Liquid ejection device and method, electrode forming device, multilayer separator forming device

Abstract

The present invention relates to a liquid ejecting apparatus, an electrode forming apparatus, a multilayer separator forming apparatus, and a liquid ejecting method, which perform printing without causing liquid to adhere to a conveyance surface in marginless printing in which not only a surface of an electrode base but also a side surface is printed. In marginless printing in which not only a surface of an electrode base but also a side surface is printed, a liquid adhering member for performing printing without causing liquid to adhere to a conveyance surface can be provided with high accuracy with a small and simple apparatus. The apparatus includes a conveyance section that conveys a base, a liquid adhering member that is provided on the conveyance section and is partially sandwiched between an end portion of the base and the conveyance section, and an ejecting section that ejects a liquid composition toward the base and the liquid adhering member, the base being inclined to a conveyance surface of the base in the conveyance section.

Description

Technical Field

[0001] This invention relates to a liquid jetting apparatus, an electrode forming apparatus, a multilayer diaphragm forming apparatus, and a liquid jetting method. Background Technology

[0002] Traditionally, electrodes used in electrochemical elements of energy storage devices such as batteries, power generation devices such as fuel cells, and solar power generation devices are formed by dispersing powdered active materials or catalyst compositions into a liquid, coating the liquid onto an electrode substrate, fixing it, and drying it. The coating of the liquid typically employs spraying, dispensing, extrusion coating, or lift coating, and more advanced methods include inkjet printing.

[0003] The technology disclosed in Patent Document 1 involves using electrostatic force to make the liquid adhering to the conveying surface fly during air spraying after the liquid is coated, and then removing the liquid by a liquid removal component.

[0004] However, according to existing technology, it is impractical to make it fly using electrostatic force when the amount of adhesion is large, such as in borderless printing that prints not only on the surface of the electrode substrate but also on the sides.

[0005] The present invention was made in view of the above circumstances, and its object is to print without liquid adhering to the conveying surface during borderless printing that prints not only on the surface of the electrode substrate but also on the side surfaces.

[0006] Furthermore, in borderless printing, which prints not only on the surface of the electrode substrate but also on its sides, a liquid adhesion component can be precisely set up with a small and simple device to print without allowing liquid to adhere to the conveying surface.

[0007] [Patent Document 1] Japanese Patent Application Publication No. 2006-264172 Summary of the Invention

[0008] To solve the above-mentioned problems and achieve the objective, the present invention is characterized by comprising: a conveying section for conveying a substrate; a liquid adhering member disposed on the conveying section and partially sandwiched between the end of the substrate and the conveying section; and a spraying section for spraying a liquid composition onto the substrate and the liquid adhering member, wherein the substrate is inclined to the conveying surface of the substrate in the conveying section.

[0009] In addition, the present invention is characterized by including: a tape holding member for holding the tape; a tape mounting member for positioning and attaching the front end of the tape held by the tape holding member; and a tape pressing member that operates by peeling the tape, which is constrained to a tensioned state and attached to the tape mounting member, from the tape mounting member while pressing and attaching it to the conveying surface of the conveying substrate.

[0010] According to the present invention, when printing without margins on not only the surface of the electrode substrate but also the side surface, the effect of printing without allowing liquid to adhere to the conveying surface is obtained.

[0011] Furthermore, it achieves the effect of using a small and simple device to precisely set up a liquid adhesion component for printing without allowing liquid to adhere to the conveying surface when printing not only on the surface of the electrode substrate but also on the side surfaces in borderless printing. Attached Figure Description

[0012] Figure 1 The diagram shown is a schematic diagram of the electrode printing apparatus according to the first embodiment.

[0013] Figure 2 The image shown is a side view of the ink removal mechanism installed in the electrode printing device.

[0014] Figure 3 The image shown is a top view of the ink removal mechanism installed in the electrode printing device.

[0015] Figure 4 The image shown is a front view of the cross-section of the ink removal mechanism installed in the electrode printing device, as seen from the downstream side in the conveying direction.

[0016] Figure 5 The diagram shows the positional relationship between the electrode substrate and the liquid-attached component.

[0017] Figure 6 The diagram shown is a schematic of the tape application device.

[0018] Figure 7 Figures (a) and (b) show the positional relationship of the main components of the tape application device.

[0019] Figure 8 The diagram shown is a schematic of the tape front end constraint process.

[0020] Figure 9 The diagram shown is a schematic of the tape cutting process.

[0021] Figure 10 The diagram shows a process of applying pressure to the front end of the tape for bonding.

[0022] Figure 11 The diagram shows the positional relationship of the back end of the tape when applying it around the entire circumference.

[0023] Figure 12 The diagram shown is a schematic of the tape back-end cutting process.

[0024] Figure 13 The diagram shows the tape bonding process.

[0025] Figure 14 The image shown is a top view of the ink removal mechanism provided in the electrode printing apparatus according to the second embodiment.

[0026] Figure 15 The image shown is a front view of the cross-section of the ink removal mechanism installed in the electrode printing device, as seen from the downstream side in the conveying direction.

[0027] Figure 16 The diagram shown is a schematic diagram of the electrode forming apparatus according to the third embodiment. Detailed Implementation

[0028] Hereinafter, embodiments of the bonding apparatus, liquid jetting apparatus, electrode forming apparatus, multilayer diaphragm forming apparatus, and bonding method will be described in detail with reference to the accompanying drawings.

[0029] (First Implementation)

[0030] Figure 1 The diagram shown is a schematic diagram of the electrode printing apparatus according to the first embodiment.

[0031] like Figure 1 As shown, the electrode printing apparatus 1 is a liquid jetting device that uses liquid ink as ink for forming functional layers to selectively form functional layers at at least one location on the surface of the electrode substrate (hereinafter also referred to as "electrode substrate surface") and the surface of the active material layer (hereinafter also referred to as "active material layer surface"). In other words, the electrode printing apparatus 1 uses liquid ink to selectively form functional layers at locations on the electrode substrate surface and / or the active material layer surface.

[0032] Furthermore, within the scope of this specification and the claims, a functional layer refers to a layer that functions in the manufacture and / or use of the electrochemical element. For example, in the case where an insulating resin layer and / or inorganic layer is provided on the electrode active material, the functional layer functions as an insulating layer.

[0033] Furthermore, although the following embodiments describe a configuration in which the functional layer is disposed on an electrode substrate, the multilayer membrane forming apparatus may be a multilayer membrane forming apparatus with a membrane formed of a resin such as polypropylene or a nonwoven fabric as the substrate instead of an electrode substrate, or a multilayer membrane forming apparatus with a multilayer membrane on which a layer different from the membrane is disposed may be used.

[0034] like Figure 1 As shown, the electrode printing apparatus 1 includes a conveying mechanism 3 as a conveying unit to convey an electrode substrate 2 as a substrate and / or an electrode having an active material layer on the electrode substrate 2. Furthermore, in the electrode printing apparatus 1, an image recognition device 9, a liquid injection head 4, a light source 5, a heater 6, a liquid injection head 7, a light source 5, and a heater 6 are sequentially arranged from upstream to downstream of the conveying direction X of the electrode substrate 2 by the conveying mechanism 3.

[0035] The electrode substrate 2 is, for example, a metal component, i.e., a current collector, used to extract the electricity stored in the electrode body inside the battery casing to the outside of the battery casing. Alternatively, the electrode substrate 2 is, for example, an electrode element having a current collector and an active material layer formed on the current collector.

[0036] The electrode substrate 2 is a planar conductive foil, which can generally be used as a secondary battery or capacitor for energy storage devices, especially a lithium-ion secondary battery. The conductive foil used includes aluminum foil (hereinafter referred to as "aluminum foil"), copper foil, stainless steel foil, titanium foil, as well as etched foil with micropores created by etching, or open-cell electrode substrates for lithium-ion capacitors, etc.

[0037] The electrode substrate 2 can be a planar electrode substrate made of carbon paper fiber electrodes used in power generation devices such as fuel cells in a non-woven or woven form, or an electrode substrate with fine pores in the aforementioned open electrode substrate.

[0038] The image recognition device 9 is positioned at the upstream end of the conveying direction X. Its function is to acquire information about defects or locations on the surface of the active material layer formed on the electrode substrate 2. The image recognition device 9 is, for example, a camera or a line sensor. Since the image recognition device 9 is used when an active material layer already exists on the electrode substrate 2, it identifies and records the location of the active material image or defects on the electrode substrate 2. Therefore, it is not a necessary component but is provided as needed.

[0039] The conveying mechanism 3 transports the electrode substrate 2, causing it to pass sequentially over the front of the liquid injection head 4, the light source 5, and the heater 6. The conveying mechanism 3 can be, for example, a combination of a belt, an air levitation mechanism, or rollers that move the electrode substrate 2, and a drive mechanism equipped with a motor or the like that drives it. Furthermore, the conveying mechanism 3 may also include guide components that assist in the movement of the electrode substrate 2.

[0040] The function of the liquid jet head 4 is to form an ink layer by spraying liquid ink (liquid composition) as ink for making resin and / or inorganic layers onto the electrode substrate 2. The liquid jet head 4 sprays liquid ink onto the electrode substrate 2 based on image signals related to information about forming a frame pattern that forms the ink layer pattern described later, or defect information acquired by the image recognition device 9 as needed, to form an ink layer as a precursor to the resin and / or inorganic layers. The liquid jet head 4 can be a linearly arranged nozzle with a width greater than or equal to the width in the width direction orthogonal to the transport direction X of the electrode substrate 2. There are no particular limitations on the pressure generation means and driving method for spraying liquid ink from the liquid jet head 4. For example, a thermal actuator that uses the pressure of steam generated by the heat of a heating element to aspirate liquid ink droplets, a piezoelectric actuator that uses mechanical pressure pulses generated by a piezoelectric element to aspirate liquid ink droplets, or an electrostatic actuator consisting of a vibrating plate and a counter electrode can also be used. Furthermore, the liquid ink supply system can be pressure-controlled to make it fly, depending on the need.

[0041] The light source 5 has the function of curing the ink layer formed on the electrode substrate 2 by irradiating light onto it, thereby solidifying the ink layer into a resin layer. Examples of light sources 5 include low-, medium-, and high-pressure mercury lamps, tungsten lamps, arc lamps, excimer lamps, excimer lasers, semiconductor lasers, high-output UV-LEDs, YAG lasers, laser systems combining lasers and nonlinear optical crystals, high-frequency induced ultraviolet light generators, electron beam irradiation devices such as EB curing devices, and X-ray irradiation devices. Among these, high-frequency induced ultraviolet light generators, high- and low-pressure mercury lamps, or semiconductor lasers are preferred for system simplification. Additionally, a focusing mirror or scanning optical system can be provided in the light source 5.

[0042] The heater 6 functions to heat an ink layer formed by spraying an inorganic layer-making ink onto the electrode substrate 2, serving as a curing / drying means or heating means / mechanism to promote curing or drying. Examples of heaters 6 include infrared lamps, rollers (heat rollers) with built-in heating elements, blowers that blow warm or hot air, and furnaces that introduce boiler-type hot air using steam or the like.

[0043] When the active material layer is continuously formed on the electrode substrate 2 where the resin layer has been provided, the function of the liquid jet head 7 is as a coating means for further coating the active material as needed. Alternatively, instead of the liquid jet head 7, an intermittent extrusion nozzle, a high-speed dispensing machine, a jet nozzle, a spray nozzle, or the same liquid jet head as described above can be used to coat the active material layer with ink.

[0044] At this time, the function of the liquid jet head 7 is as a liquid jet head for producing an active material layer, to jet an ink (liquid composition) containing active material onto the surface of the electrode substrate 2 to form an active material layer. Since the liquid jet head 7 is appropriately set according to needs, its function can also be based on the defect information obtained by the image recognition device 9, and it can be used as a coating means for coating resin layer and / or inorganic layer producing ink at defect sites on the surface of the active material layer.

[0045] Thus, the function of the liquid jet head 7 can be the same as that of the liquid jet head 4 for forming an ink layer, which jets liquid ink, which is used to make a resin layer and / or an inorganic layer, onto the electrode substrate 2 to form an ink layer.

[0046] The electrode printing device 1 is equipped with a control device for controlling the movement of the conveying mechanism 3, the image recognition device 9, the liquid jet head 4, the light source 5, the heater 6, the liquid jet head 7, the light source 5, the heater 6, etc.

[0047] Next, the operation of the electrode printing device 1 will be explained.

[0048] First, the control device of the electrode printing apparatus 1 drives the electrode substrate 2 from the electrode substrate 2 via the conveying mechanism 3. Figure 1 The electrode substrate 2 is transported from right to left along the transport direction X. The transport speed of the electrode substrate 2 at this time is, for example, in the range of 0.1 m / min to several hundred m / min.

[0049] The control device of the electrode printing apparatus 1, when the image recognition device 9 is located upstream of the electrode printing apparatus 1, observes the electrode surface through the image recognition device 9, performs reading by a camera or line sensor that records the position information of the defective part, identifies the defective part and its position, and provides feedback for the subsequent liquid ink jetting / printing by the liquid jetting head 4.

[0050] When the electrode substrate 2 is transported to the front of the liquid jet head 4, the control device of the electrode printing apparatus 1 controls the liquid jet head 4 to spray the liquid ink according to the image signal. As a result, an ink layer is formed on the electrode substrate 2.

[0051] Next, the control device of the electrode printing apparatus 1 transports the electrode substrate 2, on which the ink layer has been formed, toward the front of the light source 5. As the electrode substrate 2 passes the front of the light source 5, the control device of the electrode printing apparatus 1 drives the light source 5 to irradiate the ink layer formed on the electrode substrate 2, causing the ink layer to solidify. Furthermore, the intensity of the irradiated light at the position on the surface of the ink layer varies depending on the wavelength of the light source used, but is typically in the range of several mW / cm² to 1 kW / cm². The exposure amount of the ink layer can be appropriately set according to the sensitivity of the liquid ink or the moving speed of the printed surface (the transport speed of the electrode substrate 2).

[0052] Next, the control device of the electrode printing apparatus 1 transports the electrode substrate 2, which carries the ink layer in a cured state, into or near the heater 6. As the electrode substrate 2 passes into or near the heater 6, the control device of the electrode printing apparatus 1 drives the heater 6 to heat the ink layer formed on the electrode substrate 2, thereby drying the solvent contained in the ink layer to form an insulating layer. The heater 6 needs to be sufficiently heated to remove the solvent from the ink layer; therefore, its capacity is determined by the speed of the transport mechanism 3 and the boiling point of the solvent. Therefore, in the heater 6, heating is typically performed at a relatively high temperature, for example, around 200°C or less, preferably around 80°C to 200°C or around 60°C to 180°C. The drying time, while depending on the thickness of the ink layer, is typically around 0.5 minutes to 60 minutes, more preferably 1 minute to 10 minutes. Additionally, this can also promote the crosslinking reaction during the actual heating. Furthermore, in this case, Figure 1 In the electrode printing apparatus 1 shown, the heating time of the heater 6 is typically a few seconds to tens of seconds, which is relatively short. Therefore, in order to ensure that the ink layer is almost completely cured by the heater 6, heating is performed at a relatively high temperature, for example, below 200°C, preferably between 80°C and 200°C or between 60°C and 180°C.

[0053] Next, before an active material layer is formed on the electrode substrate 2, the control device of the electrode printing apparatus 1 sprays ink for forming the active material layer onto the surface of the electrode substrate 2 through a liquid spray head 7 or the like to form the active material layer, and then dries it using a heater 6. The heater 6 needs to be sufficiently heated to remove the solvent from the active material; therefore, its capacity is determined by the speed of the conveying mechanism 3 and the boiling point of the solvent. Therefore, the heater 6 is typically heated at a relatively high temperature, for example, below 200°C, preferably between 80°C and 200°C or between 60°C and 180°C. While the drying time also depends on the thickness of the active material layer, it is typically between 0.5 minutes and 60 minutes, more preferably between 1 minute and 10 minutes.

[0054] Then, the control device of the electrode printing apparatus 1 either winds the electrode substrate 2 into a strip or feeds the electrode substrate 2 into a storage container (a container for holding thin film electrodes). Thus, electrode printing is completed.

[0055] Heating methods for heating ink layers are generally known as heat sources, and any device that can be controlled can be used. When using a light source 5, for example, a device that may generate infrared light in addition to visible light, heating can be performed simultaneously with light irradiation. In this case, curing can be promoted, and therefore it is more preferable.

[0056] When light shines on the ink layer, the ink layer is heated by the heat generated from the light source 5. Therefore, the heating method does not need to be a separate component like the heater 6. However, it takes a long time for the ink layer to fully cure at room temperature using only the heat from the light source 5. Therefore, it is desirable for applications where room temperature storage can ensure a sufficiently long time until complete curing. For example, printed materials such as newspaper advertisements published the next day can be fully cured even when stored at room temperature because they can ensure a curing time of about 24 hours.

[0057] Examples of such light sources include the LightHammer series (manufactured by FusionUVSystems). Additionally, high-brightness UV-LEDs or laser diodes with a brightness of 1W or more, sold by LED manufacturers such as Nichia Chemical Co., Ltd., can be appropriately used by arranging them in lines or planes. Furthermore, in situations where light cannot reach through the gaps in the active material powder, electron beam or X-ray irradiation devices can be used as light sources; for example, small EB irradiation devices manufactured by Iwasaki Electric Co., Ltd. are suitable.

[0058] In the electrode printing apparatus 1, which is the device for spraying liquid ink according to this embodiment, two or more liquid spray heads are provided to spray different liquid inks (e.g., liquid ink layers of both resin layer and inorganic layer), which can be used for printing multiple layers simultaneously or mixing liquid inks at the landing point.

[0059] In the electrode printing apparatus 1 described above, a conveying mechanism 3 is provided to move the electrode substrate 2 relative to the liquid injection head 4 or 7, etc., in order to form a resin layer and / or inorganic layer of desired thickness. However, the liquid injection head 4 or the like can also be moved along the conveying direction X as needed. Alternatively, both the electrode substrate 2 and the liquid injection head 4 or 7 can be moved.

[0060] Furthermore, by appropriately utilizing the techniques described in this embodiment, it is also possible to form overlapping or relatively thick resin layer and / or inorganic layer patterns. That is, by repeatedly spraying liquid ink into a defined area of ​​the electrode substrate and curing the resulting ink layer, it is also possible to form resin layers and / or inorganic layers with a thickness of tens of μm or more.

[0061] When forming an electrode active material layer on the electrode substrate 2, and forming a resin layer or an inorganic layer using a liquid spray head 4 or 7, the control device of the electrode printing apparatus 1 uses an image recognition device 9 to provide feedback on any defects in the obtained electrode active material layer. By changing the concentration, thickness, or type of liquid sprayed by the liquid spray head 4 or 7, the defects in the electrode active material layer are improved during the formation of the active material, resin layer, inorganic layer, and patterning of the inorganic layer.

[0062] The thin-film electrode described in this embodiment is typically a thin-film electrode with a thickness of 1 mm or less, more preferably 500 μm or less per unit. The lower limit of the thickness is not specifically defined, but is limited to approximately 1 μm by current foil manufacturing technology. By implementing and providing a thin-film electrode with the aforementioned thickness and the effects described above and below, miniaturization can be facilitated for various devices (especially lithium-ion secondary batteries) due to its high performance and lighter weight.

[0063] However, in the electrode printing apparatus 1, when liquid (liquid composition) is ejected from the liquid ejection heads 4 and 7 (which serve as ejection sections) to form an ink layer or active material layer on the electrode substrate 2, borderless printing of the ejected ink is performed beyond the end in the width direction orthogonal to the transport direction X of the electrode substrate 2. Here, borderless printing in this embodiment refers to printing not only on the surface of the electrode substrate 2 but also on its sides, and is different from general borderless printing that prints on the entire surface. However, when performing borderless printing in this way, there is a problem of ink being ejected outside the electrode substrate 2, causing contamination of the belt constituting the transport mechanism 3.

[0064] Therefore, in the electrode printing apparatus 1 according to this embodiment, an ink removal mechanism is used to remove ink sprayed onto the electrode substrate 2. This will be explained below.

[0065] here, Figure 2 The image shown is a side view of the ink removal mechanism installed in the electrode printing device 1. Figure 3 The image shown is a top view of the ink removal mechanism installed in the electrode printing device 1. Figure 4 The image shown is a front view of the cross-section of the ink removal mechanism installed in the electrode printing device 1, as seen from the downstream side in the conveying direction.

[0066] like Figures 2 to 4As shown, the ink removal mechanism includes a liquid attachment component 11 and a liquid removal component 12. The liquid attachment component 11 attaches liquid L ejected from the liquid jetting heads 4 and 7 disposed on the belt 3a constituting the conveying mechanism 3, and the liquid removal component 12 removes the liquid L from the liquid attachment component 11 as a removal part.

[0067] The liquid adhesion component 11 is a long strip of adhesive tape, positioned to cover the area on the belt 3a constituting the conveying mechanism 3, specifically the area around one end (the position where the liquid L is sprayed outside the electrode substrate 2) that is parallel to the conveying surface of the electrode substrate 2 and orthogonal to the conveying direction X. Therefore, a portion of the liquid adhesion component 11 is sandwiched between the end of the electrode substrate 2 and the belt 3a constituting the conveying mechanism 3. Consequently, the electrode substrate 2 becomes inclined relative to the conveying surface of the electrode substrate 2 in the belt 3a constituting the conveying mechanism 3.

[0068] The liquid attachment component 11 is formed, for example, of a non-permeable material. Furthermore, "non-permeable" means that the liquid L does not penetrate into the interior of the liquid attachment component 11, and the liquid L does not flow to the back side of the liquid attachment component 11. Specifically, the liquid attachment component 11 is formed, for example, of a synthetic resin such as fluoropolymer, polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET) resin, or polyimide film. Thus, by forming the liquid attachment component 11 with a non-permeable material, since the liquid L sprayed outside the electrode substrate 2 will not penetrate into the liquid attachment component 11, the conveying surface of the electrode substrate 2 in the belt 3a constituting the conveying mechanism 3 will not be contaminated.

[0069] Additionally, the liquid adhesion component 11 is attached to the tape adhesive device 100 (see reference 3) located upstream of the conveying direction of the conveying mechanism 3. Figure 6 The liquid attachment component 11 is installed on the belt 3a that constitutes the conveying mechanism 3. In this way, by installing the liquid attachment component 11 upstream in the conveying direction of the conveying mechanism 3, the liquid L ejected from the liquid nozzles 4 and 7 can be attached downstream in the conveying direction of the conveying mechanism 3.

[0070] Thus, by providing a liquid adhesion member 11 made of a non-permeable material at one end of the conveying surface of the electrode substrate 2 (the position where the liquid L is sprayed outside the electrode substrate 2), the liquid L sprayed from the liquid spray heads 4 and 7 outside the electrode substrate 2 adheres to the liquid adhesion member 11, thereby preventing the liquid L from adhering to the outside of the electrode substrate 2 on the conveying surface of the electrode substrate 2 in the belt 3a constituting the conveying mechanism 3.

[0071] Additionally, a liquid removal component 12 is disposed near the roller 3b downstream of the electrode substrate 2 in the conveying direction of the belt 3a constituting the conveying mechanism 3. The liquid removal component 12 removes the liquid L sprayed onto the liquid adhesion component 11, for example, by scraping and attracting the liquid L on the liquid adhesion component 11 with a scraper.

[0072] An example has been described in which the tape application device 100 is located upstream of the electrode substrate 2 in the conveying direction and the liquid removal component 12 is located downstream of the electrode substrate 2 in the conveying direction. However, it is also possible for the tape application device 100 to be located downstream of the electrode substrate 2 in the conveying direction and the liquid removal component 12 to be located upstream of the electrode substrate 2 in the conveying direction, or for them to be located upstream or downstream of the electrode substrate 2 in the conveying direction, respectively.

[0073] In this way, at one end of the belt 3a constituting the conveying mechanism 3, which is parallel to the conveying surface of the electrode substrate 2 and orthogonal to the conveying direction X (the position where the liquid L is sprayed outside the electrode substrate 2), the liquid L adhering to the liquid attachment member 11 is removed by the liquid removal member 12. At least at one end of the conveying surface, the liquid L is prevented from remaining inside the electrode printing device 1, thereby keeping the inside of the electrode printing device 1 clean.

[0074] Next, the positional relationship between the electrode substrate 2 and the liquid adhesion component 11 will be explained.

[0075] here, Figure 5 The diagram shows the positional relationship between the electrode substrate 2 and the liquid attachment component 11. Typically, when the gap t between the electrode substrate 2 and the liquid attachment component 11 is small, the liquid L adhering to the liquid attachment component 11 is drawn in through capillary action, and the liquid L adhering to the liquid attachment component 11 adheres to the back side of the electrode substrate 2. Thus, when the liquid L adheres to the back side of the electrode substrate 2, it contaminates the belt 3a or surrounding parts constituting the conveying mechanism 3.

[0076] Therefore, in this embodiment, among the edges of the surface of the electrode substrate 2 that contacts the liquid attachment member, the longest distance between the uppermost edge (based on the liquid attachment member 11) and the liquid attachment member 11—that is, the distance that descends vertically from the end of the electrode substrate 2 to the liquid attachment member 11 (gap distance: t in the figure)—is 30 μm or more. This prevents the liquid L adhering to the liquid attachment member 11 due to capillary action from circulating and permeating to the back surface of the electrode substrate 2.

[0077] Next, the tape-adhesive device 100, which is an adhesive device for attaching the liquid-adhesive component 11 to the tape 3a, will be described.

[0078] here, Figure 6The diagram shown is a structural diagram of the tape application device 100. Figure 7 The diagram shows the positional relationship of the main components of the tape application device 100. Figure 7 (a) is a side view. Figure 7 (b) is the front view. For example... Figure 6 and Figure 7 As shown, the tape application device 100 holds the adhesive tape 200a, with at least one adhesive side, in the shape of a roll of adhesive tape 200.

[0079] like Figure 6 and Figure 7 As shown, the tape application device 100 includes guide shafts 104a and 104b positioned on the structure holding frame 104, a sliding base 105 configured to be fixed on the guide shafts 104a and 104b, a base plate 106 fixed on the sliding base 105, a tape setting shaft 106a serving as the main body of the tape holding component, a setting roller arm shaft 106b, and a tape roll stop 106c.

[0080] The tape application device 100 is assembled onto a base plate 106 fixed in a sliding base 105. The tape application device 100 is axially movable along guide shafts 104a and 104b.

[0081] The tape setting shaft 106a rotates smoothly via a bearing component with low resistance in the rotational direction, setting the adhesive tape roll 200. The tape roll stop 106c is a limiting component that restricts the axial direction of the adhesive tape 200a. Specifically, the tape roll stop 106c determines the axial edge position of the adhesive tape roll 200 located on the tape setting shaft 106a. In this way, while restricting the axial direction of the tape, the tape posture can be stably maintained by using a bearing component with low resistance in the rotational direction. Because the tape position is determined, slack or twisting does not occur, thus improving the bonding accuracy.

[0082] like Figure 6 and Figure 7 As shown, the tape application device 100 includes a film setting arm 107, bracket pins 107a and 107b mounted on the film setting arm 107, a push roller arm 108, shafts 108a and 108b integrally formed with the push roller arm 108, a push roller 109 which is the main body of the tape pressing component, a push handle 110 assembled on the film setting arm 107, and a pressing means 111.

[0083] The push handle 110 is configured to rotate around the support pin 107b mounted on the membrane setting arm 107. Furthermore, the push handle 110 engages with the shaft 108b, which is integrally formed with the push roller arm 108.

[0084] The pressurizing means 111 is disposed between the support pin 107b, which serves as the rotation center of the push handle 110, and the shaft 108b integrally formed with the push roller arm 108. The pressurizing means 111 has the function of uniquely determining the position of the push roller arm 108 relative to the film setting arm 107, and also has the function of placing the push roller arm 108 in a pushing state on the belt 3a side constituting the conveying means 3 by rotating the push handle 110 (described later).

[0085] In addition, such as Figure 6 and Figure 7 As shown, the tape application device 100 includes a setting roller arm 112, a setting roller bracket 112a disposed on the setting roller arm 112, a tape installation roller 113 supported on the setting roller bracket 112a and capable of rotation, a tape installation guide 114 which serves as the main body of the tape installation component, and a tape rear end plate 115.

[0086] The tape mounting roller 113 and the tape mounting guide 114 are mounted on the mounting roller arm 112, which is rotatable and centered on the mounting roller arm shaft 106.

[0087] The tape mounting guide 114 is positioned close to the tape mounting roller 113 in a manner that surrounds a portion of the outer periphery of the tape mounting roller 113, which is supported on a mounting roller bracket 112a provided on the mounting roller arm 112 so that it is rotatable.

[0088] In addition, such as Figure 7 As shown, a visual mark 114a for the tape edge is applied in the depth direction of the tape installation guide 114, which corresponds to the axial edge position of the adhesive tape roll 200.

[0089] In addition, such as Figure 7 As shown, in the tape installation guide 114, a front cutting guide 114b is provided orthogonally to the pull-out direction of the adhesive tape 200a, indicating the cutting position of the front end of the adhesive tape 114a. The front cutting guide 114b is formed by a slit or groove to guide the tip position of a cutting blade or the like.

[0090] That is, by having a slit or groove parallel to the width direction of the tape on the tape mounting guide 114, which becomes the tape bonding surface, the leading end of the adhesive tape 200a can be cut straight, thus ensuring stable bonding quality at the cut end. Furthermore, it improves operational safety.

[0091] The tape rear end adhesive plate 115 is positioned close to the side of the tape 3a, located in the middle of the path of the adhesive tape 200a connecting the tape setting shaft 106a and the tape mounting guide 114, in a non-contact position. For example... Figure 7As shown, on the surface of the tape rear end adhesive plate 115, similar to the front end cutting guide 114b, a rear end cutting guide 115a, consisting of a slit or groove, is provided orthogonally to the pulling direction of the adhesive tape 200a in a manner that guides the front end position of the cutting blade or the like. By providing such a tape rear end adhesive plate 115, the cutting operation of the rear end of the adhesive tape 200a can be easily performed. Furthermore, by having a slit or groove parallel to the tape width direction on the tape side surface of the tape rear end adhesive plate 115, the rear end of the adhesive tape 200a can be cut straight, thus ensuring stable adhesion quality at the cut portion. Additionally, operational safety is improved.

[0092] First, the tape tip restraint process in this tape application device 100 will be explained.

[0093] Figure 8 The diagram shown is of the tape front end constraint process.

[0094] First, such as Figure 8 As shown, the operator pulls out the adhesive tape roll 200, which is positioned on the tape setting shaft 106a with its axial edge determined, so that it becomes part of the belt 3a constituting the conveyor mechanism 3. Next, the operator presses and adheres the pulled-out adhesive tape 200a to the tape mounting roller 113 and tape mounting guide 114 from the non-adhesive side. Furthermore, because of the tension caused by the peeling force from the unwinding of the roll acting on the adhesive tape 200a, the operator can adhere the pulled-out adhesive tape 200a to the tape mounting roller 113 and tape mounting guide 114 with a non-slack tension.

[0095] Additionally, the operator will visually mark the edge of the adhesive tape 200a at a position consistent with the edge position in the width direction (see reference). Figure 7 The adhesive tape 200a is marked as a marker to be applied to the front end of the tape. This allows the operator to position the tape 200a straight from the roll of tape 200 without twisting, preventing misalignment and thus constraining the front end of the tape, thereby improving application accuracy.

[0096] Furthermore, by moving the sliding base 105 on the guide shafts 104a and 104b, the operator can attach the adhesive tape 200a at any position on the belt 3a constituting the conveyor mechanism 3. That is, regardless of the width of the electrode substrate 2, the operator can adjust the relative position of the edge of the electrode substrate 2 and the adhesive tape 200a.

[0097] Next, the tape tip cutting process in the tape application device 100 will be described.

[0098] Figure 9 The diagram shown is of the tape cutting process.

[0099] The operator will Figure 8 In the tape front-end constraint process shown, the front end of the adhesive tape 200a is constrained and positioned, i.e., the front end that may hinder adhesion due to the adhesion of the operator's hand oil, etc., is cut off.

[0100] The adhesive tape 200a is mostly made of a thin film and easily stretchable material. When cutting with a cutting blade, the stretching of the adhesive tape 200a makes it difficult to determine the cutting position and achieve a straight cut. Furthermore, when the cut surface of the adhesive tape 200a is curved, it is easy to create a portion that does not tightly adhere to the substrate surface (tape mounting roller 113 and tape mounting guide 114), causing it to lift after application. Additionally, when puncturing the film, the large protrusion of the cutting tool poses a safety concern during operation.

[0101] Therefore, in this embodiment, the adhesive tape 200a is adhered to the tape mounting guide 114 to eliminate the elongation of the adhesive tape 200a, and the cutting position is defined by guiding the movement path of the cutter through the front end of the guide 114b. This enables the adhesion quality of the cutting part and safe operation.

[0102] Specifically, such as Figure 9 As shown, after the operator cuts the tip of the adhesive tape 200a along the front cutting guide 114b with a cutting knife or the like, the operator rotates the push handle 110 assembled on the film setting arm 107 in a counterclockwise direction (arrow A) as shown in the figure. In this way, as the push handle 110 rotates, the push roller 109 rotates together with the push roller arm 108. Thus, the operator can... Figure 8 The adhesive tape 200a, whose front end is constrained to a tensioned state, is pressed and adhered to the surface of the belt 3a constituting the conveyor mechanism 3.

[0103] In addition, such as Figure 7 As shown, the push roller 109 is configured to cover the entire width of the adhesive tape 200a in order to push the adhesive tape 200a evenly.

[0104] The operator then continues pressing the push handle 110. By pressing the push handle 110, the path length of the adhesive tape 200a is increased, thus increasing the tension of the adhesive tape 200a. Then, through the operator's pressing of the push handle 110, the tape mounting roller 113 rotates towards the push roller 109 (clockwise in the figure), so the adhesive tape 200a adhered to the tape mounting roller 113 is cut off from the cutting surface.

[0105] Thus, during the tape tip cutting process, because the adhesive tape 200a can maintain tension, it is possible to remove the tape without positional shift. Figure 8 The tip of the adhesive tape 200a described herein comes into contact with human hands during the restraint process and may be contaminated with foreign matter such as hand oil that may hinder adhesion.

[0106] Next, the tape application process of applying pressure to the front end of the tape in the tape application device 100 will be described.

[0107] Figure 10 The diagram shows a process of applying pressure to the front end of the tape for bonding.

[0108] Here, for in Figure 9 The adhesive tape 200a that is pasted on the surface of the tape mounting roller 113 in the tape front-end cutting process refers to the process of pressing and pasting it onto the surface of the belt 3a constituting the conveyor mechanism 3 and the process of pressing and pasting the adhesive tape 200a onto the surface of the belt 3a.

[0109] Operator from Figure 9 Starting from the indicated state, by rotating the push handle 110 clockwise around the support pin 107b, the push roller arm 108 and the push roller 109 move together towards... Figure 9 The arrow points to direction B. Additionally, at this time, the membrane setting arm 107 is engaged via a latching mechanism (not shown). Figure 9 The position shown is fixed.

[0110] Here, it is maintained by the membrane setting arm 107. Figure 9 In the posture shown, the pressure means 111 pushes the pressure roller arm 108 towards the belt 3a, so the pressure roller 109 rolls while applying pressure to the surface of the belt 3a from the adhesive tape 200a. At this time, due to the... Figure 8 and Figure 9 In the process described, the tape mounting roller 113 and tape mounting guide 114 used to constrain the front end of the adhesive tape 200a are mounted on the mounting roller arm 112, which is rotatably configured with the mounting roller arm shaft 106b as the center, so that they can be withdrawn without hindering the movement of the push roller 109.

[0111] Operator in maintaining Figure 10 In the shown posture, by moving the tape application device 100 relative to the belt 3a constituting the conveyor mechanism 3, the adhesive tape 200a can be applied to the surface of the belt 3a.

[0112] For example, by turning band 3a counterclockwise ( Figure 10As the electrode substrate 2 in the belt 3a of the conveying mechanism 3 rotates in the direction of arrow C) on the upstream side of the roller 3c, the adhesive tape 200a is unwound from the adhesive tape roll 200 and adhered to the entire circumference of the surface of the belt 3a as the belt 3a moves.

[0113] Because the adhesive tape 200a is subjected to the tension caused by the peeling force when the adhesive tape roll 200 is unwound, and is bonded while being pressed by the push roller 109, it can be bonded in a state without deviation from the conveying direction of the tape 3a due to serpentine motion or floating off the surface of the tape 3a.

[0114] In this way, since the pressure roller 109 can maintain a pressing state, as it moves relative to the belt 3a constituting the conveyor mechanism 3, the adhesive tape 200a can be adhered to any position on the surface of the belt 3a while being unwound from the adhesive tape roll 200. Therefore, adhesion of any length can be achieved depending on the amount of relative movement.

[0115] Furthermore, by using a rotating roller, namely the push roller 109, as a tape pressing component, it can move in an arc around the adhesive tape 200a, and after contacting the surface of the tape 3a, it can move upward along the surface of the tape 3a. Thus, the leading edge of the adhesive tape 200a, which is adhered to the surface of the tape mounting roller 113, can be pressed wider and adhered to the surface of the tape 3a.

[0116] Furthermore, in this embodiment, a tape path exists within the movable range of the push roller 109. Therefore, the adhesive tape 200a adhered to the tape mounting roller 113 can be cut from the cutting surface without causing the tape position to deviate, and the tip of the adhesive tape 200a, which may have come into contact with a human hand during the restraint process and may have been contaminated with hand oil or other substances that hinder adhesion, can be removed.

[0117] Next, the treatment of the back end of the adhesive tape 200a when it is applied to the full circumference of tape 3a will be explained.

[0118] Here, Figure 11 The diagram shows the positional relationship of the back end of the tape when applying it along the entire circumference.

[0119] Figure 11 The position indicated by "a" is the junction between the adhesive tape 200a pulled from the adhesive tape roll 200 and the belt 3a constituting the conveyor mechanism 3. Additionally, Figure 11 The position indicated by "b" is the front end position of the initially pasted adhesive tape 200a, which is then wrapped around and returned to its original position.

[0120] Next, the tape end-end cutting process in the tape application device 100 will be described.

[0121] Figure 12 The diagram shown is a schematic of the tape cutting process at the rear end.

[0122] When the operator stops the movement of the belt 3a constituting the conveyor mechanism 3 at a position where the relationship between the distance from the rear cut guide 115a to point a and the distance from point a to point b is given by the following formula.

[0123] The distance from the rear cut guide 115a to point a is greater than or equal to the distance from point a to point b.

[0124] Next, as Figure 12 As shown, the operator pushes the handle 110 towards the... Figure 10 The arrow B rotates in the opposite direction and also releases the latch of the opening membrane setting arm 107, causing the push roller 109 to release from the pushing state.

[0125] Next, the operator presses and sticks the adhesive tape 200a pulled from the adhesive tape roll 200 onto the adhesive plate 115 at the rear end of the tape.

[0126] Next, the operator cuts the adhesive tape 200a at the position where the guide 115a is cut off at the rear end of the adhesive tape.

[0127] Next, the tape bonding process of the tape bonding device 100 will be explained.

[0128] Figure 13 The diagram shows the tape bonding process.

[0129] like Figure 13 As shown, the operator closes the membrane setting arm 107, and simultaneously latches the push roller 109 into a pushing state.

[0130] Next, the operator moves the belt 3a constituting the conveyor mechanism 3 towards... Figure 13 The direction of arrow D indicates rotational movement. Accompanying this rotational movement, the rear end cut point c of the adhesive tape 200a is cut as the belt 3a constituting the conveyor mechanism 3 moves. Then, the rear end cut point c of the adhesive tape 200a is pressed at the clamping point of the pressure roller 109 and overlapped and adhered to point b surrounding the front end of the tape.

[0131] Through the following process, the rear end of the adhesive tape 200a overlaps the initially pasted front end, is pressed and pasted by the push roller 109, so that the adhesive tape 200a can be pasted on the entire circumference of the belt 3a constituting the conveyor mechanism 3 to become the liquid adhesion part 11.

[0132] In addition, in this embodiment, the front end position of the initially pasted adhesive tape 200a that is wrapped around back, i.e., point b, is taken as the front end of the wrapped adhesive tape 200a. However, it is not limited to this, and is not limited to the front end of the adhesive tape 200a. By performing the same process at any position, the pasting length of the adhesive tape 200a can be changed.

[0133] Thus, according to this embodiment, during borderless printing, the liquid L sprayed onto the electrode substrate 2 adheres to the liquid adhesion member 11, and then the liquid L on the liquid adhesion member 11 is removed by the liquid removal member 12. Therefore, during borderless printing, printing can be performed without liquid L adhering to the belt 3a constituting the transport mechanism 3.

[0134] Furthermore, according to this embodiment, since the front end of the adhesive tape 200a is constrained and positioned, and the adhesive tape 200a, constrained to a tensioned state, is pressed down and adhered to the belt 3a, and after cutting off the portion of the initially constrained front end that is likely to have hand oil or the like adhering to it, the front end of the adhesive tape 200a is pushed down to adhere it, so high positional accuracy and reliable adhesion can be achieved with a simple structure and a small configuration. That is, according to this embodiment, in borderless printing, a liquid adhesion member 11 for printing without liquid adhering to the conveyor surface can be set with high precision using a small and simple device.

[0135] Alternatively, the control device of the electrode printing apparatus 1 can also control the liquid spray heads 4 and 7 to prevent the liquid L from being sprayed onto the area where the liquid adhesion member 11 is not provided on the conveying surface of the electrode substrate 2 in the belt 3a constituting the conveying mechanism 3. In this way, since the liquid L does not overflow from the liquid adhesion member 11, the conveying surface of the conveying mechanism 3 or the electrode printing apparatus 1 will not be soiled.

[0136] In addition, in this embodiment, ink (liquid L) is sprayed from liquid nozzles 4 and 7 to form an ink layer or active material layer on the electrode substrate 2. However, it is not limited to this. Liquid L containing insulating material can also be sprayed from the liquid nozzle to form an insulating layer.

[0137] (Second Implementation)

[0138] Next, the second embodiment will be described.

[0139] The second embodiment differs from the first embodiment in that the liquid adhesion member 11 is provided to cover the ends of the belt 3a constituting the conveying mechanism 3 in a direction parallel to the conveying surface of the electrode substrate 2 and orthogonal to the conveying direction X (the position where the liquid L is sprayed outside the electrode substrate 2). In the following description of the second embodiment, the parts identical to those in the first embodiment are omitted, and the differences from the first embodiment are described.

[0140] here, Figure 14 The image shown is a side view of the ink removal mechanism installed in the electrode printing apparatus 1 according to the second embodiment. Figure 15 The image shown is a front view of the cross-section of the ink removal mechanism installed in the electrode printing device 1, as seen from the downstream side in the conveying direction.

[0141] like Figure 14 and Figure 15 As shown, the liquid adhesion member 11 is arranged to cover the two ends of the belt 3a constituting the conveying mechanism 3 in a direction parallel to the conveying surface of the electrode substrate 11 and orthogonal to the conveying direction X (the position where the liquid L is sprayed outside the electrode substrate 2). Therefore, a portion of the liquid adhesion member 11 is sandwiched between the end of the electrode substrate 2 and the belt 3a constituting the conveying mechanism 3. As a result, the electrode substrate 2, in order to be flexible, is inclined at the two ends in the direction orthogonal to the conveying direction X relative to the conveying surface of the electrode substrate 2 in the belt 3a constituting the conveying mechanism 3.

[0142] Thus, by providing liquid attachment members 11 made of non-permeable material at the ends of both sides of the conveying surface of the electrode substrate 2 (the position where the liquid L is sprayed outside the electrode substrate 2), the liquid L sprayed from the liquid spray heads 4 and 7 outside the electrode substrate 2 adheres to the liquid attachment members 11, thereby preventing the liquid L from adhering to the outside of the electrode substrate 2 on the conveying surface of the electrode substrate 2 in the belt 3a constituting the conveying mechanism 3.

[0143] Furthermore, even in this embodiment, among the edges of the surface of the electrode substrate 2 that contacts the liquid attachment member, the longest distance between the uppermost edge (based on the liquid attachment member 11) and the liquid attachment member 11—that is, the distance (gap distance) that descends vertically from the end of the electrode substrate 2 to the liquid attachment member 11—is 30 μm or more. This prevents the liquid L adhering to the liquid attachment member 11 due to capillary action from circulating and permeating to the back surface of the electrode substrate 2.

[0144] (Third Implementation)

[0145] Next, the third embodiment will be described.

[0146] The third embodiment differs from the first and second embodiments in that it is an electrode forming apparatus having an electrode printing device 1. In the following description of the third embodiment, descriptions of parts identical to those of the first and second embodiments will be omitted, and descriptions will focus on aspects different from the first and second embodiments.

[0147] here, Figure 16The diagram shown is a schematic representation of the electrode forming apparatus 50 according to the third embodiment. Figure 16 As shown, the electrode forming apparatus 50 is equipped with a post-processing mechanism 20 after the electrode printing apparatus 1, such as a pressing roller for pressing the obtained thin film electrode, or a slit knife or laser for cutting the thin film electrode.

[0148] While the preferred embodiments and examples of the present invention have been described above, the present invention is not limited to the specific embodiments and examples described above. Various modifications and alterations can be made within the scope of the invention as described in the claims, unless otherwise specified in the foregoing description. For example, appropriate combinations of the technical content described in the foregoing embodiments or examples can also be made.

[0149] For example, in the above embodiments, the thin-film electrode that exerts the above-described effects of the present invention is applied to a lithium-ion secondary battery in detail, but it is not limited thereto, and can also be applied to or used in secondary batteries, power generation devices such as fuel cells, etc., which are the above-described energy storage devices.

[0150] The effects described in the embodiments of the present invention are merely examples of the best effects produced by the present invention, and the effects of the present invention are not limited to those described in the embodiments of the present invention.

[0151] <Note>

[0152] The preferred embodiments of the present invention are described below.

[0153] <Method 1>

[0154] An adhesive device, characterized in that it comprises:

[0155] Tape retaining components that hold the tape in place;

[0156] A tape mounting component that positions and adheres the front end of the tape held by the tape holding component, and

[0157] The tape pressurizing component operates by peeling the tape, which is constrained into a taut state and adhered to the tape mounting component, from the tape mounting component while simultaneously applying pressure to and bonding it to the conveying surface of the conveying substrate.

[0158] <Method 2>

[0159] The adhesive device according to method 1 is characterized in that:

[0160] The tape pressurizing component can continuously maintain pressure on the conveying surface of the tape.

[0161] <Third Method>

[0162] The adhesive device according to method 1 is characterized in that:

[0163] The tape pressing component has a rotating roller that presses the tape onto the conveying surface, and

[0164] The rotating roller is capable of moving in an arc around the tape and moving along the conveying surface after contacting it.

[0165] <The Fourth Method>

[0166] The adhesive device according to method 1 is characterized in that:

[0167] The tape has a path within the movable range of the tape pressurizing component.

[0168] <The Fifth Method>

[0169] The adhesive device according to any one of methods 1 to 4 is characterized in that:

[0170] The tape mounting component is equipped with a rotating roller.

[0171] When the tape pressurizing component makes movable contact along the conveying surface, the rotating roller can be moved in an upward manner.

[0172] <Method 6>

[0173] The adhesive device according to any one of methods 1 to 5 is characterized in that:

[0174] At least one side of the tape is an adhesive surface, and it is in the shape of a roll.

[0175] <The 7th Method>

[0176] The adhesive device according to any one of methods 1 to 6 is characterized in that:

[0177] The tape retaining component has an axially restricting component for the tape and a bearing component with low load resistance in the rotational direction.

[0178] <The 8th Method>

[0179] The adhesive device according to any one of methods 1 to 7 is characterized in that:

[0180] The tape mounting component is marked with a position that corresponds to the edge position of the tape in the width direction, which is positioned by the tape holding component.

[0181] <The 9th Method>

[0182] The adhesive device according to any one of methods 1 to 8 is characterized in that:

[0183] The tape mounting component has a slit or groove on the surface where the tape is pasted, which is parallel to the width direction of the tape.

[0184] <The 10th Method>

[0185] The adhesive device according to any one of methods 1 to 9 is characterized in that:

[0186] A tape rear end pasting member is provided on one side of the conveying surface in the middle of the path of the tape connecting the tape holding member and the tape mounting member.

[0187] <Method 11>

[0188] The adhesive device according to method 10 is characterized in that:

[0189] The adhesive tape back end bonding component has a slit or groove on the side surface of the tape that is parallel to the width direction of the tape.

[0190] <Method 12>

[0191] The adhesive device according to method 1 is characterized in that:

[0192] The tape, the tape holding component, the tape mounting component, and the tape pressurizing component can move along the width direction of the conveying surface while maintaining alignment with the conveying surface.

[0193] <The 13th Method>

[0194] A liquid injection device, characterized in that it comprises:

[0195] The adhesive device according to any one of methods 1 to 12;

[0196] Conveying section of the conveying base;

[0197] A liquid adhesion component, which is disposed on the delivery section by the adhesive device and partially sandwiched between the end of the substrate and the delivery section, and

[0198] The spraying unit sprays a liquid composition onto the substrate and the liquid adhesion component.

[0199] The substrate is inclined relative to the conveying surface of the substrate in the conveying section.

[0200] <Method 14>

[0201] An electrode forming apparatus, characterized in that it comprises:

[0202] The liquid injection device described in Method 13, and

[0203] A post-processing mechanism is installed after the liquid injection device.

[0204] The substrate is an electrode substrate.

[0205] <Method 15>

[0206] A multilayer diaphragm forming apparatus, characterized in that:

[0207] Equipped with the liquid injection device described in embodiment 13

[0208] The substrate is a diaphragm.

[0209] <Method 16>

[0210] A method of pasting, characterized by comprising:

[0211] The tape holding process involves holding the tape on a tape holding component.

[0212] The tape application process involves positioning the front end of the tape held by the tape holding member to the tape mounting member and then applying it.

[0213] A tape pressing process is a process in which the tape, which is attached to the tape mounting component and constrained to a taut state, is peeled off from the tape mounting component while applying pressure to the conveying surface of the conveying substrate and sticking the tape, thereby actuating the tape pressing component.

[0214] <Method 17>

[0215] The pasting method according to method 16 is characterized in that:

[0216] The tape installation process involves positioning and attaching the tape to the tape installation component, followed by cutting off the front end of the tape from the tape installation component.

[0217] <The 18th Method>

[0218] The pasting method according to method 16 is characterized in that:

[0219] After the tape pressing process involves pressing the tape onto the conveyor surface using the tape pressing component, the tape is then peeled off from the tape mounting component by allowing the tape pressing component to move along the conveyor surface until the front end of the tape is adhered to the conveyor surface.

[0220] <Method 19>

[0221] The pasting method according to method 16 is characterized in that:

[0222] The tape pressing process involves applying pressure to the conveyor surface using the tape pressing component, and simultaneously attaching the tape to any position through the relative movement of the tape pressing component and the conveyor surface.

[0223] <Method 20>

[0224] The pasting method according to any one of methods 16 to 19 is characterized in that:

[0225] The substrate is an electrode substrate.

[0226] <Method 21>

[0227] The pasting method according to any one of methods 16 to 19 is characterized in that:

[0228] The substrate is a diaphragm.

Claims

1. A liquid injection device, characterized in that... include: Conveying section of the conveying base; A liquid adhesion component disposed on the conveying section and partially sandwiched between the end of the base body and the conveying section, and A jetting section that sprays a liquid composition onto the substrate and the liquid adhesion component. A portion of the liquid adhesion component is sandwiched between the end of the substrate and the delivery section, thereby tilting the substrate at the delivery surface of the substrate in the delivery section.

2. The liquid injection device according to claim 1, characterized in that: It has a removal section to remove the liquid composition sprayed onto the liquid adhesion component.

3. The liquid injection device according to claim 1 or 2, characterized in that: The spraying section does not spray the liquid composition in the area of ​​the delivery section where the liquid adhesion component is not provided.

4. The liquid injection device according to claim 1, characterized in that: The liquid-adhesive component is made of a non-permeable material.

5. The liquid injection device according to claim 4, characterized in that: The non-permeable material is a synthetic resin.

6. The liquid injection device according to claim 1, characterized in that: Among the edges of the surface in the substrate that contacts the liquid-adhesive component, the distance between the uppermost edge, with reference to the liquid-adhesive component, and the liquid-adhesive component is 30 μm or more.

7. The liquid injection device according to claim 1, characterized in that: The spraying section sprays the liquid composition beyond the end of the substrate in the width direction orthogonal to the delivery direction.

8. The liquid injection device according to claim 1, characterized in that: The liquid adhesion component is provided on the conveying section by an adhesive device provided on the upstream side of the conveying section in the conveying direction.

9. The liquid injection device according to claim 8, characterized in that, The adhesive device includes: Tape retaining components that hold the tape in place; A tape mounting component that positions and adheres the front end of the tape held by the tape holding component, and The tape pressurizing component operates by peeling the tape, which is constrained and tensioned by being attached to the tape mounting component, from the tape mounting component while simultaneously applying pressure and attaching it to the conveying surface of the conveying substrate.

10. The liquid injection device according to claim 1, characterized in that: The spray section sprays the liquid composition from the liquid spray head.

11. The liquid injection device according to claim 1, characterized in that: The liquid adhesion component is disposed on one end of the substrate in the conveying section, in a direction parallel to the conveying surface and orthogonal to the conveying direction.

12. The liquid injection device according to claim 1, characterized in that: The liquid adhesion components are disposed at both ends of the substrate in the conveying section in a direction parallel to the conveying surface and orthogonal to the conveying direction.

13. The liquid injection device according to claim 1, characterized in that: The substrate is a current collector, which is a metal part, used to extract the electricity stored in the electrode body inside the battery casing to the outside of the battery casing.

14. The liquid injection device according to claim 1, characterized in that: The substrate is an electrode element having a current collector, which is a metal part, for extracting the electricity stored in the electrode body inside the battery housing to the outside of the battery housing, and an active material layer formed on the current collector.

15. The liquid injection device according to claim 1, characterized in that: The spraying section sprays the liquid composition containing an insulating material.

16. The liquid injection device according to claim 1, characterized in that: The conveyor unit is a belt conveyor.

17. The liquid injection device according to claim 1, characterized in that: The spraying section sprays a liquid composition onto the surface and sides of the substrate.

18. An electrode forming apparatus, characterized in that... include: The liquid injection device according to any one of claims 1 to 17, and A post-processing mechanism is installed after the liquid injection device. The substrate is an electrode substrate.

19. A multilayer diaphragm forming apparatus, characterized in that: Equipped with any one of claims 1 to 17, The substrate is a diaphragm.

20. A liquid injection method, characterized in that... include: The conveying process of the conveying substrate; The process of installing a liquid adhesion member on the upper part of the conveying section of the conveying base, sandwiched between the end of the base and the conveying section, and A spraying process for spraying a liquid composition onto the substrate and the liquid adhesion component. A portion of the liquid adhesion component is sandwiched between the end of the substrate and the delivery section, thereby tilting the substrate at the delivery surface of the substrate in the delivery section.

21. The liquid spraying method according to claim 20, further comprising an adhesive bonding step, characterized in that: The tape holding process involves holding the tape on a tape holding component. The tape application process involves positioning the front end of the tape held by the tape holding member to the tape mounting member and then applying it. A tape pressing process is a process in which the tape, which is attached to the tape mounting component and constrained to a tensioned state, is peeled off from the tape mounting component while applying pressure to the conveying surface of the conveying substrate and sticking to it, thereby actuating the tape pressing component.

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