Method and device for monitoring ambient temperature of switch equipment

Abstract

Embodiments of the present invention relate to a method and apparatus for monitoring the ambient temperature of a switch device, comprising: obtaining temperature information collected by two temperature sensors mounted on a PCB board of a target switch device; determining whether an optical module is plugged into the target switch device based on the temperature information; determining an ambient temperature determination strategy based on the determination result; and calculating the ambient temperature of the target switch device using the temperature information based on the determination strategy. Thus, by calculating the ambient temperature based on the relationship between the ambient information and the temperature of the PCB board's air inlet and outlet, the ambient temperature can be calculated based on the air inlet and outlet temperatures, enabling ambient temperature monitoring for devices with high power consumption and high-density port layouts.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of switch equipment environment monitoring, and in particular to a method and device for monitoring the ambient temperature of a switch equipment. Background Art

[0002] For communications electronics such as switches, real-time monitoring of the ambient temperature is necessary. For products without power-consuming components at the air inlet, the readings of internally located temperature sensors can be used as a direct reference. However, for products with high-power consumption components such as optical modules at the air inlet, or where these components are densely packed, the temperature sensor readings will differ significantly from the actual ambient temperature, making it impossible to accurately monitor the actual ambient temperature. Summary of the Invention

[0003] In view of this, in order to solve the above technical problems or part of the technical problems, an embodiment of the present invention provides a method and apparatus for monitoring the ambient temperature of a switch device.

[0004] In a first aspect, an embodiment of the present invention provides a method for monitoring the ambient temperature of a switch device, comprising:

[0005] Obtain temperature information collected by two temperature sensors installed on the PCB board of the target switch device;

[0006] Determining whether an optical module is inserted into the target switch device based on the temperature information;

[0007] Determine a determination strategy for the ambient temperature based on the determination result;

[0008] The ambient temperature of the target switch device is calculated using the temperature information based on the determination strategy.

[0009] In one possible implementation, the method further includes:

[0010] The first temperature sensor is arranged at the air inlet of the PCB board, and the second temperature sensor is arranged at the air outlet of the PCB board;

[0011] Acquire first temperature information collected by the first temperature sensor and second temperature information collected by the second temperature sensor;

[0012] If the first temperature information is greater than the second temperature information, it is determined that an optical module is inserted into the target switch device;

[0013] If the first temperature information is less than the second temperature information, it is determined that no optical module is inserted into the target switch device.

[0014] In one possible implementation, the method further includes:

[0015] If it is determined that an optical module is inserted into the target switch device, determining that the judgment strategy is to make a judgment based on the second temperature information and a preset fitting difference value;

[0016] If it is determined that no optical module is inserted into the target switch device, the judgment strategy is determined to be based on the first temperature information.

[0017] In one possible implementation, the method further includes:

[0018] If it is determined that the judgment strategy is to make a judgment based on the second temperature information and a preset fitting difference value, then obtaining the current system fan speed;

[0019] determining a current fitting difference based on the fan speed;

[0020] A first difference between the second temperature information and the current fitting difference is used as the ambient temperature of the target switch device.

[0021] In one possible implementation, the method further includes:

[0022] If it is determined that the judgment strategy is to make a judgment based on the first temperature information, the first temperature information is used as the ambient temperature of the target switch device.

[0023] In one possible implementation, the method further includes:

[0024] The system fan is controlled based on the ambient temperature of the target switch device so that the ambient temperature of the target switch device meets a safety condition.

[0025] In one possible implementation, the method further includes:

[0026] Acquire temperature information corresponding to the first temperature sensor and the second temperature sensor respectively at different system fan speeds;

[0027] Acquire a second difference between the temperature information and the actual ambient temperature;

[0028] A polynomial fitting is performed based on the second difference and the fan speed to obtain a fitting relationship between the second difference and the fan speed.

[0029] In a second aspect, an embodiment of the present invention provides an ambient temperature monitoring device for a switch device, comprising:

[0030] An acquisition module is used to obtain temperature information collected by two temperature sensors installed on the PCB board of the target switch device;

[0031] a judgment module, configured to judge whether an optical module is inserted into the target switch device based on the temperature information;

[0032] A judgment module, used to determine a judgment strategy for the ambient temperature based on the judgment result;

[0033] A calculation module is configured to calculate the ambient temperature of the target switch device using the temperature information based on the determination strategy.

[0034] In a third aspect, an embodiment of the present invention provides an electronic device, comprising: a processor and a memory, wherein the processor is configured to execute an ambient temperature monitoring program for a switch device stored in the memory to implement the ambient temperature monitoring method for the switch device described in the first aspect.

[0035] In a fourth aspect, an embodiment of the present invention provides a storage medium, comprising: the storage medium stores one or more programs, and the one or more programs can be executed by one or more processors to implement the ambient temperature monitoring method of the switch device described in the first aspect above.

[0036] The embodiment of the present invention provides an environmental temperature monitoring solution for a switch device, which obtains temperature information collected by two temperature sensors installed on the PCB board of the target switch device; determines whether an optical module is inserted into the target switch device based on the temperature information; determines a strategy for determining the environmental temperature based on the judgment result; and calculates the environmental temperature of the target switch device using the temperature information based on the judgment strategy. Compared with the existing technology, which cannot accurately monitor the environmental temperature of the switch by disposing temperature sensors in high-power and high-density port layouts, this solution solves the problem. By using the relationship between environmental information and the temperature of the air inlet and outlet of the PCB board, the environmental temperature can be calculated based on the temperature of the air inlet and outlet, thereby realizing environmental temperature monitoring of devices with high power consumption and high-density port layouts. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 A schematic diagram of a flow chart of a method for monitoring the ambient temperature of a switch device provided in an embodiment of the present invention;

[0038] Figure 2 A schematic flow chart of another method for monitoring the ambient temperature of a switch device provided by an embodiment of the present invention;

[0039] Figure 3 A schematic diagram of the structure of a switch device provided in an embodiment of the present invention;

[0040] Figure 4 A schematic diagram of a fitting relationship between a second difference and a fan speed provided by an embodiment of the present invention;

[0041] Figure 5 A schematic diagram of the structure of an ambient temperature monitoring device for a switch device provided by an embodiment of the present invention;

[0042] Figure 6 A schematic structural diagram of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0043] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0044] To facilitate understanding of the embodiments of the present invention, specific embodiments will be further explained below with reference to the accompanying drawings. The embodiments do not limit the embodiments of the present invention.

[0045] Figure 1 A flow chart of a method for monitoring the ambient temperature of a switch device provided by an embodiment of the present invention is shown as follows: Figure 1 As shown, the method specifically includes:

[0046] S11 , obtaining temperature information collected by two temperature sensors disposed on a PCB board of a target switch device.

[0047] The embodiments of the present invention are mainly applied to the scenario of ambient temperature monitoring of switch devices, and are preferably applicable to ambient temperature monitoring of switch devices with high power consumption and high-density port layout.

[0048] like Figure 3The following is a schematic diagram of the switch structure: 1. Optical module, 2. PCB, 3. Temperature sensor A, 4. Temperature sensor B, 5. System fan and power module. The front panel of the switch houses the optical module port, and the rear panel houses the system fan and power module. Airflow is front-to-back. Two temperature sensors are located on the PCB: sensor A, located on the left side of the PCB, within 1 cm of the optical module; and sensor B, located on the right side, approximately 1 cm from the edge. Sensor B is free of high-power, heat-generating components, and there is no copper padding near the bottom of sensor B to prevent heat transfer from the board and a significant temperature rise. When an optical module is installed in a front-panel port, the high power consumption of the optical module heats the nearby board, which in turn heats sensor A. This causes the temperature of sensor A to be significantly higher than that of sensor B, with the following relationship: sensor A > sensor B > ambient temperature. When no optical module is installed in the front-panel port, the temperature follows the following relationship: sensor B > sensor A ≈ ambient temperature.

[0049] First, the temperature sensors A and B are used to collect the temperature information of the external environment of the target switch device in its current state.

[0050] S12: Determine whether an optical module is inserted into the target switch device based on the temperature information.

[0051] According to the above rules, whether the target switch device is plugged in with an optical module can be determined based on the magnitude of the temperature information collected by the two temperature sensors.

[0052] S13. Determine a determination strategy for the ambient temperature based on the determination result.

[0053] In embodiments of the present invention, the ambient temperature determination strategy can be determined based on whether an optical module is installed in the target switch. For example, when an optical module is installed, the temperature values ​​follow the order: temperature sensor A > temperature sensor B > ambient temperature. A mathematical model can be established based on this order to calculate the ambient temperature. When no optical module is installed, the temperature values ​​follow the order: temperature sensor B > temperature sensor A ≈ ambient temperature. The temperature information collected by temperature sensor A can be considered the ambient temperature information.

[0054] S14: Calculate the ambient temperature of the target switch device using the temperature information based on the determination strategy.

[0055] The ambient temperature of the target switch device is calculated based on the above-set ambient temperature judgment strategy. The process of establishing the mathematical model is as follows:

[0056] Starting with a 10% initial fan speed, increase the speed by 10% increments and measure the corresponding temperature sensor values ​​at different fan speeds. Speeds N1 to N10 correspond to TB_1 to TB_10, respectively. The difference between TB_1 to TB_10 and the actual ambient temperature is set to T1 to T10, respectively. Higher speeds decrease the difference T, while lower speeds increase the difference T. However, this relationship is not linear. The N1 to N10 and T1 to T10 values ​​are fitted to a polynomial: T = aN2 + bN + c. Here, a, b, and c are constants. The actual ambient temperature can be manually measured.

[0057] Furthermore, the presence of an optical module is determined by comparing the temperature information collected by temperature sensors A and B. When there is no optical module, the ambient temperature is equal to the value of temperature sensor A. When there is an optical module, the ambient temperature is equal to the value of temperature sensor B minus the difference T.

[0058] Furthermore, the system fan is controlled based on the ambient temperature of the target switch device so that the ambient temperature of the target switch device meets the safety condition.

[0059] Specifically, you can set an ambient temperature safety threshold. When the ambient temperature is detected to be above the safety threshold, the system fan speed can be adjusted and accelerated to achieve the purpose of cooling, ensuring safe system operation and avoiding abnormalities caused by excessive temperatures. When the system fan speed reaches the maximum, an early warning can be issued or other cooling devices can be introduced.

[0060] The embodiment of the present invention provides a method for monitoring the ambient temperature of a switch device, which obtains temperature information collected by two temperature sensors installed on the PCB board of the target switch device; determines whether an optical module is inserted into the target switch device based on the temperature information; determines a strategy for determining the ambient temperature based on the judgment result; and calculates the ambient temperature of the target switch device using the temperature information based on the judgment strategy. Compared with the existing technology, it is impossible to accurately monitor the ambient temperature of the switch by placing temperature sensors in high-power and high-density port layouts. According to this method, the ambient temperature can be calculated based on the temperature of the air inlet and outlet through the relationship between the ambient information and the temperature of the air inlet and outlet of the PCB board, thereby realizing ambient temperature monitoring of devices with high power consumption and high-density port layouts.

[0061] Figure 2 A flow chart of another method for monitoring the ambient temperature of a switch device provided by an embodiment of the present invention is shown as follows: Figure 2 As shown, the method specifically includes:

[0062] S21. Acquire first temperature information collected by the first temperature sensor and second temperature information collected by the second temperature sensor.

[0063] S22: If the first temperature information is greater than the second temperature information, determine that an optical module is inserted into the target switch device.

[0064] like Figure 3 The following is a schematic diagram of the switch structure: 1. Optical module, 2. PCB, 3. Temperature sensor A, 4. Temperature sensor B, 5. System fan and power module. The front panel of the switch houses the optical module port, and the rear panel houses the system fan and power module. Airflow is front-to-back. Two temperature sensors are located on the PCB: sensor A, located on the left side of the PCB, within 1 cm of the optical module; and sensor B, located on the right side, approximately 1 cm from the edge. Sensor B is free of high-power, heat-generating components, and there is no copper padding near the bottom of sensor B to prevent heat transfer from the board and a significant temperature rise. When an optical module is installed in a front-panel port, the high power consumption of the optical module heats the nearby board, which in turn heats sensor A. This causes the temperature of sensor A to be significantly higher than that of sensor B, with the following relationship: sensor A > sensor B > ambient temperature. When no optical module is installed in the front-panel port, the temperature follows the following relationship: sensor B > sensor A ≈ ambient temperature.

[0065] Furthermore, two temperature sensors are communicatively connected to the processing system, and temperature sensor A (first temperature sensor) and temperature sensor B (second temperature sensor) are used to collect temperature information (first temperature information and second temperature information) of the external environment of the target switch device in its current state. The collected first temperature information and second temperature information can be directly sent to the processing system.

[0066] It is determined whether the first temperature information is greater than the second temperature information. If so, it is determined that an optical module is inserted into the target switch device.

[0067] S23: Determine the judgment strategy as making a judgment based on the second temperature information and a preset fitting difference value.

[0068] In the embodiment of the present invention, firstly, a mathematical model may be established according to the above-mentioned rule to calculate the external environment temperature information when the target switch device is plugged with an optical module.

[0069] Specifically, temperature information corresponding to the first temperature sensor and the second temperature sensor is obtained at different system fan speeds; a second difference between the temperature information and the actual ambient temperature is obtained; and a polynomial fit is performed based on the second difference and the fan speed to obtain a fitted relationship between the second difference and the fan speed. The actual ambient temperature can be obtained by manual measurement.

[0070] For example, with 10% as the initial fan speed, and increasing it by 10%, the corresponding temperature sensor values ​​at different fan speeds are measured. That is, speeds N1 to N10 correspond to TB_1 to TB_10, respectively. This is shown in Table 1:

[0071] Table 1

[0072]

[0073] The difference between TB_1~TB_10 and the actual external ambient temperature (second difference) is set to T1~T10 respectively. The higher the speed, the smaller the difference T, and the lower the speed, the larger the difference T, but it is not a linear relationship, such as Figure 4 The figure shows the relationship between the second difference and the fan speed. The values ​​N1 to N10 and T1 to T10 are fitted into a polynomial, namely, T = aN2 + bN + c. Here, a, b, and c are constants.

[0074] S24. Get the current system fan speed.

[0075] S25. Determine a current fitting difference based on the fan speed.

[0076] In the embodiment of the present invention, the current system fan speed can be directly obtained according to the setting gear of the fan, and the current system fan speed is substituted into the fitting polynomial to obtain the current fitting difference.

[0077] S26: Use a first difference between the second temperature information and the current fitting difference as the ambient temperature of the target switch device.

[0078] When it is determined that an optical module is inserted into the target switch device, a first difference between the second temperature information and the current fitting difference value is used as the ambient temperature of the target switch device.

[0079] S27: If the first temperature information is less than the second temperature information, determine that no optical module is inserted into the target switch device.

[0080] S28: Determine that the judgment strategy is to make a judgment based on the first temperature information.

[0081] S29: Use the first temperature information as the ambient temperature of the target switch device.

[0082] If the first temperature information is less than the second temperature information, it is determined that no optical module is inserted into the target switch device. According to the above rule, the first temperature information is used as the ambient temperature of the target switch device. That is, the first temperature information collected by temperature sensor A is the ambient temperature of the target switch device.

[0083] Furthermore, the system fan is controlled based on the ambient temperature of the target switch device so that the ambient temperature of the target switch device meets the safety condition.

[0084] Specifically, you can set an ambient temperature safety threshold. When the ambient temperature is detected to be above the safety threshold, the system fan speed can be adjusted and accelerated to achieve the purpose of cooling, ensuring safe system operation and avoiding abnormalities caused by excessive temperatures. When the system fan speed reaches the maximum, an early warning can be issued or other cooling devices can be introduced.

[0085] The method for monitoring the ambient temperature of a switch device provided in an embodiment of the present invention obtains temperature information collected by two temperature sensors disposed on a PCB board of a target switch device; determines whether an optical module is plugged into the target switch device based on the temperature information; determines an ambient temperature determination strategy based on the determination result; and calculates the ambient temperature of the target switch device using the temperature information based on the determination strategy. This method, based on the relationship between the ambient information and the temperature of the PCB board's air inlet and outlet, can calculate the ambient temperature based on the air inlet and outlet temperatures, thereby enabling ambient temperature monitoring for devices with high power consumption and high-density port layouts. Furthermore, the system fan speed is promptly adjusted based on the ambient temperature monitoring results to avoid system abnormalities caused by excessive temperatures.

[0086] Figure 5 A schematic diagram of the structure of an ambient temperature monitoring device for a switch device provided in an embodiment of the present invention specifically includes:

[0087] An acquisition module 501 is configured to acquire temperature information collected by two temperature sensors disposed on a PCB of a target switch device;

[0088] A judgment module 502 is configured to judge whether an optical module is inserted into the target switch device based on the temperature information;

[0089] A judgment module 502 is used to determine a judgment strategy for the ambient temperature based on the judgment result;

[0090] The calculation module 504 is configured to calculate the ambient temperature of the target switch device using the temperature information based on the determination strategy.

[0091] In one possible embodiment, the acquisition module 501 is specifically used to obtain temperature information corresponding to the first temperature sensor and the second temperature sensor respectively at different system fan speeds; obtain a second difference between the temperature information and the actual ambient temperature; and perform polynomial fitting based on the second difference and the fan speed to obtain a fitting relationship between the second difference and the fan speed.

[0092] In one possible embodiment, the judgment module 502 is specifically configured to: set a first temperature sensor at the air inlet of the PCB board, and set a second temperature sensor at the air outlet of the PCB board; obtain first temperature information collected by the first temperature sensor and second temperature information collected by the second temperature sensor; if the first temperature information is greater than the second temperature information, determine that an optical module is inserted into the target switch device; if the first temperature information is less than the second temperature information, determine that no optical module is inserted into the target switch device.

[0093] In one possible implementation, the judgment module 502 is further configured to, if it is determined that an optical module is inserted into the target switch device, determine that the judgment strategy is based on the second temperature information and a preset fitting difference value; and, if it is determined that no optical module is inserted into the target switch device, determine that the judgment strategy is based on the first temperature information.

[0094] In one possible embodiment, the calculation module 504 is specifically used to obtain the current system fan speed if it is determined that the judgment strategy is based on the second temperature information and a preset fitting difference; determine the current fitting difference based on the fan speed; and use the first difference between the second temperature information and the current fitting difference as the ambient temperature of the target switch device.

[0095] In a possible implementation manner, the calculation module 504 is further configured to use the first temperature information as the ambient temperature of the target switch device if it is determined that the judgment strategy is to make a judgment based on the first temperature information.

[0096] In a possible implementation, the apparatus for monitoring the ambient temperature of a switch device further includes a control module configured to control a system fan based on the ambient temperature of the target switch device so that the ambient temperature of the target switch device meets a safety condition.

[0097] The ambient temperature monitoring device for the switch device provided in this embodiment can be as follows Figure 5 The ambient temperature monitoring device of the switch device shown in FIG can perform the following operations: Figure 1-2 All steps of the ambient temperature monitoring method of the switch equipment in the Figure 1-2 For details on the technical effects of the ambient temperature monitoring method for switch equipment, please refer to Figure 1-2 For the sake of brevity, the relevant description will not be repeated here.

[0098] Figure 6 A schematic diagram of the structure of an electronic device provided by an embodiment of the present invention is provided. Figure 6The electronic device 600 shown includes: at least one processor 601, a memory 602, at least one network interface 604 and another user interface 603. The various components in the electronic device 600 are coupled together via a bus system 605. It is understood that the bus system 605 is used to achieve connection and communication between these components. In addition to including a data bus, the bus system 605 also includes a power bus, a control bus, and a status signal bus. However, for the sake of clarity, the bus system 605 is not shown in FIG. Figure 6 Various buses are labeled as bus system 605.

[0099] The user interface 603 may include a display, a keyboard, or a pointing device (eg, a mouse, a trackball, a touchpad, or a touch screen).

[0100] It is understood that the memory 602 in the embodiment of the present invention can be a volatile memory or a non-volatile memory, or can include both volatile and non-volatile memories. Among them, the non-volatile memory can be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or a flash memory. The volatile memory can be a random access memory (RAM), which is used as an external cache. By way of example and not limitation, many forms of RAM are available, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate synchronous DRAM (DDRSDRAM), enhanced synchronous DRAM (ESDRAM), synchronous link DRAM (SLDRAM), and direct RAM bus random access memory (DRRAM). The memory 602 described herein is intended to include, but is not limited to, these and any other suitable types of memory.

[0101] In some embodiments, the memory 602 stores the following elements, executable units, or data structures, or a subset thereof, or an extended set thereof: an operating system 6021 and application programs 6022 .

[0102] The operating system 6021 includes various system programs, such as a framework layer, a core library layer, and a driver layer, for implementing various basic services and handling hardware-based tasks. Application programs 6022 include various application programs, such as a media player and a browser, for implementing various application services. Programs implementing the methods of the embodiments of the present invention may be included in application programs 6022.

[0103] In an embodiment of the present invention, by calling a program or instruction stored in the memory 602, specifically, a program or instruction stored in the application 6022, the processor 601 is configured to execute the method steps provided in each method embodiment, for example, including:

[0104] Acquire temperature information collected by two temperature sensors disposed on a PCB board of a target switch device; determine whether an optical module is plugged into the target switch device based on the temperature information; determine a strategy for determining the ambient temperature based on the determination result; and calculate the ambient temperature of the target switch device using the temperature information based on the determination strategy.

[0105] In one possible embodiment, a first temperature sensor is arranged at the air inlet of the PCB board, and a second temperature sensor is arranged at the air outlet of the PCB board; first temperature information collected by the first temperature sensor and second temperature information collected by the second temperature sensor are obtained; if the first temperature information is greater than the second temperature information, it is determined that an optical module is inserted in the target switch device; if the first temperature information is less than the second temperature information, it is determined that no optical module is inserted in the target switch device.

[0106] In one possible implementation, if it is determined that an optical module is inserted into the target switch device, the judgment strategy is determined to be based on the second temperature information and a preset fitting difference value; if it is determined that no optical module is inserted into the target switch device, the judgment strategy is determined to be based on the first temperature information.

[0107] In one possible embodiment, if it is determined that the judgment strategy is to make a judgment based on the second temperature information and a preset fitting difference, the current system fan speed is obtained; the current fitting difference is determined based on the fan speed; and the first difference between the second temperature information and the current fitting difference is used as the ambient temperature of the target switch device.

[0108] In a possible implementation, if it is determined that the judgment strategy is to make a judgment based on the first temperature information, the first temperature information is used as the ambient temperature of the target switch device.

[0109] In a possible implementation, a system fan is controlled based on the ambient temperature of the target switch device so that the ambient temperature of the target switch device meets a safety condition.

[0110] In one possible implementation, temperature information corresponding to the first temperature sensor and the second temperature sensor is obtained at different system fan speeds; a second difference between the temperature information and the actual ambient temperature is obtained; and a polynomial fitting is performed based on the second difference and the fan speed to obtain a fitting relationship between the second difference and the fan speed.

[0111] The methods disclosed in the above embodiments of the present invention can be applied to or implemented by processor 601. Processor 601 may be an integrated circuit chip with signal processing capabilities. During implementation, each step of the above method can be completed by hardware integrated logic circuits in processor 601 or by software instructions. The above processor 601 may be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. The methods, steps, and logic block diagrams disclosed in the embodiments of the present invention can be implemented or executed. The general-purpose processor may be a microprocessor or any conventional processor. The steps of the methods disclosed in conjunction with the embodiments of the present invention can be directly implemented and executed by a hardware decoding processor, or by a combination of hardware and software units in the decoding processor. The software units can be located in storage media well-known in the art, such as random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, registers, etc. The storage medium is located in the memory 602 , and the processor 601 reads the information in the memory 602 and completes the steps of the above method in combination with its hardware.

[0112] It is understood that the embodiments described herein may be implemented using hardware, software, firmware, middleware, microcode, or a combination thereof. For hardware implementation, the processing unit may be implemented in one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), general-purpose processors, controllers, microcontrollers, microprocessors, other electronic units for performing the functions described herein, or a combination thereof.

[0113] For software implementation, the technology described herein can be implemented by a unit that performs the functions described herein. The software code can be stored in a memory and executed by a processor. The memory can be implemented in the processor or outside the processor.

[0114] The electronic device provided in this embodiment may be Figure 6 The electronic device shown in FIG. 1 can perform the following operations: Figure 1-2 All steps of the ambient temperature monitoring method of the switch equipment in the Figure 1-2 For details on the technical effects of the ambient temperature monitoring method for switch equipment, please refer to Figure 1-2 For the sake of brevity, the relevant description will not be repeated here.

[0115] Embodiments of the present invention also provide a storage medium (computer-readable storage medium). The storage medium stores one or more programs. The storage medium may include volatile memory, such as random access memory; the memory may also include non-volatile memory, such as read-only memory, flash memory, a hard disk, or a solid-state drive; or a combination of the aforementioned types of memory.

[0116] When one or more programs in the storage medium can be executed by one or more processors, the above-mentioned method for monitoring the ambient temperature of the switch device executed on the electronic device side is implemented.

[0117] The processor is configured to execute an ambient temperature monitoring program of a switch device stored in a memory to implement the following steps of an ambient temperature monitoring method of a switch device executed on an electronic device side:

[0118] Acquire temperature information collected by two temperature sensors disposed on a PCB board of a target switch device; determine whether an optical module is plugged into the target switch device based on the temperature information; determine a strategy for determining the ambient temperature based on the determination result; and calculate the ambient temperature of the target switch device using the temperature information based on the determination strategy.

[0119] In one possible embodiment, a first temperature sensor is arranged at the air inlet of the PCB board, and a second temperature sensor is arranged at the air outlet of the PCB board; first temperature information collected by the first temperature sensor and second temperature information collected by the second temperature sensor are obtained; if the first temperature information is greater than the second temperature information, it is determined that an optical module is inserted in the target switch device; if the first temperature information is less than the second temperature information, it is determined that no optical module is inserted in the target switch device.

[0120] In one possible implementation, if it is determined that an optical module is inserted into the target switch device, the judgment strategy is determined to be based on the second temperature information and a preset fitting difference value; if it is determined that no optical module is inserted into the target switch device, the judgment strategy is determined to be based on the first temperature information.

[0121] In one possible embodiment, if it is determined that the judgment strategy is to make a judgment based on the second temperature information and a preset fitting difference, the current system fan speed is obtained; the current fitting difference is determined based on the fan speed; and the first difference between the second temperature information and the current fitting difference is used as the ambient temperature of the target switch device.

[0122] In a possible implementation, if it is determined that the judgment strategy is to make a judgment based on the first temperature information, the first temperature information is used as the ambient temperature of the target switch device.

[0123] In a possible implementation, a system fan is controlled based on the ambient temperature of the target switch device so that the ambient temperature of the target switch device meets a safety condition.

[0124] In one possible implementation, temperature information corresponding to the first temperature sensor and the second temperature sensor is obtained at different system fan speeds; a second difference between the temperature information and the actual ambient temperature is obtained; and a polynomial fitting is performed based on the second difference and the fan speed to obtain a fitting relationship between the second difference and the fan speed.

[0125] Professionals should also be further aware that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the components and steps of each example according to their functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0126] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein may be implemented using hardware, a software module executed by a processor, or a combination of the two. The software module may be placed in random access memory (RAM), internal memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.

[0127] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A method for monitoring the ambient temperature of a switch device, characterized in that: include: Acquire temperature information collected by two temperature sensors disposed on a PCB board of a target switch device, wherein the first temperature sensor is disposed at an air inlet of the PCB board, and the second temperature sensor is disposed at an air outlet of the PCB board. The target switch device has an optical module port disposed on a front panel, the air inlet is located on one side of the front panel, no high-power heating devices are disposed on the side of the second temperature sensor, and the bottom of the second temperature sensor has no copper cladding. determining whether an optical module is installed on the target switch device based on the temperature information, wherein if the first temperature information collected by the first temperature sensor is greater than the second temperature information collected by the second temperature sensor, determining that the optical module is installed on the target switch device; and if the first temperature information is less than the second temperature information, determining that the optical module is not installed on the target switch device; Determine a determination strategy for the ambient temperature based on the determination result; The ambient temperature of the target switch device is calculated using the temperature information based on the determination strategy.

2. The method according to claim 1, characterized in that The determination strategy for determining the ambient temperature based on the judgment result includes: If it is determined that an optical module is inserted into the target switch device, determining that the judgment strategy is to make a judgment based on the second temperature information and a preset fitting difference value; If it is determined that no optical module is inserted into the target switch device, the judgment strategy is determined to be based on the first temperature information.

3. The method according to claim 2, characterized in that The calculating the ambient temperature of the target switch device by using the temperature information based on the determination strategy includes: If it is determined that the judgment strategy is to make a judgment based on the second temperature information and a preset fitting difference value, then obtaining the current system fan speed; determining a current fitting difference based on the fan speed; A first difference between the second temperature information and the current fitting difference is used as the ambient temperature of the target switch device.

4. The method according to claim 2, characterized in that The calculating the ambient temperature of the target switch device by using the temperature information based on the determination strategy includes: If it is determined that the judgment strategy is to make a judgment based on the first temperature information, the first temperature information is used as the ambient temperature of the target switch device.

5. The method according to any one of claims 1 to 4, characterized in that The method further comprises: The system fan is controlled based on the ambient temperature of the target switch device so that the ambient temperature of the target switch device meets a safety condition.

6. The method according to claim 1, characterized in that The method further comprises: Acquire temperature information corresponding to the first temperature sensor and the second temperature sensor respectively at different system fan speeds; Acquire a second difference between the temperature information and the actual ambient temperature; A polynomial fitting is performed based on the second difference and the fan speed to obtain a fitting relationship between the second difference and the fan speed.

7. An environmental temperature monitoring device for a switch device, characterized in that: include: An acquisition module is configured to acquire temperature information collected by two temperature sensors disposed on a PCB board of a target switch device, wherein the first temperature sensor is disposed at an air inlet of the PCB board, and the second temperature sensor is disposed at an air outlet of the PCB board. The front panel of the target switch device is provided with an optical module port, the air inlet is located on one side of the front panel, no high-power heating device is disposed on the side of the second temperature sensor, and the bottom of the second temperature sensor is designed without copper plating. a determination module, configured to determine whether an optical module is installed on the target switch device based on the temperature information, wherein if the first temperature information collected by the first temperature sensor is greater than the second temperature information collected by the second temperature sensor, it is determined that the optical module is installed on the target switch device; and if the first temperature information is less than the second temperature information, it is determined that the optical module is not installed on the target switch device; A judgment module, used to determine a judgment strategy for the ambient temperature based on the judgment result; A calculation module is configured to calculate the ambient temperature of the target switch device using the temperature information based on the determination strategy.

8. An electronic device, characterized in that: include: A processor and a memory, wherein the processor is configured to execute an ambient temperature monitoring program of a switch device stored in the memory, so as to implement the ambient temperature monitoring method of a switch device according to any one of claims 1 to 6.

9. A storage medium, characterized in that: The storage medium stores one or more programs, and the one or more programs can be executed by one or more processors to implement the method for monitoring the ambient temperature of a switch device according to any one of claims 1 to 6.

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