, and the orthographic projection of each of the sub-first connecting portions on the substrate at least partially overlaps with the orthographic projection of a corresponding one of the sub-insulating portions on the substrate.

[0013] In some embodiments, the second conductive portion further includes a second connecting portion, the second connecting portion of the second conductive portion is electrically connected to the first conductive portion, and the orthographic projection of the plurality of first openings of the covering layer on the substrate does not overlap with the orthographic projection of the second connecting portion of the second conductive portion on the substrate.

[0014] In some embodiments, the light emitting substrate further comprises a second insulating layer, wherein the second insulating layer is located between the first conductive portion and the second conductive portion, and the first insulating portion is located on a side of the second insulating layer away from the substrate.

[0015] In some embodiments, the second connection portion of the second conductive portion is connected to the first conductive portion via a second via in the second insulating layer.

[0016] In some embodiments, the second insulating layer is located only at the overlapping region.

[0017] In some embodiments, the second conductive portion further includes a plurality of conductive pads, and an orthographic projection of each of the plurality of first openings of the cover layer on the substrate covers an orthographic projection of at least one of the plurality of conductive pads on the substrate.

[0018] In some embodiments, the light emitting substrate further includes: a third insulating layer located between the second conductive portion and the cover layer and including a plurality of third via holes; and a fourth insulating layer located between the third insulating layer and the cover layer and including a plurality of fourth via holes. Each of the plurality of third via holes and a corresponding one of the plurality of fourth via holes penetrate each other, and the plurality of third via holes and the plurality of fourth via holes expose the plurality of conductive pads.

[0019] In some embodiments, the light emitting substrate further includes a fifth insulating layer located between the second conductive portion and the second insulating layer, and the fifth insulating layer covers the first insulating portion and the second insulating layer.

[0020] In some embodiments, a material of the first insulating portion is an organic material.

[0021] In some embodiments, a portion of the first insulating portion located in the overlapping region has a thickness of about 2.5 μm in a direction perpendicular to the substrate.

[0022] In some embodiments, the second conductive part also includes a main body part, which is located on both sides of the first connecting part, the first end of the main body part located on one side of the first connecting part is connected to the first end of the first connecting part, the second end of the main body part located on one side of the first connecting part is connected to the second connecting part, and the first end of the main body part located on the other side of the first connecting part is connected to the second end of the first connecting part.

[0023] In some embodiments, the light emitting substrate further comprises a plurality of light emitting elements, each of the plurality of light emitting elements being a sub-millimeter light emitting diode or a micro light emitting diode.

[0024] In some embodiments, there is a voltage difference between the first conductive portion and the second conductive portion.

[0025] According to another aspect of the present disclosure, a display device is provided. The display device includes the light emitting substrate described in any one of the above embodiments.

[0026] According to another aspect of the present disclosure, a method for manufacturing a light-emitting substrate is provided, comprising: providing a substrate, the substrate comprising a light-emitting area; forming a first conductive portion on the substrate, the first conductive portion being arranged at least within the light-emitting area and extending along a first direction within the light-emitting area; forming a first insulating portion on a side of the first conductive portion away from the substrate, the first insulating portion being located within the light-emitting area; and forming a second conductive portion on a side of the first insulating portion away from the substrate, the second conductive portion being arranged within the light-emitting area and comprising a first connecting portion, the first connecting portion of the second conductive portion extending along a second direction intersecting the first direction, a first orthographic projection of the first connecting portion of the second conductive portion on the substrate at least partially overlapping with a second orthographic projection of the first conductive portion on the substrate, an area where the first orthographic projection overlaps with the second orthographic projection constitutes an overlapping area, the first insulating portion is located only between the first connecting portion of the second conductive portion and the first conductive portion, and the overlapping area falls within the orthographic projection of the first insulating portion on the substrate.

[0027] In some embodiments, the steps of forming the first conductive portion, the first insulating portion and the second conductive portion include: applying a first conductive layer on the substrate, and patterning the first conductive layer through a first mask process to form the first conductive portion; applying a second insulating material layer on a side of the first conductive portion away from the substrate and applying a first insulating material layer on a side of the second insulating material layer away from the substrate, and patterning the first insulating material layer and the second insulating material layer through a second mask process to form the first insulating portion and the second insulating layer; applying a second conductive layer on a side of the first insulating portion and the second insulating layer away from the substrate, and patterning the second conductive layer through a third mask process to form the second conductive portion; applying a third insulating material layer on a side of the second conductive portion away from the substrate and applying a fourth insulating material layer on a side of the third insulating material layer away from the substrate, and patterning the third insulating material layer and the fourth insulating material layer through a fourth mask process to form a third insulating layer and a fourth insulating layer.

[0028] In some embodiments, after forming the first insulating part and the second insulating layer and before forming the second conductive part, it also includes: applying a fifth insulating material layer on the side of the second insulating layer away from the substrate to cover the first insulating part and the second insulating layer, and composing the fifth insulating material layer through a fifth mask process to form a fifth insulating layer.

[0029] In some embodiments, the step of forming the second conductive portion includes: composing the second conductive layer through the third mask process so that the first connection portion of the second conductive portion includes at least two sub-first connection portions extending along the second direction and spaced apart from each other, and in response to detecting that one of the at least two sub-first connection portions is faulty, using a laser to cut both sides of the faulty sub-first connection portion so that the middle portion of the sub-first connection portion is disconnected from the two end portions. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly describe the technical solutions in the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0031] Figure 1A is a plan view schematically showing a light emitting substrate in the related art;

[0032] Figure 1B is a cross-sectional schematic diagram of a light-emitting substrate in the related art;

[0033] Figure 2 is a schematic plan view of a partial structure of a light-emitting substrate according to an embodiment of the present disclosure;

[0034] Figure 3A for Figure 1A A partial enlarged schematic diagram of region I of the light-emitting substrate;

[0035] Figure 3B is another cross-sectional schematic diagram of a light-emitting substrate in the related art;

[0036] Figure 4 for Figure 2 A partial enlarged schematic diagram of region II of the light-emitting substrate;

[0037] Figure 5 is a schematic plan view of a partial structure of a light-emitting substrate according to another embodiment of the present disclosure;

[0038] Figure 6 is a schematic plan view of a partial structure of a light-emitting substrate according to another embodiment of the present disclosure;

[0039] Figure 7 for Figure 6 A partial enlarged schematic diagram of region III of the light-emitting substrate;

[0040] Figure 8 is a schematic cross-sectional view of a partial structure of a light-emitting substrate according to an embodiment of the present disclosure;

[0041] Fig. 9 is a schematic plan view of a partial structure of a light-emitting substrate in a fan-out area according to an embodiment of the present disclosure;

[0042] Fig.10 is a schematic plan view of a partial structure of a light-emitting substrate according to an embodiment of the present disclosure;

[0043] Fig.11 is a block diagram of a display device according to an embodiment of the present disclosure; and

[0044] Fig.12 The present invention is a flowchart of a method for manufacturing a light-emitting substrate according to an embodiment of the present invention. DETAILED DESCRIPTION

[0045] The technical solutions in the embodiments of the present disclosure will be described clearly and completely below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0046] It is understood that the various drawings in the embodiments of the present disclosure are only used to schematically illustrate the connection relationship between the various components, the sizes of the various components in the drawings are not drawn according to scale, and their relative positions do not necessarily correspond completely to the actual positions. In the drawings, the proportions of certain areas and layers may be exaggerated for the sake of clarity.

[0047] In the related art, the light-emitting substrate of the display device (for example, the light-emitting substrate of the backlight source) includes at least two conductive layers, for example, a first conductive layer and a second conductive layer. The first conductive layer is usually used to act as various signal lines to transmit corresponding electrical signals, and the second conductive layer located at a different layer from the first conductive layer is usually used to act as a connecting lead between various conductive pads and light-emitting elements. Through the cooperation of the first conductive layer and the second conductive layer, the light-emitting element of the light-emitting substrate can be controlled to emit light. The first conductive layer and the second conductive layer often inevitably overlap in the direction perpendicular to the substrate. An insulating layer is usually provided between the first conductive layer and the second conductive layer, and particulate foreign matter in the environment may be entrained into the insulating layer during the manufacturing process. If the first conductive layer and the second conductive layer are close in the direction perpendicular to the substrate, on the one hand, the particulate foreign matter may pierce the insulating layer between the first conductive layer and the second conductive layer, causing the first conductive layer and the second conductive layer to short-circuit; on the other hand, the closer distance will cause a very obvious mutual capacitance between the first conductive layer and the second conductive layer, affecting the electrical performance of the light-emitting substrate. Therefore, a thicker insulating layer needs to be provided in the overlapping area of ​​the first conductive layer and the second conductive layer. However, due to the limitation of manufacturing process, inorganic insulating layer usually cannot form thicker film layer, while organic insulating layer is formed by coating process, and the thickness of the formed film layer (for example, thickness of 3.0~10.0um) can meet the thickness requirement of insulating layer. Therefore, a stack of inorganic insulating layer and organic insulating layer is usually provided between the first conductive layer and the second conductive layer.

[0048] However, since organic polymers are hygroscopic, the organic insulating layer composed of organic materials usually has a certain degree of hygroscopicity. The light-emitting substrate is provided with devices such as light-emitting elements and driving circuits, and vias are usually provided at the locations where the light-emitting elements and driving circuits are located to achieve electrical connection between the light-emitting elements and driving circuits and other circuits. During the manufacturing process, water vapor in the air will enter the interior of the light-emitting substrate along the vias of the light-emitting elements and driving circuits. Figure 1A 1 shows a schematic plan view of a light emitting substrate 10 in the related art. Figure 1B FIG. 1 is a cross-sectional schematic diagram of a light emitting substrate 10 in the related art. Figure 1A and 1BAs shown, the light-emitting substrate 10 includes a substrate 11, a first conductive layer 12, a second conductive layer 13, and an organic insulating layer 14 located between the first conductive layer 12 and the second conductive layer 13. The organic insulating layer 14 is a whole-surface structure, which is laid on the first conductive layer 12 in its entirety, thereby substantially completely covering the first conductive layer 12 below. As mentioned above, the organic insulating layer 14 is water-absorbent, so the water vapor entering the interior of the light-emitting substrate 10 through the via hole can travel a certain distance inside the organic insulating layer 14. The first conductive layer 12 and the second conductive layer 13 have an overlapping area in a direction perpendicular to the substrate 11. The water vapor moving inside the organic insulating layer 14 is concentrated at a position of the organic insulating layer 14 corresponding to the overlapping portion of the first conductive layer 12 and the second conductive layer 13. Under the influence of the potential difference and water molecules, the overlapping portion of the first conductive layer 12 and the second conductive layer 13 is prone to electrochemical corrosion, resulting in a short circuit problem between the first conductive layer 12 and the second conductive layer 13, which in turn causes a partial functional failure of the light-emitting substrate 10.

[0049] In order to solve the above problems, an embodiment of the present disclosure provides a light-emitting substrate. Figure 2 FIG. 1 is a plan view showing a partial structure of the light emitting substrate 100. Figure 2 As shown, the light-emitting substrate 100 includes: a substrate 101, which includes a light-emitting area E; a first conductive portion 102, which is located on the substrate 101 and is at least arranged in the light-emitting area E, and the first conductive portion 102 extends along a first direction D1 in the light-emitting area E; a second conductive portion 103, which is located on a side of the first conductive portion 102 away from the substrate 101 and is arranged in the light-emitting area E, and the second conductive portion 103 includes a first connecting portion 1032, and the first connecting portion 1032 of the second conductive portion 103 extends along a second direction D1 intersecting the first direction D1. 2, a first orthographic projection of the first connecting portion 1032 of the second conductive portion 103 on the substrate 101 at least partially overlaps with a second orthographic projection of the first conductive portion 102 on the substrate 101, and an overlapping region R is formed by overlapping the first orthographic projection and the second orthographic projection; and a first insulating portion 104, which is located in the light-emitting region E, the first insulating portion 104 is only located between the first connecting portion 1032 of the second conductive portion 103 and the first conductive portion 102, and the overlapping region R falls within the orthographic projection of the first insulating portion 104 on the substrate 101.

[0050] It should be noted that Figure 2 The area shown is a part of the light emitting area E of the light emitting substrate 100, and other areas (such as the fan-out area, the binding area, etc.) of the light emitting substrate 100 are shown in FIG. Figure 2. In addition, in the present application document, terms such as "XX extends along the first direction D1" means that XX as a whole is basically wired along the first direction D1, but it is not required that each section of XX must be wired strictly in accordance with the first direction D1 without slight bending. For example, in the light-emitting area E, it is possible that all sections of the first conductive part 102 are wired along the first direction D1, or it is possible that most sections of the first conductive part 102 are wired along the first direction D1, while a small part of the sections are wired along the second direction D2 or any other direction that is at a non-zero angle to the first direction D1. Both of these situations can be understood as the first conductive part 102 extending along the first direction D1. Similarly, terms such as "XX extends along the second direction D2" means that XX as a whole is basically wired along the second direction D2, but it is not required that each section of XX must be wired strictly in accordance with the second direction D2 without slight bending.

[0051] The first connection part 1032 of the second conductive part 103 connects the main part 1031 (which will be described in detail later) located on both sides of the first connection part 1032. The main part 1031 of the second conductive part 103 is usually provided with a light-emitting element and electrically connected to the light-emitting element. The existence of the first connection part 1032 can connect the light-emitting elements on the main part 1031 on both sides of the first connection part 1032 in series. In the embodiment of the present disclosure, in order to prevent the first conductive part 102 and the second conductive part 103 from short-circuiting at the overlapping area of ​​the two, the first insulating part 104 is only provided in the overlapping area of ​​the first conductive part 102 and the second conductive part 103 (that is, between the first connection part 1032 of the second conductive part 103 and the first conductive part 102), and the first insulating part 104 is not provided above the area of ​​the first conductive part 102 that does not overlap with the second conductive part 103. Therefore, compared with the related art, the light-emitting substrate 100 in the embodiment of the present disclosure cancels the design of the whole surface organic insulating layer, but only designs an extremely narrow organic insulating layer bridge structure, namely the first insulating part 104, in the overlapping area of ​​the first conductive part 102 and the second conductive part 103. Compared with the whole surface structure, the extremely narrow first insulating part 104 is significantly reduced in area and volume, so it has very weak or even negligible water absorption. Moreover, since the first insulating part 104 is only arranged between the first connecting part 1032 of the second conductive part 103 and the first conductive part 102, it perfectly avoids the opening position of the light-emitting element. Therefore, even if water vapor enters the inside of the light-emitting substrate 100 along the opening of the light-emitting element, it will not contact the first insulating part 104, so that the electrochemical corrosion between the first conductive part 102 and the second conductive part 103 caused by the invasion of water vapor can be avoided, the electrochemical corrosion ratio of the light-emitting substrate 100 in the process is reduced, and the reliability level of the light-emitting substrate 100 and the whole product including the light-emitting substrate 100 is effectively improved.

[0052] Since the first insulating portion 104 is mainly used to prevent the first conductive portion 102 from being electrically connected to the first connecting portion 1032 of the second conductive portion 103 and thus causing a short circuit, the four sides of the first insulating portion 104 need to be extended beyond the side portions of the first conductive portion 102 located in the overlapping region R and the side portions of the second conductive portion 103 located in the overlapping region R. Figure 2 As shown, the orthographic projections of the parts of the two side edges of the first conductive portion 102 extending along the first direction D1 that are located in the overlapping region R (i.e., the parts of the two side edges of the first conductive portion 102 extending along the first direction D1 that overlap with the first insulating portion 104) on the substrate 101 respectively fall within the orthographic projections of the first insulating portion 104 on the substrate 101, and the orthographic projections of the parts of the two side edges of the first connecting portion 1032 of the second conductive portion 103 extending along the second direction D2 that are located in the overlapping region R on the substrate 101 respectively fall within the orthographic projections of the first insulating portion 104 on the substrate 101. In other words, the two sides 1041 and 1042 of the first insulating portion 104 extending along the first direction D1 respectively extend in the second direction D2 beyond the two sides of the first conductive portion 102 extending in the first direction D1 and located in the overlapping region R, and the two sides 1043 and 1044 of the first insulating portion 104 extending in the second direction D2 respectively extend in the first direction D1 beyond the two sides of the first connecting portion 1032 of the second conductive portion 103 extending in the second direction D2 and located in the overlapping region R. The specific values ​​of the outward expansion distances of the four sides of the first insulating portion 104 are determined by the process accuracy, and the embodiments of the present disclosure do not specifically limit this. In an example, the two side edges 1041 and 1042 of the first insulating portion 104 extend in the second direction D2 respectively beyond the two side edges of the first conductive portion 102 extending along the first direction D1 by a distance greater than 10um and less than 100um, and the two side edges 1043 and 1044 of the first insulating portion 104 extend in the first direction D1 respectively beyond the two side edges of the first connecting portion 1032 of the second conductive portion 103 extending along the second direction D2 by a distance greater than 10um and less than 100um.

[0053] The material of the first insulating part 104 may be an organic material, so that an appropriate thickness can be formed through a coating process to meet the structural and electrical requirements of the first conductive part 102 and the second conductive part 103. The embodiments of the present disclosure do not limit the specific composition of the organic material of the first insulating part 104. In one example, the first insulating part 104 is an OC (Over Coating) layer, which is a negative photoresist composed of an organic material.

[0054] like Figure 2As shown, the second conductive part 103 further includes a main body 1031 and a second connecting part 1033. The second connecting part 1033 of the second conductive part 103 is electrically connected to the first conductive part 102. The main body 1031 of the second conductive part 103 is located on both sides of the first connecting part 1032, and is located on one side of the first connecting part 1032 (for example, on Figure 2 The first end 1031A of the main body 1031 located on the left side of the first connection portion 1032 is connected to the first end 1032-1 of the first connection portion 1032, and the second end 1031B of the main body 1031 located on one side of the first connection portion 1032 is connected to the second connection portion 1033. Figure 2 The first end 1031C of the main body 1031 (on the right side of the first connection part 1032) is connected to the second end 1032-2 of the first connection part 1032. The main body 1031 of the second conductive part 103, the first connection part 1032 and the second connection part 1033 make the second conductive part 103 present a "U-shaped" shape.

[0055] Figure 3A yes Figure 1A A partial enlarged view of region I of the light emitting substrate 10, Figure 3B is another cross-sectional view of the light emitting substrate 10. Figure 3A and 3B As shown, in the related art, the light-emitting substrate 10 also includes a covering layer 15 and a light-emitting element 21 located on the side of the second conductive layer 13 away from the substrate 11, and the covering layer 15 includes an opening 151, and the light-emitting element 21 is electrically connected to the second conductive layer 13 via the opening 151. In the light-emitting substrate 10, on the one hand, the second conductive layer 13 is usually designed to be as close to the first conductive layer 12 as possible in the horizontal direction. On the other hand, the connecting portion 131 of the second conductive layer 13 is electrically connected to the first conductive layer 12 via a via 141 in the organic insulating layer 14. Since it is necessary to avoid overlapping of the via 141 with the edge of the first conductive layer 12, the via 141 needs to be at least 20um away from the edge of the first conductive layer 12. Due to the above two reasons, as Figure 3A As shown, the opening 151 of the cover layer 15 exposes the connecting portion 131 of the second conductive layer 13, that is, the orthographic projection of the opening 151 of the cover layer 15 on the substrate 11 at least partially overlaps with the orthographic projection of the connecting portion 131 of the second conductive layer 13 on the substrate 11. The connecting portion 131 of the second conductive layer 13 overlaps with the first conductive layer 12, and the opening 151 of the cover layer 15 is a position where water vapor easily enters, as shown in FIG. Figure 3BAs shown, water vapor 24 invades into the interior of the light-emitting substrate 10 along the edges of the sealants 22 and 23 and the opening 151, penetrates through each film layer and infiltrates into the connecting portion 131 of the second conductive layer 13 and the first conductive layer 12, thereby causing electrochemical corrosion between the connecting portion 131 of the second conductive layer 13 and the first conductive layer 12, resulting in a short circuit between the first conductive layer 12 and the second conductive layer 13, and further causing the function of a part of the light-emitting substrate 10 to fail.

[0056] Figure 4 The embodiment of the present disclosure provides Figure 2 A local enlarged view of region II of the light emitting substrate 100 in FIG. Figure 2 In order to more clearly illustrate the structures of the first conductive part 102 and the second conductive part 103, the cover layer 105 located on the side of the second conductive part 103 away from the substrate 101 is omitted. Figure 4 As shown, the light-emitting substrate 100 also includes a covering layer 105 and a plurality of light-emitting elements 106, the covering layer 105 is located on a side of the second conductive portion 103 away from the substrate 101 and includes a plurality of first openings 1051, the plurality of light-emitting elements 106 are located on a side of the covering layer 105 away from the substrate 101, and each light-emitting element 106 is electrically connected to a main portion 1031 of the second conductive portion 103 via a corresponding first opening 1051. Figure 4 As an example, only one light emitting element 106 and one first opening 1051 of the cover layer 105 are shown. The second connection portion 1033 of the second conductive portion 103 is electrically connected to the first conductive portion 102. By electrically connecting the second connection portion 1033 of the second conductive portion 103 to the first conductive portion 102 and electrically connecting the main portion 1031 of the second conductive portion 103 to the light emitting element 106, the electrical signal carried by the first conductive portion 102 can be transmitted to the light emitting element 106 via the second connection portion 1033 and the main portion 1031 of the second conductive portion 103 to drive the light emitting element 106 to emit light. In some embodiments, the first conductive portion 102 can be a driving voltage signal line VLEDL and / or a common voltage signal line GNDL, and the second conductive portion 103 is a lead connecting each light emitting element 106.

[0057] The orthographic projection of the second connection portion 1033 of the second conductive portion 103 on the substrate 101 at least partially overlaps with the orthographic projection of the first conductive portion 102 on the substrate 101, and the orthographic projection of the plurality of first openings 1051 of the cover layer 105 on the substrate 101 does not overlap with the orthographic projection of the second connection portion 1033 of the second conductive portion 103 on the substrate 101. That is, the first opening 105 of the cover layer 105 does not expose the second connection portion 1033 of the second conductive portion 103, but the cover layer 105 covers the second connection portion 1033 of the second conductive portion 103. With such an arrangement, even if water vapor may enter the interior of the light-emitting substrate 100 along the first opening 1051 of the cover layer 105 during the manufacturing process, since the cover layer 105 is not hygroscopic, the water vapor will not migrate inside the cover layer 105, and therefore, the intruding water vapor at most exists at the location of the first opening 1051, and will not migrate to the second connection portion 1033 of the second conductive portion 103 far away from the first opening 1051. Therefore, electrochemical corrosion will not occur at the overlapping portion between the second connecting portion 1033 of the second conductive portion 103 and the first conductive portion 102 .

[0058] It should be noted that Figure 4 FIG. 1 shows that the first opening 1051 of the covering layer 105 exposes a portion of the main body 1031 of the second conductive part 103, but this has no effect because the main body 1031 of the second conductive part 103 does not overlap with the first conductive part 102. Therefore, even if the main body 1031 of the second conductive part 103 may be corroded by water vapor, it will not cause an electrochemical reaction between the first conductive part 102 and the second conductive part 103, resulting in electrochemical corrosion.

[0059] The number of the plurality of light-emitting elements 106 is equal to the number of the plurality of first openings 1051 of the cover layer 105, that is, at the location of each light-emitting element 106, the cover layer 105 is correspondingly provided with a first opening 1051 to allow the light-emitting element 106 to be connected to the main portion 1031 of the second conductive portion 103 via the first opening 1051. The second conductive portion 103 includes a plurality of conductive pads, such as a positive conductive pad 1061 and a negative conductive pad 1062, and the light-emitting element 106 is connected to the main portion 1031 of the second conductive portion 103 via these two conductive pads 1061 and 1062. The orthographic projection of each light-emitting element 106 on the substrate 101 falls within the orthographic projection of a corresponding first opening 1051 on the substrate 101, that is, the area of ​​the first opening 1051 of the cover layer 105 is larger than the area occupied by the light-emitting element 106. In one example, as Figure 4As shown, the shape of the first opening 1051 of the cover layer 105 is circular, and the distance T1 between the side edge of the light emitting element 106 and the corresponding side edge of the first opening 1051 is 0.5 mm. For example, as shown in the figure, the distance T1 between the right edge of the light emitting element 106 and the right side of the circular first opening 1051 is 0.5 mm, and the distance T1 between the upper edge of the light emitting element 106 and the upper side of the circular first opening 1051 is 0.5 mm. Similarly, the distance T1 between the left edge of the light emitting element 106 and the left side of the circular first opening 1051 is 0.5 mm, and the distance T1 between the lower edge of the light emitting element 106 and the lower side of the circular first opening 1051 is 0.5 mm. The cover layer 105 is usually formed by a screen printing process, and its screen printing accuracy is about 0.3 mm. Therefore, in order to ensure that the first opening 1051 does not overlap with the second connection portion 1033 of the second conductive portion 103, the distance T2 between the upper highest point of the circular first opening 1051 and the second connection portion 1033 of the second conductive portion 103 should be greater than 0.3 mm. Through such a design, the distance between the upper edge of the light-emitting element 106 and the second connection portion 1033 of the second conductive portion 103 is T1+T2, that is, greater than 0.8 mm. Therefore, no matter how the position of the first opening 1051 of the cover layer 105 deviates within the accuracy range during the manufacturing process, the first opening 1051 of the cover layer 105 can perfectly avoid the second connection portion 1033 of the second conductive portion 103, so as not to overlap with the second connection portion 1033 of the second conductive portion 103.

[0060] The orthographic projections of the plurality of first openings 1051 of the cover layer 105 on the substrate 101 and the orthographic projections of the first insulating portion 104 on the substrate 101 do not overlap. Figure 2 and Figure 4 , the distance between the side edge 1043 of the first insulating portion 104 and the first opening 1051 of the cover layer 105 is 1-2 mm. With such an arrangement, water vapor intruding along the first opening 1051 cannot contact the first insulating portion 104, so that the first insulating portion 104 can play a good insulating effect between the first conductive portion 102 and the first connecting portion 1032 of the second conductive portion 103, thereby preventing a short circuit between the first conductive portion 102 and the first connecting portion 1032 of the second conductive portion 103.

[0061] The material of the cover layer 105 may be any appropriate material, and the embodiments of the present disclosure do not specifically limit the material of the cover layer 105. In one example, the material of the cover layer 105 is white oil. The cover layer 105 may be a reflective layer with a reflective function to reflect the light emitted by the light emitting element 106 toward the user, thereby improving the utilization rate of the light source.

[0062] The light-emitting element 106 may be a sub-millimeter light-emitting diode (Mini LED) or a micro light-emitting diode (MircoLED). The size of a sub-millimeter light-emitting diode is, for example, in the range of 100 microns to 500 microns; the size of a micro light-emitting diode is, for example, less than 100 microns. The embodiments of the present disclosure do not limit the type and size of the light-emitting element 106. By using a sub-millimeter light-emitting diode or a micro light-emitting diode as the light-emitting element 106, a high dynamic range (HDR) display can be achieved. When such a light-emitting substrate is applied to a display device, the contrast of the display device can be significantly improved.

[0063] It should be noted that, in addition to the light emitting element 106, the light emitting substrate 100 may also include other electronic devices, including but not limited to sensor devices, integrated circuits, etc. The cover layer 105 is provided with first openings 1051 at positions corresponding to these electronic devices, and the positional relationship between the first openings 1051 and the first insulating portion 104 at these positions can be designed according to the positional relationship between the first openings 1051 and the first insulating portion 104 of the cover layer 105 as described above.

[0064] In some embodiments, the ratio of the area of ​​the orthographic projection of the first insulating portion 104 on the substrate 101 to the area of ​​the substrate 101 is approximately 10%. The term "approximately 10%" means that the ratio may be equal to 10%, may be slightly less than 10%, or may be slightly greater than 10%. In some embodiments, the area of ​​the orthographic projection of the first insulating portion 104 on the substrate 101 is smaller than the area of ​​the orthographic projection of the second conductive portion 103 on the substrate 101. As mentioned above, in the related art, the organic insulating layer is a whole-surface structure, that is, the area of ​​the organic insulating layer is substantially equal to the area of ​​the substrate, and the second conductive layer is only arranged in certain areas on the substrate. Therefore, in the related art, the area of ​​the organic insulating layer is larger than the area of ​​the second conductive layer. In the embodiment of the present disclosure, the first insulating portion 104 is provided only at the overlapping area R of the first conductive portion 102 and the second conductive portion 103, and the first insulating portion 104 is not provided in other areas, so that the area of ​​the first insulating portion 104 is much smaller than the area of ​​the second conductive portion 103. Compared with the related art, the light-emitting substrate provided in the embodiment of the present disclosure significantly reduces the area of ​​the first insulating part 104, so that the first insulating part 104 has very weak or even negligible water absorption, thereby avoiding electrochemical corrosion between the first conductive part 102 and the second conductive part 103, thereby improving the reliability of the light-emitting substrate, and because the first insulating part 104 has a smaller area, the organic materials used can be saved and the production cost can be reduced. Figure 5 FIG. 2 is a plan view showing a partial structure of the light emitting substrate 200. Figure 5 The light emitting substrate 200 shown in FIG. Figure 2The light emitting substrate 100 shown in FIG. 1 is substantially the same in structure, and therefore the same reference numerals are used to refer to the same components. Figure 5 With Figure 2 The detailed roles and functions of the components with the same reference numerals can be referred to in Figure 2 The description of Figure 2 similar, Figure 5 In order to more clearly illustrate the structures of the first conductive part 102 and the second conductive part 103, the cover layer 105 located on the side of the second conductive part 103 away from the substrate 101 is omitted, but the light-emitting substrate 200 includes the cover layer 105, and the arrangement of the cover layer 105 of the light-emitting substrate 200 is the same as that of the cover layer 105 of the light-emitting substrate 100. For the sake of simplicity, Figure 5 The light emitting substrate 200 and Figure 2 The similarities of the light-emitting substrate 100 in FIG. 1 are not described again, and only the differences are described below.

[0065] like Figure 5 As shown, the first connection portion 1032 of the second conductive portion 103 includes at least two sub-first connection portions extending along the second direction D2 and spaced apart from each other, and the orthographic projections of the at least two sub-first connection portions on the substrate 101 at least partially overlap with the orthographic projections of the same first insulating portion 104 on the substrate 101. Figure 5 As an example, two sub-first connection parts 1032A and 1032B (referred to as the first sub-connection part 1032A and the second sub-connection part 1032B) are shown, but this is only an example. The first connection part 1032 of the second conductive part 103 may also include a larger number of sub-first connection parts, such as three, four or even more. The embodiments of the present disclosure do not limit the specific number of sub-first connection parts. In one example, the interval between the first sub-connection part 1032A and the second sub-connection part 1032B is greater than 300μm. When the first connection part 1032 of the second conductive part 103 includes a plurality of sub-first connection parts, the interval between any two adjacent sub-first connection parts among the plurality of sub-first connection parts is greater than 300μm.

[0066] The reason why the first connection part 1032 is designed to include at least two sub-first connection parts and the interval between the two sub-first connection parts is greater than 300 μm is that in the manufacturing process, particles in the environment are sometimes inevitably introduced between the first conductive part 102 and the second conductive part 103. If particles exist between the first connection part 1032 of the first conductive part 102 and the second conductive part 103, the particles may pierce the film layer between the first connection part 1032 of the first conductive part 102 and the second conductive part 103, causing a short circuit between the first connection part 1032 of the first conductive part 102 and the second conductive part 103. Since both sides of the first connection part 1032 of the second conductive part 103 are connected to the main part 1031 respectively, and a light-emitting element 106 is respectively arranged on the main part 1031 on both sides, the first connection part 1032 connects the two light-emitting elements 106 in series. If the first connection part 1032 of the second conductive part 103 is short-circuited, the functions of the two light-emitting elements 106 (and other light-emitting elements 106 connected in series with the two light-emitting elements 106) will fail, thereby causing the light-emitting elements 106 to have bad phenomena such as explosion and extinguishing. In the embodiment of the present disclosure, the first connection part 1032 includes at least two sub-first connection parts 1032A and 1032B, and the interval between the two sub-first connection parts 1032A and 1032B is greater than 300μm. Since the size of the particles is less than 300um, even when there are particles between the first connection part 1032 of the first conductive part 102 and the second conductive part 103, this "double bridge" design of the first connection part 1032 can ensure that there are no particles below at least one of the two sub-first connection parts, so that normal electrical connection can be achieved, ensuring that adjacent light-emitting elements 106 can be normally connected in series.

[0067] Figure 6 FIG. 2 is a plan view showing a partial structure of the light emitting substrate 300. Figure 6 The light emitting substrate 300 shown in FIG. Figure 5 The light emitting substrate 200 shown in FIG. 1 is substantially the same in structure, and therefore the same reference numerals are used to refer to the same components. Figure 6 With Figure 5 The detailed roles and functions of the components with the same reference numerals can be referred to in Figure 2 and Figure 5 The description of Figure 2 similar, Figure 6In order to more clearly illustrate the structures of the first conductive part 102 and the second conductive part 103, the cover layer 105 located on the side of the second conductive part 103 away from the substrate 101 is omitted, but the light-emitting substrate 300 includes the cover layer 105, and the arrangement of the cover layer 105 of the light-emitting substrate 300 is the same as that of the cover layer 105 of the light-emitting substrate 100. For the sake of simplicity, Figure 6 The light emitting substrate 300 and Figure 5 The similarities of the light-emitting substrate 200 in FIG. 2 are not described again, and only the differences are described below.

[0068] like Figure 6 As shown, the first insulating portion 104 of the light-emitting substrate 300 includes at least two sub-insulating portions extending along the second direction D2 and spaced apart from each other, and the number of the at least two sub-insulating portions is equal to the number of the at least two sub-first connecting portions. When the first connecting portion 1032 of the second conductive portion 103 includes two sub-first connecting portions, namely the first sub-connecting portion 1032A and the second sub-connecting portion 1032B, the first insulating portion 104 correspondingly includes two sub-insulating portions, namely the first sub-insulating portion 1041 and the second sub-insulating portion 1042. The orthographic projection of the first sub-connecting portion 1032A on the substrate 101 at least partially overlaps with the orthographic projection of the first sub-insulating portion 1041 on the substrate 101, and the orthographic projection of the second sub-connecting portion 1032B on the substrate 101 at least partially overlaps with the orthographic projection of the second sub-insulating portion 1042 on the substrate 101. Similar to the above description, the two sides of the first sub-insulating portion 1041 extending along the first direction D1 respectively extend beyond the portions of the two sides of the first conductive portion 102 extending along the first direction D1 located in the overlapping region R, and the two sides of the first sub-insulating portion 1041 extending along the second direction D2 respectively extend beyond the portions of the two sides of the first sub-connecting portion 1032A extending along the second direction D2 located in the overlapping region R. The two sides of the second sub-insulating portion 1042 extending along the first direction D1 respectively extend beyond the portions of the two sides of the first conductive portion 102 extending along the first direction D1 located in the overlapping region R, and the two sides of the second sub-insulating portion 1042 extending along the second direction D2 respectively extend beyond the portions of the two sides of the second sub-connecting portion 1032B extending along the second direction D2 located in the overlapping region R. In this way, the first sub-insulating portion 1041 and the second sub-insulating portion 1042 can provide a better insulation effect for the first conductive portion 102 and the second conductive portion 103.

[0069] Figure 7 yes Figure 6 A partial enlarged view of region III of the light emitting substrate 300. Figure 7, one of the first sub-connection part 1032A and the second sub-connection part 1032B (shown in the figure as the second sub-connection part 1032B) includes two cutouts 107 on both sides, the two cutouts 107 are respectively located on both sides of the first conductive part 102, and the middle part of the second sub-connection part 1032B is disconnected from the two end parts of the second sub-connection part 1032B at the two 107. In one example, the minimum value of the spacing S of the cutouts 107 is 20μm. By making the cutouts 107 located on both sides of the first conductive part 102 without overlapping with the first conductive part 102 and the overlapping area R, it is possible to avoid damaging the first conductive part 102 and the first insulating part 104 when laser cutting the second sub-connection part 1032B. In the manufacturing process, after the second conductive part 103 is prepared or the second conductive part 103 and its subsequent film layers are prepared, the surface of the light-emitting substrate 300 can be checked for particles by an all-in-one device AIO (All-in-One). If particles are found between the second sub-connection part 1032B of the second conductive part 103 and the first conductive part 102, laser repair equipment can be used to cut and interrupt the two ends of the second sub-connection part 1032B, so that the middle part of the second sub-connection part 1032B is disconnected from the two ends of the second sub-connection part 1032B at the cut 107, so that the second sub-connection part 1032B will not be short-circuited with the first conductive part 102 due to the piercing of particles. There are no particles below the first sub-connection part 1032A, and normal electrical connection can still be achieved. Therefore, the adjacent light-emitting elements 106 located on both sides of the first connection part 1032 can still be normally connected in series to achieve normal light emission.

[0070] like Figure 7 As shown, the width of the first conductive portion 102 at the overlapping region R is smaller than the width of the first conductive portion 102 on both sides of the overlapping region R, so that Figure 7 The first conductive portion 102 shown in the figure is approximately in the shape of an I. The first conductive portion 102 here may be a common voltage signal line GNDL. A light emitting element 106 and a part of the second conductive portion 103 may be disposed at a position where the first conductive portion 102 is recessed.

[0071] like Figure 7As shown, the first connection portion 1032 of the second conductive portion 103 further includes a first confluence portion 1034 and a second confluence portion 1035, and the first confluence portion 1034 and the second confluence portion 1035 are respectively located on both sides of the first conductive portion 102. One end of the first sub-connection portion 1032A and one end of the second sub-connection portion 1032B (for example, the left ends of the two in the figure) converge at the first confluence portion 1034, and the other end of the first sub-connection portion 1032A and the other end of the second sub-connection portion 1032B (for example, the right ends of the two in the figure) converge at the second confluence portion 1035. The cutout 107 is located near the first confluence portion 1034 and the second confluence portion 1035. The orthographic projections of the first confluence portion 1034 and the second confluence portion 1035 on the substrate 101 do not overlap with the orthographic projections of the overlap region R on the substrate 101. In one example, the spacing R between the orthographic projection of the first junction 1034 on the substrate 101 and the orthographic projection of the overlap region R on the substrate 101 is greater than 300 μm, for example, greater than 400 μm, for example, greater than 500 μm. In addition, the orthographic projections of the first junction 1034 and the second junction 1035 on the substrate 101 do not overlap with the orthographic projection of the first insulating portion 104 on the substrate 101.

[0072] By keeping the first confluence 1034 and the second confluence 1035 away from the overlapping region R, damage to the surrounding film layers (for example, the first conductive portion 102 and the first insulating portion 104 located in the overlapping region R) can be avoided when the second sub-connection portion 1032B is cut by laser to form an incision 107 near the first confluence 1034 and the second confluence 1035.

[0073] When the first connecting portion 1032 of the second conductive portion 103 includes at least two sub-first connecting portions, that is, Figure 5 or Figure 6In the example, the thickness of the portion of the first insulating portion 104 located in the overlapping region R in the direction perpendicular to the substrate 101 can be reduced to about 2.5 μm. As mentioned above, in a conventional light-emitting substrate 10, the entire surface of the organic insulating layer 14 usually needs to be designed to have a very thick thickness (for example, 7.5 μm~10.0 μm). The thicker organic insulating layer 14 can wrap the particles to prevent the particles from piercing the organic insulating layer 14 and causing a short circuit between the first conductive layer 12 and the second conductive layer 13. In the light-emitting substrate 200 or 300 provided in the embodiment of the present disclosure, since the first connecting portion 1032 of the second conductive portion 103 includes at least two sub-first connecting portions spaced apart from each other, this design can perfectly solve the short circuit problem caused by the particles, so there is no need to wrap the particles by increasing the thickness of the first insulating portion 104. Compared with the whole-surface organic insulating layer 14 in the related art, the first insulating part 104 in the embodiment of the present disclosure can be significantly reduced not only in area and volume, but also in thickness (from 7.5um~10.0μm to 2.5um), which is conducive to the light-emitting substrate being made lighter and thinner while reducing production costs.

[0074] Figure 8 1 shows a cross-sectional schematic diagram of a light-emitting substrate, which may be the light-emitting substrates 100, 200, 300 described in the previous embodiments. The same reference numerals are used to refer to the same components, therefore, Figure 8 The detailed roles and functions of the components with the same reference numerals as those in the previous embodiments can be referred to the description of the light-emitting substrates 100, 200, and 300, and will not be repeated here. For example, the light-emitting substrate includes a substrate 101, a first conductive portion 102, a second conductive portion 103, and a first insulating portion 104.

[0075] As shown in the figure, the light-emitting substrate may further include a second insulating layer 108, the second insulating layer 108 is located between the first conductive part 102 and the second conductive part 103, and the first insulating part 104 is located on the side of the second insulating layer 108 away from the substrate 101. The second insulating layer 108 is an inorganic insulating layer. In one example, the material of the second insulating layer 108 is SiN. The second insulating layer 108 is disposed between the first conductive part 102 and the second conductive part 103, which can provide a good insulation effect for the first conductive part 102 and the second conductive part 103, prevent the first conductive part 102 and the second conductive part 103 from short-circuiting, and reduce the mutual capacitance between the first conductive part 102 and the second conductive part 103.

[0076] The second insulating layer 108 and the first insulating portion 104 may have the same or different shapes. In some embodiments, during the manufacturing process, the second insulating layer 108 and the first insulating portion 104 may be formed simultaneously using the same mask, so that the two have the same shape. In this case, similar to the first insulating portion 104, the second insulating layer 108 is also only located at the overlapping region R, and the orthographic projection of the second insulating layer 108 on the substrate 101 covers the overlapping region R. In an alternative embodiment, during the manufacturing process, the second insulating layer 108 and the first insulating portion 104 may be formed separately using masks with different patterns, so that the two have different shapes.

[0077] refer to Figure 4 and Figure 8 In one example, the second connection portion 1033 of the second conductive portion 103 in the light-emitting region E is connected to the first conductive portion 102 via a second via 1081 in the second insulating layer 108. In an alternative example, the second connection portion 1033 of the second conductive portion 103 in the light-emitting region E is directly connected to the first conductive portion 102, that is, the second connection portion 1033 of the second conductive portion 103 is overlapped on the first conductive portion 102 without any film layer and any via. The term "A overlaps B" means that A is in direct contact with B. The substrate 101 includes not only the light-emitting region E, but also the binding region B. In one example, the second connection portion 1033 of the second conductive portion 103 in the light-emitting region E is directly connected to the first conductive portion 102, and the second conductive portion 103 in the binding region B is connected to the first conductive portion 102 via a second via 1081 in the second insulating layer 108.

[0078] The light-emitting substrate may further include a third insulating layer 109 located on a side of the second conductive portion 103 away from the substrate 101 and a fourth insulating layer 110 located on a side of the third insulating layer 109 away from the substrate 101. The third insulating layer 109 includes a third via hole 1091, the fourth insulating layer 110 includes a fourth via hole 1101, and the third via hole 1091 and the fourth via hole 1101 penetrate each other. The cover layer 105 ( Figure 8 ) is located on the side of the fourth insulating layer 110 away from the substrate 101. The light emitting element 106 ( Figure 8 The second conductive portion 103 is connected to the main body 1031 of the second conductive portion 103 via the first opening 1051 of the cover layer 105 and the third via 1091 and the fourth via 1101 (not shown). The second conductive portion 103 includes a plurality of conductive pads 1061 and 1062, each of which has an orthographic projection on the substrate 101 that falls within the orthographic projection of the first opening 1051 of the cover layer 105 on the substrate 101. The first opening 1051 of the cover layer 105, the third via 1091 of the third insulating layer 109, and the fourth via 1101 of the fourth insulating layer 110 expose the plurality of conductive pads.

[0079] The materials of the third insulating layer 109 and the fourth insulating layer 110 may be any appropriate materials, and the embodiments of the present disclosure are not limited thereto. The third insulating layer 109 may be an inorganic insulating layer, and the fourth insulating layer 110 may be an organic insulating layer. In one example, the third insulating layer 109 may be made of the same material as the second insulating layer 108, and the fourth insulating layer 110 may be made of the same material as the first insulating portion 104.

[0080] Return to reference Figure 1B In a conventional light-emitting substrate 10, the light-emitting substrate 10 further includes an alignment layer 20, a second insulating layer 16, a fifth insulating layer 17, a third insulating layer 18, and a fourth insulating layer 19 sequentially stacked on the substrate 11. Compared with the light-emitting substrate 10, the light-emitting substrate provided in the embodiment of the present disclosure can omit the fifth insulating layer 17 and the alignment layer 20. In the light-emitting substrate 10, the fifth insulating layer 17 is used to wrap the particles on the one hand, and to cover the entire surface of the organic insulating layer 14 thereunder on the other hand, to prevent water vapor from invading the organic insulating layer 14. In the light-emitting substrate provided in the embodiment of the present disclosure, at least two sub-first connection parts of the first connection part 1032 of the second conductive part 103 have perfectly solved the short circuit problem caused by particles, and the first insulating part 104 is a very narrow "bridge structure" that only exists between the first connection part 1032 of the second conductive part 103 and the first conductive part 102, rather than a whole surface structure. In addition, the position of the first insulating part 104 avoids the opening of the light-emitting element 106 (for example, the first opening 1051 of the cover layer 105, the third via 1091 of the third insulating layer 109, and the fourth via 1101 of the fourth insulating layer 110). Even if water vapor enters the light-emitting substrate along these openings, it cannot contact the first insulating part 104. Therefore, in the light-emitting substrate provided in the embodiment of the present disclosure, it is no longer necessary to use the fifth insulating layer 17 to wrap the particles and cover the first insulating part 104. Therefore, the fifth insulating layer 17 can be omitted, which is conducive to the thinness of the product and reduces the production cost. Of course, in some embodiments, the light-emitting substrate provided in the embodiment of the present disclosure may also include a fifth insulating layer, which is located between the second conductive portion 103 and the second insulating layer 108, and covers the first insulating portion 104 and the second insulating layer 108. By providing the fifth insulating layer, the first insulating portion 104 can be better protected.

[0081] In some embodiments, the light-emitting substrate provided in the embodiment of the present disclosure may omit the alignment layer. Alternatively, the first conductive portion 102 is used as an alignment mark layer during the manufacturing process. The alignment layer is usually made of black matrix material. By omitting the alignment layer, the mask used to form the alignment layer can be saved. Alternatively, the light-emitting substrate provided in the embodiment of the present disclosure may also include an alignment layer 111, which is used to provide a precise alignment function during the manufacturing process.

[0082] Fig. 9 The wiring method of the light-emitting substrate in any of the previous embodiments in the fan-out area F is shown. In some embodiments, the fan-out area F can be a region arranged separately at the bottom of the light-emitting substrate, and the region does not overlap with the light-emitting area of ​​the light-emitting substrate. In other embodiments, due to the requirement of a narrow frame, the fan-out area F uses a double-layer conductive layer and partially overlaps with the light-emitting area of ​​the light-emitting substrate. Due to the complex wiring of the fan-out area F and the dense arrangement of the lines, the first conductive part 102 and the second conductive part 103 have a large number of overlapping areas in the fan-out area F. The overlapping position of the first conductive part 102 and the second conductive part 103 in the fan-out area F can be designed using a similar design idea as described above (for example, the first connecting part 1032 of the second conductive part 103 is designed as a "double bridge", the first insulating part 104 is only located in the overlapping area of ​​the two, and the first opening 1051 of the cover layer 105 avoids the design of the first insulating part 104, etc.). Below, the wiring method of the fan-out area F is briefly introduced.

[0083] The wiring method of the first conductive part 102 and the second conductive part 103 in the light-emitting area E and the fan-out area F is roughly as follows. Each first conductive part 102 is arranged not only in the light-emitting area E, but also in the fan-out area F. The part of the first conductive part 102 in the light-emitting area E extends along the first direction D1, and the part in the fan-out area F either continues to extend along the first direction D1, or extends along the second direction D2, or extends along another direction different from the first direction D1 and the second direction D2. In other words, the first conductive part 102 is bent in the fan-out area F to facilitate connection with the binding electrode of the binding area. The main part 1031 of each second conductive part 103 is connected in series with multiple light-emitting elements 106, for example, four light-emitting elements 106 are connected in series, wherein the first light-emitting element 106 of the four light-emitting elements 106 is electrically connected to the first conductive part 102 via the second connecting part 1033 of the second conductive part 103, and the last light-emitting element 106 of the four light-emitting elements 106 is electrically connected to the driving circuit. Each first conductive portion 102 is connected to a plurality of second conductive portions 103, wherein most of the plurality of second conductive portions 103 are arranged in the light-emitting region E, and a small number of the plurality of second conductive portions 103 are arranged in the fan-out region F. The cover layer 105 spans the light-emitting region E and the fan-out region F of the light-emitting substrate, and the cover layer 105 includes a first opening 1051 at the location of each light-emitting element 106.

[0084] like Fig. 9As shown, the first conductive part 102 includes a plurality of second openings 112 (shown by a dotted rectangular frame in the figure) in the fan-out region F, the number of the light-emitting elements 106 located in the fan-out region F is equal to the number of the plurality of second openings 112, the orthographic projection of each light-emitting element 106 located in the fan-out region F on the substrate 101 falls within the orthographic projection of a corresponding second opening 112 on the substrate 101, and the orthographic projection of a first opening 1051 of the cover layer 105 corresponding to the light-emitting element 106 on the substrate 101 falls within the orthographic projection of the corresponding second opening 112 on the substrate 101. That is, in the fan-out region F, at the position where the light-emitting element 106 is provided, the cover layer 105 is provided with a first opening 1051 at the corresponding position, the first conductive part 102 is provided with a second opening 112 at the corresponding position, and the area of ​​the light-emitting element 106 is less than the area of ​​the first opening 1051 and less than the area of ​​the second opening 112. In the light-emitting area E, the first conductive part 102 extends along the first direction D1, and the first conductive part 102 and the second conductive part 103 have less overlapping areas. The first conductive part 102 does not need to be designed with openings, and the first opening 1051 of the cover layer 105 can avoid the overlapping areas of the first conductive part 102 and the second conductive part 103. In the fan-out area F, the lines are arranged more densely, and the first conductive part 102 and the second conductive part 103 have more overlapping areas. If the first conductive part 102 is not designed with openings, the first opening 1051 of the cover layer 105 will expose the overlapping parts of the first conductive part 102 and the second conductive part 103, so that water vapor exists in the overlapping area of ​​the first conductive part 102 and the second conductive part 103 along the first opening 1051, thereby causing electrochemical corrosion and causing a short circuit. Fig. 9 In the embodiment, by making the first opening 1051 of the cover layer 105 smaller than the second opening 112 of the first conductive part 102, at the location where the first opening 1051 of the cover layer 105 is located, at most only the second conductive part 103 is exposed, and no first conductive part 102 is exposed, that is, at the location where the first opening 1051 of the cover layer 105 is located, there is no overlap between the first conductive part 102 and the second conductive part 103. In this way, electrochemical corrosion between the first conductive part 102 and the second conductive part 103 caused by the introduction of water vapor can be avoided.

[0085] The second opening 112 of the first conductive portion 102 needs to have an appropriate size. If the second opening 112 is too small, such as Fig. 9As shown in the second opening 112', the size of the first opening 1051 of the cover layer 105 must be larger than the second opening 112' of the first conductive part 102, resulting in the first opening 1051 of the cover layer 105 exposing the overlapping first conductive part 102 and second conductive part 103. Of course, the second opening 112 should not be too large. If the opening is too large, the channel resistance of the first conductive part 102 will be significantly increased.

[0086] Therefore, when designing the second opening 112 of the first conductive part 102, it is necessary to first evaluate whether the increased resistance of the first conductive part 102 caused by the opening meets the electrical requirements. On the basis of meeting the electrical requirements, the size of the second opening 112 of the first conductive part 102 is increased as much as possible.

[0087] In some embodiments, in the fan-out region F, between the first conductive portion 102 and the second conductive portion 103, a first insulating layer 104' may be further provided. The shape of the first insulating layer 104' may be the same as that of the second conductive portion 103, but it needs to be larger than the length and width of the second conductive portion 103, so that the orthographic projection of the second conductive portion 103 on the substrate 101 completely falls within the orthographic projection of the first insulating layer 104' on the substrate 101. Through such an arrangement, the first insulating layer 104' can not only provide a good insulation effect for the first conductive portion 102 and the second conductive portion 103 in the fan-out region F, but also effectively reduce the use area of ​​the first insulating layer 104', avoid laying the first insulating layer 104' on the entire surface of the fan-out region F, and save materials. The first insulating layer 104' in the fan-out region F and the first insulating portion 104 in the light-emitting region E may have the same material. In the manufacturing process, the first insulating portion 104 and the first insulating layer 104' may be formed simultaneously through a single mask process.

[0088] In some embodiments, in the fan-out region F, the second conductive part 103 may also adopt a "double bridge" design. As shown in the figure, the second conductive part 103 includes a first sub-connection part 1032A and a second sub-connection part 1032B. If particles are found between one of the first sub-connection part 1032A and the second sub-connection part 1032B and the first conductive part 102, a laser repair device may be used to cut and interrupt the two ends of the sub-connection part, so that the middle part of the sub-connection part is disconnected from the two ends of the sub-connection part at the cut. The other of the first sub-connection part 1032A and the second sub-connection part 1032B can still achieve normal electrical connection, so that the adjacent light-emitting elements 106 can be normally connected in series, thereby emitting light normally.

[0089] In the light-emitting substrate provided in each of the above embodiments, the first conductive portion 102 may be a driving voltage signal line VLEDL, and the second conductive portion 103 may be a lead connecting each light-emitting element 106. The first conductive portion 102 is electrically connected to the second connecting portion 1033 of the second conductive portion 103 to transmit the driving voltage signal to the light-emitting element 106, thereby driving the light-emitting element 106 to emit light. Other circuit arrangements are not shown in the accompanying drawings. In fact, there are several other leads located on the same layer as the first conductive portion 102, such as a common voltage signal line GNDL, an addressing signal line ADDRL, a power signal line VccL, a driving data signal line DataL, a feedback signal line FBL, etc. In the manufacturing process, the first conductive portion 102 and the several leads can be formed simultaneously by patterning the same conductive layer. Similarly, there are other components located on the same layer as the second conductive portion 103, such as a conductive pad of the light-emitting element 106 and a conductive pad of the driving circuit. In the manufacturing process, the second conductive portion 103 and the above components can be formed simultaneously by patterning the same conductive layer.

[0090] Fig.10 A schematic plan view showing a partial structure of a light emitting substrate according to an embodiment of the present disclosure is shown. Fig.10 The light-emitting substrate shown may be the light-emitting substrates 100, 200, 300 described in the previous embodiments. Fig.10 As shown, the first conductive part 102 includes a driving voltage signal line VLEDL and a common voltage signal line GNDL, the second connecting part 1033 of the second conductive part 103 is electrically connected to the driving voltage signal line VLEDL to receive a voltage signal from the driving voltage signal line VLEDL, the first connecting part 1032 of the second conductive part 103 overlaps with the common voltage signal line GNDL to form an overlapping area R as described above, and the main body 1031 of the second conductive part 103 is connected in series with four light-emitting elements, each of which is connected to a first pad 1061 and a second pad 1062. The light-emitting substrate also includes an integrated circuit 113. During the light-emitting period, the integrated circuit 113 provides a driving voltage to the driving voltage signal line VLEDL and provides a common voltage to the common voltage signal line GNDL, thereby driving the light-emitting element to emit light. The specific working principle of the integrated circuit 113 can be referred to the contents recorded in the relevant literature, and the embodiments of the present disclosure will not be repeated here.

[0091] According to another aspect of the present disclosure, a backlight source is provided, which includes a light-emitting substrate described in any of the previous embodiments. The backlight source can be used as a backlight source in a display device to provide a display light source for a display panel in the display device. Of course, the backlight source can also be used for any other device that requires a light source, and the embodiments of the present disclosure do not specifically limit the use of the backlight source. Since the backlight source can have basically the same technical effects as the light-emitting substrate described in the previous embodiments, for the purpose of brevity, the technical effects of the backlight source will not be repeated here.

[0092] According to another aspect of the present disclosure, a display device is provided. Fig.11 A block diagram of a display device 400 is shown, and the display device 400 includes a light-emitting substrate described in any of the previous embodiments. In some embodiments, the display device 400 can be a liquid crystal display device, which includes a liquid crystal panel and a backlight source arranged on the non-display side of the liquid crystal panel, and the backlight source includes the light-emitting substrate described in any of the previous embodiments, for example, which can be used to implement HDR dimming for display operations. The liquid crystal display device can have a more uniform backlight brightness and a better display contrast. The display device 400 can be any appropriate display device, including but not limited to any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, an e-book, etc.

[0093] Since the display device 400 can have substantially the same technical effects as the light-emitting substrate described in the previous embodiments, the technical effects of the display device 400 will not be repeatedly described herein for the purpose of brevity.

[0094] According to another aspect of the present disclosure, a method for manufacturing a light-emitting substrate is provided. Fig.12 The flowchart of the method 500 is shown, and the method 500 is applicable to the light-emitting substrate described in any of the above embodiments. The method 500 may include the following steps:

[0095] S501: providing a substrate 101, wherein the substrate 101 includes a light-emitting area E;

[0096] S502: forming a first conductive portion 102 on the substrate 101, wherein the first conductive portion 102 is at least arranged in the light-emitting region E and extends along a first direction D1 in the light-emitting region E;

[0097] S503: forming a first insulating portion 104 on a side of the first conductive portion 102 away from the substrate 101, wherein the first insulating portion 104 is located in the light emitting region E; and

[0098] S504: A second conductive portion 103 is formed on a side of the first insulating portion 104 away from the substrate 101, the second conductive portion 103 is arranged in the light-emitting area E and includes a first connecting portion 1032, the first connecting portion 1032 of the second conductive portion 103 extends along a second direction D2 intersecting the first direction D1, a first orthographic projection of the first connecting portion 1032 of the second conductive portion 103 on the substrate 101 at least partially overlaps with a second orthographic projection of the first conductive portion 102 on the substrate 101, and an area where the first orthographic projection overlaps with the second orthographic projection constitutes an overlapping area R, the first insulating portion 104 is only located between the first connecting portion 1032 of the second conductive portion 103 and the first conductive portion 102, and the overlapping area R falls within the orthographic projection of the first insulating portion 104 on the substrate 101.

[0099] Reference below Figures 6 to 9 , each step of method 500 is described in more detail using a specific example.

[0100] First, a substrate 101 is provided. The substrate 101 may be any appropriate substrate such as a plastic substrate, a silicon substrate, a ceramic substrate, a glass substrate, a quartz substrate, etc. The embodiment of the present disclosure does not limit the material of the substrate 101.

[0101] Then, a first conductive layer is applied on the substrate 101, and the first conductive layer is patterned by a first mask process to form a first conductive portion 102. The first conductive layer can be made on the substrate 101 by a magnetron sputtering method or an electroplating method. The first conductive portion 102 spans the light-emitting area E and the fan-out area F, and the first conductive portion 102 extends along the first direction D1 in the light-emitting area E. The portion of the first conductive portion 102 in the fan-out area F includes a second opening 112 at a position corresponding to the light-emitting element 106. The first conductive portion 102 can be, for example, a driving voltage signal line VLEDL. When the first conductive portion 102 is formed by a magnetron sputtering method, since the thickness of a single magnetron sputtering generally does not exceed 1 μm, when making a conductive layer exceeding 1 μm, multiple sputterings are usually required to form it. In one example, the formation process of the first conductive part 102 can be described as follows: first, a MoNb layer with a thickness of about 300Å is formed on the substrate 101, and the MoNb layer is used to improve the adhesion between the film layer and the substrate 101; then, a Cu layer with a thickness of about 3.6μm is formed on the MoNb layer to transmit various electrical signals; finally, a MoNb layer with a thickness of about 300Å is formed on the Cu layer to protect the middle Cu layer and prevent the surface of the middle Cu layer with low resistivity from being exposed and oxidized. In an alternative example, the formation process of the first conductive part 102 can be described as follows: first, a molybdenum-titanium-nickel (MTD) layer with a thickness of about 300Å is formed on the substrate 101; then, a Cu layer with a thickness of about 3.6μm is formed on the molybdenum-titanium-nickel layer to transmit various electrical signals; finally, a molybdenum-titanium-nickel layer or an alloy such as CuNi with a thickness of about 300Å is formed on the Cu layer to protect the middle Cu layer and prevent the surface of the middle Cu layer with low resistivity from being exposed and oxidized. In other embodiments, when the first conductive portion 102 is formed on the substrate 101 by electroplating, a seed layer may be formed by using MoNiTi to increase the nucleation density of metal grains in the subsequent electroplating process, and then a Cu layer with low resistivity is formed by electroplating, and then an anti-oxidation layer is formed, and the material may be MoNiTi. When the first conductive portion 102 is formed by using the first mask process, other signal lines such as a common voltage signal line GNDL, an addressing signal line ADDRL, a power signal line VccL, a data drive signal line DataL, and a feedback signal line FBL may also be formed at the same time.

[0102] Next, a second insulating material layer is applied on the side of the first conductive part 102 away from the substrate 101 by magnetron sputtering, and a first insulating material layer is coated on the side of the second insulating material layer away from the substrate 101, and the first insulating material layer and the second insulating material layer are patterned by a second mask process to form a first insulating part 104 and a second insulating layer 108. The first insulating part 104 and the second insulating layer 108 have the same shape, and the thickness of the portion of the first insulating part 104 located in the overlapping region R can be, for example, about 2.5 μm, and the thickness of the second insulating layer 108 can be, for example, about 2400 Å. The first insulating part 104 is only located between the first conductive part 102 and the first connecting part 1032 of the second conductive part 103 formed subsequently. The first insulating portion 104 and the second insulating layer 108 have appropriate thicknesses. On the one hand, they can be used to wrap particles between the first conductive portion 102 and the second conductive portion 103 to prevent the particles from piercing and causing a short circuit between the first conductive portion 102 and the second conductive portion 103; on the other hand, they can provide an appropriate spacing distance between the first conductive portion 102 and the second conductive portion 103 to prevent a very obvious mutual capacitance from being generated between the first conductive portion 102 and the second conductive portion 103. The material of the first insulating portion 104 can be an organic material, such as a negative photoresist. The material of the second insulating layer 108 can be an inorganic material, such as SiN.

[0103] Then, a second conductive layer is formed on the side of the second insulating layer 108 away from the substrate 101 by a magnetron sputtering method or an electroplating method, and the second conductive layer is patterned by a third mask process to form a second conductive part 103. The second conductive part 103 includes a main body 1031, a first connecting part 1032 and a second connecting part 1033 connected to the main body 1031. The main body 1031 of the second conductive part 103 is configured to be electrically connected to the light-emitting element 106, and the second connecting part 1033 of the second conductive part 103 is configured to be electrically connected to the first conductive part 102. The main body 1031 is located on both sides of the first connecting part 1032 and is respectively connected to both ends of the first connecting part 1032. Therefore, the light-emitting elements 106 on the main body 1031 on both sides can be connected in series through the first connecting part 1032. The signal of the first conductive part 102 can be transmitted to a plurality of light-emitting elements 106 connected in series through the second conductive part 103. The second conductive part 103 presents a similar "U-shaped" structure. The first connection portion 1032 of the second conductive portion 103 includes at least two sub-first connection portions 1032A and 1032B extending along the second direction D2 and spaced apart from each other, and the spacing between the at least two sub-first connection portions 1032A and 1032B is greater than 300 μm. A first insulating portion 104 is provided between the first connection portion 1032 of the second conductive portion 103 and the first conductive portion 102 to electrically insulate the first connection portion 1032 of the second conductive portion 103 from the first conductive portion 102. When the second conductive portion 103 is formed by a magnetron sputtering method, since the thickness of a single magnetron sputtering generally does not exceed 1 μm, multiple sputterings are usually required to form the conductive layer when the thickness exceeds 1 μm. In one example, the formation process of the second conductive part 103 can be described as follows: first, a MoNb layer with a thickness of about 300Å is formed on the second insulating layer 108, and the MoNb layer is used to improve the adhesion between the film layer and the second insulating layer 108; then, a Cu1 layer with a thickness of about 0.6μm is formed on the MoNb layer; finally, a Cu2 layer with a thickness of about 500Å is formed on the Cu1 layer to protect the middle Cu1 layer and prevent the surface of the middle Cu1 layer with low resistivity from being exposed and oxidized. In another example, the formation process of the second conductive part 103 can be described as follows: first, a molybdenum-titanium-nickel (MTD) layer with a thickness of about 300Å is formed on the second insulating layer 108; then, a Cu layer with a thickness of about 0.6μm is formed on the molybdenum-titanium-nickel layer; finally, a CuNi alloy layer with a thickness of about 500Å is formed on the Cu layer to protect the middle Cu layer and prevent the surface of the middle Cu layer with low resistivity from being exposed and oxidized. When the second conductive portion 103 is formed by using the third mask process, for example, a first conductive pad and a second conductive pad may be formed simultaneously. The first conductive pad is used to mount the light emitting element 106 , and the second conductive pad is used to mount the driving circuit.

[0104] Then, a third insulating material layer is applied on the side of the second conductive portion 103 away from the substrate 101, and a fourth insulating material layer is applied on the side of the third insulating material layer away from the substrate 101, and the third insulating material layer and the fourth insulating material layer are patterned by a fourth mask process to form a third insulating layer 109 and a fourth insulating layer 110. The third insulating layer 109 includes a third via 1091, and the fourth insulating layer 110 includes a fourth via 1101. The thickness of the third insulating layer 109 can be, for example, about 3500Å, and the thickness of the fourth insulating layer 110 can be, for example, about 3.0μm. The material of the third insulating layer 109 can be an inorganic material, such as SiN. The material of the fourth insulating layer 110 can be an organic material, such as a negative photoresist.

[0105] Next, after the third insulating layer 109 and the fourth insulating layer 110 are prepared, or after the second conductive part 103 is prepared and before the third insulating layer 109 and the fourth insulating layer 110 are prepared, an all-in-one device AIO (All-in-One) is used to check whether there are particles on the surface of the light-emitting substrate. If it is found that there are particles between one of the first sub-connection part 1032A and the second sub-connection part 1032B of the second conductive part 103 and the first conductive part 102, a laser repair device can be used to cut and interrupt the two ends of the sub-connection part, so that the middle part of the sub-connection part is disconnected from the two end parts of the sub-connection part at the incision 107, so that the sub-connection part will not be short-circuited with the first conductive part 102 due to the piercing of the particles. There are no particles under the other of the first sub-connection part 1032A and the second sub-connection part 1032B, and normal electrical connection can still be achieved, so that the adjacent light-emitting elements 106 can be normally connected in series, thereby emitting light normally.

[0106] Then, a cover layer 105 is formed by screen printing on a side of the fourth insulating layer 110 away from the substrate 101. The cover layer 105 at least covers the light-emitting area E and the fan-out area F, and includes a plurality of first openings 1051 in the light-emitting area E and the fan-out area F. The position of each first opening 1051 corresponds to the position of each light-emitting element 106, so as to allow the light-emitting element 106 to be connected to the main part 1031 of the second conductive part 103 via the first opening 1051. In the light-emitting area E, the orthographic projection of the first opening 1051 of the cover layer 105 on the substrate 101 does not overlap with the orthographic projection of the second connecting part 1033 of the second conductive part 103 on the substrate 101, and the orthographic projection of the first opening 1051 of the cover layer 105 on the substrate 101 does not overlap with the orthographic projection of the first insulating part 104 on the substrate 101. In the fan-out region F, the position of each first opening 1051 corresponds to the position of each second opening 112 of the first conductive portion 102 , and the orthographic projection of the first opening 1051 of the cover layer 105 on the substrate 101 falls within the orthographic projection of the second opening 112 of the first conductive portion 102 on the substrate 101 .

[0107] Finally, the light emitting element 106 is installed on the side of the cover layer 105 away from the substrate 101 , and the light emitting element 106 is electrically connected to the main portion 1031 of the second conductive part 103 through the first opening 1051 of the cover layer 105 , the fourth via 1101 of the fourth insulating layer 110 , and the third via 1091 of the third insulating layer 109 .

[0108] It can be seen from the above description that in the method 500 provided in the embodiment of the present disclosure, the light-emitting substrate can be prepared by four mask processes, that is, using four mask plates. Compared with the related art that requires at least seven mask plates to complete the preparation, the method 500 provided in the embodiment of the present disclosure omits three rounds of mask processes and saves three mask plates, thereby significantly improving production efficiency and reducing production costs. Other technical effects achieved by the method 500 provided in the embodiment of the present disclosure can refer to the technical effects of the light-emitting substrate described in the previous embodiments. Therefore, for the purpose of brevity, they will not be repeated here.

[0109] In some embodiments, after forming the first insulating portion 104 and the second insulating layer 108 and before forming the second conductive portion 103, the method may further include: applying a fifth insulating material layer on the side of the second insulating layer 108 away from the substrate 101 to cover the first insulating portion 104 and the second insulating layer 108, and patterning the fifth insulating material layer through a fifth mask process to form a fifth insulating layer, the fifth insulating layer being on the second insulating layer 108 and the first insulating portion 104. The thickness of the fifth insulating layer may be, for example, about 1500Å. By providing the fifth insulating layer, the first insulating portion 104 may be better protected to prevent potential water vapor from entering the first insulating portion 104. The material of the fifth insulating layer may be an inorganic material, such as SiN.

[0110] It will be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and / or parts in this article, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish an element, component, region, layer or part from another region, layer or part. Therefore, the first element, component, region, layer or part discussed above may be referred to as a second element, component, region, layer or part without departing from the teaching of the present disclosure.

[0111] Spatial relative terms such as "row", "column", "under", "above", "left", "right", etc. may be used herein to describe the relationship between one element or feature and another element or feature as illustrated in the figure for ease of description. It will be understood that these spatial relative terms are intended to cover different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure is flipped, the element described as "under other elements or features" will be oriented as "above other elements or features". Therefore, the exemplary term "under" can cover both the orientations above and below. The device can be oriented in other ways (rotated 90 degrees or in other orientations) and the spatial relative descriptors used in this article are interpreted accordingly. In addition, it will also be understood that when a layer is referred to as "between two layers", it can be the only layer between the two layers, or one or more intermediate layers can also be present.

[0112] The terms used herein are only for the purpose of describing a specific embodiment and are not intended to limit the present disclosure. As used herein, the singular forms "one", "one" and "the" are intended to also include plural forms, unless the context clearly indicates otherwise. It will be further understood that the terms "include" and / or "comprise" specify the presence of the features, wholes, steps, operations, elements and / or parts when used in this specification, but do not exclude the presence of one or more other features, wholes, steps, operations, elements, parts and / or their groups or add one or more other features, wholes, steps, operations, elements, parts and / or their groups. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. In the description of this specification, the description of the reference terms "one embodiment", "another embodiment" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment are included in at least one embodiment of the present disclosure. In this specification, the schematic representation of the above terms does not necessarily have to be directed to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. Furthermore, those skilled in the art may combine and associate different embodiments or examples and features of different embodiments or examples described in this specification without mutual contradiction.

[0113] It will be understood that when an element or layer is referred to as being "on another element or layer," "connected to another element or layer," "coupled to another element or layer," or "adjacent to another element or layer," it may be directly on another element or layer, directly connected to another element or layer, directly coupled to another element or layer, or directly adjacent to another element or layer, or there may be intermediate elements or layers. Conversely, when an element is referred to as being "directly on another element or layer," "directly connected to another element or layer," "directly coupled to another element or layer," or "directly adjacent to another element or layer," there are no intermediate elements or layers. However, in no case should "on..." or "directly on..." be interpreted as requiring that one layer completely cover the layer below.

[0114] Embodiments of the present disclosure are described herein with reference to schematic illustrations of idealized embodiments of the present disclosure (as well as intermediate structures). As such, variations in the illustrated shapes, for example as a result of manufacturing techniques and / or tolerances, should be expected. Therefore, embodiments of the present disclosure should not be construed as limited to the specific shapes of the regions illustrated herein, but should include shape deviations, for example due to manufacturing. Therefore, the regions illustrated in the figures are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device and are not intended to limit the scope of the present disclosure.

[0115] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the relevant art and / or the context of this specification, and will not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0116] The above is only a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A light-emitting substrate, comprising: a substrate including a light emitting region; A first conductive portion, located on the substrate and arranged at least in the light-emitting area, wherein the first conductive portion extends along a first direction in the light-emitting area; A second conductive portion, located at a side of the first conductive portion away from the substrate and arranged in the light-emitting area, the second conductive portion comprising a first connecting portion; A first insulating portion, located in the light emitting area; as well as a covering layer, located on a side of the second conductive portion away from the substrate, The first connecting portion of the second conductive portion extends along a second direction intersecting the first direction, a first orthographic projection of the first connecting portion of the second conductive portion on the substrate at least partially overlaps with a second orthographic projection of the first conductive portion on the substrate, and an overlapping region between the first orthographic projection and the second orthographic projection constitutes an overlapping region. wherein the first insulating portion is located only between the first connecting portion of the second conductive portion and the first conductive portion, and the overlapping region falls within the orthographic projection of the first insulating portion on the substrate, and The covering layer includes a plurality of first openings, and the orthographic projections of the plurality of first openings of the covering layer on the substrate do not overlap with the orthographic projections of the first insulating portion on the substrate.

2. The light-emitting substrate according to claim 1, in, The orthographic projections of the parts of the two sides of the first conductive portion extending along the first direction and located in the overlapping area on the substrate respectively fall within the orthographic projections of the first insulating portion on the substrate, and The orthographic projections of the two side edges of the first connecting portion of the second conductive portion extending along the second direction and located in the overlapping region on the substrate respectively fall within the orthographic projections of the first insulating portion on the substrate.

3. The light-emitting substrate according to claim 1, wherein: A ratio of an area of ​​an orthographic projection of the first insulating portion on the substrate to an area of ​​the substrate is approximately 10%.

4. The light-emitting substrate according to claim 1, wherein: An area of ​​an orthographic projection of the first insulating portion on the substrate is smaller than an area of ​​an orthographic projection of the second conductive portion on the substrate.

5. The light emitting substrate according to claim 1, wherein: The first connection portion of the second conductive portion includes at least two sub-first connection portions extending along the second direction and spaced apart from each other, and an orthographic projection of the at least two sub-first connection portions on the substrate at least partially overlaps an orthographic projection of the same first insulating portion on the substrate.

6. The light emitting substrate according to claim 5, wherein: The interval between two adjacent sub-first connecting portions of the at least two sub-first connecting portions is greater than 300 μm.

7. The light-emitting substrate according to claim 5, wherein: The first connection portion of the second conductive portion also includes a first confluence portion and a second confluence portion, the first confluence portion and the second confluence portion are respectively located on both sides of the first conductive portion, the two ends of the at least two sub-first connection portions respectively converge at the first confluence portion and the second confluence portion, and the orthographic projections of the first confluence portion and the second confluence portion on the substrate do not overlap with the orthographic projection of the overlapping area on the substrate.

8. The light emitting substrate according to claim 5, wherein: One of the at least two sub-first connection parts includes two cutouts, the two cutouts are respectively located on both sides of the first conductive part, and the middle part of the sub-first connection part is disconnected from the two end parts of the sub-first connection part at the two cutouts.

9. The light emitting substrate according to claim 5, wherein: The same first insulating portion includes at least two sub-insulating portions extending along the second direction and spaced apart from each other, the number of the sub-insulating portions is equal to the number of the sub-first connecting portions, and the orthographic projection of each of the sub-first connecting portions on the substrate at least partially overlaps with the orthographic projection of a corresponding one of the sub-insulating portions on the substrate.

10. The light-emitting substrate according to claim 1, in, The second conductive part further includes a second connecting part, the second connecting part of the second conductive part is electrically connected to the first conductive part, and The orthographic projections of the plurality of first openings of the covering layer on the substrate do not overlap with the orthographic projections of the second connecting portions of the second conductive portions on the substrate.

11. The light emitting substrate according to claim 10, further comprising a second insulating layer, wherein: The second insulating layer is located between the first conductive portion and the second conductive portion, and the first insulating portion is located on a side of the second insulating layer away from the substrate.

12. The light emitting substrate according to claim 11, wherein: The second connection portion of the second conductive portion is connected to the first conductive portion via a second via hole in the second insulating layer.

13. The light emitting substrate according to claim 11, wherein: The second insulating layer is located only at the overlapping region.

14. The light emitting substrate according to claim 1, wherein: The second conductive portion further includes a plurality of conductive pads, and an orthographic projection of each of the plurality of first openings of the cover layer on the substrate covers an orthographic projection of at least one of the plurality of conductive pads on the substrate.

15. The light emitting substrate according to claim 14, further comprising: a third insulating layer, located between the second conductive portion and the cover layer and comprising a plurality of third via holes; as well as a fourth insulating layer, located between the third insulating layer and the cover layer and comprising a plurality of fourth via holes, Each of the plurality of third via holes and a corresponding one of the plurality of fourth via holes penetrate each other, and the plurality of third via holes and the plurality of fourth via holes expose the plurality of conductive pads.

16. The light emitting substrate according to claim 11, further comprising a fifth insulating layer located between the second conductive portion and the second insulating layer, wherein: The fifth insulating layer covers the first insulating portion and the second insulating layer.

17. The light-emitting substrate according to any one of claims 1 to 16, wherein: The material of the first insulating portion is an organic material.

18. The light-emitting substrate according to any one of claims 1 to 16, wherein: A portion of the first insulating portion located in the overlapping region has a thickness of about 2.5 μm in a direction perpendicular to the substrate.

19. The light-emitting substrate according to any one of claims 10 to 13, wherein: The second conductive part also includes a main body part, which is located on both sides of the first connecting part, the first end of the main body part located on one side of the first connecting part is connected to the first end of the first connecting part, the second end of the main body part located on one side of the first connecting part is connected to the second connecting part, and the first end of the main body part located on the other side of the first connecting part is connected to the second end of the first connecting part.

20. The light-emitting substrate according to any one of claims 1 to 16, further comprising a plurality of light-emitting elements, wherein: Each of the plurality of light emitting elements is a sub-millimeter light emitting diode or a micro light emitting diode.

21. The light-emitting substrate according to any one of claims 1 to 16, wherein: There is a voltage difference between the first conductive portion and the second conductive portion.

22. A display device comprising the light-emitting substrate according to any one of claims 1 to 21.

23. A method for manufacturing a light-emitting substrate, comprising: providing a substrate, the substrate comprising a light emitting region; forming a first conductive portion on the substrate, wherein the first conductive portion is at least arranged in the light-emitting area and extends along a first direction in the light-emitting area; forming a first insulating portion on a side of the first conductive portion away from the substrate, wherein the first insulating portion is located in the light emitting area; A second conductive portion is formed on a side of the first insulating portion away from the substrate, the second conductive portion is arranged in the light-emitting area and includes a first connecting portion, the first connecting portion of the second conductive portion extends along a second direction intersecting the first direction, a first orthographic projection of the first connecting portion of the second conductive portion on the substrate at least partially overlaps with a second orthographic projection of the first conductive portion on the substrate, an area where the first orthographic projection overlaps with the second orthographic projection constitutes an overlapping area, the first insulating portion is located only between the first connecting portion of the second conductive portion and the first conductive portion, and the overlapping area falls within the orthographic projection of the first insulating portion on the substrate; as well as A covering layer is formed on a side of the second conductive portion away from the substrate, the covering layer comprising a plurality of first openings, and an orthographic projection of the plurality of first openings of the covering layer on the substrate does not overlap with an orthographic projection of the first insulating portion on the substrate.

24. The method according to claim 23, wherein: The steps of forming the first conductive portion, the first insulating portion and the second conductive portion include: Applying a first conductive layer on the substrate, and patterning the first conductive layer through a first mask process to form the first conductive portion; Applying a second insulating material layer on a side of the first conductive portion away from the substrate and applying a first insulating material layer on a side of the second insulating material layer away from the substrate, and patterning the first insulating material layer and the second insulating material layer by a second mask process to form the first insulating portion and the second insulating layer; Applying a second conductive layer on the first insulating portion and the second insulating layer on a side away from the substrate, and patterning the second conductive layer through a third mask process to form the second conductive portion; A third insulating material layer is applied on a side of the second conductive portion away from the substrate, and a fourth insulating material layer is applied on a side of the third insulating material layer away from the substrate, and the third insulating material layer and the fourth insulating material layer are patterned through a fourth mask process to form a third insulating layer and a fourth insulating layer.

25. The method according to claim 24, after forming the first insulating portion and the second insulating layer and before forming the second conductive portion, further comprising: A fifth insulating material layer is applied on a side of the second insulating layer away from the substrate to cover the first insulating portion and the second insulating layer, and the fifth insulating material layer is patterned by a fifth mask process to form a fifth insulating layer.

26. The method according to claim 24 or 25, wherein: The step of forming the second conductive portion further includes: The second conductive layer is patterned by the third mask process so that the first connection portion of the second conductive portion includes at least two sub-first connection portions extending along the second direction and spaced apart from each other, and in response to detecting that one of the at least two sub-first connection portions is faulty, the two sides of the faulty sub-first connection portion are cut by a laser so that the middle portion of the sub-first connection portion is disconnected from the two end portions.

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