A pick-up device for detecting electronic components and a method thereof

Abstract

The application provides a kind of pick-up equipment for detecting electronic components and its method, wherein the pick-up equipment includes carousel structure and pick-up device, carousel structure includes driver and its drive and generates rotation disc, and the disc is provided with the bearing position for placing electronic components, and each bearing position is arranged at intervals;Pick-up device is arranged on one side of carousel structure, and pick-up device includes pick-up mechanism, pick-up mechanism is arranged along the bearing position and includes base and movable connection base of suction member, and suction member is provided with space for giving place;Wherein suction member can continuously rotate through the space for giving place after suctioning electronic components and moving disc.By this means, the overall operation time can be shortened, and the detection efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of testing equipment technology, and more particularly to a material handling device and method for testing electronic components. Background Technology

[0002] With the booming development of electronic components and related industries, in addition to focusing on the development of "light, thin, short and small" products, manufacturers must also achieve large-scale and rapid production to enhance their competitiveness. Therefore, in recent years, automated production and testing have gradually become the development trend of the industry. By investing in automated equipment to improve production and testing speed, labor costs can be significantly reduced.

[0003] Existing material handling equipment for testing electronic components mainly includes a turntable structure and a material handling device. The electronic components are placed sequentially on the turntable structure, and the material handling device picks up each electronic component and then simultaneously transfers it to each testing station for testing. During the testing process, the turntable structure is limited by the material handling device and can only wait in its original position. After each electronic component has completed its testing, the turntable structure transfers the batch of electronic components again. This method makes the testing efficiency quite low and is not economical.

[0004] In view of this, the inventor has devoted himself to research and applied theoretical knowledge to address the shortcomings of the prior art, and has made every effort to solve the above-mentioned technical problems, which is the target of the applicant's improvement. Summary of the Invention

[0005] One objective of this application is to provide a material handling device and method for inspecting electronic components, which can shorten the overall operation time and thus improve inspection efficiency.

[0006] To achieve the above objectives, this application provides a material handling device for testing electronic components, including a turntable structure and a material handling device. The turntable structure includes a driver and a disk body connected to and driven by the driver to rotate. The disk body has multiple support positions for placing the electronic components, and each support position is arranged in a ring and spaced apart. The material handling device is disposed on one side of the turntable structure and includes multiple material handling mechanisms. Each material handling mechanism is arranged along each support position. Each material handling mechanism includes a base and a pick-up member movably connected to the base. Each pick-up member has a clearance space. After the pick-up member picks up the electronic component and moves, the disk body can continuously rotate through each clearance space.

[0007] In one embodiment, the suction member includes a sliding plate and a suction arm. The sliding plate is connected to the base, and the suction arm is disposed on the sliding plate. The suction arm includes an arm plate and a suction head extending from the arm plate. The arm plate is connected to the sliding plate and moves with it. The clearance space is formed in the area enclosed by the suction head, the arm plate, and the sliding plate.

[0008] In one embodiment, the suction head has a suction nozzle, and the arm plate and the inside of the suction head are provided with a suction channel communicating with the suction nozzle.

[0009] In one embodiment, the turntable structure further includes a connecting component connected between the driver and the turntable body, the turntable body rotating by the driver driving the connecting component.

[0010] In one embodiment, the disk is a circular disk, and each bearing position is located at the outer periphery of the circular disk.

[0011] In one embodiment, the disc body has a negative pressure channel at each corner corresponding to a bearing position, which connects to that bearing position.

[0012] To achieve the above objectives, this application provides a method for inspecting electronic components, the method comprising the following steps:

[0013] a) Provides a turntable structure, a material handling device and multiple testing stations. The turntable structure includes a disc body with multiple bearing positions. The material handling device includes multiple suction components, each of which has clearance space.

[0014] b) Place multiple electronic components into each of the carrier positions, with at least one carrier position left empty.

[0015] c) Each electronic component is picked up from its respective carrier position by each picking component and moved toward each testing station;

[0016] d) During the testing of each electronic component at each testing station, the disk can rotate continuously through the clearance spaces; and

[0017] e) After each electronic component is tested at each testing station, each pick-up component moves the electronic component back to its next-order bearing position.

[0018] In one embodiment, the number of each absorbing component is less than the number of each bearing position.

[0019] In one embodiment, the number of each extraction component is one-half, one-third, or one-quarter of the number of each bearing position.

[0020] In one implementation, the number of each extraction component is equal to the number of each detection station.

[0021] This application also has the following beneficial effects, which can effectively avoid the collision between the various suction components and the disc body and cause damage or other adverse situations. Attached Figure Description

[0022] Figure 1 This is an appearance diagram of the material handling equipment and various testing stations used in this application for testing electronic components.

[0023] Figure 2 This is a partial enlarged view of the material handling equipment and testing station used for testing electronic components in this application.

[0024] Figure 3 yes Figure 2 The enlarged view of the selected area is shown by the dashed circle.

[0025] Figure 4 This is a partial enlarged view of the material handling mechanism in this application.

[0026] Figure 5 This is a cross-sectional view of the disk in this application.

[0027] Figure 6 yes Figure 5 The enlarged view of the selected area is shown by the dashed circle.

[0028] Figure 7 This is a cross-sectional view of the combination of the disc body, material handling mechanism and testing station in this application.

[0029] Figure 8 This is a cross-sectional view (a) of the disc body, material handling mechanism, and testing station in use according to this application.

[0030] Figure 9 This is a cross-sectional view (II) of the disc body, material handling mechanism, and testing station in use according to this application.

[0031] Figure 10 This is a top view of the turntable structure and the combination of each testing station in this application.

[0032] Explanation of reference numerals in the attached figures:

[0033] 10: Turntable structure;

[0034] 11: Driver;

[0035] 12: Disc body;

[0036] 121: Bearing position;

[0037] 122: Negative pressure channel;

[0038] 13: Connecting components;

[0039] 20: Material handling device;

[0040] 21: Material handling mechanism;

[0041] 211: Base;

[0042] 212: Extraction component;

[0043] 2121: Sliding plate;

[0044] 2122: Extraction arm;

[0045] 2123: Arm plate;

[0046] 2124: Suction head;

[0047] 2125: Suction nozzle;

[0048] 2126: Inhalation channel;

[0049] 213: Make room for improvement;

[0050] 7: Testing station;

[0051] 8: Electronic components;

[0052] a~e: steps. Detailed Implementation

[0053] The detailed description and technical content of this application are illustrated below with reference to the accompanying drawings. However, the drawings are provided for reference and illustration only and are not intended to limit the scope of this application.

[0054] Please see Figures 1 to 6 As shown, this application provides a material handling device for testing electronic components, which mainly includes a turntable structure 10 and a material handling device 20. A plurality of (including at least two) testing stations 7 are arranged in a ring below the turntable structure 10, and each testing station 7 is used to test the electronic components 8 respectively.

[0055] Please refer to the following first. Figure 1 The turntable structure 10 mainly includes a driver 11, a disc body 12, and a connecting component 13. The connecting component 13 is connected between the driver 11 and the disc body 12. The disc body 12 rotates by the driver 11 driving the connecting component 13. In this embodiment, the disc body 12 is a circular disc body with multiple bearing positions 121 on its outer periphery. Each bearing position 121 is spaced apart, and each bearing position 121 is used to place an electronic component 8.

[0056] Please continue reading. Figure 5 and Figure 6The disk body 12 has a negative pressure channel 122 at each corner corresponding to the support position 121, which is connected to the support position 121. In this embodiment, the support position 121 is roughly cross-shaped, but this shape is not a limitation and it can also be other different geometric shapes. When the electronic component 8 is placed in the support position 121, it is positioned by being drawn in by the negative pressure channel 122.

[0057] Please continue reading. Figures 2 to 4 and Figure 7 The material handling device 20 is located on the upper side of the turntable structure 10, and mainly includes multiple material handling mechanisms 21. Each material handling mechanism 21 surrounds the connecting assembly 13 and is configured corresponding to each bearing position 121. Each material handling mechanism 21 includes a base 211 and a suction member 212. The suction member 212 is movably connected to the base 211, and each suction member 212 is provided with a clearance space 213. Similarly, to meet actual usage requirements, the material handling device 20 can also be located on the lower side of the turntable structure 10.

[0058] The suction component 212 mainly includes a sliding plate 2121 and a suction arm 2122. The sliding plate 2121 is connected to the base 211, and the suction arm 2122 is fixed on the sliding plate 2121. The suction arm 2122 mainly includes an arm plate 2123 and a suction head 2124. The arm plate 2123 is connected to the sliding plate 2121. The aforementioned clearance space 213 is formed in the area enclosed by the suction head 2124, the arm plate 2123, and the sliding plate 2121. A suction nozzle 2125 is provided at the end of the suction head 2124, and a suction channel 2126 communicating with the suction nozzle 2125 is provided inside the arm plate 2123 and the suction head 2124.

[0059] Please see Figures 7 to 9 As shown, during operation, each batch of electronic components 8 is first placed in its respective carrier position 121. Each electronic component 8 is then picked up and positioned in its respective carrier position 121 by the negative pressure channels 122. The disk body 12 rotates under the drive of the driver 11. After each carrier position 121 rotates to a position directly below each picking member 212, each picking member 212 picks up each electronic component 8 with its suction nozzle 2125 and moves it towards each detection station 7. Each detection station 7 then detects each electronic component 8. During the downward movement of each picking member 212, each clearance space 213 is located outside the edge of the disk body 12 (e.g., ...). Figure 8 As shown), there is no interference with the disk body 12, thus allowing the disk body 12 to rotate continuously; after each detection station 7 completes the detection work on each electronic component 8, each pick-up component 212 moves each electronic component 8 back to the next sequential bearing position 121.

[0060] Please see Figure 10As shown, this application also provides a method for inspecting electronic components, the method comprising the following steps:

[0061] a) Provides a turntable structure 10, a material handling device 20 and multiple testing stations 7. The turntable structure 10 includes a disc body 12, which is provided with multiple bearing positions 121. The material handling device 20 includes multiple suction components 212, each of which is provided with a clearance space 213.

[0062] b) Place multiple electronic components 8 into each of the bearing positions 121, wherein at least one of the bearing positions 121 is empty and no electronic component 8 is placed there;

[0063] c) Each electronic component 8 is picked up from each carrier position 121 by each picking member 212 and moved toward each detection station 7;

[0064] d) When each electronic component 8 is tested at each testing station 7, the disk 12 can rotate continuously through each clearance space 213; and

[0065] e) After each testing station 7 completes the testing of each electronic component 8, each pick-up component 212 moves each electronic component 8 back to the next-order bearing position 121; wherein "the next-order bearing position 121" means not returning to the bearing position 121 when it was moved out, and can be the aforementioned empty position or the bearing position 121 after the electronic component 8 was moved out.

[0066] In one embodiment, if a space of the bearing position 121 is formed between any two adjacent detection stations 7, the bearing position 121 also receives the electronic component 8 in a space-empty manner; thus, after each electronic component 8 has completed the detection, each electronic component 8 can be moved back to the empty bearing position 121 by each pick-up member 212.

[0067] In one embodiment, if two empty spaces of the bearing position 121 are formed between any two adjacent detection stations 7, (1) the bearing position 121 also receives the electronic component 8 in the manner of having two empty spaces; (2) the bearing position 121 receives the electronic component 8 in two consecutive spaces, and the next bearing position 121 does not place the electronic component 8 and forms an empty space.

[0068] In one embodiment, if three empty spaces of bearing position 121 are formed between any two adjacent detection stations 7, (1) bearing position 121 also accepts electronic component 8 with one empty space; (2) bearing position 121 also accepts electronic component 8 with three empty spaces; (3) bearing position 121 accepts electronic component 8 in three consecutive spaces, and the next bearing position 121 does not place electronic component 8 and forms an empty space.

[0069] As can be seen from the above, if the detection station 7 is empty of n cells, (1) the bearing position 121 is continuously (n+1) cells, and at least one cell is not placed with the electronic component 8 to be tested, thus forming an empty space; where n is an integer greater than or equal to 1.

[0070] In one embodiment, the number of each suction member 212 is less than the number of each bearing position 121. Specifically, the number of each suction member 212 is one-half, one-third, or one-quarter of the number of each bearing position 121. The number of each suction member 212 is equal to the number of each detection station 7.

[0071] In summary, the material handling equipment and method for testing electronic components proposed in this application can indeed achieve the intended purpose of use, and overcomes the defects of the prior art. Furthermore, due to its novelty and inventiveness, it fully meets the requirements for an invention patent application. Therefore, this application is filed in accordance with the Patent Law, and we respectfully request examination and authorization to protect the applicant's rights.

Claims

1. A material handling device for inspecting electronic components, for placing multiple electronic components, characterized in that, include: A turntable structure includes a driver and a disk body connected to and driven by the driver to rotate. The disk body is provided with a plurality of carrier positions for placing the various electronic components, and the carrier positions are arranged at intervals. as well as A material handling device is disposed on one side of the turntable structure. The material handling device includes multiple material handling mechanisms, each of which is arranged along each of the bearing positions. Each material handling mechanism includes a base and a suction member movably connected to the base. Each suction member includes a sliding plate and a suction arm. The sliding plate is connected to the base, and the suction arm is disposed on the sliding plate. The suction arm includes an arm plate and a suction head extending from the arm plate. The arm plate is connected to the sliding plate and moves with it. A clearance space is provided around the suction head, the arm plate, and the sliding plate. The disc body is rotated by the drive of the driver. After each of the bearing positions rotates to a position below each of the picking members, each of the picking members picks up the electronic components with their nozzles. During the downward movement of each of the picking members, each of the clearance spaces is located outside the edge of the disc body, thereby enabling the disc body to rotate continuously.

2. The material handling device for detecting electronic components as described in claim 1, characterized in that, The suction head has a suction nozzle, and the arm plate and the inside of the suction head are provided with a suction channel that communicates with the suction nozzle.

3. The material handling device for detecting electronic components as described in claim 1, characterized in that, The turntable structure also includes a connecting component, which is connected between the driver and the turntable body. The turntable body rotates by the driver driving the connecting component.

4. The material handling equipment for inspecting electronic components as described in claim 1, characterized in that, The disk body is a circular disk body, and each of the bearing positions is located at the outer periphery of the circular disk body.

5. The material handling device for inspecting electronic components as described in claim 1, characterized in that, The disk body has a negative pressure channel at each corner corresponding to the bearing position, which connects to the bearing position.

6. A method for inspecting electronic components, characterized in that, include: a) Provides a turntable structure, a material handling device and multiple testing stations. The turntable structure includes a disc body with multiple bearing positions. The material handling device includes multiple suction components. Each suction component includes a sliding plate and a suction arm. The suction arm includes an arm plate and a suction head. A clearance space is provided around the suction head, the arm plate and the sliding plate. b) Place the plurality of said electronic components into each of said carrier positions, wherein at least one of said carrier positions is left empty without placing the electronic components; c) The electronic components are picked up from the carrier positions by the pick-up members and moved toward the detection stations. d) When each of the aforementioned testing stations tests each of the aforementioned electronic components, during the downward movement of each of the aforementioned pick-up components, each of the aforementioned clearance spaces is located outside the edge of the disk body, and the disk body can continuously rotate through each of the aforementioned clearance spaces; as well as e) After each of the said testing stations has completed the testing of each of the said electronic components, each of the said picking members moves each of the said electronic components back to the next-order carrying position.

7. The method for picking up electronic components as described in claim 6, characterized in that, The number of each of the described extraction components is less than the number of each of the described bearing positions.

8. The method for picking up electronic components as described in claim 7, characterized in that, The number of each of the said extraction components is one-half, one-third, or one-quarter of the number of each of the said bearing positions.

9. The method for picking up electronic components as described in claim 6, characterized in that, The number of each of the described extraction components is equal to the number of each of the described detection stations.

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