A temperature measuring device and a temperature measuring method

Abstract

The application discloses a temperature measuring device and a temperature measuring method, and relates to the technical field of temperature measurement. The temperature measuring device comprises a flexible substrate, the flexible substrate comprises a plurality of temperature measuring areas, each temperature measuring area is provided with a temperature measuring element, the temperature measuring elements of the plurality of temperature measuring areas are located on the same side of the flexible substrate, the side of the flexible substrate, which is away from the temperature measuring elements, is used for adhering to an object to be measured, the temperature measuring elements can measure the temperature of the corresponding positions of the object to be measured, and the flexible substrate can selectively remove any temperature measuring area to form a vacancy. The temperature measuring device can accurately measure the temperature distribution of the surface of an object.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of temperature measurement, in particular to a temperature measuring device and a temperature measuring method. BACKGROUND

[0002] Temperature is an important environmental parameter that affects our production and life, and temperature also has an impact on the characteristics of an object. In order to understand the impact of temperature on an object, the temperature distribution on the surface of the object needs to be known.

[0003] Currently, temperature measurement on an object can be divided into contact measurement and non-contact measurement. Non-contact measurement uses thermal imaging or infrared scanning, which has low accuracy and is not very accurate when measuring the temperature of a surface with high reflectivity. Contact measurement mainly measures the temperature of an object by setting a thermistor or thermocouple on a fixed substrate and directly contacting the object to be measured. However, when measuring the temperature of an object with holes on the surface, it is difficult to ensure that the distance between the holes and the thermistor or thermocouple around the holes is equal, and therefore the temperature distribution on the surface of the object cannot be accurately measured.

[0004] In view of the above problems, a temperature measuring device and a temperature measuring method need to be developed to solve the above problems. SUMMARY

[0005] The purpose of the present application is to provide a temperature measuring device and a temperature measuring method that can accurately measure the temperature distribution on the surface of an object.

[0006] To achieve this purpose, the present application adopts the following technical solutions:

[0007] A temperature measuring device, comprising:

[0008] A flexible substrate, the flexible substrate comprising a plurality of temperature measuring areas, each temperature measuring area being provided with a temperature measuring element, and the temperature measuring elements of the plurality of temperature measuring areas being located on the same side of the flexible substrate, the side of the flexible substrate away from the temperature measuring elements being used to adhere to an object to be measured, the temperature measuring elements being capable of measuring the temperature of the corresponding position of the object to be measured, and the flexible substrate being capable of selectively removing any temperature measuring area to form a vacancy.

[0009] Preferably, a splitting unit is provided between two adjacent temperature measuring areas, and the two adjacent temperature measuring areas can be split by the splitting unit.

[0010] Preferably, the splitting unit is a through hole or a shear line.

[0011] Preferably, the temperature measuring element is a thermistor, the thermistor is attached to the corresponding temperature measuring area, and the thermistor is capable of measuring the temperature of the temperature measuring area.

[0012] Preferably, the flexible substrate is an FPC board, and each temperature measuring area of the FPC board is provided with a solder pad, and the thermistor is fixedly connected to the FPC board through the solder pad.

[0013] Preferably, the side of the flexible substrate away from the temperature measuring element is provided with an adhesive layer, and the adhesive layer can bond the flexible substrate to the surface of the object to be measured.

[0014] Preferably, each temperature measuring area is provided with a receiving hole, the temperature measuring element covers the receiving hole, and a heat-conducting element abutting against the temperature measuring element is arranged in the receiving hole, and the heat-conducting element protrudes from the side of the flexible substrate away from the temperature measuring element.

[0015] Preferably, the adhesive layer is provided with a clearance hole at a position opposite to the heat-conducting element, and the heat-conducting element passes through the clearance hole.

[0016] Preferably, the thickness of the adhesive layer is less than or equal to the height of the heat-conducting element protruding from the side of the flexible substrate away from the temperature measuring element.

[0017] A temperature measuring method, which can use the temperature measuring device to measure the temperature of an object to be measured, and the temperature measuring method comprises the following steps:

[0018] Obtaining the size of a temperature measuring interference area on the surface of the object to be measured, wherein the temperature measuring interference area includes a protruding structure, a recessed structure and / or a hole;

[0019] Removing a plurality of temperature measuring areas of the flexible substrate to form a vacancy, and the size of the vacancy is greater than or equal to the size of the temperature measuring interference area;

[0020] Bonding the side of the flexible substrate away from the temperature measuring element to the object to be measured, and locating the temperature measuring interference area in the vacancy;

[0021] Measuring the temperature of the surface of the object to be measured by using the temperature measuring element.

[0022] The present application has the following advantages:

[0023] The application provides a temperature measuring device and a temperature measuring method. In the temperature measuring device, the flexible substrate can be attached to the surface of the object to be measured, so that the temperature measuring element of each temperature measuring area can accurately measure the temperature of the object in the area through the flexible substrate, the temperature measuring precision is improved through the matrix measurement, the temperature measuring device can measure the temperature of multiple points on the surface of the object at the same time, and the temperature measuring efficiency is improved. When the temperature of the object with the temperature measuring interference area on the surface needs to be measured, a plurality of temperature measuring areas can be removed from the flexible substrate according to the size of the temperature measuring interference area, so as to form a vacancy in the flexible substrate, the vacancy is equal to or greater than the temperature measuring interference area, the operator can observe the position of the temperature measuring interference area through the vacancy, so as to adjust the flexible substrate to make the distance between the temperature measuring element around the vacancy and the temperature measuring interference area equal, and the temperature distribution of the surface of the object with the temperature measuring interference area can be accurately measured. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 FIG. 1 is a structural schematic diagram of the temperature measuring device provided by the application;

[0025] Figure 2 FIG. 2 is a partial enlarged view of A in FIG. 1; Figure 1

[0026] Figure 3 FIG. 3 is a top view of the temperature measuring device provided by the application; Figure 1 ;

[0027] Figure 4 FIG. 4 is a top view of the temperature measuring device provided by the application; Figure 2 ;

[0028] Figure 5 FIG. 5 is a top view of the temperature measuring device provided by the application; Figure 3 ;

[0029] Figure 6 FIG. 6 is a sectional view of B-B in FIG. 5. Figure 3

[0030] In the drawings:

[0031] 1, flexible substrate; 2, temperature measuring element; 3, adhesive layer; 4, heat conducting element;

[0032] 11, temperature measuring area; 12, through hole; 13, accommodating hole; 31, avoiding hole. DETAILED DESCRIPTION

[0033] The embodiments of the application are described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the application, and cannot be understood as a limitation of the application. ​​

[0034] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions.

[0035] Unless otherwise expressly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" should be understood broadly, for example, it can be fixed connection, or detachable connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0036] Unless otherwise expressly specified and limited, "on" or "under" of the first feature to the second feature can include that the first feature and the second feature are in direct contact, or the first feature and the second feature are not in direct contact but are in contact through another feature between them. Moreover, "on", "above" and "above" of the first feature to the second feature include that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The "below", "below" and "below" of the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0037] The technical scheme of the present application will be further illustrated by specific embodiments in conjunction with the drawings.

[0038] The current temperature measurement for objects can be divided into contact measurement and non-contact measurement. Non-contact measurement uses thermal imaging or infrared scanning, which has low precision and inaccurate data when measuring the temperature of a surface with high reflectivity. The contact measurement mainly measures the temperature of the object by setting a thermal resistance or a thermocouple on a flexible substrate and directly contacting the object to be measured. However, when measuring the temperature of an object with a temperature measurement interference area (such as a protruding structure, a recessed structure and / or a hole), it is difficult to ensure that the distance between the temperature measurement interference area and the thermal resistance or thermocouple around it is equal, so it is impossible to accurately measure the temperature distribution of the surface of the object.

[0039] The present embodiment provides a temperature measuring device, which comprisesFigures 1-5 As shown, the temperature measuring device comprises a flexible substrate 1, which comprises a plurality of temperature measuring areas 11 Figure 3 The dashed line frame represents the boundary range of the temperature measuring area 11, and there is no actual structure. Each temperature measuring area 11 is provided with a temperature measuring element 2, and the temperature measuring elements 2 of the plurality of temperature measuring areas 11 are located on the same side of the flexible substrate 1. The side of the flexible substrate 1 away from the temperature measuring element 2 is used to adhere to the object to be measured. The temperature measuring element 2 can measure the temperature of the corresponding position of the object to be measured. The flexible substrate 1 can selectively remove any temperature measuring area 11 to form a vacancy.

[0040] In the temperature measuring device, the flexible substrate 1 can be adhered to the surface of the object to be measured, and can be curved along the shape of the surface of the object, so as to ensure that each temperature measuring area 11 can be adhered to the object. It is suitable for both planar temperature measurement and arc surface temperature measurement. The temperature measuring element 2 of each temperature measuring area 11 of the flexible substrate 1 can accurately measure the temperature of the object in the area through the flexible substrate 1. The matrix measurement improves the temperature measurement accuracy, and the temperature measuring device can measure the temperature of multiple points on the surface of the object, and the temperature measurement efficiency is fast. When it is necessary to measure the temperature of the object with a hole on the surface, a plurality of temperature measuring areas 11 can be removed from the flexible substrate 1 according to the size of the hole, so as to form a vacancy in the flexible substrate 1. The vacancy is equal to or greater than the hole of the object. The operator can observe the position of the hole through the vacancy, so as to adjust the flexible substrate 1 to make the distance between the temperature measuring element 2 around the vacancy and the hole equal, so as to accurately measure the temperature distribution on the surface of the object.

[0041] The temperature measuring device can also measure the object with a concave structure on the surface, and the measurement method is the same as that of the object with a hole described above. It can be understood that the temperature measuring device can also measure the object with a convex structure on the surface. Correspondingly, it is necessary to remove the temperature measuring area 11 with a size slightly larger than the convex structure from the flexible substrate 1, and then adhere the flexible substrate 1 to the surface of the object. Only the convex structure needs to pass through the vacancy.

[0042] Further, after removing a certain number of temperature measuring areas 11, the remaining flexible substrate 1 can be bent and bonded to form different shapes of the flexible substrate 1 to adhere to more types of objects, such as objects with arc surfaces.

[0043] It is worth noting that when the surface of the object to be measured has a large curvature, the flexible substrate 1 cannot be adhered to the surface of the object after being bent. In addition to removing the temperature measuring area 11 and bonding the boundary to make the flexible substrate 1 have a curvature, a plurality of temperature measuring areas 11 can also be removed from the area of the object to be measured which does not need to be measured, so as to reduce the deformation of the flexible substrate 1 as a whole, and also to improve the adhesion of the flexible substrate 1 to the object.

[0044] Preferably, the multiple temperature measuring areas 11 are arranged in a matrix. A matrix arrangement of temperature measuring areas 11 can cover a larger surface area of ​​the object, and the equal spacing between the temperature measuring areas 11 results in a smoother temperature change measured by the temperature measuring element 2 within each area 11. This accurately reflects the temperature distribution on the object's surface, accurately measures the temperature gradient, reduces errors, and improves measurement accuracy. It is understood that the multiple temperature measuring areas 11 arranged in a matrix are preferably rectangular to ensure the flatness of the flexible substrate 1.

[0045] In some embodiments, the temperature measuring area 11 can also be a polygon such as a hexagon, triangle, trapezoid, or octagon. Taking hexagons and triangles as examples, for instance... Figure 4 As shown, when the temperature measuring area 11 is removed, the boundary of the flexible substrate 1 with the hexagonal temperature measuring area 11 becomes closer to a circle, making it suitable for measuring objects with circular holes, circular grooves, and cylindrical or conical protrusions. The flexible substrate 1 can better conform to the object. Figure 5 As shown, the flexible substrate 1 with a triangular temperature measuring area 11 can remove part of the temperature measuring area 11 as needed, and then bond the boundary to form a specific shape. For example, the flexible substrate 1 with a triangular temperature measuring area 11 can form a conical surface, which is convenient for measuring the surface of a conical object.

[0046] It is understandable that if the surface of the object to be measured is a void surface with few or small solid areas, a single temperature measurement area 11 can be separated for temperature measurement. Alternatively, multiple connected temperature measurement areas 11 adapted to the solid area can be separated for temperature measurement based on the shape and size of the solid area. This approach has high applicability and can cover a variety of temperature measurement needs.

[0047] like Figures 1-5 As shown, a splitting unit is provided between two adjacent temperature measuring areas 11, allowing the two adjacent temperature measuring areas 11 to be split apart. The splitting unit facilitates the operator in determining the splitting boundary, improves efficiency, and also prevents damage to other areas.

[0048] Specifically, the splitting unit can be a through hole 12, which can reduce the connection strength between adjacent temperature measuring areas 11 of the flexible substrate 1, reducing the difficulty for operators to remove the temperature measuring areas 11, so that the temperature measuring device can measure the temperature of the surface of the perforated object. The splitting unit can also be a cutting line, which allows operators to tear the flexible substrate along the cutting line to remove several temperature measuring areas.

[0049] It can be understood that the boundaries of adjacent temperature measuring areas 11 can be collinear, at this time the through holes 12 are arranged on the boundary lines of the temperature measuring areas 11, and the through holes 12 are arranged along the boundary lines, so that the arrangement of the through holes 12 is regular, and the temperature measuring areas 11 are ensured to be broken along the boundaries when the temperature measuring areas 11 are removed. Or the cutting lines are the boundary lines of the temperature measuring areas 11, and the operator can directly remove the temperature measuring areas 11 along the cutting lines.

[0050] It should be noted that when the temperature measuring area 11 is a polygon, the adjacent temperature measuring areas 11 can be partially or completely collinear, at this time the splitting unit can be a through hole 12 or a cutting line; and when the temperature measuring area 11 is a circle, the adjacent temperature measuring areas are not collinear, at this time the splitting unit is preferably a cutting line, which is convenient for the operator to remove the temperature measuring area 11.

[0051] The through holes 12 or the cutting lines are both convenient for the operator to directly perform a hand tearing operation, thereby improving the temperature measuring efficiency, and after removing part of the flexible substrate 1, it is convenient for the operator to observe the relative position between the edge of the hole of the object and the temperature measuring element 2, thereby ensuring the accuracy of temperature measurement by the temperature measuring element 2.

[0052] It is worth noting that the arrangement of the through holes 12 not only facilitates the operator to tear the flexible substrate 1 by hand, but also can reduce the rigidity of the flexible substrate 1 to some extent, so that the flexible substrate 1 is more easily bent, so that the flexible substrate 1 is better adhered to the surface of the object. The through holes 12 are arranged on the boundary lines of the temperature measuring areas 11, which can ensure that the reduction of the rigidity of the flexible substrate 1 is relatively uniform at all places, which is conducive to the adhesion of the flexible substrate 1 to the surface of the object.

[0053] In order to improve the accuracy of temperature measurement, the temperature of the surface of the object is measured by contact measurement in the embodiment. Specifically, the temperature measuring element 2 is a thermistor, and the thermistor is attached to the corresponding temperature measuring area 11. The thermistor can measure the temperature of the temperature measuring area 11.

[0054] The thermistor is a sensor resistor, and its resistance value changes with temperature. Therefore, by connecting a measuring instrument to both ends of the thermistor to measure the resistance value of the thermistor, the temperature of the thermistor, that is, the temperature of the surface of the object within the temperature measuring area 11, can be accurately determined. Specifically, after the flexible substrate is adhered to the surface of the object, the temperature of a certain point is measured by connecting the measuring instrument to both ends of a certain thermistor, which has a simple structure, low cost and strong pertinence.

[0055] Preferably, the flexible substrate 1 is an FPC board (Flexible Printed Circuit). Each temperature measuring area 11 of the FPC board is provided with a pad, and the thermistor is fixedly connected to the FPC board through the pad. The FPC board has the advantages of being thin, flexible, and having a certain strength. Furthermore, the pads on the FPC board facilitate the soldering and fixing of the thermistor to the FPC board.

[0056] It is worth noting that no traces are provided between adjacent temperature measurement areas 11 on the FPC board to prevent the traces from breaking and affecting the temperature measurement of the thermistor when the flexible substrate 1 is cut or torn by hand.

[0057] like Figure 6 As shown, an adhesive layer 3 is provided on the side of the flexible substrate 1 facing away from the temperature measuring element 2. The adhesive layer 3 can bond the flexible substrate 1 to the surface of the object to be measured. When the surface of the object is curved, the adhesive layer 3 can improve the fit between the flexible substrate 1 and the surface of the object and prevent the flexible substrate 1 from shifting, thereby improving the accuracy of temperature measurement.

[0058] It is understandable that the flexible substrate 1 generally has poor thermal conductivity. When the temperature measuring device 2 measures the temperature of the object surface through the flexible substrate 1, the flexible substrate 1 needs to be attached to the object surface and kept there for a period of time, which results in low measurement efficiency. In addition, the operator cannot guarantee that the temperature of the flexible substrate 1 is consistent with that of the object surface, and the measurement accuracy is also poor.

[0059] To address the aforementioned issues, each temperature measurement zone 11 is provided with a receiving hole 13. The temperature measuring element 2 covers the receiving hole 13, and a heat-conducting element 4 is disposed within the receiving hole 13, abutting against the temperature measuring element 2. The heat-conducting element 4 protrudes from the flexible substrate 1 on the side opposite to the temperature measuring element 2. When the flexible substrate 1 is attached to the surface of an object, the heat-conducting element 4 also abuts against the surface of the object. Since the heat-conducting element 4 is a good conductor of heat, it can quickly transfer the temperature of the object to the temperature measuring element 2 that abuts against the heat-conducting element 4, thereby improving the efficiency and accuracy of temperature measurement.

[0060] Furthermore, the adhesive layer 3 has a clearance hole 31 located opposite the heat-conducting component 4, through which the heat-conducting component 4 passes. By creating the clearance hole 31, the adhesive layer 3 avoids the heat-conducting component 4, ensuring good contact between the heat-conducting component 4 and the object, and ensuring smooth temperature measurement.

[0061] Specifically, the thickness of the adhesive layer 3 is less than or equal to the height of the heat-conducting element 4 protruding from the flexible substrate 1 on the side away from the temperature measuring element 2. The heat-conducting element 4 can pass through the clearance hole 31 and protrude from the adhesive layer 3 to ensure that when the flexible substrate 1 is bonded to the surface of the object by the adhesive layer 3, the heat-conducting element 4 can abut against the surface of the object, thereby ensuring the smooth operation of temperature measurement.

[0062] Preferably, the heat-conducting member 4 can be a heat-conducting patch or a heat-conducting silica gel. Both the heat-conducting patch and the heat-conducting silica gel are good conductors of heat, and can exchange heat quickly so that the heat-conducting patch and the heat-conducting silica gel can quickly reach the same temperature as the surface of the object, so as to enable the temperature measuring member 2 to measure the temperature.

[0063] The embodiment also provides a temperature measuring method, which can utilize the temperature measuring device to measure the temperature of an object, and the temperature measuring method comprises the following steps:

[0064] Obtaining the size of the hole on the surface of the object;

[0065] Removing a plurality of temperature measuring areas 11 of the flexible substrate 1 to form a vacancy, and the size of the vacancy is greater than the size of the hole;

[0066] Attaching the side of the flexible substrate 1, which is away from the temperature measuring member 2, to the object, and locating the hole in the vacancy;

[0067] Measuring the temperature of the corresponding area of the object by using the temperature measuring member 2.

[0068] When the temperature of an object with a hole on the surface needs to be measured, a plurality of temperature measuring areas 11 can be removed from the flexible substrate 1 according to the size of the hole, so that a vacancy is formed in the flexible substrate 1, and the size of the vacancy is slightly greater than the size of the hole of the object. The operator can observe the position of the hole through the vacancy, and adjust the flexible substrate 1 so that the distance between the temperature measuring member 2 around the vacancy and the hole is equal, thereby accurately measuring the temperature distribution on the surface of the object.

[0069] The above is only a preferred embodiment of the present application, and for those skilled in the art, the specific implementation and application range can be changed according to the idea of the present application, and the content of the description should not be understood as a limitation of the present application.

Claims

1. A temperature measuring device, characterized in that, include: A flexible substrate (1) includes multiple temperature measuring areas (11), each of the temperature measuring areas (11) is provided with a temperature measuring element (2), and the temperature measuring elements (2) of the multiple temperature measuring areas (11) are all located on the same side of the flexible substrate (1). The side of the flexible substrate (1) away from the temperature measuring element (2) is used to attach to the object to be tested. The temperature measuring element (2) can measure the temperature of the corresponding position of the object to be tested. The flexible substrate (1) can selectively remove any number of the temperature measuring areas (11) to form vacancies.

2. The temperature measuring device according to claim 1, characterized in that, A splitting unit is provided between two adjacent temperature measuring areas (11), and the two adjacent temperature measuring areas (11) can be split by the splitting unit.

3. The temperature measuring device according to claim 2, characterized in that, The splitting unit is a through hole (12) or a shear line.

4. The temperature measuring device according to claim 1, characterized in that, The temperature measuring element (2) is a thermistor, which is attached to the corresponding temperature measuring area (11) and can measure the temperature of the temperature measuring area (11).

5. The temperature measuring device according to claim 4, characterized in that, The flexible substrate (1) is an FPC board, and each of the temperature measuring areas (11) of the FPC board is provided with a pad. The thermistor is fixedly connected to the FPC board through the pad.

6. The temperature measuring device according to claim 1, characterized in that, An adhesive layer (3) is provided on the side of the flexible substrate (1) away from the temperature measuring element (2), and the adhesive layer (3) can bond the flexible substrate (1) to the surface of the object to be measured.

7. The temperature measuring device according to claim 6, characterized in that, Each of the temperature measuring areas (11) is provided with a receiving hole (13), the temperature measuring element (2) covers the receiving hole (13), and a heat-conducting element (4) is provided in the receiving hole (13) to abut against the temperature measuring element (2). The heat-conducting element (4) protrudes from the flexible substrate (1) on the side away from the temperature measuring element (2).

8. The temperature measuring device according to claim 7, characterized in that, The adhesive layer (3) has a clearance hole (31) at a position opposite to the heat-conducting element (4), and the heat-conducting element (4) passes through the clearance hole (31).

9. The temperature measuring device according to claim 8, characterized in that, The thickness of the adhesive layer (3) is less than or equal to the height of the heat-conducting element (4) protruding from the flexible substrate (1) on the side away from the temperature measuring element (2).

10. A temperature measurement method, characterized in that, The temperature measurement method can measure the temperature of the object to be measured using the temperature measuring device according to any one of claims 1 to 9, and the temperature measurement method includes: The size of the temperature interference area on the surface of the object to be tested is obtained, and the temperature interference area includes a raised structure, a recessed structure and / or a hole; A number of the temperature measurement areas (11) of the flexible substrate (1) are removed to form vacancies, the size of which is greater than or equal to the size of the temperature measurement interference area; The flexible substrate (1) is attached to the side of the temperature measuring element (2) away from the object to be measured, and the temperature interference area is located in the empty space. The temperature of the surface of the object to be tested is measured using the temperature measuring device (2).

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