Wax coating apparatus for wafer mounting and related wafer mounting apparatus

Abstract

A wax coating apparatus for wafer mounting and a related wafer mounting apparatus, the wax coating apparatus for wafer mounting of an embodiment includes a vacuum chuck in which a vacuum flow channel that provides a vacuum pressure is embedded, a heating disc that is mounted on an upper side portion of the vacuum chuck and has a hole and a recess that are connected to the vacuum flow channel of the vacuum chuck to adsorb a block portion to which a wafer is adhered, a rotation shaft that is connected to a lower side portion of the vacuum chuck, a driving motor for rotating the rotation shaft, and a wax nozzle that is arranged to be spaced apart from the upper side portion of the vacuum chuck, wherein the heating disc can be operated to heat the block portion when the wax nozzle sprays wax onto the block portion.

Description

Technical Field

[0001] This disclosure relates to a wax coating apparatus for wafer mounting that can simplify the process, and wafer mounting apparatus including the wax coating apparatus. Background Technology

[0002] Typically, wafers are manufactured through a polishing process, in which a single crystal ingot is sliced ​​into thin slices, and then the surface of the wafer is planarized and mirror-finished.

[0003] Typically, polishing processes can polish both sides of a wafer simultaneously or only one side of the wafer. Wax adhesion is mainly used to polish one side of the wafer. In wax adhesion, the wafer is adhered to the ceramic block using wax.

[0004] Specifically, in wafer mounting equipment, one side of the wafer is adhered to a ceramic block using wax, and the wafer polishing equipment polishes the other side of the wafer using polishing pads. Because the wax-adhesion polishing method offers superior wafer processing quality, it is widely used.

[0005] Figure 1 This is a schematic view of a device used to polish one surface of a wafer.

[0006] As in Figure 1 The diagram shows a wafer polishing apparatus for polishing one surface of a wafer, comprising: a polishing head 10 on which the wafer W to be polished is mounted and rotatably mounted; a disk 30 on which a polishing pad 20 for polishing the wafer W is adhered below the polishing head 10; a surface disk 40 that rotates together with the disk 30; and a slurry supply nozzle 50 that supplies slurry between the surface of the wafer W and the polishing pad 20, the slurry being supplied from a separate slurry reservoir.

[0007] The wafer W is adhered to the block portion 11 by using an adhesive such as wax, and the block portion 11 is mounted on the polishing head 10.

[0008] When the wafer W is mounted on the polishing head 10, and when the polishing head 10 and the polishing disk 40 rotate with the wafer W and the polishing pad 10 in contact with each other, the wafer W is polished by the polishing pad 20.

[0009] In the prior art, the process of attaching a wafer to a block is as follows.

[0010] When the block is loaded into the wax coating unit, after wax is sprayed onto the block from the wax coating unit, the block is immediately rotated while wax is being applied, and the block is moved from the wax coating unit to the wax heating unit. The block is then heated in the wax heating unit to increase the adhesion of the applied wax to the block. Subsequently, when the block is moved from the wax heating unit to the wafer adhesion unit, the wafer is loaded into the wafer adhesion unit, and the wafer is adhered to the wax-coated surface of the block in the wafer adhesion unit.

[0011] However, according to the existing technology, since the process of moving the block after applying wax and the process of heating the block are performed separately, there are problems of increased processing time and reduced productivity. Summary of the Invention

[0012] Technical issues

[0013] This disclosure is made to address the problems of the prior art and is intended to provide a wax coating apparatus for wafer mounting and a wafer mounting apparatus including the wax coating apparatus, which can simplify the process.

[0014] Technical solution

[0015] An embodiment of a wax coating apparatus for wafer mounting includes: a vacuum chuck with a vacuum channel for providing vacuum pressure embedded in it; a heating plate mounted on the upper side of the vacuum chuck and having holes and grooves connected to the vacuum channel of the vacuum chuck to adsorb a block portion onto which the wafer is adhered; a rotating shaft connected to the lower side of the vacuum chuck; a drive motor for rotating the rotating shaft; and a wax nozzle arranged spaced apart from the upper side of the vacuum chuck, wherein the heating plate can be operated to heat the block portion as the wax nozzle sprays wax onto it.

[0016] While the wax nozzle sprays wax onto the block, the drive motor can rotate the vacuum suction cup via the rotating shaft, and the heating plate can be operated in combination with at least one of the drive motor and the wax nozzle.

[0017] The heating plate can be mounted on the upper side of the vacuum suction cup by multiple fastening components, which are arranged at predetermined intervals in the circumferential direction.

[0018] The heating plate can be composed of a disc-shaped part, the diameter of which is smaller than the diameter of the block part and larger than the radius of the block part.

[0019] The heating plate may include an upper plate and a heater, the upper plate being made of metal and the heater being attached to the underside of the upper plate.

[0020] The upper plate may include: a central hole at the center of the upper plate, the central hole communicating with the vacuum channel of the vacuum chuck, a pair of linear grooves that intersect each other based on the central hole, and an annular groove that connects the two ends of the linear grooves to each other.

[0021] The wafer mounting apparatus of the embodiment may include: a block loading unit that provides a block; a wafer loading unit that provides a wafer; a wax coating unit that heats the block and simultaneously coats it with wax from the block provided by the block loading unit; and a wafer adhesion unit that adheres the wafer to the wax-coated surface of the block, wherein the wafer is provided by the wafer loading unit and the block is provided by the wax coating unit.

[0022] Beneficial effects

[0023] According to the embodiment, the wax coating apparatus for wafer mounting and the wafer mounting apparatus including the wax coating apparatus have a heating plate arranged in a vacuum chuck, so that wax coating and heating of the block can be performed simultaneously.

[0024] Therefore, there are the following advantages: simplifying the process can reduce process time and increase productivity. Attached Figure Description

[0025] Figure 1 This is a schematic view of an apparatus used to polish one surface of a wafer;

[0026] Figure 2 This is a schematic plan view of an apparatus for mounting wafers according to an embodiment;

[0027] Figure 3 This is a side cross-sectional view showing a wax coating apparatus for wafer mounting according to an embodiment;

[0028] Figure 4 It shows that it is applied to Figure 3 A plan view of the heating plate and vacuum suction cup; and

[0029] Figure 5 This is a flowchart illustrating a method for mounting a wafer according to an embodiment. Detailed Implementation

[0030] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0031] Figure 2 This is a schematic plan view of a device for mounting wafers according to an embodiment.

[0032] As in Figure 2As shown in the figure, the device for mounting wafers in this embodiment includes: a block loading unit 1 for providing a block; a wafer loading unit 2 for providing a wafer and heating the block while applying wax to it; a wax coating unit 100 for cleaning; a wafer adhesion unit 3 for adhering the wafer to the wax-coated block; a cleaning unit 4 for cleaning the wafer adhered to the block immediately after polishing; and a removal unit 5 for removing the cleaned wafer from the block.

[0033] Block loading unit 1 may include block box 1a and block moving robot 1b. The block is housed in the block box, and the block moving robot transfers block B from block box 1a to wax coating unit 100, but the embodiment is not limited thereto. Block moving robot 1b is positioned at the center of each of units 1, 2, 100, 3, 4, and 5, and can transfer the block between each of units 1, 2, 100, 3, 4, and 5.

[0034] The wafer loading unit 2 may include a wafer cassette 2a and a wafer moving robot 2b, in which the wafer is housed. The wafer moving robot transfers the wafer from the wafer cassette 2a to the wafer adhesion unit 3, but the embodiments are not limited thereto. The wafer moving robot 2b may provide the wafer to the wafer adhesion unit 3 by flipping the wafer.

[0035] The wax coating unit 100 can be configured to spray wax onto the block B, rotate the block to distribute the wax evenly over the entire block, and then heat the block to increase the adhesion of the wax. The wax coating unit 100 is configured to apply wax to the block while simultaneously heating the wax, which will be described in detail below.

[0036] The wafer adhesion unit 3 can adhere a wafer provided from the wafer loading unit 2 to a wax-coated surface of the block portion. The wax is provided from the wax coating unit 100. The detailed structure of the wafer adhesion unit will be omitted.

[0037] The wafers adhered to the block in the wafer adhesion unit 3 are transferred to a separate polishing device (not shown), and then the block is mounted on the polishing head and the polishing process is performed, so that the surface of the wafer is in close contact with the polishing pad while rotating.

[0038] The cleaning unit 4 can clean the wafers that have been polished and adhered to block B. The cleaning unit can consist of nozzles or similar objects and an overflow water tank, but the embodiments are not limited thereto.

[0039] The removal unit 5 separates the wafers provided by the cleaning unit 4 from the block portion B, and may include a wafer cassette 5a and a pair of blades 5b. The wafer cassette contains the polished wafers, and the pair of blades separates the wafers from the block portion B, but the embodiments are not limited thereto.

[0040] Figure 3 This is a side cross-sectional view showing a wax coating apparatus for wafer mounting according to an embodiment.

[0041] As in Figure 3 As shown, the wax coating unit 100 of this embodiment may include: a vacuum suction cup 110 for adsorbing block B; a heating plate 120 mounted on the upper side of the vacuum suction cup 110 to simultaneously support and heat block B; a rotating shaft 130 connected to the lower side of the vacuum suction cup 110; a drive motor 140 providing rotational force to the rotating shaft 130; and a wax nozzle 150 for spraying wax onto block B.

[0042] The vacuum chuck 110 can be arranged to fix and support the position of block B by providing vacuum pressure. The vacuum chuck 110 may have an embedded vacuum channel 111 perpendicular to the center of the vacuum chuck, and the vacuum channel 111 may be supplied with vacuum pressure by an external pump or the like.

[0043] The heating plate 120 can be mounted on the upper side of the vacuum suction cup 110 and can be arranged to simultaneously support and heat the block B. The heating plate 120 can be configured as a heater with an embedded heating wire and can be provided with holes and grooves connected to the vacuum flow channel 111 of the vacuum suction cup 110 to adsorb the block B, as will be described in detail below.

[0044] The rotating shaft 130 is rotatably mounted at the lower center of the vacuum suction cup 110. The upper end of the rotating shaft 130 is connected to the lower part of the vacuum suction cup 110, and the lower end of the rotating shaft 130 can be supported by the rotary joint 131.

[0045] The drive motor 140 provides rotational force, and the first pulley 141, the second pulley 142, and the belt 143 connecting the first pulley and the second pulley can be arranged to transmit the rotational force of the drive motor 140 to the rotating shaft. When the drive motor 140 is running, the vacuum suction cup 110 and the heating plate 120 connected to the rotating shaft 130 can rotate together.

[0046] The wax nozzle 150 can be arranged spaced apart from the upper part of the vacuum chuck 110 and can spray wax onto the block B, which is then adsorbed onto the vacuum chuck 110 and the heating plate 120. The wax is an adhesive used to adhere the wafer to the block B and has the characteristic that its adhesion increases with increasing temperature.

[0047] The heating plate 120, drive motor 140, and wax nozzle 150 can operate in combination with each other. For example, when the wax nozzle 150 sprays wax onto block B, and the drive motor 140 operates to rotate the vacuum suction cup 110 and the heating plate 120, the wax on block B can be evenly coated onto the entire surface of block B by centrifugal force.

[0048] As described above, when wax is applied to block B while the heating plate 120 is running, the heating plate 120 can heat block B to increase the temperature of the wax applied to block B. Therefore, wax application and heating can be performed simultaneously to simplify the process.

[0049] Figure 4 It shows that it is applied to Figure 3 A plan view of the heating plate and vacuum suction cup.

[0050] As in Figure 4 As shown, the heating plate 120 according to this embodiment can be mounted on the upper side of the vacuum suction cup 110, and can include an upper plate and a heater. The upper plate is made of a metal with high heat transfer efficiency, and the heater is embedded in the lower side of the upper plate.

[0051] The diameter of the heating plate 120 is smaller than the diameter of the block portion, but preferably the heating plate 120 has a disc shape with a diameter larger than the radius of the block portion to quickly heat the block portion.

[0052] In order to transmit the vacuum pressure of the vacuum suction cup 110, the upper plate of the heating plate 120 may be provided with holes 121 and grooves 122a for transmitting the vacuum pressure.

[0053] According to this embodiment, the heating plate 120 may be arranged with a central hole 121, which is located at the center of the upper plate to interact with the vacuum channel 111 of the vacuum chuck 110. Figure 3 (As shown in the diagram) a pair of linear grooves 122a and 122b, which are orthogonal to each other based on the central hole 121; and an annular groove 123 connecting the ends of the linear grooves 122a and 122b to each other. Preferably, the diameter of the central hole 121 is formed to be the largest, and the linear grooves 122a and 122b and the annular groove 123 are formed as thin slits smaller than the diameter of the central hole 121.

[0054] As described above, since the central hole 121, linear grooves 122a and 122b, and annular groove 123 of the heating plate 120 are interconnected, a vacuum pressure can be provided over the entire upper plate of the heating plate 120.

[0055] The heating plate 120 may be located in a mounting hole (not shown) arranged at the center of the vacuum suction cup 110, and preferably, the heating plate 120 is secured by a plurality of fastening members 125a, 125b, 125c, 126a and 126b to rotate integrally with the vacuum suction cup 110.

[0056] Three upper fastening members 125a, 125b, and 125c arranged at predetermined intervals in the circumferential direction can fix the upper surface of the heating plate 120 to the upper surface of the vacuum suction cup 110 on the upper side, and two side fastening members 126a and 126b can fix the side surface of the heating plate 120 to the side surface of the vacuum suction cup 110, but the embodiment is not limited to this.

[0057] Figure 5 This is a flowchart illustrating a method for mounting a wafer according to an embodiment.

[0058] Reference Figures 3 to 5 In the wafer mounting method according to this embodiment, the block portion is loaded into the wax coating unit 100 (see S1).

[0059] When the block mobile robot 1b arranges the block B, which is contained in the block box 1a, on the vacuum suction cup 110 and the heating plate 120, the vacuum flow channel 111 of the vacuum suction cup 110 provides vacuum pressure on the upper part of the heating plate 120, and the block B can be fixed to the heating plate 120 by the vacuum pressure.

[0060] Next, wax is applied to block B in wax coating unit 100 while block B is heated (see S2).

[0061] When the wax nozzle 150 sprays wax onto the block B adsorbed on the heating plate 120, the drive motor 140 runs to rotate the vacuum suction cup 110 and the heating plate 120. The wax is evenly coated onto the entire block B by centrifugal force, and the heating plate 120 runs to heat the block B, thereby increasing the adhesion by raising the temperature of the wax coated onto the block B.

[0062] Even if block B does not move, wax is applied to block B by wax coating unit 100, and block B is heated at the same time, thereby simplifying the process and reducing production time to improve productivity.

[0063] Next, the wafer is adhered to the wax-coated surface of block B (see S3).

[0064] When the block portion B coated with wax in the wax coating unit 100 is provided to the wafer adhesion unit 3, the wafer is flipped in the wafer loading unit 1 and provided to the wafer adhesion unit 3, so that the wafer can be adhered to a wax-coated surface of the block portion B.

[0065] Next, the wafer adhered to block B is polished (see S4).

[0066] When the wafer to be adhered to the block in the wafer adhesion unit 3 is arranged to a separate polishing device (not shown), the block B is mounted on the polishing head, and the polishing process is performed while the surface of the wafer is rotated in close contact with the polishing pad.

[0067] Next, the polished wafer is cleaned while it is being adhered to block B, and then the polished wafer is removed from block B (see S5 and S6).

[0068] When the wafer to be polished in the polishing equipment is provided to the cleaning unit 4, the polished wafer is cleaned while being adhered to block B.

[0069] When the block B to which the wafer to be cleaned in cleaning unit 4 is attached is provided to removal unit 5, blade 5b separates the polished wafer from block B, followed by a separate wafer cassette 5a. Block B, from which the wafer is separated, can be reused through a separate cleaning process.

[0070] The above description is merely an example of the technical spirit of the present invention. Various modifications and changes can be made by those skilled in the art to which this invention pertains without departing from the basic characteristics of the present invention.

[0071] Therefore, the embodiments disclosed in this invention are not intended to limit the technical spirit of the invention, but are intended to be described, and the spirit and scope of the invention are not limited by such embodiments.

[0072] The scope of protection of this invention shall be interpreted by the appended claims, and all technical spirit within the equivalent scope of the appended claims shall be interpreted as being included within the scope of the claims of this invention.

[0073] Explanation of reference numerals in the attached figures

[0074] 100: Wax coating unit; 110: Vacuum suction cup

[0075] 120: Heating plate; 130: Rotating shaft

[0076] 140: Drive motor; 150: Wax nozzle

Claims

1. A wax coating apparatus for wafer mounting, the wax coating apparatus comprising: A vacuum suction cup, in which a vacuum channel providing vacuum pressure is embedded; A heating plate is mounted on the upper side of the vacuum chuck and has holes and grooves connected to the vacuum channel of the vacuum chuck to adsorb the block portion, and the wafer is adhered to the block portion. A rotating shaft is connected to the lower side of the vacuum suction cup; A drive motor, the drive motor being used to rotate the rotating shaft; as well as A wax nozzle, the wax nozzle being arranged spaced apart from the upper side of the vacuum suction cup. The heating plate includes a central hole at its center, the central hole being connected to the vacuum channel of the vacuum suction cup. A pair of linear grooves, the pair of linear grooves intersecting each other based on the central hole, and An annular groove connects the two ends of the linear groove to each other. The heating plate is configured to heat the block portion when the wax nozzle sprays wax onto the block portion.

2. The wax coating equipment according to claim 1, wherein, As the wax nozzle sprays the wax onto the block, the drive motor rotates the vacuum suction cup via the rotating shaft, and The heating plate is operated in combination with at least one of the drive motor and the wax nozzle.

3. The wax coating equipment according to claim 1, wherein, The heating plate is mounted on the upper side of the vacuum suction cup by a plurality of fastening components, which are arranged at predetermined intervals in the circumferential direction.

4. The wax coating equipment according to claim 1, wherein, The heating plate is composed of a disc-shaped portion, the diameter of which is smaller than the diameter of the block portion and larger than the radius of the block portion.

5. The wax coating equipment according to claim 1, wherein, The heating plate includes an upper plate and a heater, the upper plate being made of metal, and the heater being attached to the lower side of the upper plate.

6. A wafer mounting apparatus, the wafer mounting apparatus comprising: Block loading unit, the block loading unit providing blocks; Wafer loading unit, the wafer loading unit provides wafers; The wax coating apparatus according to any one of claims 1 to 5, wherein the wax coating apparatus heats the block portion while simultaneously coating wax onto the block portion provided from the block portion loading unit; and A wafer adhesion unit that adheres the wafer to the wax-coated surface of the block portion, the wafer being provided from the wafer loading unit and the block portion being provided from the wax coating unit.

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