Substrate processing apparatus and substrate processing method

Abstract

A substrate processing apparatus and a substrate processing method are provided. The substrate processing method includes the steps of: acquiring substrate information; selecting either a liquid replacement step or a concentration adjustment step; a first processing liquid adjustment step, in a case where the liquid replacement step is selected in the selected step, discharging at least a part of the processing liquid of the processing tank from the processing tank when the processing liquid of the processing tank does not satisfy a specific condition, and supplying sulfuric acid and hydrogen peroxide water to the processing tank; a second processing liquid adjustment step, in a case where the concentration adjustment step is selected in the selected step, adjusting the concentration of the processing liquid of the processing tank while circulating the processing liquid of the processing tank through a pipe connected to the processing tank; and immersing the substrate in the processing liquid of the processing tank while circulating the processing liquid of the processing tank adjusted in the first processing liquid adjustment step or the second processing liquid adjustment step through a pipe connected to the processing tank.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus and a substrate processing method. Background Technology

[0002] On the surface of the substrate being processed, such as a semiconductor wafer (hereinafter referred to as a wafer), substances generated during the manufacturing process of semiconductor devices sometimes adhere. Since these substances can degrade the characteristics of semiconductor devices, various chemicals are used to clean the wafer surface in order to remove them.

[0003] SPM solution is used for cleaning wafer surfaces. SPM solution is a mixture of sulfuric acid and hydrogen peroxide solution. Besides stripping residual resist from wafer surfaces and removing residue from substrates after resist ashing, SPM solution is also used as a solution for oxidizing substrates after component separation. SPM solution is used not only in single-wafer processing devices, such as those that supply the solution to the surface of a wafer while it is rotated on a rotating platform, but also in batch processing devices where multiple wafers are simultaneously immersed in a processing tank filled with the solution for cleaning.

[0004] In batch substrate processing equipment using SPM solution to process wafers, typically dozens of wafers are immersed in SPM solution heated to 100°C–130°C. After a specific time, the wafers are removed, and the process of immersing the next wafer is repeated, thereby continuously processing multiple wafers. In this continuous processing, because some of the SPM solution in the processing tank adheres to the wafer surface and is carried out of the processing tank, causing the liquid level to drop, sulfuric acid and hydrogen peroxide water must be added to the SPM solution at specific times.

[0005] Furthermore, hydrogen peroxide is known to be a relatively unstable substance. Since hydrogen peroxide decomposes into water over time, even with the replenishment of sulfuric acid and hydrogen peroxide solution, for example, to adjust the liquid level, the sulfuric acid concentration in the SPM solution will decrease over time. When the sulfuric acid concentration decreases, the ability to remove contaminants decreases, necessitating periodic shutdowns of the wafers in the processing tank and complete replacement of the SPM solution within the tank. This results in reduced processing efficiency and / or increased chemical consumption, leading to higher chemical costs. Therefore, in batch substrate processing apparatuses, efforts are being made to suppress the decrease in the ability to remove contaminants (Patent Document 1).

[0006] In the substrate processing apparatus of Patent Document 1, sulfuric acid is added downstream of the heater in the circulation path. Patent Document 1 describes how adding sulfuric acid downstream of the heater in the circulation path suppresses the decomposition of hydrogen peroxide and carboxylic acid, which are considered helpful for the effective removal of contaminants, by direct heating.

[0007] [Background Technical Documents]

[0008] [Patent Literature]

[0009] [Patent Document 1] Japanese Patent No. 2011-114305 Summary of the Invention

[0010] [The problem the invention aims to solve]

[0011] In the substrate processing apparatus of Patent Document 1, the SPM concentration of the processing tank is adjusted to a fixed value regardless of the type of substrate. However, depending on the type of substrate, there are also cases where the substrate can be properly processed even without strictly adjusting the SPM concentration of the processing tank. In the substrate processing apparatus of Patent Document 1, sulfuric acid and hydrogen peroxide are sometimes used unnecessarily compared to the amount of sulfuric acid and hydrogen peroxide water required for processing the substrate.

[0012] The present invention was made in view of the aforementioned problems, and aims to provide a substrate processing apparatus and a substrate processing method that can avoid the excessive use of sulfuric acid and hydrogen peroxide water.

[0013] [Technical means to solve the problem]

[0014] According to one aspect of the present invention, the substrate treatment method involves immersing the substrate in a treatment tank containing a treatment solution comprising sulfuric acid and hydrogen peroxide to treat the substrate. The substrate processing method includes the following steps: before immersing the substrate in the processing liquid of the processing tank, obtaining substrate information representing information related to the substrate; based on the substrate information, selecting either a liquid replacement step or a concentration adjustment step as a processing liquid adjustment step to adjust the processing liquid; in the first processing liquid adjustment step, if the liquid replacement step is selected in the selected steps, when the processing liquid in the processing tank does not meet specific conditions, discharging at least a portion of the processing liquid in the processing tank from the processing tank, and supplying sulfuric acid and hydrogen peroxide water to the processing tank to adjust the processing liquid in the processing tank; in the second processing liquid adjustment step, if the concentration adjustment step is selected in the selected steps, adjusting the concentration of the processing liquid in the processing tank while circulating the processing liquid in the processing tank through a pipe connected to the processing tank; and immersing the substrate in the processing liquid of the processing tank while circulating the processing liquid in the processing tank after adjustment in the first processing liquid adjustment step or the second processing liquid adjustment step through a pipe connected to the processing tank.

[0015] In one embodiment, if the substrate information indicates that the resist on the substrate has been ashed during the step of obtaining the substrate information, the liquid replacement step is selected during the selected step; if the substrate information indicates that either ion implantation has been performed on the resist on the substrate or element separation has been performed on the substrate during the step of obtaining the substrate information, the concentration adjustment step is selected during the selected step.

[0016] In one embodiment, during the first treatment liquid adjustment step, if the treatment liquid in the treatment tank meets specific conditions, the treatment liquid in the treatment tank is not discharged.

[0017] In one embodiment, the first processing liquid adjustment step includes the following steps: before immersing the substrate, setting the amount of processing liquid discharged from the processing tank based on the elapsed time since the substrate was immersed in the processing liquid in the processing tank.

[0018] In one embodiment, the second treatment liquid adjustment step includes the following steps: adjusting the hydrogen peroxide concentration of the treatment liquid based on the measurement results of a concentration sensor that measures the concentration of the treatment liquid in the treatment tank.

[0019] In one embodiment, the second processing solution adjustment step includes the following steps: supplying hydrogen peroxide water to the processing tank in a manner that increases the hydrogen peroxide concentration of the processing solution before immersing the substrate in the processing solution of the processing tank; and decreasing the hydrogen peroxide concentration of the processing solution of the processing tank after immersing the substrate in the processing solution of the processing tank.

[0020] According to another aspect of the present invention, a substrate processing apparatus comprises: a processing tank for storing a processing solution containing sulfuric acid and hydrogen peroxide; a circulation unit having piping for circulating the processing solution in the processing tank; a drain unit for draining the processing solution from the processing tank; a processing solution supply unit for supplying sulfuric acid and hydrogen peroxide to the processing tank; a substrate holding unit for holding a substrate and immersing the substrate in the processing solution in the processing tank; and a control unit for controlling the circulation unit, the drain unit, the processing solution supply unit, and the substrate holding unit. Before immersing the substrate in the processing liquid of the processing tank, the control unit selects either a liquid replacement step or a concentration adjustment step as the processing liquid adjustment step based on substrate information indicating information related to the substrate. If the liquid replacement step is selected, the control unit controls the draining unit and the processing liquid supply unit to perform the first processing liquid adjustment step. In this first processing liquid adjustment step, if the processing liquid in the processing tank does not meet specific conditions, at least a portion of the processing liquid in the processing tank is discharged from the processing tank, causing the processing liquid supply unit to supply the processing tank with the sulfuric acid and the hydrogen peroxide solution. The processing solution in the processing tank is adjusted; when the concentration adjustment step is selected, the control unit controls the circulation unit and the processing solution supply unit to perform a second processing solution adjustment step, and the concentration of the processing solution is adjusted while circulating the processing solution in the processing tank through the piping of the circulation unit in the second processing solution adjustment step; the control unit controls the circulation unit and the substrate holding unit to immerse the substrate in the processing solution in the processing tank while circulating the processing solution in the processing tank adjusted in the first processing solution adjustment step or the second processing solution adjustment step through the piping of the circulation unit.

[0021] [The effects of the invention]

[0022] According to the present invention, the excessive use of sulfuric acid and hydrogen peroxide water can be avoided. Attached Figure Description

[0023] Figure 1 (a) and (b) are schematic perspective views of the substrate processing apparatus of this embodiment.

[0024] Figure 2 This is a schematic diagram of the substrate processing apparatus of this embodiment.

[0025] Figure 3 This is a schematic block diagram of the substrate processing apparatus of this embodiment.

[0026] Figure 4 This is a flowchart of the substrate processing method of this embodiment.

[0027] Figure 5 (a) to (c) are schematic diagrams illustrating the liquid replacement step in the substrate processing method of this embodiment.

[0028] Figure 6 This is a graph showing the time-varying concentrations of sulfuric acid and hydrogen peroxide in the treatment tank during the liquid replacement step of the substrate treatment method of this embodiment.

[0029] Figure 7 This is a flowchart of the liquid replacement step selected in the substrate processing method of this embodiment.

[0030] Figure 8 (a) to (c) are schematic diagrams illustrating the concentration adjustment step in the substrate processing method of this embodiment.

[0031] Figure 9 This is a graph showing the time-varying concentrations of sulfuric acid and hydrogen peroxide in the treatment tank during concentration adjustment in the substrate treatment method of this embodiment.

[0032] Figure 10 (a) and (b) are graphs showing the time-varying concentrations of sulfuric acid and hydrogen peroxide in the treatment tank during the substrate treatment method of this embodiment.

[0033] Figure 11 This is a flowchart of the concentration adjustment step in the substrate processing method of this embodiment.

[0034] Figure 12 This is a flowchart of the substrate processing method of this embodiment.

[0035] Figure 13 This is a schematic diagram of a substrate processing system equipped with the substrate processing apparatus of this embodiment. Detailed Implementation

[0036] Hereinafter, embodiments of the substrate processing apparatus and substrate processing method of the present invention will be described with reference to the accompanying drawings. Furthermore, the same or equivalent parts in the drawings will be labeled with the same reference numerals without repetition of the description. Additionally, in this specification, for ease of understanding of the invention, mutually orthogonal X-axis, Y-axis, and Z-axis are sometimes described. Typically, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0037] refer to Figure 1 This section describes an embodiment of the substrate processing apparatus 100 of the present invention. Figure 1 (a) and Figure 1 (b) is a schematic perspective view of the substrate processing apparatus 100 of this embodiment. Figure 1 (a) indicates the substrate processing apparatus 100 before the substrate W is placed into the processing tank 110. Figure 1(b) indicates the substrate processing apparatus 100 after the substrate W is placed into the processing tank 110.

[0038] The substrate processing apparatus 100 processes the substrate W. The substrate processing apparatus 100 processes the substrate W by at least one of etching, surface treatment, oxidation treatment, property imparting, processing film formation, removal and washing of at least a portion of the film.

[0039] The substrate W is a relatively thin plate. Typically, the substrate W is a relatively thin, roughly circular plate. Substrate W includes, for example, semiconductor wafers, substrates for liquid crystal displays, substrates for plasma displays, substrates for field emission displays (FEDs), substrates for optical discs, substrates for magnetic disks, substrates for magneto-optical discs, substrates for photomasks, ceramic substrates, and substrates for solar cells.

[0040] The substrate processing apparatus 100 is a batch substrate processing apparatus. The substrate processing apparatus 100 processes multiple substrates W simultaneously. Typically, the substrate processing apparatus 100 processes multiple substrates W in groups. For example, one group contains 25 substrates W.

[0041] like Figure 1 As shown in (a), the substrate processing apparatus 100 includes a processing tank 110, a substrate holding section 120, and a processing liquid supply section 130. The processing tank 110 stores a processing liquid for processing the substrate W. The processing liquid is a mixture containing sulfuric acid and hydrogen peroxide water. The processing liquid supply section 130 supplies the processing liquid to the processing tank 110. For example, the processing liquid supply section 130 supplies sulfuric acid and hydrogen peroxide water to the processing tank 110 respectively. In one example, sulfuric acid and hydrogen peroxide water are mixed in the processing tank 110 to generate the processing liquid. However, the sulfuric acid and hydrogen peroxide water supplied from the processing liquid supply section 130 may also be mixed before reaching the processing tank 110 to generate the processing liquid.

[0042] The substrate holding portion 120 holds the substrate W. The normal direction of the main surface of the substrate W held by the substrate holding portion 120 is parallel to the Y direction. Multiple substrates W are arranged in a row along the Y direction. The multiple substrates W are arranged approximately parallel to the horizontal direction. In addition, the normal of each of the multiple substrates W extends along the Y direction, and each of the multiple substrates W extends approximately parallel to the X and Z directions.

[0043] Typically, the substrate holding section 120 holds multiple substrates W. Here, the substrate holding section 120 holds substrates W arranged in a row along the Y direction. The substrate holding section 120 moves the substrates W while holding them. For example, the substrate holding section 120 moves vertically upward or downward while holding the substrates W.

[0044] Specifically, the substrate holding section 120 includes a lifting section. The substrate holding section 120 moves vertically upward or vertically downward while holding multiple substrates W. By moving the substrate holding section 120 vertically downward, the multiple substrates W held by the substrate holding section 120 are immersed in the processing liquid L stored in the processing tank 110.

[0045] exist Figure 1 In (a), the substrate holding section 120 is located above the processing tank 110. The substrate holding section 120 descends vertically downward (in the Z direction) while holding multiple substrates W. As a result, the multiple substrates W are placed into the processing tank 110.

[0046] like Figure 1 As shown in (b), when the substrate holding section 120 descends to the processing tank 110, multiple substrates W are immersed in the processing liquid within the processing tank 110. The substrate holding section 120 immerses multiple substrates W, which are arranged neatly with specific intervals, in the processing liquid stored in the processing tank 110.

[0047] The processing tank 110 has a double-tank structure. The processing tank 110 has an inner tank 112 and an outer tank 114. The outer tank 114 surrounds the inner tank 112. Both the inner tank 112 and the outer tank 114 have upward-opening upper openings.

[0048] The inner tank 112 and the outer tank 114 each store processing liquid. Multiple substrates W are placed into the inner tank 112. Specifically, multiple substrates W held in the substrate holding section 120 are placed into the inner tank 112. By placing multiple substrates W into the inner tank 112, they are immersed in the processing liquid in the inner tank 112.

[0049] The substrate holding portion 120 includes a body plate 122 and a holding rod 124. The body plate 122 is a plate extending in the vertical direction (Z direction). The holding rod 124 extends from a main surface of the body plate 122 in the horizontal direction (X direction). Figure 1 (a) and Figure 1 In (b), three retaining rods 124 extend horizontally from one main surface of the body plate 122. Multiple substrates W are neatly arranged with a specific interval between them, and are held in an upright (vertical) position by the multiple retaining rods 124 abutting against the lower edge of each substrate W.

[0050] The substrate holding section 120 may further include a lifting unit 126. The lifting unit 126 positions the body plate 122 below the multiple substrates W held on the holding rod 124 within the processing tank 110. Figure 1 (b) shows the position above the processing tank 110, where the multiple substrates W held on the holding rod 124 are located. Figure 1The body plate 122 is moved between the positions shown in (a). Thus, by using the lifting unit 126 to move the body plate 122 to the lower position, the multiple substrates W held on the holding rod 124 are immersed in the processing liquid.

[0051] Multiple substrates W are held by multiple holding rods 124. Specifically, the lower edges of each substrate W abut against the multiple holding rods 124, thus holding the multiple substrates W in an upright (vertical) position. More specifically, the multiple substrates W held by the substrate holding portion 120 are arranged neatly with spacing along the Y direction. Therefore, the multiple substrates W are arranged in a row along the Y direction. Furthermore, each of the multiple substrates W is held in the substrate holding portion 120 in a position substantially parallel to the XZ plane.

[0052] The lifting unit 126 raises and lowers the body plate 122 and the holding rod 124. By raising and lowering the body plate 122 and the holding rod 124, the body plate 122 and the holding rod 124 move vertically upwards or downwards while holding multiple substrates W. The lifting unit 126 has a drive source and a lifting mechanism. The drive source drives the lifting mechanism to raise and lower the body plate 122 and the holding rod 124. The drive source includes, for example, a motor. The lifting mechanism includes, for example, a rack / pinion mechanism or a ball screw.

[0053] More specifically, the lifting unit 126 positions the substrate holding portion 120 in the processing position. Figure 1 (b) shows the position and the retreat position ( Figure 1 It rises and falls between the positions shown in (a). Figure 1 As shown in (b), when the substrate holding section 120 moves vertically downwards (in the Z direction) to the processing position while holding multiple substrates W, the multiple substrates W are placed into the inner tank 112. Specifically, the multiple substrates W held in the substrate holding section 120 move into the inner tank 112. As a result, the multiple substrates W are immersed in the processing liquid within the inner tank 112 and processed by the processing liquid. On the other hand, as... Figure 1 As shown in (a), when the substrate holding part 120 moves to the retracted position, the multiple substrates W held in the substrate holding part 120 move above the inner tank 112 and are lifted out of the processing liquid.

[0054] Next, refer to Figure 1 and Figure 2 This describes the substrate processing apparatus 100 of this embodiment. Figure 2 This is a schematic diagram of the substrate processing apparatus 100 of this embodiment.

[0055] like Figure 2As shown, the substrate processing apparatus 100 includes a processing tank 110, a substrate holding section 120, a processing liquid supply section 130, a circulation section 140, a drain section 150, and a control device 180. The control device 180 controls the substrate holding section 120, the processing liquid supply section 130, the circulation section 140, and the drain section 150.

[0056] The processing tank 110 stores the processing liquid L. The substrate holding section 120 holds the substrate W. The substrate holding section 120 includes a lifting section. Multiple substrates W can be immersed together in the processing liquid L stored in the processing tank 110 via the substrate holding section 120.

[0057] The treatment liquid supply unit 130 supplies treatment liquid to the treatment tank 110. The treatment liquid supply unit 130 includes a sulfuric acid supply unit 132 and a hydrogen peroxide supply unit 134. The sulfuric acid supply unit 132 supplies sulfuric acid to the treatment tank 110. The hydrogen peroxide supply unit 134 supplies hydrogen peroxide water to the treatment tank 110.

[0058] As described above, hydrogen peroxide decomposes into water over time. Therefore, in order to maintain a constant concentration of the treatment solution in the treatment tank 110, sulfuric acid supply unit 132 and hydrogen peroxide supply unit 134 supply sulfuric acid and hydrogen peroxide water to the treatment tank 110. Typically, the amount of sulfuric acid supplied per unit time from sulfuric acid supply unit 132 is greater than the amount of hydrogen peroxide water supplied per unit time from hydrogen peroxide supply unit 134. For example, the ratio of the amount (volume) of sulfuric acid supplied to the amount (volume) of hydrogen peroxide water supplied is 5:1 to 10:1.

[0059] The circulation section 140 circulates the processing liquid L stored in the processing tank 110. While the circulation section 140 circulates the processing liquid L in the processing tank 110, the processing liquid is heated to a specific temperature. Furthermore, while the circulation section 140 circulates the processing liquid L in the processing tank 110, the processing liquid can be filtered to remove impurities from it.

[0060] The drain section 150 discharges the treatment liquid L stored in the treatment tank 110. The treatment liquid in the treatment tank 110 can be discharged through the drain section 150. In addition, while the drain section 150 discharges the treatment liquid L stored in the treatment tank 110, the sulfuric acid supply section 132 and the hydrogen peroxide supply section 134 supply sulfuric acid and hydrogen peroxide water to the treatment tank 110, thereby allowing the treatment liquid L stored in the treatment tank 110 to be replaced with new treatment liquid.

[0061] As described above, treatment tank 110 stores treatment solution L. Treatment solution L is a mixture of sulfuric acid and hydrogen peroxide solution. In treatment solution L, the concentration (mass concentration) of sulfuric acid is 80% or more and 90% or less, and the concentration (mass concentration) of hydrogen peroxide is 0.8% or more and 2.0% or less.

[0062] Here, the processing tank 110 has a double-tank structure. The processing tank 110 has an inner tank 112 and an outer tank 114. The inner tank 112 and the outer tank 114 each have an upward-opening upper opening. The inner tank 112 is configured to store the processing liquid L and accommodate multiple substrates W. The outer tank 114 is disposed on the outer side of the upper opening of the inner tank 112. The upper edge of the outer tank 114 is higher than the upper edge of the inner tank 112.

[0063] The processing tank 110 also has a cover 116. The cover 116 can be opened and closed relative to the upper opening of the inner tank 112. By closing the cover 116, the upper opening of the inner tank 112 can be closed.

[0064] The cover 116 has an opening portion 116a and an opening portion 116b. The opening portion 116a is located on one side of the upper opening of the inner groove 112 in the X direction. The opening portion 116a is disposed near the upper edge of the inner groove 112 and can be opened and closed relative to the upper opening of the inner groove 112. The opening portion 116b is located on the other side of the upper opening of the inner groove 112 in the X direction. The opening portion 116b is disposed near the upper edge of the inner groove 112 and can be opened and closed relative to the upper opening of the inner groove 112. By closing the opening portions 116a and 116b to cover the upper opening of the inner groove 112, the inner groove 112 of the processing tank 110 can be sealed.

[0065] The substrate holding section 120 holds the substrate W. The substrate holding section 120 moves vertically upward or vertically downward while holding the substrate W. As the substrate holding section 120 moves vertically downward, the substrate W held by the substrate holding section 120 is immersed in the processing liquid L stored in the inner tank 112.

[0066] The substrate holding section 120 includes a body plate 122 and holding rods 124. The body plate 122 is a plate extending in the vertical direction (Z direction). The holding rods 124 extend from one main surface of the body plate 122 in the horizontal direction (X direction). Here, three holding rods 124 extend from one main surface of the body plate 122 in the Y direction. With multiple substrates W arranged in a near-forward direction along the plane of the paper, the multiple holding rods 124 abut against the lower edge of each substrate W, thereby holding the multiple substrates W in an upright position (vertical position).

[0067] The substrate holding portion 120 may further include a lifting unit 126. The lifting unit 126 moves the body plate 122 to a processing position where the substrate W held in the substrate holding portion 120 is located within the inner groove 112. Figure 2 The substrate W is moved between the position shown and the retracted position (not shown) above the inner tank 112, where it is held in the substrate holding portion 120. Therefore, by using the lifting unit 126 to move the body plate 122 to the processing position, multiple substrates W held on the holding rod 124 are immersed in the processing liquid. Thus, the substrates W are processed.

[0068] The sulfuric acid supply unit 132 includes a pipe 132a and a valve 132b. Sulfuric acid is sprayed from one end of the pipe 132a into the treatment tank 110. The pipe 132a is connected to a sulfuric acid supply source. The valve 132b is installed in the pipe 132a. The supply of sulfuric acid to the treatment tank 110 can be controlled by the valve 132b. When the valve 132b is opened according to the control device 180, the sulfuric acid is supplied to the treatment tank 110 through the pipe 132a. In the treatment tank 110, the sulfuric acid is mixed with the treatment liquid in the treatment tank 110.

[0069] For example, sulfuric acid sprayed from pipe 132a is supplied to inner tank 112. When the treated liquid overflows from the upper edge of inner tank 112, the overflowing treated liquid is caught and recovered by outer tank 114. Here, sulfuric acid is sprayed into inner tank 112. One end of pipe 132a that supplies sulfuric acid from sulfuric acid supply section 132 to inner tank 112 can be installed in inner tank 112.

[0070] The hydrogen peroxide supply unit 134 includes a pipe 134a and a valve 134b. Hydrogen peroxide water is sprayed from one end of the pipe 134a into the treatment tank 110. The pipe 134a is connected to a hydrogen peroxide water supply source. The valve 134b is disposed in the pipe 134a. The supply of hydrogen peroxide water to the treatment tank 110 can be controlled by the valve 134b. When the valve 134b is opened according to the control device 180, the hydrogen peroxide water supplied through the pipe 134a is supplied to the treatment tank 110. In the treatment tank 110, the hydrogen peroxide water mixes with the treatment liquid in the treatment tank 110.

[0071] For example, hydrogen peroxide water sprayed from pipe 134a is supplied to the inner tank 112. When the treatment liquid overflows from the upper edge of the inner tank 112, the overflowing treatment liquid is caught and recycled by the outer tank 114. Here, hydrogen peroxide water is sprayed into the inner tank 112. One end of the pipe 134a that supplies hydrogen peroxide water from the hydrogen peroxide supply unit 134 to the inner tank 112 can be arranged in the inner tank 112.

[0072] The circulation unit 140 includes a piping 141, a pump 142, a filter 143, a heater 144, a regulating valve 145, a valve 146, and a circulating fluid supply pipe 148. The pump 142, filter 143, heater 144, regulating valve 145, and valve 146 are arranged sequentially from upstream to downstream of the piping 141.

[0073] Pipe 141 guides the treated liquid discharged from the treated tank 110 back into the treated tank 110. Specifically, the upstream end of pipe 141 is located in the outer tank 114, and the downstream end of pipe 141 is located in the inner tank 112. The downstream end of pipe 141 is connected to the circulating liquid supply pipe 148 located in the inner tank 112.

[0074] Pump 142 delivers the treatment fluid from piping 141 to circulating fluid supply piping 148. Filter 143 filters the treatment fluid flowing through piping 141. Filter 143 removes particulate matter and other foreign objects from the treatment fluid flowing through piping 141.

[0075] Heater 144 heats the processing liquid flowing through piping 141. The temperature of the processing liquid is adjusted by heater 144. Heater 144 heats the processing liquid flowing through piping 141 to adjust it to a processing temperature (e.g., approximately 100°C to 120°C). Heater 144 may also heat the processing liquid and measure its temperature. In this case, heater 144 has both a heating section and a temperature measuring section.

[0076] Adjusting valve 145 regulates the opening of piping 141, thereby adjusting the flow rate of the processed fluid supplied to circulating fluid supply pipe 148. Adjusting valve 145 adjusts the flow rate of the processed fluid. Adjusting valve 145 includes a valve body (not shown) with an internal valve seat, a valve body that opens and closes the valve seat, and an actuator (not shown) that moves the valve body between an open and closed position. The same applies to other adjusting valves. Valve 146 opens and closes piping 141. Alternatively, adjusting valve 145 may be omitted. In this case, the flow rate of the processed fluid supplied to circulating fluid supply pipe 148 is adjusted by controlling pump 142.

[0077] A circulating fluid supply pipe 148 is disposed in the inner tank 112. Here, the circulating fluid supply pipe 148 is disposed at the bottom of the inner tank 112 of the processing tank 110. The circulating fluid supply pipe 148 is disposed within the processing fluid L stored in the inner tank 112. The circulating fluid supply pipe 148 supplies the circulated processing fluid to the inner tank 112.

[0078] The drainage section 150 includes a drainage pipe 151, a valve 152, a drainage pipe 153, a valve 154, and a valve 155. The treatment liquid in the inner tank 112 is discharged through the drainage pipe 151 and the valve 152. The treatment liquid in the outer tank 114 is discharged through the drainage pipe 153, the valve 154, and the valve 155.

[0079] A drain pipe 151 is connected to the bottom wall of the inner tank 112. A valve 152 is installed in the drain pipe 151. The valve 152 is opened and closed by a control device 180. When the valve 152 is opened, the treatment liquid stored in the inner tank 112 is discharged to the outside through the drain pipe 151. The discharged treatment liquid is transported to a drain treatment device (not shown) for treatment.

[0080] A drain pipe 153 is connected to piping 141. Here, the drain pipe 153 is connected to piping 141 downstream of pump 142. A valve 154 is located downstream of the connection point with drain pipe 153 in piping 141. Valve 155 is located in drain pipe 153. By opening valve 154 and closing valve 155, the treatment liquid in treatment tank 110 can be returned to treatment tank 110 through piping 141, thus circulating the treatment liquid in treatment tank 110. Alternatively, by closing valve 154 and opening valve 155, the treatment liquid in treatment tank 110 can be discharged through piping 141 and drain pipe 153.

[0081] in addition, Figure 2 To avoid making the accompanying drawings too complicated, one regulating valve 145 and one valve 146 are shown, but at least one of the regulating valves 145 and 146 may also be provided in multiples.

[0082] The control device 180 is configured, for example, using a microcomputer. The control device 180 includes an arithmetic unit such as a central processing unit (CPU), a storage unit such as a fixed-function memory device and a hard disk drive, and an input / output unit. The storage unit stores the programs executed by the arithmetic unit.

[0083] Next, refer to Figures 1-3 This section describes an embodiment of the substrate processing apparatus 100 of the present invention. Figure 3 This is a schematic block diagram of the substrate processing apparatus 100 of this embodiment.

[0084] like Figure 3 As shown, the control device 180 includes a control unit 182 and a storage unit 184. The control unit 182 controls the operation of each part of the substrate processing apparatus 100.

[0085] The control unit 182 includes a processor. The processor may have, for example, a central processing unit (CPU). Alternatively, the processor may also have a general-purpose arithmetic unit.

[0086] Storage unit 184 stores data and computer programs. Storage unit 184 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. Storage unit 184 may also include removable media. The processor of control unit 182 executes the computer program stored in storage unit 184 to perform a substrate processing method.

[0087] The control device 180 controls the substrate holding section 120, sulfuric acid supply section 132, hydrogen peroxide supply section 134, circulation section 140, and drainage section 150 according to a preset program. Specifically, the control device 180 controls the operation of the lifting unit 126, pump 142, filter 143, heater 144, etc. Furthermore, the control device 180 controls the opening and closing of valves 132b, 134b, 146, 152, 154, and 155. In addition, the control device 180 controls the opening adjustment of the regulating valve 145.

[0088] The substrate processing apparatus 100 has a concentration sensor 162. The concentration sensor 162 measures the concentration of sulfuric acid and hydrogen peroxide in the processing solution in the processing tank 110.

[0089] For example, a concentration sensor 162 is installed in the treatment tank 110. The concentration sensor 162 measures a value representing the specific gravity of the treatment liquid stored in the treatment tank 110. The concentration sensor 162 also measures the back pressure of the treatment tank 110.

[0090] For example, the front end of the concentration sensor 162 is positioned at a specific depth from the surface of the treated liquid in the treatment tank 110. Gas is supplied to the front end of the concentration sensor 162, forming bubbles within the treated liquid in the treatment tank 110. The hydraulic pressure of the treated liquid stored in the treatment tank 110 is thus detected as the gas pressure at the front end of the concentration sensor 162, positioned at a specific depth from the surface of the liquid in the treatment tank 110. Nitrogen gas is typically used as the gas. By pre-measuring the relationship between the gas pressure and the sulfuric acid and hydrogen peroxide concentrations of the treated liquid, and by creating a reference table showing the relationship between gas pressure and the treated liquid, the specific gravity of the treated liquid can be measured based on the gas pressure at which bubbles are formed.

[0091] Furthermore, the control unit 182 functions as a substrate information acquisition unit 182a and a processing liquid adjustment step selection unit 182b by executing a computer program stored in the storage unit 184. Therefore, the control unit 182 includes a substrate information acquisition unit 182a and a processing liquid adjustment step selection unit 182b.

[0092] The substrate information acquisition unit 182a acquires substrate information representing information related to the substrate W before the substrate processing apparatus 100 processes the substrate W. The substrate information may also represent processing performed before the substrate W is moved into the substrate processing apparatus 100.

[0093] The processing solution adjustment step selection unit 182b selects whether to perform a liquid replacement step or a concentration adjustment step as the processing solution adjustment step for adjusting the processing solution in the processing tank 110. The processing solution adjustment step selection unit 182b selects either the liquid replacement step or the concentration adjustment step based on the substrate information. The liquid replacement step and the concentration adjustment step will be described later.

[0094] Furthermore, the control unit 182 functions as a processing fluid information acquisition unit 182c by executing a computer program stored in the storage unit 184. Therefore, the control unit 182 includes the processing fluid information acquisition unit 182c. The processing fluid information acquisition unit 182c acquires processing fluid information representing information related to the processing fluid in the processing tank 110. For example, the processing fluid information acquisition unit 182c acquires processing fluid information based on the measurement results of the concentration sensor 162.

[0095] Next, refer to Figures 1-4 This describes the substrate processing method of this embodiment. Figure 4 This is a flowchart of the substrate processing method of this embodiment.

[0096] like Figure 4 As shown, in step S10, substrate information representing information related to the substrate processed by the substrate processing apparatus 100 is obtained. For example, the substrate information acquisition unit 182a obtains the substrate information from the storage unit 184.

[0097] For example, substrate information indicates the treatment performed on substrate W before it is transferred to substrate processing apparatus 100. In one example, substrate information indicates that substrate W has been ashed with a etchant before being transferred to substrate processing apparatus 100. Alternatively, substrate information indicates that substrate W has been ion implanted with a etchant before being transferred to substrate processing apparatus 100. Or, substrate information indicates that substrate W is in its state before being oxidized for device separation.

[0098] In step S20, a processing solution adjustment step is selected. Based on the substrate information, the control unit 182 selects either a liquid replacement step or a concentration adjustment step as the processing solution adjustment step. For example, the processing solution adjustment step selection unit 182b selects either a liquid replacement step or a concentration adjustment step.

[0099] For example, if the substrate W is one that can be properly processed even when the concentration range of the processing liquid required to properly process the substrate to be processed by the substrate processing apparatus 100 is set relatively loosely, the control unit 182 selects a liquid replacement step as the processing liquid adjustment step. As an example, when processing a substrate to remove residue from a substrate that has already been ashed with an resist, the substrate can be properly processed even when the concentration range of the processing liquid is set relatively loosely. Therefore, when the substrate has already been ashed with an resist, the control unit 182 selects a liquid replacement step.

[0100] On the other hand, if the substrate W is one that cannot be properly processed unless the concentration range of the processing solution required for properly processing the substrate is set relatively narrowly, the control unit 182 selects a concentration adjustment step as the processing solution adjustment step. For example, if the substrate W has ion-implanted resist, the resist cannot be properly removed or stripped unless the concentration range of the processing solution is set relatively strictly. Therefore, if the substrate W is a substrate with ion-implanted resist, the control unit 182 selects a concentration adjustment step.

[0101] Alternatively, if the substrate is oxidized after component separation, it is impossible to properly treat the substrate unless the concentration range of the treatment solution is set relatively strictly. Therefore, when the substrate W is an oxidized substrate after component separation, the control unit 182 selects a concentration adjustment step.

[0102] Thus, based on the substrate information, the control unit 182 selects either a liquid replacement step or a concentration adjustment step for the processing solution in the processing tank 110. Typically, the control unit 182 selects the processing solution adjustment step based on the substrate information before the target substrate arrives at the substrate processing apparatus 100.

[0103] If the liquid replacement step is selected in step S20, the process proceeds to step S30. On the other hand, if the concentration adjustment step is selected in step S20, the process proceeds to step S40.

[0104] In step S30, a liquid replacement step is performed. This liquid replacement step adjusts the treatment fluid in the treatment tank 110. In this specification, the adjustment of the treatment fluid when selecting the liquid replacement step is sometimes described as the first treatment fluid adjustment step.

[0105] In this case, it is determined whether the treatment solution in the treatment tank 110 meets the criteria. The criteria may be set based on the sulfuric acid concentration and / or hydrogen peroxide concentration of the treatment solution in the treatment tank 110.

[0106] Alternatively, the reference may be set based on the time elapsed since the processing liquid in the processing tank 110 was replaced. Alternatively, the reference may be set based on the number of substrates W to be processed after the processing liquid in the processing tank 110 is replaced. The reference may also be set based on the time elapsed since the previous substrate was immersed in the processing liquid in the processing tank 110.

[0107] If the treatment liquid in the treatment tank 110 meets the reference, the treatment liquid in the treatment tank 110 is not discharged. However, even in this case, in order to maintain the hydrogen peroxide concentration through the decomposition of hydrogen peroxide water, the hydrogen peroxide supply unit 134 can continuously supply hydrogen peroxide water to the treatment tank 110 at a fixed amount.

[0108] On the other hand, if the processing liquid in the processing tank 110 does not meet the standard, at least a portion of the processing liquid in the processing tank 110 is replaced. In this case, at least a portion of the processing liquid in the processing tank 110 is discharged, while processing liquid is supplied to the processing tank 110.

[0109] In one example, when discharging the processing liquid from the processing tank 110, the processing liquid from the outer tank 114 is also discharged. In this case, the control unit 182 drives the pump 142, opens the valve 155, and closes the valve 154. This allows the processing liquid from the outer tank 114 to be discharged. Additionally, the processing liquid from the inner tank 112 is also discharged. For example, the control unit 182 discharges the processing liquid from the inner tank 112 by opening the valve 152.

[0110] Additionally, a treatment solution is supplied to the treatment tank 110. In this case, the treatment solution supply unit 130 supplies treatment solution to the treatment tank 110. For example, the sulfuric acid supply unit 132 supplies sulfuric acid to the treatment tank 110. The hydrogen peroxide supply unit 134 supplies hydrogen peroxide solution to the treatment tank 110. This adjusts the treatment solution in the treatment tank 110. The sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 supply sulfuric acid and hydrogen peroxide solution respectively to achieve a specific concentration ratio in the treatment solution containing sulfuric acid and hydrogen peroxide solution supplied to the treatment tank 110. In this case, the temperature of the treatment solution rises due to the reaction with the sulfuric acid and hydrogen peroxide solution.

[0111] Additionally, to maintain the treatment solution at a specific temperature, heating can be performed while circulating the treatment solution by driving pump 142 and heater 144. In this case, heater 144 heats the treatment solution as needed. For example, if the temperature of the treatment solution is below a specific temperature, heater 144 heats the treatment solution to raise it to the specific temperature. On the other hand, when the temperature of the treatment solution rises above the specific temperature due to the reaction with sulfuric acid and hydrogen peroxide water, heater 144 stops heating the treatment solution by lowering it back to the temperature of the treatment solution. Next, the process proceeds to step S50A.

[0112] In step S50A, the substrate W is immersed in the processing solution of the processing tank 110. Then, the substrate W is removed from the processing solution of the processing tank 110. The substrate processing is then complete.

[0113] In step S40, a concentration adjustment step is performed. This concentration adjustment step adjusts the treatment solution in the treatment tank 110. In this specification, the adjustment of the treatment solution when the concentration adjustment step is selected is sometimes described as the second treatment solution adjustment step.

[0114] In this case, the concentration of the treatment solution in the treatment tank 110 is adjusted. For example, the concentration of hydrogen peroxide in the treatment solution of the treatment tank 110 is adjusted. In one example, the concentration of hydrogen peroxide in the treatment solution of the treatment tank 110 is increased.

[0115] Alternatively, the sulfuric acid concentration in the treatment solution of treatment tank 110 can be adjusted. In one example, the sulfuric acid concentration in the treatment solution of treatment tank 110 is increased.

[0116] Typically, the treatment solution supply unit 130 supplies treatment solution to the treatment tank 110. For example, the sulfuric acid supply unit 132 supplies sulfuric acid to the treatment tank 110. The hydrogen peroxide supply unit 134 supplies hydrogen peroxide solution to the treatment tank 110. The sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 supply sulfuric acid and hydrogen peroxide solution to the treatment tank 110 in a specific concentration ratio.

[0117] For example, when increasing the concentration of hydrogen peroxide in the treatment liquid of the treatment tank 110, the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 supply sulfuric acid and hydrogen peroxide water in such a way that the concentration of hydrogen peroxide in the treatment tank 110 is increased by increasing the proportion of hydrogen peroxide water.

[0118] In this case, the treatment liquid in the treatment tank 110 is circulated. Here, in order to maintain the treatment liquid at a specific temperature, the treatment liquid can also be heated while being circulated by driving the pump 142 and the heater 144.

[0119] The control unit 182 supplies sulfuric acid and hydrogen peroxide solution until the sulfuric acid concentration and / or hydrogen peroxide concentration measured by the concentration sensor 162 reaches a specific concentration. Furthermore, the control unit 182 supplies sulfuric acid and hydrogen peroxide solution in a manner that maintains the sulfuric acid concentration and / or hydrogen peroxide concentration measured by the concentration sensor 162 at a specific concentration. Thus, the control unit 182 can use the concentration sensor 162 to adjust the sulfuric acid concentration and / or hydrogen peroxide concentration through feedback control. The concentration adjustment is performed moment before immersing the substrate W in the processing tank 110; if the substrate W is not immersed in the processing tank 110 during a specific period, it is preferable not to perform concentration adjustment. Next, the process proceeds to step S50B.

[0120] In step S50B, the substrate is immersed in a processing solution with adjusted hydrogen peroxide concentration. Then, the substrate W is removed from the processing solution in processing tank 110. The substrate processing is then complete.

[0121] According to this embodiment, the substrate is treated with a processing solution adjusted in different ways depending on the substrate W. For example, if the substrate to be processed in the substrate processing apparatus 100 can be processed with a processing solution adjusted to a relatively loose concentration range, the processing solution in the processing tank 110 is adjusted during the liquid replacement step. Therefore, the processing solution in the processing tank 110 is replaced only when the standard is not met. This reduces the frequency of processing solution replacement in the processing tank 110 and lowers the cost of the processing solution. Furthermore, if the substrate to be processed in the substrate processing apparatus 100 requires processing with a processing solution adjusted to a relatively strict concentration range, the processing solution in the processing tank 110 is adjusted during the concentration adjustment step. This avoids maintaining the processing solution in the processing tank 110 in a concentrated state before the substrate is introduced, and allows for proper processing of the introduced substrate. Therefore, according to this embodiment, excessive use of sulfuric acid and hydrogen peroxide water can be avoided depending on the substrate W.

[0122] Next, refer to Figures 1-5 This describes the liquid replacement step of the substrate processing apparatus 100 in this embodiment. Figure 5 (a)~ Figure 5 (c) is a schematic diagram illustrating the liquid replacement step in the substrate processing method of this embodiment.

[0123] like Figure 5 As shown in (a), a processing liquid is stored in a processing tank 110. Here, a fixed amount of processing liquid is stored in each of the inner tank 112 and the outer tank 114. As described above, the processing liquid overflowing from the inner tank 112 flows into the outer tank 114. The fixed amount in the inner tank 112 is set to the maximum amount in the container of the inner tank 112.

[0124] The metering of the outer tank 114 is set to be less than the maximum amount of the container in the outer tank 114. When more than the metering amount of treatment liquid flows into the outer tank 114, the control unit 182 drives the pump 142 to make the treatment liquid in the outer tank 114 flow out to the outside.

[0125] like Figure 5 (b) shows the discharge of the processing liquid from the processing tank 110. For example, when discharging the processing liquid from the inner tank 112, the control unit 182 opens the valve 152 to discharge the processing liquid from the inner tank 112.

[0126] In addition, when the processing liquid in the outer tank 114 is discharged, the control unit 182 drives the pump 142 and closes the valve 154 and opens the valve 155 to discharge the processing liquid in the outer tank 114.

[0127] The amount of treatment fluid discharged from treatment tank 110 can also be set based on the time elapsed since the last fluid replacement. For example, if the time elapsed since the last fluid replacement is relatively long, the amount of treatment fluid discharged from treatment tank 110 will be set to be relatively large. Conversely, if the time elapsed since the last fluid replacement is relatively short, the amount of treatment fluid discharged from treatment tank 110 will be set to be relatively small.

[0128] Alternatively, the amount of processing liquid discharged from the processing tank 110 can be set according to the time elapsed since the last substrate immersion. If the time elapsed since the last substrate immersion is relatively long, the amount of processing liquid discharged from the processing tank 110 will be set to be relatively large. Conversely, if the time elapsed since the last substrate immersion is relatively short, the amount of processing liquid discharged from the processing tank 110 will be set to be relatively small.

[0129] Typically, when the treatment liquid is discharged from the treatment tank 110, the treatment liquid in the treatment tank 110 is not circulated. However, it is also possible to circulate the treatment liquid in the treatment tank 110 while discharging the treatment liquid from the treatment tank 110.

[0130] like Figure 5 As shown in (c), the treatment liquid supply unit 130 supplies treatment liquid to the treatment tank 110. Specifically, the sulfuric acid supply unit 132 supplies sulfuric acid to the treatment tank 110. Additionally, the hydrogen peroxide supply unit 134 supplies hydrogen peroxide solution to the treatment tank 110. In this case, the control unit 182 controls the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 to supply sulfuric acid and hydrogen peroxide solution to the treatment tank 110 respectively.

[0131] After the processing fluid is supplied to the processing tank 110, the processing fluid in the processing tank 110 is circulated through the circulation section 140. For example, the control unit 182 drives the pump 142 to open the adjusting valves 145 and 146, and opens the valve 154 to close the valve 155, thereby causing the processing fluid in the processing tank 110 to circulate from the processing tank 110 to the processing tank 110 through the piping 141. In addition, the control unit 182 drives the heater 144 to heat the processing fluid flowing through the piping 141.

[0132] At this time, in order to maintain the treatment liquid in the treatment tank 110, the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 can supply sulfuric acid and hydrogen peroxide water to the treatment tank 110. The ratio of the amount of sulfuric acid supplied from the sulfuric acid supply unit 132 to the amount of hydrogen peroxide water supplied from the hydrogen peroxide supply unit 134 is the same as before the liquid was replaced.

[0133] As described above, the processing liquid in the processing tank 110 can be adjusted by liquid replacement. According to this embodiment, a portion of the processing liquid in the processing tank 110 can be discharged, and processing liquid can be supplied to the processing tank 110. Therefore, the processing liquid in the processing tank 110 can be quickly adjusted to processing conditions suitable for substrate processing. Furthermore, since the processing liquid in the processing tank 110 is not completely discarded, substrate processing costs can be reduced.

[0134] Next, refer to Figures 1-6 This section explains the liquid replacement step in the substrate processing method of this embodiment. Figure 6 This is a graph showing the time-varying concentrations of sulfuric acid and hydrogen peroxide in the processing tank 110 during the liquid replacement step in the substrate processing method of this embodiment. Figure 6 In the diagram, line Lsp represents the time-varying concentration of sulfuric acid. Line Lhp represents the time-varying concentration of hydrogen peroxide.

[0135] As shown in line Lsp, the sulfuric acid concentration is roughly constant before Pp during the liquid replacement period. However, strictly speaking, the sulfuric acid concentration gradually decreases over time. This is because water is produced by the reaction and decomposition of hydrogen peroxide water and sulfuric acid in treatment tank 110.

[0136] During liquid replacement Pp, at least a portion of the treatment liquid in treatment tank 110 is discharged. Additionally, during liquid replacement Pp, sulfuric acid and hydrogen peroxide water are resupplyed to treatment tank 110. Typically, after the discharge of treatment liquid from treatment tank 110 begins, new treatment liquid is supplied to treatment tank 110. However, the discharge and supply of treatment liquid from treatment tank 110 can also be carried out at any time.

[0137] After the liquid replacement period (Pp), the sulfuric acid concentration increased compared to before the liquid replacement period (Pp). Subsequently, the sulfuric acid concentration gradually decreased over time.

[0138] As shown in line Lhp, the hydrogen peroxide concentration is approximately constant before Pp during the liquid replacement period. However, strictly speaking, the hydrogen peroxide concentration gradually decreases over time. This is because the hydrogen peroxide water reacts with sulfuric acid in treatment tank 110 to decompose and produce water.

[0139] After the liquid replacement period (Pp) ended, the hydrogen peroxide concentration increased compared to before the liquid replacement period (Pp). Subsequently, the hydrogen peroxide concentration decreased over time.

[0140] In addition, Figure 6 During the liquid replacement period Pp, the processing liquid in the processing tank 110 is heated while circulating through the circulation section 140. Alternatively, the processing liquid in the processing tank 110 can be heated while circulating through the circulation section 140 during the liquid replacement period Pp.

[0141] Next, refer to Figures 1 to 7 This describes the substrate processing method of this embodiment. Figure 7 This is a flowchart of the liquid replacement step selected in the substrate processing method of this embodiment.

[0142] like Figure 7 As shown, in step S102, it is determined whether the substrate W processed by the substrate processing apparatus 100 is the target substrate for the liquid replacement step. For example, if the substrate W is a substrate that has been ashed with an resist, the control unit 182 determines that the substrate W is the target substrate for the liquid replacement step. Typically, the control unit 182 determines whether the substrate W is the target substrate before the substrate arrives at the substrate processing apparatus 100.

[0143] If the substrate W is not the target substrate (No in step S102), the process returns to step S102. On the other hand, if the substrate W is the target substrate (Yes in step S102), the process proceeds to step S104.

[0144] In step S104, it is determined whether the processing liquid in the processing tank 110 meets a specific reference. This specific reference is set as an indicator that the substrate W can be properly processed without adjusting the processing liquid in the processing tank 110. If the processing liquid in the processing tank 110 meets the specific reference, the processing liquid in the processing tank 110 is not discharged. On the other hand, if the processing liquid in the processing tank 110 does not meet the specific reference, the processing liquid in the processing tank 110 is discharged and adjustments are made.

[0145] A specific benchmark can be set based on the concentration of the processing liquid in the processing tank 110. For example, the specific benchmark is set based on the concentration of hydrogen peroxide in the processing liquid of the processing tank 110. In one example, if the concentration of hydrogen peroxide in the processing liquid of the processing tank 110 is above a specific value, the control unit 182 determines that the specific benchmark is met. On the other hand, if the concentration of hydrogen peroxide in the processing liquid of the processing tank 110 is below a specific value, the control unit 182 determines that the specific benchmark is not met.

[0146] If the processing liquid in the processing tank 110 meets a specific standard (yes in step S104), the processing proceeds to step S112. On the other hand, if the processing liquid in the processing tank 110 does not meet the specific standard (no in step S104), the processing proceeds to step S106.

[0147] In step S106, the processing liquid in the processing tank 110 is discharged. At least a portion of the processing liquid stored in the processing tank 110 is discharged. The control unit 182 discharges the processing liquid in the outer tank 114 by driving the pump 142, opening valve 154 and closing valve 155. In addition, the control unit 182 discharges the processing liquid in the inner tank 112 by opening valve 152.

[0148] In step S108, a treatment solution is supplied to the treatment tank 110. The treatment solution supply unit 130 supplies the treatment solution to the treatment tank 110. Under the control of the control unit 182, the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 supply sulfuric acid and hydrogen peroxide water to the treatment tank 110.

[0149] In step S110, the supply of treatment liquid to the treatment tank 110 is stopped. According to the control of the control unit 182, the supply of sulfuric acid and hydrogen peroxide water from the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 to the treatment tank 110 is stopped.

[0150] In step S112, the processing liquid in the processing tank 110 is circulated while being heated. Under the control of the control unit 182, the pump 142 is driven and the adjusting valves 145 and 146 are opened, while valve 154 is opened and valve 155 is closed, thereby causing the processing liquid in the processing tank 110 to circulate from the processing tank 110 back to the processing tank 110 via the piping 141. Additionally, under the control of the control unit 182, the heater 144 heats the processing liquid flowing through the piping 141.

[0151] In step S114, it is determined whether the temperature of the processing liquid is a specific temperature. If the temperature of the processing liquid is not a specific temperature (no in step S114), the process returns to step S112. On the other hand, if the temperature of the processing liquid is a specific temperature (yes in step S114), the process proceeds to step S116.

[0152] In step S116, the substrate W is immersed in the processing solution of the processing tank 110. Typically, the substrate holding unit 120 lowers towards the processing tank 110 while holding the substrate W, immersing the substrate W in the processing solution of the processing tank 110. At this time, the processing solution supply unit 130 may not supply sulfuric acid and hydrogen peroxide water to the processing tank 110. Alternatively, the processing solution supply unit 130 may only supply hydrogen peroxide water to the processing tank 110. In any case, it is preferable to drive the heater 144 together with the drive pump 142, thereby circulating the processing solution in the processing tank 110 while heating the processing solution in the processing tank 110.

[0153] Then, the substrate W is lifted from the processing tank 110. Typically, the substrate W is removed from the substrate processing apparatus 100.

[0154] In step S118, it is determined whether the substrate W to be processed by the substrate processing apparatus 100 next is a target substrate. Typically, the control unit 182 determines whether the substrate W is a target substrate before the next substrate arrives at the substrate processing apparatus 100.

[0155] If the next substrate W is not the target substrate (No in step S118), the process ends. On the other hand, if the next substrate W is the target substrate (Yes in step S118), the process proceeds to step S120.

[0156] In step S120, it is determined whether the treatment liquid in the treatment tank 110 meets a specific standard. The specific standard is set in the same way as in step S104.

[0157] If the processing solution in the processing tank 110 does not meet a specific standard (no in step S120), the process returns to step S106. On the other hand, if the processing solution in the processing tank 110 meets the specific standard (yes in step S120), the process returns to step S116. In this case, the processing solution supply unit 130 may not supply sulfuric acid and hydrogen peroxide water to the processing solution in the processing tank 110. Alternatively, the processing solution supply unit 130 may only supply hydrogen peroxide water to the processing solution in the processing tank 110. In any case, it is preferable to drive the heater 144 together with the drive pump 142, thereby circulating the processing solution in the processing tank 110 while heating the processing solution in the processing tank 110.

[0158] In this embodiment, as described above, if the processing solution in the processing tank 110 meets a specific standard, the substrate W is immersed without being drained. On the other hand, if the processing solution in the processing tank 110 does not meet the specific standard, at least a portion of the processing solution in the processing tank 110 is drained, and sulfuric acid and hydrogen peroxide water are resupplyed, thereby replacing at least a portion of the processing solution in the processing tank 110. This reduces the frequency of processing solution replacements and suppresses increases in processing solution costs.

[0159] As mentioned above, reference has been made. Figures 5-7 This document describes the liquid replacement step in the substrate processing method of this embodiment and a flowchart of the process for selecting the liquid replacement step. Furthermore, the concentration adjustment step in the substrate processing method of this embodiment is performed as follows.

[0160] Next, refer to Figures 1 to 8 This section explains the concentration adjustment step in the substrate processing method of this embodiment. Figure 8 (a)~ Figure 8 (c) is a schematic diagram illustrating the concentration adjustment step in the substrate processing method of this embodiment.

[0161] like Figure 8 As shown in (a), the state of the treatment liquid in the treatment tank 110 is maintained. Here, a fixed amount of treatment liquid is stored in each of the inner tank 112 and the outer tank 114. For example, the treatment liquid in the treatment tank 110 is maintained in a fixed state by circulating and heating simultaneously.

[0162] For example, the treatment solution in treatment tank 110 is maintained at a sulfuric acid concentration of 75% or higher and 90% or lower, a hydrogen peroxide concentration of 0.8% or higher and 2.0% or lower, and a temperature of 100°C or higher and 140°C. In one example, the treatment solution maintained in treatment tank 110 has a sulfuric acid concentration of 82%, a hydrogen peroxide concentration of 1.0%, and a temperature of 110°C.

[0163] Under the control of the control unit 182, the temperature, sulfuric acid concentration, and hydrogen peroxide concentration of the treatment solution in the treatment tank 110 are maintained. Specifically, the sulfuric acid supply unit 132 supplies a specific amount of sulfuric acid to the treatment tank 110, and the hydrogen peroxide supply unit 134 supplies a specific amount of hydrogen peroxide solution to the treatment tank 110. In addition, the heater 144 heats the treatment solution with a fixed amount of power.

[0164] like Figure 8 (b) shows the adjustment of the concentration of the treatment solution in the treatment tank 110. At this time, the ratio of the amount of sulfuric acid supplied from the sulfuric acid supply unit 132 to the amount of hydrogen peroxide water supplied from the hydrogen peroxide supply unit 134 is changed. For example, the concentration of the treatment solution in the treatment tank 110 is adjusted a moment before the substrate W is immersed in the treatment solution of the treatment tank 110.

[0165] Here, the hydrogen peroxide concentration is increased while maintaining the sulfuric acid concentration in the treatment solution of the treatment tank 110. In this case, the control unit 182 controls the hydrogen peroxide supply unit 134 to increase the supply of hydrogen peroxide water until the hydrogen peroxide concentration in the treatment solution of the treatment tank 110 increases. Additionally, the control unit 182 controls the sulfuric acid supply unit 132 to supply sulfuric acid according to the level required to maintain the sulfuric acid concentration in the treatment solution of the treatment tank 110.

[0166] In one example, the treatment solution maintained in treatment tank 110 had a sulfuric acid concentration of 82%, a hydrogen peroxide concentration of 1.4%, and a temperature of 110°C.

[0167] Subsequently, the control unit 182 immerses the substrate W in the processing solution of the processing tank 110, maintaining the temperature of the processing solution, the sulfuric acid concentration, and the hydrogen peroxide concentration in the processing solution until the substrate W is lifted out of the processing solution in the processing tank 110. Specifically, the sulfuric acid supply unit 132 supplies a specific amount of sulfuric acid to the processing tank 110, and the hydrogen peroxide supply unit 134 supplies a specific amount of hydrogen peroxide solution to the processing tank 110. Additionally, the heater 144 heats the processing solution with a fixed amount of power.

[0168] After the control unit 182 lifts the substrate W from the processing solution in the processing tank 110, it changes the temperature of the processing solution, the sulfuric acid concentration of the processing solution, and the hydrogen peroxide concentration of the processing solution in the processing tank 110. Typically, the control unit 182 changes any one of the temperature of the processing solution, the sulfuric acid concentration of the processing solution, and the hydrogen peroxide concentration of the processing solution in the processing tank 110 to the state before the substrate W was immersed.

[0169] like Figure 8 (c) shows the restoration of the state of the treatment liquid in the treatment tank 110. Here, the hydrogen peroxide concentration is reduced while maintaining the sulfuric acid concentration in the treatment liquid of the treatment tank 110. In this case, the control unit 182 controls the hydrogen peroxide supply unit 134 to reduce the supply of hydrogen peroxide water until the hydrogen peroxide concentration in the treatment liquid in the treatment tank 110 is reduced. In addition, the control unit 182 controls the sulfuric acid supply unit 132 to supply sulfuric acid according to the level of maintaining the sulfuric acid concentration in the treatment liquid in the treatment tank 110. At this time, the ratio of the amount of sulfuric acid supplied from the sulfuric acid supply unit 132 to the amount of hydrogen peroxide water supplied from the hydrogen peroxide supply unit 134 is changed again.

[0170] In one example, the treatment solution maintained in treatment tank 110 had a sulfuric acid concentration of 82%, a hydrogen peroxide concentration of 1.0%, and a temperature of 110°C.

[0171] Subsequently, the control unit 182 maintains the temperature of the treatment solution, the sulfuric acid concentration, and the hydrogen peroxide concentration in the treatment tank 110. Specifically, the sulfuric acid supply unit 132 supplies a specific amount of sulfuric acid to the treatment tank 110, and the hydrogen peroxide supply unit 134 supplies a specific amount of hydrogen peroxide solution to the treatment tank 110. In addition, the heater 144 heats the treatment solution with a fixed amount of power.

[0172] Next, refer to Figures 1-9 This section explains the concentration adjustment step in the substrate processing method of this embodiment. Figure 9 This is a graph showing the time-varying concentrations of sulfuric acid and hydrogen peroxide in the treatment tank 110 during the concentration adjustment step in the substrate treatment method of this embodiment. Figure 9 In the diagram, line Lsc represents the time-varying concentration of sulfuric acid. Line Lhc represents the time-varying concentration of hydrogen peroxide.

[0173] As shown by line Lsc, before the concentration adjustment period Pc, the sulfuric acid concentration is maintained at the target concentration Tsb. However, strictly speaking, the sulfuric acid concentration changes relative to the target concentration Tsb over time. This is because the sulfuric acid supply unit 132 intermittently supplies sulfuric acid to the processing tank 110 based on the measurement results of the concentration sensor 162. Here, when the sulfuric acid concentration decreases and reaches the target concentration Tsb, the sulfuric acid supply unit 132 supplies a specific amount of sulfuric acid to the processing tank 110. Therefore, the sulfuric acid concentration temporarily increases from the target concentration Tsb.

[0174] During the concentration adjustment period Pc, the treatment tank 110 is supplied with sulfuric acid and hydrogen peroxide water, which become the new treatment solution during the liquid replacement period Pp. Typically, the concentration adjustment period Pc is the period immediately before the substrate W is immersed in the treatment solution of the treatment tank 110.

[0175] Here, the sulfuric acid concentration remains at the target concentration Tsb after the concentration adjustment period Pc, compared to before the adjustment period Pc. Strictly speaking, in this case, the sulfuric acid concentration also changes relative to the target concentration Tsb over time.

[0176] On the other hand, as shown in line Lhc, the hydrogen peroxide concentration is maintained at the target concentration Tob1 before the concentration adjustment period Pc. However, strictly speaking, the hydrogen peroxide concentration changes relative to the target concentration Tob1 over time. This is because the hydrogen peroxide supply unit 134 intermittently supplies hydrogen peroxide water to the treatment tank 110. Here, when the hydrogen peroxide concentration decreases and reaches the target concentration Tob1, the hydrogen peroxide supply unit 134 also supplies a specific amount of hydrogen peroxide water to the treatment tank 110. Therefore, the hydrogen peroxide concentration temporarily increases from the target concentration Tob1.

[0177] Compared to before the concentration adjustment period Pc, the hydrogen peroxide concentration increases after the concentration adjustment period Pc. This is because, through concentration adjustment, the target concentration of the hydrogen peroxide water has changed from target concentration Tob1 to target concentration Tob2. However, strictly speaking, the hydrogen peroxide concentration changes relative to the target concentration Tob2 over time. As mentioned above, this is because the hydrogen peroxide supply unit 134 intermittently supplies hydrogen peroxide water to the treatment tank 110.

[0178] Subsequently, after a specific period, when the substrate W is not pre-immersed in the processing solution of the processing tank 110, the target concentration of hydrogen peroxide is restored from the target concentration Tob2 to the target concentration Tob1.

[0179] Next, refer to Figures 1-10 This section describes an embodiment of the substrate processing apparatus 100 of the present invention. Figure 10 (a) is a graph showing the time-varying concentration of sulfuric acid in the treatment tank 110 in the substrate treatment method of this embodiment. Figure 10 (b) is a graph showing the time-varying concentration of hydrogen peroxide in the processing tank 110 during the substrate processing method of this embodiment.

[0180] like Figure 10 As shown in (a), the sulfuric acid concentration varies relative to the target concentration Ts. This is because the sulfuric acid supply unit 132 intermittently supplies sulfuric acid to the treatment tank 110 based on the measurement results of the concentration sensor 162.

[0181] In detail, after the sulfuric acid supply unit 132 stops supplying sulfuric acid for a specific period, the sulfuric acid concentration gradually decreases over time. When the concentration sensor 162 detects that the sulfuric acid concentration has reached the lower limit Tsd, the control unit 182 controls the sulfuric acid supply unit 132 to supply a specific amount of sulfuric acid to the processing tank 110. Furthermore, the amount of sulfuric acid supplied by the sulfuric acid supply unit 132 is set such that the sulfuric acid concentration detected by the concentration sensor 162 does not exceed the upper limit Tsu. Therefore, the sulfuric acid concentration changes relative to the target concentration Ts over time.

[0182] like Figure 10 As shown in (b), the hydrogen peroxide concentration varies relative to the target concentration Th. This is because the hydrogen peroxide supply unit 134 intermittently supplies hydrogen peroxide water to the treatment tank 110 based on the measurement results of the concentration sensor 162.

[0183] In detail, after the hydrogen peroxide supply unit 134 stops supplying hydrogen peroxide water for a specific period, the hydrogen peroxide concentration gradually decreases over time. When the concentration sensor 162 detects that the hydrogen peroxide concentration has reached the lower limit Thd, the control unit 182 controls the hydrogen peroxide supply unit 134 to supply a specific amount of hydrogen peroxide water to the treatment tank 110. Furthermore, the amount of hydrogen peroxide water supplied by the hydrogen peroxide supply unit 134 is set such that the hydrogen peroxide concentration measured by the concentration sensor 162 does not exceed the upper limit Thu. Therefore, the hydrogen peroxide concentration changes relative to the target concentration Th over time.

[0184] In addition, such as Figure 10 (a) and Figure 10 As shown in (b), the sulfuric acid concentration and hydrogen peroxide concentration can also be used for feedback control of the target concentration. Furthermore, feedback control is best performed during the concentration adjustment step. However, feedback control can also be performed during the liquid replacement step.

[0185] Next, refer to Figures 1 to 11 This section explains the concentration adjustment step in the substrate processing method of this embodiment. Figure 11 This is a flowchart of the concentration adjustment step in the substrate processing method of this embodiment.

[0186] like Figure 11 As shown, in step S202, the state of the treatment liquid in the treatment tank 110 is maintained. The control unit 182 maintains the temperature, sulfuric acid concentration, and hydrogen peroxide concentration of the treatment liquid in the treatment tank 110. Based on the results of the concentration sensor 162, the control unit 182 controls the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 so that the sulfuric acid concentration and hydrogen peroxide concentration of the treatment liquid reach specific values. In addition, based on the temperature measured by the heater 144, the control unit 182 controls the heater 144 to maintain a specific temperature for the treatment liquid.

[0187] In step S204, it is determined whether the substrate W processed by the substrate processing apparatus 100 is the target substrate for concentration adjustment. Typically, the control unit 182 determines whether the substrate W is the target substrate before the substrate arrives at the substrate processing apparatus 100.

[0188] For example, if substrate W is a substrate with ion-implanted resist, control unit 182 determines that substrate W is a substrate for which concentration adjustment is required. Alternatively, if substrate W is a substrate that has undergone oxidation treatment after component separation, control unit 182 determines that substrate W is a substrate for which concentration adjustment is required.

[0189] If the substrate W is not the target substrate (No in step S204), the process returns to step S202. On the other hand, if the substrate W is the target substrate (Yes in step S204), the process proceeds to step S206.

[0190] In step S206, the concentration of hydrogen peroxide in the treatment solution within the treatment tank 110 is increased. Typically, the control unit 182 controls the hydrogen peroxide supply unit 134 by increasing the supply of hydrogen peroxide water until the concentration of hydrogen peroxide in the treatment solution within the treatment tank 110 increases. Additionally, the control unit 182 controls the sulfuric acid supply unit 132 by supplying sulfuric acid to maintain the sulfuric acid concentration in the treatment solution within the treatment tank 110.

[0191] In step S208, it is determined whether the concentration adjustment of the treatment solution is complete. When the hydrogen peroxide concentration increases and the concentration sensor 162 indicates a specific value, the concentration adjustment of the treatment solution is terminated.

[0192] If the adjustment of the processing fluid is not completed (No in step S208), the process returns to step S208. On the other hand, if the adjustment of the processing fluid has been completed (Yes in step S208), the process proceeds to step S210.

[0193] In step S210, the state of the treatment liquid in the treatment tank 110 is maintained. The control unit 182 maintains the temperature of the treatment liquid, the sulfuric acid concentration of the treatment liquid, and the hydrogen peroxide concentration of the treatment liquid in the treatment tank 110. Specifically, the sulfuric acid supply unit 132 supplies a specific amount of sulfuric acid to the treatment tank 110, and the hydrogen peroxide supply unit 134 supplies a specific amount of hydrogen peroxide water to the treatment tank 110. In addition, the heater 144 heats the treatment liquid with a fixed amount of power.

[0194] In step S212, the substrate W is immersed in the processing solution of the processing tank 110. Typically, the substrate W is transferred into the substrate processing apparatus 100 and immersed in the processing solution of the processing tank 110. Then, the substrate W is transferred from the substrate processing apparatus 100. After that, the processing proceeds to step S214.

[0195] In step S214, it is determined whether there is a substrate W that the substrate processing apparatus 100 should process next, and whether the substrate W is a target substrate. Typically, before the next substrate arrives at the substrate processing apparatus 100, the control unit 182 determines whether there is a next substrate W and whether the next substrate W is a target substrate.

[0196] If there is no next substrate W, or if the next substrate W is not the target substrate (no in step S214), the process proceeds to step S216. On the other hand, if there is a next substrate W, and the substrate W is the target substrate (yes in step S214), the process returns to step S210.

[0197] In step S216, the hydrogen peroxide concentration of the treatment solution in the treatment tank 110 is reduced. Typically, the control unit 182 controls the hydrogen peroxide supply unit 134 by reducing the supply of hydrogen peroxide water until the hydrogen peroxide concentration in the treatment solution in the treatment tank 110 is reduced. Additionally, the control unit 182 controls the sulfuric acid supply unit 132 by supplying sulfuric acid to maintain the sulfuric acid concentration in the treatment solution in the treatment tank 110.

[0198] In step S218, it is determined whether the concentration adjustment of the treatment solution is complete. When the hydrogen peroxide concentration decreases and the concentration sensor 162 indicates a specific value, the concentration adjustment of the treatment solution is terminated.

[0199] If the adjustment of the processing fluid is not completed (No in step S218), the process returns to step S216. On the other hand, if the adjustment of the processing fluid has been completed (Yes in step S218), the process proceeds to step S220.

[0200] In step S220, the state of the treatment liquid in the treatment tank 110 is maintained. The control unit 182 maintains the temperature of the treatment liquid, the sulfuric acid concentration of the treatment liquid, and the hydrogen peroxide concentration of the treatment liquid in the treatment tank 110. Specifically, the sulfuric acid supply unit 132 supplies a specific amount of sulfuric acid to the treatment tank 110, and the hydrogen peroxide supply unit 134 supplies a specific amount of hydrogen peroxide water to the treatment tank 110. In addition, the heater 144 heats the treatment liquid with a fixed amount of power.

[0201] According to this embodiment, as described above, the concentration of the processing solution in the processing tank 110 is adjusted. According to this embodiment, the processing solution in the processing tank 110 is adjusted to a concentration suitable for processing the substrate W just before immersing the substrate W in the processing tank 110. Therefore, in the case of substrates for which concentration adjustment is not required, the concentration of the processing solution in the processing tank 110 may not need to be adjusted, thus avoiding excessive use of hydrogen peroxide water.

[0202] In addition, Figure 9 and Figure 11 In this embodiment, as an example of concentration adjustment, when substrate W is the target substrate, the hydrogen peroxide concentration is increased; however, this embodiment is not limited to this. When substrate W is the target substrate, the sulfuric acid concentration may also be increased.

[0203] In addition, Figure 4 In the flowchart shown, the processing liquid adjustment step is selected based on substrate information representing substrate-related information obtained before the substrate is processed by the substrate processing apparatus 100; however, this embodiment is not limited to this. The processing liquid adjustment step may also be selected based on the substrate information and other information.

[0204] Next, refer to Figures 1-12 This describes the substrate processing method of this embodiment. Figure 12 This is a flowchart of the substrate processing method of this embodiment.

[0205] like Figure 12 As shown, in step S10, substrate information related to the substrate W processed by the substrate processing apparatus 100 is obtained. For example, the substrate information acquisition unit 182a obtains the substrate information from the storage unit 184.

[0206] In step S10A, processing liquid information indicating the state of the processing liquid in the processing tank 110 is acquired. The processing liquid information may indicate any one of the following: sulfuric acid concentration, hydrogen peroxide concentration, and temperature in the processing liquid of the processing tank 110. For example, concentration sensor 162 measures the sulfuric acid concentration and hydrogen peroxide concentration in the processing liquid within the processing tank 110. Additionally, heater 144 measures the temperature of the processing liquid. The processing liquid information acquisition unit 182c acquires the processing liquid information from concentration sensor 162 and / or heater 144.

[0207] In step S20, a processing solution adjustment step is selected. Based on the substrate information and processing solution information, the control unit 182 selects whether to adjust the processing solution in the processing tank 110 using either a liquid replacement step or a concentration adjustment step. Typically, the control unit 182 selects the processing solution adjustment step based on the substrate information and processing solution information before the substrate W arrives at the substrate processing apparatus 100.

[0208] For example, based on substrate information, target values ​​for the processing solution in processing tank 110 are set. In one example, target sulfuric acid concentration, target hydrogen peroxide concentration, and target temperature in the processing solution of processing tank 110 are set according to the treatment performed on substrate W before it is transferred into substrate processing apparatus 100.

[0209] The processing solution adjustment step selection unit 182b selects a processing solution adjustment step. For example, the processing solution adjustment step selection unit 182b selects a processing solution adjustment step based on the target sulfuric acid concentration, target hydrogen peroxide concentration, and target temperature set based on the substrate information, and the difference between these values ​​and the sulfuric acid concentration, target hydrogen peroxide concentration, and target temperature of the processing solution in the processing tank 110 shown in the processing solution information. For example, if the difference is relatively large, the processing solution adjustment step selection unit 182b selects a liquid replacement step as the processing solution adjustment step. On the other hand, if the difference is relatively small, the processing solution adjustment step selection unit 182b selects a concentration adjustment step as the processing solution adjustment step.

[0210] If the liquid replacement step is selected in step S20, the process proceeds to step S30. On the other hand, if the concentration adjustment step is selected in step S20, the process proceeds to step S40.

[0211] In step S30, a liquid replacement step is performed. This liquid replacement step adjusts the treatment solution in the treatment tank 110. As described above, it is determined whether the treatment solution in the treatment tank 110 meets the reference standard. If the treatment solution meets the reference standard, the treatment solution in the treatment tank 110 is not discharged. If the treatment solution does not meet the reference standard, the treatment solution in the treatment tank 110 is discharged, and sulfuric acid and hydrogen peroxide water are re-supplyed to the treatment tank 110. Afterwards, the process proceeds to step S50A.

[0212] In step S50A, the substrate W is immersed in the processing solution of the processing tank 110. Then, the substrate W is removed from the processing solution of the processing tank 110. The substrate processing is then complete.

[0213] In step S40, a concentration adjustment step is performed. In this case, the concentration of the treatment solution in the treatment tank 110 is adjusted. Next, the treatment proceeds to step S50B.

[0214] In step S50B, the substrate is immersed in the processing solution of the processing tank 110. Then, the substrate W is removed from the processing solution of the processing tank 110. The substrate processing is then complete.

[0215] According to this embodiment, the processing solution adjustment step is selected by considering not only substrate information but also processing solution information. Therefore, the substrate W can be appropriately processed by taking into account the time required to adjust the processing solution.

[0216] Additionally, in reference Figures 1-12 In the above description, to avoid making the invention overly complex, the substrate W is processed in one substrate processing apparatus 100; however, this embodiment is not limited to this. The substrate W may also be processed in two or more substrate processing apparatuses 100.

[0217] Next, refer to Figure 13 This describes a substrate processing system 10 equipped with the substrate processing apparatus 100 of this embodiment. Figure 13 This is a schematic diagram of a substrate processing system 10 equipped with the substrate processing apparatus 100 of this embodiment. Figure 13 The substrate processing system 10 shown includes a first substrate processing apparatus 100A to a third substrate processing apparatus 100C.

[0218] like Figure 13 As shown, the substrate processing system 10 includes an input section 20, multiple storage sections 30, a transfer mechanism 40, a removal section 50, a buffer unit BU, a first transfer device CTC, a second transfer device WTR, multiple substrate processing devices 100, and a control device 180.

[0219] Multiple substrate processing apparatuses 100 include a first substrate processing apparatus 100A, a second substrate processing apparatus 100B, and a third substrate processing apparatus 100C. The first substrate processing apparatus 100A, the second substrate processing apparatus 100B, and the third substrate processing apparatus 100C are arranged in one direction. For example, the first substrate processing apparatus 100A, the second substrate processing apparatus 100B, and the third substrate processing apparatus 100C are adjacent to the transport path of the first transport apparatus CTC, and the first substrate processing apparatus 100A, the second substrate processing apparatus 100B, and the third substrate processing apparatus 100C are arranged sequentially from near the transport path of the first transport apparatus CTC.

[0220] Here, the first substrate processing apparatus 100A to the third substrate processing apparatus 100C store a processing solution containing sulfuric acid and hydrogen peroxide water. Alternatively, a substrate W undergoing different processing can be introduced into each of the first substrate processing apparatus 100A to the third substrate processing apparatus 100C.

[0221] The substrate W processed by the substrate processing apparatus 100 is brought in from the input section 20. The input section 20 includes a plurality of mounting stages 22. The substrate W processed by the substrate processing apparatus 100 is removed from the removal section 50. The removal section 50 includes a plurality of mounting stages 52.

[0222] The receiving section 20 houses the receiving section 30, which holds the substrate W. The receiving section 30 in the receiving section 20 holds the substrate W that has not been processed by the substrate processing apparatus 100. Here, the two receiving sections 30 are respectively placed on two mounting stages 22.

[0223] Multiple receiving sections 30 each receive multiple substrates W. Each substrate W is received in a horizontal position within the receiving section 30. The receiving section 30 is, for example, a FOUP (Front Opening Unified Pod).

[0224] The receiving section 30, placed in the removal section 50, receives the substrate W processed by the substrate processing apparatus 100. The removal section 50 includes multiple mounting stages 52. Two receiving sections 30 are respectively placed on two mounting stages 52. The removal section 50 receives the processed substrate W in the receiving section 30 and removes it together with the receiving section 30.

[0225] The buffer unit BU is arranged adjacent to the input section 20 and the output section 50. The buffer unit BU extracts the receiving section 30, along with the substrate W, placed in the input section 20 into its interior, and places the receiving section 30 on a shelf (not shown). Additionally, the buffer unit BU receives the processed substrate W, stores it in the receiving section 30, and places the receiving section 30 on a shelf. A transfer mechanism 40 is arranged within the buffer unit BU.

[0226] The transfer mechanism 40 transfers the receiving section 30 between the input section 20 and the output section 50 and the shelf. Furthermore, the transfer mechanism 40 only transfers the substrate W to the first conveying device CTC. That is, the transfer mechanism 40 transfers the substrate W group to the first conveying device CTC.

[0227] After receiving the unprocessed multiple substrates W from the transfer mechanism 40, the first transfer device CTC changes the orientation of the multiple substrates W from a horizontal to a vertical orientation and transfers the multiple substrates W to the second transfer device WTR. Conversely, after receiving the processed multiple substrates W from the second transfer device WTR, the first transfer device CTC changes the orientation of the multiple substrates W from a vertical to a horizontal orientation and transfers the substrates W to the transfer mechanism 40.

[0228] The second transport device WTR can move from the third substrate processing device 100C to the second substrate processing device 100B along the length of the substrate processing system 10. The second transport device WTR can transport the substrate W group into and out of the first substrate processing device 100A, the second substrate processing device 100B and the third substrate processing device 100C.

[0229] The control device 180 controls various operations of the substrate processing system 10. Specifically, the control device 180 controls the transfer mechanism 40, the first transfer device CTC, the second transfer device WTR, and the substrate processing device 100.

[0230] The control device 180 includes a control unit 182 and a storage unit 184. The control unit 182 has a processor. The control unit 182 may have a central processing unit (CPU) for example. Alternatively, the control unit 182 may also have a general-purpose arithmetic unit (GNU).

[0231] Storage unit 184 stores data and computer programs. The data includes process data. The process data contains information representing multiple processes. Each of the multiple processes specifies the processing content and order of the substrate W.

[0232] Storage unit 184 includes a primary storage device and a secondary storage device. The primary storage device is, for example, a semiconductor memory. The secondary storage device is, for example, a semiconductor memory and / or a hard disk drive. Storage unit 184 may also include removable media. Storage unit 184 is an example of a non-transitory computer-readable storage medium.

[0233] The storage unit 184 stores a computer program with a preset sequence. The substrate processing apparatus 100 operates according to the sequence specified by the computer program. The control unit 182 executes the computer program stored in the storage unit 184 to perform substrate processing operations. The processor of the control unit 182 controls the transfer mechanism 40, the first transfer device CTC, the second transfer device WTR, and the substrate processing apparatus 100 by executing the computer program stored in the storage unit 184.

[0234] The above has been referenced in the appendix. Figure 1 The embodiments of the present invention will be described below. However, the present invention is not limited to the described embodiments and can be implemented in various ways without departing from its spirit. Furthermore, various inventions can be formed by appropriately combining the multiple constituent elements disclosed in the embodiments. For example, some constituent elements may be deleted from all the constituent elements shown in the embodiments. In addition, constituent elements spanning different embodiments may be appropriately combined. For ease of understanding, the accompanying drawings are schematically represented with each constituent element as the main body. The thickness, length, number, spacing, etc., of each constituent element shown are for ease of drawing preparation and may differ from reality. Furthermore, the material, shape, size, etc., of each constituent element shown in the embodiments are examples and are not particularly limited; various modifications can be made without substantially departing from the effects of the present invention.

[0235] [Industry Availability]

[0236] This invention is suitable for substrate processing apparatus and substrate processing methods.

[0237] [Symbol Explanation]

[0238] 10: Substrate Processing System

[0239] 100: Substrate processing apparatus

[0240] 110: Processing tank

[0241] 112: Inner groove

[0242] 114: Outer groove

[0243] 120: Substrate holding section

[0244] 130: Processing Fluid Supply Department

[0245] 180: Control device

[0246] 182: Control Department

[0247] 184: Storage Department

[0248] W: Substrate.

Claims

1. A substrate treatment method, comprising immersing a substrate in a treatment bath containing a treatment solution comprising sulfuric acid and hydrogen peroxide to treat the substrate, and comprising the following steps: Before immersing the substrate in the processing liquid of the processing tank, substrate information representing information related to the substrate is obtained; Based on the substrate information, either the liquid replacement step or the concentration adjustment step is selected as the liquid adjustment step for adjusting the processing solution. In the first treatment liquid adjustment step, when the liquid replacement step is selected in the selected steps, if the treatment liquid in the treatment tank does not meet specific conditions, at least a portion of the treatment liquid in the treatment tank is discharged from the treatment tank, and sulfuric acid and hydrogen peroxide water are supplied to the treatment tank to adjust the treatment liquid in the treatment tank. The second treatment solution adjustment step involves, when the concentration adjustment step is selected in the selected steps, adjusting the concentration of the treatment solution in the treatment tank while circulating the treatment solution in the treatment tank via piping connected to the treatment tank; and While circulating the treatment liquid in the treatment tank, adjusted in the first or second treatment liquid adjustment step, through piping connected to the treatment tank, the substrate is immersed in the treatment liquid in the treatment tank; and In the step of obtaining the substrate information, if the substrate information indicates that the resist on the substrate has been ashed, then the liquid replacement step is selected in the selected steps. In the step of obtaining the substrate information, where the substrate information indicates that either ion implantation of the substrate resist has been performed or element separation of the substrate has been performed, the concentration adjustment step is selected in the selected step.

2. The substrate processing method according to claim 1, wherein in the first processing liquid adjustment step, the processing liquid in the processing tank is not discharged if the processing liquid in the processing tank meets specific conditions.

3. The substrate processing method according to claim 1 or 2, wherein the first processing liquid adjustment step comprises the following steps: before immersing the substrate, setting the amount of processing liquid discharged from the processing tank based on the time elapsed since the substrate was immersed in the processing liquid in the processing tank.

4. The substrate processing method according to claim 1 or 2, wherein the second processing liquid adjustment step comprises the following steps: adjusting the hydrogen peroxide concentration of the processing liquid based on the measurement result of a concentration sensor that measures the concentration of the processing liquid in the processing tank.

5. The substrate processing method according to claim 1 or 2, wherein the second processing liquid adjustment step comprises the following steps: Before immersing the substrate in the processing solution of the processing tank, hydrogen peroxide water is supplied to the processing tank in a manner that increases the hydrogen peroxide concentration of the processing solution; and After immersing the substrate in the processing solution of the processing tank, the hydrogen peroxide concentration of the processing solution in the processing tank is reduced.

6. A substrate processing apparatus comprising: The treatment tank stores a treatment solution containing sulfuric acid and hydrogen peroxide. The circulation section has piping for circulating the treatment liquid in the treatment tank; The drain section discharges the treatment liquid from the treatment tank. The treatment solution supply unit supplies sulfuric acid and hydrogen peroxide water to the treatment tank; A substrate holding section holds the substrate and immerses the substrate in the processing liquid of the processing tank; and The control unit controls the circulation unit, the drainage unit, the processing liquid supply unit, and the substrate holding unit; and Before immersing the substrate in the processing liquid of the processing tank, the control unit selects either a liquid replacement step or a concentration adjustment step as a processing liquid adjustment step based on substrate information representing information related to the substrate. When the liquid replacement step is selected, the control unit controls the draining unit and the processing liquid supply unit in a manner that performs the first processing liquid adjustment step. In the first processing liquid adjustment step, when the processing liquid in the processing tank does not meet specific conditions, at least a portion of the processing liquid in the processing tank is discharged from the processing tank, and the processing liquid supply unit supplies the sulfuric acid and the hydrogen peroxide water to the processing tank to adjust the processing liquid in the processing tank. When the concentration adjustment step is selected, the control unit controls the circulation unit and the treatment liquid supply unit in a manner that performs the second treatment liquid adjustment step, and the concentration of the treatment liquid is adjusted while the treatment liquid in the treatment tank is circulated through the piping of the circulation unit in the second treatment liquid adjustment step. The control unit controls the circulation section and the substrate holding section to immerse the substrate in the processing liquid of the processing tank while circulating the processing liquid in the processing tank after adjustment in the first processing liquid adjustment step or the second processing liquid adjustment step through the piping of the circulation section; and The control unit If the substrate information indicates that the resist on the substrate has been ashed, then the liquid replacement step is selected; If the substrate information indicates that either ion implantation of the substrate resist has been performed or element separation of the substrate has been performed, the concentration adjustment step is selected.

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