Method and device for detecting the quality of a patch

Abstract

The application provides a patch quality detection method and device. The detection method comprises: obtaining detection information in the process of performing a lamp bead patching operation on a pad, wherein the detection information comprises patch pressure information borne by the pad and / or air flow information in a patch suction nozzle (101); and determining whether the patch quality of the pad is qualified according to the detection information. According to the detection method provided by the application, when the patch quality of a certain pad is unqualified, the patch quality can be detected in time, so that the patching work can be intervened or adjusted in time, and the efficiency of lamp bead patching is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and in particular to a method and apparatus for detecting the quality of chip mounting. Background Technology

[0002] Due to a combination of factors, including poor packaging processes, defects in LED chip raw materials, and abnormalities in the integrated circuits (ICs) on the circuit board, LED boards may exhibit various display problems after being powered on, such as dead LEDs, dim LEDs, bright LEDs, LED crosstalk, and color distortion. Therefore, LED boards with defective LEDs need to be reworked. LED board rework typically involves multiple steps, including rejection, soldering, surface mounting, and die bonding. These steps can be performed by different components of the LED board rework equipment.

[0003] One of the current challenges is the placement of LED chips. In this process, a surface mount assembly (SMA) transfers good LED chips from the wafer to the pads on the circuit board. This involves chip pickup, circuit board positioning, and chip placement. Ensuring the chips are placed evenly and accurately on the pads is a major industry pain point. Currently, because the chips are automatically attached to the pads by the SMA assembly according to a pre-set automated program, defects in the placement quality (e.g., insufficient contact between the chip and solder paste, or the chip sticking to the nozzle instead of the pad) are often not detected in time. This can affect subsequent placement operations on other pads and may require rework or re-attaching, thus reducing the efficiency of LED chip placement. Summary of the Invention

[0004] This application provides a method and apparatus for detecting the quality of chip mounting. When a chip mounting pad fails to meet quality standards, it can be detected in a timely manner, allowing for timely intervention or adjustment of the chip mounting process, which is beneficial for improving the efficiency of LED chip mounting.

[0005] In a first aspect, a method for detecting the quality of chip mounting is provided, comprising: acquiring detection information during the chip mounting operation on the pads, the detection information including chip mounting pressure information borne by the pads and / or airflow information in the chip mounting nozzle; and determining whether the chip mounting quality of the pads is qualified based on the detection information.

[0006] In one possible implementation, the detection information includes the chip placement pressure information, and determining whether the chip placement quality of the LED bead is qualified based on the detection information includes: when the chip placement stroke of the chip placement nozzle reaches a certain value and the chip placement pressure borne by the pad is greater than or equal to a preset pressure threshold, then the chip placement quality of the pad is determined to be qualified.

[0007] In one possible implementation, the method further includes: when the placement stroke of the placement nozzle reaches a certain value and the placement pressure on the pad is less than the preset pressure threshold, driving the placement nozzle to continue moving toward the pad for a preset stroke.

[0008] In one possible implementation, the detection information includes the airflow information, and determining whether the chip mounting quality of the LED is qualified based on the detection information includes: if the airflow in the chip mounting nozzle increases significantly after the chip mounting nozzle leaves the pad, then the chip mounting quality of the pad is determined to be qualified.

[0009] In one possible implementation, the detection information includes the chip pressure information and the airflow information. Determining whether the chip placement quality of the LED bead is qualified based on the detection information includes: when the chip placement travel of the chip nozzle reaches a certain point, the chip placement pressure on the pad is greater than or equal to a preset pressure threshold, and when the chip placement nozzle leaves the pad, the airflow in the chip placement nozzle increases significantly, then the chip placement quality of the pad is determined to be qualified.

[0010] In one possible implementation, the detection information also includes vacuum level information inside a vacuum generator connected to the patch nozzle.

[0011] In one possible implementation, the method further includes: outputting a reminder message when it is determined that the pad placement quality is unqualified.

[0012] Secondly, a device for detecting the quality of chip mounting is provided, comprising: an acquisition unit for acquiring detection information during the chip mounting operation on a pad, the detection information including chip mounting pressure information borne by the pad and / or airflow information in the chip mounting nozzle; and a determination unit for determining whether the chip mounting quality of the pad is qualified based on the detection information.

[0013] In one possible implementation, the detection information includes the placement pressure information, and the determining unit is specifically used to: determine that the placement quality of the pad is qualified when the placement stroke of the placement nozzle reaches the set point and the placement pressure borne by the pad is greater than or equal to a preset pressure threshold.

[0014] In one possible implementation, the detection device further includes a drive unit for driving the placement nozzle to continue traveling a preset distance toward the pad when the placement stroke of the placement nozzle reaches the preset pressure threshold.

[0015] In one possible implementation, the detection information includes the airflow information, and the determining unit is specifically used to: if the airflow in the placement nozzle increases significantly after the placement nozzle leaves the pad, then determine that the placement quality of the pad is qualified.

[0016] In one possible implementation, the detection information includes the placement pressure information and the airflow information. The determining unit is specifically used to: determine that the placement quality of the pad is qualified when the placement stroke of the placement nozzle reaches a certain value, the placement pressure on the pad is greater than or equal to a preset pressure threshold, and the airflow in the placement nozzle increases significantly after the placement nozzle leaves the pad.

[0017] In one possible implementation, the detection information also includes vacuum level information inside a vacuum generator connected to the patch nozzle.

[0018] In one possible implementation, the detection device further includes an alert unit for outputting an alert message when it is determined that the pad placement quality is unqualified.

[0019] Thirdly, a patch quality detection device is provided, comprising: a processor; a memory; and a computer program, wherein the computer program is stored in the memory, and when the computer program is executed by the processor, the memory device causes the storage device to perform the detection method provided by any possible implementation of the first aspect described above.

[0020] Fourthly, a computer-readable storage medium is provided, the computer-readable storage medium storing program code that, when the computer program code is run on a computer, causes the computer to perform the detection method provided by any possible implementation of the first aspect above.

[0021] Fifthly, a chip system is provided, including a processor for calling and running a computer program from a memory, causing an electronic device equipped with the chip system to perform the detection method provided by any possible implementation of the first aspect above.

[0022] In a sixth aspect, a computer program product is provided, the computer program product comprising: computer program code, which, when run on a computer, causes the computer to execute the detection method provided by any possible implementation of the first aspect above.

[0023] It should be noted that the above-mentioned computer program code can be stored in whole or in part on the first storage medium, wherein the first storage medium can be packaged together with the processor or packaged separately from the processor, and this application does not make specific limitations in this regard.

[0024] The chip placement quality detection method provided in this application embodiment can acquire detection information during the chip placement operation of the chip placement nozzle on the pad, and then determine whether the chip placement quality of the pad is qualified based on the detection information. This detection information may include the placement pressure information borne by the pad and / or the airflow information within the chip placement nozzle, and the chip placement quality can be determined based on the placement pressure information and / or the airflow information. For example, the placement pressure information can be used to determine whether the LED is tightly attached to the pad (solder paste), thereby determining whether the chip placement quality is qualified. The airflow information can also be used to determine whether the LED is accurately picked up, whether the LED falls off midway, and whether the LED sticks to the nozzle instead of adhering to the pad, thereby determining whether the chip placement quality is qualified.

[0025] The chip placement quality detection method provided in this application embodiment can monitor the chip placement process. When a chip placement quality of a certain pad is unqualified, it can be detected in time. At this time, a reminder message can be output to the operator in time, so that manual intervention or adjustment can be made in time, which is beneficial to improving the efficiency of chip placement. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of the patch assembly provided in the embodiments of this application.

[0027] Figure 2 This is a schematic diagram of the installation structure of the patch nozzle.

[0028] Figure 3 This is a schematic diagram of the control principle of the surface mount assembly.

[0029] Figure 4 This is a flowchart of the patch quality detection method provided in the embodiments of this application.

[0030] Figure 5 This is a schematic block diagram of the patch quality detection device provided in the embodiments of this application.

[0031] Figure 6 This is a structural block diagram of the detection device provided in the embodiments of this application.

[0032] Figure label:

[0033] 100. Surface Mount Assembly; 101. Surface Mount Nozzle; 102. Laser Rangefinder; 103. Nozzle Rotary Motor; 104. Y-axis Motion Module; 105. Z-axis Lifting Module; 106. CCD Camera; 107. Three-Axis Manual Micro-Motion Platform; 109. Mounting Base; 110. Connecting Arm;

[0034] 200. Gantry frame. Detailed Implementation

[0035] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0036] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between the components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0037] In the description of this application, it should be understood that the terms "upper", "lower", "side", "front", "rear", etc., indicate the orientation or positional relationship based on the installation orientation or positional relationship, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0038] It should also be noted that in the embodiments of this application, the same reference numerals are used to represent the same component or part. For the same part in the embodiments of this application, the reference numerals may only be used to mark one part or component as an example. It should be understood that the reference numerals are also applicable to other identical parts or components.

[0039] In current technology, due to the lack of monitoring during the process of attaching LEDs to the pads on the circuit board, even if a pad has a defective placement quality (such as the LED not being attached tightly enough or the LED sticking to the nozzle instead of being attached to the pad), it cannot be detected in time. This may not only affect the placement of other pads, but may also require rework or re-attachment of the pad, thereby reducing the efficiency of LED placement.

[0040] To address the aforementioned issues, this application provides a method for detecting the quality of LED placement. According to this method, during the LED placement process of the mounting assembly on the pads, detection information is first acquired. This detection information includes the placement pressure information borne by the pads and / or the airflow information within the placement nozzle. Then, the quality of the placement on the pads can be determined based on this detection information. The method for detecting the quality of LED placement provided in this application can monitor the placement process. When a pad exhibits substandard placement quality, it can be detected promptly, allowing for timely intervention or adjustment of the placement work, thereby improving the efficiency of LED placement.

[0041] The surface mount quality detection method provided in this application can be applied to the surface mount assembly in LED panel rework equipment. The surface mount assembly will be described first, that is, the application background of the surface mount quality detection method provided in this application will be introduced. This application first provides a surface mount assembly 100. Figure 1 This is a schematic diagram of the structure of the patch assembly 100 provided in the embodiments of this application.

[0042] like Figure 1 As shown, the surface mount assembly 100 provided in this application embodiment can be applied to lamp board processing (production) equipment or lamp board rework equipment. For example, the surface mount assembly 100 can be mounted on the mounting platform of the lamp board processing equipment or lamp board rework equipment via a gantry 200. The lamp board here mainly includes a circuit board and LED beads fixedly connected to the circuit board. During the lamp board processing or rework process, the surface mount assembly 100 is used to attach the LED beads to the pads of the circuit board, more specifically, to attach the LED beads to the solder paste on the pads. Subsequently, the LED beads can be fixedly mounted on the circuit board by heating the solder paste (i.e., performing a die bonding operation). The circuit board can be, for example, a printed circuit board (PCB), but is not limited to this; the LED beads can be, for example, any type of LED beads such as a mini light-emitting diode (MiniLED), but is not limited to this.

[0043] like Figure 1 As shown, the surface mount assembly 100 provided in this embodiment includes a surface mount nozzle 101 and a driving mechanism. The driving mechanism is connected to the surface mount nozzle 101 and is used to drive the surface mount nozzle 101 to move between the LED chip pick-up position and the surface mount position to complete the entire surface mount process of the LED chip.

[0044] Specifically, the surface mount nozzle 101 has an opening and can generate negative pressure inside; for example, the surface mount nozzle 101 can be connected to a vacuum generator. When the surface mount nozzle 101 is moved to or near the LED pick-up position, the vacuum generator starts working, and negative pressure is generated inside the surface mount nozzle 101, allowing it to pick up LEDs through the opening. In one case, the opening may not be completely sealed by the LED; there may be a gap between the opening edge and the LED, allowing external air to flow through this gap, through the surface mount nozzle 101, and then to the vacuum generator, thus maintaining a small, weak airflow inside the surface mount nozzle 101. In another case, the LED can completely seal the opening of the surface mount nozzle 101, in which case negative pressure is maintained inside the surface mount nozzle 101, and no airflow occurs.

[0045] Under the action of the drive mechanism, the pick-up nozzle 101 that has picked up the LED chip is moved from the LED chip pick-up position to the pick-up position, which is the location of the pad where the pick-up operation is to be performed. At this time, the vacuum generator is controlled to make the negative pressure inside the pick-up nozzle 101 disappear or decrease, so that the LED chip can be detached from the pick-up nozzle 101 and attached to the solder paste on the pad, thereby completing the entire pick-up process for the pad.

[0046] Alternatively, in other cases, during the placement process, the negative pressure inside the placement nozzle 101 can remain constant. This negative pressure can always be maintained at a small value, which can hold the LED above the nozzle opening when it is not in contact with solder paste. After it is attached to the solder paste, and during the upward movement of the placement nozzle 101, due to the adhesiveness of the solder paste, it can be detached from the placement nozzle 101 and attached to the pad.

[0047] Optionally, the drive mechanism is connected to the patch nozzle 101 via a transmission. This drive mechanism can include any power source such as a motor, cylinder, or guide rail, slide, gear, cam, belt, or robotic arm; this application does not limit its scope. For example, the drive mechanism can include a high-precision KK module.

[0048] Optionally, the placement nozzle 101 may include multiple nozzles arranged in parallel. In this case, the drive mechanism drives the multiple placement nozzles 101 to move simultaneously, and the multiple placement nozzles 101 can pick up multiple LEDs at the same time, realizing the placement operation on multiple pads at the same time.

[0049] like Figure 1 As shown, the drive mechanism may include a Y-axis motion module 104, which is mounted on the gantry 200. A chip picker nozzle 101 is connected to the Y-axis motion module 104. The Y-axis motion module 104 is used to drive the chip picker nozzle 101 along the Y direction to above the pad after the chip picker nozzle 101 picks up the LED.

[0050] For example, the Y-axis motion module 104 can be a high-precision KK module with a repeatability of ±2μm. Combined with a 17-bit absolute servo motor and an encoder accuracy of 0.00274°, it can achieve high placement accuracy requirements. The module's linear motor also has a repeatability of ±2μm, and when used with a ±1μm grating ruler, it can also achieve high placement accuracy requirements.

[0051] Figure 2 This is a schematic diagram of the mounting structure of the patch nozzle 101. (See diagram below.) Figure 1 and Figure 2 As shown, the drive mechanism also includes a Z-axis lifting module 105. The placement nozzle 101 is connected to the Z-axis lifting module 105 via an L-shaped connecting arm 110. The Z-axis lifting module 105 is connected to the Y-axis motion module 104. The Z-axis lifting module 105 is used to drive the placement nozzle 101 to move up and down along the Z-direction to approach the pad and attach the LED to the pad. After the LED is attached to the pad, the placement nozzle 101 is moved away from the pad. During this process, the negative pressure inside the placement nozzle 101 decreases or disappears to facilitate the removal of the LED from the placement nozzle 101.

[0052] like Figure 1 and Figure 2 As shown, the surface mount assembly 100 also includes a laser rangefinder 102, which is used to measure the height information of the pads. In some cases, this height can be characterized by the distance between the laser rangefinder 102 and the pads; the shorter the distance, the higher the pads. This height information can be used to determine the stroke of the Z-axis lifting module 105, that is, to determine how far the Z-axis lifting module 105 needs to descend to accurately attach the LED to the pads.

[0053] For example, before patch placement, the height value can be detected by a laser rangefinder 102, and the motion control algorithm calculates the height deviation value. This deviation is then compensated for by the motion control algorithm and applied to the Z-axis lifting module 105, thereby making the patch placement's vertical travel more stable and reliable. For example, the Z-axis lifting module 105 can be a Z-axis robot or a high-precision KK module.

[0054] like Figure 1 and Figure 2As shown, the surface mount assembly 100 also includes a nozzle rotation motor 103, which can be mounted on the connecting arm 110 and is connected to the surface mount nozzle 101. The nozzle rotation motor 103 is used to rotate the surface mount nozzle 101 so that the LED on the surface mount nozzle 101 can be aligned with the pads. After the LED is picked up by the surface mount nozzle 101, the bonding surface of the LED is parallel to the XOY plane. Considering that the LED may rotate in the XOY plane, making it impossible for the LED to be aligned with the pads, the nozzle rotation motor 103 can be set to rotate the LED to ensure that the LED can be aligned with the pads.

[0055] like Figure 1 As shown, the placement assembly 100 also includes a charge-coupled device (CCD) camera 106. The CCD camera 106 can photograph the wafer containing the LEDs to be picked up, for example, it can photograph and position the wafer on the loading assembly, so that the placement nozzle 101 can accurately pick up the LEDs to be picked up. The CCD camera 106 is fixedly mounted on a three-axis (XYZ axis) manual micro-motion platform 107, and the position of the CCD camera 106 can be adjusted using the three-axis manual micro-motion platform 107.

[0056] Figure 3 This is a schematic diagram illustrating the control principle of the surface mount assembly 100. (For example...) Figure 3 As shown, the patch assembly 100 also includes a controller, and the aforementioned vacuum generator, laser rangefinder 102, nozzle rotary motor 103, Y-axis motion module 104, Z-axis lifting module 105 and CCD camera 106 are all connected to the controller.

[0057] CCD camera 106 takes pictures of the wafers with LEDs to be picked up on the loading assembly and sends the acquired image information to the controller. The controller, based on this image information, controls the Y-axis motion module 104 and the Z-axis lifting module 105 to move the placement nozzle 101 to pick up the LEDs (during which a vacuum generator is activated to create negative pressure within the placement nozzle 101). The Y-axis motion module 104 moves the placement nozzle 101, now holding the LEDs, above the pads. Laser rangefinder 102 measures the height of the pads to obtain height information. Based on this height information, the controller lowers the Z-axis lifting module 105 so that the LEDs on the placement nozzle 101 can be attached to the pads. After the placement is completed, the controller controls the Z-axis lifting module 105 to drive the placement nozzle 101 to rise (during which the vacuum generator is controlled to reduce or cancel the negative pressure generated in the placement nozzle 101), and controls the Y-axis motion module 104 to drive the placement nozzle 101 to move towards the upward component to start the next placement process.

[0058] Furthermore, such as Figure 3 As shown, the surface mount assembly 100 provided in this embodiment further includes a detector for acquiring detection information. This detector is connected to a controller, which determines whether the surface mount quality of the pads is acceptable based on the detection information. The detector includes a pressure sensor and / or a flow meter. The pressure sensor acquires the surface mount pressure information borne by the pads, and the flow meter acquires the airflow information within the surface mount nozzle 101. Therefore, the detection information includes surface mount pressure information and / or airflow information, and the controller can determine whether the surface mount quality of the pads is acceptable based on the surface mount pressure information and / or airflow information.

[0059] exist Figure 3 Based on this, embodiments of this application provide a method for detecting patch quality. Figure 4 This is a flowchart of a patch quality detection method 200 provided in an embodiment of this application. This detection method 200 can be performed by... Figure 3 The detection method 200 can be executed by the controller of the surface mount assembly 100, or by the controller of the lamp board rework equipment, the controller of the lamp board production and processing equipment, etc., but is not limited to these. The following describes the detection method 200 with the controller of the surface mount assembly 100 as the executing entity. The detection method 200 includes steps 210 and 220.

[0060] Step 210: During the LED chip placement operation on the pads, the controller acquires detection information, which includes the placement pressure information borne by the pads and / or the airflow information in the placement nozzle 101.

[0061] Step 220: The controller determines whether the pad placement quality is qualified based on the detection information.

[0062] Combination Figure 3 and Figure 4 The pressure sensor is used to acquire the placement pressure information borne by the pads during the placement process. This placement pressure is the pressure exerted by the LED on the pads during placement, and also the pressure borne by the LED from the pads. The placement pressure can be used to determine whether the LED is tightly attached to the pads (solder paste), thus determining whether the placement quality is acceptable. For example, if the placement pressure is too low, or no placement pressure is detected (i.e., pressure is 0), it indicates that the LED is not tightly attached to the pads. In this case, the LED may not be deeply embedded in the solder paste, the LED may be floating on the solder paste, or the LED may not even be attached to the pads (e.g., the LED may fall off during movement). Therefore, the controller can determine that the placement quality is unacceptable.

[0063] Optionally, for ease of detection, a pressure sensor can be used to detect the pressure exerted on the LED chip by the solder pads. Based on the principle of action and reaction, this pressure is the placement pressure exerted on the solder pads during the placement process. In this case, the pressure sensor can be positioned between the connecting arm 110 and the placement nozzle 101. After the placement nozzle 101 is subjected to the squeezing force of the solder pads, it continues to squeeze the pressure sensor. Thus, the pressure sensor indirectly detects the placement pressure information exerted on the solder pads during the placement process through the placement nozzle 101. This pressure sensor can be, for example, a strain gauge pressure sensor, a piezoresistive pressure sensor, a capacitive pressure sensor, or a piezoelectric pressure sensor.

[0064] The flow meter is used to obtain airflow information within the surface mount nozzle 101. As mentioned earlier, when the surface mount nozzle 101 picks up the LED chip, the LED chip blocks the opening of the nozzle 101. To maintain the negative pressure state within the nozzle, there may be a relatively small airflow, or the opening may be completely blocked, resulting in zero airflow. When the LED chip detaches from the surface mount nozzle 101, the airflow within the nozzle suddenly increases significantly. Therefore, by judging whether the airflow within the nozzle increases sharply, it can be determined whether the LED chip has detached from the nozzle. This allows it to determine whether the LED chip has stuck together during the process of being attached to the solder pad and moving upwards on the surface mount nozzle 101.

[0065] Specifically, during the upward movement of the surface mount nozzle 101, the LED should detach from the surface mount nozzle 101. At this time, the airflow inside the surface mount nozzle 101 will increase significantly (sharply). If the airflow inside the surface mount nozzle 101 does not increase significantly, it is determined that the LED is stuck to the nozzle and not attached to the pad. The controller can then determine that the surface mount quality is unqualified.

[0066] Based on a similar principle, during the surface mount technology (SMT) process, it can be determined whether the SMT nozzle 101 has picked up the LED chip by detecting whether there is a significant increase or decrease in the airflow within the nozzle 101, and whether the LED chip abnormally detaches from the nozzle 101 during chip movement. Therefore, a flow meter can be used to obtain airflow information within the nozzle 101, and the controller can determine whether the SMT quality is acceptable based on this information. As a special case, if the LED chip detaches and is not attached to the solder pad, this is also considered a case of unacceptable SMT quality.

[0067] Alternatively, the flow meter here can be any type, such as a differential pressure flow meter, volumetric flow meter, turbine flow meter, electromagnetic flow meter, ultrasonic flow meter, vortex flow meter, thermal mass flow meter, or Coriolis flow meter.

[0068] According to the chip mounting quality detection method 200 provided in this application embodiment, detection information can be acquired during the chip mounting operation of the chip mounting nozzle 101 on the pad, and then the chip mounting quality of the pad can be determined based on the detection information. The detection information may include the mounting pressure information borne by the pad and / or the airflow information within the chip mounting nozzle 101, and the chip mounting quality can be determined based on the mounting pressure information and / or the airflow information. For example, the mounting pressure information can be used to determine whether the LED is tightly attached to the pad (solder paste), thereby determining whether the chip mounting quality is acceptable. The airflow information can also be used to determine whether the LED is accurately picked up, whether the LED falls off midway, and whether the LED sticks to the nozzle instead of the pad, thereby determining whether the chip mounting quality is acceptable.

[0069] The chip placement quality detection method 200 provided in this application embodiment can monitor the chip placement process. When a chip placement quality of a certain pad is unqualified, it can be detected in time. At this time, a reminder message can be output to the operator in time, so that manual intervention or adjustment can be made in time for chip placement work, which is beneficial to improving the efficiency of chip placement.

[0070] In one possible implementation, the detection information includes placement pressure information. When the placement stroke of the placement nozzle 101 reaches a certain value and the placement pressure on the pad is greater than or equal to a preset pressure threshold, it indicates that the LED is tightly and reliably attached to the pad. At this time, the controller determines that the placement quality of the pad is qualified.

[0071] Optionally, the preset threshold can be determined in advance based on experience values ​​from past normal patching processes and input into the controller.

[0072] Optionally, when the placement stroke of the placement nozzle 101 reaches the preset pressure threshold and the placement pressure on the pad is less than the preset pressure threshold, it indicates that the LED is not tightly attached to the pad. At this time, the depth of the LED embedded in the solder paste may be insufficient, the LED may float on the solder paste, or the LED may not even be attached to the pad (for example, the LED falls off during the movement). Therefore, the controller can determine that the placement quality is unqualified.

[0073] Optionally, when the placement stroke of the pick-and-place nozzle 101 reaches the preset pressure threshold while the placement pressure on the pad is less than the preset pressure threshold, the Z-axis lifting module 105 is controlled to drive the pick-and-place nozzle 101 to continue downward (i.e., towards the pad) for a preset stroke. This preset stroke can be, for example, 0.05 mm, 0.1 mm, 0.12 mm, 0.15 mm, or 0.2 mm. After the movement is complete, the placement pressure information is acquired again. If the placement pressure is greater than or equal to (reaches) the preset pressure threshold, the controller determines that the placement quality is acceptable. Otherwise, the controller determines that the placement quality is unacceptable, and the motion control program alarms, requiring manual intervention to determine if the placement is abnormal.

[0074] The above settings can improve the automation level of patch placement to a certain extent, which helps save manpower, reduce the number of times manual intervention is required, and improve the efficiency of patch placement.

[0075] In another possible implementation, the detection information includes airflow information. If the airflow in the pick-up nozzle 101 increases significantly after the pick-up nozzle 101 leaves the pad, it indicates that the LED has been successfully attached to the pad (solder paste) without sticking. Therefore, the controller determines that the pick-up quality of the pad is qualified.

[0076] Optionally, the detection information includes airflow information. If the airflow in the pick-up nozzle 101 does not increase significantly after the pick-up nozzle 101 leaves the pad, it indicates that the LED is stuck to the nozzle and has not been successfully attached to the pad (solder paste). Therefore, the controller determines that the pick-up quality of the pad is unqualified.

[0077] Here, those skilled in the art will understand the specific meaning of a significant increase in airflow. This significant increase in airflow is due to the LED chip detaching from the opening of the surface mount nozzle 101, causing the opening to be fully opened (suddenly opened), resulting in a sudden increase in airflow. For example, the airflow may suddenly become 1.5 times, 2 times, 3 times, 4 times, 5 times, or even more than the original amount. This excludes the situation of minor changes in airflow (e.g., minor changes within a 10% or even smaller range) that occur during the normal and stable operation of the equipment due to factors such as control precision and operational errors.

[0078] In another possible implementation, the detection information includes placement pressure information and airflow information. When the placement stroke of the placement nozzle 101 is reached, the placement pressure on the pad is greater than or equal to a preset pressure threshold. And when the placement nozzle 101 leaves the pad, the airflow in the placement nozzle 101 increases significantly. At this time, the controller determines that the placement quality of the pad is qualified.

[0079] At this point, the placement quality is determined more accurately by combining placement pressure information and airflow information. If at least one of the following conditions occurs: the placement pressure is lower than the preset pressure threshold, or the airflow within the placement nozzle 101 does not significantly increase after leaving the pad, the controller determines that the placement quality of the pad is unqualified.

[0080] In another possible implementation, the detection information also includes the vacuum level information inside the vacuum generator. In this case, the vacuum level information, combined with the aforementioned placement pressure information and / or airflow information, can be used to determine whether the pad placement quality is up to standard. Using more information in this case results in a more accurate assessment of placement quality.

[0081] Here, since the vacuum generator is connected to the placement nozzle 101, the vacuum information is similar to the airflow information mentioned above. Based on whether the vacuum level in the vacuum generator changes significantly during the placement process (e.g., suddenly increases or decreases), it can be determined whether the LED is accurately picked up, whether the LED falls off midway, and whether the LED sticks to the nozzle instead of the pad. Thus, it can be determined whether the placement quality is qualified.

[0082] For example, when the flow meter reading (i.e., air flow information), pressure sensor reading (i.e., patch pressure information), and vacuum reading (i.e., vacuum information) all meet the preset conditions or preset values, the patch quality of the solder pads is determined to be qualified.

[0083] Furthermore, when the controller determines that the pad placement quality is unqualified, the controller can output a reminder message to the operator. This reminder message can be, for example, a voice message or a flashing light message, or it can be output as a pop-up window through a corresponding user interface (e.g., a display screen). This application does not limit the output method of the reminder message. This allows for timely manual intervention or adjustment of the placement process, which is beneficial for improving the efficiency of LED chip placement.

[0084] The above text combined Figures 1 to 4 The method for detecting patch quality provided in the embodiments of this application is described in detail below. Figure 5 , Figure 6 This application describes in detail the patch quality detection apparatus according to embodiments of the present application. It should be understood that... Figure 5 , Figure 6 The detection device shown can achieve Figure 4 The steps shown in the method flow are one or more. To avoid repetition, they will not be described in detail here.

[0085] Figure 5 This is a schematic block diagram of the patch quality detection device 300 provided in an embodiment of this application. Figure 5As shown, the detection device 300 includes an acquisition unit 310, a determination unit 320, a driving unit 330, and an alert unit 340.

[0086] The acquisition unit 310 is used to acquire detection information during the LED chip placement operation on the pads. The detection information includes the placement pressure information borne by the pads and / or the air flow information in the placement nozzle.

[0087] The determining unit 320 is used to determine whether the pad placement quality is qualified based on the detection information.

[0088] Optionally, the detection information includes the placement pressure information, and the determination unit 320 is specifically used to: determine that the placement quality of the pad is qualified when the placement stroke of the placement nozzle reaches the preset pressure threshold and the placement pressure borne by the pad is greater than or equal to the preset pressure threshold.

[0089] Optionally, the drive unit 330 is configured to drive the placement nozzle to continue traveling a preset distance toward the pad when the placement stroke of the placement nozzle reaches the preset pressure threshold and the placement pressure borne by the pad is less than the preset pressure threshold.

[0090] Optionally, the detection information includes the airflow information, and the determination unit 320 is specifically used to: if the airflow in the placement nozzle increases significantly after the placement nozzle leaves the pad, then determine that the placement quality of the pad is qualified.

[0091] Optionally, the detection information includes the placement pressure information and the airflow information. The determination unit 320 is specifically used to: determine that the placement quality of the pad is qualified when the placement stroke of the placement nozzle reaches a certain value, the placement pressure on the pad is greater than or equal to a preset pressure threshold, and the airflow in the placement nozzle increases significantly after the placement nozzle leaves the pad.

[0092] Optionally, the detection information may also include vacuum level information inside the vacuum generator connected to the patch nozzle.

[0093] Optionally, the reminder unit 340 is used to output a reminder message when it is determined that the pad mounting quality is unqualified.

[0094] Specifically, the detection device 300 may correspond to the controller in the detection method 200 according to the embodiments of this application. The detection device 300 may include a controller for performing... Figure 3 or Figure 4The various units of the method executed by the controller. Furthermore, each unit in the detection device 300 and the other operations and / or functions described above are for implementing the corresponding process of the detection method 200. The specific process of each unit executing the corresponding steps described above has been described in detail in the detection method 200, and will not be repeated here for the sake of brevity.

[0095] This application embodiment also provides a patch quality detection device 400. Figure 6 This is a structural block diagram of the detection device 400 provided in an embodiment of this application. Figure 6 As shown, the detection device 400 includes a processor 410 and a memory 420, and the above-mentioned devices can be connected through one or more buses 430.

[0096] The detection device 400 also includes a computer program 421, which is stored in the memory 420. When the computer program 421 is executed by the processor 410, the detection device 400 performs the aforementioned actions. Figure 4 The detection method 200 is shown. All relevant details of each step in the above method embodiment can be found in the functional description of the corresponding physical device, and will not be repeated here.

[0097] This application also provides a computer-readable storage medium storing a computer program that, when run on an electronic device, causes the electronic device to perform the aforementioned actions. Figure 4 The detection method shown is 200.

[0098] This application also provides a computer program product, including: computer program code, which, when executed on an electronic device, causes the electronic device to perform the aforementioned... Figure 4 The detection method shown is 200.

[0099] This application also provides a chip system, including: a processor, configured to retrieve and run a computer program from a memory, causing an electronic device equipped with the chip to perform the aforementioned actions. Figure 4 The detection method shown is 200.

[0100] From the above description of the embodiments, those skilled in the art will understand that, for the sake of convenience and brevity, only the division of the above functional modules is used as an example. In practical applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above.

[0101] It should be understood that the apparatuses and processes disclosed in the several embodiments provided in this application can be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the division of modules or units is only a logical functional division. In actual implementation, there may be other division methods, such as multiple units or components being combined or integrated into another device. In addition, some features may be omitted or not performed. Furthermore, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or units may be electrical, mechanical, or other forms.

[0102] The units described as separate components may or may not be physically separate. A component shown as a unit can be one or more physical units. That is, it can be located in one place or distributed in multiple different locations. Depending on the actual needs, some or all of the units can be selected to achieve the purpose of this solution.

[0103] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit; they can also exist physically separately; or some units can be integrated into one unit while others exist physically separately. The integrated units described above can be implemented in hardware or as software functional units.

[0104] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a readable storage medium. Based on this understanding, all or part of the technical solutions of the embodiments of this application can be embodied in the form of a software product. This software product is stored in a storage medium. The software product includes several instructions to cause a device (which may be a microcontroller, chip, etc.) or processor to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, ROM, RAM, magnetic disks, or optical disks.

[0105] It should be noted that all or part of the above embodiments provided in this application (e.g., part or all of any feature) can be arbitrarily combined or combined with each other.

[0106] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method for detecting the quality of a patch, characterized in that, include: During the LED chip placement operation on the pads, detection information is acquired, including the placement pressure information borne by the pads and the air flow information in the placement nozzle (101). The placement nozzle (101) has an opening and can generate negative pressure inside. The placement nozzle (101) is connected to a vacuum generator. When the placement nozzle (101) is moved to or near the LED chip pick-up position, the vacuum generator starts to work, and negative pressure is generated inside the placement nozzle (101), so that the LED chip can be picked up through the opening. When the placement stroke of the placement nozzle (101) reaches a certain point, the placement pressure on the pad is greater than or equal to a preset pressure threshold, and the airflow in the placement nozzle (101) increases significantly after the placement nozzle (101) leaves the pad, then the placement quality of the pad is determined to be qualified; when at least one of the following occurs, the placement pressure is less than the pressure threshold, and the airflow in the placement nozzle (101) does not increase significantly after the placement nozzle (101) leaves the pad, then the placement quality of the pad is determined to be unqualified.

2. The detection method according to claim 1, characterized in that, The method further includes: When the placement stroke of the placement nozzle (101) reaches the preset pressure threshold and the placement pressure on the pad is less than the preset pressure threshold, the placement nozzle (101) is driven to continue to travel the preset stroke toward the pad.

3. The detection method according to claim 1 or 2, characterized in that, The detection information also includes the vacuum level information inside the vacuum generator connected to the patch nozzle (101).

4. The detection method according to claim 1 or 2, characterized in that, The method further includes: When it is determined that the pad placement quality is unqualified, an alert message is output.

5. A device for detecting patch quality, characterized in that, include: The acquisition unit is used to acquire detection information during the LED chip placement operation on the pad. The detection information includes the placement pressure information borne by the pad and the air flow information in the placement nozzle (101). The placement nozzle (101) has an opening and can generate negative pressure inside. The placement nozzle (101) is connected to a vacuum generator. When the placement nozzle (101) is moved to or close to the LED chip pick-up position, the vacuum generator starts to work, and negative pressure is generated inside the placement nozzle (101), so that the LED chip can be picked up through the opening. The determining unit determines that the pad's placement quality is qualified when the placement stroke of the placement nozzle (101) reaches a point where the placement pressure on the pad is greater than or equal to a preset pressure threshold, and the airflow in the placement nozzle (101) increases significantly after the placement nozzle (101) leaves the pad; and determines that the pad's placement quality is unqualified when at least one of the following occurs: the placement pressure is less than the pressure threshold, and the airflow in the placement nozzle (101) does not increase significantly after the placement nozzle (101) leaves the pad.

6. A device for detecting patch quality, characterized in that, include: processor; Memory; And a computer program, wherein the computer program is stored in the memory, and when the computer program is executed by the processor, causes the detection device to perform the detection method as described in any one of claims 1 to 4.

7. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when run on a computer, causes the computer to perform the detection method as described in any one of claims 1 to 4.

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