A solder strip polishing apparatus and a solder strip polishing method

Abstract

The application discloses a solder strip polishing device and a solder strip polishing method, and relates to the field of solder manufacturing.The device comprises a rack, a feeding wheel, a polishing device, a tensioning device and a collecting wheel are arranged in the rack, the polishing device is arranged between the feeding wheel and the collecting wheel, the tensioning device is arranged between the polishing device and the feeding wheel and / or between the polishing device and the collecting wheel, the tensioning device can pressurize the solder strip and make the solder strip in a tensioning state, the tensioning device and the polishing device are staggered, the tensioning device can change the direction of the solder strip, and the solder strip is in a broken line structure when being polished.The solder strip polishing device can realize automatic polishing of two sides of the solder strip, the polishing is uniform, and the solder strip will not slip when being polished.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of solder manufacturing, in particular to a solder strip polishing device and a solder strip polishing method. BACKGROUND

[0002] At present, the solder strips on the market are polished by manual polishing wheels. In the process of manual polishing, the surface of the solder strip is easily polished unevenly, and the polishing efficiency is low. In addition, manual polishing is easy to slip and damage the solder strip. SUMMARY

[0003] The present application aims at the above-mentioned problems, and provides a solder strip polishing device and a solder strip polishing method, which can realize automatic polishing of both sides of the solder strip, and the solder strip will not slip during polishing.

[0004] The technical scheme adopted by the present application is as follows:

[0005] A solder strip polishing device comprises a rack, a feeding wheel, a polishing device, a tensioning device and a collecting wheel arranged in the rack, and the polishing device is arranged between the feeding wheel and the collecting wheel. A tensioning device is arranged between the polishing device and the feeding wheel and / or between the polishing device and the collecting wheel. The tensioning device can pressurize the solder strip and make the solder strip in a tensioning state. The tensioning device and the polishing device are staggered. The tensioning device can change the direction of the solder strip, so that the solder strip has a zigzag structure during polishing.

[0006] Due to the above-mentioned technical scheme, the feeding wheel and the collecting wheel cooperate to realize automatic polishing of the solder strip. The zigzag structure can ensure that the solder strip will not slip during polishing. After polishing one side, the solder strip is collected from the feeding wheel to the collecting wheel. The positions of the feeding wheel and the collecting wheel are exchanged, so that the original feeding wheel serves as a new collecting wheel, and the original collecting wheel serves as a new feeding wheel. The other side of the solder strip is polished, and the polishing efficiency is high.

[0007] Further, the polishing device comprises a polishing wheel and a pressing wheel. The pressing wheel can move relative to the polishing wheel. The pressing wheel can act on the solder strip and press the solder strip against the polishing wheel.

[0008] Due to the above-mentioned technical scheme, the polishing device can be suitable for solder strips of different thicknesses. At the same time, the pressing wheel also limits the solder strip, ensuring uniform polishing of the solder strip.

[0009] Further, two or more polishing devices are arranged between the feeding wheel and the collecting wheel. The polishing wheel close to the feeding wheel can perform rough polishing of the solder strip, and the polishing wheel close to the collecting wheel can perform fine polishing of the solder strip.

[0010] Due to the above-mentioned technical scheme, the solder strip is first rough polished and then fine polished, ensuring the polishing quality.

[0011] Furthermore, a tensioning device is provided between two adjacent polishing devices.

[0012] By adopting the above technical solution and setting a tensioning device, multiple polishing devices can be separated, avoiding interference between adjacent polishing devices.

[0013] Furthermore, the tensioning device is located on the side that matches the pressure wheel, and the tensioning device and the pressure wheel together restrict the welding strip so that the welding strip has a zigzag structure during polishing.

[0014] Because of the above technical solution, the welding strip is only restricted by the tensioning device and the pressure roller during its movement, and the tension force will not be transmitted to the polishing wheel, ensuring that the polishing wheel can work normally.

[0015] Furthermore, it also includes feed strips, with pairs of feed strips respectively located at the beginning and end of the solder strip.

[0016] Thanks to the above technical solution, the starting and ending ends of the welding strip can be automatically polished by pulling the welding strip with the feed tape.

[0017] Accordingly, the present invention also discloses a method for polishing solder strips, comprising the following steps:

[0018] Preparation steps: Start the polishing wheel and attach the feed tape to the beginning and end of the welding strip;

[0019] Traction steps: Wrap the welding strip together with the feed strip on the feeding wheel, pull the feed strip at the beginning of the welding strip to form a zigzag structure around the polishing device and tensioning device, and finally wrap it around the take-up wheel. Rotate the take-up wheel to bring the beginning of the welding strip to the front of the polishing device.

[0020] Tensioning steps: Adjust the feeding roller and the receiving roller to flatten the welding strip and move the welding strip towards the receiving roller;

[0021] Polishing steps: The pressure roller in the polishing device presses down, so that the welding strip comes into contact with the polishing wheel in the polishing device. The speed of the polishing wheel is adjusted to the specified value to polish the welding strip.

[0022] Re-polishing steps: After the welding strip is collected to the receiving wheel, the receiving wheel and the feeding wheel are swapped so that the original receiving wheel becomes the new feeding wheel and the original feeding wheel becomes the new receiving wheel. The welding strip is then flipped over, and the above steps are repeated to complete the double-sided polishing of the welding strip.

[0023] Thanks to the above technical solution, automatic polishing of both sides of the solder strip can be achieved, and the zigzag structure can ensure that the solder strip will not slip during polishing.

[0024] Further, in the traction step, the number of polishing devices is two or more; in the polishing step, the solder strip is subjected to rough polishing by the polishing device close to the feeding wheel, and the solder strip is subjected to fine polishing by the polishing device close to the collecting wheel.

[0025] Due to the above technical scheme, the solder strip is subjected to rough polishing and then fine polishing, so as to ensure the polishing quality.

[0026] Further, in the traction step, a tensioning device is arranged between the adjacent two polishing devices, so as to form a zigzag structure between the adjacent two polishing devices.

[0027] Due to the above technical scheme, the multiple polishing devices can be separated by the tensioning device, so as to avoid the interference between the adjacent two polishing devices.

[0028] Further, in the polishing step, the rotating speed of the polishing wheel is 1700 r / min-2300 r / min.

[0029] In summary, due to the above technical scheme, the present application has the following advantages:

[0030] 1. The feeding wheel and the collecting wheel are matched, so as to realize the automatic polishing of the solder strip.

[0031] 2. The zigzag structure can ensure that the solder strip does not slip during polishing.

[0032] 3. The present application can realize the automatic polishing of the double sides of the solder strip, and the polishing efficiency is high.

[0033] 4. The solder strip is tractioned by the feeding strip, so that the beginning end and the ending end of the solder strip can also be polished automatically.

[0034] 5. The multiple polishing devices can be separated, so as to avoid the interference between the adjacent two polishing devices. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 is a structural schematic view of the solder strip polishing device of the present application.

[0036] In the figure, 1 is a feeding wheel, 2 is a polishing device, 3 is a tensioning device, 4 is a collecting wheel, 201 is a polishing wheel, and 202 is a pressing wheel. DETAILED DESCRIPTION

[0037] The present application will be described in detail below with reference to the accompanying drawings.

[0038] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application, and are not used to limit the present application.

[0039] Example 1

[0040] A solder strip polishing device, such as Figure 1 As shown, the machine includes a frame, within which are a feeding roller 1, a polishing device 2, a tensioning device 3, and a receiving roller 4. The polishing device 2 is located between the feeding roller 1 and the receiving roller 4. A tensioning device 3 is provided between the polishing device 2 and the feeding roller 1, and / or between the polishing device 2 and the receiving roller 4. The tensioning device 3 applies pressure to the welding strip and keeps it under tension. The tensioning device 3 and the polishing device 2 are staggered, and the tensioning device 3 can change the direction of the welding strip, making it form a zigzag structure during polishing. Specifically, the feeding roller 1 and the receiving roller 4 work together to achieve automatic polishing of the welding strip. The zigzag structure ensures that the welding strip will not slip during polishing. After polishing one side, the welding strip is collected from the feeding roller 1 onto the receiving roller 4. By switching the positions of the feeding roller 1 and the receiving roller 4, the original feeding roller 1 becomes the new receiving roller 4, and the original receiving roller 4 becomes the new feeding roller 1, to polish the other side of the welding strip, resulting in high polishing efficiency.

[0041] The polishing device 2 includes a polishing wheel 201 and a pressure wheel 202. The pressure wheel 202 is movable relative to the polishing wheel 201 and acts on the welding strip, pressing the welding strip against the polishing wheel 201. Specifically, this makes the polishing device 2 suitable for welding strips of different thicknesses. At the same time, the pressure wheel 202 also restricts the welding strip, ensuring uniform polishing of the welding strip.

[0042] The two polishing devices 2 are arranged between the feeding wheel 1 and the receiving wheel 4. The polishing wheel 201 closer to the feeding wheel 1 can perform rough polishing on the welding strip, and the polishing wheel 201 closer to the receiving wheel 4 can perform fine polishing on the welding strip. Specifically, the welding strip is first rough polished and then fine polished to ensure polishing quality.

[0043] A tensioning device 3 is provided between the two polishing devices 2. Specifically, by providing the tensioning device 3, the two polishing devices 2 can be separated, thus avoiding interference between adjacent polishing devices 2.

[0044] The tensioning device 3 is located on the side that matches the pressure roller 202. The tensioning device 3 and the pressure roller 202 together restrict the welding strip, so that the welding strip has a zigzag structure during polishing. Specifically, during the movement of the welding strip, it is only restricted by the tensioning device 3 and the pressure roller 202, and the tension force will not be transmitted to the polishing wheel 201, ensuring that the polishing wheel 201 can work normally.

[0045] It also includes guide strips, with pairs of guide strips respectively located at the beginning and end of the solder strip. Specifically, the guide strips pull the solder strip, enabling automatic polishing at both the beginning and end of the solder strip.

[0046] Example 2

[0047] A method for polishing solder strips, such as Figure 1 As shown, it includes the following steps:

[0048] Preparation steps: Attach feed tape to the beginning and end of the solder strip;

[0049] Traction steps: Wrap the welding strip together with the feed belt on the feeding wheel 1, pull the feed belt at the beginning of the welding strip to form a zigzag structure around the polishing device 2 and the tensioning device 3, and finally wrap it around the take-up wheel 4. Rotate the take-up wheel 4 to bring the beginning of the welding strip to the front of the polishing device 2.

[0050] Tensioning steps: Adjust the feeding roller 1 and the receiving roller 4 to flatten the welding strip and move the welding strip toward the receiving roller 4;

[0051] Polishing steps: The pressure roller 202 in the polishing device 2 presses down, so that the welding strip comes into contact with the polishing wheel 201 in the polishing device 2. The speed of the polishing wheel 201 is adjusted to the specified value to polish the welding strip.

[0052] Re-polishing steps: After the welding strip is collected to the receiving wheel 4, the receiving wheel 4 and the feeding wheel 1 are swapped so that the original receiving wheel 4 becomes the new feeding wheel 1 and the original feeding wheel 1 becomes the new receiving wheel 4. The welding strip is then flipped over, and the above steps are repeated to complete the double-sided polishing of the welding strip.

[0053] Specifically, it can automatically polish both sides of the solder strip, and the zigzag structure can ensure that the solder strip will not slip during polishing.

[0054] In the traction step, there are two polishing devices 2; in the polishing step, the welding strip is rough polished by the polishing device 2 near the feeding wheel 1, and the welding strip is fine polished by the polishing device 2 near the receiving wheel 4.

[0055] During the traction step, a tensioning device 3 is provided between two adjacent polishing devices 2, forming a zigzag structure between them. Specifically, by setting the tensioning device 3, the two polishing devices 2 can be separated, avoiding interference between adjacent polishing devices 2.

[0056] The polishing wheel 201 rotates at a speed of 2000 r / min during the polishing step.

[0057] This article uses specific embodiments to illustrate the principles and implementation methods of the present invention. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of the present invention. It should be noted that those skilled in the art can make several improvements and modifications to the present invention without departing from the principles of the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

[0058] In the description of the application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the product of the application is used, and are only for the convenience of describing the application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the application.

[0059] In the description of the application, it should also be noted that, unless otherwise expressly specified and limited, the terms "arrangement", "installation", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.

Claims

1. A method for polishing solder strips, applied to a solder strip polishing apparatus, the solder strip polishing apparatus comprising a frame, characterized in that, The frame is equipped with a feeding wheel (1), a polishing device (2), a tensioning device (3), and a receiving wheel (4). The polishing device (2) is located between the feeding wheel (1) and the receiving wheel (4). A tensioning device (3) is provided between the polishing device (2) and the feeding wheel (1) and / or between the polishing device (2) and the receiving wheel (4). The tensioning device (3) can apply pressure to the welding strip and keep the welding strip in a tensioned state. The tensioning device (3) and the polishing device (2) are arranged alternately. The tensioning device (3) can change the direction of the welding strip so that the welding strip has a zigzag structure during polishing. The device (2) includes a polishing wheel (201) and a pressure wheel (202). The pressure wheel (202) is movable relative to the polishing wheel (201). The pressure wheel (202) acts on the welding strip and presses the welding strip against the polishing wheel (201). Two or more of the polishing devices (2) are arranged between the feeding wheel (1) and the receiving wheel (4). The polishing wheel (201) closer to the feeding wheel (1) can perform rough polishing on the welding strip, and the polishing wheel (201) closer to the receiving wheel (4) can perform fine polishing on the welding strip. The pressure wheel (202) is located above the polishing wheel (201). The solder strip polishing method includes the following steps: Preparation steps: Start the polishing wheel (201) and attach the feed tape to the beginning and end of the welding strip; Traction steps: Wrap the welding strip together with the feed belt on the feeding wheel (1), pull the feed belt at the beginning of the welding strip to form a zigzag structure around the polishing device (2) and the tensioning device (3), and finally wrap it around the take-up wheel (4). Rotate the take-up wheel (4) to bring the beginning of the welding strip to the front of the polishing device (2). Tensioning steps: Adjust the feeding wheel (1) and the receiving wheel (4) to flatten the welding strip and move the welding strip towards the receiving wheel (4); Polishing steps: The pressure roller (202) in the polishing device (2) presses down, so that the welding strip comes into contact with the polishing wheel (201) in the polishing device (2). The speed of the polishing wheel (201) is adjusted to the specified value to polish the welding strip. Re-polishing steps: After the welding strip is collected to the receiving wheel (4), the receiving wheel (4) and the feeding wheel (1) are swapped so that the original receiving wheel (4) becomes the new feeding wheel (1) and the original feeding wheel (1) becomes the new receiving wheel (4). The welding strip is flipped over, and the relative positions of the pressure wheel (202) and the polishing wheel (201) are adjusted so that the polishing wheel (201) close to the new feeding wheel (1) can perform rough polishing on the welding strip, and the polishing wheel (201) close to the new receiving wheel (4) can perform fine polishing on the welding strip. The above steps are repeated to complete the double-sided polishing of the welding strip.

2. The solder strip polishing method as described in claim 1, characterized in that, A tensioning device (3) is provided between two adjacent polishing devices (2).

3. The solder strip polishing method as described in claim 2, characterized in that, The tensioning device (3) is located on the side that matches the pressure roller (202). The tensioning device (3) and the pressure roller (202) together restrict the welding strip, so that the welding strip has a zigzag structure during polishing.

4. The solder strip polishing method as described in claim 1, characterized in that, It also includes feed strips, with pairs of feed strips respectively located at the beginning and end of the welding strip.

5. The solder strip polishing method as described in claim 1, characterized in that, In the traction step, there are two or more polishing devices (2); in the polishing step, the welding strip is rough polished by the polishing device (2) near the feeding wheel (1), and the welding strip is fine polished by the polishing device (2) near the receiving wheel (4).

6. The solder strip polishing method as described in claim 5, characterized in that, During the traction step, a tensioning device (3) is provided between two adjacent polishing devices (2) to form a zigzag structure between the two adjacent polishing devices (2).

7. The solder strip polishing method as described in claim 1, characterized in that, The polishing wheel (201) rotates at a speed of 1700 r / min to 2300 r / min during the polishing step.

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