Wave soldering fixture and method of using wave soldering fixture

Abstract

The present application relates to the technical field of wave-soldering fixture, and discloses a wave-soldering fixture and a use method of the wave-soldering fixture.The wave-soldering fixture comprises a connecting part and an insulating part.The connecting part is adapted to be connected to the welding surface of a board to be welded, is located between two groups of pins to be welded, and is spaced apart from each group of pins to be welded by a first preset interval.The insulating part is connected to the side of the connecting part away from the board, and the distance between the projection of the insulating part on the welding surface and the pins to be welded is at least the first preset interval.The present application can form an interval in the thickness direction between two groups of pins to be welded, thereby preventing the pins from being connected to tin.

Description

Technical Field

[0001] This invention relates to the field of wave soldering fixture technology, specifically to wave soldering fixtures and methods of using wave soldering fixtures. Background Technology

[0002] A PCB (Printed Circuit Board) typically connects several components. One method of connection between components and the PCB is wave soldering. In wave soldering, the component leads are first inserted into the soldering surface of the PCB, and then the PCB is placed on a conveyor belt and passed through a wave soldering oven where it comes into contact with high-temperature molten solder. In traditional wave soldering, due to the small spacing between adjacent leads, the solder can easily clump together, causing solder bridging. This solder bridging usually leads to short circuits between adjacent leads, rendering the PCB unusable.

[0003] One method in the related technology is to design a solder drag pad for each wave soldering pin to prevent solder bridging. However, due to the influence of the direction of the PCB board passing through the wave soldering oven, not all components to be wave soldered can have solder drag pads added. The pins of components that cannot have solder drag pads added still have solder bridging.

[0004] In another approach to related technologies, solder resist is applied around the pins of the component to be soldered. However, when the spacing between two adjacent pins is very close, the solder resist is less effective at preventing solder bridging between the pins. Summary of the Invention

[0005] In view of this, the present invention provides a wave soldering fixture and a method for using the wave soldering fixture to solve the problems in the related art where some pins still have solder bridging because the PCB board's conveying direction makes it impossible to add solder pads, and where the solder resist white paint is less effective in preventing solder bridging when the spacing between two adjacent pins is very close.

[0006] In a first aspect, the present invention provides a wave soldering fixture, comprising a connecting portion and an insulating portion. The connecting portion is adapted to be connected to the soldering surface of a board to be soldered, located between two adjacent sets of pins to be soldered, and at least a first preset distance is provided between the connecting portion and each set of pins to be soldered. The insulating portion is connected to the side of the connecting portion facing away from the board, and the distance between the projection of the insulating portion on the soldering surface and the pins to be soldered is at least the first preset distance.

[0007] The connecting part connects the insulating part to the soldering surface of the circuit board. The insulating part protrudes from the soldering surface, creating a thickness-direction gap between adjacent sets of pins to be soldered. After the circuit board, components, and wave soldering fixture pass through the wave soldering oven, the pins of the components near the soldering surface are spaced apart by the insulating part in the thickness direction, preventing solder bridging even with thick solder. Even if solder bridging occurs, it can be removed by removing the insulating part. Furthermore, the wave soldering fixture of this invention has a wide range of applications, is less affected by the second preset spacing between pins, and is not affected by the conveying direction during wave soldering.

[0008] In one optional embodiment, the shape of the connecting portion matches the shape of the insulating portion. The connecting portion and the insulating portion have a first preset distance between them, and the distance between the projection of the insulating portion onto the soldering surface and the pin to be soldered is also at least the first preset distance, preventing solder from passing between the insulating portion and the soldering surface during soldering. Furthermore, the fabrication of the insulating portion can be performed with reference to the fabrication of the connecting portion, or vice versa. Only the preset width of one of the connecting portion and the insulating portion needs to be calculated, allowing for simultaneous fabrication of both, simplifying the processing steps and improving efficiency.

[0009] In one alternative embodiment, the connecting portion is bonded to the insulating portion; this facilitates the connection and fixation of the connecting portion and the insulating portion, and eliminates the need for drilling holes in the insulating portion or the connecting portion, preventing solder penetration that may result from drilling holes, which could lead to solder bridging at the pins.

[0010] In one alternative embodiment, the connecting portion is bonded to the circuit board to be soldered. The connection between the connecting portion and the circuit board to be soldered is simple and can be completed with simple tools. Furthermore, bonding the connecting portion to the circuit board to be soldered also facilitates the disassembly of the connecting portion.

[0011] In one optional embodiment, the connecting part is a high-temperature resistant double-sided adhesive tape; the material is relatively common, readily available, and low in cost, and can be easily cut and processed according to the first preset spacing and specific requirements. Furthermore, the high-temperature resistant double-sided adhesive tape can achieve both fixed bonding between the connecting part and the soldering surface of the board to be soldered, and fixed bonding between the connecting part and the insulating part. It is also high-temperature resistant, preventing it from affecting the soldering of the pins or causing solder bridging during wave soldering due to high-temperature melting.

[0012] In one alternative embodiment, the insulating part is made of rigid plastic. The insulating part can be cut to the required size from a thin sheet of rigid plastic, making the process simple and convenient. The material is also readily available, easy to mold, and inexpensive. Rigid plastic is also heat-resistant and will not melt or soften during wave soldering.

[0013] In one optional implementation, the ratio k between the length of the pin protruding from the soldering surface and the thickness of the insulating portion satisfies 4 ≤ k ≤ 6. A suitable ratio k should be selected. If the thickness of the insulating portion is too large and the ratio k is too small, it will affect the amount of solder applied to the pin. Conversely, if the thickness of the insulating portion is too small and the ratio k is too large, the insulating portion may fail, and the pin may still have the risk of solder bridging. Therefore, setting a reasonable ratio k, 4 ≤ k ≤ 6, will neither affect the amount of solder applied to the pin nor cause the insulating portion to fail, thus avoiding solder bridging.

[0014] In one optional embodiment, the first preset spacing F satisfies F≥10mil. The first preset spacing between the connecting part and the pin is at least greater than 10mil, and the first preset spacing between the insulating part and the pin is at least greater than 10mil, which ensures that the pin does not brittle and facilitates the connection between the connecting part and the insulating part.

[0015] In one optional embodiment, when the two sets of pins to be soldered located on both sides of the insulating portion are evenly distributed in an array, the connecting portion is rectangular and the insulating portion is rectangular. The rectangular strip structure is simple and easy to form, the pins in the array are relatively uniform, each set of pins can have multiple pins, and one connecting portion and insulating portion can simultaneously space multiple pins.

[0016] In one optional embodiment, when there is a difference in the number and distribution position of the two sets of pins to be soldered on both sides of the insulating portion, the insulating portion includes a strip-shaped body and a clearance notch, the strip-shaped body being disposed between the two sets of pins to be soldered; the clearance notch being disposed on the side of the strip-shaped body, the clearance notch being an inwardly recessed notch corresponding to the pin.

[0017] The connecting part and the insulating part are shaped to match, and the connecting part also has a corresponding strip-shaped body and a clearance notch. The clearance notch ensures that there is at least a first preset distance between the insulating part and the pin. This allows one connecting part and one corresponding insulating part to simultaneously separate multiple pins on both sides, preventing pin bridging. The recessed notch design does not excessively compromise the integrity and overall strength of the connecting part and the insulating part, and it also fits the corresponding pin at the corresponding position to achieve the purpose of preventing solder bridging.

[0018] Secondly, the present invention also provides a method for using the above-mentioned wave soldering fixture, comprising the following steps:

[0019] Obtain the second preset spacing between two adjacent sets of pins to be soldered on the board to be soldered, and obtain the preset width of the connecting part and the insulating part based on the second preset spacing and the first preset spacing;

[0020] The connecting part and the insulating part are manufactured according to the preset width;

[0021] Connect the connecting part to the corresponding position on the board;

[0022] The insulating part is connected to the connecting part;

[0023] The circuit board, pins, and wave soldering fixture are soldered together in a wave soldering oven.

[0024] After welding is completed, the wave soldering fixture is disassembled.

[0025] The connecting part connects the insulating part to the soldering surface of the circuit board. The insulating part protrudes from the soldering surface, creating a thickness-direction gap between adjacent sets of pins to be soldered. After the circuit board, components, and wave soldering fixture pass through the wave soldering oven, the pins of the components near the soldering surface are spaced apart by the insulating part in the thickness direction, preventing solder bridging even with thick solder. Even if solder bridging occurs, the bridging portion can be removed when disassembling the wave soldering fixture. The wave soldering fixture of this invention has a wide range of applications, is less affected by the second preset spacing between pins, and is not affected by the conveying direction during wave soldering.

[0026] The first preset spacing is the distance between the connecting part and the pin to be soldered, and the second preset spacing is the distance between the two sets of pins to be soldered. The preset widths of the connecting part and the insulating part can be obtained based on the first preset spacing and the second preset spacing. Under the premise of meeting the minimum size of the first preset spacing, the preset widths of the connecting part and the insulating part are selected according to the difficulty of processing and manufacturing.

[0027] In one optional embodiment, the step of disassembling the wave soldering fixture after welding includes: dissolving the connection part with a chemical solution after welding to separate the connection part and the insulation part from the soldering surface of the board.

[0028] By using chemical solutions to dissolve the connectors, the connectors and the insulation can be easily separated from the soldering surface of the circuit board. This method allows for easy separation of the connectors and insulation without damaging the circuit board. The operation is simple, the disassembly is quick, and it does not damage the circuit board.

[0029] In one optional embodiment, the step of obtaining the preset width of the connecting portion and the insulating portion according to the second preset spacing and the first preset spacing includes: obtaining the preset width of the connecting portion and the insulating portion according to the formula E = D - 2F;

[0030] Wherein, E is the preset width of the connecting part and the insulating part, D is the second preset spacing between two adjacent sets of pins to be soldered, and F is the first preset spacing between the connecting part and the insulating part and the pins to be soldered.

[0031] The first preset distance F between the connecting part and the insulating part and the pin to be soldered needs to satisfy F≥10mil. After calculating the preset width E of the connecting part and the insulating part, it needs to be recalculated. During the recalculation, the range of the first preset distance is taken into priority. When the first preset spacing is reached, the result can be calculated using the formula E = D - 2F; When this is done, the preset width E of the connecting part and the insulating part can be reduced to meet the first preset spacing F = 10 mil. Furthermore, the first preset spacing between the two sides of each connecting part and the corresponding pins on both sides is preferably equal, and the optimal F:E:F ratio is 1:2:1. Attached Figure Description

[0032] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0033] Figure 1 This is a schematic diagram of a wave soldering fixture connected on a circuit board according to an embodiment of the present invention;

[0034] Figure 2 This is a schematic diagram illustrating another connection of a wave soldering fixture on a circuit board according to an embodiment of the present invention;

[0035] Figure 3 This is a flowchart illustrating a method for using a wave soldering fixture according to an embodiment of the present invention.

[0036] Explanation of reference numerals in the attached figures:

[0037] 1. Circuit board; 2. Insulation part; 3. Pin; 4. Component; 5. Strip-shaped body; 6. Clearance notch. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] A PCB (Printed Circuit Board) typically connects several components 4. The connection between components 4 and the PCB is achieved through wave soldering. In wave soldering, the leads 3 of the components 4 are first inserted into the soldering surface of the PCB, and then the PCB is placed on a conveyor structure. As it passes through the wave soldering oven, it comes into contact with high-temperature liquid solder. In traditional wave soldering, due to the small spacing between adjacent leads 3, the solder on adjacent leads 3 can easily stick together, causing solder bridging on the leads 3 of the components 4. Solder bridging on the leads 3 usually leads to a short circuit between adjacent leads 3, rendering the PCB unusable.

[0040] One method in the related technology is to design a solder drag pad for each wave soldering pin 3 to prevent solder bridging of the pin 3. However, due to the influence of the direction of the PCB board 1 passing through the wave soldering oven, not all components 4 to be wave soldered can have solder drag pads added. The pins 3 of components 4 that cannot have solder drag pads added still have solder bridging.

[0041] In another method of the related technology, solder resist white paint is designed around the pins 3 of the component 4 to be soldered, which can prevent the pins 3 from bridging in the soldering plane. However, when the distance between two adjacent pins 3 is very close and the solder thickness is relatively thick, the solder resist white paint is less effective in preventing the pins 3 from bridging, and the bridging of the pins 3 still exists.

[0042] The following is combined with Figures 1 to 3 The following describes embodiments of the present invention.

[0043] like Figures 1 to 2As shown, according to an embodiment of the present invention, on the one hand, a wave soldering fixture is provided, which includes a connecting portion and an insulating portion 2. The connecting portion is adapted to be connected to the soldering surface of the circuit board 1 to be soldered, located between two adjacent groups of pins 3 to be soldered, and at least a first preset distance is provided between the connecting portion and each group of pins 3 to be soldered; the insulating portion 2 is connected to the side of the connecting portion facing away from the circuit board 1, and the distance between the projection of the insulating portion 2 on the soldering surface and the pins 3 to be soldered is at least the first preset distance.

[0044] In this embodiment, the connecting portion can connect the insulating portion 2 to the soldering surface of the circuit board 1, and the insulating portion 2 is protruded on the soldering surface, so as to form a gap in the thickness direction between two adjacent groups of pins 3 to be soldered. After the circuit board 1, the component 4 and the wave soldering fixture pass through the wave soldering furnace for soldering together, the position of the pin 3 of the component 4 close to the soldering surface is spaced by the insulating portion 2 in the thickness direction of the insulating portion 2, so that even if the thickness of the solder is relatively thick, bridging will not occur; even if bridging of the pins 3 occurs, the bridged part can be removed by removing the insulating portion 2. The wave soldering fixture of this embodiment has a wide range of applications, is less affected by the second preset distance between the pins 3, and will not be affected by the conveying direction during wave soldering in terms of the connection and use of the wave soldering fixture of the present invention.

[0045] Specifically, the circuit board 1 can be a PCB board (the full English name is Printed Circuit Board, and the Chinese name is printed circuit board), the component 4 can be a chip, a capacitor, a resistor, etc., and the pins 3 are the pins 3 of components 4 such as chips, capacitors, and resistors.

[0046] As Figure 3 shown, the usage method of the wave soldering fixture provided in this embodiment includes the following steps:

[0047] Step S1, obtain the second preset distance between two adjacent groups of pins 3 to be soldered on the circuit board 1 to be soldered, and obtain the preset widths of the connecting portion and the insulating portion 2 according to the second preset distance and the first preset distance;

[0048] Step S2, manufacture the corresponding connecting portion and insulating portion 2 according to the preset widths;

[0049] Step S3, connect the connecting portion to the corresponding position on the circuit board 1;

[0050] Step S4, connect the insulating portion 2 to the connecting portion;

[0051] Step S5, pass the circuit board 1 to be soldered, the pins 3 and the wave soldering fixture through the wave soldering furnace for soldering;

[0052] Step S6: After welding is completed, disassemble the wave soldering fixture.

[0053] Furthermore, step S6, the step of disassembling the wave soldering fixture after welding, includes: after welding, using chemical solutions to dissolve the connecting part, so as to separate the connecting part and the insulating part 2 from the welding surface of the board 1. The step S1, the step of obtaining the preset width of the connecting part and the insulating part 2 according to the second preset spacing and the first preset spacing, includes: obtaining the preset width of the connecting part and the insulating part 2 according to the formula E = D - 2F; where E is the preset width of the connecting part and the insulating part 2, D is the second preset spacing between two adjacent sets of pins 3 to be welded, and F is the first preset spacing between the connecting part and the insulating part 2 and the pins 3 to be welded.

[0054] In one embodiment, the shape of the connecting portion matches the shape of the insulating portion 2. The connecting portion and the insulating portion 2 are matched, and there is at least a first preset distance between the connecting portion and the pin 3. The distance between the projection of the insulating portion 2 onto the welding surface and the pin 3 to be welded is also at least the first preset distance, preventing solder from passing between the insulating portion 2 and the welding surface during welding. Furthermore, the fabrication of the insulating portion 2 can be performed with reference to the fabrication of the connecting portion, or the fabrication of the connecting portion can be performed with reference to the fabrication of the insulating portion 2. Only the preset width of one of the connecting portion and the insulating portion 2 needs to be calculated, allowing for simultaneous fabrication of both the connecting portion and the insulating portion 2, simplifying the processing steps and improving efficiency.

[0055] In a preferred embodiment, such as Figure 1 and Figure 2 As shown, the projection of the insulating part 2 onto the soldering surface of the board 1 coincides with the connecting part. The dimensions and shapes of the connecting part and the insulating part 2 are completely identical, which facilitates processing and forming. The distances between the two sides of the projection of the insulating part 2 onto the soldering surface of the board 1 and the pins 3 are equal, and can all be a first preset spacing, or both can be greater than the first preset spacing.

[0056] In one embodiment, the connecting part is bonded to the insulating part 2; this facilitates the connection and fixation of the connecting part and the insulating part 2, and eliminates the need for drilling holes in the insulating part 2 or the connecting part, preventing solder penetration that may result from drilling holes, which could lead to solder bridging on the pin 3.

[0057] As an alternative implementation, the connecting part and the insulation can also be pre-melted, or the connecting part and the insulation can be integrally injection molded, or the connecting part and the insulation can be welded.

[0058] In one embodiment, the connecting part is bonded to the board 1 to be soldered. The connection between the connecting part and the board 1 to be soldered is simple and can be completed with simple tools. Furthermore, the bonding of the connecting part to the board 1 to be soldered also facilitates the disassembly of the connecting part.

[0059] As an alternative implementation, the connector can also be detachably connected to the board 1 using fasteners. While this facilitates disassembly and connection, compared to adhesive bonding, detachable connection via fasteners can easily create a gap between the connector and the board 1, posing a risk of solder leakage. In this case, an insulating elastic seal can be provided between the connector and the board 1 to prevent this gap.

[0060] In one embodiment, the connecting part is high-temperature resistant double-sided tape; the material is relatively common, readily available, and low in cost, and can be easily cut and processed according to the first preset spacing and specific requirements. Furthermore, the high-temperature resistant double-sided tape can achieve both fixed bonding between the connecting part and the soldering surface of the board 1 to be soldered, and fixed bonding between the connecting part and the insulating part 2. It is also high-temperature resistant, preventing it from melting during wave soldering and affecting the soldering of the pins 3 or causing solder bridging on the pins 3. The high-temperature resistant double-sided tape can be easily cut into the desired size and shape using simple and readily available tools such as scissors.

[0061] In step S6, the step of disassembling the wave soldering fixture after welding includes: after welding, using chemical solutions to dissolve the connecting part, so as to separate the connecting part and the insulating part 2 from the welding surface of the board 1.

[0062] By using chemical solutions to dissolve the connecting parts, the connecting parts and the insulating parts 2 can be easily separated from the soldering surface of the board 1. This method allows for easy separation of the connecting parts and the insulating parts 2 without damaging the board 1. The operation is simple, the disassembly is quick, and the board 1 is not damaged.

[0063] As an alternative implementation, the connecting part can be bonded to the soldering surface of the board 1 to be soldered using high-temperature resistant adhesive, and the connecting part can also be bonded to the insulating part 2 using high-temperature resistant adhesive. Furthermore, the high-temperature resistant adhesive not only achieves a fixed bond between the connecting part and the soldering surface of the board 1 to be soldered, and a fixed bond between the connecting part and the insulating part 2, but it is also heat-resistant, preventing it from melting at high temperatures during wave soldering and affecting the soldering of the pins 3 or causing solder bridging on the pins 3.

[0064] Specifically, the connecting part is bonded to the welding surface of the board 1 to be welded, and the connecting part is bonded to the insulating part 2. The connecting part can be made of high-temperature resistant double-sided tape or high-temperature resistant adhesive. After bonding, the connecting part can be dissolved by chemical solutions to remove the connecting part and the insulating part 2 from the welding surface of the board 1. High-temperature resistant double-sided tape and high-temperature resistant adhesive typically contain alkyd or acrylic pressure-sensitive adhesives. Alkyd or acrylic pressure-sensitive adhesives are easily soluble in dichloromethane or trichloromethane. Some high-temperature resistant double-sided tapes and high-temperature resistant adhesives are also easily soluble in ethyl acetate and cyclohexanone.

[0065] In one embodiment, the insulating part 2 is made of rigid plastic. The insulating part 2 can be cut and processed to the required size from a thin sheet of rigid plastic, making the processing simple and convenient. The material is also readily available, easy to mold, and inexpensive. Rigid plastic is also heat-resistant and will not melt or soften during wave soldering.

[0066] In an alternative implementation, the insulating part 2 can also be a glass insulator. The insulating part 2 can be made by cutting and processing a strip of glass insulator according to actual needs, and various strip-shaped glass insulators with different preset widths can be formed. A suitable strip-shaped glass insulator can be selected according to the second preset spacing and the first preset spacing between the pins 3.

[0067] In an alternative implementation, the insulating part 2 can also be a ceramic insulator. The insulating part 2 can be made by cutting and processing a strip-shaped ceramic insulator according to actual needs, and various strip-shaped ceramic insulators with different preset widths can be formed. A suitable strip-shaped ceramic insulator can be selected according to the second preset spacing and the first preset spacing between the pins 3.

[0068] In one embodiment, the ratio k between the length of the pin 3 protruding from the welding surface and the thickness of the insulating portion 2 satisfies 4≤k≤6.

[0069] A suitable ratio k should be selected between the length of pin 3 protruding from the solder surface and the thickness of the insulating part 2. If the thickness of the insulating part 2 is too large and the ratio k is too small, it will affect the amount of solder applied to pin 3. If the thickness of the insulating part 2 is too small and the ratio k is too large, the insulating part 2 may fail, and pin 3 may still have the risk of solder bridging. Therefore, a reasonable ratio k, 4≤k≤6, will neither affect the amount of solder applied to pin 3 nor cause the insulating part 2 to fail, thus avoiding solder bridging of pin 3.

[0070] In one specific embodiment, the ratio k between the length of the pin 3 protruding from the welding surface and the thickness of the insulating portion 2 is 4.

[0071] In another specific embodiment, the ratio k between the length of the pin 3 protruding from the welding surface and the thickness of the insulating portion 2 is 6.

[0072] In a preferred embodiment, the ratio k between the length of the pin 3 protruding from the soldering surface and the thickness of the insulating portion 2 is 5. This ratio k is the optimal implementation, as it neither affects the amount of solder applied to the pin 3 nor causes the insulating portion 2 to fail, thus preventing solder bridging of the pin 3. Specifically, for example, the length of the pin 3 protruding from the soldering surface is 2mm, and the thickness of the insulating portion 2 is designed to be 0.4mm for optimal results.

[0073] In one embodiment, the first preset spacing F satisfies F≥10mil. The first preset spacing between the connecting part and the pin 3 is at least greater than 10mil, and the first preset spacing between the insulating part 2 and the pin 3 is at least greater than 10mil. This ensures that the pin 3 does not brittle and facilitates the connection between the connecting part and the insulating part 2. Preferably, the distances between the two sides of the connecting part and the corresponding pin 3 are equal, and the distances between the two sides of the insulating part 2 and the corresponding pin 3 are also equal.

[0074] The first preset distance F between the connecting part and the insulating part 2 and the pin 3 to be soldered needs to satisfy F≥10mil. After calculating the preset width E of the connecting part and the insulating part 2, it needs to be recalculated. During the recalculation, the range of the first preset distance is taken into priority. When the first preset spacing is reached, the result can be calculated using the formula E = D - 2F; When this is done, the preset width E of the connecting part and the insulating part 2 can be reduced to satisfy the first preset spacing F = 10 mil. Moreover, the first preset spacing between the two sides of each connecting part and the insulating part 2 and the corresponding pins 3 on both sides is preferably equal, and the ratio of F:E:F is optimal when it is 1:2:1.

[0075] In one specific embodiment, the first preset distance F between the connecting part and the pin 3 is 10 mil; the first preset distance F between the insulating part 2 and the pin 3 is 10 mil.

[0076] In one embodiment, when the two sets of pins 3 to be soldered are evenly arrayed on both sides of the insulating part 2, such as Figure 1 As shown, Figure 1 The middle part of the structure has multiple sets of pins 3 to be soldered arranged in an array; the connecting part is rectangular strip-shaped, and the insulating part 2 is rectangular strip-shaped. The rectangular strip structure is simple and easy to form, and the array of pins 3 is relatively uniform. Each set of pins 3 can have multiple pins, and one connecting part and one insulating part 2 can simultaneously space multiple pins 3.

[0077] In another embodiment, when there is a difference in the number and distribution of the two sets of pins 3 to be soldered on both sides of the insulating portion 2, such as Figure 1 As shown, Figure 1 The pins 3 on both sides are not evenly distributed. The insulating part 2 includes a strip-shaped body 5 and a clearance notch 6. The strip-shaped body 5 is disposed between two sets of pins 3 to be soldered. The clearance notch 6 is disposed on the side of the strip-shaped body 5. The clearance notch 6 is an inwardly recessed notch corresponding to the pin 3.

[0078] The connecting part and the insulating part 2 are shaped to match. The connecting part is also provided with a strip-shaped body 5 and a clearance notch 6. The clearance notch 6 ensures that there is at least a first preset distance between the insulating part 2 and the pin 3. This allows one connecting part and one corresponding insulating part 2 to simultaneously separate multiple pins 3 on both sides, preventing the pins 3 from bridging. The recessed notch design does not excessively compromise the integrity and overall strength of the connecting part and the insulating part 2, and it can also be adapted to the corresponding pin 3 at the corresponding position to achieve the purpose of preventing bridging.

[0079] In another embodiment, such as Figure 2 As shown, the pins 3 are staggered, and the second preset spacing between two adjacent pins 3 to be soldered is small. Therefore, a short connecting part and an insulating part 2 can be provided between each pair of pins 3 to be soldered.

[0080] In a preferred embodiment, the shape of the clearance notch 6 matches the shape of the pin 3. This ensures that the distance between each point of the clearance notch 6 and the pin 3 is a first preset spacing. When the pin 3 is circular, the projection of the clearance notch 6 onto the soldering surface of the board 1 is an arc; or when the pin 3 is rectangular, the projection of the clearance notch 6 onto the soldering surface of the board 1 corresponds to a right-angled triangle at the included angle of the rectangle, and no clearance notch 6 is needed at the straight-line position of the rectangle.

[0081] According to an embodiment of the present invention, in another aspect, a method for using the above-mentioned wave soldering fixture is also provided, comprising the following steps:

[0082] Step S1: Obtain the second preset spacing between two adjacent sets of pins 3 to be soldered on the board 1 to be soldered, and obtain the preset width of the connecting part and the insulating part 2 according to the second preset spacing and the first preset spacing;

[0083] Step S2: Fabricate the corresponding connecting part and insulating part 2 according to the preset width;

[0084] Step S3: Connect the connecting part to the corresponding position on the board 1;

[0085] Step S4: Connect the insulating part 2 to the connecting part;

[0086] Step S5: The board 1 to be soldered, the pins 3 and the wave soldering fixture are soldered together in a wave soldering oven;

[0087] Step S6: After welding is completed, disassemble the wave soldering fixture.

[0088] The connecting part connects the insulating part 2 to the soldering surface of the board 1. The insulating part 2 protrudes from the soldering surface, creating a thickness-direction gap between adjacent sets of pins 3 to be soldered. After the board 1, components 4, and wave soldering fixture are soldered together in the wave soldering oven, the positions of the pins 3 of components 4 near the soldering surface are spaced apart by the insulating part 2 in the thickness direction, preventing solder bridging even if the solder is thick. Even if solder bridging occurs, the bridging portion can be removed when disassembling the wave soldering fixture. The wave soldering fixture of this embodiment has a wide range of applications, is less affected by the second preset spacing between pins 3, and is not affected by the conveying direction during wave soldering.

[0089] In step S1, where the preset widths of the connecting portion and the insulating portion 2 are obtained, the first preset distance is the distance between the connecting portion and the pin 3 to be welded, and the second preset distance is the distance between the two sets of pins 3 to be welded. The preset widths of the connecting portion and the insulating portion 2 can be obtained based on the first and second preset distances. Under the premise of meeting the minimum size of the first preset distance, the preset widths of the connecting portion and the insulating portion 2 are selected according to the ease of processing. Specifically, the first preset distance F between the connecting portion and the pin 3 satisfies F≥10mil; the first preset distance F between the insulating portion 2 and the pin 3 satisfies F≥10mil.

[0090] In one embodiment, the step of disassembling the wave soldering fixture after welding in step S6 includes: dissolving the connection part with a chemical solution after welding to separate the connection part and the insulation part 2 from the welding surface of the board 1.

[0091] By using chemical solutions to dissolve the connecting parts, the connecting parts and the insulating parts 2 can be easily separated from the soldering surface of the board 1. This method allows for easy separation of the connecting parts and the insulating parts 2 without damaging the board 1. The operation is simple, the disassembly is quick, and the board 1 is not damaged.

[0092] Specifically, the connecting part is bonded to the welding surface of the board 1 to be welded, and the connecting part is bonded to the insulating part 2. The connecting part can be made of high-temperature resistant double-sided tape or high-temperature resistant adhesive. After bonding, the connecting part can be dissolved by chemical solutions to remove the connecting part and the insulating part 2 from the welding surface of the board 1. High-temperature resistant double-sided tape and high-temperature resistant adhesive typically contain alkyd or acrylic pressure-sensitive adhesives. Alkyd or acrylic pressure-sensitive adhesives are easily soluble in dichloromethane or trichloromethane. Some high-temperature resistant double-sided tapes and high-temperature resistant adhesives are also easily soluble in ethyl acetate and cyclohexanone.

[0093] In one embodiment, step S1, the step of obtaining the preset width of the connecting part and the insulating part 2 according to the second preset spacing and the first preset spacing, includes: obtaining the preset width of the connecting part and the insulating part 2 according to the formula E = D - 2F;

[0094] Wherein, E is the preset width of the connecting part and the insulating part 2, D is the second preset distance between two adjacent sets of pins 3 to be soldered, and F is the first preset distance between the connecting part and the insulating part 2 and the pins 3 to be soldered.

[0095] The first preset distance F between the connecting part and the insulating part 2 and the pin 3 to be soldered needs to satisfy F≥10mil. After calculating the preset width E of the connecting part and the insulating part 2, it needs to be recalculated. During the recalculation, the range of the first preset distance is taken into priority. When the first preset spacing is reached, the result can be calculated using the formula E = D - 2F; When this is done, the preset width E of the connecting part and the insulating part 2 can be reduced to satisfy the first preset spacing F = 10 mil. Moreover, the first preset spacing between the two sides of each connecting part and the insulating part 2 and the corresponding pins 3 on both sides is preferably equal, and the ratio of F:E:F is optimal when it is 1:2:1.

[0096] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A method of using a wave soldering fixture, characterized in that, include: The connecting part is adapted to be bonded to the welding surface of the board (1) to be welded, located between two adjacent sets of pins (3) to be welded, and at least a first preset distance is provided between each set of pins (3) to be welded; Insulating part (2), the insulating part (2) is bonded to the side of the connecting part facing away from the board (1), and the distance between the projection of the insulating part (2) on the welding surface and the pin (3) to be welded is at least the first preset spacing; The usage method includes the following steps: Obtain the second preset spacing between two adjacent sets of pins (3) to be soldered on the board (1) to be soldered, and obtain the preset width of the connecting part and the insulating part (2) according to the second preset spacing and the first preset spacing; The corresponding connecting part and the insulating part (2) are made according to the preset width. Connect the connecting part to the corresponding position on the board (1); The insulating part (2) is connected to the connecting part; The board (1), pins (3) to be soldered and the wave soldering fixture are soldered together in a wave soldering oven; The step of disassembling the wave soldering fixture after welding includes: dissolving the connecting part with chemical solution after welding to separate the connecting part and the insulating part (2) from the welding surface of the board (1), wherein the connecting part can be high temperature resistant double-sided tape.

2. The method of using the wave soldering fixture according to claim 1, characterized in that, The shape of the connecting part matches the shape of the insulating part (2).

3. The method of using the wave soldering fixture according to claim 1, characterized in that... The insulating part (2) is made of rigid plastic.

4. The method of using the wave soldering fixture according to any one of claims 1 to 3, characterized in that, The ratio k between the length of the protrusion of the pin (3) to be soldered from the soldering surface and the thickness of the insulating part (2) satisfies 4≤k≤6; And / or, the first preset spacing F satisfies F≥10mil.

5. The method of using the wave soldering fixture according to any one of claims 1 to 3, characterized in that, When the two sets of pins (3) to be soldered are evenly distributed on both sides of the insulating part (2), the connecting part is rectangular and the insulating part (2) is rectangular.

6. The method of using the wave soldering fixture according to any one of claims 1 to 3, characterized in that, When there is a difference in the number and distribution position of the two sets of pins (3) to be welded on both sides of the insulating part (2), the insulating part (2) includes a strip-shaped body (5) and a clearance notch (6). The strip-shaped body (5) is disposed between the two sets of pins (3) to be welded. The clearance notch (6) is disposed on the side of the strip-shaped body (5). The clearance notch (6) is an inwardly recessed notch corresponding to the pin (3).

7. The method of using the wave soldering fixture according to claim 1, characterized in that, The step of obtaining the preset widths of the connecting portion and the insulating portion (2) based on the second preset spacing and the first preset spacing includes: according to formula E Obtain the preset width of the connecting part and the insulating part (2); Wherein, E is the preset width of the connecting part and the insulating part (2), D is the second preset distance between two adjacent sets of pins (3) to be welded, and F is the first preset distance between the connecting part and the insulating part (2) and the pins (3) to be welded.

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