A processing method of an O-shaped sealing groove of a semiconductor machine component gas distribution plate

Abstract

The application relates to a processing method of an O-shaped sealing groove of a gas distribution plate of a semiconductor machine component, and the processing method comprises the following steps: (1) processing the gas distribution plate by using a straight groove cutter to obtain a straight groove; (2) processing the inner circle of the straight groove obtained in step (1) by using a left-biased cutter, and then processing the outer circle of the straight groove by using a right-biased cutter to obtain an O-shaped sealing groove. The processing method provided by the application effectively solves the processing problem of the O-shaped sealing groove of the gas distribution plate, and improves the sealing property of the O-shaped sealing groove.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor processing, in particular to a processing method of an O-shaped sealing groove of a gas distribution plate of a semiconductor machine component. BACKGROUND

[0002] In semiconductor manufacturing, chemical vapor deposition technology is often used, that is, one or more gas phase compounds or elements containing thin film elements are chemically reacted on the substrate surface to generate a thin film. Chemical vapor deposition technology is a technology that uses heating, plasma excitation or light radiation to make gaseous or vapor state chemicals in a reactor on the gas phase or gas-solid interface to form solid deposition by chemical reaction.

[0003] In the process of chemical vapor deposition plating, the wafer is located below the gas distribution plate. During chemical vapor deposition, the gas distribution plate needs to ensure good sealing to ensure the stability of the deposition process. If the sealing is not good, the surface of the gas distribution plate will be tilted, which will cause uneven plating, and ultimately affect the performance of the chip.

[0004] CN113953777A discloses a sealing bearing sealing ring groove processing method, which comprises the following steps: clamping the sleeve ring to the tool, then sequentially performing sleeve ring turning forming, channel turning, heat treatment, rough grinding of each surface, hard turning of the sealing ring groove and stable treatment. Although this method can process the sealing ring groove, it is not suitable for processing high-precision semiconductor components and cannot meet the use requirements of semiconductor components.

[0005] Therefore, it is of great significance to provide a processing method of an O-shaped sealing groove of a gas distribution plate of a semiconductor machine component. SUMMARY

[0006] To solve the above problems, the present application provides a processing method of an O-shaped sealing groove of a gas distribution plate of a semiconductor machine component, which uses a specific shape of straight groove cutter, left and right bias cutter, and controls the processing parameters in the processing process, effectively solves the processing problem of the O-shaped sealing groove of the gas distribution plate, and improves the sealing performance of the O-shaped sealing groove.

[0007] To achieve the purpose of the present application, the following technical solutions are adopted:

[0008] The present application provides a processing method of an O-shaped sealing groove of a gas distribution plate of a semiconductor machine component, which comprises the following steps:

[0009] (1) using a straight groove cutter to process the gas distribution plate to obtain a straight groove;

[0010] (2) using a left-biased cutter to process the inner circle of the straight groove obtained in step (1), and then using a right-biased cutter to process the outer circle of the straight groove, to obtain an O-shaped sealing groove.

[0011] In the present application, by sequentially using a straight groove cutter, a left-biased cutter and a right-biased cutter to process the gas distribution plate, and by designing the cutter size and controlling the processing parameters during processing, the processing problem of the O-shaped sealing groove of the gas distribution plate is effectively solved, and the sealing performance of the O-shaped sealing groove is improved.

[0012] Preferably, the spindle speed during processing of the straight groove cutter is 300-400 r / min, for example, it can be 300 r / min, 305 r / min, 310 r / min, 315 r / min, 320 r / min, 325 r / min, 330 r / min, 335 r / min, 340 r / min, 345 r / min, 350 r / min, 355 r / min, 360 r / min, 365 r / min, 370 r / min, 375 r / min, 380 r / min, 385 r / min, 390 r / min or 395 r / min, but not limited to the listed values, other values not listed within the value range are also applicable.

[0013] Preferably, the cutting speed of the straight groove cutter is 0.06-0.07 mm / r, for example, it can be 0.06 mm / r, 0.062 mm / r, 0.064 mm / r, 0.066 mm / r, 0.068 mm / r or 0.07 mm / r, but not limited to the listed values, other values not listed within the value range are also applicable.

[0014] In the present application, preferably, the cutting speed of the straight groove cutter is controlled within a specific range, which can further improve the processing precision and thus improve the sealing performance of the O-shaped sealing groove.

[0015] Preferably, the straight groove cutter in step (1) comprises a handle, a head and a blade.

[0016] Preferably, the length of the handle of the straight groove cutter is 100-150 mm, for example, it can be 100 mm, 105 mm, 110 mm, 115 mm, 120 mm, 125 mm, 130 mm, 135 mm, 140 mm, 145 mm or 150 mm, but not limited to the listed values, other values not listed within the value range are also applicable.

[0017] Preferably, the shank width of the straight slot cutter is 10-20mm, for example, it can be 10mm, 11mm, 12mm, 13mm, 14mm, 15mm, 16mm, 17mm, 18mm, 19mm or 20mm, but not limited to the listed values, other values not listed in the value range are also applicable.

[0018] Preferably, the included angle between the side surface of the blade of the straight slot cutter and the axis is 40-50°, for example, it can be 40°, 42°, 44°, 46°, 48° or 50°, but not limited to the listed values, other values not listed in the value range are also applicable.

[0019] Preferably, the blade of the straight slot cutter is inserted into the cutter head.

[0020] Preferably, the length of the blade of the straight slot cutter exposed to the cutter head part is 3-5mm, for example, it can be 3mm, 3.2mm, 3.4mm, 3.6mm, 3.8mm, 4mm, 4.2mm, 4.4mm, 4.6mm, 4.8mm or 5mm, but not limited to the listed values, other values not listed in the value range are also applicable.

[0021] Preferably, the included angle between the side surface of the blade of the straight slot cutter and the axis is 5-7°, for example, it can be 5°, 5.2°, 5.4°, 5.6°, 5.8°, 6°, 6.2°, 6.4°, 6.8° or 7°, but not limited to the listed values, other values not listed in the value range are also applicable.

[0022] In the present application, the included angle between the side surface of the blade of the straight slot cutter and the axis is preferably controlled, which can further improve the machining precision and thus improve the sealing performance of the O-shaped sealing groove.

[0023] Preferably, the spindle speed during the left-biased cutter machining of step (2) is 300-400r / min, for example, it can be 300r / min, 305r / min, 310r / min, 315r / min, 320r / min, 325r / min, 330r / min, 335r / min, 340r / min, 345r / min, 350r / min, 355r / min, 360r / min, 365r / min, 370r / min, 375r / min, 380r / min, 385r / min, 390r / min or 395r / min, but not limited to the listed values, other values not listed in the value range are also applicable.

[0024] Preferably, the cutting speed of the left-biased cutter is 0.04-0.05 mm / r, for example, it can be 0.04 mm / r, 0.042 mm / r, 0.044 mm / r, 0.046 mm / r, 0.048 mm / r or 0.05 mm / r, but not limited to the listed values, other values not listed in the value range are also applicable.

[0025] In the present application, the cutting speed of the left-biased cutter is preferably controlled, which can further improve the machining accuracy and thus improve the sealing performance of the O-shaped sealing groove.

[0026] Preferably, the left-biased cutter of step (2) comprises a handle, a head and a blade.

[0027] Preferably, the length of the handle of the left-biased cutter is 100-150 mm, for example, it can be 100 mm, 105 mm, 110 mm, 115 mm, 120 mm, 125 mm, 130 mm, 135 mm, 140 mm, 145 mm or 150 mm, but not limited to the listed values, other values not listed in the value range are also applicable.

[0028] Preferably, the width of the handle of the left-biased cutter is 10-20 mm, for example, it can be 10 mm, 11 mm, 12 mm, 13 mm, 14 mm, 15 mm, 16 mm, 17 mm, 18 mm, 19 mm or 20 mm, but not limited to the listed values, other values not listed in the value range are also applicable.

[0029] Preferably, the blade of the left-biased cutter is inserted into the head.

[0030] Preferably, the length of the blade of the left-biased cutter exposed to the head is 3-5 mm, for example, it can be 3 mm, 3.2 mm, 3.4 mm, 3.6 mm, 3.8 mm, 4 mm, 4.2 mm, 4.4 mm, 4.6 mm, 4.8 mm or 5 mm, but not limited to the listed values, other values not listed in the value range are also applicable.

[0031] Preferably, in the left-biased cutter, the included angle between the two side surfaces of the front end of the blade is 40-44°, for example, it can be 40°, 40.5°, 41°, 41.5°, 42°, 42.5°, 43°, 43.5° or 44°, but not limited to the listed values, other values not listed in the value range are also applicable.

[0032] In the present application, the included angle between the two side surfaces of the front end of the blade in the left-biased cutter is preferably controlled, which can further improve the machining accuracy and thus improve the sealing performance of the O-shaped sealing groove.

[0033] Preferably, the spindle speed during the right-biased tool machining of step (2) is 300-400 r / min, for example, it can be 300 r / min, 305 r / min, 310 r / min, 315 r / min, 320 r / min, 325 r / min, 330 r / min, 335 r / min, 340 r / min, 345 r / min, 350 r / min, 355 r / min, 360 r / min, 365 r / min, 370 r / min, 375 r / min, 380 r / min, 385 r / min, 390 r / min or 395 r / min, but not limited to the listed values, other values not listed in the value range are also applicable.

[0034] Preferably, the cutting speed of the right-biased tool is 0.04-0.05 mm / r, for example, it can be 0.04 mm / r, 0.042 mm / r, 0.044 mm / r, 0.046 mm / r, 0.048 mm / r or 0.05 mm / r, but not limited to the listed values, other values not listed in the value range are also applicable.

[0035] In the present application, the cutting speed of the right-biased tool is preferably controlled, which can further improve the machining precision and thus improve the sealing performance of the O-shaped sealing groove.

[0036] Preferably, the right-biased tool of step (2) comprises a tool handle, a tool head and a tool blade.

[0037] Preferably, the length of the tool handle of the right-biased tool is 100-150 mm, for example, it can be 100 mm, 105 mm, 110 mm, 115 mm, 120 mm, 125 mm, 130 mm, 135 mm, 140 mm, 145 mm or 150 mm, but not limited to the listed values, other values not listed in the value range are also applicable.

[0038] Preferably, the width of the tool handle of the right-biased tool is 10-20 mm, for example, it can be 10 mm, 11 mm, 12 mm, 13 mm, 14 mm, 15 mm, 16 mm, 17 mm, 18 mm, 19 mm or 20 mm, but not limited to the listed values, other values not listed in the value range are also applicable.

[0039] Preferably, the tool blade of the right-biased tool is inserted into the tool head.

[0040] Preferably, the length of the tool blade of the right-biased tool exposed to the tool head is 3-5 mm, for example, it can be 3 mm, 3.2 mm, 3.4 mm, 3.6 mm, 3.8 mm, 4 mm, 4.2 mm, 4.4 mm, 4.6 mm, 4.8 mm or 5 mm, but not limited to the listed values, other values not listed in the value range are also applicable.

[0041] Preferably, the included angle between the two side surfaces of the front end of the blade in the right-biased cutter is 40-44°, for example, it can be 40°, 40.5°, 41°, 41.5°, 42°, 42.5°, 43°, 43.5° or 44°, but not limited to the listed values, other values not listed in the value range are also applicable.

[0042] In the present application, the included angle between the two side surfaces of the front end of the blade in the right-biased cutter is preferably controlled, which can further improve the machining precision and thus improve the sealing performance of the O-shaped sealing groove.

[0043] Preferably, the shank material of the straight groove cutter, the left-biased cutter and the right-biased cutter is tungsten steel.

[0044] Preferably, the blade material of the straight groove cutter, the left-biased cutter and the right-biased cutter is precision steel stone.

[0045] As a preferred technical solution of the present application, the machining method comprises the following steps:

[0046] (1) The straight groove cutter is used to machine the gas distribution plate under the conditions that the spindle speed is 300-400 r / min and the cutting speed is 0.06-0.07 mm / r, to obtain a straight groove;

[0047] The straight groove cutter comprises a shank, a head and a blade, the length of the shank of the straight groove cutter is 100-150 mm, the width of the shank of the straight groove cutter is 10-20 mm, the included angle between the side surface of the head of the straight groove cutter and the axis is 40-50°, the blade of the straight groove cutter is inserted into the head, the length of the part of the blade of the straight groove cutter exposed from the head is 3-5 mm, and the included angle between the side surface of the blade of the straight groove cutter and the axis is 5-7°;

[0048] (2) The inner circle of the straight groove obtained in step (1) is machined by using the left-biased cutter under the conditions that the spindle speed is 300-400 r / min and the cutting speed is 0.04-0.05 mm / r, and then the outer circle of the straight groove is machined by using the right-biased cutter under the conditions that the spindle speed is 300-400 r / min and the cutting speed is 0.04-0.05 mm / r, to obtain an O-shaped sealing groove;

[0049] The left-biased cutter comprises a shank, a head and a blade, the length of the shank of the left-biased cutter is 100-150 mm, the width of the shank of the left-biased cutter is 10-20 mm, the blade of the left-biased cutter is inserted into the head, the length of the part of the blade of the left-biased cutter exposed from the head is 3-5 mm, and the included angle between the two side surfaces of the front end of the blade in the left-biased cutter is 40-44°;

[0050] The right bias cutter comprises a cutter handle, a cutter head and a cutter blade, the length of the cutter handle of the right bias cutter is 100-150mm, the width of the cutter handle of the right bias cutter is 10-20mm, the cutter blade of the right bias cutter is inserted into the cutter head, the length of the part of the cutter blade exposed from the cutter head is 3-5mm, and the included angle between the two side surfaces of the front end of the cutter blade in the right bias cutter is 40-44°.

[0051] Compared with the prior art, the present application has the following beneficial effects:

[0052] In the present application, the gas distribution plate is processed by using the straight slot cutter, the left bias cutter and the right bias cutter in sequence, and the machining problem of the O-shaped sealing groove of the gas distribution plate is effectively solved by designing the size of the cutter and controlling the machining parameters in the processing process, and the sealing performance of the O-shaped sealing groove is improved. BRIEF DESCRIPTION OF DRAWINGS

[0053] Figure 1 is a structural schematic diagram of the straight slot cutter according to the present application embodiment 1;

[0054] Figure 2 is a structural schematic diagram of the left bias cutter according to the present application embodiment 1;

[0055] Figure 3 is a structural schematic diagram of the right bias cutter according to the present application embodiment 1. DETAILED DESCRIPTION

[0056] The technical solutions of the present application will be further described by specific embodiments. Those skilled in the art should understand that the embodiments are only used to help understand the present application, and should not be regarded as a specific limitation on the present application.

[0057] Embodiment 1

[0058] The present embodiment provides a processing method of an O-shaped sealing groove of a gas distribution plate of a semiconductor machine part, which comprises the following steps:

[0059] (1) using a straight slot cutter to process the gas distribution plate under the condition that the main shaft rotation speed is 350r / min and the cutting speed is 0.065mm / r, to obtain a straight slot;

[0060] As shown in Figure 1 The straight slot cutter comprises a cutter handle, a cutter head and a cutter blade, the length of the cutter handle of the right bias cutter is 100-150mm, the width of the cutter handle of the right bias cutter is 10-20mm, the cutter blade of the right bias cutter is inserted into the cutter head, the length of the part of the cutter blade exposed from the cutter head is 3-5mm, and the included angle between the two side surfaces of the front end of the cutter blade in the right bias cutter is 40-44°.

[0061] (2) using the left offset tool under the conditions of spindle speed of 350 r / min and cutting speed of 0.045 mm / r to process the inner circle of the straight groove obtained in step (1), and then using the right offset tool under the conditions of spindle speed of 350 r / min and cutting speed of 0.045 mm / r to process the outer circle of the straight groove, to obtain an O-shaped sealing groove;

[0062] As shown in Figure 2 , the left offset tool comprises a tool handle, a tool head and a blade, the length of the tool handle of the left offset tool is 120 mm, the width of the tool handle of the left offset tool is 15 mm, the blade of the left offset tool is inserted into the tool head, the length of the blade of the left offset tool exposed from the tool head is 4 mm, and the included angle between the two side surfaces of the front end of the blade in the left offset tool is 42°;

[0063] As shown in Figure 3 , the right offset tool comprises a tool handle, a tool head and a blade, the length of the tool handle of the right offset tool is 120 mm, the width of the tool handle of the right offset tool is 15 mm, the blade of the right offset tool is inserted into the tool head, the length of the blade of the right offset tool exposed from the tool head is 4 mm, and the included angle between the two side surfaces of the front end of the blade in the right offset tool is 42°;

[0064] The tool handle of the straight groove tool, the left offset tool and the right offset tool is made of tungsten steel, and the blade of the straight groove tool, the left offset tool and the right offset tool is made of fine steel stone.

[0065] After the sealing groove obtained in this embodiment is filled with a sealing ring, a helium mass spectrometer leak detector is used to blow the sealing part, and it is found that the reading of the helium mass spectrometer leak detector is stable, indicating that the sealing performance is good.

[0066] Example 2

[0067] The embodiment provides a processing method of an O-shaped sealing groove of a gas distribution plate of a semiconductor machine table component, and the processing method comprises the following steps:

[0068] (1) using a straight groove tool under the conditions of spindle speed of 300 r / min and cutting speed of 0.07 mm / r to process the gas distribution plate, to obtain a straight groove;

[0069] The straight groove tool comprises a tool handle, a tool head and a blade, the length of the tool handle of the straight groove tool is 100 mm, the width of the tool handle of the straight groove tool is 10 mm, the included angle between the side surface of the tool head of the straight groove tool and the axis is 40°, the blade of the straight groove tool is inserted into the tool head, the length of the blade of the straight groove tool exposed from the tool head is 3 mm, and the included angle between the side surface of the blade of the straight groove tool and the axis is 5°;

[0070] (2) using left bias cutter under the conditions of spindle speed of 300 r / min, cutting speed of 0.05 mm / r to process the inner circle of the straight groove obtained in step (1), and then using right bias cutter under the conditions of spindle speed of 300 r / min, cutting speed of 0.05 mm / r to process the outer circle of the straight groove, to obtain O-shaped sealing groove;

[0071] The left bias cutter comprises a handle, a head and a blade, the length of the handle of the left bias cutter is 100 mm, the width of the handle of the left bias cutter is 10 mm, the blade of the left bias cutter is inserted into the head, the length of the blade of the left bias cutter exposed from the head is 3 mm, and the included angle between the two side surfaces of the front end of the blade in the left bias cutter is 44°;

[0072] The right bias cutter comprises a handle, a head and a blade, the length of the handle of the right bias cutter is 100 mm, the width of the handle of the right bias cutter is 10 mm, the blade of the right bias cutter is inserted into the head, the length of the blade of the right bias cutter exposed from the head is 3 mm, and the included angle between the two side surfaces of the front end of the blade in the right bias cutter is 44°;

[0073] The handle material of the straight groove cutter, the left bias cutter and the right bias cutter is tungsten steel, and the blade material of the straight groove cutter, the left bias cutter and the right bias cutter is fine steel stone.

[0074] After the sealing groove obtained in the embodiment is filled with a sealing ring, a helium mass spectrometer leak detector is used to blow the sealing part, and it is found that the reading of the helium mass spectrometer leak detector is stable, which indicates that the sealing performance is good.

[0075] Example 3

[0076] The embodiment provides a processing method of an O-shaped sealing groove of a gas distribution plate of a semiconductor machine table component, and the processing method comprises the following steps:

[0077] (1) using a straight groove cutter under the conditions of spindle speed of 400 r / min, cutting speed of 0.06 mm / r to process the gas distribution plate, to obtain a straight groove;

[0078] The straight groove cutter comprises a handle, a head and a blade, the length of the handle of the straight groove cutter is 150 mm, the width of the handle of the straight groove cutter is 20 mm, the included angle between the side surface of the head of the straight groove cutter and the axis is 50°, the blade of the straight groove cutter is inserted into the head, the length of the blade of the straight groove cutter exposed from the head is 5 mm, and the included angle between the side surface of the blade of the straight groove cutter and the axis is 7°;

[0079] (2) using the left-biased cutter to process the inner circle of the straight groove obtained in step (1) under the condition that the main shaft rotation speed is 400 r / min and the cutting speed is 0.04 mm / r, and then using the right-biased cutter to process the outer circle of the straight groove under the condition that the main shaft rotation speed is 400 r / min and the cutting speed is 0.04 mm / r, to obtain the O-shaped sealing groove;

[0080] The left-biased cutter comprises a cutter handle, a cutter head and a cutter blade, the length of the cutter handle of the left-biased cutter is 150 mm, the width of the cutter handle of the left-biased cutter is 20 mm, the cutter blade of the left-biased cutter is inserted into the cutter head, the length of the part of the cutter blade of the left-biased cutter exposed from the cutter head is 5 mm, and the included angle between the two side surfaces of the front end of the cutter blade in the left-biased cutter is 40°.

[0081] The right-biased cutter comprises a cutter handle, a cutter head and a cutter blade, the length of the cutter handle of the right-biased cutter is 150 mm, the width of the cutter handle of the right-biased cutter is 20 mm, the cutter blade of the right-biased cutter is inserted into the cutter head, the length of the part of the cutter blade of the right-biased cutter exposed from the cutter head is 5 mm, and the included angle between the two side surfaces of the front end of the cutter blade in the right-biased cutter is 40°.

[0082] The cutter handle of the straight groove cutter, the left-biased cutter and the right-biased cutter is made of tungsten steel, and the cutter blade of the straight groove cutter, the left-biased cutter and the right-biased cutter is made of fine steel stone.

[0083] After the sealing groove obtained in the embodiment is filled with a sealing ring, the sealing position is blown by a helium mass spectrometric leak detector, it is found that the reading of the helium mass spectrometric leak detector is stable, which indicates that the sealing property is good.

[0084] Embodiment 4

[0085] The embodiment provides a processing method of an O-shaped sealing groove of a gas distribution plate of a semiconductor machine table part, and the difference compared with the embodiment 1 is that the cutting speed of the straight groove cutter is 0.1 mm / r.

[0086] After the sealing groove obtained in the embodiment is filled with a sealing ring, the sealing position is blown by a helium mass spectrometric leak detector, it is found that the reading of the helium mass spectrometric leak detector fluctuates, which indicates that the sealing property is relatively poor, and through the comparison between the embodiment 1 and the embodiment 4, it can be seen that the preferred control of the cutting speed of the straight groove cutter can further improve the processing precision of the sealing groove and improve the sealing property.

[0087] Embodiment 5

[0088] The embodiment provides a processing method of an O-shaped sealing groove of a gas distribution plate of a semiconductor machine table part, and the difference compared with the embodiment 1 is that the included angle between the cutter blade side surface of the straight groove cutter and the axis is 10°.

[0089] After the sealing groove obtained in the embodiment is filled with a sealing ring, a helium mass spectrometer leak detector is used to blow the sealing position, and it is found that the reading of the helium mass spectrometer leak detector fluctuates, indicating that the sealing property is relatively poor. It can be seen from the comparison between the embodiment 1 and the embodiment 5 that the present application preferably controls the included angle between the blade side surface of the straight slot cutter and the axis, so that the machining precision of the sealing groove is further improved, and the sealing property is improved.

[0090] Embodiment 6

[0091] The embodiment provides a machining method of an O-shaped sealing groove of a gas distribution plate of a semiconductor machine table component, and the difference compared with the embodiment 1 is that the included angle between the two side surfaces of the front end of the blade of the left bias cutter is 46°.

[0092] After the sealing groove obtained in the embodiment is filled with a sealing ring, a helium mass spectrometer leak detector is used to blow the sealing position, and it is found that the reading of the helium mass spectrometer leak detector fluctuates, indicating that the sealing property is relatively poor. It can be seen from the comparison between the embodiment 1 and the embodiment 6 that the present application preferably controls the included angle between the two side surfaces of the front end of the blade of the left bias cutter, so that the machining precision of the sealing groove is further improved, and the sealing property is improved.

[0093] Embodiment 7

[0094] The embodiment provides a machining method of an O-shaped sealing groove of a gas distribution plate of a semiconductor machine table component, and the difference compared with the embodiment 1 is that the cutting speed of the left bias cutter is 0.08 mm / r.

[0095] After the sealing groove obtained in the embodiment is filled with a sealing ring, a helium mass spectrometer leak detector is used to blow the sealing position, and it is found that the reading of the helium mass spectrometer leak detector fluctuates, indicating that the sealing property is relatively poor. It can be seen from the comparison between the embodiment 1 and the embodiment 7 that the present application preferably controls the cutting speed of the left bias cutter, so that the machining precision of the sealing groove is further improved, and the sealing property is improved.

[0096] Embodiment 8

[0097] The embodiment provides a machining method of an O-shaped sealing groove of a gas distribution plate of a semiconductor machine table component, and the difference compared with the embodiment 1 is that the cutting speed of the right bias cutter is 0.09 mm / r.

[0098] After the sealing groove obtained in the embodiment is filled with a sealing ring, a helium mass spectrometer leak detector is used to blow the sealing position, and it is found that the reading of the helium mass spectrometer leak detector fluctuates, indicating that the sealing property is relatively poor. It can be seen from the comparison between the embodiment 1 and the embodiment 8 that the present application preferably controls the cutting speed of the right bias cutter, so that the machining precision of the sealing groove is further improved, and the sealing property is improved.

[0099] In summary, the application solves the machining problem of the O-shaped sealing groove of the gas distribution plate by sequentially using the straight slot cutter, the left offset cutter and the right offset cutter to machine the gas distribution plate, and improves the sealing property of the O-shaped sealing groove.

[0100] The applicant declares that the above description is only a specific embodiment of the application, but the protection scope of the application is not limited thereto. It should be understood by those skilled in the art that any changes or replacements within the technical scope disclosed by the application can be easily thought out by any person skilled in the art, and all of them fall within the protection scope and disclosure scope of the application.

Claims

1. A method for processing an O-ring groove of a gas distribution plate of a semiconductor machine tool component, characterized by, The processing method comprises the following steps: (1) using a straight slot cutter to process a gas distribution plate to obtain a straight slot; The cutting speed of the straight slot cutter is 0.06-0.07 mm / r; The straight slot cutter comprises a handle, a head and a blade; the included angle between the head side of the straight slot cutter and the axis is 40-50°; (2) using a left offset cutter to process the inner circle of the straight slot obtained in step (1), and then using a right offset cutter to process the outer circle of the straight slot to obtain an O-shaped sealing groove; The spindle speed of the left offset cutter during processing is 300-400 r / min; the cutting speed of the left offset cutter is 0.04-0.05 mm / r; The left offset cutter comprises a handle, a head and a blade; in the left offset cutter, the included angle between the two side surfaces of the front end of the blade is 40-44°; The spindle speed of the right offset cutter during processing is 300-400 r / min; the cutting speed of the right offset cutter is 0.04-0.05 mm / r; The right offset cutter comprises a handle, a head and a blade; in the right offset cutter, the included angle between the two side surfaces of the front end of the blade is 40-44°.

2. The method of claim 1, wherein, The spindle speed of the straight slot cutter during processing in step (1) is 300-400 r / min.

3. The method of claim 1 wherein, The length of the handle of the straight slot cutter in step (1) is 100-150 mm.

4. The method of claim 1 wherein, The width of the handle of the straight slot cutter is 10-20 mm.

5. The method of claim 1 wherein, The blade of the straight slot cutter is inserted into the head.

6. The method of claim 1 wherein, The length of the blade exposed part of the head of the straight slot cutter is 3-5 mm.

7. The method of claim 1 wherein, The included angle between the blade side surface of the straight slot cutter and the axis is 5-7°.

8. The method of claim 1 wherein, The length of the handle of the left offset cutter in step (2) is 100-150 mm.

9. The method of claim 1 wherein, The width of the handle of the left offset cutter is 10-20 mm.

10. The method of claim 1 wherein, The blade of the left offset cutter is inserted into the head.

11. The method of claim 1 wherein, The length of the blade exposed part of the head of the left offset cutter is 3-5 mm.

12. The method of claim 1 wherein, The length of the handle of the right offset cutter in step (2) is 100-150 mm.

13. The method of claim 1 wherein, The width of the handle of the right offset cutter is 10-20 mm.

14. The method of claim 1 wherein, The blade of the right offset cutter is inserted into the head.

15. The method of claim 1 wherein, The length of the blade exposed part of the head of the right offset cutter is 3-5 mm.

16. The method of claim 1 wherein, The material of the handle of the straight slot cutter, the left offset cutter and the right offset cutter is tungsten steel.

17. The method of claim 1 wherein, The material of the blade of the straight slot cutter, the left offset cutter and the right offset cutter is fine steel stone.

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