A special negative-pressure voltage regulator for semiconductor systems

Abstract

This application relates to the field of pressure reducer technology, and particularly to a negative pressure regulating device dedicated for semiconductor systems; it includes a parent body, a first connecting pipe, a second connecting pipe, a cutoff component, a force application component, a transmission component, and a negative pressure recovery component; the cutoff component is used to close or open the gas passage; the transmission component is connected to the cutoff component and is used to transmit the force of the force application component to the cutoff component; the force application component is used to drive the cutoff component to move; the negative pressure recovery component is connected to the cutoff component, and when in a vacuum state, the negative pressure recovery component is used to drive the cutoff component to move; when the air pressures of the first connecting pipe and the second connecting pipe are the same, the negative pressure recovery component moves, and the negative pressure recovery component drives the cutoff component to move, closing the gas passage. At this time, the movement in the cyclic negative pressure state gradually extracts all the harmful gases in the semiconductor. In addition, no manual operation is required during the extraction process, improving the efficiency of extracting harmful gases from semiconductor processing equipment.

Description

Technical Field

[0001] This application relates to the field of pressure reducing valve technology, and in particular to a negative pressure regulating device dedicated to semiconductor systems. Background Art

[0002] In semiconductor systems, gas welding or gas cutting is often performed on semiconductors. However, since the air pressure in general gas cylinders is relatively high and semiconductor processing is relatively precise, the pressure used for gas welding or gas cutting is relatively small. In order to output a stable air pressure and improve the quality of semiconductor processing, a pressure reducing valve needs to be installed on the gas welding or gas cutting pipeline; the function of the pressure reducing valve is to reduce the high-pressure gas in the gas cylinder to low-pressure gas and maintain a stable adjustment device for the pressure and flow rate of the output gas.

[0003] In the related art, the steps for the pressure reducing valve to reduce the pressure of the gas are as follows: The gas in the gas cylinder passes through the pipeline and enters the pressure reducing valve. The handwheel set on the pressure reducing valve is adjusted. The downward movement of the handwheel drives the spring inside the pressure reducing valve to move downward. The spring inside the pressure reducing valve drives the valve plate and the valve rod to move. The valve rod moves downward, and the gap between the valve rod and the valve plate is separated to form a gas flow channel. The high-pressure gas in the gas cylinder passes through the gap between the valve rod and the valve plate and enters the low-pressure chamber of the pressure reducing valve. The high-pressure gas in the gas cylinder is reduced to low-pressure gas, and the converted low-pressure gas is transported to the working equipment for semiconductor processing.

[0004] Aiming at the above related art, there are the following technical defects: During semiconductor processing, harmful gases will be generated in the semiconductor processing equipment. Before use, the harmful gases in the semiconductor processing device need to be extracted by a vacuum pumping device. The negative pressure gas enters the pressure reducing valve to extract the harmful gases in the semiconductor processing equipment. At this time, the valve plate and the valve rod are opened, and the harmful gases in the semiconductor processing equipment are extracted. However, after extraction for a period of time, the air pressure at the air inlet and the air outlet is balanced, and the valve plate and the valve rod are closed. The harmful gases in the semiconductor processing equipment cannot be extracted, but at this time, the harmful gases in the semiconductor processing equipment have not been completely extracted, and the handwheel needs to be rotated manually to separate the valve plate and the valve rod, which reduces the efficiency of extracting harmful gases from the semiconductor processing equipment. Summary of the Invention

[0005] In order to improve the extraction efficiency of harmful gases in semiconductor processing equipment, this application provides a negative pressure regulating device dedicated to semiconductor systems.

[0006] The negative pressure regulating device dedicated to semiconductor systems provided by this application adopts the following technical solutions:

[0007] A negative pressure regulating device dedicated to semiconductor systems includes a main body, a first connecting pipe, a second connecting pipe, a cut-off assembly, a force application assembly, a transmission assembly, and a negative pressure recovery assembly;

[0008] The voltage regulator is divided into a step-down state and a vacuum pumping state;

[0009] A gas passage is provided in the main body;

[0010] The first connecting pipe is provided on the main body, the first connecting pipe is communicated with the main body, and an air inlet cavity is formed between the first connecting pipe and the main body. In the step-down state, gas is introduced into the gas passage through the first connecting pipe;

[0011] The second connecting pipe is provided on the main body, the first connecting pipe is communicated with the main body, and an air outlet cavity is formed between the second connecting pipe and the main body. Among them, the air inlet cavity, the gas passage and the air outlet cavity are communicated. In the vacuum pumping state, a pumping device can be connected to the second connecting pipe;

[0012] The cut-off assembly is provided in the gas passage, and the cut-off assembly is used to close or open the gas passage;

[0013] The transmission assembly is provided on the main body, and the transmission assembly is connected to the cut-off assembly for transmitting the force of the force application assembly to the cut-off assembly;

[0014] The force application assembly is provided on the main body for driving the transmission assembly to move;

[0015] The negative pressure recovery assembly is connected to the cut-off assembly. In the vacuum pumping state, the negative pressure recovery assembly is used to drive the cut-off assembly to move.

[0016] By adopting the above technical solution, when it is necessary to reduce the pressure of the gas, the gas cylinder is connected to the first connecting pipe, and the gas in the gas cylinder enters the gas passage through the first connecting pipe. The force application component is adjusted, the force application component moves, the force application component drives the cut-off component to move, the cut-off component opens the gas passage, the gas enters the second connecting pipe through the gas passage, the high-pressure gas passes through the cut-off component, and the high-pressure gas is converted into low-pressure gas. The converted low-pressure gas enters the working equipment through the second connecting pipe; when it is necessary to evacuate harmful gases from the semiconductor processing equipment, the evacuation equipment is connected to the second connecting pipe, the air pressure in the matrix changes, the air pressure drives the transmission component to move, the transmission component drives the negative pressure recovery component to move, the negative pressure recovery component drives the cut-off component to move, the cut-off component opens the gas passage, and the harmful gases in the semiconductor processing equipment enter the evacuation equipment, realizing the extraction of harmful gases in the semiconductor processing equipment. When the air pressures in the first connecting pipe and the second connecting pipe are the same, the negative pressure recovery component moves, the negative pressure recovery component drives the cut-off component to move, and the gas passage is closed. At this time, the movement in the cyclic negative pressure state gradually extracts all the harmful gases in the semiconductor. In addition, no manual operation is required during the extraction process, improving the efficiency of extracting harmful gases from the semiconductor processing equipment.

[0017] Optionally, the cut-off component includes a nozzle, a valve plate, a valve rod, and a return member;

[0018] The nozzle is arranged in the gas passage, and the nozzle is connected to the matrix;

[0019] The valve plate is arranged at the bottom of the nozzle;

[0020] One end of the valve rod is connected to the matrix through the return member, the other end of the valve rod passes through the valve plate and the nozzle and is connected to the transmission component, the valve rod is slidably connected to the nozzle and the valve plate, and the axial direction of the valve rod is perpendicular to the intake direction;

[0021] The force application component is used to drive the valve rod to move. Among them, the valve rod can abut against the valve plate to close the gas passage;

[0022] The return member is used to drive the valve rod to return.

[0023] By adopting the above technical solution, in the step-down state, the force application component applies a force to the transmission component. The transmission component drives the valve stem to move under the force, the valve stem disengages from the valve disc, the nozzle opens, and the gas passes through the gap between the valve stem and the valve disc. The path through which the gas moves becomes smaller, thereby achieving the purpose of converting high-pressure gas into low-pressure gas. In the vacuum pumping state, the pumping device moves. Due to the change in the internal air pressure of the parent body, the transmission component moves. The transmission component drives the valve disc to separate from the valve stem. The harmful gas in the semiconductor device enters the ventilation pipeline through the first connecting pipe, and the harmful gas enters the pumping device through the second connecting pipe, realizing the extraction of the harmful gas. When the air pressures of the first connecting pipe and the second connecting pipe are the same, the negative pressure recovery component moves back. The negative pressure recovery component drives the cut-off component to move, and the gas passage is closed. Through the movement in the cyclic negative pressure state, the harmful gas in the semiconductor is gradually extracted completely. No manual operation is required during the extraction process, improving the efficiency of extracting harmful gas from semiconductor processing equipment.

[0024] Optionally, the restoring member includes a restoring spring;

[0025] The restoring spring is coaxially sleeved on the valve stem. One end of the restoring spring is connected to the parent body, and the other end is connected to the valve stem.

[0026] By adopting the above technical solution, when the transmission component moves forward, the transmission component drives the valve stem to move, the valve stem drives the restoring spring to move, and the restoring spring is compressed. When the transmission component changes in the reverse direction, the transmission component drives the valve stem to move, the restoring spring extends, the restoring spring drives the valve stem to move, and the valve stem quickly contacts and presses against the valve disc, achieving the purpose of quickly closing the gas passage.

[0027] Optionally, the force application component includes an upper cover, an adjusting screw rod, a pressure regulating spring, an upper spring button, and a lower spring button;

[0028] The upper cover is connected to the parent body. The upper cover is hollow and communicated with the parent body;

[0029] The lower spring button is slidably connected inside the upper cover. The lower spring button is connected to the transmission component. The movement direction of the lower spring button is the same as the axial direction of the valve stem;

[0030] The adjusting screw rod is threadedly connected to the upper cover. The axial direction of the adjusting screw rod is the same as the movement direction, and the end of the adjusting screw rod can be connected to the upper spring button;

[0031] One end of the pressure regulating spring is connected to the lower spring button, and the other end is connected to the upper spring button. The axial direction of the pressure regulating spring is the same as the axial direction of the adjusting screw rod.

[0032] By adopting the above technical solution, rotate the adjusting screw rod. The adjusting screw rod rotates on the upper cover and moves downward. The movement of the adjusting screw rod drives the movement of the upper spring button. The movement of the upper spring button drives the movement of the pressure regulating spring. The movement of the pressure regulating spring drives the movement of the lower spring button. The lower spring button moves downward, and the lower spring button drives the transmission component to move. The transmission component drives the valve rod to move, and the valve rod moves away from the valve disc, realizing the opening of the gas passage, facilitating the conversion of high-pressure gas into low-pressure gas. Similarly, rotate the adjusting screw rod. The adjusting screw rod rotates on the upper cover and moves upward. The movement of the adjusting screw rod drives the movement of the upper spring button. The movement of the upper spring button drives the movement of the pressure regulating spring. The movement of the pressure regulating spring drives the movement of the lower spring button. The lower spring button moves upward, and the lower spring button drives the transmission component to move. The transmission component drives the valve rod to move, and the valve rod moves closer to the valve disc, realizing the closing of the gas passage.

[0033] Optionally, the force application component further includes a needle roller bearing;

[0034] One end of the needle roller bearing is fixedly connected to the upper spring button, and the other end is rotatably connected to the adjusting screw rod.

[0035] By adopting the above technical solution, rotate the adjusting screw rod. The adjusting screw rod rotates on the needle roller bearing, and the adjusting screw rod drives the movement of the pressure regulating spring. The provided needle roller spring facilitates the rotation of the adjusting screw rod, thereby improving the efficiency of gas conversion.

[0036] Optionally, the negative pressure recovery component includes a connecting block, a spring seat and a corrugated spring;

[0037] One side of the connecting block is connected to the upper cover and is communicated with the upper cover. The other side is connected to the parent body and is communicated with the parent body;

[0038] One side of the spring seat is slidably connected in the connecting block through the corrugated spring. The moving direction of the spring seat is the same as the moving direction of the adjusting screw rod. The axial direction of the corrugated spring is the same as the moving direction of the spring seat;

[0039] The lower spring button is connected to the other side of the spring seat.

[0040] By adopting the above technical solution, when it is necessary to evacuate harmful gases from a semiconductor processing device, the pressure regulating spring is in a relaxed state. The vacuum pumping device operates, and the air pressure inside the main body changes. The change in the air pressure inside the main body causes the air pressure inside the upper cover to change, the transmission component moves, the transmission component drives the valve stem to move, the valve stem separates from the valve disc, and the harmful gases pass through the gas passage and enter the pumping device, realizing the extraction of harmful gases. When the air pressures of the first connecting pipe and the second connecting pipe are the same, the corrugated spring extends, the corrugated spring drives the spring seat to move, the spring seat drives the lower spring button to move, the lower spring button drives the transmission component to move, the transmission component drives the valve stem to move, and the valve stem abuts against the valve disc, closing the gas passage. By repeating the above movement process, the harmful gases inside the semiconductor device are gradually extracted.

[0041] Optionally, the stiffness of the pressure regulating spring is greater than that of the corrugated spring.

[0042] By adopting the above technical solution, the stiffness of the pressure regulating spring is set to be greater than that of the corrugated spring, creating a stiffness difference between the pressure regulating spring and the corrugated spring. This facilitates, under the vacuum state, manually interfering to rotate the adjusting screw rod to increase the amount of harmful gases passing through, further improving the extraction efficiency of harmful gases from the semiconductor processing device.

[0043] Optionally, the transmission component includes a transmission diaphragm;

[0044] One side of the transmission diaphragm is connected to the spring seat, and the other side is connected to the valve stem.

[0045] By adopting the above technical solution, the transmission diaphragm moves, the transmission diaphragm drives the valve stem to move, and the valve stem separates from or abuts against the valve disc, achieving the purpose of opening or closing the gas passage. The provided transmission diaphragm, on the one hand, can drive the valve stem to move through the deformation of the transmission diaphragm, and on the other hand, can improve the sealing performance of the pressure regulating device, thereby improving the efficiency of gas conversion or extraction.

[0046] Optionally, the transmission component further includes a washer for reducing the deformation and damage of the transmission diaphragm;

[0047] The washer is arranged between the transmission diaphragm and the lower spring button, and the washer can contact the lower spring button.

[0048] By adopting the above technical solution, by arranging a washer between the transmission diaphragm and the lower spring button, the occurrence of the phenomenon that the transmission diaphragm is damaged due to excessive force during deformation is reduced.

[0049] Optionally, the transmission component further includes a diaphragm gasket for further reducing the damage of the transmission diaphragm;

[0050] The diaphragm gasket is disposed on the upper cover and on the side close to the transfer diaphragm.

[0051] By adopting the above technical solution, a diaphragm gasket is arranged between the diaphragm gasket and the upper cover, so that the force on the transfer diaphragm is balanced, and the phenomenon of damage caused by uneven force on the transfer diaphragm is reduced.

[0052] In summary, the present application includes at least one of the following beneficial technical effects:

[0053] 1. In the present application, the vacuum device is connected to the second connecting pipe, so that the air pressure in the mother body changes. The air pressure drives the transfer assembly to move, the transfer assembly drives the negative pressure recovery assembly to move, the negative pressure recovery assembly drives the cut-off assembly to move, and the cut-off assembly opens the gas passage. The harmful gas in the semiconductor processing equipment enters the pumping equipment, realizing the extraction of the harmful gas in the semiconductor processing equipment. When the air pressures of the first connecting pipe and the second connecting pipe are the same, the negative pressure recovery assembly moves, the negative pressure recovery assembly drives the cut-off assembly to move, and the gas passage is closed. At this time, the movement in the cyclic negative pressure state gradually extracts all the harmful gas in the semiconductor. In addition, no manual operation is required during the extraction process, improving the efficiency of extracting the harmful gas in the semiconductor processing equipment;

[0054] 2. In the present application, by rotating the adjusting screw rod, the adjusting screw rod rotates on the upper cover, the adjusting screw rod moves downward, the movement of the adjusting screw rod drives the upper spring button to move, the movement of the upper spring button drives the pressure regulating spring to move, the movement of the pressure regulating spring drives the lower spring button to move, the lower spring button moves downward, the lower spring button drives the transfer assembly to move, the transfer assembly drives the valve rod to move, and the valve rod moves away from the valve plate, realizing the opening of the gas passage and facilitating the conversion of high-pressure gas into low-pressure gas; Similarly, by rotating the adjusting screw rod, the adjusting screw rod rotates on the upper cover, the adjusting screw rod moves upward, the movement of the adjusting screw rod drives the upper spring button to move, the movement of the upper spring button drives the pressure regulating spring to move, the movement of the pressure regulating spring drives the lower spring button to move, the lower spring button moves upward, the lower spring button drives the transfer assembly to move, the transfer assembly drives the valve rod to move, and the valve rod moves closer to the valve plate, realizing the closing of the gas passage;

[0055] 3. In the present application, by setting the stiffness of the pressure regulating spring to be greater than the stiffness of the corrugated spring, a stiffness difference is formed between the pressure regulating spring and the corrugated spring, which is convenient for artificially interfering with the rotation of the adjusting screw rod under the vacuum state to increase the amount of harmful gas passing through, and further improving the extraction efficiency of the harmful gas in the semiconductor processing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] Figure 1 is a schematic structural diagram of a semiconductor system special negative pressure regulating device of the present application;

[0057] Figure 2It is a cross-sectional view of a negative-pressure pressure regulating device dedicated to a semiconductor system in this application;

[0058] Figure 3 It is Figure 2 An enlarged view of part A.

[0059] Reference numerals: 1, parent body; 11, gas passage; 2, first connecting pipe; 21, intake cavity; 3, second connecting pipe; 32, outlet cavity; 4, cut-off assembly; 41, nozzle; 42, valve disc; 43, valve rod; 44, restoring member; 441, restoring spring; 45, gasket; 5, force application assembly; 51, upper cover; 511, retaining ring; 52, adjusting screw rod; 53, pressure regulating spring; 54, upper spring knob; 55, lower spring knob; 56, needle roller bearing; 57, operating member; 571, first locking nut; 572, second locking nut; 573, adjusting handwheel; 6, transmission assembly; 61, transmission diaphragm; 62, washer; 621, first O-ring; 622, second O-ring; 623, third O-ring; 63, diaphragm gasket; 7, negative-pressure restoring assembly; 71, connecting block; 72, spring seat; 73, corrugated spring. Detailed implementation manners

[0060] The following Figures 1-3 further elaborates on this application in detail with reference to the attached drawings.

[0061] An embodiment of this application discloses a negative-pressure pressure regulating device dedicated to a semiconductor system.

[0062] Referring to Figure 1 , Figure 2 , Figure 3 , a negative-pressure pressure regulating device dedicated to a semiconductor system includes a parent body 1, a first connecting pipe 2, a second connecting pipe 3, a cut-off assembly 4, a force application assembly 5, a transmission assembly 6, and a negative-pressure restoring assembly 7; the pressure regulating device is divided into a pressure-reducing state and a vacuum pumping state; a gas passage 11 is provided in the parent body 1; the first connecting pipe 2 is fixed to one side of the parent body 1 by means of threaded connection, and the first connecting pipe 2 is communicated with the parent body 1. The first connecting pipe 2 and the parent body 1 form an intake cavity 21. In the pressure-reducing state, gas is introduced into the gas passage 11 through the first connecting pipe 2; the second connecting pipe 3 is fixed to the parent body 1 by means of threaded connection, the first connecting pipe 2 is communicated with the parent body 1, the second connecting pipe 3 and the parent body 1 form an outlet cavity 32, and the intake cavity 21, the gas passage 11, and the outlet cavity 32 are communicated. In the vacuum pumping state, a pumping device is connected to the second connecting pipe 3.

[0063] Referring to Figure 2 , Figure 3, the cutoff component 4 is installed in the gas passage 11, and the cutoff component 4 is used to close or open the gas passage 11; the transfer component 6 is installed on the base body 1, the transfer component 6 is connected to the cutoff component 4, and the transfer component 6 is used to transfer the force of the force application component 5 to the cutoff component 4 to realize the opening or closing of the gas passage 11; the force application component 5 is connected to the base body 1, and the force application component 5 is used to drive the cutoff component 4 to move; the negative pressure recovery component 7 is connected to the cutoff component 4, and in the vacuum state, the negative pressure recovery component 7 is used to drive the cutoff component 4 to move.

[0064] Referring to Figure 1 , in the embodiment of the present application, to improve the efficiency of gas pressure reduction and the extraction of harmful gases in the semiconductor processing equipment, the first connecting pipe 2 and the second connecting pipe 3 are symmetrically arranged about the axis of the base body 1.

[0065] Referring to Figure 2 、 Figure 3 , the cutoff component 4 includes a nozzle 41, a valve plate 42, a valve rod 43 and a return member 43; the nozzle 41 is fixedly connected to the base body 1 by a threaded connection, wherein the nozzle 41 is located in the gas passage 11, and the nozzle 41 is communicated with the gas passage 11; the valve plate 42 is fixedly connected to the bottom of the nozzle 41 by a welding connection; one end of the valve rod 43 is connected to the base body 1 through the return member 43, and the other end of the valve rod 43 passes through the valve plate 42 and the nozzle 41 and is connected to the transfer component 6. Among them, the valve rod 43 is slidably connected to the nozzle 41 and the valve plate 42, and the axis of the valve rod 43 is perpendicular to the intake direction; the force application component 5 is used to drive the valve rod 43 to move, and the valve rod 43 can abut against or move away from the valve plate 42 to realize the closing or opening of the gas passage 11; the return member 43 is used to drive the valve rod 43 to return to its original position.

[0066] Referring to Figure 2 , in the embodiment of the present application, the return member 44 is preferably a return spring 441; the return spring 441 is coaxially sleeved on the valve rod 43, one end of the return spring 441 is fixedly connected to the base body 1, and the other end is fixedly connected to the valve rod 43 by welding; the valve rod 43 moves, the valve rod 43 drives the return spring 441 to move, the return spring 441 compresses downward, the valve rod 43 is separated from the valve plate 42, and the gas passes through in the gas passage 11. The return spring 431 extends, the return spring 431 drives the valve rod 43 to move, the valve rod 43 abuts against the valve plate 42, and the gas passage 11 is closed.

[0067] Referring to Figure 2 , to reduce the phenomenon that when the return spring 441 moves, the return spring 441 applies force to the base body 1 and damages the base body 1, a gasket 45 is provided at one end of the return spring 441 close to the base body 1; when the return spring 441 compresses, the return spring 441 applies force downward. Since the provided gasket 45 buffers the force of the return spring 441, the phenomenon that the base body 1 is easily damaged is reduced.

[0068] Referring to Figure 2 and Figure 3 , the force - applying component 5 includes an upper cover 51, an adjusting screw rod 52, a pressure - regulating spring 53, an upper spring button 54 and a lower spring button 55; the upper cover 51 is connected to the parent body 1, the upper cover 51 is hollow - shaped, and the upper cover 51 is communicated with the parent body 1; the lower spring button 55 is slidably connected inside the upper cover 51, the lower spring button 55 is connected to the transmission component 6, and the moving direction of the lower spring button 55 is the same as the axial direction of the valve rod 43; the adjusting screw rod 52 is installed at the other end of the upper cover 51, the adjusting screw rod 52 is threadedly connected to the upper cover 51, and the axial direction of the adjusting screw rod 52 is the same as the moving direction of the lower spring button 55; one end of the pressure - regulating spring 53 is connected to the lower spring button 55, and the other end is connected to the upper spring button 54, and the axial direction of the pressure - regulating spring 53 is the same as the axial direction of the adjusting screw; the adjusting screw rod 52 is connected to the upper spring button 54, and the axial direction of the adjusting screw rod 52 is the same as the moving direction of the spring button.

[0069] Referring to Figure 3 , in the embodiment of the present application, in order to reduce the occurrence of the pressure - regulating spring 53 shifting and affecting the operation, a retaining ring 511 is fixed inside the upper cover 51. Among them, the axial direction of the retaining ring 511 is the same as the axial direction of the upper cover 51, and the pressure - regulating spring 53 is installed in the cavity of the retaining ring 511.

[0070] Referring to Figure 2 , in the embodiment of the present application, in order to facilitate driving the rotation of the adjusting screw rod 52, an operating member 57 for facilitating the rotation of the adjusting screw rod 52 is connected to the end of the adjusting screw rod 52; the operating member 57 includes an adjusting handwheel 573, a first locking nut 571 and a second locking nut 572; the second locking nut 572 is threadedly connected to the adjusting screw rod 52, the adjusting handwheel 573 passes through the adjusting screw rod 52 and abuts against the top of the second locking nut 572, and the first locking nut 571 is threadedly connected to the adjusting screw rod 52, and the first locking nut 571 abuts against the other end of the adjusting handwheel 573.

[0071] Referring to Figure 2 , in order to improve the rotation effect of the adjusting screw rod 52 and thus improve the efficiency of gas conversion, the force - applying component 5 in the embodiment of the present application further includes a needle roller bearing 56; one end of the needle roller bearing 56 is fixedly connected to the upper spring button 54, and the other end is rotatably connected to the adjusting screw rod 52.

[0072] Referring to Figure 2 and Figure 3, the negative pressure recovery component 7 includes a connection block 71, a spring seat 72 and a corrugated spring 73; one side of the connection block 71 is threadedly connected to the upper cover 51, the connection block 71 is communicated with the upper cover 51, the other side of the connection block 71 is threadedly connected to the parent body 1, and the connection block 71 is communicated with the parent body 1; one side of the spring seat 72 is slidably connected to the connection block 71 through the corrugated spring 73, the moving direction of the spring seat 72 is the same as the moving direction of the adjusting screw rod 52, and the axial direction of the corrugated spring 73 is the same as the moving direction of the spring seat 72; the lower spring button 55 is fixed to the other side of the spring seat 72.

[0073] Referring to Figure 2 , to facilitate the improvement of the vacuum pumping efficiency through manual intervention in the vacuum state, in the embodiment of the present application, the stiffness of the pressure regulating spring 53 is greater than the stiffness of the corrugated spring 73; when the vacuum pumping device moves, negative pressure appears in the parent body 1, the transmission component 6 moves, the transmission component 6 drives the spring seat 72 to move, the movement of the spring seat 72 drives the corrugated spring 73 to move, and at the same time, the movement of the transmission component 6 drives the valve rod 43 to move, and the valve rod 43 is separated from the valve piece 42 to realize the extraction of harmful gases in the semiconductor processing equipment. When the pressures of the first connecting pipe 2 and the second connecting pipe 3 are the same, the transmission component 6 moves, the transmission component 6 drives the spring seat 72 to move, the corrugated spring 73 moves, the valve rod 43 moves, and the valve rod 43 abuts against the valve piece 42, and the gas passage 11 is closed; repeating the above actions realizes the extraction of harmful gases in the semiconductor processing equipment. In addition, since the stiffness of the pressure regulating spring 53 is greater than the stiffness of the corrugated spring 73, when the corrugated spring 73 moves, the pressure regulating spring 53 will not move, but for the corrugated spring 73, its movement stroke is effective. When it is necessary to improve the extraction of harmful gases in the semiconductor processing equipment, through manual intervention, the adjusting screw realizes the rapid extraction of harmful gases in the negative pressure state.

[0074] Referring to Figure 2 , Figure 3 , the transmission component 6 in the embodiment of the present application includes a transmission diaphragm 61; one side of the transmission diaphragm 61 is fixedly connected to the spring seat 72. To improve the connection strength between the transmission diaphragm 61 and the spring seat 72, the transmission diaphragm 61 and the spring seat 72 are fixedly connected by screws. The other side of the transmission diaphragm 61 is fixedly connected to the valve rod 43. Similarly, in the embodiment of the present application, to improve the connection strength between the valve rod 43 and the transmission diaphragm 61 and facilitate the separation of the valve rod 43 and the transmission diaphragm 61 during subsequent maintenance, the valve rod 43 is threadedly connected to the transmission diaphragm 61.

[0075] Referring to Figure 2 , Figure 3 , the transmission component 6 further includes a washer 62 for reducing the deformation and damage of the transmission diaphragm 61; the washer 62 is installed between the transmission diaphragm 61 and the spring seat 72, and the washer 62 can contact the spring seat 72.

[0076] Reference Figure 2 、 Figure 3 In the embodiment of the present application, the gasket 62 includes a first O-ring 621, a second O-ring 622, and a third O-ring 623; the first O-ring 621 and the second O-ring 622 are installed between the lower spring button 55 and the transfer diaphragm 61, wherein the first O-ring 621 and the second O-ring 622 are located in the recess of the transfer diaphragm 61, and the third O-ring 623 is located at the connection between the base body 1 and the transfer diaphragm 61.

[0077] Reference Figure 3 To balance the deformation force of the transfer diaphragm 61 and reduce the phenomenon of damage to the transfer diaphragm 61, the transfer assembly 6 in the embodiment of the present application further includes a diaphragm gasket 63 for further reducing the damage to the transfer diaphragm 61; the diaphragm gasket 63 is fixed to the upper cover 51 and the side close to the transfer diaphragm 61 by welding.

[0078] The implementation principle of a semiconductor system-specific negative pressure regulating device in the embodiment of the present application is as follows: When it is necessary to reduce the pressure of the gas, the gas cylinder is connected to the first connecting pipe 2, and the high-pressure gas in the gas cylinder enters the gas passage 11 through the first connecting pipe 2. Rotate the adjusting handwheel 573, and the rotation of the adjusting handwheel 573 drives the electric adjusting lead screw to move. The adjusting lead screw moves downward, and the movement of the adjusting lead screw 52 drives the pressure regulating spring 53 to move. The pressure regulating spring 53 moves downward, and the pressure regulating spring 53 drives the lower spring button 55 to move. The movement of the lower spring button 55 drives the transfer diaphragm 61 to move. The transfer diaphragm 61 moves downward, and the downward movement of the transfer diaphragm 61 drives the valve stem 43 to move. The valve stem 43 moves downward, and the valve stem 43 separates from the valve plate 42. The high-pressure gas passes through the gap between the valve stem 43 and the valve plate 42, and the high-pressure gas is converted into low-pressure gas. The low-pressure gas enters the processing equipment through the gas passage 11 and the second connecting pipe 3; when it is necessary to extract the harmful gas in the semiconductor processing equipment, rotate the adjusting handwheel 573, and the pressure regulating spring 53 is in a relaxed state. Connect the air extraction device to the second connecting pipe 3, and the air extraction device operates. The air pressure in the base body 1 changes, and the transfer diaphragm 61 moves downward. The transfer diaphragm 61 drives the spring seat 72 to move. The spring seat 72 moves downward, and the corrugated spring 73 is compressed. The downward movement of the transfer diaphragm 61 drives the valve stem 43 to move. The valve stem 43 separates from the valve plate 42, and the gas passage 11 is opened. The harmful gas enters the inside of the air extraction device. After a period of extraction of the harmful gas, the air pressure in the first connecting pipe 2 and the second connecting pipe 3 is the same, and the transfer diaphragm 61 moves upward. At the same time, the corrugated spring 73 extends, and the corrugated spring 73 drives the spring seat 72 to move upward. The valve stem 43 moves upward, and the valve stem 43 abuts against the valve plate, repeating the negative pressure action to gradually realize the extraction of the harmful gas.

[0079] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereby. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application shall be covered within the protection scope of the present application.

Claims

1. A special negative pressure voltage regulator for a semiconductor system, characterized in that: It includes a main body (1), a first connecting pipe (2), a second connecting pipe (3), a cut-off assembly (4), a force-applying assembly (5), a transmission assembly (6), and a negative-pressure recovery assembly (7); The pressure-regulating device is divided into a pressure-reducing state and a vacuum-pumping state; A gas passage (11) is provided in the main body (1); The first connecting pipe (2) is provided on the main body (1), the first connecting pipe (2) is communicated with the main body (1), the first connecting pipe (2) and the main body (1) form an intake cavity (21), and in the pressure-reducing state, gas is introduced into the gas passage (11) through the first connecting pipe (2); The second connecting pipe (3) is provided on the main body (1), the second connecting pipe (3) is communicated with the main body (1), the second connecting pipe (3) and the main body (1) form an air outlet cavity (32), wherein the intake cavity (21), the gas passage (11), and the air outlet cavity (32) are communicated. In the vacuum-pumping state, a pumping device can be connected to the second connecting pipe (3); The cut-off assembly (4) is provided in the gas passage (11), and the cut-off assembly (4) is used to close or open the gas passage (11); The transmission assembly (6) is provided on the main body (1), the transmission assembly (6) is connected to the cut-off assembly (4), and is used to transmit the force of the force-applying assembly (5) to the cut-off assembly (4); The force-applying assembly (5) is provided on the main body (1) and is used to drive the transmission assembly (6) to move; The negative-pressure recovery assembly (7) is connected to the cut-off assembly (4), and in the vacuum-pumping state, the negative-pressure recovery assembly (7) is used to drive the cut-off assembly (4) to move; The force-applying assembly (5) includes an upper cover (51), an adjusting screw rod (52), a pressure-regulating spring (53), an upper spring button (54), and a lower spring button (55); The negative-pressure recovery assembly (7) includes a connecting block (71), a spring seat (72), and a corrugated spring (73); One side of the connecting block (71) is connected to the upper cover (51) and is communicated with the upper cover (51), and the other side is connected to the main body (1) and is communicated with the main body (1); One side of the spring seat (72) is slidably connected in the connecting block (71) through the corrugated spring (73), the moving direction of the spring seat (72) is the same as the moving direction of the adjusting screw rod (52), and the axial direction of the corrugated spring (73) is the same as the moving direction of the spring seat (72); The lower spring button (55) is provided on the other side of the spring seat (72).

2. The special negative-pressure voltage regulating device for a semiconductor system according to claim 1, wherein: The cut-off assembly (4) includes a nozzle (41), a valve disc (42), a valve rod (43), and a restoring member (44); The nozzle (41) is provided in the gas passage (11), and the nozzle (41) is connected to the main body (1); The valve disc (42) is provided at the bottom of the nozzle (41); One end of the valve rod (43) is connected to the base body (1) through the restoring member (44). The other end of the valve rod (43) passes through the valve plate (42) and the nozzle (41) and is connected to the transmission assembly (6). The valve rod (43) is slidably connected to the nozzle (41) and the valve plate (42), and the axis of the valve rod (43) is perpendicular to the air intake direction; The force - applying assembly (5) is used to drive the valve rod (43) to move. Among them, the valve rod (43) can be in tight contact with the valve plate (42) to close the gas passage (11); The restoring member (44) is used to drive the valve rod (43) to move back.

3. A semiconductor system-specific negative pressure regulating device according to claim 2, characterized in that: The restoring member (44) includes a restoring spring (441); The restoring spring (441) is coaxially sleeved on the valve rod (43). One end of the restoring spring (441) is connected to the base body (1), and the other end is connected to the valve rod (43).

4. The special negative - pressure voltage - regulating device for a semiconductor system according to claim 2, characterized in that: The upper cover (51) is connected to the base body (i). The upper cover (51) is hollow and is communicated with the base body (1); The lower spring button (55) is slidably connected in the upper cover (51). The lower spring button (55) is connected to the transmission assembly (6). The movement direction of the lower spring button (55) is the same as the axis of the valve rod (43); The adjusting screw rod (52) is threadedly connected to the upper cover (51). The axis of the adjusting screw rod (52) is the same as the movement direction of the lower spring button (55), and the end of the adjusting screw rod (52) can be connected to the upper spring button (54); One end of the voltage - regulating spring (53) is connected to the lower spring button (55), and the other end is connected to the upper spring button (54). The axis of the voltage - regulating spring (53) is the same as the axis of the adjusting screw rod (52).

5. A special negative-pressure voltage regulator for a semiconductor system according to claim 4, characterized in that: The force - applying assembly (5) further includes a needle roller bearing (56); One end of the needle roller bearing (56) is fixedly connected to the upper spring button (54), and the other end is rotatably connected to the adjusting screw rod (52).

6. A special negative pressure regulating device for a semiconductor system according to claim 4, characterized in that: The stiffness of the voltage - regulating spring (53) is greater than the stiffness of the corrugated spring (73).

7. A dedicated negative pressure voltage regulator for a semiconductor system according to claim 4, characterized in that: The transmission assembly (6) includes a transmission diaphragm (61); One side of the transmission diaphragm (61) is connected to the spring seat (72), and the other side is connected to the valve rod (43).

8. A special negative-pressure voltage regulator for a semiconductor system according to claim 7, characterized in that: The transmission assembly (6) further includes a washer (62) for reducing the deformation and damage of the transmission diaphragm (61); The washer (62) is arranged between the transmission diaphragm (61) and the spring seat (72), and the washer (62) can be in contact with the spring seat (72).

9. A special negative-pressure voltage regulator for a semiconductor system according to claim 7, characterized in that: The transmission assembly (6) further includes a diaphragm gasket (63) for further reducing the damage of the transmission diaphragm (61); The diaphragm gasket (63) is arranged on the upper cover (51) and on the side close to the transmission diaphragm (61).

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