Balun, RF front-end chip and RF front-end module

Abstract

The present invention discloses a balun, a radio frequency front-end chip and a radio frequency front-end module, wherein the balun comprises a first winding and a second winding coupled to each other; the first winding comprises a first coil; the first coil is located in a second metal layer, and the second winding comprises a first coil segment and a second coil segment; the first coil segment and the second coil segment are located in the first metal layer, the first coil segment and the second coil segment are connected by a first bridge wire, the first bridge wire is located in the second metal layer, and the first bridge wire does not intersect with the first coil. The technical solution can reduce the occupied area of ​​the balun while ensuring the performance of the balun.

Description

Technical Field

[0001] The present invention relates to the field of radio frequency technology, and in particular to a balun, a radio frequency front-end chip and a radio frequency front-end module. Background Art

[0002] The RF front-end module is located between the antenna and the RF transceiver, and is the core component of electronic terminal communication. In some RF power amplifiers, such as push-pull power amplifiers, baluns are usually used. In some applications, the balun is set on the substrate or on the chip.

[0003] However, in some specific applications, the area of ​​the substrate or chip or the number of metal layers is relatively limited. In such a limited area or number of metal layers, it is difficult to take into account both the area and performance of the balun, which restricts the overall performance indicators of the RF power amplifier. Summary of the invention

[0004] The embodiments of the present invention provide a balun, a radio frequency front-end chip and a radio frequency front-end module to solve the problem that it is difficult for a balun to take both the area and the performance of the balun into consideration at the same time.

[0005] A balun includes a first winding and a second winding coupled to each other; the first winding includes a first coil; the first coil is located in a second metal layer, and the second winding includes a first coil segment and a second coil segment; the first coil segment and the second coil segment are located in the first metal layer, the first coil segment and the second coil segment are connected by a first bridge wire, the first bridge wire is located in the second metal layer, and the first bridge wire does not intersect with the first coil.

[0006] Furthermore, the first bridge wire and the first coil are coupled in the same layer.

[0007] Furthermore, the first coil wiring forms at least one coil gap; and the first bridge wire is located in any one of the coil gaps.

[0008] Furthermore, the first end of the first winding is connected to the first end of the first capacitor, and the second end of the first winding is the first signal transmission end; the second end of the first capacitor is connected to the first through hole, and the first through hole is used to connect to the ground end, and the first capacitor and the first through hole are located in the area surrounded by the first winding.

[0009] Further, the first end of the first coil is connected to the first end of the first capacitor, and the second end of the first coil is the first signal transmission end; with the first end of the first coil as the starting point and the second end of the first coil as the end point, the wiring direction of the first coil is clockwise or counterclockwise, the first end of the first coil is located within the area surrounded by the first coil, and the second end of the first coil is located outside the area surrounded by the first coil;

[0010] The first end of the first coil segment is a second signal transmission end, the second end of the first coil segment is connected to the first end of the second coil segment, and the second end of the second coil segment is a third signal transmission end; starting from the first end of the first coil segment, the wiring direction of the first coil segment is clockwise, starting from the first end of the second coil segment, the wiring direction of the second coil segment is clockwise, or the wiring direction of the first coil segment is counterclockwise, starting from the first end of the second coil segment, the wiring direction of the second coil segment is counterclockwise;

[0011] The first end of the second coil segment and the second end of the second coil segment are located outside a region surrounded by the second coil.

[0012] Furthermore, the first end of the first winding is also connected to a first pad, the first pad is used to connect to a power supply end, and the first pad is located in an area surrounded by the first winding.

[0013] Furthermore, the balun also includes a third winding; the third winding is located in a third metal layer; the second metal layer is located between the first metal layer and the third metal layer; the third winding is connected in parallel with the second winding.

[0014] Furthermore, the third winding includes a third coil; the first end of the third coil is connected to the first end of the first coil segment, and the second end of the third coil is connected to the second end of the second coil segment; with the first end of the third coil as the starting point, the wiring direction of the third coil is the same as the wiring direction of the second coil segment.

[0015] A balun includes a first winding and a second winding coupled to each other, wherein the first end of the first winding is connected to the first end of a first capacitor, and the second end of the first winding is a first signal transmission end; the second end of the first capacitor is connected to a first through hole, and the first through hole is used to connect to a ground end, and the first capacitor and the first through hole are located in an area surrounded by the first winding.

[0016] Furthermore, the first end of the first winding is also connected to a first pad, the first pad is used to connect to a power supply end, and the first pad is located in an area surrounded by the first winding.

[0017] Furthermore, the first winding includes a first coil; the second winding includes a second coil; the first coil is located in the second metal layer; the second coil is located in the first metal layer; and projections of the first coil and the second coil in the vertical direction at least partially overlap.

[0018] Furthermore, the first winding includes a first coil, and the second winding includes a first coil segment and a second coil segment; the first coil is located in the second metal layer; the first coil segment and the second coil segment are located in the first metal layer, the first coil segment and the second coil segment are connected by a first bridging wire, the first bridging wire is located in the second metal layer, and the first bridging wire does not intersect with the first coil.

[0019] Furthermore, it also includes a third winding; the third winding is located in a third metal layer; the second metal layer is located between the first metal layer and the third metal layer; the third winding is connected in parallel with the second winding.

[0020] A radio frequency front-end chip comprises the above-mentioned balun.

[0021] A radio frequency front-end module includes the above-mentioned balun.

[0022] The balun, the RF front-end chip and the RF front-end module, the balun includes a first winding and a second winding coupled to each other. The first winding includes a first coil, and the first coil is located in the second metal layer. The second winding includes a first coil segment and a second coil segment, the first coil segment and the second coil segment are located in the first metal layer, the first coil segment and the second coil segment are connected by a first bridge line, the first bridge line is located in the second metal layer, and the first bridge line does not intersect with the first coil. In this embodiment, by setting the first coil in the second metal layer and the first coil segment and the second coil segment in the first metal layer, the first coil, the upper and lower layers are coupled between the first coil segment and the second coil segment, thereby improving the coupling degree between the first winding and the second winding, and connecting the first coil segment and the second coil segment through the first bridge line, and setting the first bridge line in the second metal layer, and making the first bridge line not intersect with the first coil, so as to achieve the situation of ensuring the number of turns and coupling degree of the first winding and the second winding of the balun, and also making the balun set in fewer metal layers, so as to achieve the purpose of reducing the occupied area of ​​the balun, so as to solve the problem that the balun is difficult to take into account both the area and performance of the balun.

[0023] The balun includes a first winding and a second winding coupled to each other, wherein the first end of the first winding is connected to the first end of the first capacitor, and the second end of the first winding is a first signal transmission end; the second end of the first capacitor is connected to the first through hole, and the first through hole is used to connect to the ground end, and the first capacitor and the first through hole are located in the area surrounded by the first winding. Since the first end of the first winding is an end arranged in the area formed by the wiring of the first winding, and the first end of the first winding also needs to be connected to the ground end through the first capacitor, therefore, the present application not only can reasonably utilize the area in the area surrounded by the first winding, reduce the occupied area of ​​the balun, but also reduce the loss caused by the bridge line by locating the first capacitor and the first through hole in the area surrounded by the first winding, without the need to arrange the first capacitor outside the balun area through other bridge lines. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0025] Figure 1 is a schematic diagram of a structure of a balun in one embodiment of the present invention;

[0026] Figure 2 is another structural schematic diagram of a balun in one embodiment of the present invention;

[0027] Figure 3 is another structural schematic diagram of a balun in one embodiment of the present invention;

[0028] Figure 4 Detailed description of the invention The figure is a circuit diagram of a radio frequency power amplifier circuit according to an embodiment of the present invention. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] It should be understood that the present invention can be implemented in different forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, providing these embodiments will make the disclosure thorough and complete and fully convey the scope of the present invention to those skilled in the art. In the accompanying drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity. The same reference numerals throughout represent the same elements.

[0031] It should be understood that when an element or layer is referred to as being "on, adjacent to, connected to or coupled to other elements or layers, it may be directly on, adjacent to, connected to or coupled to other elements or layers, or there may be intervening elements or layers. In contrast, when an element is referred to as being "directly on, directly adjacent to, directly connected to or directly coupled to other elements or layers, there may be no intervening elements or layers. It should be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present invention, the first element, component, region, layer or part discussed below may be represented as a second element, component, region, layer or part.

[0032] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," and the like may be used herein for ease of description to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that the spatially relative terms are intended to include different orientations of the device in use and operation in addition to the orientations shown in the figures. For example, if the device in the accompanying drawings is flipped, then the elements or features described as "under other elements" or "under" or "under" will be oriented as "above" the other elements or features. Thus, the exemplary terms "under" and "under" may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0033] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present invention. When used herein, the singular forms "a", "an" and " / the" are also intended to include plural forms, unless the context clearly indicates another way. It should also be understood that the terms "consisting of" and / or "comprising" when used in this specification determine the presence of features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0034] In order to fully understand the present invention, detailed structures and steps will be presented in the following description to illustrate the technical solutions proposed by the present invention. The preferred embodiments of the present invention are described in detail below, but in addition to these detailed descriptions, the present invention may also have other implementations.

[0035] This embodiment provides a balun B1, such as Figure 1 As shown, it includes a first winding and a second winding coupled to each other; the first winding includes a first coil L1; the first coil L1 is located in the second metal layer, and the second winding includes a first coil segment L2a and a second coil L2 segment L2b; the first coil segment L2a and the second coil L2 segment L2b are located in the first metal layer, the first coil segment L2a and the second coil L2 segment L2b are connected through a first bridge wire L4, the first bridge wire L4 is located in the second metal layer, and the first bridge wire L4 does not intersect with the first coil L1.

[0036] In a specific embodiment, the balun B1 in this embodiment can be applied to a substrate or a chip. The substrate or the chip may include a plurality of metal layers. Preferably, the plurality of metal layers include a first metal layer and a second metal layer arranged in sequence from top to bottom. In an actual application process, since the thickness of the first metal layer is greater than the thickness of the second metal layer, and the first coil L1 in this embodiment is connected to the power supply terminal VCC, it is necessary to transmit the high-power DC signal output by the power supply terminal VCC. Therefore, the first coil L1 in this embodiment is arranged in the second metal layer with a larger thickness to improve the reliability of the balun B1.

[0037] In a specific embodiment, the balun B1 includes a first winding and a second winding coupled to each other. The first winding includes a first coil L1, and the second winding includes a first coil segment L2a and a second coil L2 segment L2b. The first coil L1 is located in the second metal layer, and the first coil segment L2a and the second coil L2 segment L2b are located in the first metal layer. The first coil L1 and the first coil segment L2a and the second coil L2 segment L2b are coupled in the upper and lower layers. Compared with the balun B1 using the same-layer side coupling, the balun B1 using the upper and lower layer coupling in the present application has a higher coupling degree.

[0038] The first coil segment L2a and the second coil segment L2b are connected via the first bridge wire L4, the first bridge wire L4 is located in the second metal layer, and the first bridge wire L4 does not intersect with the first coil L1. In this embodiment, when the balun B1 needs to ensure a large inductance and needs to use a first winding and a second winding with a large number of turns, the first winding and the second winding are configured in the above manner, that is, the first coil L1 is set in the second metal layer, and the first coil segment L2a and the second coil segment L2b are set in the first metal layer, so that the first coil L1, the first coil segment L2a and the second coil segment L2b are coupled between the upper and lower layers, and the first coil segment L2a and the second coil segment L2b are connected via the first bridge wire L4, and the first bridge wire L4 is connected to the first coil segment L2a and the second coil segment L2b. The wiring L4 is arranged in the second metal layer, and the first bridge wiring L4 does not intersect with the first coil L1, that is, the first bridge wiring L4 connecting the first coil segment L2a and the second coil segment L2b is arranged in the second metal layer and does not affect the wiring of the first coil L1, thereby ensuring the number of turns and coupling degree of the first winding and the second winding of the balun B1, and also enabling the balun B1 to be arranged in fewer metal layers, thereby achieving the purpose of reducing the occupied area of ​​the balun B1, thereby solving the problem that it is difficult for the balun B1 to take into account both the area and performance of the balun B1.

[0039] In this embodiment, the balun B1 includes a first winding and a second winding coupled to each other. The first winding includes a first coil L1, and the first coil L1 is located in the second metal layer. The second winding includes a first coil segment L2a and a second coil L2 segment L2b, and the first coil segment L2a and the second coil L2 segment L2b are located in the first metal layer, and the first coil segment L2a and the second coil L2 segment L2b are connected through a first bridge wire L4, and the first bridge wire L4 is located in the second metal layer, and the first bridge wire L4 does not intersect with the first coil L1. In this embodiment, the first coil L1 is arranged on the second metal layer, and the first coil segment L2a and the second coil segment L2b are arranged on the first metal layer, so that the first coil L1 is coupled with the first coil segment L2a and the second coil segment L2b in the upper and lower layers, thereby improving the coupling degree between the first winding and the second winding, and the first coil segment L2a and the second coil segment L2b are connected through the first bridge wire L4, and the first bridge wire L4 is arranged on the second metal layer, and the first bridge wire L4 does not intersect with the first coil L1, so that the balun B1 can be arranged in fewer metal layers while ensuring the number of turns and coupling degree of the first winding and the second winding of the balun B1, thereby achieving the purpose of reducing the occupied area of ​​the balun B1, and solving the problem that it is difficult for the balun B1 to take both the area and performance of the balun B1 into consideration.

[0040] In one embodiment, the first bridge line L4 and the first coil L1 are coupled in the same layer.

[0041] In a specific embodiment, the first coil segment L2a and the second coil segment L2b located in the first metal layer are connected through the first bridge wire L4 located in the second metal layer, and the first bridge wire L4 is coupled with the first coil L1 in the same layer, while ensuring that the first bridge wire L4 does not affect the wiring of the first coil L1, the first bridge wire L4 can also be used to improve the coupling degree between the first winding and the second winding. In this embodiment, that is, while the first coil L1 is coupled with the first coil segment L2a and the second coil segment L2b in the upper and lower layers, the first bridge wire L4 can also be coupled with the first coil L1 in the same layer, thereby improving the coupling degree between the first winding and the second winding.

[0042] In one embodiment, the first coil L1 is wired to form at least one coil gap; and the first bridge wire L4 is located in any coil gap.

[0043] In a specific embodiment, the first coil L1 is wired to form at least one coil gap. For example, when wiring the first coil L1, starting from any end of the first coil L1, the wiring is performed in a clockwise or counterclockwise direction to form a first coil L1 with at least two turns, and a coil gap is formed between two adjacent turns of the first coil L1, so that the first coil L1 is wired to form at least one coil gap. It should be noted that the first winding of this embodiment can more flexibly adjust the turn ratio of the first winding by adopting the first coil L1 wired in this way.

[0044] In a specific embodiment, the first bridge wire L4 is located in any coil gap. In this embodiment, by setting the first bridge wire L4 in any coil gap, that is, ensuring that the first bridge wire L4 does not intersect with the first coil L1, the first bridge wire L4 and the first coil L1 are coupled in the same layer, that is, while the first coil L1 is coupled with the first coil segment L2a and the second coil segment L2b in the upper and lower layers, the first bridge wire L4 and the first coil L1 can also be coupled in the same layer, thereby improving the coupling degree between the first winding and the second winding. Preferably, when the first bridge wire L4 is set in the coil gap formed by the wiring of the first coil L1, the first bridge wire L4 is set in parallel with the first coil L1 in the corresponding area, thereby further improving the coupling degree between the first winding and the second winding while saving space.

[0045] In one embodiment, the first end of the first winding is connected to the first end of the first capacitor C1, and the second end of the first winding is the first signal transmission end; the second end of the first capacitor C1 is connected to the first through hole M1, and the first through hole M1 is used to connect to the ground end, and the first capacitor C1 and the first through hole M1 are located in the area surrounded by the first winding.

[0046] In an application scenario, the balun B1 in this embodiment is used to convert a single-ended RF input signal into a differential RF output signal, or to convert a differential RF input signal into a single-ended RF output signal.

[0047] As an example, Figure 4 As shown, the balun B1 is applied to a radio frequency power amplifier circuit, which includes a first-stage power amplifier circuit and a second-stage power amplifier circuit. The first-stage power amplifier circuit includes a first amplifier M11, and the second-stage power amplifier includes a second amplifier M21 and a third amplifier M22.

[0048] Specifically, the first end of the first winding in the balun B1 is connected to the first end of the first capacitor C1, the second end of the first winding is the first signal transmission end, and is connected to the output end of the first amplifier M11, the first end of the second winding is connected to the input end of the second amplifier M21, and the second end of the second winding is connected to the input end of the third amplifier M22. Among them, the first amplifier M11 is configured to receive a first RF signal, amplify the first RF signal, and output a RF input signal. The balun B1 is configured to convert the RF input signal, output a first RF output signal and a second RF output signal, and the first RF output signal and the second RF output signal are equal in size and opposite in phase. The second amplifier M21 is configured to amplify the first RF output signal and output a first RF amplified signal, and the third amplifier M22 is configured to amplify the second RF output signal and output a second RF amplified signal. It should be noted that the first capacitor C1 in this embodiment is configured to perform decoupling filtering on the electrical signal flowing through the balun B1.

[0049] In a specific implementation, the first end of the first capacitor C1 is connected to the first end of the first winding, and the second end of the first capacitor C1 is connected to the first through hole M1 on the substrate, and the first through hole M1 is used to connect to the ground end, so as to achieve a decoupling filtering effect. In this embodiment, since the first end of the first winding is an end arranged in the area formed by the wiring of the first winding, and the first end of the first winding also needs to be connected to the ground end through the first capacitor C1, therefore, the present application, by locating the first capacitor C1 and the first through hole M1 in the area surrounded by the first winding, without the need to arrange the first capacitor C1 outside the balun B1 area through other bridge lines, can not only reasonably utilize the area in the area surrounded by the first winding, reduce the occupied area of ​​balun B1, but also reduce the loss caused by the bridge line.

[0050] In one embodiment, the first end of the first coil L1 is connected to the first end of the first capacitor C1, and the second end of the first coil L1 is the first signal transmission end; with the first end of the first coil L1 as the starting point and the second end of the first coil L1 as the end point, the wiring direction of the first coil L1 is clockwise or counterclockwise, the first end of the first coil L1 is located in the area surrounded by the first coil L1, and the second end of the first coil L1 is located outside the area surrounded by the first coil L1; the first end of the first coil segment L2a is the second signal transmission end, the second end of the first coil segment L2a is connected to the first end of the second coil segment L2b, and the first end of the first coil segment L2a is connected to the first end of the second coil segment L2b. The second end of the second coil L2 segment L2b is the third signal transmission end; with the first end of the first coil segment L2a as the starting point, the wiring direction of the first coil segment L2a is clockwise, and with the first end of the second coil L2 segment L2b as the starting point, the wiring direction of the second coil L2 segment L2b is clockwise, or the wiring direction of the first coil segment L2a is counterclockwise, with the first end of the second coil L2 segment L2b as the starting point, the wiring direction of the second coil L2 segment L2b is counterclockwise; the first end of the second coil L2 segment L2b and the second end of the second coil L2 segment L2b are located outside the area surrounded by the second coil L2.

[0051] In a specific embodiment, the first end of the first coil L1 is connected to the first end of the first capacitor C1, and the second end of the first coil L1 is the first signal transmission end; with the first end of the first coil L1 as the starting point and the second end of the first coil L1 as the end point, the wiring direction of the first coil L1 is clockwise or counterclockwise, the first end of the first coil L1 is located within the area enclosed by the first coil L1, and the second end of the first coil L1 is located outside the area enclosed by the first coil L1. In this embodiment, the first coil L1 is formed by taking the first end of the first coil L1 as the starting point and the second end of the first coil L1 as the end point, and the wiring direction is clockwise or counterclockwise, so that the first end of the first coil L1 is located within the area surrounded by the first coil L1, and the second end of the first coil L1 is located outside the area surrounded by the first coil L1, so that the first end of the first coil L1 is connected to the first capacitor C1 in the area surrounded by the first coil L1, thereby further reducing the occupied area of ​​the balun B1; and the first winding of this embodiment can more flexibly adjust the turns ratio of the first winding by adopting the first coil L1 with this wiring method.

[0052] In a specific embodiment, the first end of the first coil segment L2a is the second signal transmission end, the second end of the first coil segment L2a is connected to the first end of the second coil segment L2b, and the second end of the second coil segment L2b is the third signal transmission end; with the first end of the first coil segment L2a as the starting point, the wiring direction of the first coil segment L2a is clockwise, with the first end of the second coil segment L2b as the starting point, the wiring direction of the second coil segment L2b is clockwise, or the wiring direction of the first coil segment L2a is counterclockwise, with the first end of the second coil segment L2b as the starting point, the wiring direction of the second coil segment L2b is counterclockwise. 2b is the starting point, and the wiring direction of the second coil L2 segment L2b is counterclockwise; the first end of the second coil L2 segment L2b and the second end of the second coil L2 segment L2b are located outside the area surrounded by the second coil L2, so that the first coil segment L2a and the second coil L2 segment L2b can be connected through the first bridge wire L4, and the first bridge wire L4 is set in the second metal layer, so that the balun B1 is set in fewer metal layers, so as to achieve the purpose of reducing the occupied area of ​​the balun B1, so as to solve the problem that the balun B1 is difficult to take into account both the area and performance of the balun B1. As an example, the second signal transmission end can be used to connect the input end of the second amplifier M21 in the above embodiment, and the third signal transmission end can be used to connect the input end of the third amplifier M22 in the above embodiment.

[0053] In one embodiment, the first end of the first winding is also connected to the first pad pad1, the first pad pad1 is used to connect to the power supply terminal VCC, and the first pad pad1 is located in the area surrounded by the first winding.

[0054] In a specific embodiment, since the first winding is located in the first metal layer and the thickness of the first metal layer is greater than that of the second metal layer, the first end of the first winding can be connected to the first pad pad1, and the first pad pad1 is used to connect the power supply terminal VCC, and the power supply terminal VCC is used to supply power to the first amplifier M11 in the above embodiment, that is, the first winding located in the first metal layer is used to supply power to the first amplifier M11 connected to the first winding.

[0055] In a specific embodiment, the first pad pad1 is located in the area surrounded by the first winding. In this embodiment, the first pad pad1 is disposed in the area surrounded by the first winding, and the area in the area surrounded by the first winding is reasonably utilized, thereby further reducing the occupied area of ​​the balun B1.

[0056] In one embodiment, the balun B1 further includes a third winding; the third winding is located in a third metal layer; the second metal layer is located between the first metal layer and the third metal layer; and the third winding is connected in parallel with the second winding.

[0057] In a specific embodiment, the balun B1 further includes a third winding, the third winding is located in the third metal layer, and the second metal layer is located between the first metal layer and the third metal layer. In this embodiment, by connecting the third winding in parallel with the second winding, the first winding is coupled with the upper and lower layers of the second winding, and is also coupled with the upper and lower layers of the third winding, so that the coupling degree of the balun B1 can be further improved.

[0058] In one embodiment, if Figure 2 As shown, the third winding includes a third coil; the first end of the third coil is connected to the first end of the first coil segment L2a, and the second end of the third coil is connected to the second end of the second coil segment L2b; with the first end of the third coil as the starting point, the wiring direction of the third coil is the same as the wiring direction of the second coil segment L2b.

[0059] In a specific embodiment, the third winding includes a third coil, the first end of the third coil is connected to the first end of the first coil segment L2a, the second end of the third coil is connected to the second end of the second coil L2 segment L2b, and the second end of the first coil segment L2a is connected to the first end of the second coil L2 segment L2b through the first bridge wire L4. With the first end of the third coil as the starting point, the wiring direction of the third coil is the same as the wiring direction of the second coil L2 segment L2b. In this embodiment, by connecting the first end of the third coil to the first end of the first coil segment L2a, the second end of the third coil is connected to the second end of the second coil L2 segment L2b, the second end of the first coil segment L2a is connected to the first end of the second coil L2 segment L2b through the first bridge wire L4, and the first end of the third coil is used as the starting point, the wiring is formed in the same wiring direction as the wiring direction of the second coil L2 segment L2b, so that the first coil L1 can not only be coupled with the first bridge wire L4 in the same layer, but also can be coupled with the first coil segment L2a, the second coil L2 segment L2b and the third coil in the upper and lower layers, further improving the coupling degree of the balun B1.

[0060] This embodiment provides a balun B1, which includes a first winding and a second winding coupled to each other, wherein the first end of the first winding is connected to the first end of the first capacitor C1, and the second end of the first winding is a first signal transmission end; the second end of the first capacitor C1 is connected to the first through hole M1, and the first through hole M1 is used to connect to the ground end, and the first capacitor C1 and the first through hole M1 are located in the area surrounded by the first winding.

[0061] In an application scenario, the balun B1 in this embodiment is used to convert a single-ended RF input signal into a differential RF output signal, or to convert a differential RF input signal into a single-ended RF output signal.

[0062] As an example, Figure 4As shown, the balun B1 is applied to a radio frequency power amplifier circuit, which includes a first-stage power amplifier circuit and a second-stage power amplifier circuit. The first-stage power amplifier circuit includes a first amplifier M11, and the second-stage power amplifier includes a second amplifier M21 and a third amplifier M22.

[0063] Specifically, the first end of the first winding in the balun B1 is connected to the first end of the first capacitor C1, the second end of the first winding is the first signal transmission end, and is connected to the output end of the first amplifier M11, the first end of the second winding is connected to the input end of the second amplifier M21, and the second end of the second winding is connected to the input end of the third amplifier M22. Among them, the first amplifier M11 is configured to receive a first RF signal, amplify the first RF signal, and output a RF input signal. The balun B1 is configured to convert the RF input signal, output a first RF output signal and a second RF output signal, and the first RF output signal and the second RF output signal are equal in size and opposite in phase. The second amplifier M21 is configured to amplify the first RF output signal and output a first RF amplified signal, and the third amplifier M22 is configured to amplify the second RF output signal and output a second RF amplified signal. It should be noted that the first capacitor C1 in this embodiment is configured to perform decoupling filtering on the electrical signal flowing through the balun B1.

[0064] In a specific implementation, the first end of the first capacitor C1 is connected to the first end of the first winding, and the second end of the first capacitor C1 is connected to the first through hole M1 on the substrate, and the first through hole M1 is used to connect to the ground end, so as to achieve a filtering effect. In this embodiment, by locating the first capacitor C1 and the first through hole M1 in the area surrounded by the first winding, since the first end of the first winding is an end arranged in the area formed by the wiring of the first winding, and the first end of the first winding also needs to be connected to the ground end through the first capacitor C1, therefore, the present application locates the first capacitor C1 and the first through hole M1 in the area surrounded by the first winding, and does not need to arrange the first capacitor C1 outside the balun B1 area through other bridge lines, which can not only reasonably utilize the area in the area surrounded by the first winding, reduce the occupied area of ​​balun B1, but also reduce the loss caused by the bridge line.

[0065] In one embodiment, the first end of the first winding is also connected to the first pad pad1, the first pad pad1 is used to connect to the power supply terminal VCC, and the first pad pad1 is located in the area surrounded by the first winding.

[0066] In a specific embodiment, since the first winding is located in the first metal layer and the thickness of the first metal layer is greater than that of the second metal layer, the first end of the first winding can be connected to the first pad pad1, and the first pad pad1 is used to connect the power supply terminal VCC, and the power supply terminal VCC is used to supply power to the first amplifier M11 in the above embodiment, that is, the first winding located in the first metal layer is used to supply power to the first amplifier M11 connected to the first winding.

[0067] In one embodiment, if Figure 3 As shown, the first winding includes a first coil L1; the second winding includes a second coil L2; the first coil L1 is located in the second metal layer; the second coil L2 is located in the first metal layer; the projections of the first coil L1 and the second coil L2 in the vertical direction at least partially overlap.

[0068] In this embodiment, the first winding includes a first coil L1; the second winding includes a second coil L2; the first coil L1 is located in the second metal layer; the second coil L2 is located in the first metal layer; the projections of the first coil L1 and the second coil L2 in the vertical direction at least partially overlap, so as to realize the upper and lower layer coupling of the first winding and the second winding. Compared with the balun B1 using the same layer side coupling, the coupling degree of the upper and lower layer coupling balun B1 used in this application is higher. At the same time, the first end of the first winding is connected to the first end of the first capacitor C1, and the second end of the first winding is the first signal transmission end; the second end of the first capacitor C1 is connected to the first through hole M1, and the first through hole M1 is used to connect to the ground end. The first capacitor C1 and the first through hole M1 are located in the area surrounded by the first winding, and the area in the area surrounded by the first winding can be reasonably utilized, thereby further reducing the occupied area of ​​the balun B1.

[0069] In one embodiment, if Figure 1 As shown, the first winding includes a first coil L1, and the second winding includes a first coil segment L2a and a second coil segment L2b; the first coil L1 is located at the second metal layer; the first coil segment L2a and the second coil segment L2b are located at the first metal layer, the first coil segment L2a and the second coil segment L2b are connected through a first bridge wire L4, the first bridge wire L4 is located at the second metal layer, and the first bridge wire L4 does not intersect with the first coil L1.

[0070] In a specific embodiment, the balun B1 in this embodiment can be applied to a substrate or a chip. The substrate or the chip may include multiple metal layers. Preferably, the multiple metal layers include a first metal layer and a second metal layer arranged in sequence from top to bottom. The thickness of the first metal layer is greater than the thickness of the second metal layer.

[0071] In a specific embodiment, the balun B1 includes a first winding and a second winding coupled to each other. The first winding includes a first coil L1, and the second winding includes a first coil segment L2a and a second coil segment L2b. The first coil L1 is located in the second metal layer, and the first coil segment L2a and the second coil segment L2b are located in the first metal layer. The first coil L1 is coupled with the first coil segment L2a and the second coil segment L2b in the upper and lower layers. The first coil segment L2a and the second coil segment L2b are connected by a first bridge wire L4, and the first bridge wire L4 is located in the second metal layer, and the first bridge wire L4 does not intersect with the first coil L1. In this embodiment, when the balun B1 needs to ensure a large inductance and needs to use a first winding and a second winding with a large number of turns, the first winding and the second winding are configured in the manner described above, that is, the first coil L1 is arranged on the second metal layer, and the first coil segment L2a and the second coil segment L2b are arranged on the first metal layer, so that the first coil L1, the first coil segment L2a and the second coil segment L2b are coupled between the upper and lower layers, and the first coil segment L2a and the second coil segment L2b are connected through the first bridge wire L4, and the first bridge wire L4 is connected to the first bridge wire L4. The wiring L4 is arranged in the second metal layer, and the first bridge wiring L4 does not intersect with the first coil L1, that is, the first bridge wiring L4 connecting the first coil segment L2a and the second coil segment L2b is arranged in the second metal layer and does not affect the wiring of the first coil L1, thereby ensuring the number of turns and coupling degree of the first winding and the second winding of the balun B1, and also enabling the balun B1 to be arranged in fewer metal layers, thereby achieving the purpose of reducing the occupied area of ​​the balun B1, thereby solving the problem that it is difficult for the balun B1 to take into account both the area and performance of the balun B1.

[0072] In this embodiment, the balun B1 includes a first winding and a second winding coupled to each other. The first winding includes a first coil L1, and the first coil L1 is located in the second metal layer. The second winding includes a first coil segment L2a and a second coil L2 segment L2b, and the first coil segment L2a and the second coil L2 segment L2b are located in the first metal layer, and the first coil segment L2a and the second coil L2 segment L2b are connected through a first bridge wire L4, and the first bridge wire L4 is located in the second metal layer, and the first bridge wire L4 does not intersect with the first coil L1. In this embodiment, the first coil L1 is arranged on the second metal layer, and the first coil segment L2a and the second coil segment L2b are arranged on the first metal layer, so that the first coil L1 is coupled with the first coil segment L2a and the second coil segment L2b in the upper and lower layers, and the first coil segment L2a and the second coil segment L2b are connected through the first bridge wire L4, and the first bridge wire L4 is arranged on the second metal layer, and the first bridge wire L4 does not intersect with the first coil L1, so that the balun B1 can be arranged in fewer metal layers while ensuring the number of turns and coupling degree of the first winding and the second winding of the balun B1, so as to achieve the purpose of reducing the occupied area of ​​the balun B1, and solve the problem that it is difficult to take into account both the area and performance of the balun B1.

[0073] In one embodiment, a third winding is further included; the third winding is located in the third metal layer; the second metal layer is located between the first metal layer and the third metal layer; and the third winding is connected in parallel with the second winding.

[0074] In a specific embodiment, the balun B1 further includes a third winding, the third winding is located in the third metal layer, and the second metal layer is located between the first metal layer and the third metal layer. In this embodiment, by connecting the third winding in parallel with the second winding, the first winding is coupled with the upper and lower layers of the second winding, and is also coupled with the upper and lower layers of the third winding, so that the coupling degree of the balun B1 can be further improved.

[0075] In one embodiment, if Figure 2 As shown, the third winding includes a third coil; the first end of the third coil is connected to the first end of the first coil segment L2a, and the second end of the third coil is connected to the second end of the second coil segment L2b; with the first end of the third coil as the starting point, the wiring direction of the third coil is the same as the wiring direction of the second coil segment L2b.

[0076] In a specific embodiment, the third winding includes a third coil, the first end of the third coil is connected to the first end of the first coil segment L2a, the second end of the third coil is connected to the second end of the second coil segment L2b, and the second end of the first coil segment L2a is connected to the first end of the second coil segment L2b through the first bridge wire L4. With the first end of the third coil as the starting point, the wiring direction of the third coil is the same as the wiring direction of the second coil segment L2b. In this embodiment, by connecting the first end of the third coil to the first end of the first coil segment L2a, the second end of the third coil is connected to the second end of the second coil segment L2b, the second end of the first coil segment L2a is connected to the first end of the second coil segment L2b through the first bridge wire L4, and the first end of the third coil is used as the starting point, the wiring is formed in the same wiring direction as the wiring direction of the second coil segment L2b, so that the first coil L1 can not only be coupled with the first bridge wire L4 in the same layer, but also can be coupled with the first coil segment L2a, the second coil segment L2b and the third coil in the upper and lower layers, thereby improving the coupling degree of the balun B1.

[0077] This embodiment provides a radio frequency front-end chip, including the above-mentioned balun B1.

[0078] In a specific embodiment, the RF front-end chip includes a first metal layer, a second metal layer, a first capacitor C1, a first amplifier M11, a second amplifier M21 and a third amplifier M22. The balun B1 is arranged on the adjacent first metal layer and the second metal layer. The first end of the balun B1 is connected to the first capacitor C1, the second end of the balun B1 is connected to the output end of the first amplifier M11, the third end of the balun B1 is connected to the input end of the second amplifier M21, the fourth end of the balun B1 is connected to the input end of the third amplifier M22, the first capacitor C1 is connected to the first through hole M1, and the first through hole M1 is used to connect to the ground terminal. In this embodiment, since the first end of the first winding is an end arranged in the area formed by the wiring of the first winding, and the first end of the first winding also needs to be connected to the ground end through the first capacitor C1, therefore, the present application locates the first capacitor C1 and the first through hole M1 in the area enclosed by the first winding, without the need to set the first capacitor C1 outside the balun B1 area through other bridge lines. This not only can reasonably utilize the area within the area enclosed by the first winding and reduce the occupied area of ​​the balun B1, but also can reduce the loss caused by the bridge line.

[0079] This embodiment provides a radio frequency front-end module, including the above-mentioned balun B1.

[0080] In a specific embodiment, the RF front-end module includes a substrate, a first metal layer and a second metal layer arranged on the substrate, a first capacitor C1 arranged on the substrate, a first amplifier M11 arranged on the substrate, a second amplifier M21 arranged on the substrate, and a third amplifier M22 arranged on the substrate. The balun B1 is arranged on the adjacent first metal layer and the second metal layer. The first end of the balun B1 is connected to the first capacitor C1, the second end of the balun B1 is connected to the output end of the first amplifier M11, the third end of the balun B1 is connected to the input end of the second amplifier M21, the fourth end of the balun B1 is connected to the input end of the third amplifier M22, the first capacitor C1 is connected to the first through hole M1, and the first through hole M1 is used to connect to the ground end. In this embodiment, since the first end of the first winding is an end arranged in the area formed by the wiring of the first winding, and the first end of the first winding also needs to be connected to the ground end through the first capacitor C1, therefore, the present application locates the first capacitor C1 and the first through hole M1 in the area enclosed by the first winding, without the need to set the first capacitor C1 outside the balun B1 area through other bridge lines. This not only can reasonably utilize the area within the area enclosed by the first winding and reduce the occupied area of ​​the balun B1, but also can reduce the loss caused by the bridge line.

[0081] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A balun, characterized in that: The invention comprises a first winding and a second winding coupled to each other; the first winding comprises a first coil; the first coil is located in a second metal layer, and the second winding comprises a first coil segment and a second coil segment; the first coil segment and the second coil segment are located in the first metal layer, the first coil segment and the second coil segment are connected by a first bridge wire, the first bridge wire is located in the second metal layer, and the first bridge wire does not intersect with the first coil; The number of turns of the first coil is at least two, a coil gap is formed between two adjacent turns of the first coil, the first bridge wire is located in the coil gap, the first bridge wire is arranged in parallel with the first coil in the corresponding area, and is coupled with the first coil in the same layer, so that the first coil is coupled up and down with the first coil segment and the second coil segment in the second winding and is coupled with the first bridge wire in the second winding in the same layer.

2. The balun according to claim 1, wherein: The first end of the first winding is connected to the first end of the first capacitor, and the second end of the first winding is the first signal transmission end; the second end of the first capacitor is connected to the first through hole, and the first through hole is used to connect to the ground end, and the first capacitor and the first through hole are located in the area surrounded by the first winding.

3. The balun according to claim 2, wherein: The first end of the first coil is connected to the first end of the first capacitor, and the second end of the first coil is the first signal transmission end; the first end of the first coil is used as a starting point, and the second end of the first coil is used as an end point, the wiring direction of the first coil is clockwise or counterclockwise, the first end of the first coil is located in the area surrounded by the first coil, and the second end of the first coil is located outside the area surrounded by the first coil; The first end of the first coil segment is a second signal transmission end, the second end of the first coil segment is connected to the first end of the second coil segment, and the second end of the second coil segment is a third signal transmission end; starting from the first end of the first coil segment, the wiring direction of the first coil segment is clockwise, starting from the first end of the second coil segment, the wiring direction of the second coil segment is clockwise, or the wiring direction of the first coil segment is counterclockwise, starting from the first end of the second coil segment, the wiring direction of the second coil segment is counterclockwise; The first end of the second coil segment and the second end of the second coil segment are located outside a region surrounded by the second coil.

4. The balun according to claim 1, wherein: The first end of the first winding is also connected to a first pad, and the first pad is used to connect to a power supply end. The first pad is located in an area surrounded by the first winding.

5. The balun according to claim 1, wherein: The balun also includes a third winding; the third winding is located in a third metal layer; the second metal layer is located between the first metal layer and the third metal layer; the third winding is connected in parallel with the second winding.

6. The balun according to claim 5, wherein: The third winding includes a third coil; the first end of the third coil is connected to the first end of the first coil segment, and the second end of the third coil is connected to the second end of the second coil segment; with the first end of the third coil as the starting point, the wiring direction of the third coil is the same as the wiring direction of the second coil segment.

7. A balun, characterized in that: The balun includes a first winding and a second winding coupled to each other, wherein a first end of the first winding is connected to a first end of a first capacitor, and a second end of the first winding is a first signal transmission end; a second end of the first capacitor is connected to a first through hole, and the first through hole is used to connect to a ground end, and the first capacitor and the first through hole are located in an area surrounded by the first winding; The first winding includes a first coil, and the first coil is located in a second metal layer; the second winding includes a first coil segment and a second coil segment, and the first coil segment and the second coil segment are located in the first metal layer, and the first coil segment and the second coil segment are connected by a first bridge wire, and the first bridge wire is located in the second metal layer, and the first bridge wire does not intersect with the first coil; The number of turns of the first coil wiring is at least two, a coil gap is formed between two adjacent turns of the first coil, the first bridge wire is located in the coil gap, the first bridge wire is arranged in parallel with the first coil in the corresponding area, and is coupled with the first coil in the same layer, so that the first coil is coupled up and down with the first coil segment and the second coil segment in the second winding and is coupled with the first bridge wire in the second winding in the same layer.

8. The balun according to claim 7, wherein: The first end of the first winding is also connected to a first pad, and the first pad is used to connect to a power supply end. The first pad is located in an area surrounded by the first winding.

9. The balun according to claim 7, wherein: The first winding includes a first coil; the second winding includes a second coil; the first coil is located in the second metal layer; the second coil is located in the first metal layer; and projections of the first coil and the second coil in a vertical direction at least partially overlap.

10. The balun according to claim 7, wherein: It also includes a third winding; the third winding is located in a third metal layer; the second metal layer is located between the first metal layer and the third metal layer; the third winding is connected in parallel with the second winding.

11. A radio frequency front-end chip, characterized in that: Comprising a balun as described in any one of claims 1-10.

12. A radio frequency front-end module, characterized in that: Comprising a balun as described in any one of claims 1-10.

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