A laser chip aging test device

Abstract

The application relates to a laser chip aging test device and relates to the technical field of chip reliability testing, which comprises a test body, a temperature control heat sink plate, a test clamp, an electric heating sheet, an air cooling assembly and a heat dissipation assembly. Through the above structure, the heat dissipation efficiency can be adjusted, heating or heat dissipation can be assisted for different types of chips, aging of different power chips can be adapted, and the adaptability is relatively strong.

Description

Technical Field

[0001] This invention relates to the field of chip reliability testing technology, and in particular to a laser chip aging test device. Background Technology

[0002] To ensure chip quality and reliability, aging tests are often used after chip manufacturing to screen out chips that fail early. Chip aging tests typically employ high-temperature power aging, which requires powering the chip and controlling it to a specified temperature. During aging testing, the chip itself generates some heat. When the chip's heat generation is low, an external heat source is needed to keep the fixture holding the chip at the specified temperature. When the chip's heat generation is high, the chip's own heat will cause the fixture temperature to exceed the specified temperature, requiring forced cooling using a fan and heatsink.

[0003] Patent CN112578149B discloses an aging device for chip reliability testing. This invention's aging device for chip reliability testing separates the test section requiring temperature control from the drive section requiring heat dissipation through a partition. Combined with a heating plate in the chip fixture and a heat sink below the heating plate, it not only ensures that the temperature of the test chamber is unaffected by temperature fluctuations in the drive chamber but also allows the chip to remain stable at the test temperature, thereby improving test accuracy. Furthermore, the support, heat dissipation pad, heat sink, exhaust fan, and air inlet located on the drive circuit board quickly remove heat generated in the drive chamber, protecting the drive circuit board. This achieves temperature control separation between the test section and the drive section, ensuring the normal operation of the equipment components.

[0004] However, the existing aging equipment for chip reliability testing is inadequate because different types of chips have vastly different thermal power, and the heat dissipation efficiency of the aging equipment is difficult to adjust, making it unsuitable for aging chips with different power levels. Therefore, there is an urgent need for a laser chip aging test device. Summary of the Invention

[0005] In view of the current situation of the prior art, the present invention provides a laser chip aging test device, which can effectively solve the problem that the existing technology cannot adapt to the aging of chips with different power because the thermal power of different types of chips varies greatly and the heat dissipation efficiency of the aging equipment is inconvenient to adjust.

[0006] This invention is achieved through the following technical solution:

[0007] This invention provides a laser chip aging test apparatus, comprising:

[0008] The test body has an opening at the top and an internal cavity.

[0009] A temperature-controlled heat sink plate is arranged at the opening and forms a heat dissipation space with the bottom surface of the accommodating cavity.

[0010] A test fixture is arranged at the temperature-controlled heat sink plate for clamping the chip on the top of the temperature-controlled heat sink plate.

[0011] An electric heating sheet is arranged at the temperature-controlled heat sink plate for heating the temperature-controlled heat sink plate.

[0012] An air cooling assembly is arranged at the heat dissipation space for providing cold air flow to the heat dissipation space.

[0013] A heat dissipation assembly includes an expansion unit and a heat dissipation sheet, the expansion unit connects the temperature-controlled heat sink plate and the heat dissipation sheet, when the temperature in the heat dissipation space is lower than a set value, the expansion unit drives the heat dissipation sheet to be close to the temperature-controlled heat sink plate, when the temperature in the heat dissipation space is higher than a set value, the expansion unit drives the heat dissipation sheet to be away from the temperature-controlled heat sink plate, the heat dissipation sheet has a first position abutting the bottom of the temperature-controlled heat sink plate and a second position spaced from the bottom of the temperature-controlled heat sink plate.

[0014] Further, the expansion unit includes a welding head, an air bag, a diaphragm and a nut, the welding head is arranged at the temperature-controlled heat sink plate and has an opening at the bottom and an expansion space formed inside, the air bag is arranged in the expansion space, the diaphragm is located at the opening of the welding head and connected with the air bag, the nut is connected with the diaphragm and at least part of it extends out of the opening of the welding head, the heat dissipation sheet is arranged at the bottom end of the nut, when the temperature in the heat dissipation space is lower than a set value, the air bag contracts and drives the heat dissipation sheet to the first position, when the temperature in the heat dissipation space is higher than a set value, the air bag expands and drives the heat dissipation sheet to the second position.

[0015] Further, one side surface and the bottom surface of the test body are respectively provided with a first air passage communicating with the heat dissipation space.

[0016] Further, the test device further includes a driving circuit board arranged in the accommodating cavity for electrifying the chip.

[0017] Further, the test device further includes a deflector arranged in the heat dissipation space for adjusting the air flow direction of the air cooling assembly.

[0018] Further, the air cooling assembly is a centrifugal fan.

[0019] Further, the temperature-controlled heat sink plate is inlaid with a heat pipe for air flow.

[0020] Further, the extension direction of the heat pipe is the same as the airflow direction of the centrifugal fan.

[0021] Further, the electric heating sheet is arranged at the bottom of the temperature-controlled heat sink plate through a heat-conducting glue.

[0022] Further, the testing device further comprises a testing box, at least one mounting slot for mounting the testing body is formed on one side of the testing box, and the testing box is provided with a second air passage communicating with the mounting slot.

[0023] Compared with the prior art, the present application has the following advantages and beneficial effects:

[0024] By arranging the testing body, the temperature-controlled heat sink plate, the testing fixture, the electric heating sheet, the air-cooling assembly and the heat-dissipating assembly, the chip is first clamped on the top of the temperature-controlled heat sink plate through the testing fixture, then the chip is powered on and tested, when the power of the chip is large, the testing device needs to dissipate heat, at this time, the air-cooling assembly provides cold air flow to the heat-dissipating space, and the cold air flow flows through the top opening of the testing body and carries away heat, at this time, the temperature in the heat-dissipating space is lower than the set value, the expansion unit drives the heat sink fins to move towards the temperature-controlled heat sink plate, i.e., the heat sink fins are at the first position, the heat sink fins are in close contact with the bottom of the temperature-controlled heat sink plate, the heat sink fins can quickly dissipate heat to the heat-dissipating space and carry away the heat through the cold air flow, through the synergistic heat dissipation effect of the air-cooling assembly and the heat sink fins, the heat dissipation efficiency can be increased, and the aging of the high-power chip can be adapted; when the power of the chip is small, the testing device needs to provide heat, at this time, the electric heating sheet heats the temperature-controlled heat sink plate, and the air-cooling assembly does not work, at this time, the airflow in the testing device is in a natural convection state, heat is conducted to the heat expansion unit through the temperature-controlled heat sink plate, since no cold air flow is provided, the temperature in the heat-dissipating space is higher than the set value, the expansion unit drives the heat sink fins to move away from the temperature-controlled heat sink plate, i.e., the heat sink fins are at the second position, the heat sink fins are spaced apart from the bottom of the temperature-controlled heat sink plate, the heat sink fins cannot conduct heat, heat waste is avoided, the heat provided by the electric heating sheet is reduced, energy is saved, the heat dissipation efficiency is reduced, and the aging of the low-power chip can be adapted; by arranging the above structure, the heat dissipation efficiency can be adjusted, the chips of different types can be heated or cooled, the aging of chips of different powers can be adapted, and the adaptability is high. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 The three-dimensional structure of the laser chip aging test device provided by the present application is shown in the embodiment Figure 1 ;

[0026] Figure 2 A three-dimensional structural diagram of an embodiment of the laser chip aging test device provided by the present invention. Figure 2 ;

[0027] Figure 3 A three-dimensional structural diagram of an embodiment of the laser chip aging test device provided by the present invention. Figure 3 ;

[0028] Figure 4 for Figure 3 A schematic diagram of the cross-sectional structure along the BB direction;

[0029] Figure 5 This is a front view structural diagram of an embodiment of the expansion unit provided by the present invention;

[0030] Figure 6 for Figure 5 A schematic diagram of the cross-sectional structure along the AA direction;

[0031] Figure 7 This is a three-dimensional structural schematic diagram of another embodiment of the laser chip aging test device provided by the present invention.

[0032] Reference numerals: 1. Test body; 11. Receiving cavity; 12. First vent; 2. Temperature-controlled heat sink plate; 21. Heat pipe; 3. Test fixture; 31. Chip; 4. Electric heating element; 5. Air-cooled assembly; 6. Heat dissipation assembly; 61. Expansion unit; 611. Welding head; 612. Airbag; 613. Diaphragm; 614. Nut; 62. Heat sink; 7. Air guide plate; 8. Test box; 81. Mounting slot; 82. Second vent. Detailed Implementation

[0033] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which constitute a part of this application and are used together with the embodiments of the present invention to illustrate the present invention, but are not intended to limit the present invention.

[0034] like Figures 1 to 7 As shown, the laser chip aging test device provided by the present invention includes a test body 1, a temperature control heat sink plate 2, a test fixture 3, an electric heating element 4, an air cooling component 5, and a heat dissipation component 6.

[0035] The test body 1 has an opening at the top and an internal cavity 11.

[0036] The temperature-controlled heat sink plate 2 is located at the opening and forms a heat dissipation space between it and the bottom surface of the receiving cavity 11.

[0037] The test fixture 3 is disposed on the temperature-controlled heat sink plate 2 to clamp the chip 31 on the top of the temperature-controlled heat sink plate 2.

[0038] The electric heating sheet 4 is arranged on the temperature-controlled heat sink plate 2 for heating the temperature-controlled heat sink plate 2.

[0039] The air-cooling assembly 5 is arranged on the heat dissipation space for providing cold air flow to the heat dissipation space.

[0040] The heat dissipation assembly 6 comprises an expansion unit 61 and a heat dissipation sheet 62, the expansion unit 61 connects the temperature-controlled heat sink plate 2 and the heat dissipation sheet 62, when the temperature in the heat dissipation space is lower than a set value, the expansion unit 61 is used to drive the heat dissipation sheet 62 to be close to the temperature-controlled heat sink plate 2, when the temperature in the heat dissipation space is higher than a set value, the expansion unit 61 is used to drive the heat dissipation sheet 62 to be away from the temperature-controlled heat sink plate 2, the heat dissipation sheet 62 has a first position abutting with the bottom of the temperature-controlled heat sink plate 2 and a second position spaced apart from the bottom of the temperature-controlled heat sink plate 2.

[0041] When the temperature in the heat dissipation space is lower than a set value, the expansion unit 61 is used to drive the heat dissipation sheet 62 to the first position, when the temperature in the heat dissipation space is higher than a set value, the expansion unit 61 is used to drive the heat dissipation sheet 62 to the second position.

[0042] In actual use scenarios, since different types of chips 31 have large differences in thermal power, and the number of loaded chips 31 is not fixed, it is necessary for the aging device to have strong heat dissipation capacity and to provide sufficient heating power. The stronger the heat dissipation capacity of the test device, the greater the total power of the chips 31 that can be aged, the higher the heating power, the faster the temperature rise of the test device, and the higher the supportable temperature. In order to increase the heat dissipation capacity of the test device, a large-size heat dissipation sheet 62 needs to be designed, but when a small-power chip 31 is high-temperature aged, the large-size heat dissipation sheet 62 will waste a large amount of heat, causing a large amount of energy waste. Therefore, the present application provides a laser chip aging test device which can adjust the heat dissipation efficiency, assist in heating or heat dissipation for different types of chips 31, adapt to the aging of different power chips 31, and has strong adaptability.

[0043] The application sets the test body 1, the temperature control heat sink plate 2, the test fixture 3, the electric heating sheet 4, the air cooling assembly 5 and the heat dissipation assembly 6, etc. The chip 31 is clamped on the top of the temperature control heat sink plate 2 through the test fixture 3, and then the chip 31 is powered and tested. When the power of the chip 31 is large, the heat needs to be dissipated through the test device. At this time, the air cooling assembly 5 provides cold air flow to the heat dissipation space, and the cold air flow flows through the top opening of the test body 1 and carries away the heat. At this time, the temperature in the heat dissipation space is lower than the set value, the expansion unit 61 drives the cooling fins 62 to move close to the temperature control heat sink plate 2, that is, the cooling fins 62 are in the first position, the cooling fins 62 are attached to the bottom of the temperature control heat sink plate 2, and the cooling fins 62 can quickly dissipate heat to the heat dissipation space and be carried away by the cold air flow. Through the synergistic effect of the air cooling assembly 5 and the cooling fins 62, the heat dissipation efficiency can be increased, and the aging of the large-power chip 31 can be adapted. When the power of the chip 31 is small, the heat needs to be supplied through the test device. At this time, the electric heating sheet 4 heats the temperature control heat sink plate 2, and the air cooling assembly 5 does not work. At this time, the airflow in the test device is in a natural convection state, and the heat is conducted to the heat expansion unit 61 through the temperature control heat sink plate 2. Since no cold air flow is provided, the temperature in the heat dissipation space is higher than the set value. The expansion unit 61 drives the cooling fins 62 to move away from the temperature control heat sink plate 2, that is, the cooling fins 62 are in the second position, the cooling fins 62 are spaced apart from the bottom of the temperature control heat sink plate 2, and the cooling fins 62 cannot conduct heat, thereby avoiding waste of heat, reducing the heat provided by the electric heating sheet 4, saving energy, reducing the heat dissipation efficiency, and adapting to the aging of the small-power chip 31. The application can adjust the heat dissipation efficiency, assist in heating or cooling for different types of chips 31, adapt to the aging of chips 31 with different powers, and has strong adaptability.

[0044] For different types of chips 31, there are generally thermal power parameters, so the cooling fins 62 are in the first position or the second position, which can be adjusted according to actual conditions. When the power of the chip 31 is large or small, the temperature in the heat dissipation space is theoretically large or small, and the temperature in the heat dissipation space is relatively large or small relative to the temperature set value in the heat dissipation space. In actual application, when the power of the chip 31 is large, the heat can be dissipated according to the above operation steps; when the power of the chip 31 is small, the heat can be heated according to the above operation steps. The temperature in the test device always meets the actual demand. In actual application, the inside of the test device can be maintained at a lower temperature, the service life of the electronic components in the test device is improved, and the reliability of the equipment is improved.

[0045] To facilitate switching of the heat sink 62 between the first and second positions, the expansion unit 61 includes a welding head 611, an air bladder 612, a diaphragm 613, and a nut 614. The welding head 611 is located on the temperature-controlled heat sink plate 2 and has an opening at its bottom with an expansion space inside. The air bladder 612 is located in the expansion space. The diaphragm 613 is located at the opening of the welding head 611 and connected to the air bladder 612. The nut 614 is connected to the diaphragm 613 and at least partially extends out of the opening of the welding head 611. The heat sink 62 is located at the bottom end of the nut 614. When the temperature in the heat dissipation space is lower than a set value, the air bladder 612 contracts and drives the heat sink 62 to the first position. When the temperature in the heat dissipation space is higher than the set value, the air bladder 612 expands and drives the heat sink 62 to the second position. The expansion unit 61 structure designed in this invention utilizes the principle of gas thermal expansion. Compared with the small thermal expansion coefficient of conventional solid materials, gas thermal expansion can achieve millimeter-level expansion and contraction, which is sufficient to make the heat sink 62 fit or detach from the temperature control heat sink plate 2.

[0046] To facilitate adjustment of heat dissipation efficiency, the test body 1 has a first vent 12 on one side and the bottom, which communicates with the heat dissipation space. When heat dissipation is required through the test device, the first vent 12 provides a cool airflow to the heat dissipation space. The cool airflow flows through the top opening of the test body 1 and the first vent 12, carrying away heat and resulting in higher heat dissipation efficiency, which is convenient for practical applications.

[0047] In a preferred embodiment, the testing apparatus further includes a drive circuit board disposed in the receiving cavity 11 for powering the chip 31. This design facilitates testing and practical application.

[0048] To facilitate adjustment of heat dissipation efficiency, the testing device further includes an air guide plate 7, which is disposed in the heat dissipation space to adjust the airflow direction of the air-cooling component 5. The air-cooling component 5 is a centrifugal fan. The air guide plate 7 can change the airflow direction of the air-cooling component 5. When the airflow direction is the same as the natural convection direction of the first vent 12, the heat dissipation efficiency is maximum. When the airflow direction is at an angle to the natural convection direction of the first vent 12, the heat dissipation efficiency is lower. Therefore, the air guide plate 7 is provided to facilitate adjustment of the heat dissipation efficiency.

[0049] In order to ensure the uniformity of the temperature of the chip 31, the heat pipe 21 for airflow passing is embedded in the temperature control heat sink plate 2. By arranging the heat pipe 21, the longitudinal heat conduction of the temperature control heat sink plate 2 is increased, so as to ensure the uniformity of the temperature of the chip 31 and adapt to the aging of different power chips 31. As a preferred embodiment, the extension direction of the heat pipe 21 is the same as the airflow direction of the centrifugal fan. Such design makes the temperature of the chip 31 more uniform and can adapt to the aging of different power chips 31.

[0050] In order to facilitate the adjustment of the size of the heat dissipation efficiency, the electric heating sheet 4 is arranged at the bottom of the temperature control heat sink plate 2 through the heat-conducting glue. Such design facilitates heat conduction, so as to facilitate the adjustment of the size of the heat dissipation efficiency.

[0051] In order to facilitate the mass testing of the chip 31, the testing device further comprises a testing box 8, one side of the testing box 8 is provided with at least one mounting groove 81 for respectively mounting the testing body 1, and the testing box 8 is provided with a second air permeation opening 82 communicating with the mounting groove 81. In particular, the first air permeation opening 12 and the second air permeation opening 82 are both mesh structures. Such design can improve the efficiency of chip 31 testing and facilitate practical application.

[0052] The working principle of the laser chip aging test device provided by the application when the power of the tested chip 31 is large is as follows:

[0053] First, the chip 31 is clamped on the top of the temperature control heat sink plate 2 through the testing clamp 3, and then the chip 31 is powered on and tested through the driving circuit board. Since heat dissipation is required through the testing device, the air cooling assembly 5 provides cold airflow to the heat dissipation space, and the cold airflow flows through the top opening of the testing body 1 and the first air permeation opening 12 and carries away heat. At this time, the temperature in the heat dissipation space is lower than the set value, the expansion unit 61 drives the cooling fin 62 to move towards the temperature control heat sink plate 2, that is, the cooling fin 62 is at the first position, the cooling fin 62 is attached to the bottom of the temperature control heat sink plate 2, and the cooling fin 62 can quickly dissipate heat to the heat dissipation space and carry away the heat through the cold airflow. Through the synergistic heat dissipation effect of the air cooling assembly 5 and the cooling fin 62, the heat dissipation efficiency can be increased, and the aging of the high-power chip 31 can be adapted.

[0054] The working principle of the laser chip aging test device provided by the application when the power of the tested chip 31 is small is as follows:

[0055] First, the chip 31 is clamped on the top of the temperature-controlled heat sink plate 2 by the test fixture 3, and then the chip 31 is powered and tested by the driving circuit board, and since heat supply is needed by the testing device, the electric heating sheet 4 heats the temperature-controlled heat sink plate 2, and the air cooling assembly 5 does not work, and at this time, the testing device is in a natural convection state, heat is conducted to the thermal expansion unit 61 through the temperature-controlled heat sink plate 2, and since no cold air flow is provided, the temperature in the heat dissipation space is higher than the set value, the expansion unit 61 drives the heat dissipation sheet 62 to move away from the temperature-controlled heat sink plate 2, that is, the heat dissipation sheet 62 is in the second position, the heat dissipation sheet 62 is spaced apart from the bottom of the temperature-controlled heat sink plate 2, and the heat dissipation sheet 62 cannot conduct heat, thereby avoiding waste of heat, reducing the heat provided by the electric heating sheet 4, saving energy, and reducing the heat dissipation efficiency, and being able to adapt to the aging of the small-power chip 31.

[0056] Compared with the prior art, the laser chip aging test device has the following beneficial effects:

[0057] The application sets the test body 1, the temperature control heat sink plate 2, the test fixture 3, the electric heating sheet 4, the air cooling assembly 5 and the heat dissipation assembly 6, etc. The chip 31 is clamped on the top of the temperature control heat sink plate 2 through the test fixture 3, and the chip 31 is powered and tested. When the power of the chip 31 is large, the heat needs to be dissipated through the test device. At this time, the air cooling assembly 5 provides cold air flow to the heat dissipation space, and the cold air flow flows through the top opening of the test body 1 and carries away the heat. At this time, the temperature in the heat dissipation space is lower than the set value, the expansion unit 61 drives the cooling fin 62 to move close to the temperature control heat sink plate 2, that is, the cooling fin 62 is at the first position, the cooling fin 62 is attached to the bottom of the temperature control heat sink plate 2, and the cooling fin 62 can quickly dissipate heat to the heat dissipation space and be carried away by the cold air flow. Through the synergistic effect of the air cooling assembly 5 and the cooling fin 62, the heat dissipation efficiency can be increased, and the aging of the large-power chip 31 can be adapted. When the power of the chip 31 is small, the test device needs to be heated. At this time, the electric heating sheet 4 heats the temperature control heat sink plate 2, and the air cooling assembly 5 does not work. At this time, the airflow in the test device is in a natural convection state, and the heat is conducted to the heat expansion unit 61 through the temperature control heat sink plate 2. Since no cold air flow is provided, the temperature in the heat dissipation space is higher than the set value, the expansion unit 61 drives the cooling fin 62 to move away from the temperature control heat sink plate 2, that is, the cooling fin 62 is at the second position, the cooling fin 62 is spaced apart from the bottom of the temperature control heat sink plate 2, and the cooling fin 62 cannot conduct heat, avoiding waste of heat, so that the heat provided by the electric heating sheet 4 is reduced, energy is saved, the heat dissipation efficiency is reduced, and the aging of the small-power chip 31 can be adapted. The application can adjust the heat dissipation efficiency, assist in heating or cooling for different types of chips 31, adapt to the aging of chips 31 of different powers, and has strong adaptability.

[0058] The above is only a preferred embodiment of the application, not any form of limitation on the application. Any simple modification or equivalent change made according to the technical essence of the application to the above embodiment falls within the protection scope of the application.

Claims

1. A laser chip burn-in test apparatus, characterized by, The test device comprises: a test body, which is open at the top and has a containing cavity formed inside; a temperature-controlled heat sink plate, which is arranged at the opening and forms a heat dissipation space with the bottom surface of the containing cavity; a test fixture, which is arranged on the temperature-controlled heat sink plate for clamping a chip on the top of the temperature-controlled heat sink plate; an electric heating sheet, which is arranged on the temperature-controlled heat sink plate for heating the temperature-controlled heat sink plate; an air cooling assembly, which is arranged in the heat dissipation space for providing a cold air flow to the heat dissipation space; a heat dissipation assembly, which comprises an expansion unit and a heat dissipation sheet, the expansion unit is connected to the temperature-controlled heat sink plate and the heat dissipation sheet, when the temperature in the heat dissipation space is lower than a set value, the expansion unit drives the heat dissipation sheet to be close to the temperature-controlled heat sink plate, when the temperature in the heat dissipation space is higher than a set value, the expansion unit drives the heat dissipation sheet to be away from the temperature-controlled heat sink plate, the heat dissipation sheet has a first position abutting the bottom of the temperature-controlled heat sink plate and a second position spaced from the bottom of the temperature-controlled heat sink plate; the expansion unit comprises a welding head, an air bag, a diaphragm and a nut, the welding head is arranged on the temperature-controlled heat sink plate and is open at the bottom and has an expansion space formed inside, the air bag is arranged in the expansion space, the diaphragm is located at the opening of the welding head and is connected to the air bag, the nut is connected to the diaphragm and at least part of it extends out of the opening of the welding head, the heat dissipation sheet is arranged at the bottom end of the nut, when the temperature in the heat dissipation space is lower than a set value, the air bag contracts and drives the heat dissipation sheet to the first position, when the temperature in the heat dissipation space is higher than a set value, the air bag expands and drives the heat dissipation sheet to the second position.

2. The laser chip burn-in test apparatus according to claim 1, characterized by A first air passage is formed in one side and the bottom of the test body and communicates with the heat dissipation space.

3. The laser chip burn-in test apparatus according to claim 2, wherein The test device further comprises a driving circuit board, which is arranged in the containing cavity for electrifying the chip.

4. The laser chip burn-in test apparatus according to claim 3, wherein The test device further comprises a wind deflector, which is arranged in the heat dissipation space for adjusting the air flow direction of the air cooling assembly.

5. The laser chip burn-in test apparatus according to claim 4, wherein The air cooling assembly is a centrifugal fan.

6. The laser chip burn-in test apparatus according to claim 5, wherein A heat pipe is embedded in the temperature-controlled heat sink plate for air flow.

7. The laser chip burn-in test apparatus according to claim 6, wherein The extension direction of the heat pipe is the same as the air flow direction of the centrifugal fan.

8. The laser chip burn-in test apparatus according to claim 7, wherein The electric heating sheet is arranged on the bottom of the temperature-controlled heat sink plate through a heat-conducting adhesive.

9. The laser chip burn-in test apparatus according to any one of claims 1 to 8, characterized by, The test device further comprises a test box, one side of which is provided with at least one mounting slot for mounting the test body, and the test box is provided with a second air passage communicating with the mounting slot.

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